High-performance transceiving integrated cylindrical array underwater acoustic transducer and preparation process thereof

Abstract

The invention belongs to the technical field of underwater acoustic transducers, and particularly relates to a high-performance transceiving integrated cylindrical array underwater acoustic transducer, which comprises a cylindrical array sensitive element, a rigid prism supporting structure, a sound absorption layer and a waterproof sound transmission layer, and is characterized in that the cylindrical array sensitive element comprises a sound wave transmitting array unit and two sound wave receiving array units; the two sound wave receiving array units are located at the upper end and the lower end of the sound wave emission array unit respectively, the sound wave emission array unit is bonded to the middle of the outer side of the rigid prism supporting structure, and the two sound wave receiving array units are bonded to the upper end and the lower end of the outer side of the rigid prism supporting structure respectively. According to the invention, the system structure can be effectively simplified, the environmental average noise is suppressed, the signal-to-noise ratio and directivity are improved, the system has the functions of receiving and transmitting integration, horizontal 360-degree omnidirectional and omnidirectional rotary scanning transmission, multimode coupling is realized, the bandwidth is expanded, the sending voltage response is increased, and the receiving sensitivity is increased.

Description

Technical Field

[0001] The present invention belongs to the technical field of underwater acoustic transducers, and in particular relates to a high-performance transmitting-receiving integrated cylindrical array underwater acoustic transducer and a preparation process thereof. Background Art

[0002] As the core component of underwater acoustic systems, underwater acoustic transducers are widely used in marine resource exploration, underwater target detection, communication navigation, and environmental monitoring.

[0003] However, traditional underwater acoustic transducers mostly adopt a split-transmitter and receiver design, that is, the transmitting unit and the receiving unit are set independently, resulting in a bulky device with low integration, and easily introduces signal interference when multiple units work together. In addition, the transmitting transducer has low electro-acoustic conversion efficiency, large energy loss, insufficient transmitting voltage response, and low receiving sensitivity of the receiving transducer, which affects the detection of weak sound signals and has insufficient anti-noise capability.

[0004] Existing technologies have partially improved performance through composite materials or structural optimization to address these issues, but they still cannot achieve a balance between high efficiency, wide bandwidth, and noise immunity. For example, while Type 1-3 piezoelectric composites extend bandwidth, the introduction of polymers reduces sensitivity. Traditional vector hydrophones require the addition of inertial sensors, resulting in a complex structure. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-performance integrated transmitting and receiving cylindrical array underwater acoustic transducer and its preparation process, which can effectively simplify the system structure, suppress the average environmental noise, improve the signal-to-noise ratio and directivity, and have the functions of integrated transmitting and receiving, horizontal 360° omnidirectional and omnidirectional rotation scanning transmission, realize multi-mode coupling, expand bandwidth, increase the transmitting voltage response, and increase the receiving sensitivity.

[0006] The technical solutions adopted by the present invention are as follows:

[0007] A high-performance cylindrical array underwater acoustic transducer with integrated transmitting and receiving functions, comprising a cylindrical array sensitive element, a rigid prism support structure, a sound absorbing layer, and a waterproof and sound-permeable layer;

[0008] The cylindrical array sensitive element includes an acoustic wave transmitting array unit and two acoustic wave receiving array units, the two acoustic wave receiving array units are respectively located at the upper and lower ends of the acoustic wave transmitting array unit, the acoustic wave transmitting array unit is bonded to the middle position of the outer side of the rigid prism support structure, and the two acoustic wave receiving array units are respectively bonded to the upper and lower ends of the outer side of the rigid prism support structure;

[0009] The acoustic wave transmitting array unit and the acoustic wave receiving array unit each include a plurality of array units, and the plurality of array units are arranged along the circumference of the rigid prismatic support structure;

[0010] The array unit includes a metal plate and two piezoelectric modules, each of which includes a base and a piezoelectric column array fixedly connected to one side of the base. The two piezoelectric modules are relatively stacked, and the metal plate is bonded between the two relatively stacked piezoelectric modules.

[0011] The two piezoelectric modules of the acoustic wave emission array unit are connected in electrical parallel;

[0012] The two piezoelectric modules of the acoustic wave receiving array unit are connected in electrical series;

[0013] One side of the sound absorbing layer is attached to the outer side of the rigid prism support structure, and the base of the array unit close to the side of the rigid prism support structure is attached to the other side of the sound absorbing layer. The cylindrical array sensitive element, the rigid prism support structure and the sound absorbing layer are all arranged in the waterproof and sound-permeable layer.

[0014] Furthermore, the substrate and the piezoelectric pillar array are integrally connected.

[0015] Furthermore, the piezoelectric module is made of piezoelectric ceramics or piezoelectric single crystals.

[0016] Furthermore, the piezoelectric pillar array includes a plurality of piezoelectric pillars, and air is filled between adjacent piezoelectric pillars.

[0017] Furthermore, the two piezoelectric pillar arrays in the same array unit have different thicknesses, the two piezoelectric modules are stacked along the thickness direction of the piezoelectric pillar array, and the metal plate is bonded between the two piezoelectric modules.

[0018] Furthermore, corresponding positions on one side of the metal plate contacting the piezoelectric pillar array are pitted and coated with conductive silver paste.

[0019] Furthermore, a positive electrode lead is led out from the surface of the metal plate in the acoustic wave emitting array unit, and a negative electrode lead is led out from the surfaces of the two substrates in the acoustic wave emitting array unit.

[0020] Furthermore, a negative electrode lead is drawn out from the substrate surface of the acoustic wave receiving array unit on the side close to the rigid prism support structure, and a positive electrode lead is drawn out from the substrate surface of the acoustic wave receiving array unit on the side away from the rigid prism support structure.

[0021] A preparation process for a high-performance integrated transmitting and receiving cylindrical array underwater acoustic transducer comprises the following steps:

[0022] Step S1: preparing a rigid prism support structure, and evenly attaching a sound absorbing layer to the outer layer of the rigid prism support structure;

[0023] Step S2: Electrodes are plated on both sides of the piezoelectric material sheet, the piezoelectric material sheet is polarized in the thickness direction, and the piezoelectric material sheet is cut along the length and width directions to form a piezoelectric pillar array and a substrate integrally connected to the piezoelectric pillar array, which is a piezoelectric module;

[0024] Step S3: making pits at positions corresponding to the piezoelectric pillar array on the metal plate and applying silver paste;

[0025] Step S4: two piezoelectric modules with the same polarization direction are arranged opposite to each other, and opposite sides of the two piezoelectric modules are bonded to two side surfaces of the metal plate using conductive adhesive;

[0026] Step S5: attaching a sound absorbing layer to the back surface of the substrate of one of the piezoelectric modules, leading out a negative electrode lead from the surface of the substrate, and leading out a positive electrode lead from the surface of the metal plate, thereby forming an array unit of an acoustic wave emission array unit;

[0027] Step S6: preparing a plurality of acoustic wave emission array units according to steps S2 to S5, arranging them equidistantly along the circumference in the middle position of the rigid prismatic support structure to form an acoustic wave emission cylindrical array, thereby preparing an acoustic wave emission array unit;

[0028] Step S7: After preparing the piezoelectric modules according to Steps S2 and S3, two piezoelectric modules with opposite polarization directions are arranged opposite to each other, and the opposite sides of the two piezoelectric modules are bonded to the two side surfaces of the metal plate using conductive adhesive;

[0029] Step S8: attaching a sound absorbing layer to the back surface of the substrate of the forward-polarized piezoelectric module, extending a negative electrode lead from the substrate surface, and extending a positive electrode lead from the substrate of the reverse-polarized piezoelectric module, thereby forming an array unit of a sound wave receiving array unit;

[0030] Step S9: preparing a plurality of acoustic wave receiving array units according to steps S2, S3, S7, and S8, and arranging them equidistantly along the circumferential direction at the upper and lower ends of the outer side of the rigid prismatic support structure to form acoustic wave receiving cylindrical arrays at the upper and lower ends, thereby preparing an acoustic wave receiving array unit;

[0031] Step S10: Curing the external potting glue on the sound wave emitting cylindrical array, the sound wave receiving cylindrical array, the sound absorbing layer and the rigid prism support structure to form a waterproof and sound-permeable layer.

[0032] The technical effects achieved by the present invention are:

[0033] The present invention provides a high-performance integrated transmitting and receiving cylindrical array underwater acoustic transducer and its preparation process, which can realize the function of the corresponding vector hydrophone by combining the sound pressure signal collected by the piezoelectric unit in the cylindrical array transducer and the sound pressure data collected by each piezoelectric module in the array. The sound wave receiving array units at the upper and lower ends have the function of a vector hydrophone, effectively simplifying the system structure, suppressing the average environmental noise, improving the signal-to-noise ratio and directivity, and having the functions of integrated transmitting and receiving, horizontal 360° omnidirectional and omnidirectional rotation scanning transmission. Two piezoelectric modules of different thicknesses are mechanically connected in series to form an array unit with a sandwich structure, realizing multi-mode coupling and expanding bandwidth. The upper and lower piezoelectric modules of the sound wave transmitting array unit are electrically connected in parallel to increase the sending voltage response, and the upper and lower piezoelectric modules of the sound wave receiving array unit are electrically connected in series to increase the receiving sensitivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a structural schematic diagram of the present invention;

[0035] Figure 2 It is a schematic diagram of the explosion structure of the present invention;

[0036] Figure 3 It is a schematic structural diagram of the PMP unit of the present invention;

[0037] Figure 4 It is a schematic diagram of the exploded structure of the PMP unit of the present invention;

[0038] Figure 5 It is a structural schematic diagram of the PM unit of the present invention;

[0039] Figure 6 is a distribution diagram of the array units of the present invention;

[0040] Figure 7 is a schematic top view of an array unit of the present invention;

[0041] Figure 8 is a frequency admittance curve diagram of the acoustic wave emission array unit of the present invention;

[0042] Figure 9 is a frequency admittance curve diagram of the sound wave receiving array unit of the present invention;

[0043] Figure 10 is a transmission voltage response curve diagram of the acoustic wave emission array unit of the present invention;

[0044] Figure 11 is a receiving sensitivity curve diagram of the sound wave receiving array unit of the present invention;

[0045] Figure 12 is an emission voltage response curve diagram of the PM unit of the present invention;

[0046] Figure 13 It is a receiving sensitivity curve diagram of the PM unit of the present invention.

[0047] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0048] 1. Acoustic wave transmitting array unit; 2. Acoustic wave receiving array unit; 3. Rigid prism support structure; 4. Piezoelectric pillar array; 5. Substrate; 6. Metal plate. DETAILED DESCRIPTION

[0049] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is described in detail below with reference to the following examples. It should be understood that the following text is only used to describe one or more specific embodiments of the present invention and does not strictly limit the scope of protection of the present invention.

[0050] Example 1:

[0051] like Figure 1-13 As shown, a high-performance integrated transmitting and receiving cylindrical array underwater acoustic transducer includes a cylindrical array sensitive element, a rigid prism support structure 3, a sound absorbing layer and a waterproof and sound-permeable layer;

[0052] The cylindrical array sensitive element includes an acoustic wave transmitting array unit 1 and two acoustic wave receiving array units 2. The two acoustic wave receiving array units 2 are respectively located at the upper and lower ends of the acoustic wave transmitting array unit 1. The acoustic wave transmitting array unit 1 is bonded to the middle position of the outer side of the rigid prismatic support structure 3. The two acoustic wave receiving array units 2 are respectively bonded to the upper and lower ends of the outer side of the rigid prismatic support structure 3. At this time, the acoustic wave transmitting array unit 1 and the two acoustic wave receiving array units 2 are stacked along the axial direction of the rigid prismatic support structure 3 to form a three-cylinder array axial stacking structure.

[0053] Specifically, the acoustic wave transmitting array unit 1 and the acoustic wave receiving array unit 2 each include a plurality of array units, which are arranged circumferentially along the rigid prismatic support structure 3, that is, the plurality of array units are arranged in a circular array with the axis of the rigid prismatic support structure 3 as the center of the circle, and have the functions of integrated transmission and reception, horizontal 360° omnidirectional and omnidirectional rotation scanning transmission.

[0054] The acoustic wave transmitting array unit 1 and the acoustic wave receiving array unit 2 have the same structure but different sizes, and their structures have the function of widening the receiving and transmitting bandwidths.

[0055] The array unit includes a metal plate 6 and two piezoelectric modules. The piezoelectric module includes a substrate 5 and a piezoelectric column array 4 fixedly connected to one side of the substrate 5. The substrate 5 and the piezoelectric column array 4 are preferably connected as one piece. The two piezoelectric modules are relatively stacked. The metal plate 6 is bonded between the two relatively stacked piezoelectric modules to form a mechanical series structure. The two piezoelectric modules of different thicknesses are mechanically connected in series to form an array unit with a sandwich structure, thereby realizing multi-mode coupling and expanding the bandwidth.

[0056] Here, the mechanical series structure means that the two piezoelectric modules and the metal plate 6 in the middle are connected in sequence, and the continuity of force and vibration speed is satisfied at the connection between the two piezoelectric modules and the metal plate 6.

[0057] Here, the piezoelectric module is made of PZT series piezoelectric ceramics or PMN series piezoelectric single crystals. The piezoelectric column array 4 includes a plurality of piezoelectric columns. The gaps between adjacent piezoelectric columns are filled with air. The structure of filling the gaps with air has a high electromechanical coupling coefficient, which can increase the transmission voltage response and receiving sensitivity. Compared with the conventional cutting-filling epoxy resin method, this embodiment retains the gaps between the air-filled piezoelectric columns to make the thickness vibration of the entire piezoelectric ceramic (electromechanical coupling coefficient k t is about 0.5) into the longitudinal stretching vibration of the piezoelectric pillar array 4 (electromechanical coupling coefficient k 33 About 0.7), which retains the longitudinal expansion and contraction mode of the piezoelectric column to the greatest extent, weakens the interference of other vibration modes, reduces mechanical loss, and effectively improves the electromechanical coupling coefficient.

[0058] A single array unit is called a PMP unit. The structure of the array unit includes a substrate 5, a piezoelectric pillar array 4, a metal plate 6, a piezoelectric pillar array 4, and a substrate 5 arranged in sequence.

[0059] Among them, the thickness direction of the piezoelectric column array 4 is from the end farthest from the metal plate 6 to the end close to the metal plate 6. The two piezoelectric column arrays 4 in the same array unit have different thicknesses. The two piezoelectric modules are stacked along the thickness direction of the piezoelectric column array 4, and the metal plate 6 is bonded between the two piezoelectric modules.

[0060] In order to ensure that the metal plate 6 and the piezoelectric pillar array 4 are fully in contact and reinforced, so as to match, bond and conduct electricity with the piezoelectric pillar array 4, pits are made at the corresponding positions on the side of the metal plate 6 that contacts the piezoelectric pillar array 4 and conductive silver paste is applied before bonding, so that the metal plate 6 acts as an electrode and reinforces the piezoelectric pillar array 4. At the same time, the stress amplification effect of the metal plate 6 on the piezoelectric pillar array 4 can increase its equivalent piezoelectric constant, further improving the receiving sensitivity of the sensitive element.

[0061] Punching a hole at a position corresponding to the side of the metal plate 6 that contacts the piezoelectric pillar array 4 can increase structural stability.

[0062] Here, the pits at the corresponding positions on the side of the metal plate 6 that contacts the piezoelectric pillar array 4 refer to the pits that are adapted to the shape of the piezoelectric pillars on the side of the metal plate 6 that contacts the piezoelectric pillar array 4. The piezoelectric pillars are snapped into the inside of the pits to increase the structural stability.

[0063] Among them, two piezoelectric modules with different thicknesses are stacked in the PMP unit, and the piezoelectric columns of the two piezoelectric modules adopt an N×M array. Since the two piezoelectric modules with different thicknesses are stacked, such as Figure 8 The admittance curve of the acoustic wave transmitting array unit 1 when N≠M, its two coupled resonant frequencies are 143kHz and 152kHz, Figure 9 The admittance curve of the acoustic wave receiving array unit 2 when N=M has two coupled anti-resonance frequencies of 140kHz and 150kHz, which are close to those of the acoustic wave transmitting array unit 1, thereby completing the integrated transmitting and receiving function.

[0064] The PMP unit uses two stacked piezoelectric modules of different thicknesses to expand the bandwidth through multi-modal coupling. Figure 10 and Figure 11 They are respectively a transmission voltage response curve diagram of the acoustic wave transmitting array unit 1 and a receiving sensitivity curve diagram of the acoustic wave receiving array unit 2, with bandwidths of 18 kHz and 10 kHz respectively.

[0065] For the middle acoustic wave emission array unit 1, the two piezoelectric modules of the acoustic wave emission array unit 1 are connected in electrical parallel to increase the emission current driving capability and output power, so as to increase the emission voltage response.

[0066] Specifically, a positive electrode lead is drawn from the surface of the metal plate 6 in the acoustic wave emission array unit 1, and a negative electrode lead is drawn from the surfaces of the two substrates 5 in the acoustic wave emission array unit 1. This structure can effectively increase the emission voltage response and bandwidth.

[0067] For the acoustic wave receiving array unit 2 at the upper and lower ends, the two piezoelectric modules of the acoustic wave receiving array unit 2 are connected in an electrically series manner. The voltage outputs of the two piezoelectric modules are directly superimposed. Under unit sound pressure excitation, the output voltage of the transducer increases. At the same time, the impedance increases after the series connection, which enhances the voltage output of weak signals, thereby increasing the receiving sensitivity.

[0068] Specifically, in the sound wave receiving array units 2 at the upper and lower ends, a negative electrode lead is led out from the surface of the substrate 5 on the side close to the rigid prism support structure 3, and a positive electrode lead is led out from the surface of the substrate 5 on the side away from the rigid prism support structure 3. This structure can effectively increase the receiving sensitivity and bandwidth.

[0069] Compared with the design of conventional acoustic vector hydrophones that require additional inertial sensors, the present invention only relies on the sound pressure signal collected by the piezoelectric unit in the cylindrical array transducer. By combining the sound pressure data collected by each piezoelectric module in the array, it can realize the function of the corresponding vector hydrophone. The sound wave receiving array unit 2 at the upper and lower ends has the function of a vector hydrophone, effectively simplifying the system structure, suppressing the average environmental noise, and improving the signal-to-noise ratio and directivity.

[0070] One side of the sound-absorbing layer is attached to the outside of the rigid prism support structure 3, and the base 5 of the array unit close to the side of the rigid prism support structure 3 is attached to the other side of the sound-absorbing layer. The cylindrical array sensitive element, the rigid prism support structure 3 and the sound-absorbing layer are all arranged in the waterproof and sound-permeable layer. The transducer as a whole forms a hollow overflow structure, and fluid flows in and out of it, so that the pressure inside and outside is the same, so that the pressure difference between the inside and outside of the transducer is zero, which increases the water immersion depth of the transducer. The inner cavity of the hollow overflow structure has a buffer space to adapt to the high hydrostatic pressure environment. It has excellent pressure resistance and can withstand deep water pressure, ensuring the stable operation of the transducer in deep water high pressure environment. It is suitable for various complex marine environment scenarios such as deep-water sonar, UUV communication, underwater target detection, and can be used for deep-sea detection.

[0071] The sound absorbing layer may be made of hard foam, has a thickness of about 2.5 mm, and is a rectangular structure of the same size as the corresponding array unit. The sound absorbing layer is located between the array unit and the rigid prismatic support structure 3 .

[0072] The waterproof and sound-permeable layer may be made of polyurethane, which wraps all array units and is cured by polyurethane potting glue to form a cylindrical structure.

[0073] Finite element simulation analysis software is used to simulate the acoustic wave transmitting array unit 1 and the acoustic wave receiving array unit 2 underwater, and the following results are obtained: Figure 10 The emission voltage response curve shown and Figure 11 From the receiving sensitivity curve shown, it can be seen that the maximum transmitting voltage response is 162.8dB and the maximum receiving sensitivity is -192.1dB.

[0074] For comparison, the metal plate 6 is bonded above the piezoelectric pillar array 4 in the piezoelectric module of this embodiment, which is called a PM unit. The underwater simulation of the PM unit is performed and the following is obtained: Figure 12 The emission voltage response curve shown and Figure 13From the receiving sensitivity curve shown, it can be seen that the maximum transmission voltage response is 161.2dB, the bandwidth is only 8kHz, the maximum receiving sensitivity is less than -210dB, and the bandwidth is 5kHz. In comparison, by adopting mechanical series connection and electrical series and parallel connection, the transmitting voltage response is effectively improved by 1.7dB, the effective working bandwidth is nearly doubled, the receiving sensitivity is effectively improved by 18.1dB, and the effective working bandwidth is doubled.

[0075] Example 2:

[0076] A preparation process for a high-performance integrated transmitting and receiving cylindrical array underwater acoustic transducer comprises the following steps:

[0077] Step S1: preparing a rigid prism support structure 3, and evenly attaching a sound absorbing layer to the outer layer of the rigid prism support structure 3;

[0078] Step S2: Electrodes are plated on both sides of the piezoelectric material sheet, the piezoelectric material sheet is polarized in the thickness direction, and the piezoelectric material sheet is cut along the length and width directions to form a piezoelectric pillar array 4 and a substrate 5 integrally connected to the piezoelectric pillar array 4, which is a piezoelectric module;

[0079] Here, the piezoelectric material sheet used to make the acoustic wave emission array unit 1 is made of PZT-4 piezoelectric ceramics.

[0080] The thickness direction of the piezoelectric material sheet is the same as the axial direction of the piezoelectric pillar array 4 , the length direction of the piezoelectric material sheet is the same as the length direction of the substrate 5 , and the width direction of the piezoelectric material sheet is the same as the width direction of the substrate 5 .

[0081] Step S3: making pits at positions corresponding to the piezoelectric pillar array 4 on the metal plate 6 and applying silver paste;

[0082] Step S4: two piezoelectric modules with the same polarization direction are arranged opposite to each other, and the opposite sides of the two piezoelectric modules are bonded to the two side surfaces of the metal plate 6 by conductive adhesive;

[0083] Step S5: attaching a sound absorbing layer to the back surface of the substrate 5 of one of the piezoelectric modules, leading out a negative electrode lead from the surface of the substrate 5, and leading out a positive electrode lead from the surface of the metal plate 6, thereby forming an array unit of the acoustic wave emission array unit 1;

[0084] Step S6: preparing a plurality of acoustic wave emission array units 1 according to steps S2 to S5, arranging them equidistantly along the circumference in the middle position of the rigid prismatic support structure 3 to form an acoustic wave emission cylindrical array, thereby obtaining an acoustic wave emission array unit 1;

[0085] Here, the piezoelectric material sheet used to make the acoustic wave receiving array unit 2 is made of PZT-5A piezoelectric ceramic.

[0086] Step S7: After preparing the piezoelectric modules according to Steps S2 and S3, two piezoelectric modules with opposite polarization directions are placed opposite to each other, and the opposite sides of the two piezoelectric modules are bonded to the two side surfaces of the metal plate 6 using conductive adhesive;

[0087] Step S8: attaching a sound absorbing layer to the back surface of the substrate 5 of the forward-polarized piezoelectric module, extending a negative electrode lead from the surface of the substrate 5, and extending a positive electrode lead from the substrate 5 of the reverse-polarized piezoelectric module, thereby forming an array unit of the acoustic wave receiving array unit 2;

[0088] Step S9: preparing a plurality of acoustic wave receiving array units 2 according to steps S2, S3, S7, and S8, and arranging them equidistantly along the circumferential direction at the upper and lower ends of the outer side of the rigid prismatic support structure 3 to form acoustic wave receiving cylindrical arrays at the upper and lower ends, thereby preparing an acoustic wave receiving array unit 2;

[0089] Step S10: The external potting glue of the sound wave emitting cylindrical array, the sound wave receiving cylindrical array, the sound absorbing layer and the rigid prism support structure 3 is cured to form a waterproof and sound-permeable layer.

[0090] The foregoing is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained herein shall, unless otherwise specified or limited, be implemented in accordance with conventional means in the art.

Claims

1. A high-performance cylindrical array underwater acoustic transducer with integrated transceiver and transmitter, characterized by: It includes a cylindrical array sensitive element, a rigid prism support structure (3), a sound absorbing layer and a waterproof sound-permeable layer; The cylindrical array sensitive element comprises an acoustic wave emitting array unit (1) and two acoustic wave receiving array units (2), wherein the two acoustic wave receiving array units (2) are respectively located at the upper and lower ends of the acoustic wave emitting array unit (1), the acoustic wave emitting array unit (1) is bonded to the middle position of the outer side of the rigid prism support structure (3), and the two acoustic wave receiving array units (2) are respectively bonded to the upper and lower ends of the outer side of the rigid prism support structure (3); The acoustic wave transmitting array unit (1) and the acoustic wave receiving array unit (2) each comprise a plurality of array units, wherein the plurality of array units are arranged circumferentially along the rigid prism support structure (3); The array unit includes a metal plate (6) and two piezoelectric modules, wherein the piezoelectric modules include a substrate (5) and a piezoelectric column array (4) fixedly connected to one side of the substrate (5), the two piezoelectric modules are relatively stacked, and the metal plate (6) is bonded between the two relatively stacked piezoelectric modules; The two piezoelectric modules of the acoustic wave emission array unit (1) are connected in electrical parallel; The two piezoelectric modules of the acoustic wave receiving array unit (2) are connected in an electrically serial manner; One side of the sound absorbing layer is attached to the outside of the rigid prism support structure (3); the base (5) of the array unit close to the side of the rigid prism support structure (3) is attached to the other side of the sound absorbing layer; and the cylindrical array sensitive element, the rigid prism support structure (3) and the sound absorbing layer are all arranged in the waterproof and sound-permeable layer.

2. The high-performance cylindrical array underwater acoustic transducer with integrated transmission and reception according to claim 1, characterized in that: The substrate (5) and the piezoelectric pillar array (4) are connected as one body.

3. The high-performance cylindrical array underwater acoustic transducer with integrated transmitting and receiving functions according to claim 1, characterized in that: The piezoelectric module is made of piezoelectric ceramics or piezoelectric single crystals.

4. The high-performance cylindrical array underwater acoustic transducer with integrated transmission and reception according to claim 1, characterized in that: The piezoelectric column array (4) comprises a plurality of piezoelectric columns, and air is filled between adjacent piezoelectric columns.

5. The high-performance cylindrical array underwater acoustic transducer with integrated transmitting and receiving functions according to claim 1, characterized in that: The two piezoelectric column arrays (4) in the same array unit have different thicknesses, the two piezoelectric modules are stacked along the thickness direction of the piezoelectric column array (4), and the metal plate (6) is bonded between the two piezoelectric modules.

6. The high-performance cylindrical array underwater acoustic transducer with integrated transmitting and receiving functions according to claim 1, characterized in that: A surface of the metal plate (6) in contact with the piezoelectric pillar array (4) has pits at corresponding positions and is coated with conductive silver paste.

7. The high-performance cylindrical array underwater acoustic transducer with integrated transmitting and receiving functions according to claim 1, characterized in that: A positive electrode lead is drawn from the surface of the metal plate (6) in the acoustic wave emission array unit (1), and a negative electrode lead is drawn from the surfaces of the two substrates (5) in the acoustic wave emission array unit (1).

8. The high-performance cylindrical array underwater acoustic transducer with integrated transmission and reception according to claim 1, characterized in that: A negative electrode lead is drawn from the surface of the base (5) on the side of the sound wave receiving array unit (2) close to the rigid prism support structure (3), and a positive electrode lead is drawn from the surface of the base (5) on the side of the sound wave receiving array unit (2) away from the rigid prism support structure (3).

9. A process for preparing a high-performance cylindrical array underwater acoustic transducer with integrated transmission and reception, for preparing the high-performance cylindrical array underwater acoustic transducer with integrated transmission and reception according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step S1: preparing a rigid prism support structure (3), and evenly attaching a sound absorbing layer to the outer layer of the rigid prism support structure (3); Step S2: Electrodes are plated on both sides of the piezoelectric material sheet, the piezoelectric material sheet is polarized in the thickness direction, and the piezoelectric material sheet is cut along the length and width directions of the piezoelectric material sheet to form a piezoelectric column array (4) and a substrate (5) integrally connected to the piezoelectric column array (4), which is a piezoelectric module; Step S3: making pits at positions corresponding to the piezoelectric pillar array (4) on the metal plate (6) and applying silver paste; Step S4: two piezoelectric modules with the same polarization direction are arranged opposite to each other, and the opposite sides of the two piezoelectric modules are bonded to the two side surfaces of the metal plate (6) by conductive glue; Step S5: attaching a sound absorbing layer to the back of the substrate (5) of one of the piezoelectric modules, leading out a negative electrode lead from the surface of the substrate (5), and leading out a positive electrode lead from the surface of the metal plate (6), thereby forming an array unit of the acoustic wave emission array unit (1); Step S6: preparing a plurality of array units of the acoustic wave emission array units (1) according to steps S2 to S5, arranging them equidistantly along the circumference at the middle position of the rigid prism support structure (3) to form an acoustic wave emission cylindrical array, thereby preparing the acoustic wave emission array unit (1); Step S7: After preparing the piezoelectric modules according to Step S2 and Step S3, two piezoelectric modules with opposite polarization directions are arranged opposite to each other, and the opposite sides of the two piezoelectric modules are bonded to the two side surfaces of the metal plate (6) by conductive adhesive; Step S8: attaching a sound absorbing layer to the back of the substrate (5) of the forward polarized piezoelectric module, leading out a negative electrode lead on the surface of the substrate (5), and leading out a positive electrode lead on the substrate (5) of the reverse polarized piezoelectric module, thereby forming an array unit of a sound wave receiving array unit (2); Step S9: preparing a plurality of array units of the sound wave receiving array unit (2) according to step S2, step S3, step S7, and step S8, arranging them equidistantly along the circumferential direction at the upper and lower ends of the outer side of the rigid prism support structure (3) to form sound wave receiving cylindrical arrays at the upper and lower ends, thereby preparing the sound wave receiving array unit (2); Step S10: The external potting glue of the sound wave emitting cylindrical array, the sound wave receiving cylindrical array, the sound absorbing layer and the rigid prism support structure (3) is cured to form a waterproof and sound-permeable layer.

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