Heat and mass transfer analysis method, system and equipment

Abstract

The invention discloses a heat and mass transfer analysis method, system and equipment, the method is applied to a heat exchanger, the heat exchanger comprises a cold fluid flow channel and a hot fluid flow channel, the method comprises the steps that target strategies and a convection conduction function of the heat exchanger are obtained, and the target strategies comprise a standard working condition strategy and a non-standard working condition strategy; according to the target strategy and the convection conduction function, convection conduction stratified analysis is conducted on all conduction infinitesimal elements on the heat exchanger, and first temperature data of a plurality of cold end infinitesimal elements and second temperature data of a plurality of hot end infinitesimal elements are obtained; and according to all the first temperature data and the second temperature data, convection conduction analysis information of the heat exchanger is generated. According to the method, the application range of heat and mass transfer analysis can be effectively widened, and the detail degree and interpretability of heat and mass transfer analysis are improved. The invention relates to the technical field of thermal measurement.

Description

Technical Field

[0001] The present application relates to the technical field of thermal measurement in heat and mass transfer processes, and in particular to an analysis method, system, and equipment for heat and mass exchange. Background Art

[0002] The heat and mass transfer process refers to the coupled phenomenon of the transfer of matter and energy in a medium, involving the interaction between heat transfer (i.e. heat transfer) and material diffusion (i.e. mass transfer), which is crucial to the improvement of heat exchanger flow channels and heat exchangers.

[0003] At present, the relevant technology usually involves spot welding multiple thermocouples on the surface of the heat exchanger flow channel, and analyzing the heat and mass transfer process of the heat exchanger through the temperature data collected by the thermocouples. However, due to the obvious black box effect of this method, it is often difficult to reflect the changes in the mass and heat transfer process at various positions of the heat exchanger. The scope of application is limited, and the accuracy and reliability of the heat and mass exchange analysis are unsatisfactory.

[0004] Therefore, the problems existing in related technologies still need to be solved and optimized urgently. Summary of the Invention

[0005] In order to solve at least one of the above technical problems, the present application provides a heat and mass exchange analysis method, system and equipment, wherein the method can effectively improve the scope of application of heat and mass exchange analysis and improve the accuracy and reliability of heat and mass exchange analysis.

[0006] According to a first aspect of the present application, a heat and mass exchange analysis method is provided, which is applied to a heat exchanger, wherein the heat exchanger includes a cold fluid flow channel and a hot fluid flow channel, and the method comprises:

[0007] Obtaining a target strategy and a convection conduction function of the heat exchanger, wherein the target strategy includes a standard operating condition strategy and a non-standard operating condition strategy;

[0008] performing a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, wherein the cold-end elements are conduction elements of the cold fluid flow channel and the hot-end elements are conduction elements of the hot fluid flow channel;

[0009] Convection and conduction analysis information of the heat exchanger is generated according to all the first temperature data and the second temperature data.

[0010] Furthermore, in an embodiment of the present application, when the target strategy is a standard operating condition strategy, a convection conduction hierarchical analysis is performed on all conduction elements on the heat exchanger according to the target strategy and the convection conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, including:

[0011] According to the standard operating condition strategy, obtaining a first cold flow port temperature of the cold fluid flow channel and a first hot flow port temperature of the hot fluid flow channel, wherein a cold flow port position of the first cold flow port temperature is the same as a hot flow port position of the first hot flow port temperature;

[0012] According to the convection conduction function, the first hot flow port temperature and the first cold flow port temperature, a microelement heat exchange analysis process is performed to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement.

[0013] Furthermore, in an embodiment of the present application, performing microelement heat exchange analysis processing based on the convection conduction function, the first hot flow port temperature, and the first cold flow port temperature to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement includes:

[0014] Acquire a first cold flow element temperature of the current cold end element and a first hot flow element temperature of the hot end element, where the first cold flow element temperature is the first cold flow port temperature or the first temperature data of the first element, and the first hot flow element temperature is the first hot flow port temperature or the second temperature data of the second element; wherein the first element is the cold end element preceding the current cold end element, and the second element is the hot end element preceding the current hot end element;

[0015] performing adaptive coefficient calculation on the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain the current cold flow conduction coefficient of the cold end element and the heat flow conduction coefficient of the hot end element;

[0016] Heat transfer analysis is performed based on the cold flow conduction coefficient, the heat flow conduction coefficient, the first cold flow element temperature, and the first heat flow element temperature to obtain first temperature data of the current cold end element and second temperature data of the hot end element.

[0017] Furthermore, in an embodiment of the present application, the method further includes:

[0018] According to the standard working condition strategy, obtaining the temperature of the second cold flow port of the cold fluid flow channel;

[0019] Performing a fluid temperature analysis on the first hot flow port temperature according to the second cold flow port temperature and the first cold flow port temperature to obtain a second hot flow port temperature of the hot fluid flow channel;

[0020] performing a cold flow boundary analysis on the first temperature data according to the second cold flow port temperature to obtain a cold flow analysis result;

[0021] According to the second heat flow port temperature, a heat flow boundary analysis is performed on the second temperature data to obtain a heat flow analysis result.

[0022] Furthermore, in an embodiment of the present application, performing adaptive coefficient calculation on the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain the current cold flow conduction coefficient of the cold end element and the heat flow conduction coefficient of the hot end element includes:

[0023] Obtaining the heat exchange area between the current cold end micro-element and the hot end micro-element;

[0024] According to the first cold flow element temperature and the first heat flow element temperature, adaptively generating coefficients for the convection conduction function to obtain a plurality of cold flow intermediate coefficients and a plurality of heat flow intermediate coefficients, each cold flow intermediate coefficient corresponding to one heat flow intermediate coefficient;

[0025] Performing coefficient validity verification on the cold flow intermediate coefficient and the hot flow intermediate coefficient according to the heat exchange area to obtain a validity verification result;

[0026] If the validity verification result is valid, the last cold flow intermediate coefficient is determined as the cold flow conduction coefficient of the current cold end element, and the last heat flow intermediate coefficient is determined as the heat flow conduction coefficient of the current hot end element.

[0027] Furthermore, in an embodiment of the present application, the adaptive coefficient generation of the convection conduction function is performed based on the first cold flow element temperature and the first heat flow element temperature to obtain a plurality of cold flow intermediate coefficients and a plurality of heat flow intermediate coefficients, including:

[0028] Obtaining a third cold flow element temperature, a second hot flow element temperature, a heat flow exchange step length, and a cold flow exchange step length, wherein the third cold flow element temperature is the first cold flow element temperature or the previous fourth cold flow element temperature, and the second hot flow element temperature is the first heat flow element temperature or the previous third heat flow element temperature;

[0029] performing a heat flow temperature update on the second heat flow element temperature according to the heat flow exchange step length to obtain a third heat flow element temperature, and performing a cold flow temperature update on the third cold flow element temperature according to the cold flow exchange step length to obtain a fourth cold flow element temperature;

[0030] The coefficients of the convection conduction function are generated according to the fourth cold flow element temperature and the third heat flow element temperature to obtain the cold flow intermediate coefficient and the heat flow intermediate coefficient.

[0031] Furthermore, in an embodiment of the present application, the heat transfer analysis processing is performed based on the cold flow conduction coefficient, the heat flow conduction coefficient, the first cold flow element temperature, and the first heat flow element temperature to obtain the first temperature data of the current cold end element and the second temperature data of the hot end element, including:

[0032] Obtaining the heat exchange area between the current cold-end micro-element and the hot-end micro-element, as well as the heat exchange cold-end temperature and the heat exchange hot-end temperature of the heat exchange area;

[0033] performing a microelement heat flow analysis on the first cold flow microelement temperature and the first hot flow microelement temperature based on the cold flow conduction coefficient, the heat flow conduction coefficient, the heat exchange area, the heat exchange cold end temperature, and the heat exchange hot end temperature to obtain a current microelement heat exchanged between the cold end microelement and the hot end microelement;

[0034] Performing cold flow heat correction on the first cold flow micro-element temperature according to the micro-element exchange heat to obtain the first temperature data;

[0035] According to the heat exchanged by the micro-element, heat flow heat correction is performed on the first heat flow micro-element temperature to obtain the second temperature data.

[0036] Furthermore, in an embodiment of the present application, when the target strategy is a non-standard operating condition strategy, a convection conduction hierarchical analysis is performed on all conduction elements on the heat exchanger according to the target strategy and the convection conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, including:

[0037] According to the non-standard working condition strategy, obtaining a second cold flow port temperature of the cold fluid flow channel and a first hot flow port temperature of the hot fluid flow channel, wherein a cold flow port position of the second cold flow port temperature is different from a hot flow port position of the first hot flow port temperature;

[0038] According to the convection conduction function, the first hot flow port temperature and the second cold flow port temperature, a microelement heat exchange analysis process is performed to obtain first temperature data of several cold end microelements and second temperature data of several hot end microelements.

[0039] Furthermore, in the embodiment of the present application, the microelement heat exchange analysis processing is performed based on the convection conduction function, the first hot flow port temperature, and the second cold flow port temperature to obtain the first temperature data of a plurality of the cold end microelements and the second temperature data of a plurality of the hot end microelements, including:

[0040] Obtaining a temperature step and a first simulation temperature, where the first simulation temperature is the second cold flow port temperature or the second simulation temperature of the previous step;

[0041] Performing a microelement heat exchange analysis process according to the convection conduction function, the first heat flow port temperature, and the first simulation temperature to obtain first temperature data of a plurality of the cold-end microelements and second temperature data of a plurality of the hot-end microelements;

[0042] performing a cold flow boundary analysis on the first temperature data according to the second cold flow port temperature to obtain a cold flow analysis result;

[0043] If the cold flow analysis result is that the cold flow boundary condition is not met, the first simulation temperature is updated according to the temperature step to obtain the second simulation temperature, and then the step of obtaining the temperature step and the first simulation temperature is returned to be executed.

[0044] According to a second aspect of the present application, a heat and mass exchange analysis system is provided, which is applied to a heat exchanger, wherein the heat exchanger includes a cold fluid flow channel and a hot fluid flow channel, and the system includes:

[0045] A first processing unit is configured to obtain a target strategy and a convection conduction function of the heat exchanger, wherein the target strategy includes a standard operating condition strategy and a non-standard operating condition strategy;

[0046] a second processing unit, configured to perform a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function, to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, wherein the cold-end elements are conduction elements of the cold fluid flow channel and the hot-end elements are conduction elements of the hot fluid flow channel;

[0047] The third processing unit is configured to generate convection and conduction analysis information of the heat exchanger according to all the first temperature data and the second temperature data.

[0048] According to a third aspect of the present application, a computer device is provided, comprising:

[0049] at least one processor;

[0050] at least one memory for storing at least one program;

[0051] When the at least one program is executed by the at least one processor, the at least one processor implements the method as described above.

[0052] According to a fourth aspect of the present application, a computer-readable storage medium is provided, in which a program executable by a processor is stored. When the program executable by the processor is executed by the processor, it is used to implement the method described in the above aspects.

[0053] The beneficial effects of the technical solution provided by the embodiments of this application are:

[0054] The present application provides a method, system, and apparatus for analyzing heat and mass exchange, wherein the method is applied to a heat exchanger, the heat exchanger including a cold fluid flow channel and a hot fluid flow channel. The method comprises obtaining a target strategy and a convection conduction function for the heat exchanger, the target strategy including a standard operating condition strategy and a non-standard operating condition strategy; performing a convection conduction hierarchical analysis on all conductive elements on the heat exchanger based on the target strategy and the convection conduction function, obtaining first temperature data for a plurality of cold-end elements and second temperature data for a plurality of hot-end elements, the cold-end elements being conductive elements in the cold fluid flow channel and the hot-end elements being conductive elements in the hot fluid flow channel; and generating convection conduction analysis information for the heat exchanger based on all the first and second temperature data. The method performs a convection conduction hierarchical analysis on all conductive elements on the heat exchanger based on the standard operating condition strategy or the non-standard operating condition strategy and the convection conduction function. The method can determine the changes in each conductive element in the heat exchanger during the mass and heat transfer process, effectively improving the accuracy and reliability of the heat and mass exchange analysis, and expanding the scope of application of the heat and mass exchange analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 A schematic flow chart of a heat and mass exchange analysis method provided in an embodiment of the present application;

[0056] Figure 2 A detailed flowchart of the first step S120 provided in an embodiment of the present application;

[0057] Figure 3 A detailed flowchart of step S220 provided in an embodiment of the present application;

[0058] Figure 4 A detailed flowchart of step S320 provided in an embodiment of the present application;

[0059] Figure 5A detailed flowchart of step S420 provided in an embodiment of the present application;

[0060] Figure 6 A detailed flowchart of step S330 provided in an embodiment of the present application;

[0061] Figure 7 A schematic diagram of one of the optional flow charts of a heat and mass exchange analysis method provided in an embodiment of the present application;

[0062] Figure 8 A detailed flowchart of the second step S120 provided in an embodiment of the present application;

[0063] Figure 9 A detailed flowchart of step S820 provided in an embodiment of the present application;

[0064] Figure 10 A schematic diagram of a heat and mass exchange analysis system provided in an embodiment of the present application;

[0065] Figure 11 A structural block diagram of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0066] The present application is further described below in conjunction with the accompanying drawings and specific embodiments. The described embodiments should not be considered as limiting the present application. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0067] In the following description, reference is made to “some embodiments”, which describes a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0069] The following is an introduction to several terms involved in this application:

[0070] A heat exchanger, also known as a heat exchanger, is a device that transfers part of the heat flow of a hot fluid to a cold fluid. The heat exchanger usually contains a cold fluid flow channel and a hot fluid flow channel.

[0071] Cold fluid refers to the fluid with a lower temperature in the heat exchanger, which is usually a fluid that absorbs heat, such as industrial cooling water and refrigerant.

[0072] Thermal fluid refers to the fluid with a higher temperature in the heat exchanger, which is usually a fluid that releases heat, such as steam, high-temperature oil, and exhaust gas.

[0073] The flow channel refers to the channel for fluid flow in the heat exchanger. The channel for the flow of cooling fluid is called the cold fluid flow channel, and the channel for the flow of heating fluid is called the hot fluid flow channel.

[0074] At present, the relevant technology usually involves spot welding multiple thermocouples on the surface of the heat exchanger flow channel, and analyzing the heat and mass transfer process of the heat exchanger through the temperature data collected by the thermocouples. However, due to the obvious black box effect of this method, it is often difficult to reflect the changes in the mass and heat transfer process at various positions of the heat exchanger. The level of detail is biased, the scope of application is limited, and the accuracy and reliability of the heat and mass exchange analysis are unsatisfactory.

[0075] In addition, there are some related technologies that use a fixed fluid heat transfer coefficient and a fixed heat transfer rate to calibrate and calculate the fluid temperature at various locations in the heat exchanger flow channel, thereby achieving heat and mass exchange analysis of the heat exchanger. Among them, the fixed heat transfer rate means that the heat transfer rate distributed along the length of the heat exchanger flow channel is the same, and the fixed fluid heat transfer coefficient is often a fluid heat transfer coefficient summarized based on practical experience, that is, the fixed fluid heat transfer coefficient is an empirical value. In actual environments, however, because the energy transferred at various locations in the heat exchanger flow channel often varies, the heat and mass exchange analysis results obtained by this method often deviate to a certain extent from the actual changes in the mass and heat transfer process at various locations in the heat exchanger, and the accuracy of the heat and mass exchange analysis is not high.

[0076] It should be noted that the above-mentioned related technologies are only used to assist in understanding the technical solutions of this application and do not mean that they belong to the disclosed prior art.

[0077] In view of this, an embodiment of the present application provides an analysis method, system and equipment for heat and mass exchange, wherein the method performs a convective conduction layered analysis on all conductive elements on the heat exchanger based on a standard operating condition strategy or a non-standard operating condition strategy, and a convective conduction function. The method can determine the changes in each conductive element of the heat exchanger during the mass transfer and heat transfer process, effectively improving the reliability and accuracy of the heat and mass exchange analysis, and increasing the scope of application of the heat and mass exchange analysis.

[0078] Specifically, for any corresponding group of cold-end infinitesimals and hot-end infinitesimals in the heat exchanger, this method adaptively determines the conduction coefficient of the current conduction infinitesimal element through the temperature data of the previous conduction infinitesimal element, and dynamically generates corresponding infinitesimal exchange heat for each group of cold-end infinitesimal elements and hot-end infinitesimal elements through infinitesimal heat flow analysis. This method can fully consider the situation that the energy transferred between the infinitesimals at various positions in the heat exchanger flow channel is changing (that is, different conduction coefficients and different heat transfer rates corresponding to the infinitesimal exchange heat), and can more accurately reflect the actual changes in the mass transfer and heat transfer process at various positions of the heat exchanger, so that the actual changes in the mass transfer and heat transfer process at various positions of the heat exchanger can be accurately represented, which effectively improves the accuracy and reliability of heat and mass exchange analysis.

[0079] The heat and mass exchange analysis method, system and equipment provided in the embodiments of the present application can be specifically illustrated by the following embodiments. First, a heat and mass exchange analysis method in the embodiments of the present application is described.

[0080] The heat and mass exchange analysis method provided in the embodiments of the present application can be applied to thermal measurement application scenarios. In thermal measurement application scenarios, the heat transfer process or mass transfer process of the heat exchanger can be analyzed by the method provided in the embodiments of the present application, which can expand the scope of application of the heat and mass exchange analysis of the heat exchanger and improve the reliability and accuracy of the heat and mass exchange analysis.

[0081] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, and the like. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, and the like that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments in which tasks are performed by remote processing devices connected via a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media, including storage devices.

[0082] Reference Figure 1 , Figure 1 This is a feasible flow chart of a heat and mass exchange analysis method provided in an embodiment of the present application. Figure 1 The analysis method of heat and mass exchange is applied to a heat exchanger, which includes a cold fluid flow channel and a hot fluid flow channel, which may include but is not limited to S110 to S130.

[0083] S110, obtaining a target strategy and convection conduction function of the heat exchanger;

[0084] In an embodiment of the present application, the convective conduction function can be a convective heat transfer function or a convective mass transfer function, wherein the convective heat transfer function is used to characterize the functional relationship between the convective heat transfer coefficient and the fluid flow rate, fluid temperature, fluid pressure, heat exchange interface temperature and flow channel geometric characteristics, and the convective mass transfer function is used to characterize the functional relationship between the convective mass transfer coefficient and the fluid flow rate, material exchange interface temperature and flow channel geometric characteristics.

[0085] It is understood that the convective heat transfer function and convective mass transfer function in the embodiments of the present application can be determined based on machine learning technology by analyzing the experimental data and the intrinsic relationship between various physical quantities. Specifically, the convective heat transfer function can be expressed as:

[0086] h conv =f1(m & ,T,P,T W1 ,G Ch )

[0087] Among them, h conv is the convective heat transfer coefficient; f1(·) is the convective heat transfer function; m & is the fluid flow rate; T is the fluid temperature; P is the fluid pressure; T W1 is the heat exchange interface temperature; G Ch It refers to the geometric characteristics of the flow channel, such as shape, cross-sectional dimensions, etc.

[0088] The convective mass transfer function can be expressed as:

[0089] k=f2(m & ,T,P,C,T W2 ,G Ch )

[0090] Where k is the convective mass transfer coefficient; f2(·) is the convective mass transfer function; C is the molar concentration of the fluid; T W2 is the material exchange interface temperature.

[0091] It should be noted that the target strategy corresponds to the heat exchanger's design operating conditions, including standard and non-standard operating conditions. Specifically, for actual heat exchangers, the cross-sectional dimensions, geometry, and heat exchange interface thickness of the heat exchanger flow channel are all known parameters. When the operating conditions are known for the hot fluid inlet temperature and the cold fluid inlet and outlet temperatures, the corresponding target strategy can be the standard operating condition strategy. Alternatively, when the hot fluid inlet temperature, the cold fluid inlet temperature, and the heat exchanger flow channel geometry are known, the corresponding target strategy can be the non-standard operating condition strategy.

[0092] It is worth mentioning that the convection conduction function can be a convection heat transfer function or a convection mass transfer function. If the target strategy is the standard operating condition strategy and the convection conduction function is the convection heat transfer function, the heat transfer process of the heat exchanger can be analyzed under the standard operating condition; or, if the target strategy is the standard operating condition strategy and the convection conduction function is the convection mass transfer function, the mass transfer process of the heat exchanger can be analyzed under the standard operating condition; or, if the target strategy is the non-standard operating condition strategy and the convection conduction function is the convection heat transfer function, the heat transfer process of the heat exchanger can be analyzed under the non-standard operating condition; or, if the target strategy is the non-standard operating condition strategy and the convection conduction function is the convection mass transfer function, the mass transfer process of the heat exchanger can be analyzed under the non-standard operating condition.

[0093] Also, since the mass transfer process and heat transfer process of the heat exchanger are similar, the embodiment of the present application will collectively refer to the convective mass transfer function and the convective heat transfer function as a convective conduction function as an example, and this application will not go into details here.

[0094] S120, performing a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function, to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, wherein the cold-end elements are conduction elements of the cold fluid flow channel, and the hot-end elements are conduction elements of the hot fluid flow channel;

[0095] In an embodiment of the present application, based on the target strategy and convection conduction function, a conduction hierarchical analysis of the heat transfer process or mass transfer process can be performed on all cold-end elements on the cold fluid flow channel of the heat exchanger and all hot-end elements on the hot fluid flow channel of the heat exchanger, so as to obtain the first temperature data of each cold-end element on the cold fluid flow channel of the heat exchanger and the second temperature data of each hot-end element on the hot fluid flow channel of the heat exchanger, and each cold-end element corresponds to a hot-end element through the heat exchange interface.

[0096] Reference Figure 2 In some embodiments, when the target strategy is a standard operating condition strategy, S120 performs a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, including:

[0097] S210: Acquire a first cold flow port temperature of the cold fluid flow channel and a first hot flow port temperature of the hot fluid flow channel according to the standard operating condition strategy, wherein a cold flow port position of the first cold flow port temperature is the same as a hot flow port position of the first hot flow port temperature;

[0098] In the actual mass transfer and heat transfer process of the heat exchanger, the cold fluid flow channels and hot fluid flow channels of the heat exchanger often have co-current arrangement and counter-current arrangement. The co-current arrangement means that the cold fluid and hot fluid of the heat exchanger flow in the same direction, and the flow channel inlet of the hot fluid is the same as the flow channel inlet of the cold fluid; while the counter-current arrangement means that the cold fluid and hot fluid of the heat exchanger flow in opposite directions, and the flow channel inlet of the hot fluid is opposite to the flow channel inlet of the cold fluid.

[0099] In an embodiment of the present application, if the target strategy of the heat exchanger is a standard operating condition strategy and is arranged in a downstream manner, the first cold flow port temperature can be the temperature at the inlet position of the cold fluid flow channel (i.e., the cold fluid inlet temperature), and the first hot flow port temperature can be the temperature at the inlet position of the hot fluid flow channel (i.e., the cold fluid inlet temperature).

[0100] Alternatively, if the target strategy of the heat exchanger is a standard operating condition strategy and is a countercurrent arrangement, the first cold flow port temperature can be the temperature at the outlet of the cold fluid flow channel (i.e., the cold fluid outlet temperature), and the first hot flow port temperature can be the temperature at the inlet of the hot fluid flow channel, that is, the cold flow port position of the first cold flow port temperature is the same as the hot flow port position of the first hot flow port temperature.

[0101] S220. Performing microelement heat exchange analysis and processing based on the convection conduction function, the first hot flow port temperature, and the first cold flow port temperature to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement.

[0102] In an embodiment of the present application, the cold fluid flow channel and the hot fluid flow channel of the heat exchanger can first be divided based on a pre-set microelement scale, thereby obtaining a number of cold-end microelements on the cold fluid flow channel and a number of hot-end microelements on the hot fluid flow channel; then, in a microelement cycle, heat exchange analysis is performed at the microelement level from the first cold-end microelement and the corresponding first hot-end microelement. The first cold-end microelement is usually the cold-end microelement corresponding to the temperature of the first cold flow port, and the first hot-end microelement is usually the cold-end microelement corresponding to the temperature of the first hot flow port, thereby obtaining the first temperature data of each cold-end microelement and the second temperature data of each hot-end microelement.

[0103] Reference Figure 3 Further, the step S220 of performing microelement heat exchange analysis and processing based on the convection conduction function, the first hot flow port temperature, and the first cold flow port temperature to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement includes:

[0104] S310: Acquire a first cold flow element temperature of the current cold end element and a first heat flow element temperature of the hot end element, where the first cold flow element temperature is the first cold flow port temperature or the first temperature data of the first element, and the first heat flow element temperature is the first heat flow port temperature or the second temperature data of the second element; wherein the first element is the cold end element preceding the current cold end element, and the second element is the hot end element preceding the current hot end element;

[0105] In an embodiment of the present application, for a certain micro-element cycle process, if the current micro-element cycle number is 1, the current cold-end micro-element is the first cold-end micro-element, and its first cold flow micro-element temperature is the first cold flow micro-element temperature, and the current hot-end micro-element is the first hot-end micro-element, and its first hot flow micro-element is the first hot flow port temperature; or, if the current micro-element cycle number is greater than 1, the current cold-end micro-element can be a cold-end micro-element adjacent to the cold-end micro-element position of the previous micro-element cycle process, and its first cold flow micro-element temperature is the first temperature data of the cold-end micro-element of the previous micro-element cycle process. The current hot-end micro-element is the same as the aforementioned current cold-end micro-element, and can be simply deduced by analogy.

[0106] S320: Calculate the adaptive coefficient of the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain the current cold flow conduction coefficient of the cold end element and the heat flow conduction coefficient of the hot end element;

[0107] Reference Figure 4 Furthermore, step S320, performing adaptive coefficient calculation on the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain the current cold flow conduction coefficient of the cold end element and the heat flow conduction coefficient of the hot end element, includes:

[0108] S410, obtaining the heat exchange area between the current cold end micro-element and the hot end micro-element;

[0109] S420: Generate adaptive coefficients for the convection conduction function based on the first cold flow element temperature and the first heat flow element temperature to obtain a plurality of cold flow intermediate coefficients and a plurality of heat flow intermediate coefficients, where each cold flow intermediate coefficient corresponds to one heat flow intermediate coefficient.

[0110] Reference Figure 5 Furthermore, the step S420 generates adaptive coefficients for the convection conduction function based on the first cold flow element temperature and the first heat flow element temperature to obtain a plurality of cold flow intermediate coefficients and a plurality of heat flow intermediate coefficients, including:

[0111] S510: Obtain a third cold flow element temperature, a second hot flow element temperature, a heat flow exchange step length, and a cold flow exchange step length, wherein the third cold flow element temperature is the first cold flow element temperature or the previous fourth cold flow element temperature, and the second hot flow element temperature is the first heat flow element temperature or the previous third heat flow element temperature;

[0112] S520: performing a heat flow temperature update on the second heat flow element temperature according to the heat flow exchange step length to obtain a third heat flow element temperature; and performing a cold flow temperature update on the third cold flow element temperature according to the cold flow exchange step length to obtain a fourth cold flow element temperature;

[0113] S530. Generate coefficients for the convection conduction function according to the fourth cold flow element temperature and the third heat flow element temperature to obtain the cold flow intermediate coefficient and the heat flow intermediate coefficient.

[0114] In an embodiment of the present application, for the cold-end element and the hot-end element in a certain element cycle process, the heat exchange area between the current cold-end element and the hot-end element at the heat exchange interface can be determined based on the heat exchange interface of the heat exchanger; then, through temperature cycling, the cold flow element temperature of the current cold-end element and the hot flow element temperature of the hot-end element are updated based on the heat flow exchange step and the cold flow exchange step, and the cold flow intermediate coefficient of the current cold-end element in each temperature cycle process and the heat flow intermediate coefficient of the current hot-end element in each temperature cycle process are determined based on the fourth cold flow element temperature, the third heat flow element temperature, and the convection conduction function of each temperature cycle process.

[0115] Specifically, for a current cold end element and a hot end element, if the current number of temperature cycles is 1, the third cold flow element temperature of the current cold end element can be the aforementioned first cold flow element temperature, and the second heat flow element temperature of the current hot end element can be the aforementioned first heat flow element temperature; or, if the current number of temperature cycles is greater than 1, the third cold flow element temperature of the current cold end element can be the fourth cold flow element temperature determined by the current cold end element during the previous temperature cycle, and the second heat flow element temperature of the current hot end element can be the third heat flow element temperature determined by the current hot end element during the previous temperature cycle.

[0116] It is understood that for the cold flow intermediate coefficient and the hot flow intermediate coefficient during the nth temperature cycle, step S520 can be to calculate the difference between the second heat flow element temperature and the heat flow exchange step length to obtain a third heat flow element temperature, which is used to represent the hot end temperature of the heat exchange interface corresponding to the current hot end element during the temperature cycle; and calculate the sum of the third cold flow element temperature and the cold flow exchange step length to obtain a fourth cold flow element temperature, wherein the step size of the cold flow exchange step length and the heat flow exchange step length can be flexibly set according to specific accuracy requirements. For example, the third heat flow element temperature and the fourth cold flow element temperature can be expressed as:

[0117]

[0118] in, The third heat flow element temperature of the current hot end element during the nth temperature cycle; is the second heat flux element temperature of the current hot end element during the nth temperature cycle, that is, the third heat flux element temperature of the current hot end element during the n-1th temperature cycle; i is the heat flux exchange step length; is the temperature of the fourth cold flow element in the nth temperature cycle of the current cold end element; is the third cold flow element temperature of the current cold end element in the nth temperature cycle, that is, the fourth fourth flow element temperature of the current cold end element in the n-1th temperature cycle; j is the cold flow exchange step.

[0119] After obtaining the third heat flow element temperature and the fourth cold flow element temperature during the nth temperature cycle, the third heat flow element temperature and the fourth cold flow element temperature can be input into the convection conduction function. By combining the known parameters of the heat exchanger, the cold flow intermediate coefficient of the current cold end element during the nth temperature cycle and the heat flow intermediate coefficient of the current hot end element during the nth temperature cycle are determined. The cold flow intermediate coefficients and heat flow intermediate coefficients of the remaining temperature cycles are similar and can be simply deduced by analogy.

[0120] It is worth mentioning that in the first embodiment, for any temperature cycling process, after determining the cold flow intermediate coefficient and the heat flow intermediate coefficient of the current temperature cycling process, a temperature condition rule can be used to verify whether the cold flow intermediate coefficient and the heat flow intermediate coefficient of the current cycle process meet the temperature cycling exit condition. In the second embodiment, after executing a certain number of temperature cycling processes, for example, after the nth temperature cycling process, the temperature condition rule can be used to verify whether the cold flow intermediate coefficient and the heat flow intermediate coefficient of the subsequent temperature cycling process meet the temperature cycling exit condition. In both embodiments, if the temperature cycling condition is not met, the process can return to step S510 after executing step S530; alternatively, if the temperature cycling exit condition is met, the process can execute step S540 after executing step S530.

[0121] For example, for a certain current cold end microelement and a corresponding current hot end microelement, the temperature condition rule in the embodiment of the present application can be expressed as:

[0122]

[0123] Where x is the allowable error term; is the cold flow intermediate coefficient of the current cold end element during the N2th temperature cycle; A is the heat exchange area between the current cold end element and the current hot end element; n1 and n2 are variables during the temperature cycle; It is the intermediate coefficient of heat flow of the current hot end element during the N2th temperature cycle.

[0124] S430. Perform coefficient validity verification on the cold flow intermediate coefficient and the hot flow intermediate coefficient according to the heat exchange area to obtain a validity verification result.

[0125] S440. If the validity verification result is valid, the last cold flow intermediate coefficient is determined as the cold flow conduction coefficient of the current cold end element, and the last heat flow intermediate coefficient is determined as the heat flow conduction coefficient of the current hot end element.

[0126] In the embodiment of the present application, for a current cold end infinitesimal element and a corresponding hot end infinitesimal element, after obtaining the cold flow temperature coefficient and the heat flow temperature coefficient of the current cold end infinitesimal element and the current hot end infinitesimal element in each temperature cycle process, it can be determined based on the effective condition rule that the cold flow intermediate coefficient and the heat flow intermediate coefficient of the last temperature cycle process meet the effective condition rule. The effective condition rule can be expressed as:

[0127]

[0128] Where λ is the thermal conductivity of the heat exchanger plate on the heat exchanger; T His the first heat flux element temperature of the current hot end element, that is, the second heat flux element temperature of the current hot end element in the first temperature cycle; T C is the first cold flow element dimension of the current cold end element, that is, the third cold flow element temperature of the current cold end element in the first temperature cycle; δ is the thickness of the heat exchange plate on the heat exchanger.

[0129] It can be understood that if the cold flow intermediate coefficient and the heat flow intermediate coefficient of the last temperature cycle process meet the validity condition rules, a validity verification result representing validity can be generated. The validity verification result can indicate that the cold flow intermediate coefficient and the heat flow intermediate coefficient of the current cold end element and the current hot end element in the last temperature cycle process are true values ​​and have correct physical meanings. At this time, the cold flow intermediate coefficient of the last temperature cycle process can be determined as the cold flow conduction coefficient of the current cold end element, and the heat flow intermediate coefficient of the last temperature cycle process can be determined as the heat flow conduction coefficient of the current hot end element.

[0130] Alternatively, if the cold flow intermediate coefficient and the heat flow intermediate coefficient of the last temperature cycle process do not meet the validity condition rules, a validity verification result indicating invalidity can be generated. The validity verification result can indicate that the cold flow intermediate coefficient and the heat flow intermediate coefficient of the current cold end element and the hot end element in the last temperature cycle process are not true values ​​or do not have correct physical meanings. At this time, based on all the obtained cold flow intermediate coefficients and heat flow intermediate coefficients, the number of temperature cycles corresponding to the current cold end element and the hot end element can be determined, and the number of temperature cycles can be updated, and then the process returns to execute step S510.

[0131] S330. Perform heat transfer analysis and processing based on the cold flow conduction coefficient, the heat flow conduction coefficient, the first cold flow element temperature, and the first heat flow element temperature to obtain first temperature data of the current cold end element and second temperature data of the hot end element.

[0132] Reference Figure 6 Further, the step S330 of performing heat transfer analysis and processing based on the cold flow conduction coefficient, the heat flow conduction coefficient, the first cold flow element temperature, and the first heat flow element temperature to obtain the first temperature data of the current cold end element and the second temperature data of the hot end element includes:

[0133] S610: Obtain the heat exchange area between the current cold-end micro-element and the hot-end micro-element, as well as the heat exchange cold-end temperature and the heat exchange hot-end temperature of the heat exchange area;

[0134] S620: Perform a microelement heat flow analysis on the first cold flow microelement temperature and the first hot flow microelement temperature based on the cold flow conduction coefficient, the heat flow conduction coefficient, the heat exchange area, the heat exchange cold end temperature, and the heat exchange hot end temperature to obtain a microelement heat exchange between the cold end microelement and the hot end microelement.

[0135] S630: Perform cold flow heat correction on the first cold flow micro-element temperature according to the micro-element exchange heat to obtain the first temperature data;

[0136] S640: Perform heat flow correction on the first heat flow element temperature according to the heat exchanged by the element to obtain the second temperature data.

[0137] In an embodiment of the present application, for the current cold-end element and the hot-end element in a certain element cycle process, since the cold flow conduction coefficient is the cold flow intermediate coefficient of the current cold-end element in the last temperature cycle process, and the heat flow conduction coefficient is the heat flow intermediate coefficient of the current hot-end element in the last temperature cycle process, the heat exchange cold-end temperature on the heat exchange area between the current cold-end element and the current hot-end element can be the fourth cold flow element temperature in the last temperature cycle process, and the heat exchange hot-end temperature on the heat exchange area between the current cold-end element and the hot-end element can be the third heat flow element temperature in the last temperature cycle process.

[0138] It can be understood that, for the current cold end micro-element and the hot end micro-element in a certain micro-element cycle process, the micro-element heat flow analysis in S620 can be to calculate the micro-element exchange heat corresponding to the cold flow conduction coefficient, the heat conduction coefficient, the heat exchange area, the heat exchange cold end temperature, and the heat exchange hot end temperature. The micro-element exchange heat can be expressed as:

[0139]

[0140] Among them, q is the infinitesimal exchange heat; is the cold flow intermediate coefficient of the current cold end element during the N1th temperature cycle; A is the heat exchange area between the current cold end element and the current hot end element; n1 and n2 are variables during the temperature cycle; is the temperature of the third heat flux element in the N1th temperature cycle of the current hot end element; is the temperature of the fourth cold flow element in the N2th temperature cycle of the current cold end element; is the heat transfer coefficient of the current hot end element during the N2th temperature cycle.

[0141] It should be noted that the heat flow correction can be based on the law of conservation of energy, using the heat exchanged by the elements to correct the first cold flow element temperature and the first hot flow element temperature respectively, so as to obtain the first temperature data of the current cold end element, and the second temperature data based on the current hot end element, wherein the first temperature data is used to characterize the first cold flow element temperature of the next cold end element adjacent to the current cold end element, and the second temperature data is used to characterize the first heat flow element temperature of the next hot cold end element adjacent to the current hot end element.

[0142] Specifically, for the first cold flow element temperature of a current cold end element, the enthalpy value of the first cold flow element temperature can be calculated based on the enthalpy value calculation method, and then the enthalpy value of the current cold end element after the heat and mass exchange with the current hot end element is determined by the sum of the enthalpy value and the element exchange heat flow; then, based on the enthalpy value after the heat and mass exchange, the first temperature data of the current cold end element is reversely determined based on the enthalpy value calculation method. There are many ways to implement the specific enthalpy value calculation, and this application will not go into details here. As for the second temperature data of the current hot end element, it is similar to the first temperature data of the current cold end element mentioned above, as well as the current cold end element and the current hot end element of the remaining element cycle processes, which can also be simply deduced by analogy, and this application will not go into details here.

[0143] Reference Figure 7 In some embodiments, the method further comprises:

[0144] S710: Acquire a temperature of a second cold flow port of the cold fluid flow channel according to the standard working condition strategy;

[0145] S720: Perform fluid temperature analysis on the first hot flow port temperature based on the second cold flow port temperature and the first cold flow port temperature to obtain a second hot flow port temperature of the hot fluid flow channel;

[0146] S730: Perform cold flow boundary analysis on the first temperature data according to the second cold flow port temperature to obtain a cold flow analysis result;

[0147] S740: Perform a heat flow boundary analysis on the second temperature data according to the second heat flow port temperature to obtain a heat flow analysis result.

[0148] In an embodiment of the present application, if the heat exchanger is arranged in a co-current manner, the second cold flow port temperature of the cold fluid flow channel can be the temperature at the outlet of the cold fluid flow channel (i.e., the cold fluid outlet temperature), and the second hot flow port temperature of the hot fluid flow channel can be the temperature at the outlet of the hot fluid flow channel; or, if the heat exchanger is arranged in a counter-current manner, the second cold flow port temperature of the cold fluid flow channel can be the temperature at the inlet of the cold fluid flow channel, and the second hot flow port temperature of the hot fluid flow channel can be the temperature at the outlet of the hot fluid flow channel.

[0149] It is understood that the fluid temperature analysis can be based on the law of conservation of energy, the second cold flow port temperature, the first cold flow port temperature, and the first hot flow port temperature, and use an enthalpy calculation function to calculate the second hot flow port temperature of the hot fluid flow channel. Specifically, the enthalpy values ​​corresponding to the second cold flow port temperature, the first cold flow port temperature, and the first hot flow port temperature can be calculated respectively, and all the obtained enthalpy values ​​can be input into the enthalpy calculation function to obtain the second hot flow port temperature.

[0150] For example, in the embodiment of the present application, the heat exchanger is arranged in a countercurrent manner as an example, and the temperature of the second heat flow port can be expressed as:

[0151]

[0152] Among them, T HOUT is the temperature of the second hot flow port of the hot fluid flow channel; f4(·) is the enthalpy calculation function; P is the fluid pressure; h HOUT is the enthalpy value of the second heat flow port temperature; h HIN is the enthalpy value of the first heat flow port temperature; h COUT is the enthalpy value of the second cold flow port temperature; h CIN is the enthalpy value of the first cold flow port temperature; m &C is the cold fluid flow rate on the cold fluid flow channel; m &H is the thermal fluid flow rate on the thermal fluid flow channel.

[0153] It should be noted that the cold flow boundary analysis can be based on the cold flow boundary condition, and the boundary analysis can be performed on the first temperature data of the last cold end element in all the element cycles. When the first temperature data of the last cold end element meets the cold flow boundary condition, a cold flow analysis result indicating that the cold flow boundary condition is met can be generated; or, when the first temperature data of the last cold end element does not meet the cold flow boundary condition, a cold flow analysis result indicating that the cold flow boundary condition is not met can be generated. Specifically, if the heat exchanger is arranged in a countercurrent manner and the last cold end element in all the element cycles is the nth current cold end element, then the cold flow boundary condition can be expressed as:

[0154] (1-x)·T CIN ≤T CN ≤(1+x)·T CIN

[0155] Among them, T CIN is the first cold flow port temperature; T CN is the first temperature data of the Nth cold end element.

[0156] It's worth noting that the results of the heat flow analysis are similar to those of the aforementioned cold flow analysis, and can be derived by analogy. Furthermore, in the first embodiment, if both the cold flow analysis and the heat flow analysis satisfy the boundary conditions, the heat exchanger's micro-element cycle can be exited. Alternatively, if either the cold flow analysis or the heat flow analysis fails to satisfy the boundary conditions, the heat exchanger's micro-element cycle can be resumed by returning to step S210.

[0157] In the second embodiment, if the boundary conditions are satisfied by the cold flow analysis results and / or the heat flow analysis results, the micro-element circulation process of the heat exchanger can be exited; or, if the boundary conditions are not satisfied by both the cold flow analysis results and the heat flow analysis results, step S210 can be returned to be executed again to perform the micro-element circulation process of the heat exchanger.

[0158] Reference Figure 8 In some embodiments, when the target strategy is a non-standard operating condition strategy, S120 performs a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, including:

[0159] S810: Acquire, according to the non-standard operating condition strategy, a second cold flow port temperature of the cold fluid flow channel and a first hot flow port temperature of the hot fluid flow channel, wherein a cold flow port position of the second cold flow port temperature is different from a hot flow port position of the first hot flow port temperature;

[0160] In the embodiment of the present application, the content of step S810 is similar to the content of the aforementioned step S210, and can be simply deduced by analogy, wherein the second cold flow port temperature is at a port position on the heat exchanger opposite to the first hot flow port temperature. For example, if the heat exchanger is arranged in a co-current manner, and the hot fluid flow channel inlet and the cold fluid flow channel inlet are at the same position, then the first hot flow port temperature can be the temperature at the hot fluid flow channel inlet, and the second cold flow port temperature can be the temperature at the cold fluid flow channel outlet; or, if the heat exchanger is arranged in a counter-current manner, and the hot fluid flow channel inlet and the cold fluid flow channel inlet are at opposite positions, then the first hot flow port temperature can be the temperature at the hot fluid flow channel inlet, and the second cold flow port temperature can be the temperature at the cold fluid flow channel inlet, that is, the cold flow port position of the second cold flow port temperature is different from the hot flow port position of the first hot flow port temperature.

[0161] S820: Perform microelement heat exchange analysis and processing based on the convection conduction function, the first hot flow port temperature, and the second cold flow port temperature to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement.

[0162] Reference Figure 9 Further, the step S820 of performing microelement heat exchange analysis and processing based on the convection conduction function, the first hot flow port temperature, and the second cold flow port temperature to obtain first temperature data of a plurality of cold-end microelements and second temperature data of a plurality of hot-end microelements includes:

[0163] S910, obtaining a temperature step and a first simulation temperature, where the first simulation temperature is the second cold flow port temperature or the second simulation temperature of the previous step;

[0164] S920: Performing a microelement heat exchange analysis process based on the convection conduction function, the first heat flow port temperature, and the first simulation temperature to obtain first temperature data of a plurality of the cold-end microelements and second temperature data of a plurality of the hot-end microelements;

[0165] S930: Perform a cold flow boundary analysis on the first temperature data according to the second cold flow port temperature to obtain a cold flow analysis result;

[0166] S940: If the cold flow analysis result does not meet the cold flow boundary condition, the first simulation temperature is updated according to the temperature step to obtain the second simulation temperature, and then the process returns to the step of obtaining the temperature step and the first simulation temperature.

[0167] In the embodiment of the present application, taking the countercurrent arrangement of the heat exchanger as an example, S820 can first be to split the heat exchanger into a certain number of micro-elements with the same scale, obtain the temperature step and assume the temperature of the second cold flow port at the inlet of the cold fluid flow channel to be the temperature at the outlet of the cold fluid flow channel, recorded as the first simulation temperature; then based on S920, determine the first temperature data of all cold-end micro-elements and the second temperature data of all hot-end micro-elements. The content of S920 is similar to that of the aforementioned S220, and can be simply deduced by analogy, so this application will not repeat them here.

[0168] It is understandable that S930 is similar to the aforementioned S730 and can be simply deduced. Specifically, if the cold flow analysis result is that it does not meet the cold flow boundary condition, it means that there is a deviation between the currently assumed first simulation temperature and the temperature at the inlet of the cold fluid flow channel. At this time, the sum of the temperature compensation and the first simulation temperature can be calculated to obtain the second simulation temperature, and the second simulation temperature is determined as the first simulation temperature of the next step cycle process, and then the process returns to execute S910; alternatively, if the cold flow analysis result meets the cold flow boundary condition, it means that the currently assumed first simulation temperature is consistent with the temperature at the inlet of the cold fluid flow channel. At this time, S130 can be executed based on all the first temperature data and all the second temperature data obtained in the current step cycle process.

[0169] S130. Generate convection and conduction analysis information of the heat exchanger based on all the first temperature data and the second temperature data.

[0170] In the embodiment of the present application, all the first temperature data and all the second temperature data can be simply integrated to describe and analyze the heat transfer process or mass transfer process at each position of the heat exchanger, thereby obtaining the convection conduction analysis information of the heat exchanger.

[0171] Figure 10 A schematic diagram of a heat and mass exchange analysis system provided in an embodiment of the present application is provided. The system is applied to a heat exchanger, wherein the heat exchanger includes a cold fluid flow channel and a hot fluid flow channel. The system includes:

[0172] The first processing unit 1001 is configured to obtain a target strategy and a convection conduction function of the heat exchanger, wherein the target strategy includes a standard operating condition strategy and a non-standard operating condition strategy;

[0173] a second processing unit 1002 configured to perform a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function, to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, wherein the cold-end elements are conduction elements of the cold fluid flow channel and the hot-end elements are conduction elements of the hot fluid flow channel;

[0174] The third processing unit 1003 is configured to generate convection and conduction analysis information of the heat exchanger according to all the first temperature data and the second temperature data.

[0175] It can be understood that the contents of the above method embodiments are all applicable to the present system embodiments, the functions specifically implemented by the present system embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0176] Figure 11 A schematic diagram of the structure of a computer device provided in an embodiment of the present application includes:

[0177] at least one processor 1180;

[0178] at least one memory 1120, configured to store at least one program;

[0179] When the at least one program is executed by the at least one processor 1180 , the at least one processor 1180 implements the methods described in the aforementioned embodiments.

[0180] An embodiment of the present application also provides a computer-readable storage medium, which stores a program executable by a processor. When the program executable by the processor 1180 is executed, it is used to implement the methods described in the above embodiments.

[0181] Specifically, the computer device can be a user terminal or a server.

[0182] This embodiment of the application takes the computer device as a user terminal as an example, and the details are as follows:

[0183] like Figure 11 As shown, the computer device 1100 may include an RF (Radio Frequency) circuit 1110, a memory 1120 including one or more computer-readable storage media, an input unit 1130, a display unit 1140, a sensor 1150, an audio circuit 1160, a WiFi module 1170, a processor 1180 including one or more processing cores, and a power supply 1190. It will be understood by those skilled in the art that Figure 11 The device structure shown in the figure does not constitute a limitation on the electronic device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0184] The RF circuit 1110 can be used to receive and transmit signals during information transmission or calls. Specifically, it receives downlink information from the base station and transmits it to one or more processors 1180 for processing. Furthermore, it transmits uplink data to the base station. Typically, the RF circuit 1110 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, an LNA (low noise amplifier), a duplexer, and the like. Furthermore, the RF circuit 1110 can communicate with the network and other devices via wireless communication. Wireless communication can utilize any communication standard or protocol, including but not limited to GSM (Global System of Mobile Communications), GPRS (General Packet Radio Service), CDMA (Code Division Multiple Access), WCDMA (Wideband Code Division Multiple Access), LTE (Long Term Evolution), email, and SMS (Short Messaging Service).

[0185] The memory 1120 can be used to store software programs and modules. The processor 1180 executes various functional applications and data processing by running the software programs and modules stored in the memory 1120. The memory 1120 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area may store data created according to the use of the device 1100 (such as audio data, a phone book, etc.), etc. In addition, the memory 1120 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage device. Accordingly, the memory 1120 may also include a memory controller to provide the processor 1180 and the input unit 1130 with access to the memory 1120. Although Figure 11 The RF circuit 1110 is shown, but it is understandable that it is not an essential component of the device 1100 and can be omitted as needed without changing the essence of the invention.

[0186] The input unit 1130 can be used to receive input digital or character information and generate keyboard, mouse, joystick, optical, or trackball signal input related to user settings and function control. Specifically, the input unit 1130 may include a touch-sensitive surface 1132 and other input devices 1131. The touch-sensitive surface 1132, also known as a touch display or touchpad, can detect user touch operations on or near it (for example, operations performed by a user using a finger, stylus, or any other suitable object or accessory on or near the touch-sensitive surface 1132) and drive corresponding connected devices according to a pre-set program. Optionally, the touch-sensitive surface 1132 may include a touch detection device and a touch controller. The touch detection device detects the user's touch position and detects signals generated by the touch operation, transmitting the signals to the touch controller. The touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 1180. It can also receive and execute commands from the processor 1180. In addition, the touch-sensitive surface 1132 can be implemented using various types such as resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch-sensitive surface 1132, the input unit 1130 can also include other input devices 1131. Specifically, the other input devices 1131 can include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, power keys, etc.), a trackball, a mouse, a joystick, and the like.

[0187] The display unit 1140 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the device 1100, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 1140 may include a display panel 1141. Optionally, the display panel 1141 may be configured in the form of an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or the like. Furthermore, the touch-sensitive surface 1132 may be covered on the display panel 1141. When the touch-sensitive surface 1132 detects a touch operation on or near it, it is transmitted to the processor 1180 to determine the type of touch event. The processor 1180 then provides corresponding visual output on the display panel 1141 according to the type of touch event. Although in Figure 11 In the embodiment, the touch-sensitive surface 1132 and the display panel 1141 are implemented as two independent components to implement input and output functions, but in some embodiments, the touch-sensitive surface 1132 and the display panel 1141 can be integrated to implement input and output functions.

[0188] The computer device 1100 may also include at least one sensor 1150, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 1141 according to the brightness of the ambient light, and the proximity sensor may turn off the display panel 1141 and / or the backlight when the device 1100 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that recognize the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that can be configured in the device 1100, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be described in detail here.

[0189] Audio circuit 1160, speaker 1161, and microphone 1162 provide an audio interface between the user and device 1100. Audio circuit 1160 converts received audio data into electrical signals and transmits them to speaker 1161, which then converts them into sound signals for output. Microphone 1162, on the other hand, converts collected sound signals into electrical signals, which are then received by audio circuit 1160 and converted into audio data. The audio data is then processed by output processor 1180 and sent to another control device via RF circuit 1110, or the audio data is output to memory 1120 for further processing. Audio circuit 1160 may also include an earphone jack to allow external headphones to communicate with device 1100.

[0190] The device 1100 can transmit information to a wireless transmission module provided on a competing device via the WiFi module 1170 .

[0191] Processor 1180 is the control center of device 1100. It connects the various components of the entire control device using various interfaces and circuits. By running or executing software programs and / or modules stored in memory 1120 and accessing data stored in memory 1120, it performs various functions of device 1100 and processes data, thereby providing overall control of the control device. Optionally, processor 1180 may include one or more processing cores. Alternatively, processor 1180 may integrate an application processor and a modem processor, with the application processor primarily handling the operating system, user interface, and application programs, while the modem processor primarily handles wireless communications. It is understood that the modem processor may not be integrated into processor 1180.

[0192] Device 1100 also includes a power supply 1190 (e.g., a battery) for supplying power to various components. Preferably, the power supply can be logically connected to processor 1180 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. Power supply 1190 can also include one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and other arbitrary components.

[0193] Although not shown, the device 1100 may also include a camera, a Bluetooth module, etc., which will not be described in detail here.

[0194] An embodiment of the present application further provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the processor executes the method described in the aforementioned embodiments.

[0195] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0196] It should be understood that in this application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0197] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0198] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0199] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0200] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0201] The step numbers in the above method embodiment are only provided for the convenience of explanation and do not limit the order of the steps. The execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0202] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A method for analyzing heat and mass exchange, characterized in that: Applied to a heat exchanger, the heat exchanger includes a cold fluid flow channel and a hot fluid flow channel, the method comprising: Obtaining a target strategy and a convection conduction function of the heat exchanger, wherein the target strategy includes a standard operating condition strategy and a non-standard operating condition strategy; performing a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, wherein the cold-end elements are conduction elements of the cold fluid flow channel and the hot-end elements are conduction elements of the hot fluid flow channel; Convection and conduction analysis information of the heat exchanger is generated according to all the first temperature data and the second temperature data.

2. The method according to claim 1, characterized in that When the target strategy is the standard operating condition strategy, performing a convection and conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection and conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements includes: According to the standard operating condition strategy, obtaining a first cold flow port temperature of the cold fluid flow channel and a first hot flow port temperature of the hot fluid flow channel, wherein a cold flow port position of the first cold flow port temperature is the same as a hot flow port position of the first hot flow port temperature; According to the convection conduction function, the first hot flow port temperature and the first cold flow port temperature, a microelement heat exchange analysis process is performed to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement.

3. The method according to claim 2, characterized in that The step of performing microelement heat exchange analysis and processing based on the convection conduction function, the first hot flow port temperature, and the first cold flow port temperature to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement includes: Acquire a first cold flow element temperature of the current cold end element and a first hot flow element temperature of the hot end element, where the first cold flow element temperature is the first cold flow port temperature or the first temperature data of the first element, and the first hot flow element temperature is the first hot flow port temperature or the second temperature data of the second element; wherein the first element is the cold end element preceding the current cold end element, and the second element is the hot end element preceding the current hot end element; performing adaptive coefficient calculation on the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain the current cold flow conduction coefficient of the cold end element and the heat flow conduction coefficient of the hot end element; Heat transfer analysis is performed based on the cold flow conduction coefficient, the heat flow conduction coefficient, the first cold flow element temperature, and the first heat flow element temperature to obtain first temperature data of the current cold end element and second temperature data of the hot end element.

4. The method according to claim 3, characterized in that The method further comprises: According to the standard working condition strategy, obtaining the temperature of the second cold flow port of the cold fluid flow channel; performing a fluid temperature analysis on the first hot flow port temperature according to the second cold flow port temperature and the first cold flow port temperature to obtain a second hot flow port temperature of the hot fluid flow channel; performing a cold flow boundary analysis on the first temperature data according to the second cold flow port temperature to obtain a cold flow analysis result; According to the second heat flow port temperature, a heat flow boundary analysis is performed on the second temperature data to obtain a heat flow analysis result.

5. The method according to claim 3, characterized in that The adaptive coefficient calculation of the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain the current cold flow conduction coefficient of the cold end element and the heat flow conduction coefficient of the hot end element includes: Obtaining the heat exchange area between the current cold end micro-element and the hot end micro-element; According to the first cold flow element temperature and the first heat flow element temperature, adaptively generating coefficients for the convection conduction function to obtain a plurality of cold flow intermediate coefficients and a plurality of heat flow intermediate coefficients, each cold flow intermediate coefficient corresponding to one heat flow intermediate coefficient; Performing coefficient validity verification on the cold flow intermediate coefficient and the hot flow intermediate coefficient according to the heat exchange area to obtain a validity verification result; If the validity verification result is valid, the last cold flow intermediate coefficient is determined as the cold flow conduction coefficient of the current cold end element, and the last heat flow intermediate coefficient is determined as the heat flow conduction coefficient of the current hot end element.

6. The method according to claim 5, characterized in that The adaptive coefficient generation of the convection conduction function according to the first cold flow element temperature and the first heat flow element temperature to obtain a plurality of cold flow intermediate coefficients and a plurality of heat flow intermediate coefficients includes: Obtaining a third cold flow element temperature, a second hot flow element temperature, a heat flow exchange step length, and a cold flow exchange step length, wherein the third cold flow element temperature is the first cold flow element temperature or the previous fourth cold flow element temperature, and the second hot flow element temperature is the first heat flow element temperature or the previous third heat flow element temperature; performing a heat flow temperature update on the second heat flow element temperature according to the heat flow exchange step length to obtain a third heat flow element temperature, and performing a cold flow temperature update on the third cold flow element temperature according to the cold flow exchange step length to obtain a fourth cold flow element temperature; The coefficients of the convection conduction function are generated according to the fourth cold flow element temperature and the third heat flow element temperature to obtain the cold flow intermediate coefficient and the heat flow intermediate coefficient.

7. The method according to claim 3, characterized in that The heat transfer analysis process is performed based on the cold flow conduction coefficient, the heat flow conduction coefficient, the first cold flow element temperature, and the first heat flow element temperature to obtain the first temperature data of the current cold end element and the second temperature data of the hot end element, including: Obtaining the heat exchange area between the current cold-end micro-element and the hot-end micro-element, as well as the heat exchange cold-end temperature and the heat exchange hot-end temperature of the heat exchange area; performing a microelement heat flow analysis on the first cold flow microelement temperature and the first hot flow microelement temperature based on the cold flow conduction coefficient, the heat flow conduction coefficient, the heat exchange area, the heat exchange cold end temperature, and the heat exchange hot end temperature to obtain a current microelement heat exchanged between the cold end microelement and the hot end microelement; Performing cold flow heat correction on the first cold flow micro-element temperature according to the micro-element exchange heat to obtain the first temperature data; According to the heat exchanged by the micro-element, heat flow heat correction is performed on the first heat flow micro-element temperature to obtain the second temperature data.

8. The method according to claim 1, characterized in that When the target strategy is a non-standard operating condition strategy, performing a convection and conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection and conduction function to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements includes: According to the non-standard working condition strategy, obtaining a second cold flow port temperature of the cold fluid flow channel and a first hot flow port temperature of the hot fluid flow channel, wherein a cold flow port position of the second cold flow port temperature is different from a hot flow port position of the first hot flow port temperature; According to the convection conduction function, the first hot flow port temperature and the second cold flow port temperature, a microelement heat exchange analysis process is performed to obtain first temperature data of the cold end microelement and second temperature data of the hot end microelement.

9. A heat and mass exchange analysis system, characterized in that: Applied to a heat exchanger, the heat exchanger includes a cold fluid flow channel and a hot fluid flow channel, and the system includes: A first processing unit is configured to obtain a target strategy and a convection conduction function of the heat exchanger, wherein the target strategy includes a standard operating condition strategy and a non-standard operating condition strategy; a second processing unit, configured to perform a convection-conduction hierarchical analysis on all conduction elements on the heat exchanger according to the target strategy and the convection-conduction function, to obtain first temperature data of a plurality of cold-end elements and second temperature data of a plurality of hot-end elements, wherein the cold-end elements are conduction elements of the cold fluid flow channel and the hot-end elements are conduction elements of the hot fluid flow channel; The third processing unit is configured to generate convection and conduction analysis information of the heat exchanger according to all the first temperature data and the second temperature data.

10. A computer device, characterized in that: include: at least one processor; at least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the method according to any one of claims 1 to 8.

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