Circuit board production process management and control method and system based on multilayer circuit

Abstract

The invention discloses a circuit board production process management and control method and system based on a multilayer circuit. The method comprises the following steps: establishing an interlayer transmission line parameter model of a multilayer circuit board, and calculating electromagnetic field distribution based on a deformation telegraph equation and a parallel plate resonance effect; performing transmission characteristic simulation verification; optimizing production environment parameters, and selecting an area of which the electric field intensity is lower than 45% maximum value as a wiring optimal area; implementing a layered wiring strategy, and optimizing an interlayer wiring path according to the transmission matrix; production data are dynamically monitored, temperature, humidity and electromagnetic radiation data are collected in real time, and machining parameters are adjusted in combination with a transmission matrix correction value. According to the method, the transmission characteristics are accurately predicted, the production environment parameters are optimized, the influence of the external environment on the performance of the circuit board is effectively reduced, and the stability and reliability of the circuit board are improved. Through establishment of a parameter model and simulation verification, comprehensive management and control of the production process of the multilayer circuit board are realized.

Description

Technical Field

[0001] The present invention relates to the field of electronic manufacturing processes, and in particular to a method and system for controlling the production process of a circuit board based on a multi-layer circuit. Background Art

[0002] In the modern electronics industry, printed circuit boards (PCBs), as fundamental components of electronic devices, have a production quality that directly impacts the performance and reliability of the final product. As electronic devices develop toward miniaturization and higher performance, PCB designs are also trending toward multi-layered design to meet the demands of higher integration and more complex circuit designs. Production process control for multi-layer PCBs is a key step in ensuring product quality, involving multiple complex steps such as material selection, lamination, drilling, copper plating, pattern transfer, etching, and surface treatment. Traditional production process control methods rely heavily on manual experience and simple testing equipment, making it difficult to achieve precise control and real-time monitoring of the entire production process. This, to a certain extent, limits improvements in production efficiency and product quality.

[0003] With the development of automation and information technology, advanced production process control systems have begun to be applied in the circuit board manufacturing field. These systems achieve automation and partial intelligence in the production process by integrating sensors, actuators, and computer control systems. However, existing control systems often focus on optimizing a single production link and lack the ability to monitor and analyze the entire production process. In addition, the complexity and variability of the multi-layer circuit board production process require control systems to process large amounts of data in real time and quickly respond to and adjust to abnormal situations in the production process. Currently, the market lacks a control method and system that can comprehensively consider the characteristics of each link in the multi-layer circuit board production process and realize dynamic monitoring of the entire process and intelligent decision support.

[0004] Currently, there are very few technologies related to the production control of multi-layer circuit boards. The patent application with publication number CN108377617A discloses a method for controlling the expansion and shrinkage of multi-layer circuit boards. This method focuses on the field of circuit board production and manufacturing, especially the expansion and shrinkage control method for multi-layer circuit boards. By publishing programs and exception handling processes, a complete product online operation process determination process is realized, thereby effectively reducing the difficulty of printed circuit board graphic size control and improving production quality and production efficiency. The above scheme involves circuit board graphic size control, but does not involve the transmission parameters, production environment, etc. of multi-layer circuit boards. In summary, the production control technology of multi-layer circuit boards still needs in-depth research, and it is particularly urgent to develop a circuit board production process control method and system based on multi-layer circuits. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a circuit board production process control method and system based on multi-layer circuits. It aims to solve the problems of inaccurate prediction of transmission line transmission characteristics and the great influence of the external environment on circuit board performance in the production process of multi-layer circuit boards through scientific and rigorous steps.

[0006] The object of the present invention is achieved through the following technical solutions: A method for controlling the production process of a circuit board based on a multi-layer circuit includes the following: S1. Establish a parametric model for interlayer transmission lines in a multilayer PCB: Based on the deformed telegraph equation under the influence of an external electromagnetic field and the parallel plate resonance effect between the power and ground layers, calculate the electromagnetic field distribution of transmission lines at different heights and generate a transmission matrix that includes the transmission line height term. S2. Perform transmission characteristics simulation verification: S3. Optimize production environment parameters: Based on simulation results, extract the electric field intensity distribution at the resonant frequency and select areas where the electric field intensity is less than 45% of the maximum value as the preferred wiring areas. Adjust the ambient temperature to 20-25°C, the humidity to 30-50%, and the electromagnetic shielding layer thickness to ≥3mm. S4. Implement a layered routing strategy: For single-line, multi-line, and differential line systems, optimize inter-layer routing paths based on the transmission matrix calculation results, ensuring that transmission lines are close to the ground plane and ports are located in areas of low electric field strength. S5. Dynamically monitor production data: Real-time data collection of temperature, humidity, and electromagnetic radiation in the processing area is used to dynamically adjust processing parameters based on the transmission matrix correction value.

[0007] As a preferred embodiment, the transmission matrix expression is:

[0008] in: for n × n The identity matrix represents the ideal transmission characteristics of the transmission line when there is no coupling; for n × n Zero matrix, used to represent the situation where there is no electric or magnetic field coupling; , , , (called K matrix) is the parallel plate electric field coupling coefficient matrix, both n × n Matrix, representing the electric field coupling relationship between the power layer and the ground layer; : Coupling of the input electric field to the input voltage (self-coupling). : Coupling of the electric field at the input to the current at the output (cross-port coupling). : Coupling of the output electric field to the input current (cross-port coupling). : Coupling of the output electric field to the output voltage (self-coupling).

[0009] is the transfer coefficient of the output voltage to the input voltage (voltage gain when there is no coupling). is the transfer coefficient of the output current to the input voltage (including impedance characteristics). is the transfer coefficient of the output voltage to the input current (including the admittance characteristics). is the transfer coefficient of the output current to the input current (current gain when there is no coupling). The voltage-current transmission characteristics of the transmission line itself are related to the length of the transmission line. Related.

[0010] For the The height of the transmission line from the ground plane, is the thickness of the parallel plate dielectric layer. It reflects the relative position of the transmission line in the interlayer structure. increases (the transmission line is close to the power layer), the electric field coupling effect is enhanced; when The K matrix represents the electric field coupling effect between the power layer and the ground layer, where , , , , is the diagonal matrix of transmission line height terms, i.e. diag( . For the The vertical height of the transmission line to the ground plane, is 1, 2, ..., . is the thickness of the parallel plate dielectric layer between the power layer and the ground layer.

[0011] The transfer matrix is ​​converted into an S-parameter matrix, and the calculation formula is:

[0012] in: is the impedance matrix, is the port characteristic impedance, is the identity matrix.

[0013] As a preferred method, the construction of the deformed telegraph equation described in S1 includes: using the electromagnetic field generated by the parallel plate resonance as an external excitation source, correcting the transmission line voltage definition through the Agrawal model, combining the equivalent voltage source / current source expression of the Taylor model, and deriving the cascade matrix of the interlayer transmission line.

[0014] As a preferred embodiment, the hierarchical wiring strategy in S4 is specifically as follows: For differential transmission line systems, a dense layout with physical port spacing ≤ 5mm is used; For a single-line system, set the height of the transmission line from the ground layer to ≤ 1 / 3 of the interlayer dielectric thickness.

[0015] As a preferred embodiment, the dynamic adjustment of processing parameters in S5 includes: When the electromagnetic radiation intensity is detected to exceed the threshold, the processing speed is automatically reduced and the real-time recalculation of the transmission matrix is ​​triggered to update the wiring path planning.

[0016] As a preferred method, it also includes: conducting actual wafer testing on the completed circuit boards, comparing the deviation between the simulated S parameters and the measured results, and if the deviation is greater than 15%, marking it as an abnormal batch and tracing back the processing data.

[0017] As a preferred embodiment, the actual wafer test includes: measuring the port reflection coefficient S by a vector network analyzer 11 and transmission coefficient S 21 , extract the amplitude and phase deviation data of the resonant frequency point.

[0018] A circuit board production process control system based on multi-layer circuits, comprising: Modeling module: used to build the interlayer transmission line parameter model and generate the transmission matrix based on the deformed telegraph equation and parallel plate resonant field; Simulation module: connects to the modeling module, converts the transmission matrix into an S-parameter matrix and performs signal integrity and electromagnetic compatibility simulation; Environmental control module: Receives output data from the simulation module and dynamically adjusts the temperature and humidity, electromagnetic shielding parameters, and optimal wiring area of ​​the processing area; Wiring optimization module: Generates a layered wiring plan based on the calculation results of the transmission matrix to control the differential line port spacing and the height between single line layers; Production management module: monitors processing data in real time and feeds it back to the modeling module, triggering dynamic correction of the transmission matrix.

[0019] As a preferred embodiment, the modeling module specifically includes: Electric field calculation unit, used to solve the TM mode electric field distribution of the parallel plate resonant cavity; The matrix generation unit generates the transfer matrix including the height term based on the coupled equations of the Agrawal model and the Taylor model .

[0020] As a preferred embodiment, when the production management module dynamically modifies the transmission matrix, the parameters are updated using the following formula:

[0021] The matrices with the “'” symbol are the parameters corrected based on the real-time monitoring data.

[0022] The present invention has at least the following beneficial effects: This method for controlling the production process of a multilayer circuit board (PCB) accurately predicts the transmission characteristics of the transmission lines by establishing a parameter model for the interlayer transmission lines of the PCB and calculating the electromagnetic field distribution based on the deformed telegraph equation and the parallel plate resonance effect. By optimizing production environment parameters, such as selecting areas with electric field strength below 45% of the maximum value as preferred wiring areas and adjusting ambient temperature, humidity, and electromagnetic shielding layer thickness, the impact of the external environment on the PCB's performance is effectively reduced, thereby improving the PCB's stability and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] To reveal the technical details of the embodiments of the present invention, the following is a brief introduction to the drawings involved in the embodiments. It should be emphasized that these drawings only illustrate several embodiments of the present invention and should not be considered as defining the scope of the invention. Those skilled in the art can deduce other relevant drawings based on these drawings without engaging in creative work.

[0024] Figure 1 This is a flow chart of the first embodiment of the present invention; Figure 2 is the transfer matrix expression; Figure 3 This is a structural diagram of the circuit board production process control system. DETAILED DESCRIPTION

[0025] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0026] In the following, embodiments of the present disclosure are described in detail with the aid of accompanying drawings. However, please be aware that the present disclosure is not limited to the specific forms shown herein. Rather, it should be understood to encompass various variations, equivalents, and / or alternatives to the embodiments of the present disclosure. In describing the drawings, the same reference numerals will be used to indicate similar components.

[0027] It should be understood that while the following description provides extensive specific details intended to facilitate a comprehensive understanding of the example embodiments, those skilled in the art will appreciate that the example embodiments can be implemented without these specific details. For example, systems may be presented in block diagram form to avoid excessive detail that would obscure the clarity of the examples. In other cases, unnecessary details regarding well-known processes, structures, and techniques may be omitted to maintain clarity of the examples.

[0028] like Figure 1 As shown, a circuit board production process control method based on multi-layer circuits includes the following contents: S1. Establish a parametric model for interlayer transmission lines in a multilayer PCB: Based on the deformed telegraph equation under the influence of an external electromagnetic field and the parallel plate resonance effect between the power and ground layers, calculate the electromagnetic field distribution of transmission lines at different heights and generate a transmission matrix that includes the transmission line height term. S2. Perform transmission characteristics simulation verification; S3. Optimize production environment parameters: Based on simulation results, extract the electric field intensity distribution at the resonant frequency and select areas where the electric field intensity is less than 45% of the maximum value as the preferred wiring areas. Adjust the ambient temperature to 20-25°C, the humidity to 30-50%, and the electromagnetic shielding layer thickness to ≥3mm. S4. Implement a layered routing strategy: For single-line, multi-line, and differential line systems, optimize inter-layer routing paths based on the transmission matrix calculation results, ensuring that transmission lines are close to the ground plane and ports are located in areas of low electric field strength. S5. Dynamically monitor production data: Real-time data collection of temperature, humidity, and electromagnetic radiation in the processing area is used to dynamically adjust processing parameters based on transmission matrix correction values. S6. Wastewater Treatment and Environmental Control: Detect the CODcr content of production wastewater. If it exceeds the standard, trigger recycling treatment and discharge it after it meets the standard. Through wastewater treatment and environmental control, the CODcr content of production wastewater is detected and recycled to ensure that the wastewater meets the standard before discharge, meeting environmental protection requirements and contributing to environmental protection and sustainable development.

[0029] This embodiment establishes a parameter model of the interlayer transmission lines of a multilayer circuit board, combines the deformed telegraph equation and the parallel plate resonance effect under the action of an external electromagnetic field, and can accurately calculate the electromagnetic field distribution of transmission lines of different heights, generate a transmission matrix containing the transmission line height term, and provide accurate data support for subsequent steps. By performing transmission characteristic simulation verification, problems in the design can be discovered and solved in a timely manner, avoiding rework or scrapping in the actual production process, thereby improving production efficiency. By optimizing the production environment parameters, selecting areas with electric field strength below 45% of the maximum value as the preferred wiring area, and adjusting the ambient temperature, humidity, and electromagnetic shielding layer thickness, the production quality of the circuit board can be ensured and the stability and reliability of the product can be improved.

[0030] In a preferred embodiment, the transfer matrix expression (see Figure 2 )for:

[0031] in: for n × n The identity matrix represents the ideal transmission characteristics of the transmission line when there is no coupling; for n × n Zero matrix, used to represent the situation where there is no electric or magnetic field coupling; , , , (called K matrix) is the parallel plate electric field coupling coefficient matrix, both n × n Matrix, representing the electric field coupling relationship between the power layer and the ground layer; : Coupling of the input electric field to the input voltage (self-coupling). : Coupling of the electric field at the input to the current at the output (cross-port coupling). : Coupling of the output electric field to the input current (cross-port coupling). : Coupling of the output electric field to the output voltage (self-coupling).

[0032] is the transfer coefficient of the output voltage to the input voltage (voltage gain when there is no coupling). is the transfer coefficient of the output current to the input voltage (including impedance characteristics). is the transfer coefficient of the output voltage to the input current (including the admittance characteristics). is the transfer coefficient of the output current to the input current (current gain when there is no coupling). The voltage-current transmission characteristics of the transmission line itself are related to the length of the transmission line. Correlation. Basic cascade matrix , , , Still determined by the transmission line length and propagation characteristics.

[0033] For a single transmission line, the parameters of the cascade matrix (ABCD matrix) , , , and transmission line length The relationship is as follows: For a single transmission line, the expression of the cascade matrix is:

[0034] in, is the propagation constant ( is the decay constant, is the phase constant); is the characteristic impedance; where is the resistance per unit length, is the inductance per unit length, is the conductance per unit length, is the capacitance (capacitance per unit length), is the angular frequency. At low frequencies, the resistance and conductivity Dominant, signal attenuation is significant; at high frequencies, inductance and capacitors Dominant, skin effect and dielectric loss enhancement. is the transmission line length. , Represents the phase delay and attenuation of voltage and current (hyperbolic cosine function); , Represents the coupling effect of impedance (hyperbolic sine function).

[0035] For n transmission lines, the cascade matrix expands to a block matrix:

[0036] Each submatrix ( ) are Matrix, the specific expression is: , , , in: is the propagation constant in matrix form; is the characteristic impedance matrix; are the resistance, inductance, conductance, and capacitance matrices per unit length respectively.

[0037] Parallel plate coupling correction: In multilayer circuit boards, the coupling effect of the external parallel plate resonant field is adjusted by adjusting the cascade matrix through the correction matrix K:

[0038] For the The height of the transmission line from the ground plane, is the thickness of the parallel plate dielectric layer. It reflects the relative position of the transmission line in the interlayer structure. increases (the transmission line is close to the power layer), the electric field coupling effect is enhanced; when The K matrix represents the electric field coupling effect between the power layer and the ground layer, where , , , , is the diagonal matrix of transmission line height terms, i.e. diag( . For the The vertical height of the transmission line to the ground plane, is 1, 2, ..., . is the thickness of the parallel plate dielectric layer between the power layer and the ground layer.

[0039] The transfer matrix is ​​converted into an S-parameter matrix, and the calculation formula is:

[0040] in: is the impedance matrix, is the port characteristic impedance (usually 50Ω, assumed to be the same for all ports), is the identity matrix. Represents the superposition of the impedance matrix and the characteristic impedance, and the inverse is Multiply them together to get the scattering matrix S.

[0041] In one embodiment, the transmission characteristic simulation verification is to confirm the accuracy of the theoretical model (transmission matrix and S parameters) through simulation and quantify its matching degree with the actual scenario. Generate Impedance Matrix , substitute the formula to calculate the S parameter matrix; check whether the conversion process meets the matrix operation rules (such as the existence of the inverse matrix and the consistency of dimensions); verify the symmetry of the S parameters (such as Verify the electric field intensity distribution under the parallel plate resonance effect. Calculate the electric field distribution at the resonant frequency point (such as the resonant frequency of the TM mode) using the transmission matrix. Compare the electromagnetic field simulation results of simulation software (such as HFSS, CST) to ensure the consistency of the peak position and amplitude of the electric field intensity. Check whether the area where the electric field intensity is less than 45% of the maximum value is consistent with the theoretically predicted "wiring preferred area". Verify the amplitude and phase characteristics of the S parameters. Key parameters include the reflection coefficient S 11 (Verify whether the input end reflection loss matches the theory) and the transmission coefficient S 21 (verify whether signal attenuation and delay are reasonable) and crosstalk coefficient (verify the crosstalk level in multi-line systems), comparing theoretical calculations with frequency domain simulation results from commercial tools (such as ADS and SIwave). Time domain reflectometry (TDR) is used to measure the reflection waveform of the actual circuit board to verify the consistency of the time domain response. In addition, the applicability of different transmission line configurations is verified. For single-line systems, the height of the transmission line is verified. Characteristics when changing (such as Differential line system: Verify the physical port spacing Common mode rejection ratio (CMRR) when the differential line and the single-ended line coexist. Hybrid system: Signal isolation when differential lines and single-ended lines coexist. The verification method includes: adjusting the transmission line parameters (height, spacing), generating multiple sets of S parameters and comparing simulation results, and analyzing the parameter change trend at key frequency points (such as resonant frequency, signal bandwidth). Finally, the consistency between the theoretical model and the actual test can be verified. Use a vector network analyzer (VNA) to measure the S parameters of the actual circuit board (such as S 11 and S 21 Extract the amplitude and phase data of the resonant frequency point and calculate the deviation from the theoretical value (if the deviation is >15%, mark it as abnormal). Analyze the processing data of abnormal batches to locate the source of model error (such as material parameter error, insufficient correction of coupling coefficient).

[0042] In a preferred embodiment, the construction of the deformed telegraph equation described in S1 includes: using the electromagnetic field generated by the resonance of the parallel plates as an external excitation source, modifying the definition of the transmission line voltage through the Agrawal model, and combining the equivalent voltage source / current source expression of the Taylor model to derive the cascade matrix of the interlayer transmission line. In a multi-layer circuit board, a structure similar to an "electromagnetic resonant cavity" is formed between the power layer and the ground layer. When the transmission line passes through this structure, the electromagnetic field generated by the resonance will interfere with the signal transmission. S1 constructs a deformed telegraph equation by combining two models (Agrawal model and Taylor model) to accurately quantify this interference. The deformed telegraph equation adds a coupling term of the external electromagnetic field to the traditional equation, and includes the following corrections: Voltage correction (Agrawal model): The component of the external electric field in the direction perpendicular to the transmission line will change the voltage definition and introduce an equivalent voltage source. Current correction (Taylor model): The external magnetic field generates an equivalent current source through the mutual inductance effect. The corrected equation is in the form of: , in and are the equivalent voltage source and current source caused by the external field, respectively.

[0043] This embodiment uses the external excitation source modeling to treat the electromagnetic field generated by the resonance of the parallel plates between the power and ground planes as an external excitation source, similar to "background noise." While conventional transmission line voltage correction (Agrawal model) only considers the inherent signal, the Agrawal model incorporates the influence of external electric fields, revising the voltage definition and clarifying how external electromagnetic fields "push up" or "pull down" the transmission line voltage. Combined with the equivalent circuit conversion (Taylor model), the complex electromagnetic field coupling effects are simplified into equivalent voltage and current sources within the circuit, intuitively reflecting the interference path of the resonant field on the transmission line. This invention also introduces a height term, quantifying the height ratio of the transmission line to the ground plane (e.g., line height / dielectric thickness), to dynamically adjust model parameters and adapt to complex routing scenarios with varying inter-layer heights. This mathematical model, which incorporates both the transmission line's inherent characteristics and external resonance effects, provides a theoretical basis for optimized routing (e.g., avoiding high electric field areas), thereby improving signal integrity and interference immunity.

[0044] In a preferred embodiment, the layered wiring strategy described in S4 is specifically: for differential transmission line systems, a dense layout with a physical port spacing of ≤5mm is adopted; for single-line systems, the height of the transmission line from the ground layer is set to ≤1 / 3 of the interlayer dielectric thickness.

[0045] A dense layout of differential transmission line systems, in which two signal lines transmit signals in a complementary manner (positive and negative symmetry), is crucial. A compact layout, with physical port spacing kept to ≤5mm, effectively reduces signal loop area and reduces susceptibility to electromagnetic radiation and external interference. This close arrangement also enhances the symmetry of differential pairs, reduces common-mode noise, and improves signal interference immunity. This design is particularly suitable for high-speed signal transmission (such as USB and HDMI), preventing distortion caused by signal delay mismatch. For single-line systems, the height between transmission lines and the ground plane must be ≤ 1 / 3 of the interlayer dielectric thickness. Routing close to the ground plane significantly reduces the electric field coupling between the transmission line and the power plane, reducing signal loss and crosstalk. Furthermore, the shielding effect of the ground plane suppresses external electromagnetic interference and improves signal integrity. This strategy optimizes electric field distribution and places transmission lines in low-interference areas, thus balancing signal stability and routing space utilization.

[0046] In another embodiment, in a multi-layer circuit board design, the above-mentioned layered wiring strategy primarily provides preliminary constraints for single-line and differential line systems. However, in actual engineering, it is also necessary to address the impact of multi-line systems, high-frequency scenarios, and complex environments. This embodiment further improves signal integrity (SI) and electromagnetic compatibility (EMC). The layout rules for multi-line systems are supplemented. For non-differential multi-line systems (such as parallel single-ended line groups), the spacing between adjacent transmission lines must be controlled to be ≥ 3 times the line width. This rule suppresses crosstalk effects by reducing inter-line coupling capacitance. At the same time, in a multi-layer board, transmission lines in adjacent signal layers should be orthogonally wired (vertically crossed) to avoid inter-layer electric field coupling caused by parallel routing, thereby reducing signal attenuation and noise interference.

[0047] Furthermore, differential line strategies must be refined and dynamically adjusted. Physical port spacing within differential line systems must be kept within a compact layout of ≤5mm to enhance symmetry and reduce common-mode noise. However, near resonant frequencies (such as the TM mode resonant frequency), if the electric field strength exceeds 45% of its maximum value, the spacing can be locally relaxed to 8mm to avoid high-interference areas. For differential lines with curved paths or asymmetrical layouts, it is recommended to add common-mode chokes or termination resistors at the ports to compensate for phase shifts and improve signal quality.

[0048] To expand single-line height restrictions and prioritize low noise, single-line systems must limit the height of the transmission line from the ground plane to ≤ 1 / 3 the dielectric thickness to reduce electric field coupling with the power plane. For high-frequency scenarios (>5 GHz), it is recommended to further reduce the height to ≤ 1 / 4 the dielectric thickness to minimize high-frequency skin effect and TM mode resonance. Furthermore, at the resonant frequency, single lines should be routed in low-noise areas where the electric field strength is <30% of the maximum value. This optimizes the electric field distribution to improve interference immunity.

[0049] Dynamic parameter adjustment is optimized for high-density boards. An environmental feedback control mechanism is introduced to monitor the processing area's temperature and humidity (20-25°C, 30-50% RH) and electromagnetic radiation intensity in real time, dynamically adjusting transmission line height and spacing. For high-density boards with 20 or more layers, a segmented transmission matrix model is used, iteratively updating parameters based on actual layer heights. This allows for compatibility with through-hole effects and complex routing scenarios, ensuring model accuracy and processing consistency.

[0050] Hybrid system collaborative design and shielding optimization: In mixed areas where differential and single-ended lines coexist, an isolation zone width ≥ 2 times the dielectric thickness is set, and ground vias are densely packed within the isolation zone to block cross-coupling paths. For transmission lines between the power and ground planes, a grid-like shield layer (thickness ≥ 3mm) is used. Distributed grounding reduces parallel plate resonance effects while optimizing power integrity and thermal stability.

[0051] The optimized layered wiring strategy covers single-line, differential line, multi-line and hybrid systems. By quantifying parameter rules, introducing a dynamic feedback mechanism, and expanding to high-density multi-layer board scenarios, it significantly improves the stability and anti-interference ability of signal transmission.

[0052] In a preferred embodiment, the dynamically adjusting processing parameters in S5 includes: When the electromagnetic radiation intensity is detected to exceed the threshold, the processing speed is automatically reduced and the real-time recalculation of the transmission matrix is ​​triggered to update the wiring path planning.

[0053] During the multilayer PCB production process, the system uses sensors to collect real-time data on the processing area, including temperature, humidity, and electromagnetic radiation intensity. If the detected electromagnetic radiation intensity exceeds a preset threshold (for example, the peak field intensity at the resonant frequency), it indicates that the current environment may cause signal interference or parallel plate resonance, leading to transmission line performance degradation. At this point, the system immediately initiates a dynamic adjustment mechanism: it automatically reduces the robot's processing speed to reduce electromagnetic noise generated by high-speed motion. Simultaneously, based on real-time environmental data, it triggers a recalculation of the transmission matrix, updates the coupling coefficient and electric field distribution model, and generates a new, low-interference routing path. This updated path prioritizes avoiding high electric field areas and optimizes the height ratio between the transmission line and the ground plane to ensure signal integrity. The entire process achieves adaptive adjustment through closed-loop feedback, suppressing electromagnetic interference while ensuring processing accuracy and efficiency.

[0054] In a preferred embodiment, the CODcr content in S6 is calculated using a multi-sensor fusion formula:

[0055] in: , , These are the measured values ​​of the national standard method, tester and spectrophotometer respectively; , , is the weight coefficient, and .

[0056] In the treatment of wastewater from multilayer circuit board production, accurate measurement of chemical oxygen demand (CODcr) is crucial for achieving environmental compliance. Traditional single-sensor detection methods are susceptible to operational errors or equipment precision limitations, leading to measurement deviations. To address this, the S6 step proposes a multi-sensor fusion algorithm that weightedly integrates the measurements from three detection methods to improve the reliability and stability of the test results.

[0057] First, multi-source data collection. National standard method (HL1): Based on standard chemical titration, the results are accurate but time-consuming, and suitable for laboratory environments. Rapid tester (HL2): Real-time measurement through electrochemical sensors, fast but easily affected by water quality fluctuations. Spectrophotometer (HL3): Utilizes spectral analysis of absorbance at specific wavelengths, suitable for low-concentration detection, but requires regular calibration. This embodiment adopts a dynamic weight allocation strategy. Based on experimental data and equipment performance evaluation, a weight coefficient (such as k1=0.5, k2=0.3, k3=0.2) is assigned to each method, and the total is 1. A high weight (k1) is assigned to the national standard method to ensure benchmark accuracy; the rapid tester (k2) and spectrophotometer (k3) supplement real-time and anti-interference capabilities.

[0058] The measured values ​​from the three methods are weighted and superimposed to generate a composite HL indicator. If a single method shows an anomaly (e.g., a sudden increase in HL2), the fused result is automatically corrected using the other methods, reducing the risk of misjudgment. If HL exceeds the standard, wastewater recycling is triggered until it is retested and released after meeting the standard. Multi-sensor fusion technology, leveraging its complementary strengths, addresses the challenges of traditional methods in achieving a balance between accuracy, speed, and interference resistance, while also reducing the impact of human intervention and providing high-confidence data support for environmental management and control.

[0059] In a preferred embodiment, the system also performs physical wafer testing on completed circuit boards, comparing the deviation between simulated S-parameters and measured results. If the deviation exceeds 15%, the batch is marked as abnormal and the processing data is backtracked. After multilayer circuit board production is complete, the system verifies product performance through physical wafer testing. The core of this testing is to compare the consistency of simulated S-parameters with measured S-parameters to assess whether signal integrity and electromagnetic compatibility meet design requirements.

[0060] This embodiment provides a test process, including signal integrity testing: using a vector network analyzer (VNA) to measure the S parameters of the circuit board (such as the reflection coefficient S 11 , transmission coefficient S 21), covering key frequency bands (such as resonant frequency and signal bandwidth). Data comparison: Compare the amplitude and phase of the measured S parameters with the simulation results, and calculate the deviation. If the deviation is greater than 15%, it is considered an abnormal batch.

[0061] In terms of deviation handling and backtracking mechanism, we use abnormal marking. The system automatically marks abnormal batches, suspends subsequent processing, and triggers alarm prompts. Data backtracking, retrieves the production data of abnormal batches (such as temperature and humidity, electromagnetic shielding layer thickness, wiring path), and combines the transmission matrix model to analyze the root cause of the deviation. If the resonant frequency shifts, it may be due to insufficient correction of the parallel plate coupling matrix or fluctuations in the processing environment. Parameter correction: Dynamically update the model parameters (such as coupling coefficient) based on the backtracking results. , height item ), regenerate the transmission matrix, and optimize subsequent production strategies. Through a closed-loop mechanism of real-time testing, comparison, and correction, the system achieves adaptive optimization, ensuring that the signal performance of each batch of circuit boards closely matches the simulation model. This data is accumulated for process improvement, improving overall yield and production efficiency.

[0062] In a preferred embodiment, the physical wafer test includes: measuring the port reflection coefficient S by a vector network analyzer 11 and transmission coefficient S 21 , extracting the amplitude and phase deviation data at the resonant frequency point. Physical circuit testing verifies the consistency of the circuit board's actual signal performance with the design simulation by measuring it. The test uses a vector network analyzer (VNA) to input a high-frequency signal into the circuit board and detect its response, focusing on two key parameters: reflection coefficient (S 11 ) and the transmission coefficient (S 21 ). Reflection coefficient (S 11 ) reflects the proportion of the signal reflected at the input port. If S 11 If the value is too high, it means that the signal fails to enter the circuit board effectively, which may cause energy loss due to impedance mismatch or circuit design defects. 21 ) measures the transmission efficiency of the signal from the input port to the output port. If S 21 If the value is too low, it means that the signal is severely attenuated during transmission, which may be caused by line loss or electromagnetic interference.

[0063] During the test, the VNA will scan the key frequency bands of the circuit board (such as the resonant frequency) and record the S 11 and S 21Amplitude and phase data. The resonant frequency is the frequency at which electromagnetic resonance occurs on a circuit board due to its interlayer structure. The signal characteristics at this frequency are particularly sensitive to electromagnetic compatibility (EMC) and signal integrity (SI). During deviation analysis and exception handling, the measured data is compared with the simulation results. If the deviation exceeds 15% (such as resonant frequency offset or abnormal signal attenuation), the system automatically marks it as an abnormal batch. At this time, the production data for that batch (such as temperature and humidity, shielding layer thickness, and wiring path) is retrieved and combined with the transmission matrix model to analyze the root cause of the deviation. For example, the resonant frequency offset may be due to insufficient correction of the parallel plate coupling matrix or fluctuations in the processing environment. Through a closed-loop feedback loop of test-comparison-correction, the system dynamically updates model parameters (such as coupling coefficient and height term) to optimize subsequent production strategies. For example, the transmission line height or spacing is adjusted to avoid high-interference areas to ensure that the performance of each batch of circuit boards is highly consistent with the simulation, ultimately improving product yield and production efficiency.

[0064] In a preferred embodiment, S4 also includes: for high-density circuit boards with more than 20 layers, a segmented transfer matrix cascade method is used to model the via effect as a parallel LC circuit and incorporate it into the overall transfer matrix calculation. In high-density circuit boards with more than 20 layers, the wiring paths are complex and the via effect is significant, making it difficult for traditional modeling methods to accurately describe signal transmission characteristics. To this end, a segmented transfer matrix cascade method is used to decompose the entire circuit board into multiple sub-segments (e.g., by layer or functional area), with each segment independently modeling a transmission matrix. The transfer matrices of each sub-segment are cascaded and multiplied to obtain the overall transmission characteristics, similar to "building blocks." This method reduces computational complexity while allowing optimization for different interlayer structures (e.g., power and ground layers).

[0065] Modeling and compensating for via effects. Vias (metal holes that vertically connect different layers) introduce parasitic inductance (L) and capacitance (C) during high-frequency signal transmission, leading to signal reflections and delays. To address this issue, vias are treated as parallel LC circuits, with their parameters extracted through electromagnetic simulation or field measurements. The smaller the via diameter, the greater the parasitic inductance; the thinner the dielectric layer, the more significant the parasitic capacitance. By embedding the LC circuit model into a segmented transmission matrix, the impact of vias on signal integrity can be accurately quantified.

[0066] This embodiment utilizes segmented modeling to flexibly handle varying interlayer heights (such as transmission lines near power or ground planes) and material parameter variations. At resonant frequencies (e.g., TM mode), the LC model of the via reveals peak signal attenuation, guiding optimization of via placement or the addition of ground vias to bypass interference. The segmented model supports parallel computing, significantly reducing simulation time for high-density boards, while also enabling iterative parameter optimization (e.g., adjusting line width and spacing).

[0067] By combining the segmented transfer matrix cascade method with the through-hole LC model, signal integrity analysis for high-density multilayer boards achieves both accuracy and efficiency. This method provides a systematic solution for interlayer routing, through-hole design, and electromagnetic compatibility optimization for complex circuit boards with more than 20 layers, particularly suitable for high-frequency scenarios such as 5G communications and high-performance computing.

[0068] A circuit board production process control system based on multi-layer circuits (see Figure 3 ),include: Modeling module: used to build the interlayer transmission line parameter model and generate the transmission matrix based on the deformed telegraph equation and parallel plate resonant field; Simulation module: connects to the modeling module, converts the transmission matrix into an S-parameter matrix and performs signal integrity and electromagnetic compatibility simulation; Environmental control module: Receives output data from the simulation module and dynamically adjusts the temperature and humidity, electromagnetic shielding parameters, and optimal wiring area of ​​the processing area; Wiring optimization module: Generates a layered wiring plan based on the calculation results of the transmission matrix to control the differential line port spacing and the height between single line layers; Production management module: monitors processing data in real time and feeds it back to the modeling module, triggering dynamic correction of the transmission matrix; Wastewater treatment module: detects CODcr content in wastewater and controls the circulation treatment process.

[0069] This embodiment includes multiple modules, including the modeling module: transmission line parameter modeling and matrix generation. This module constructs an interlayer transmission line model using a modified telegraph equation. The system considers the parallel plate resonance effect between the power and ground planes as an external excitation source, combines the Agrawal model to modify the voltage definition, and generates a transmission matrix that includes transmission line height terms (such as the line height / dielectric thickness ratio). This matrix quantifies the electromagnetic coupling characteristics at different interlayer heights.

[0070] Simulation module, signal integrity and electromagnetic compatibility verification. Based on the transmission matrix generated by the modeling module, the system converts it into an S parameter matrix (such as the reflection coefficient S 11 , transmission coefficient S 21 ), simulating signal transmission loss, crosstalk, and electric field distribution at resonant frequencies. By comparing simulation results with preset thresholds (e.g., electric field strength ≤ 45% of maximum value), high-risk areas are identified, providing data support for environmental control and wiring optimization.

[0071] The environmental control module is responsible for dynamic parameter optimization and interference suppression. Based on simulation results, this module automatically adjusts the processing area's temperature and humidity (20-25°C, 30-50% RH) and the thickness of the electromagnetic shielding layer (≥3mm) to ensure a stable production environment. Furthermore, based on electric field distribution data, it identifies optimal wiring areas (low electric field intensity zones) to physically reduce resonant interference.

[0072] The line optimization module implements layering strategies and parameter constraints. Based on transmission matrix calculations, the system implements a dense layout with port spacing ≤5mm for differential line systems to suppress common-mode noise. For single-line systems, the height of the transmission line from the ground plane is limited to ≤1 / 3 of the dielectric thickness to reduce crosstalk risk. For high-density boards with more than 20 layers, a segmented transmission matrix cascade method is used to model the via effect as a parallel LC circuit to optimize complex wiring scenarios.

[0073] The production management module provides real-time monitoring and closed-loop feedback. Sensors collect real-time data on temperature, humidity, and electromagnetic radiation within the processing area, dynamically modifying transmission matrix parameters (such as the coupling coefficients K11 / K12) and updating wiring paths. If electromagnetic radiation exceeds limits, the processing speed is automatically reduced and matrix recalculation is triggered, forming a closed-loop control system of monitoring, feedback, and correction to ensure batch consistency.

[0074] The treatment module performs environmental control and recirculating purification. The system monitors the CODcr content of production wastewater, utilizing a multi-sensor fusion algorithm (national standard method + tester + spectrophotometer weighted calculation) to improve detection accuracy. If the measured value exceeds the standard, a recirculating treatment process is triggered until the discharge meets the standard. Through cross-domain integration, the module achieves synergy between electromagnetic compatibility design and environmental control.

[0075] Through modular design and closed-loop data flow, the system transforms theoretical models into executable engineering strategies, significantly improving the signal integrity (SI), electromagnetic compatibility (EMC), and environmental compliance of multi-layer PCB production.

[0076] In a preferred embodiment, the modeling module specifically includes: an electric field calculation unit for solving the TM mode electric field distribution of the parallel plate resonant cavity; a matrix generation unit for generating a transmission matrix containing a height term based on the coupling equation of the Agrawal model and the Taylor model The function of the electric field calculation unit is to solve the TM mode electric field distribution of the parallel plate resonant cavity. In a multilayer circuit board, the power layer and the ground layer form a structure similar to an "electromagnetic resonant cavity". When the signal passes through the transmission line, it will stimulate the resonance effect between the parallel plates, generating a specific mode of electromagnetic field (such as the TM mode). This electric field distribution is similar to a standing wave, and its intensity is closely related to the resonant frequency, the position of the transmission line, and the thickness of the interlayer dielectric. Through numerical calculation and Green's function expansion, the unit can quantify the electric field intensity around transmission lines of different heights.

[0077] The matrix generation unit constructs a transmission matrix including height terms by integrating the Agrawal model and the Taylor model based on the electric field calculation results. Agrawal model: Modifies the traditional definition of transmission line voltage, equates the influence of external electric field to voltage source, and quantifies the coupling effect between signal line and parallel plate electric field. Taylor model: Simplifies the complex external electromagnetic field coupling to equivalent current source, and intuitively describes the interference path of resonant field on transmission line. Height term integration: By introducing the proportional term of transmission line height and dielectric thickness (such as ), dynamically adjust the model parameters to accurately reflect the transmission characteristics of different inter-layer heights.

[0078] This example calculates the electric field distribution of a parallel plate resonant cavity and identifies high interference areas (e.g., electric field peaks at the resonant frequency). The voltage correction of the Agrawal model and the current source equivalence of the Taylor model are combined to generate an initial transmission matrix. Based on the actual position of the transmission line, the coupling coefficients in the matrix are corrected to generate the final transmission matrix. .

[0079] In a preferred embodiment, the environmental control module includes: an electric field mapping unit that generates a heat map of the electric field intensity distribution at the resonant frequency; and a parameter execution unit that uses the heat map to identify low-electric field regions and control the temperature and humidity control equipment and electromagnetic shielding device. The electric field mapping unit receives electric field distribution data from the simulation module to generate a heat map of the electric field intensity distribution at the resonant frequency. The heat map visually identifies different regions of electric field intensity using color depth (e.g., red represents high electric field regions, blue represents low electric field regions). Based on the parallel plate resonance effect, the system automatically identifies regions where electric field intensity exceeds a safety threshold (e.g., 45% of the maximum value) and marks them as potential interference sources. This process converts discrete simulation data into a continuous, visual heat map using a spatial interpolation algorithm. The parameter execution unit uses the heat map to identify low-electric field regions (electric field intensity ≤ 45% of the maximum value) and coordinates the production equipment to perform the following operations: Temperature and humidity control: The processing area is maintained at a constant temperature of 20-25°C and humidity of 30-50% RH to reduce signal offset caused by thermal expansion and moisture absorption of the material. Electromagnetic Shielding Control: Automatically adjusts the thickness of the electromagnetic shielding layer to ≥3mm to suppress the penetration of external electromagnetic interference into high-electric-field areas. Dynamic Area Locking: Confines the wiring path to low-electric-field areas to avoid signal attenuation caused by resonance effects.

[0080] The present invention receives electric field distribution data from a simulation module and real-time environmental sensor data. It compares the electric field strength threshold and, if exceeded, triggers an alarm and suspends processing in high-risk areas. A PLC controller adjusts the operating parameters of the air conditioner, humidifier, and electromagnetic shielding material spraying equipment. It updates the thermal map in real time and dynamically adjusts the shielding strategy to ensure a consistently low-interference production environment. By synergizing electric field mapping with parameter execution, the system effectively reduces electromagnetic radiation at the resonant frequency (by over 30%) while improving signal transmission stability.

[0081] In a preferred embodiment, the wiring optimization module specifically includes: a differential line controller, which configures a compact layout with a physical port spacing of ≤5mm; a single line optimizer, which uses the formula Set the transmission line height ( is the line height, is the interlayer dielectric thickness). Differential line controllers use a compact layout to suppress common-mode noise. In a differential transmission line system, two signal lines transmit signals in a complementary manner (positive and negative symmetry). By maintaining a compact layout with physical port spacing of ≤5mm, the signal loop area can be significantly reduced, thereby reducing susceptibility to electromagnetic radiation and external interference. Tight layout enhances the symmetry of differential pairs, reduces phase differences caused by path asymmetry, and suppresses the generation of common-mode noise. For example, in high-speed signal transmission (such as USB and HDMI), a compact layout can avoid waveform distortion caused by signal delay mismatch and improve signal integrity (SI). Single-line optimizer uses height restrictions to reduce electric field coupling. For single-line systems, the height of the transmission line from the ground plane must meet the requirement of h ≤ 1 / 3 of the dielectric thickness (d). By routing the transmission line close to the ground plane, the vertical electric field coupling strength between it and the power plane can be reduced, thereby reducing signal loss and crosstalk risk. The ground plane also provides shielding, suppressing external electromagnetic field interference. For example, when the dielectric thickness is 0.6 mm, the transmission line height is limited to 0.2 mm, which can reduce the electric field coupling intensity to less than 15% of the original value.

[0082] Furthermore, the wiring optimization module also includes a multi-line system controller that configures the spacing between adjacent transmission lines to be ≥3 times the line width and an orthogonal wiring layout for adjacent signal layers; a dynamic adjustment unit that relaxes the multi-line spacing to 8mm near the resonant frequency point and enables a segmented transmission matrix model; and a hybrid system isolation unit that sets an isolation zone ≥2 times the dielectric thickness and fills ground vias in the area where differential lines and single lines coexist, while also configuring a grid-like shielding layer (≥3mm thick) for the transmission lines between the power supply and ground layers. The multi-line system controller and the dynamic adjustment unit work together to dynamically optimize the wiring path by real-time monitoring of electric field strength, ensuring signal integrity and electromagnetic compatibility for high-density circuit boards.

[0083] In a preferred embodiment, the wastewater treatment module includes a multi-sensor fusion unit that measures CODcr in parallel using the national standard method, a tester, and a spectrophotometer; and a circulating treatment controller that activates an electrolytic treatment device when CODcr exceeds the standard until it reaches the standard. The multi-sensor fusion unit accurately detects CODcr content, measuring chemical oxygen demand (CODcr) in parallel using three methods: the national standard method, a rapid tester, and a spectrophotometer. The national standard method is based on chemical titration, which is accurate but time-consuming and suitable for laboratory calibration. The rapid tester uses an electrochemical sensor for real-time measurement, which is fast but susceptible to interference from water quality fluctuations. The spectrophotometer uses spectral analysis to measure absorbance at specific wavelengths, making it suitable for low-concentration detection but requiring regular calibration. The system assigns dynamic weights to each method (e.g., 50% for the national standard method, 30% for the tester, and 20% for the spectrophotometer). Through weighted fusion, a composite CODcr value is generated, ensuring baseline accuracy while improving interference resistance.

[0084] The circulating treatment controller features intelligent purification and closed-loop feedback. When the combined CODcr value exceeds the environmental threshold, the controller immediately activates the electrolytic treatment unit. The electrolytic cell decomposes organic matter in the wastewater through electrode reactions, simultaneously oxidizing heavy metal ions and reducing pollutant concentrations. During the treatment process, the system monitors CODcr changes in real time and dynamically adjusts the electrolysis current intensity and treatment duration. If CODcr values ​​still exceed the standard after retesting, a multi-stage treatment cycle (such as adding ozone aeration or activated carbon adsorption) is initiated until the CODcr value meets the standard. Once the standard is met, the electrolytic unit automatically shuts down and records the data for process optimization.

[0085] Through multi-sensor fusion and closed-loop control, the system overcomes the inaccuracy and slow response of traditional single-detection methods, while also avoiding energy waste caused by excessive processing. Furthermore, data is uploaded to the production management module in real time, providing traceable records for environmental compliance.

[0086] In a preferred embodiment, when the production management module dynamically modifies the transmission matrix, the parameters are updated using the following formula:

[0087] The matrices with the “'” symbol are the parameters corrected based on the real-time monitoring data.

[0088] The production management module monitors key parameters of the processing environment in real time, such as temperature, humidity, and electromagnetic radiation intensity, and dynamically adjusts the transmission matrix model to ensure that the signal transmission characteristics of the multi-layer circuit board match the actual environment.

[0089] Real-time data collection and threshold determination: the sensor continuously collects the temperature (20-25°C), humidity (30-50% RH) and electromagnetic radiation intensity of the processing area. If the monitored parameters exceed the preset threshold (such as temperature fluctuation of ±2°C or radiation intensity exceeding 45% of the maximum value), the system determines that the current transmission matrix is ​​no longer applicable and needs to trigger dynamic correction. Transmission matrix correction: adjust the inductance (L), capacitance (C) and other parameters of the transmission matrix according to the environmental data. If the high temperature causes the medium to expand, the capacitance value increases, and the formula needs to be updated. Coupling coefficient correction: The electromagnetic field coupling effect (such as K11 and K21) generated by parallel plate resonance is significantly affected by temperature and humidity. The system dynamically adjusts the real-time electric field distribution data. (transverse coupling coefficient) and (Longitudinal Coupling Coefficient), quantifies the effect of environmental disturbances on the transmission line.

[0090] Matrix reorganization and inverse operation: Substitute the corrected parameters (A', B', C', D', K11', K12', K21', K22') into the matrix formula and reconstruct the overall transmission matrix through inverse matrix operation This step encodes the effects of environmental changes on the transmission characteristics into the new matrix, ensuring that the model accurately reflects the current physical state. The matrix is ​​sent to the routing optimization module in real time, recalculating low-interference routing paths and interlayer height limits. For example, if the resonant frequency shifts after correction, the system automatically avoids areas of high electric fields and adjusts the spacing or height of transmission lines to reduce signal attenuation and crosstalk risks. This dynamic correction mechanism allows the system to quickly respond to environmental fluctuations (such as sudden changes in workshop temperature and humidity or a surge in electromagnetic interference), keeping signal transmission errors within ±5%, significantly improving the production yield and signal integrity (SI) of high-density PCBs.

[0091] In a preferred embodiment, the S parameter matrix generated by the simulation module is used to evaluate the signal reflection and crosstalk characteristics at the resonant frequency, and the calculation formula is:

[0092] in, is the impedance matrix, is the port characteristic impedance.

[0093] In multi-layer PCB design, the simulation module converts the impedance matrix (Z matrix) into a scattering matrix ( Parameter matrix), evaluate the reflection and crosstalk characteristics of the signal at the resonant frequency. Impedance matrix and port matching, impedance matrix ( ) describes the impedance characteristics between the ports of the circuit, reflecting the direct relationship between voltage and current. Port characteristic impedance ( , typically 50Ω, is a reference value for ideal matching. When the actual impedance matches Z0, signal reflection is minimized; if there is a difference, reflection will occur.

[0094] The parameter matrix directly characterizes the reflection of the signal by quantifying the relationship between the incident wave and the reflected wave (such as S 11 ) and transmission (such as S 21 ) characteristics. S 11 Indicates the reflection coefficient of port 1. The smaller the value, the less signal reflection. 21 This represents the transmission efficiency from port 1 to port 2. A larger value indicates lower signal loss. The conversion formula converts the impedance matrix into a scattering matrix. At the resonant frequency, the circuit's parallel plate structure forms standing waves, resulting in signal reflection or transmission anomalies at specific frequencies. The parameter matrix can quickly locate these frequency points: reflection peak (S 11 Sudden increase: Indicates that the signal is reflected in large quantities at the port due to the sudden change in impedance. Transmission valley value (S 21 Dip): Indicates that the signal is severely attenuated due to resonant coupling or dielectric loss.

[0095] Through analysis The crosstalk coefficient in the parameters (such as S 12 、S 21 ), identify high-interference areas and adjust trace spacing or layer height. Add ground vias or shielding layers at the resonant frequency to reduce electric field coupling strength and improve signal integrity. The parameter matrix quantifies reflection and transmission characteristics, converting complex impedance relationships into an intuitive "signal behavior map", providing key guidance for high-frequency circuit design. It is particularly valuable in suppressing resonant interference and reducing crosstalk.

[0096] The present invention constructs the deformed telegraph equation of the interlayer transmission line through the modeling module, combines the parallel plate resonant field to generate the transmission matrix, and the simulation module converts the matrix into S parameters to evaluate the signal reflection and transmission characteristics. The environmental control module dynamically adjusts the temperature, humidity and shielding parameters based on the electric field thermal map to optimize the low-interference wiring area; the wiring optimization module constrains the height, spacing and interlayer layout for single-line, differential line and multi-line systems respectively to suppress crosstalk and resonance. The production management module monitors the processing data in real time, triggers the dynamic correction of the transmission matrix, and ensures that the model is consistent with the process; the wastewater treatment module integrates multiple sensors to detect CODcr and links the purification cycle. Each module works together through closed-loop feedback, taking into account signal integrity, electromagnetic compatibility and environmental compliance.

[0097] Although the preferred embodiments of the present invention have been described in detail, once those skilled in the art understand the basic innovative concepts, they may make other changes and modifications to these embodiments. Therefore, the appended claims are intended to cover the preferred embodiments and all changes and modifications that fall within the scope of protection of the present invention. The above description is only some preferred embodiments of the present invention and is not intended to limit the scope of the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be deemed to fall within the scope of protection of the present invention.

Claims

1. A method for controlling the production process of a circuit board based on a multi-layer circuit, characterized in that: Includes the following: S1. Establish a parametric model for interlayer transmission lines in a multilayer PCB: Based on the deformed telegraph equation under the influence of an external electromagnetic field and the parallel plate resonance effect between the power and ground layers, calculate the electromagnetic field distribution of transmission lines at different heights and generate a transmission matrix that includes the transmission line height term. S2. Perform transmission characteristics simulation verification; S3. Optimize production environment parameters: Based on simulation results, extract the electric field intensity distribution at the resonant frequency and select areas where the electric field intensity is less than 45% of the maximum value as the preferred wiring areas. Adjust the ambient temperature to 20-25°C, the humidity to 30-50%, and the electromagnetic shielding layer thickness to ≥3mm. S4. Implement a layered routing strategy: For single-line, multi-line, and differential line systems, optimize inter-layer routing paths based on the transmission matrix calculation results, ensuring that transmission lines are close to the ground plane and ports are located in areas of low electric field strength. S5. Dynamically monitor production data: Real-time data collection of temperature, humidity, and electromagnetic radiation in the processing area is used to dynamically adjust processing parameters based on the transmission matrix correction value.

2. The method for controlling the production process of a circuit board based on a multi-layer circuit according to claim 1, characterized in that: The transmission matrix expression is: ， in: for n × n Identity matrix; for n × n Zero matrix; , , , is the parallel plate electric field coupling coefficient matrix; : Coupling of the input electric field to the input voltage; : Coupling of the electric field at the input to the current at the output; : Coupling of the output electric field to the input current; : Coupling of the output electric field to the output voltage; is the transfer coefficient of the output voltage to the input voltage; is the transfer coefficient of output current to input voltage; is the transfer coefficient of output voltage to input current; is the transfer coefficient of the output current to the input current; The transfer matrix is ​​converted into an S-parameter matrix, and the calculation formula is: , in, is the impedance matrix, is the port characteristic impedance, is the identity matrix.

3. The method for controlling the production process of a circuit board based on a multi-layer circuit according to claim 1, characterized in that: The construction of the deformed telegraph equation described in S1 includes: taking the electromagnetic field generated by the parallel plate resonance as the external excitation source, modifying the transmission line voltage definition through the Agrawal model, combining the equivalent voltage source / current source expression of the Taylor model, and deriving the cascade matrix of the interlayer transmission line.

4. The method for controlling the production process of a circuit board based on a multi-layer circuit according to claim 1, characterized in that: The hierarchical wiring strategy described in S4 is specifically: For differential transmission line systems, a dense layout with physical port spacing ≤ 5mm is used; For a single-line system, set the height of the transmission line from the ground layer to ≤ 1 / 3 of the interlayer dielectric thickness.

5. The method for controlling the production process of a circuit board based on a multi-layer circuit according to claim 1, characterized in that: The dynamic adjustment of processing parameters in S5 includes: When the electromagnetic radiation intensity is detected to exceed the threshold, the processing speed is automatically reduced and the real-time recalculation of the transmission matrix is ​​triggered to update the wiring path planning.

6. A method for controlling the production process of a circuit board based on a multi-layer circuit according to any one of claims 1 to 5, characterized in that: Also includes: Perform physical wafer testing on the completed circuit boards and compare the deviation between the simulated S parameters and the measured results. If the deviation is greater than 15%, it is marked as an abnormal batch and the processing data is traced back.

7. The method for controlling the production process of a circuit board based on a multi-layer circuit according to claim 6, characterized in that: The actual wafer test includes: measuring the port reflection coefficient S by a vector network analyzer. 11 and transmission coefficient S 21 , extract the amplitude and phase deviation data of the resonant frequency point.

8. A circuit board production process control system based on multi-layer circuits, characterized in that: include: Modeling module: used to build the interlayer transmission line parameter model and generate the transmission matrix based on the deformed telegraph equation and parallel plate resonant field; Simulation module: connects to the modeling module, converts the transmission matrix into an S-parameter matrix and performs signal integrity and electromagnetic compatibility simulation; Environmental control module: Receives output data from the simulation module and dynamically adjusts the temperature and humidity, electromagnetic shielding parameters, and optimal wiring area of ​​the processing area; Wiring optimization module: Generates a layered wiring plan based on the calculation results of the transmission matrix to control the differential line port spacing and the height between single line layers; Production management module: monitors processing data in real time and feeds it back to the modeling module, triggering dynamic correction of the transmission matrix.

9. A circuit board production process control system based on multi-layer circuits according to claim 8, characterized in that: The modeling module specifically includes: Electric field calculation unit, used to solve the TM mode electric field distribution of the parallel plate resonant cavity; The matrix generation unit generates the transfer matrix including the height term based on the coupled equations of the Agrawal model and the Taylor model .

10. A circuit board production process control system based on multi-layer circuits according to claim 8 or 9, characterized in that: When the production management module dynamically modifies the transmission matrix, the parameters are updated using the following formula: ， The matrices marked with "'" are the parameters corrected based on real-time monitoring data.

Images