Temperature control method and device of machine heating system, readable medium and electronic equipment

Abstract

The invention relates to the technical field of semiconductors, and discloses a temperature control method and device of a machine heating system, a readable medium and electronic equipment. The temperature control method of the machine heating system comprises the following steps: acquiring related data of a heater; determining a feed-forward gain and a disturbance quantity based on the related data of the heater, wherein the feed-forward gain is used for determining feed-forward compensation power of the heater in combination with the disturbance quantity under the condition that sudden increase of the disturbance quantity is detected; a dissipation model of the heater is determined based on the related data of the heater, and dissipation compensation power of the heater is determined based on the dissipation model; under the working condition of machine liquid spraying, if the set process compensation condition is met, the process compensation power of the heater is determined; a target heating power for the heater is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power. The method has the advantages that the temperature control response speed is increased, multi-dimensional power compensation cooperation is achieved, and the temperature stability in the semiconductor manufacturing process is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a temperature control method, device, readable medium, and electronic device for a machine heating system. Background Art

[0002] The rapid development of semiconductor technology has transformed every aspect of our lives. From smartphones and computers to new energy vehicles and artificial intelligence, the increased computing power and energy efficiency of semiconductor chips have driven the widespread penetration of digitalization and intelligence. For example, 5G communication base stations rely on high-frequency, low-power radio frequency semiconductors for signal transmission, while autonomous driving systems rely on high-performance computing chips to process massive amounts of data. Third-generation semiconductor materials (such as silicon carbide and gallium nitride) have demonstrated their high-temperature resistance and high power efficiency in new energy vehicles and photovoltaic inverters. Furthermore, cutting-edge technologies such as quantum computing and biochips are leveraging the micro- and nano-fabrication capabilities of semiconductor processes to continuously push the boundaries of physics. The continued expansion of these application areas places higher demands on semiconductor manufacturing processes.

[0003] Semiconductor manufacturing processes require high precision and stability in temperature control, especially during wafer etching. Temperature fluctuations directly impact etch rate, uniformity, and chip yield. Existing heaters in some semiconductor machines suffer from slow response speeds and weak anti-interference capabilities, making precise temperature control impossible. Consequently, wafer etching rates cannot be guaranteed, leading to high semiconductor material costs. Summary of the Invention

[0004] In view of this, embodiments of the present application provide a temperature control method, device, readable medium, and electronic device for a machine heating system. This technical solution has the advantages of improving temperature control response speed, achieving multi-dimensional power compensation coordination, and enhancing semiconductor manufacturing process stability, while also achieving high wafer etching rates and low costs.

[0005] In a first aspect, the present application provides a temperature control method for a machine heating system, which is used in a controller of the machine heating system, wherein the machine heating system further includes a heater, and the method comprises: Get relevant data of heater; determining a feedforward gain and a disturbance amount corresponding to the heater based on relevant data of the heater, wherein the feedforward gain is used to determine a feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected; determining a dissipation model of the heater based on the relevant data of the heater, and determining a dissipation compensation power of the heater based on the dissipation model; Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined; A target heating power of the heater is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

[0006] In a possible implementation of the first aspect, the disturbance quantity includes a heater inlet flow rate. When a sudden increase in the disturbance quantity of the machine heating system is detected, the feedforward compensation power of the heater is determined by combining the disturbance quantity in the following manner: determining a flow rate increment corresponding to the heater inlet flow rate; The feedforward compensation power is determined based on a product of the feedforward gain and the flow rate increment.

[0007] In a possible implementation of the first aspect, the dissipation model of the heater is determined based on the relevant data of the heater in the following manner: Analyzing relevant data of the heater to obtain temperature dissipation characteristics of the heater; establishing a dissipation polynomial related to the heater inlet flow rate and the heater outlet temperature based on the temperature dissipation characteristics of the heater; The coefficients of the variables and the values ​​of the constants in the dissipative polynomial are solved to obtain a solved dissipative polynomial, and the solved dissipative polynomial is determined as the dissipative model.

[0008] In a possible implementation of the first aspect, the dissipation compensation power of the heater is determined based on the dissipation model in the following manner: determining an inlet flow rate of the heater and a target outlet temperature of the heater; Substituting the heater inlet flow rate and the target outlet temperature of the heater into the dissipation model for calculation to obtain the dissipation value of the heater; A dissipation compensation power of the heater is obtained based on the dissipation value of the heater.

[0009] In a possible implementation of the first aspect, the set process compensation condition includes: a temperature difference between an actual outlet temperature of the heater and a target outlet temperature of the heater is greater than a set threshold; In the liquid spraying working condition of the machine, if the set process compensation condition is met, the process compensation power of the heater is determined, including: The process compensation power is determined according to a temperature difference between an actual outlet temperature of the heater and a target outlet temperature of the heater.

[0010] In a possible implementation of the first aspect, determining the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power includes: The target heating power of the heater is obtained by summing the feedforward compensation power, the dissipation compensation power and the process compensation power.

[0011] In a possible implementation of the first aspect, the relevant data of the heater include heating power of the heater, heater body temperature, heater outlet temperature, heater inlet liquid temperature, and heater inlet flow rate.

[0012] In a second aspect, the present application provides a temperature control device for a machine heating system, comprising: A data acquisition module is used to acquire relevant data of the heater; a first determining module, configured to determine a feedforward gain and a disturbance amount corresponding to the heater based on relevant data of the heater, wherein the feedforward gain is used to determine a feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected; a second determining module, configured to determine a dissipation model of the heater based on relevant data of the heater, and to determine a dissipation compensation power of the heater based on the dissipation model; A third determination module is configured to determine the process compensation power of the heater if a set process compensation condition is met under the liquid spraying condition of the machine; A fourth determination module is configured to determine a target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

[0013] In a third aspect, the present application provides a computer-readable storage medium, on which instructions are stored. When the instructions are executed on an electronic device, the electronic device executes the temperature control method of the machine heating system in the first aspect and any possible implementation of the first aspect.

[0014] In a fourth aspect, the present application provides an electronic device, comprising: memory for storing instructions, and One or more processors, when the instructions are executed by the one or more processors, the processors execute the temperature control method of the machine heating system in the above-mentioned first aspect and any possible implementation of the first aspect.

[0015] Compared with the prior art, the present invention has the following advantages: The technical solution of the present application determines the feedforward gain corresponding to the heater based on the relevant data of the heater, thereby determining the feedforward compensation power of the heater. In this way, when the flow rate at the heater inlet fluctuates greatly, the feedforward compensation power can be used to compensate for the fluctuation of the heater outlet temperature caused by the fluctuation of the flow rate at the heater inlet, so that the heater outlet temperature is relatively stable. The dissipation model of the heater is determined based on the relevant data of the heater, and the dissipation compensation power of the heater is determined based on the dissipation model, so that the fluctuation of the heater outlet temperature caused by the heat dissipation of the heater can be compensated. Moreover, under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined. This part of power can additionally compensate for the fluctuation of the liquid temperature during the liquid spraying process. Based on the above-mentioned feedforward compensation power, dissipation compensation power and process compensation power, the target heating power of the heater is determined, so that the power of the heater can be adjusted in real time according to the target heating power. Through the dynamic superposition of feedforward compensation power, dissipation compensation power and process compensation power, precise temperature control is achieved, effectively improving the stability and yield rate of the semiconductor manufacturing process, with fast temperature control response speed, high wafer etching rate and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 According to some embodiments of the present application, a wafer processing manufacturing process flow is shown; Figure 2 According to some embodiments of the present application, a structural block diagram of a machine heating system is shown; Figure 3 According to some embodiments of the present application, a flow chart of a temperature control method for a machine heating system is shown; Figure 4 According to some embodiments of the present application, a structural block diagram of a temperature control device of a machine heating system is shown; Figure 5 According to some embodiments of the present application, a structural block diagram of an electronic device is shown. DETAILED DESCRIPTION

[0017] The illustrative embodiments of the present application include, but are not limited to, a temperature control method, device, readable medium, and electronic device for a machine heating system.

[0018] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0019] In order to facilitate understanding of the technical solution of this application, an application scenario of the technical solution of this application is first introduced below. Figure 1 The figure shows a wafer processing manufacturing process flow. Figure 1 The process flow diagram shown includes a chemical cabinet 12 , a machine heating system 10 , a needle valve 14 , a chamber 13 , and a liquid spraying device 15 .

[0020] The chemical cabinet 12 is used to store and manage chemical solutions required for etching, such as hydrofluoric acid (HF), buffered oxide etchant (BOE), and phosphoric acid (H3PO4). Depending on process requirements, in some embodiments, liquid is drawn from the chemical cabinet 12 and filtered to remove impurities, thereby increasing the liquid purity to meet nanoscale etching precision requirements. The liquid flowing out of the chemical cabinet 12 enters the tool heating system 10 for heating, raising the liquid temperature to a set temperature, for example, 70–80°C or higher. The heated liquid is contained in a chamber 13. A needle valve 14 is used to adjust the liquid flow rate. The heated liquid is then evenly sprayed onto the wafer surface by a liquid spraying device 15, such as a nozzle, in a specific pattern, such as laminar flow or spiral spray. The liquid chemically reacts with the wafer, thereby etching the wafer.

[0021] It should be understood that the above process flow is only a brief process for illustrating the application scenario of the technical solution of this application. In actual applications, other processes may also be included. For example, in order to clean the etched wafer, the wafer can be rinsed with a diluted solution after etching to remove by-products and residues to avoid contamination of the wafer surface. Combined with high-temperature nitrogen purge or rotary drying technology, the liquid can be quickly evaporated and the wafer can be cooled to prepare a clean surface for the next process such as deposition or photolithography.

[0022] The above-mentioned machine heating system 10 includes Figure 2The controller 17, solid-state relay 16, and heater 11 are shown. The controller 17 is used to obtain data related to the heater 11 and, based on the data, determine a feedforward gain and disturbance corresponding to the heater 11. The feedforward gain is used to determine the feedforward compensation power of the heater 11 in conjunction with the disturbance when a sudden increase in the disturbance is detected. A dissipation model of the heater 11 is determined based on the data related to the heater 11, and the dissipation compensation power of the heater 11 is determined based on the dissipation model. Under the machine's liquid spraying operation, if the set process compensation conditions are met, the process compensation power of the heater 11 is determined. The target heating power of the heater 11 is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power. This allows the power of the heater 11 to be adjusted in real time according to the target heating power. By dynamically superimposing the feedforward compensation power, the dissipation compensation power, and the process compensation power, a multi-dimensional compensation mechanism is used to achieve precise temperature control, effectively improving the stability and yield of the semiconductor manufacturing process. This system has the advantages of increasing temperature control response speed, achieving multi-dimensional power compensation synergy, and improving the stability of the semiconductor manufacturing process, while also achieving high wafer etching rates and low costs.

[0023] The solid-state relay 16 is used to respond to the control signal of the controller 17 to drive the heater 11 to heat the liquid. The heater 11 heats the liquid to a set temperature for subsequent wafer etching.

[0024] In some embodiments, the controller 17 is a programmable logic controller (PLC). In other embodiments, the controller 17 may also be a programmable automation controller (PAC) or a distributed control system (DCS).

[0025] In some embodiments, the heater 11 is a unit heater 11. In actual applications, the specific type of heater 11 can also be selected according to process requirements. For example, the heater 11 includes but is not limited to an electromagnetic induction heater 11, an infrared heater 11, and a ceramic heater 11.

[0026] The following is a detailed introduction to a temperature control method of a machine heating system 10 provided in this application.

[0027] Figure 3 According to some embodiments of the present application, a temperature control method for a machine heating system 10 is provided, which is used in a controller 17 of the machine heating system 10, such as Figure 3 As shown, the temperature control method of a machine heating system 10 provided in this application includes the following steps: S11: Obtain relevant data of the heater 11.

[0028] The relevant data of the heater 11 include the heating power of the heater 11 , the body temperature of the heater 11 , the outlet temperature of the heater 11 , the inlet liquid temperature of the heater 11 , and the inlet flow rate of the heater 11 .

[0029] The heating power of heater 11 is fixed by controller 17. For example, in some embodiments, controller 17 is a PLC that outputs pulse width modulation (PWM) with a 20% duty cycle. Controller 17 can record the power output of controller 17 in real time. The body temperature of heater 11, the outlet temperature of heater 11, and the inlet liquid temperature of heater 11 can be obtained via temperature sensors. The inlet flow rate of heater 11 refers to the volume of liquid passing through the inlet of heater 11 per unit time and can be monitored in real time using an electromagnetic flowmeter or ultrasonic flowmeter.

[0030] S12: Based on the relevant data of heater 11, a feedforward gain and a disturbance value corresponding to heater 11 are determined. The feedforward gain is used to determine the feedforward compensation power of heater 11 in combination with the disturbance value when a sudden increase in the disturbance value is detected. The feedforward gain represents the proportional relationship between the disturbance change and the power compensation value, and can be obtained by linearly fitting the power adjustment values ​​corresponding to different flow rate increments.

[0031] In some embodiments, the feedforward gain K can be calculated as follows: ff For example, first fix the heating power P0, wait for the machine heating system 10 to stabilize, record the steady-state flow F0 and steady-state temperature T0 of the heater 11; then adjust the step flow based on the steady-state flow F0 Wait for the machine heating system 10 to stabilize, then record the steady-state flow F1 and steady-state temperature T1; then gradually increase the heating power to P1 so that the outlet temperature of the heater 11 returns to T0, and calculate the power change , we can get the above feedforward gain .

[0032] In some embodiments, the above-mentioned disturbance quantity includes the inlet flow of the heater 11. When a sudden increase in the disturbance quantity of the machine heating system 10 is detected, the feedforward compensation power of the heater 11 is determined in combination with the disturbance quantity in the following manner: the flow increment corresponding to the inlet flow of the heater 11 is determined, and the feedforward compensation power is determined based on the product of the feedforward gain and the flow increment, so that the compensation power is generated in advance when the inlet flow of the heater 11 suddenly increases, thereby reducing the temperature fluctuation caused by the sudden increase in the inlet flow of the heater 11.

[0033] This application establishes a direct feedforward relationship between flow disturbance and power compensation, generates compensation power in the initial stage of flow mutation, improves the response speed of the heating system, and effectively eliminates the temperature overshoot caused by thermal inertia.

[0034] S13 : determining a dissipation model of the heater 11 based on the relevant data of the heater 11 , so as to determine the dissipation compensation power of the heater 11 based on the dissipation model.

[0035] In some embodiments, the dissipation model of the heater 11 is determined based on the relevant data of the heater 11 in the following manner: the relevant data of the heater 11 is analyzed to obtain the temperature dissipation characteristics of the heater 11; a dissipation polynomial regarding the inlet flow of the heater 11 and the outlet temperature of the heater 11 is established based on the temperature dissipation characteristics of the heater 11; the coefficients of the variables and the values ​​of the constants in the dissipation polynomial are solved to obtain the solved dissipation polynomial, and the solved dissipation polynomial is determined as the dissipation model.

[0036] The temperature dissipation characteristic refers to the physical laws governing heat dissipation from heater 11 and is used to characterize the heat exchange characteristics between heater 11 and the surrounding environment. The dissipation polynomial is a mathematical expression whose variables are the inlet flow rate and outlet temperature of heater 11. By substituting multiple sets of measured flow-temperature data into this mathematical expression and solving for the coefficients of each variable, a mathematical model is ultimately formed that accurately reflects the heat dissipation laws of heater 11.

[0037] This application not only retains the nonlinear relationship between the inlet flow and outlet temperature of the heater 11, but also ensures the accuracy of the dissipation model through experimental data calibration, effectively solving the problem of large prediction deviations of some models constructed based on experience under complex working conditions.

[0038] In some embodiments, the dissipation compensation power of heater 11 is determined based on a dissipation model in the following manner: the inlet flow rate of heater 11 and the target outlet temperature of heater 11 are determined; the inlet flow rate of heater 11 and the target outlet temperature of heater 11 are substituted into the dissipation model for calculation to obtain a dissipation value of heater 11; and the dissipation compensation power of heater 11 is obtained based on the dissipation value of heater 11. The dissipation compensation power corresponding to the steady-state heat loss is calculated based on the inlet flow rate of heater 11 and the outlet temperature of heater 11 using the above-mentioned dissipation model. The thermal dissipation model is used to improve steady-state temperature control accuracy and reduce steady-state error.

[0039] S14: Under the liquid spraying working condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater 11 is determined.

[0040] Among them, the set process compensation conditions include: the temperature difference between the actual outlet temperature of the heater 11 and the target outlet temperature of the heater 11 is greater than the set threshold value, the temperature difference refers to the instantaneous deviation between the actual outlet temperature of the heater 11 and the target outlet temperature of the heater 11, and the process compensation power refers to the additional power used to correct the temperature deviation, so that when the actual outlet temperature of the heater 11 is too high relative to the target outlet temperature of the heater 11, the heating power of the heater 11 can be reduced, otherwise, the heating power of the heater 11 can be increased.

[0041] In some embodiments, when the machine is operating under liquid spraying conditions and the set process compensation conditions are met, the process compensation power of heater 11 is determined, including determining the process compensation power based on the temperature difference between the actual outlet temperature of heater 11 and the target outlet temperature of heater 11. In some embodiments, the temperature difference is converted into a power adjustment amount, namely the process compensation power, through a proportional-integral algorithm. When this process compensation power is added to the base heating power, it can quickly offset temperature fluctuations caused by liquid spraying.

[0042] The process compensation power obtained during liquid spraying can effectively address temperature control inaccuracies caused by excessive temperature deviations during the spraying process. By setting process compensation conditions to trigger the compensation mechanism, timely intervention can be made at the initial stage of abnormal temperature fluctuations, quickly generating the corresponding compensation power. This can improve the response speed and adjustment accuracy of temperature control during the spraying stage, reduce the uneven wafer etching caused by temperature overshoot, thereby reducing semiconductor material loss and reducing costs.

[0043] S15 : Determine the target heating power of the heater 11 based on the feedforward compensation power, the dissipation compensation power and the process compensation power.

[0044] In some embodiments, the target heating power of heater 11 is determined based on feedforward compensation power, dissipation compensation power, and process compensation power, including summing the feedforward compensation power, dissipation compensation power, and process compensation power to obtain the target heating power of heater 11. This achieves multi-dimensional compensation for the power demand of heater 11, rapidly adjusting power output through feedforward compensation when the inlet flow rate suddenly changes, maintaining precise temperature control through dissipation compensation during steady-state operation, and eliminating transient deviations through process compensation during the liquid injection phase. This composite control strategy effectively reduces the temperature fluctuation amplitude of heater 11, which is beneficial for improving temperature stability and etch rate uniformity during wafer etching, thereby increasing the manufacturing yield of semiconductor devices and reducing manufacturing costs.

[0045] It can be understood that the execution order of the above steps S11 to S15 is only an illustration. In other embodiments, other execution orders may be adopted, and some steps may be split or combined, which is not limited here.

[0046] In some embodiments, the Proportional-Integral-Derivative Control (PID) algorithm within controller 17 can be adjusted based on data related to heater 11. For example, in some embodiments, the frequency of change in heater 11's outlet temperature is determined and the discrete steps within controller 17's PID algorithm are adjusted to align with the frequency of change. This allows controller 17 to more promptly detect temperature fluctuations and reduce steady-state errors. Furthermore, an integral separation is introduced. Specifically, for example, the involvement of the integral term in the PID algorithm is adjusted based on the temperature difference between the actual and target heater 11 outlet temperatures. When this temperature difference exceeds a set temperature difference threshold, the integral action is disabled; otherwise, it is enabled, avoiding integral saturation and significantly reducing overshoot, thereby improving temperature stability. Furthermore, by improving the differential term, such as by performing a weighted differential on historical data collected from heater 11, data noise can be reduced, allowing for preemptive adjustment of the control variable to minimize overshoot. This reduces sudden jumps in the differential term, reduces drastic changes in heater 11 power, and extends heater 11 life. This improved PID control can greatly improve the control stability and anti-interference ability while maintaining the simplicity and practicality of PID control.

[0047] The present application also provides a temperature control device 400 for a machine heating system, such as Figure 4 As shown, the temperature control device 400 of the machine heating system provided in this application includes: The data acquisition module 401 is used to acquire relevant data of the heater 11; A first determination module 402 is configured to determine a feedforward gain and a disturbance value corresponding to the heater 11 based on relevant data of the heater 11. The feedforward gain is used to determine a feedforward compensation power of the heater 11 in combination with the disturbance value when a sudden increase in the disturbance value is detected. The second determining module 403 is configured to determine a dissipation model of the heater 11 based on relevant data of the heater 11, and to determine a dissipation compensation power of the heater 11 based on the dissipation model. The third determining module 404 is configured to determine the process compensation power of the heater 11 if the set process compensation condition is met under the liquid spraying condition of the machine; The fourth determination module 405 is configured to determine a target heating power of the heater 11 based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

[0048] Regarding the apparatus in the above embodiment, the specific manner in which the processor performs operations has been described in detail in the embodiment of the method, and will not be elaborated on here.

[0049] An embodiment of the present invention further provides an electronic device 500, such as Figure 5 As shown, the electronic device 500 includes a memory 501 and a processor 502. The memory 501 is used to store computer programs executable by the processor 502; the processor 502 is used to execute the computer program in the memory 501 to implement the temperature control method of the machine heating system provided in any of the above embodiments.

[0050] Figure 5 The electronic device 500 shown further includes a communication interface 503. The processor 502, the memory 501 and the communication interface 503 are connected via a communication bus and communicate with each other.

[0051] The processor 502 may be a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the above-mentioned programs.

[0052] The communication interface 503 is used to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Networks (WLAN), etc.

[0053] The memory 501 can be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a random access memory (RAM) or other types of dynamic storage devices that can store information and instructions, or an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program codes in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory can be independent and connected to the processor via a bus. The memory can also be integrated with the processor.

[0054] An embodiment of the present invention further provides a computer-readable storage medium having instructions stored thereon. When the instructions are executed on an electronic device, the electronic device executes the temperature control method for the machine heating system provided in any of the above embodiments.

[0055] An embodiment of the present invention further provides a computer program product, which includes instructions. When the instructions are executed by one or more processors, they are used to implement the temperature control method of the machine heating system provided in any of the above embodiments.

[0056] The various embodiments of the mechanisms disclosed in the present invention can be implemented in hardware, software, firmware, or a combination of these implementation methods. The embodiments of the present invention can be implemented as a computer program or program code executed on a programmable system, the programmable system including at least one processor, a storage system (including volatile and non-volatile memory and / or storage elements), at least one input device, and at least one output device.

[0057] It should be noted that the various units / modules mentioned in the various device embodiments of the present invention are all logical units / modules. Physically, a logical unit / module can be a physical unit / module, or a part of a physical unit / module, or can be implemented as a combination of multiple physical units / modules. The physical implementation of these logical units / modules themselves is not the most important. The combination of functions implemented by these logical units / modules is the key to solving the technical problems raised by the present invention. In addition, in order to highlight the innovative part of the present invention, the above-mentioned device embodiments of the present invention do not introduce units / modules that are not closely related to solving the technical problems raised by the present invention. This does not mean that other units / modules do not exist in the above-mentioned device embodiments.

[0058] It should be noted that in the examples and description of this patent, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0059] While the present invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims

1. A temperature control method for a machine heating system, characterized in that: A controller for a machine heating system, wherein the machine heating system further comprises a heater, and the method comprises: Get relevant data of heater; determining a feedforward gain and a disturbance amount corresponding to the heater based on relevant data of the heater, wherein the feedforward gain is used to determine a feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected; determining a dissipation model of the heater based on the relevant data of the heater, and determining a dissipation compensation power of the heater based on the dissipation model; Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined; A target heating power of the heater is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

2. The temperature control method of the machine heating system according to claim 1, characterized in that: The disturbance quantity includes the heater inlet flow rate. When a sudden increase in the disturbance quantity of the machine heating system is detected, the feedforward compensation power of the heater is determined by combining the disturbance quantity in the following manner: determining a flow rate increment corresponding to the heater inlet flow rate; The feedforward compensation power is determined based on a product of the feedforward gain and the flow rate increment.

3. The temperature control method of the machine heating system according to claim 1, characterized in that: The dissipation model of the heater is determined based on the relevant data of the heater in the following manner: Analyzing relevant data of the heater to obtain temperature dissipation characteristics of the heater; establishing a dissipation polynomial related to the heater inlet flow rate and the heater outlet temperature based on the temperature dissipation characteristics of the heater; The coefficients of the variables and the values ​​of the constants in the dissipative polynomial are solved to obtain a solved dissipative polynomial, and the solved dissipative polynomial is determined as the dissipative model.

4. The temperature control method of the machine heating system according to claim 3, characterized in that: The dissipation compensation power of the heater is determined based on the dissipation model in the following manner: determining an inlet flow rate of the heater and a target outlet temperature of the heater; Substituting the heater inlet flow rate and the target outlet temperature of the heater into the dissipation model for calculation to obtain the dissipation value of the heater; A dissipation compensation power of the heater is obtained based on the dissipation value of the heater.

5. The temperature control method of a machine heating system according to claim 1, characterized in that: The set process compensation condition includes: the temperature difference between the actual outlet temperature of the heater and the target outlet temperature of the heater is greater than a set threshold; In the liquid spraying working condition of the machine, if the set process compensation condition is met, the process compensation power of the heater is determined, including: The process compensation power is determined according to a temperature difference between an actual outlet temperature of the heater and a target outlet temperature of the heater.

6. The temperature control method of a machine heating system according to claim 1, characterized in that: The determining the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power includes: The target heating power of the heater is obtained by summing the feedforward compensation power, the dissipation compensation power and the process compensation power.

7. The temperature control method of a machine heating system according to any one of claims 1 to 6, characterized in that: The heater related data includes the heater's heating power, heater body temperature, heater outlet temperature, heater inlet liquid temperature, and heater inlet flow rate.

8. A temperature control device for a machine heating system, characterized in that: include: A data acquisition module is used to acquire relevant data of the heater; a first determining module, configured to determine a feedforward gain and a disturbance amount corresponding to the heater based on relevant data of the heater, wherein the feedforward gain is used to determine a feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected; a second determining module, configured to determine a dissipation model of the heater based on relevant data of the heater, and to determine a dissipation compensation power of the heater based on the dissipation model; A third determination module is configured to determine the process compensation power of the heater if a set process compensation condition is met under the liquid spraying condition of the machine; A fourth determination module is configured to determine a target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores instructions, which, when executed on an electronic device, enable the electronic device to execute the temperature control method for a machine heating system according to any one of claims 1 to 7.

10. An electronic device, characterized in that: include: memory for storing instructions, and One or more processors, when the instructions are executed by the one or more processors, the processors execute the temperature control method of the machine heating system according to any one of claims 1 to 7.

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