High-temperature-resistant weather-resistant epoxy resin adhesive and preparation method thereof

Abstract

The invention discloses a high-temperature-resistant and weather-resistant epoxy resin adhesive and a preparation method thereof, and belongs to the field of epoxy resin adhesives, the adhesive can keep stable bonding strength for a long time at high temperature through the synergistic effect of hydrogenated bisphenol F type epoxy resin, silicon-containing phenyl glycidyl ether epoxy resin and a dicyandiamide-imidazole composite curing agent, and the adhesive has high temperature resistance and weather resistance. According to the present invention, the graphene aerogel is added to the silicon-containing phenyl glycidyl ether epoxy resin to meet the high temperature environment use requirement, and the silica bond in the silicon-containing phenyl glycidyl ether epoxy resin and the aging resistance of the graphene aerogel enable the adhesive to have characteristics of excellent ultraviolet aging resistance, excellent thermal cycling resistance and excellent moisture resistance, solve the performance defects of the traditional product, and be suitable for the application in the high temperature and severe environment, the method has an important practical value.

Description

Technical Field

[0001] The present invention relates to the field of epoxy resin adhesives, and more particularly to a high-temperature-resistant and weather-resistant epoxy resin adhesive and a preparation method thereof. Background Art

[0002] Epoxy resin adhesives are widely used in electronics, machinery, construction, aerospace and other fields due to their advantages such as high bond strength, low shrinkage and good chemical stability. However, traditional epoxy resin adhesives are prone to softening and a significant decrease in bond strength in high temperature environments (such as above 150°C). They also have poor weather resistance (such as resistance to UV aging, resistance to hot and cold cycles, and resistance to moisture). When used outdoors or in complex environments for a long time, they are prone to cracking and debonding, which seriously limits their application in high temperature and harsh environments.

[0003] In the existing technology, in order to improve the high temperature resistance of epoxy resin adhesives, the introduction of rigid groups (such as aromatic rings) or the addition of inorganic fillers (such as alumina and silica) are often used. However, the simple introduction of rigid groups will lead to a decrease in the toughness of the adhesive, and if the inorganic fillers are unevenly dispersed, it will cause local stress concentration, which will reduce the bonding performance. In terms of improving weather resistance, although there are studies on improving UV resistance by adding UV absorbers, such additives are easy to migrate and lose, the long-term effect is poor, and it is difficult to take into account high temperature stability.

[0004] Therefore, the development of an epoxy resin adhesive that has excellent high temperature resistance, good weather resistance, and maintains high bonding strength and toughness, and an efficient preparation method thereof, has become a technical problem that needs to be urgently solved in the current adhesive field. Summary of the Invention

[0005] 1. Technical problems to be solved

[0006] In response to the problems of existing epoxy resin adhesives such as insufficient high-temperature resistance, poor weather resistance, and difficulty in balancing toughness and strength, the present invention provides a high-temperature and weather-resistant epoxy resin adhesive and a preparation method thereof. Through the synergistic effect of specific components, the adhesive can maintain stable bonding performance in high-temperature environments while having excellent weather resistance. The preparation process is simple and controllable, making it suitable for industrial production.

[0007] 2. Technical solution

[0008] To solve the above problems, the present invention adopts the following technical solutions.

[0009] A high-temperature-resistant and weather-resistant epoxy resin adhesive comprises the following components, by weight: 30-50 parts of hydrogenated bisphenol F epoxy resin, 15-25 parts of silicon-phenyl glycidyl ether epoxy resin, 12-20 parts of dicyandiamide-imidazole composite curing agent, 8-15 parts of graphene aerogel-modified nano-alumina, 3-8 parts of mercaptopropyltrimethoxysilane, 10-18 parts of core-shell structured acrylic elastomer, 0.5-3 parts of 2-ethyl-4-methylimidazole, and 5-10 parts of triphenyl phosphate.

[0010] Furthermore, the preparation method of the hydrogenated bisphenol F type epoxy resin is as follows: using bisphenol F as a raw material, performing a hydrogenation reaction under the action of a catalyst (such as Raney nickel), the reaction temperature is 120-150°C, the pressure is 3-5MPa, and after hydrogenation, it is epoxidized with epichlorohydrin to control the epoxy value to 0.45-0.55eq / 100g;

[0011] The preparation method of the silicon-containing phenyl glycidyl ether epoxy resin comprises: using phenyl glycidyl ether and a silicon-containing monomer (such as methyltriethoxysilane) as raw materials, carrying out a condensation reaction under the action of an acidic catalyst (such as hydrochloric acid), the reaction temperature being 80-100° C., the reaction time being 4-6 hours, and the epoxy value of the product being controlled to be 0.30-0.40 eq / 100g after purification;

[0012] The preparation method of the dicyandiamide-imidazole composite curing agent is as follows: dicyandiamide and imidazole are added into a mixer at a mass ratio of 3:1, stirred at 500-600 rpm for 20-30 minutes at 60-80° C., and mixed evenly;

[0013] The preparation method of the graphene aerogel-modified nano-alumina comprises the following steps: first, using graphene oxide as a raw material, subjecting it to hydrothermal reduction (180° C., 12 hours) and freeze-drying to obtain graphene aerogel; then, drying nano-alumina (particle size 50-100 nm) at 100-120° C. for 2 hours; finally, adding the graphene aerogel and nano-alumina in a mass ratio of 1:8-1:10 into a ball mill, using ethanol as a dispersion medium, ball-milling for 2-3 hours, and drying to obtain the obtained product;

[0014] The preparation method of mercaptopropyltrimethoxysilane is as follows: chloropropyltrimethoxysilane and sodium hydrosulfide are used as raw materials in an organic solvent (such as ethanol) for reaction at a temperature of 60-70° C. for 3-4 hours, and the product is purified by distillation;

[0015] The preparation method of the core-shell structured acrylic elastomer comprises: first preparing the core layer, namely, emulsifying an acrylic ester monomer (such as butyl ester), a crosslinking agent (such as divinylbenzene), and an initiator (ammonium persulfate) in deionized water, and polymerizing at 70-80° C. for 2-3 hours to form a cross-linked acrylic ester core layer; then preparing the shell layer, namely, adding an epoxy group-containing acrylic ester monomer and an initiator to the core layer emulsion, and continuing the polymerization for 1-2 hours, controlling the core-shell mass ratio to be 3:1-4:1;

[0016] The preparation method of the 2-ethyl-4-methylimidazole is as follows: ethylamine and acetone are used as raw materials in industry, and the product is prepared by cyclization reaction at a reaction temperature of 100-120° C. and a reaction time of 5-6 hours, and the product is purified by distillation;

[0017] The preparation method of triphenyl phosphate is as follows: phenol and phosphorus oxychloride are used as raw materials, reacted in the presence of an alkaline catalyst (such as pyridine), the reaction temperature is 80-90°C, the reaction time is 3-4 hours, and the product is washed with water and purified by distillation.

[0018] Furthermore, in the dicyandiamide-imidazole composite curing agent, the mass ratio of dicyandiamide to imidazole is 3:1.

[0019] Furthermore, the particle size of the graphene aerogel-modified nano-alumina is 50-100 nm, and the mass ratio of the graphene aerogel to the nano-alumina is 1:8-1:10.

[0020] Furthermore, the core layer of the core-shell structured acrylic elastomer is cross-linked acrylic ester with a glass transition temperature Tg of 50°C to 40°C, the shell layer is an acrylic ester copolymer containing epoxy groups, and the core-shell mass ratio is 3:1-4:1.

[0021] Furthermore, the epoxy value of the hydrogenated bisphenol F epoxy resin is 0.45-0.55 eq / 100 g, and the epoxy value of the silicon phenyl glycidyl ether epoxy resin is 0.30-0.40 eq / 100 g.

[0022] A method for preparing a high-temperature resistant and weather-resistant epoxy resin adhesive comprises the following steps:

[0023] Step 1: Pre-treat the filler by adding the graphene aerogel-modified nano-alumina into a high-speed mixer and drying it at 80-100°C for 2-3 hours. Then, add 5% of the filler mass of mercaptopropyltrimethoxysilane and stir at a speed of 1000-1200 rpm for 30-40 minutes for later use.

[0024] Step 2: Prepare a resin matrix by adding hydrogenated bisphenol F epoxy resin and silicon phenyl glycidyl ether epoxy resin in parts by weight into a reaction kettle, stirring at 600-800 rpm at 60-70° C. for 20-30 minutes to mix evenly;

[0025] Step 3: Mix the filler and the resin. Slowly add the filler pretreated in step 1 to the resin matrix in step 2, and stir at 70-80°C and 800-1000 rpm for 40-50 minutes.

[0026] Step 4: Add functional additives, add core-shell structure acrylic elastomer and triphenyl phosphate in sequence, and stir at 60-65°C and 500-600 rpm for 15-20 minutes;

[0027] Step 5: Adding a curing system, mixing the dicyandiamide-imidazole composite curing agent and 2-ethyl-4-methylimidazole in parts by weight, adding the mixture to the above mixture, and stirring at 50-55° C. and 400-500 rpm for 10-15 minutes to obtain a high temperature resistant and weather resistant epoxy resin adhesive;

[0028] Step 6: Curing treatment: apply the adhesive to the surface of the substrate to be bonded and cure it at 120-150℃ for 2-3 hours.

[0029] Furthermore, in step one, the stirring environment of the high-speed mixer is an inert gas protective atmosphere, and the inert gas is nitrogen or argon. In step six, the curing treatment adopts a staged heating method, specifically, first keeping warm at 80-100°C for 1 hour, then heating to 120-150°C and keeping warm for 1-2 hours. In steps two to five, the vacuum degree of the reactor is controlled at 0.08 to 0.09 MPa to remove bubbles in the mixture.

[0030] 3. Beneficial effects

[0031] Compared with the prior art, the advantages of the present invention are:

[0032] (1) In this scheme, through the synergistic effect of hydrogenated bisphenol F epoxy resin, silanyl glycidyl ether epoxy resin and dicyandiamide-imidazole composite curing agent, the adhesive can maintain stable bonding strength for a long time at high temperature, meeting the requirements of use in high temperature environment. In addition, the silicon-oxygen bond in the silanyl glycidyl ether epoxy resin and the aging resistance of graphene aerogel give the adhesive excellent resistance to UV aging, resistance to cold and hot cycles and resistance to moisture;

[0033] (2) In this solution, graphene aerogel-modified nano-alumina can enhance mechanical strength, and core-shell structured acrylic elastomer can improve toughness. The combination of these two measures solves the problem of "rigid and brittle" of traditional epoxy resin adhesives. At the same time, mercaptopropyltrimethoxysilane can improve the interfacial compatibility between fillers and resins, avoid filler agglomeration, and ensure that the performance differences of adhesive batches are reduced. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the technical solution part of the specification of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] Example 1:

[0036] (1) Material preparation

[0037] Hydrogenated bisphenol F epoxy resin: 30 parts (epoxy value 0.45 eq / 100 g);

[0038] Silicon-containing phenyl glycidyl ether epoxy resin: 15 parts (epoxy value 0.30eq / 100g);

[0039] Dicyandiamide-imidazole composite curing agent: 12 parts (dicyandiamide:imidazole = 3:1);

[0040] Graphene aerogel-modified nano-alumina: 8 parts (particle size 50 nm, graphene aerogel: nano-alumina = 1:8);

[0041] Mercaptopropyltrimethoxysilane: 0.4 parts (5% of filler mass);

[0042] Core-shell acrylic elastomer: 10 parts (core-shell ratio 3:1, core layer Tg -50°C);

[0043] 2-ethyl-4-methylimidazole: 0.5 parts;

[0044] Triphenyl phosphate: 5 parts.

[0045] (2) Preparation process

[0046] Pretreatment of filler: Add 8 parts of graphene aerogel-modified nano-alumina into a high-speed mixer, introduce nitrogen protection, and dry at 80°C for 2 hours; add 0.4 parts of mercaptopropyltrimethoxysilane, stir at 1000 rpm for 30 minutes, and set aside.

[0047] Preparation of resin matrix: 30 parts of hydrogenated bisphenol F epoxy resin and 15 parts of silicon phenyl glycidyl ether epoxy resin were added into a reaction kettle, the vacuum degree was controlled at 0.08 MPa, and stirring was carried out at 600 rpm at 60°C for 20 minutes.

[0048] Mixing filler and resin: slowly add the pretreated filler into the resin matrix, stir at 800 rpm at 70°C for 40 minutes, and maintain the vacuum degree at 0.08 MPa.

[0049] Add functional additives: add 10 parts of core-shell structure acrylic elastomer and 5 parts of triphenyl phosphate, stir at 500 rpm at 60° C. for 15 minutes, and vacuum degree 0.08 MPa.

[0050] Add the curing system: evenly mix 12 parts of dicyandiamide-imidazole composite curing agent and 0.5 parts of 2-ethyl-4-methylimidazole, add the above mixture, and stir at 400 rpm at 50° C. for 10 minutes to obtain an adhesive.

[0051] Curing treatment: Apply to the surface of 45# steel substrate and use segmented heating to cure: keep warm at 80℃ for 1 hour, then keep warm at 120℃ for 2 hours.

[0052] Example 2:

[0053] (1) Material preparation

[0054] Hydrogenated bisphenol F epoxy resin: 40 parts (epoxy value 0.50 eq / 100 g);

[0055] Silicon-containing phenyl glycidyl ether epoxy resin: 20 parts (epoxy value 0.35eq / 100g);

[0056] Dicyandiamide-imidazole composite curing agent: 16 parts (dicyandiamide:imidazole = 3:1);

[0057] Graphene aerogel-modified nano-alumina: 12 parts (particle size 80 nm, graphene aerogel: nano-alumina = 1:9);

[0058] Mercaptopropyltrimethoxysilane: 0.6 parts (5% of filler mass);

[0059] Core-shell acrylic elastomer: 14 parts (core-shell ratio 3.5:1, core layer Tg -45°C);

[0060] 2-ethyl-4-methylimidazole: 1.5 parts;

[0061] Triphenyl phosphate: 8 parts.

[0062] (2) Preparation process

[0063] Pretreatment of filler: Add 12 parts of graphene aerogel-modified nano-alumina into a high-speed mixer, protect with argon, and dry at 90° C. for 2.5 hours; add 0.6 parts of mercaptopropyltrimethoxysilane, stir at 1100 rpm for 35 minutes, and set aside.

[0064] Preparation of resin matrix: 40 parts of hydrogenated bisphenol F epoxy resin and 20 parts of silicon phenyl glycidyl ether epoxy resin were added to a reaction kettle, vacuumed to 0.085 MPa, and stirred at 700 rpm at 65° C. for 25 minutes.

[0065] Mixing filler and resin: slowly add pretreated filler, stir at 900 rpm at 75°C for 45 minutes, and vacuum degree 0.085 MPa.

[0066] Functional additives were added: 14 parts of core-shell elastomer and 8 parts of triphenyl phosphate, and stirred at 550 rpm for 18 minutes at 63° C. and a vacuum degree of 0.085 MPa.

[0067] Add the curing system: 16 parts of composite curing agent + 1.5 parts of imidazole, stir at 450 rpm at 53° C. for 13 minutes to obtain an adhesive.

[0068] Curing treatment: After coating, curing is carried out in sections: keep warm at 90℃ for 1 hour and keep warm at 135℃ for 1.5 hours.

[0069] Example 3:

[0070] (1) Material preparation

[0071] Hydrogenated bisphenol F epoxy resin: 50 parts (epoxy value 0.55 eq / 100 g);

[0072] Silicon-containing phenyl glycidyl ether epoxy resin: 25 parts (epoxy value 0.40eq / 100g);

[0073] Dicyandiamide-imidazole composite curing agent: 20 parts (dicyandiamide:imidazole = 3:1);

[0074] Graphene aerogel-modified nano-alumina: 15 parts (particle size 100 nm, graphene aerogel: nano-alumina = 1:10);

[0075] Mercaptopropyltrimethoxysilane: 0.75 parts (5% of filler mass);

[0076] Core-shell acrylic elastomer: 18 parts (core-shell ratio 4:1, core layer Tg -40°C);

[0077] 2-ethyl-4-methylimidazole: 3 parts;

[0078] Triphenyl phosphate: 10 parts.

[0079] (2) Preparation process

[0080] Pre-treating the filler: add 15 parts of filler into a high-speed mixer, protect with nitrogen, and dry at 100° C. for 3 hours; add 0.75 parts of mercaptopropyltrimethoxysilane, stir at 1200 rpm for 40 minutes, and set aside.

[0081] Prepare the resin matrix: 50 parts of hydrogenated bisphenol F epoxy resin + 25 parts of silicon-containing epoxy resin, the vacuum degree of the reactor is 0.09 MPa, and the mixture is stirred at 800 rpm at 70°C for 30 minutes.

[0082] Mixing filler and resin: slowly add pretreated filler, stir at 1000 rpm at 80°C for 50 minutes, and vacuum degree 0.09 MPa.

[0083] Add functional additives: 18 parts of core-shell elastomer + 10 parts of triphenyl phosphate, stir at 600 rpm at 65°C for 20 minutes, and vacuum degree 0.09 MPa.

[0084] Add the curing system: 20 parts of composite curing agent + 3 parts of imidazole, stir at 500 rpm at 55°C for 15 minutes to obtain an adhesive.

[0085] Curing treatment: After coating, curing is carried out in sections: keep warm at 100℃ for 1 hour, keep warm at 150℃ for 1 hour.

[0086] Comparative Example 1:

[0087] (1) Material adjustment

[0088] It does not contain silicon-containing phenyl glycidyl ether epoxy resin, and only uses 65 parts of hydrogenated bisphenol F type epoxy resin;

[0089] Replace graphene aerogel-modified nano-alumina with ordinary nano-alumina (not modified with graphene aerogel);

[0090] The other components and amounts are the same as those in Example 2, that is, the other components and amounts are:

[0091] Dicyandiamide-imidazole composite curing agent: 16 parts;

[0092] Mercaptopropyltrimethoxysilane: 0.6 parts;

[0093] Core-shell structure acrylic elastomer: 14 parts;

[0094] 2-ethyl-4-methylimidazole: 1.5 parts;

[0095] Triphenyl phosphate: 8 parts.

[0096] (2) Preparation process adjustment

[0097] There is no inert gas protection during pretreatment of filler;

[0098] The vacuum degree of the reactor is not controlled (bubbles are retained);

[0099] Other steps are the same as in Example 2.

[0100] Comparative Example 2:

[0101] (1) Material adjustment

[0102] Use ordinary dicyandiamide curing agent (without imidazole) instead of dicyandiamide-imidazole composite curing agent;

[0103] Does not contain core-shell structured acrylic elastomer;

[0104] The other components and amounts are the same as those in Example 2, that is, the other components and amounts are:

[0105] Hydrogenated bisphenol F epoxy resin: 40 parts;

[0106] Silicon-containing phenyl glycidyl ether epoxy resin: 20 parts;

[0107] Graphene aerogel modified nano-alumina: 12 parts;

[0108] Mercaptopropyltrimethoxysilane: 0.6 parts;

[0109] 2-ethyl-4-methylimidazole: 1.5 parts;

[0110] Triphenyl phosphate: 8 parts.

[0111] (2) Preparation process adjustment

[0112] Curing is carried out by directly keeping the temperature at 135℃ for 2.5 hours (without stepwise heating);

[0113] Other steps are the same as in Example 2.

[0114] Experimental part

[0115] (1) Test sample preparation specifications

[0116] Substrate treatment: All test substrates were 45# steel with a uniform size of 100mm×25mm×2mm. Before testing, they were polished with sandpaper (800 mesh) to remove the oxide layer, then ultrasonically cleaned with anhydrous ethanol for 15 minutes, and dried for later use.

[0117] Adhesive coating: Use a scraper to coat, the bonding area is controlled to 25mm×10mm, the adhesive layer thickness is 0.2-0.3mm (calibrated by a thickness gauge), and after coating, let it stand at room temperature for 10 minutes to eliminate bubbles before curing.

[0118] Number of samples: For each example and comparative example, at least 5 sets of parallel samples were prepared, and the test results were averaged, with the deviation controlled within ±5%.

[0119] (2) Test items and standards (as shown in Table 1 below)

[0120] Table 1:

[0121]

[0122]

[0123] (III) Performance test results: The adhesives of Examples 1 to 3 and Comparative Examples 1 to 2 were subjected to performance tests. The results are shown in Table 2 below:

[0124] Table 2:

[0125]

[0126] Result Analysis

[0127] 1. Mechanism of High-Temperature Resistance: In Examples 1-3, the saturated six-membered ring structure of the hydrogenated bisphenol F epoxy resin provides high-temperature rigidity, while the high Si-O bond energy of the silylphenyl glycidyl ether epoxy resin inhibits molecular chain motion at high temperatures. These two components, combined with the dicyandiamide-imidazole composite curing agent, synergistically form a highly cross-linked network, resulting in a 200°C shear strength retention rate of 82%-83%. Comparative Example 1 lacks a silicone-containing resin and unmodified fillers, resulting in molecular chains that relax easily at high temperatures, resulting in a 200°C strength retention rate of only 60%. Comparative Example 2, due to its single curing agent and lack of imidazole to promote crosslinking, has a low crosslink density and further degrades its high-temperature stability.

[0128] 2. Reasons for improved weather resistance: The siloxy bonds in the epoxy resin containing silylphenyl glycidyl ether have excellent resistance to UV radiation, and the conjugated structure of the graphene aerogel effectively blocks UV light penetration. Therefore, after 1000 hours of UV aging, the strength retention rate reaches 90%-93%. In contrast, in Comparative Example 1, due to the lack of siloxy bonds and graphene aerogel, UV light easily causes the epoxy resin backbone to break, resulting in a retention rate of only 65%. In addition, the three-dimensional network structure of the graphene aerogel-modified nanoalumina inhibits moisture penetration, and combined with the improved interfacial compatibility of mercaptosilane, the example still maintains a strength retention rate of over 85% under conditions of 85°C / 85% RH.

[0129] 3. Toughness and strength balance mechanism: The core layer of the core-shell structured acrylic elastomer is a flexible chain that can absorb impact energy through "crack bridging". The epoxy groups in the shell are covalently bonded to the resin matrix to avoid phase separation, so the impact strength reaches 25-30kJ / m 2 Comparative Example 2 does not contain elastomer, so the impact strength is only 15kJ / m 2 , and it is easy to crack due to stress concentration during hot and cold cycles.

[0130] 4. Process Impact Verification: This example utilizes inert gas protection to prevent filler oxidation and vacuum degassing to ensure uniform filler dispersion. Staged curing avoids internal stress caused by rapid temperature increases, resulting in no cracking in the sample. In contrast, Example 1, lacking inert gas protection and vacuum degassing, exhibits filler agglomeration, leading to localized defects and significant cracking after thermal cycling.

[0131] 5. Conclusion: The present invention successfully prepared an epoxy resin adhesive with high temperature resistance, weather resistance, high strength and high toughness by rationally selecting components and optimizing the preparation process. It solves the performance defects of traditional products, is suitable for use in high temperature and harsh environments, and has important practical value.

[0132] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any person skilled in the art who, within the technical scope disclosed by the present invention, makes equivalent substitutions or modifications based on the technical solutions and improved concepts of the present invention shall be covered by the scope of protection of the present invention.

Claims

1. A high temperature resistant and weather resistant epoxy resin adhesive, characterized in that: The invention comprises the following components in parts by weight: 30-50 parts of hydrogenated bisphenol F epoxy resin, 15-25 parts of silicon phenyl glycidyl ether epoxy resin, 12-20 parts of dicyandiamide-imidazole composite curing agent, 8-15 parts of graphene aerogel modified nano-alumina, 3-8 parts of mercaptopropyltrimethoxysilane, 10-18 parts of core-shell structure acrylic elastomer, 0.5-3 parts of 2-ethyl-4-methylimidazole, and 5-10 parts of triphenyl phosphate.

2. The high temperature and weather resistant epoxy resin adhesive according to claim 1, characterized in that: In the dicyandiamide-imidazole composite curing agent, the mass ratio of dicyandiamide to imidazole is 3:

1.

3. The high temperature and weather resistant epoxy resin adhesive according to claim 1, characterized in that: The particle size of the graphene aerogel-modified nano-alumina is 50-100 nm, and the mass ratio of the graphene aerogel to the nano-alumina is 1:8-1:

10.

4. The high temperature and weather resistant epoxy resin adhesive according to claim 1, characterized in that: The core layer of the core-shell structured acrylic elastomer is cross-linked acrylic ester with a glass transition temperature Tg of 50° C. to 40° C., the shell layer is an acrylic ester copolymer containing epoxy groups, and the core-shell mass ratio is 3:1-4:

1.

5. The high temperature and weather resistant epoxy resin adhesive according to claim 1, characterized in that: The epoxy value of the hydrogenated bisphenol F epoxy resin is 0.45-0.55 eq / 100 g, and the epoxy value of the silicon-phenyl glycidyl ether epoxy resin is 0.30-0.40 eq / 100 g.

6. A method for preparing the high temperature resistant and weather resistant epoxy resin adhesive according to any one of claims 1 to 5, characterized in that: The following steps are involved: Step 1: Pre-treat the filler by adding the graphene aerogel-modified nano-alumina into a high-speed mixer and drying it at 80-100°C for 2-3 hours. Then, add 5% of the filler mass of mercaptopropyltrimethoxysilane and stir at a speed of 1000-1200 rpm for 30-40 minutes for later use. Step 2: Prepare a resin matrix by adding hydrogenated bisphenol F epoxy resin and silicon phenyl glycidyl ether epoxy resin in parts by weight into a reaction kettle, stirring at 600-800 rpm at 60-70° C. for 20-30 minutes to mix evenly; Step 3: Mix the filler and the resin. Slowly add the filler pretreated in step 1 to the resin matrix in step 2, and stir at 70-80°C and 800-1000 rpm for 40-50 minutes. Step 4: Add functional additives, add core-shell structure acrylic elastomer and triphenyl phosphate in sequence, and stir at 60-65°C and 500-600 rpm for 15-20 minutes; Step 5: Adding a curing system, mixing the dicyandiamide-imidazole composite curing agent and 2-ethyl-4-methylimidazole in parts by weight, adding the mixture to the above mixture, and stirring at 50-55° C. and 400-500 rpm for 10-15 minutes to obtain a high temperature resistant and weather resistant epoxy resin adhesive; Step 6: Curing treatment: apply the adhesive to the surface of the substrate to be bonded and cure it at 120-150℃ for 2-3 hours.

7. The preparation process according to claim 6, characterized in that: In step 1, the stirring environment of the high-speed mixer is an inert gas protection atmosphere, and the inert gas is nitrogen or argon.

8. The preparation process according to claim 6, characterized in that: In step six, the curing treatment adopts a staged heating method, specifically, first keeping the temperature at 80-100°C for 1 hour, and then heating to 120-150°C and keeping the temperature for 1-2 hours.

9. The preparation process according to claim 6, characterized in that: In steps 2 to 5, the vacuum degree of the reactor is controlled at 0.08 to 0.09 MPa to remove bubbles in the mixture.

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