Treatment liquid container, substrate processing apparatus and substrate processing method

Abstract

The invention provides a processing liquid storage container, a substrate processing apparatus, and a substrate processing method. The processing liquid storage container is provided with a container main body and a processing liquid suction part, and the processing liquid suction part is provided with: an extraction base which has a larger area than a main body-side opening in plan view and has a processing liquid extraction port at a position corresponding to the main body-side opening; an elastic member having resistance to the processing liquid and having an opening at a position corresponding to the extraction opening in plan view; an actuator capable of stretching and retracting in the vertical direction according to the magnitude of the applied voltage; and a top plate member that defines the position of the upper end of the actuator, in which when the actuator is elongated in the vertical direction, the amount of compression generated by the elastic member is increased by the actuator to close the opening, and when the actuator is contracted in the vertical direction, the amount of compression generated by the elastic member is reduced by the actuator to close the opening. Thus, the opening is opened.

Description

Technical Field

[0001] The present disclosure relates to a processing liquid storage container, a substrate processing device, and a substrate processing method. Background Art

[0002] Patent Document 1 discloses a treatment liquid container for storing a treatment liquid. The treatment liquid container comprises a container body for storing the treatment liquid and a treatment liquid suction unit connected to the container body. The treatment liquid suction unit comprises: a hollow portion; a top opening disposed at the top of the hollow portion; a bottom opening disposed at the bottom of the hollow portion; a gas supply port disposed on a side of the hollow portion for supplying gas into the hollow portion; and a gas exhaust port disposed on a side of the hollow portion for exhausting gas from the hollow portion.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2023-56612 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The technology according to the present disclosure suppresses the generation of particles in a supply path of a processing liquid with a simple structure.

[0008] Solutions for solving problems

[0009] The container of the present invention is provided with a container for storing a treatment liquid, wherein the container is provided with a container body for storing the treatment liquid; and a treatment liquid suction part connected to the container body, wherein the treatment liquid suction part comprises: a take-out base, which is arranged above a main body side opening connected to the container body, the take-out base having an area larger than the main body side opening when viewed from above, and the take-out base having a treatment liquid take-out port at a position corresponding to the main body side opening; an elastic member, which is arranged above the take-out base, the elastic member having drug resistance to the treatment liquid, and the elastic member is in contact with the container body when viewed from above. There is an opening at a position corresponding to the removal outlet; an actuator, which is arranged above the elastic member in a manner that exposes the opening, and the actuator is freely extended and retracted in the vertical direction according to the magnitude of the applied voltage; and a top plate member, which is arranged above the actuator in a manner that exposes the opening, and the top plate member defines the position of the upper end of the actuator, wherein when the actuator is extended in the vertical direction, the amount of compression generated by the elastic member is increased by the actuator, thereby closing the opening, and when the actuator is contracted in the vertical direction, the amount of compression generated by the elastic member is reduced by the actuator, thereby opening the opening.

[0010] Effects of the Invention

[0011] According to the present disclosure, the generation of particles in the supply path of the processing liquid can be suppressed with a simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a side cross-sectional view schematically showing the outline of the structure of a resist coating apparatus as a substrate processing apparatus including the processing liquid storage container according to the present embodiment.

[0013] Figure 2 Is used to illustrate the composition Figure 1 An explanatory diagram of the functions of each part of the resist coating apparatus.

[0014] Figure 3 It is a perspective view schematically showing the outline of the structure of the resist storage container according to the present embodiment.

[0015] Figure 4 It is an explanatory diagram of a resist storage container and a gas supply mechanism for supplying gas to the resist storage container.

[0016] Figure 5 It is a cross-sectional view of the resist suction portion, showing a state in which the opening of the elastic member is open.

[0017] Figure 6It is a cross-sectional view of the resist suction portion, showing a state in which the opening of the elastic member is closed.

[0018] Figure 7 It is a diagram for explaining a first modification of the resist storage container.

[0019] Figure 8 It is a diagram for explaining a second modification of the resist storage container. DETAILED DESCRIPTION

[0020] In the manufacturing process of semiconductor devices, etc., a process involves applying a resist liquid to a substrate to form a resist pattern. In this process, a semiconductor wafer (hereinafter referred to as a "wafer"), serving as a substrate and held on a rotating chuck, is rotated while the resist liquid, serving as a processing liquid, is sprayed toward the center of the wafer. The resist liquid is sprayed from a nozzle, which is supplied from a resist container containing the resist liquid.

[0021] The ever-increasing miniaturization of resist patterns formed on wafers has necessitated a reduction in the amount of particles that may adhere to the wafers to cope with this further miniaturization. Conventional coating processing equipment has achieved this reduction by, for example, using highly clean components or passing the resist liquid through a nozzle for dispensing the resist liquid, thereby suppressing the generation of particles in subsequent coating processes.

[0022] However, conventional coating processing devices have valves and pumps installed in the resist liquid supply path from the resist storage container to the nozzle, which can generate particles. Therefore, there is room for improvement in suppressing the generation of particles. The technology disclosed in Patent Document 1 is proposed to address this issue. However, this technology leaves room for improvement in terms of the simplicity of the device structure.

[0023] Therefore, the technology according to the present disclosure suppresses the generation of particles in the supply path of the processing liquid with a simple structure.

[0024] Hereinafter, the processing liquid storage container, substrate processing apparatus, and substrate processing method according to the present embodiment will be described with reference to the accompanying drawings. In addition, in this specification and the accompanying drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and repeated descriptions are omitted.

[0025] <Resist Coating Apparatus>

[0026] Figure 1 It is a side cross-sectional view schematically showing the outline of the structure of a resist coating apparatus as a substrate processing apparatus including the processing liquid storage container according to the present embodiment.

[0027] Figure 1The resist coating device 100 is used to apply a resist liquid as a processing liquid to a wafer W as a substrate. The resist coating device 100 has a processing container 101, and a loading and unloading port (not shown) for the wafer W is formed on the side of the processing container 101. A rotating holding disk 102 as a substrate holding portion is provided in the processing container 101. The rotating holding disk 102 holds the wafer W, specifically, holds the wafer W horizontally. The rotating holding disk 102 is connected to a rotating portion 103 that can be raised and lowered freely, and the rotating portion 103 is connected to a rotating drive portion 104 composed of a motor and the like. Therefore, the wafer W held on the rotating holding disk 102 can be rotated by the drive of the rotating drive portion 104.

[0028] A cup 105 is disposed outside the rotating holding disk 102 to receive and recover resist liquid that scatters or drops from the wafer W. An opening 106 is formed on the top surface of the cup 105, through which the wafer W passes before and after being transferred to the rotating holding disk 102. A drain pipe 107 and an exhaust pipe 108 are provided at the bottom of the cup 105. The exhaust pipe 108 communicates with an exhaust device 109, such as an exhaust pump.

[0029] A nozzle 110 for spraying a resist liquid toward the surface of the wafer W is arranged in the processing container 101. The nozzle 110 is supported by a nozzle support portion 111 such as an arm, and the nozzle support portion 111 is driven by a driving mechanism (not shown) such as Figure 1 The nozzle 110 can be freely raised and lowered as indicated by the dotted double-headed arrow A, and can be freely moved horizontally as indicated by the dotted double-headed arrow B. The nozzle 110 has a structure capable of aspirating and ejecting liquid based on control signals from the control unit 200, which will be described later. The specific structure of the nozzle 110 is not particularly limited as long as it can aspirate and eject liquid. For example, a well-known electric micropipette can be used as the nozzle 110.

[0030] A resist container 120 containing resist liquid and a nozzle cleaning unit 130 for cleaning the nozzle 110 are provided outside the cup 105. The resist container 120 and the nozzle cleaning unit 130 will be described later.

[0031] The resist coating apparatus 100 includes a control unit 200. The control unit 200 processes computer executable instructions that cause the resist coating apparatus 100 to perform the various processes described in the present disclosure. The control unit 200 can be configured to control the various elements of the resist coating apparatus 100 to perform the various processes described herein. In one embodiment, a portion or all of the control unit 200 can be included in the resist coating apparatus 100. The control unit 200 can include a processing unit, a storage unit, and a communication interface. The control unit 200 is implemented, for example, by a computer. The processing unit can be configured to read out a program that provides logic or routines that enable various control actions to be performed from the storage unit, and to perform various control actions by executing the read program. The program can be stored in the storage unit in advance, or it can be obtained via a medium when necessary. The obtained program is stored in the storage unit and read out and executed from the storage unit by the processing unit. The medium can be various computer-readable storage media, or it can be a communication line connected to the communication interface. The storage medium can be transient or non-transient. The processing unit may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the resist coating apparatus 100 via a communication line such as a LAN (Local Area Network).

[0032] Specifically, the control unit 200 controls the suction operation by the nozzle 110 and the discharge operation of the resist liquid toward the wafer W held on the rotary holding plate 102 .

[0033] Figure 2 1 is an explanatory diagram for explaining the functions of the components constituting the resist coating apparatus 100. The nozzle 110 can be held in the resist storage portion 120 and the rotating holding disk 102 (in the Figure 2 The nozzle cleaning unit 130 moves between the top of the wafer W (not shown in the figure) and the nozzle cleaning unit 130.

[0034] The resist storage section 120 includes a plurality of resist storage containers 1 (hereinafter sometimes referred to as "containers 1") serving as processing liquid storage containers. Each container 1 can contain, for example, different types of resist liquids or the same type of resist liquid. Alternatively, it can contain solvents such as diluents used in the pre-wetting process for wafers W. The type of processing liquid stored in the container 1 and the number of containers 1 can be adjusted appropriately depending on the processing being performed by the substrate processing apparatus.

[0035] The nozzle cleaning unit 130 includes a cleaning liquid blowing unit 131 that blows cleaning liquid onto the surface of the nozzle 110, a cleaning liquid reservoir 132 that stores the cleaning liquid, and a gas blowing unit 133 that blows gas onto the surface of the nozzle 110. The nozzle 110 moves to the nozzle cleaning unit 130 at a predetermined timing, such as when the type of resist liquid sprayed onto the wafer W is changed, and moves sequentially to the cleaning liquid blowing unit 131, the cleaning liquid reservoir 132, and the gas blowing unit 133 for cleaning. Furthermore, if cleaning of the nozzle 110 is not necessary, the nozzle cleaning unit 130 may not be provided.

[0036] In the cleaning liquid blowing unit 131 , the resist liquid adhering to the surface of the nozzle 110 is removed by blowing a cleaning liquid such as pure water onto the surface of the nozzle 110 .

[0037] In the cleaning liquid reservoir 132, the nozzle 110 is immersed in a cleaning liquid such as pure water, and the interior of the nozzle 110 is cleaned by repeatedly sucking the resist liquid and ejecting the resist liquid to a predetermined ejection location. The predetermined ejection location may be within the cleaning liquid reservoir 132 or a dedicated ejection location (not shown).

[0038] In the gas blowing unit 133 , a gas such as air is blown toward the surface of the nozzle 110 , thereby drying the surface of the nozzle 110 .

[0039] Next, the outline of the structure of the container 1 will be described. Figure 3 It is a perspective view schematically showing the outline of the structure of the container 1 according to the present embodiment. Figure 4 It is an explanatory diagram of the container 1 and a gas supply mechanism for supplying gas to the container 1 . Figure 5 and Figure 6 is a cross-sectional view of the resist suction portion described later, Figure 5 Indicates the state in which the opening of the elastic member described later is opened, Figure 6 Indicates that the opening is closed.

[0040] like Figure 3 and Figure 4 As shown, the container 1 includes a container body 10 for storing a resist liquid, and a resist suction section 20 connected to the container body 10 as a processing liquid suction section.

[0041] The container body 10 is formed, for example, from a glass bottle, and has a gas supply port 11 formed on its upper surface for supplying gas to the container body 10. One end of a gas supply pipe 140 is connected to the gas supply port 11, and the other end of the gas supply pipe 140 is connected to a gas supply unit 141 that supplies an inert gas, such as nitrogen or argon. The gas supply unit 141 includes, for example, an on-off valve for switching the inert gas supply on and off, and a flow control valve for adjusting the flow rate of the inert gas. Furthermore, a gas filter 142 is provided on the gas supply pipe 140 to remove impurities from the gas flowing through the gas supply pipe 140. The flow rate of the gas flowing through the gas supply pipe 140 is adjusted by controlling the gas supply unit 141 using the control unit 200. The structure of the gas supply mechanism for supplying gas to the container body 10 is not limited to that described in this embodiment; any structure capable of supplying a predetermined gas to the gas supply port 11 may be used.

[0042] In addition, the container body 10 is provided with a main body side opening 12 that communicates with the interior of the container body 10, that is, the storage space of the resist liquid. The main body side opening 12 is sized to allow the nozzle 110 to pass through, and is formed, for example, into a circular shape when viewed from above. In this embodiment, the main body side opening 12 is located in the following portion. That is, the main body side opening 12 is located at the other end of a resist suction pipe 13, one end of which is connected to the lower portion of the container body 10. The resist suction pipe 13 extends downward from a removal port 25 of a removal base 21 of the resist suction section 20, which will be described later, and is connected to the lower portion of the container body 10 (specifically, the bottom surface 10a).

[0043] The resist suction pipe 13 is provided with a resist filter 14, and the resist filter 14 removes impurities from the resist liquid passing through the resist suction pipe 13. If the cleanliness of the resist liquid stored in the container body 10 is sufficiently high for the resist liquid to be applied to the wafer W, the resist filter 14 may not be provided.

[0044] A liquid level sensor 15 for detecting the liquid level of the resist liquid in the resist suction pipe 13 is provided downstream of the resist filter 14 in the resist suction pipe 13. The specific structure of the liquid level sensor 15 is not particularly limited as long as it can detect the liquid level.

[0045] As will be described later, when the resist liquid in the resist aspiration tube 13 is aspirated by the nozzle 110, the liquid level in the resist aspiration tube 13 drops. However, in the container 1 of this embodiment, the liquid level can be adjusted by supplying gas from the gas supply port 11 of the container body 10. Maintaining the resist liquid level at a constant height allows the lower end position of the nozzle 110, which descends during aspiration of the resist liquid, to be fixed. This eliminates the need to adjust the amount of nozzle 110's descent based on the resist liquid level, simplifying the control of nozzle 110 movement.

[0046] The liquid level is preferably adjusted by supplying gas to the container body 10 based on the liquid level in the resist suction pipe 13 detected by the liquid level sensor 15. For example, when the liquid level sensor 15 detects a decrease in the resist liquid level, the gas supply unit 141 can be controlled to supply gas to the container body 10, thereby automatically raising the liquid level to a predetermined height.

[0047] The resist suction unit 20 is connected to the container body 10. Specifically, the resist suction unit 20 is connected to the container body 10 via the resist suction pipe 13. The resist suction unit 20 is a sealing unit that seals the main body side opening 12. Figure 5 As shown, the resist suction unit 20 includes a removal base 21 , an elastic member 22 , an actuator 23 , and a top plate member 24 .

[0048] The removal base 21 is located above the main body opening 12 and has a larger area than the main body opening 12 when viewed from above. A resist removal port 25 is provided on the removal base 21 at a position corresponding to the main body opening 12. The removal base 21 is formed from a material that is resistant to the resist and electrically insulating (e.g., polypropylene resin). The removal port 25 is sized to accommodate the nozzle 110. When viewed from above, the removal port 25 is smaller than the main body opening 12.

[0049] Furthermore, the removal base 21 has a bottom wall 26 and a peripheral wall 27 .

[0050] The bottom wall 26 is a flat plate portion that supports the elastic member 22 from below and is formed so that the removal port 25 vertically penetrates the bottom wall 26. The bottom wall 26 has, for example, a circular shape with a larger diameter than the main body opening 12 in a plan view.

[0051] The peripheral wall 27 is a restricting member that restricts lateral expansion of the elastic member 22. The peripheral wall 27 has, for example, an annular shape having an outer diameter substantially equal to that of the main body-side opening 12 in a plan view.

[0052] The elastic member 22 is provided above the removal base 21. The elastic member 22 is resistant to the resist liquid. In other words, the elastic member 22 is formed of a material that is not only elastic but also resistant to the resist liquid. For example, the material is perfluoroelastomer (FFKM).

[0053] Furthermore, the elastic member 22 has an opening 28 at a position corresponding to the removal port 25 when viewed from above. The opening 28 is formed to extend vertically through the elastic member 22. The portion surrounding the opening 28 in the elastic member 22 may gradually become thinner toward the center of the opening 28. If the opening 28 has a mortar shape in which the width gradually narrows downward, the portion surrounding the opening 28 in the elastic member 22 may gradually become thinner toward the center of the opening 28 as described above.

[0054] As described later, the opening 28 is closed or opened by the actuator 23. The size of the opening 28 is such that, when the actuator 23 opens the opening 28, nozzle 110 can pass through. Furthermore, when the actuator 23 closes the opening 28, the opening 28 may not be completely closed. This prevents the generation of particles caused by contact between the portions forming the opening 28 when the opening 28 is completely closed.

[0055] Actuator 23 is disposed above elastic member 22 so that opening 28 is exposed. Actuator 23 freely expands and contracts in the vertical direction in accordance with the magnitude of the voltage applied to actuator 23. A dielectric actuator or piezoelectric element, for example, in which a dielectric elastomer is sandwiched between electrodes, is used for actuator 23. Actuator 23 does not necessarily need to be chemically resistant.

[0056] The actuator 23 extends in the vertical direction by, for example, application of voltage.

[0057] In addition, the actuator 23 has a central opening 29 at a position corresponding to the opening 28 when viewed from above, so that the opening 28 is exposed upward. The central opening 29 is formed to vertically penetrate the actuator 23. The central opening 29 is sized to allow the nozzle 110 to pass through. When viewed from above, the central opening 29 is larger than the removal port 25, for example.

[0058] Top plate member 24 is provided above actuator 23 so that opening 28 is exposed, and defines the position of the upper end of actuator 23. Top plate member 24 has an upper opening 30 at a position corresponding to middle opening 29, so that opening 28 is exposed upward. Upper opening 30 is sized to allow nozzle 110 to pass through. Furthermore, when viewed from above, upper opening 30 is, for example, sized to be the same as middle opening 29.

[0059] The top plate member 24 is formed of, for example, the same material as that of the removal base 21 .

[0060] In addition, the top plate member 24 has a top wall 31 and a peripheral wall 32 .

[0061] The top wall 31 contacts the upper surface of the actuator 23 and secures the position of the upper end of the actuator 23 even when the actuator 23 extends vertically. The top wall 31 is formed such that an upper opening 30 extends vertically through the top wall 31. When viewed from above, the top wall 31 has, for example, an annular shape having a diameter substantially the same as that of the bottom wall 26 of the removal base 21.

[0062] The peripheral wall 32 defines the horizontal position of the actuator 23. In a plan view, the peripheral wall 32 has, for example, an annular shape having an inner diameter and an outer diameter substantially equal to those of the peripheral wall 27 of the removal base 21.

[0063] In the resist suction unit 20, the elastic member 22 and the actuator 23 are provided so as to be sandwiched between the removal base 21 and the top plate member 24. Specifically, the elastic member 22 and the actuator 23 are housed in a housing space formed by the bottom wall 26 and the peripheral wall 27 of the removal base 21, and the top wall 31 and the peripheral wall 32 of the top plate member 24, and are sandwiched between the bottom wall 26 and the top wall 31 in the vertical direction.

[0064] In the resist suction section 20 , the extraction port 25 , the opening 28 , the middle opening 29 , and the upper opening 30 are connected in sequence starting from the main body side opening 12 , for example.

[0065] In the container 1 having the above structure, as Figure 6 As shown, when actuator 23 is vertically extended, the amount of compression applied to elastic member 22 by actuator 23 increases, thereby closing opening 28. Specifically, in resist suction unit 20, when voltage is applied to actuator 23, causing actuator 23 to extend vertically, the rise of the upper end of actuator 23 is blocked by top plate member 24, causing the lower end of actuator 23 to descend, thereby compressing elastic member 22. This compression squeezes the portion of elastic member 22 surrounding opening 28, which is sandwiched between actuator 23 and removal base 21, inward, toward the center of opening 28, closing opening 28. Consequently, main body-side opening 12 is sealed.

[0066] In addition, in container 1, as Figure 5As shown, when the actuator 23 contracts vertically, the amount of compression applied to the elastic member 22 by the actuator 23 is reduced, thereby opening the opening 28. Specifically, in the resist suction unit 20, when the voltage applied to the actuator 23 is released, causing the actuator 23 to contract vertically, the lower end of the actuator 23 rises, releasing the compression applied to the elastic member 22 by the actuator 23. This causes the inner circumferential end of the opening 28 to move outward, thereby opening the opening 28. Specifically, the portion of the elastic member 22 that was pushed inward when the voltage was applied to the actuator 23 returns to its original position, thereby opening the opening 28. With the opening 28 open, the nozzle 110 is inserted below the main body opening 12 via the upper opening 30, the middle opening 29, the opening 28, and the removal port 25. The nozzle 110 then aspirates the resist liquid within the container body 10 (specifically, within the resist suction tube 13).

[0067] Furthermore, if the resist suction portion 20 is not provided to seal the main body-side opening 12, particles may enter the resist suction pipe 13 through the main body-side opening 12, thereby potentially reducing the cleanliness of the resist liquid in the resist suction pipe 13 and the resist liquid in the container main body 10. In contrast, in the container 1 according to this embodiment, the main body-side opening 12 is sealed by closing the opening 28 as described above. This prevents particles that may enter through the upper opening 30 of the top plate member 24 from reaching the resist suction pipe 13, thereby maintaining the cleanliness of the resist liquid.

[0068] <Resist Coating Process>

[0069] Next, a method of resist coating processing performed by the resist coating apparatus 100 will be described.

[0070] First, the wafer W is placed on the rotary holding plate 102 .

[0071] Next, the nozzle support 111 is moved toward the container 1 of the resist storage portion 120 so that the nozzle 110 is moved above the resist suction portion 20. Thereafter, the nozzle support 111 is lowered into the resist suction pipe 13 of the container 1.

[0072] Furthermore, the actuator 23 of the resist suction unit 20 contracts in the vertical direction, reducing the amount of compression exerted on the elastic member 22 by the actuator 23, thereby opening the opening 28. The timing of opening the opening 28 as described above under the control of the control unit 200 is linked to, for example, the timing of the control unit 200's command to control the movement of the nozzle support unit 111 toward the container 1. For example, the opening 28 may be opened at the timing of the control unit 200 outputting a command instructing the nozzle support unit 111 to begin descending into the resist suction pipe 13 of the container 1. Alternatively, the opening 28 may be opened at the timing of the control unit 200 outputting a command instructing the nozzle support unit 111 to begin moving toward the container 1 of the resist storage unit 120.

[0073] The nozzle support portion 111 is lowered until the lower end of the nozzle 110 passes through the opening 28 and the removal port 25 after the opening 28 is opened and is immersed in the resist liquid in the resist suction pipe 13 .

[0074] After the nozzle support portion 111 is lowered, the resist liquid is sucked by the nozzle 110 .

[0075] Furthermore, during the resist liquid aspiration process, the resist liquid is aspirated by the nozzle 110, thereby lowering the liquid level within the resist aspiration tube 13. While the gas supply to the container body 10 filled with the resist liquid is stopped, the liquid level sensor 15 detects a drop in the liquid level, automatically supplying gas to the container body 10 to raise the liquid level to a predetermined height. In other words, the liquid level, which had dropped after the resist liquid was aspirated by the nozzle 110, automatically returns to its original level.

[0076] Next, the nozzle support 111 is raised to move the nozzle 110 above the resist suction unit 20 . Thereafter, the nozzle support 111 is moved toward the rotary holding plate 102 to move the nozzle 110 above the wafer W held on the rotary holding plate 102 .

[0077] Furthermore, the actuator 23 of the resist suction unit 20 is extended in the vertical direction, increasing the amount of compression exerted on the elastic member 22 by the actuator 23, thereby closing the opening 28. The timing of closing the opening 28 as described above under the control of the control unit 200 is linked to, for example, the timing of the control unit 200's instruction to control the movement of the nozzle support unit 111 away from the container 1. For example, the opening 28 is closed when the control unit 200 outputs an instruction to the nozzle support unit 111 to begin moving toward the rotary holding disk 102 after the nozzle 110 has moved above the resist suction unit 20.

[0078] After the nozzle support 111 has completed its movement toward the rotary holding disk 102, the sucked resist liquid is ejected from the nozzle 110 onto the wafer W held on the rotary holding disk 102. The rotary holding disk 102 rotates in response to the ejection, and a resist film is formed on the wafer W.

[0079] Thereafter, the nozzle 110 is moved to the nozzle cleaning unit 130 as needed to clean the nozzle 110 .

[0080] After the above steps, the resist coating process on the wafer W is completed.

[0081] <Main Effects of This Embodiment>

[0082] In the resist storage container 1 according to this embodiment, valves, pumps, etc. that may generate particles are not required in the supply path for supplying the resist liquid to the nozzle 110. Therefore, the generation of particles in the resist liquid supply path can be suppressed, thereby improving the cleanliness of the resist liquid.

[0083] Furthermore, in the resist storage container 1, the resist suction unit 20 is used to prevent particles from entering the resist liquid sucked by the nozzle 110. Furthermore, the resist suction unit 20 does not require multiple gas pipes, gas supply units, gas filters, and the like, as required by the technique disclosed in Patent Document 1, nor does it require the preparation of a highly clean inert gas. Therefore, the system utilizing the resist suction unit 20 has an overall simple structure.

[0084] Therefore, according to the resist storage container 1 , the generation of particles in the supply path of the processing liquid can be suppressed with a simple structure.

[0085] Furthermore, in this embodiment, the elastic member 22 is exposed to the vapor of the resist liquid stored in the container body 10 with its opening 28 closed. Furthermore, the opening 28 of the elastic member 22 (specifically, its narrowest portion) is thinner than the removal port 25, the middle opening 29, and the upper opening 30. Therefore, from the perspective of particulate matter, even if the opening 28 of the elastic member 22 is sized so that the elastic member 22 does not contact the nozzle 110, there is a high probability that the resist liquid adhering to the nozzle 110 and the like will come into contact with the elastic member 22. In the resist suction unit 20, the elastic member 22 is resistant to chemical liquid. Consequently, damage to the elastic member 22 by the resist liquid itself or its vapor can be suppressed.

[0086] In other words, in this embodiment, the opening and closing of the removal port 25 is performed indirectly by the actuator 23 via the elastic member 22. However, a configuration in which the removal port 25 is directly opened and closed by a dielectric actuator or a piezoelectric element serving as the actuator 23, unlike this embodiment, is also conceivable. However, dielectric actuators and piezoelectric elements generally lack chemical resistance, and thus the durability of the above-described direct opening and closing configuration could be improved.

[0087] Furthermore, in the resist storage container 1 according to this embodiment, the removal base 21 of the resist suction unit 20 includes a peripheral wall 27 that restricts lateral expansion of the elastic member 22. Therefore, compared to a case where the peripheral wall 27 is not provided, the opening 28 can be closed even if the amount of compression of the elastic member 22 by the actuator 23 is reduced. In other words, the elastic member 22 does not need to be thick, thereby enabling the resist suction unit 20 to be miniaturized.

[0088] As described above, the portion around the opening 28 in the elastic member 22 may be gradually thinned toward the center of the opening 28. When thinned like this, the opening 28 can be closed even if the amount of compression of the elastic member 22 by the actuator 23 is reduced.

[0089] <Modification 1 of Resist Storage Container>

[0090] Figure 7 It is a diagram for explaining a first modification of the resist storage container.

[0091] Figure 7 The resist storage container 1A includes a proximity detection sensor 301 for detecting the approach of an object.

[0092] The proximity detection sensor 301 is provided in, for example, the resist suction portion 20A, specifically, in the top plate member 24 (see Figure 3 wait).

[0093] When the proximity detection sensor 301 is provided as described above, the control unit 200 performs the following control, for example. Specifically, when the proximity detection sensor 301 detects the approach of an object, it is assumed that the nozzle 110 is near the resist suction unit 20A and preparations need to be made to suck the resist liquid by the nozzle 110. Therefore, the control unit 200 controls the opening 28 to open. On the other hand, when the proximity detection sensor 301 does not detect the approach of an object, it is assumed that the nozzle 110 is not near the resist suction unit 20A and preparations need not be made to suck the resist liquid by the nozzle 110. Therefore, the control unit 200 controls the opening 28 to close.

[0094] By performing control in this manner, the opening 28 can be opened and closed in conjunction with the position of the nozzle 110 , and the time during which the opening 28 is open can be shortened as much as possible.

[0095] <Modification 2 of Resist Storage Container>

[0096] Figure 8 It is a diagram for explaining a second modification of the resist storage container.

[0097] Figure 8 The resist storage container 1B includes a chemical liquid detection sensor 302 for detecting chemical liquid components in the resist liquid.

[0098] The liquid detection sensor 302 is provided in, for example, the resist suction unit 20B, specifically, the top plate member 24 (see Figure 3 wait).

[0099] When the liquid chemical detection sensor 302 is provided as described above, the control unit 200 performs the following control, for example. Specifically, when the liquid chemical detection sensor 302 detects the aforementioned liquid chemical component, it is assumed that a nozzle 110 with resist liquid attached to its tip after discharge, or with resist liquid remaining on its tip after discharge, is present near the resist suction unit 20B, and preparations for suctioning the resist liquid using the nozzle 110 are necessary. Therefore, the control unit 200 controls the opening 28 to open. Furthermore, when the liquid chemical detection sensor 302 does not detect the aforementioned liquid chemical component, it is assumed that a nozzle 110 with resist liquid attached to its tip is not present near the resist suction unit 20B, and preparations for suctioning the resist liquid using the nozzle 110 are unnecessary. Therefore, the control unit 200 controls the opening 28 to close.

[0100] By performing control in this manner, the opening 28 can be opened and closed in conjunction with the position of the nozzle 110 , and the time during which the opening 28 is open can be shortened as much as possible.

[0101] <Other Modifications>

[0102] Furthermore, in this embodiment, the resist coating apparatus 100 includes a single nozzle 110, but multiple nozzles 110 may be provided. For example, two nozzles 110 and two rotating holding disks 102 may be provided within the processing container 101, with one nozzle 110 assigned to each rotating holding disk 102 to apply resist liquid to the wafer W. In the resist coating apparatus 100 with this configuration, for example, the resist storage unit 120 and the nozzle cleaning unit 130 are disposed between the two rotating holding disks 102.

[0103] Furthermore, in the aforementioned embodiment, the resist liquid level within the resist suction tube 13 is regulated by supplying gas to the container body 10. However, if the resist liquid can be aspirated without adjusting the liquid level, a mechanism for adjusting the liquid level is unnecessary. For example, if the container body 10 is a low-profile container, and the lower end of the nozzle 110 can be positioned near the bottom of the container body 10 during aspiration, the resist liquid can be aspirated even without adjusting the liquid level within the container body 10. In this case, for example, the container 1 can be constructed by directly connecting the removal port 25 of the resist suction section 20 to the gas supply port 11 of the container body 10. In this case, the gas supply port 11 serves as the main body-side opening 12. Alternatively, the container 1 can be constructed by connecting the removal port 25 of the resist suction section 20 to the gas supply port 11 of the container body 10 via piping or the like. In this case, the end of the piping on the resist suction section 20 side serves as the main body-side opening 12.

[0104] In addition, in the aforementioned embodiment, an example is described in which a single nozzle 110 is used to suck and eject the resist liquid. However, for example, a single nozzle 110 can also be used to suck and eject both the pre-wetting liquid (an organic solvent such as a diluent) and the resist liquid. Specifically, a pre-wetting liquid container (not shown) is provided near the resist container 120. After the resist liquid in the resist container 120 is sucked out by the nozzle 110, the pre-wetting liquid in the pre-wetting liquid container is sucked out. At this time, a layer of resist liquid and a layer of pre-wetting liquid are formed overlappingly inside the nozzle 110, with the pre-wetting liquid layer existing at the front end of the nozzle 110. In this state, the nozzle 110 is moved above the wafer W and the pre-wetting liquid is ejected onto the surface of the wafer W, followed by ejection of the resist liquid. In this manner, by sequentially sucking in the resist liquid, sucking in the pre-wetting liquid, ejecting the pre-wetting liquid, and ejecting the resist liquid using the nozzle 110, the pre-wetting process and the resist coating process of the wafer W can be performed continuously.

[0105] In the above example, the opening 28 of the elastic member 22 is closed when a voltage is applied to the actuator 23, and is opened when no voltage is applied. Alternatively, the opening 28 of the elastic member 22 may be closed when no voltage is applied to the actuator 23, and be opened when a voltage is applied.

[0106] Furthermore, the processing liquid storage container and substrate processing apparatus according to the present disclosure can also be applied to processing apparatuses for processing substrates other than semiconductor wafers, for example, FPD (Flat Panel Display) substrates.

[0107] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the appended claims and their subject matter. For example, the constituent elements of the above embodiments may be arbitrarily combined. According to such arbitrary combinations, it is of course possible to obtain the effects and effects of the various constituent elements involved in the combination, and it is possible to obtain other effects and effects that are clearly known to those skilled in the art based on the description of this specification.

[0108] In addition, the effects described in this specification are merely for explanation or illustration, and are not limiting. That is, the technology involved in this disclosure can also have other effects that are clearly known to those skilled in the art based on the description of this specification in addition to or instead of the above effects.

[0109] In addition, the following structural examples also belong to the technical scope of the present disclosure.

[0110] (1) A processing liquid storage container for storing processing liquid, the processing liquid storage container comprising:

[0111] a container body for storing the treatment liquid; and

[0112] a treatment liquid suction unit connected to the container body;

[0113] Wherein, the treatment liquid suction part has:

[0114] A take-out base is provided above the main body side opening communicating with the container main body, the take-out base having an area larger than the main body side opening when viewed from above, and the take-out base having a treatment liquid take-out port at a position corresponding to the main body side opening;

[0115] an elastic member disposed above the removal base, the elastic member being resistant to the treatment liquid and having an opening at a position corresponding to the removal port in a plan view;

[0116] an actuator provided above the elastic member so as to expose the opening, the actuator being capable of vertical expansion and contraction in accordance with the magnitude of an applied voltage; and

[0117] a top plate member disposed above the actuator so as to expose the opening, the top plate member defining the position of the upper end of the actuator,

[0118] When the actuator is extended in the vertical direction, the actuator increases the amount of compression of the elastic member, thereby closing the opening.

[0119] When the actuator contracts in the vertical direction, the actuator reduces the amount of compression of the elastic member, thereby opening the opening.

[0120] (2) In the treatment liquid storage container described in (1),

[0121] The removal base includes a flat plate portion that supports the elastic member from below, and a restriction member that is located at a peripheral edge of the flat plate portion and restricts expansion of the elastic member in a lateral direction.

[0122] (3) In the treatment liquid storage container described in (1) or (2),

[0123] The opening of the elastic member has a size such that a nozzle capable of sucking and ejecting the processing liquid passes therethrough when the opening is opened by the actuator.

[0124] (4) In the treatment liquid storage container described in (3),

[0125] A portion of the elastic member around the opening is formed to gradually become thinner toward the center of the opening.

[0126] (5) In the treatment liquid storage container described in any one of (1) to (4),

[0127] The elastic member is formed of perfluoroelastomer.

[0128] (6) A substrate processing apparatus comprising:

[0129] The treatment liquid storage container according to any one of (1) to (5);

[0130] a substrate holding portion that holds a substrate;

[0131] a nozzle that can be inserted into the opening of the elastic member of the processing liquid storage container and the removal port of the removal base and can suck and eject the processing liquid; and

[0132] The control unit controls a suction operation of the nozzle and a discharge operation of the processing liquid toward the substrate held by the substrate holding unit.

[0133] (7) In the substrate processing apparatus described in (6),

[0134] The control unit contracts the actuator in the vertical direction to reduce the amount of compression of the elastic member by the actuator, thereby opening the opening.

[0135] The control unit causes the nozzle to suck the processing liquid,

[0136] After the treatment liquid is sucked, the control unit extends the actuator in the vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening.

[0137] (8) In the substrate processing apparatus described in (7),

[0138] A nozzle support portion is provided for supporting the nozzle so as to allow the nozzle to move freely.

[0139] The control unit opens the opening in a timely manner in conjunction with an instruction to control the movement of the nozzle support unit toward the processing liquid storage container.

[0140] The control unit closes the opening in synchronization with a command for controlling the movement of the nozzle supporter away from the processing liquid storage container.

[0141] (9) In the substrate processing apparatus described in (7),

[0142] The treatment liquid storage container further includes a proximity detection sensor, which detects the approach of an object.

[0143] When the proximity detection sensor detects the approach, the control unit opens the opening.

[0144] The control unit closes the opening when the proximity detection sensor does not detect the approach.

[0145] (10) In the substrate processing apparatus described in (7),

[0146] The treatment liquid storage container further includes a liquid detection sensor, which detects the liquid components of the treatment liquid.

[0147] When the liquid medicine component is detected by the liquid medicine detection sensor, the control unit opens the opening.

[0148] The control unit closes the opening when the drug liquid detection sensor does not detect the drug liquid component.

[0149] (11) A substrate processing method is a method for processing a substrate using a processing liquid in a processing liquid storage container,

[0150] The treatment liquid storage container comprises:

[0151] a container body for storing the treatment liquid; and

[0152] a treatment liquid suction unit connected to the container body;

[0153] Wherein, the treatment liquid suction part has:

[0154] A take-out base is provided above the main body side opening communicating with the container main body, the take-out base having an area larger than the main body side opening when viewed from above, and the take-out base having a treatment liquid take-out port at a position corresponding to the main body side opening;

[0155] an elastic member disposed above the removal base, the elastic member being resistant to the treatment liquid and having an opening at a position corresponding to the removal port in a plan view;

[0156] an actuator provided above the elastic member so as to expose the opening, the actuator being capable of vertical expansion and contraction in accordance with the magnitude of an applied voltage; and

[0157] a top plate member disposed above the actuator so as to expose the opening, the top plate member defining the position of the upper end of the actuator,

[0158] The substrate processing method includes the following steps:

[0159] contracting the actuator in the vertical direction to reduce the amount of compression of the elastic member caused by the actuator, thereby opening the opening;

[0160] causing the nozzle to attract the treatment liquid;

[0161] extending the actuator in the vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening; and

[0162] The sucked processing liquid is ejected from the nozzle onto the substrate.

[0163] Description of Reference Numerals

[0164] 1, 1A, 1B: resist storage container; 10: container body; 12: body side opening; 20, 20A, 20B: resist suction unit; 21: base; 22: elastic member; 23: actuator; 24: top plate member; 25: removal port; 28: opening; W: wafer.

Claims

1. A treatment liquid receiving container, wherein the treatment liquid receiving container receives the treatment liquid. The treatment liquid storage container comprises: a container body for storing the treatment liquid; and a treatment liquid suction unit connected to the container body; in, The treatment liquid suction unit includes: A take-out base is provided above the main body side opening communicating with the container main body, the take-out base having an area larger than the main body side opening when viewed from above, and the take-out base having a treatment liquid take-out port at a position corresponding to the main body side opening; an elastic member disposed above the removal base, the elastic member being resistant to the treatment liquid and having an opening at a position corresponding to the removal port in a plan view; an actuator disposed above the elastic member so as to expose the opening, the actuator being capable of vertical expansion and contraction in accordance with an applied voltage; as well as a top plate member disposed above the actuator so as to expose the opening, the top plate member defining the position of the upper end of the actuator, When the actuator is extended in the vertical direction, the actuator increases the amount of compression of the elastic member, thereby closing the opening. When the actuator contracts in the vertical direction, the actuator reduces the amount of compression of the elastic member, thereby opening the opening.

2. The processing liquid storage container according to claim 1, wherein The removal base includes a flat plate portion that supports the elastic member from below, and a restriction member that is located at a peripheral edge of the flat plate portion and restricts expansion of the elastic member in a lateral direction.

3. The processing liquid storage container according to claim 1 or 2, wherein: The opening of the elastic member has a size such that a nozzle capable of sucking and ejecting the processing liquid passes therethrough when the opening is opened by the actuator.

4. The processing liquid storage container according to claim 3, wherein A portion of the elastic member around the opening is formed to gradually become thinner toward the center of the opening.

5. The processing liquid storage container according to claim 1 or 2, wherein: The elastic member is formed of perfluoroelastomer.

6. A substrate processing apparatus comprising: The treatment liquid storage container according to claim 1 or 2; a substrate holding portion that holds a substrate; a nozzle that can be inserted into the opening of the elastic member of the processing liquid storage container and the removal port of the removal base and can suck and eject the processing liquid; and The control unit controls a suction operation of the nozzle and a discharge operation of the processing liquid toward the substrate held by the substrate holding unit.

7. The substrate processing apparatus according to claim 6, wherein: The control unit contracts the actuator in the vertical direction to reduce the amount of compression of the elastic member by the actuator, thereby opening the opening. The control unit causes the nozzle to suck the processing liquid, After the treatment liquid is sucked, the control unit extends the actuator in the vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening.

8. The substrate processing apparatus according to claim 7, wherein: A nozzle support portion is provided for supporting the nozzle so as to allow the nozzle to move freely. The control unit opens the opening in a timely manner in conjunction with an instruction to control the movement of the nozzle support unit toward the processing liquid storage container. The control unit closes the opening in synchronization with a command for controlling the movement of the nozzle supporter away from the processing liquid storage container.

9. The substrate processing apparatus according to claim 7, wherein: The treatment liquid storage container further includes a proximity detection sensor, which detects the approach of an object. When the proximity detection sensor detects the approach, the control unit opens the opening. The control unit closes the opening when the proximity detection sensor does not detect the approach.

10. The substrate processing apparatus according to claim 7, wherein: The treatment liquid storage container further includes a liquid detection sensor, which detects the liquid components of the treatment liquid. When the liquid medicine component is detected by the liquid medicine detection sensor, the control unit opens the opening. The control unit closes the opening when the drug liquid detection sensor does not detect the drug liquid component.

11. A substrate processing method, wherein the substrate is processed using a processing liquid in a processing liquid receiving container. The treatment liquid storage container comprises: a container body for storing the treatment liquid; and a treatment liquid suction unit connected to the container body; in, The treatment liquid suction unit includes: A take-out base is provided above the main body side opening communicating with the container main body, the take-out base having an area larger than the main body side opening when viewed from above, and the take-out base having a treatment liquid take-out port at a position corresponding to the main body side opening; an elastic member disposed above the removal base, the elastic member being resistant to the treatment liquid and having an opening at a position corresponding to the removal port in a plan view; an actuator provided above the elastic member so as to expose the opening, the actuator being capable of vertical expansion and contraction in accordance with the magnitude of an applied voltage; and a top plate member disposed above the actuator so as to expose the opening, the top plate member defining the position of the upper end of the actuator, The substrate processing method includes the following steps: contracting the actuator in the vertical direction to reduce the amount of compression of the elastic member caused by the actuator, thereby opening the opening; causing the nozzle to attract the treatment liquid; extending the actuator in the vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening; and The sucked processing liquid is ejected from the nozzle onto the substrate.

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