Dynamic bacteria inhibition equipment for sludge treatment
By using semiconductor cooling wafers and ultrasonic transducers to control temperature and nitrogen environment in sludge treatment equipment, combined with nano-ceramic coatings and atomizing nozzle cleaning measures, the problem of thermophilic bacteria growth and adhesion during sludge storage was solved, achieving efficient and continuous sludge treatment.
Patent Information
- Application Number
- CN202510766886.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-10
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2045-06-10
AI Technical Summary
Existing sludge treatment equipment suffers from rapid proliferation of thermophilic bacteria during room temperature storage, leading to sludge fermentation and putrefaction, producing pungent odors and harmful gases. At the same time, the sludge's adhesive properties can easily cause equipment blockage, affecting the continuity and efficiency of the treatment process.
A semiconductor cooling chip assembly, combined with a PID temperature controller, is used to maintain the temperature inside the storage chamber at 4±1℃. Combined with a nitrogen environment and an ultrasonic transducer, low-frequency ultrasonic waves are generated. Nitrogen gas is sprayed out through micropores to form a dynamic gas film layer, which inhibits the growth of thermophilic bacteria. The nano-ceramic coating on the inner wall of the storage chamber reduces adhesion, and the atomizing nozzles on the spiral blades generate shear force to remove sludge.
It effectively inhibits the protein synthesis of thermophilic bacteria, reduces their reproduction rate, prevents sludge fermentation and putrefaction, and reduces adhesion through physical isolation and cleaning measures, ensuring the continuity and efficient operation of the sludge treatment process.
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Figure CN120622761B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of sludge treatment technology, and more specifically, relates to a dynamic antibacterial device for sludge treatment. Background Technology
[0002] In the field of environmental protection, sludge treatment is a critical and challenging task. With the continuous expansion of industrial production and wastewater treatment, the amount of sludge generated is increasing day by day. In the sludge treatment process, the storage stage is an important basic step.
[0003] Current dynamic antibacterial equipment for sludge treatment still has some shortcomings:
[0004] 1. Sludge is rich in microorganisms. During storage at room temperature, thermophilic bacteria and other microorganisms multiply rapidly, which can easily cause sludge fermentation and putrefaction, producing pungent odors and harmful gases. This not only pollutes the environment but also reduces the feasibility and efficiency of subsequent sludge treatment.
[0005] 2. Meanwhile, sludge has strong adhesive properties, easily adhering to the inner walls of storage and conveying equipment, causing material accumulation and equipment blockage, affecting the continuity of the treatment process, and increasing equipment maintenance costs and manual cleaning burden. Therefore, in view of this, this paper studies and improves the existing structure and its shortcomings, providing a dynamic antibacterial device for sludge treatment, aiming to achieve a more practical purpose. Summary of the Invention
[0006] To solve the above-mentioned technical problems, the present invention provides a dynamic antibacterial device for sludge treatment, which is achieved by the following specific technical means:
[0007] A dynamic antibacterial device for sludge treatment includes a frame and a storage chamber mounted on the frame. The storage chamber includes an inner shell layer, a middle shell layer, and an outer shell layer. Several connecting portions are provided between the inner shell layer and the middle shell layer, dividing the space into multiple sets of air channels. A sandwich layer is formed between the middle shell layer and the outer shell layer, and a semiconductor cooling chip assembly is embedded within the sandwich layer. The inner wall of the inner shell layer is coated with a nano-ceramic coating, and several micropores communicating with the air channels are provided on the inner shell layer and the nano-ceramic coating. The bottom of the storage chamber is conical. The storage bin is designed with a feed pipe fixedly installed at the bottom. Several ultrasonic transducers are equidistantly arranged in the conical part of the storage bin. A conveying assembly is arranged below the storage bin. The conveying assembly includes a connecting box and a central shaft. A conveying pipe is fixedly installed at one end of the connecting box. The central shaft is rotatably installed inside the connecting box and the conveying pipe. A spiral blade is fixedly installed on the central shaft. A connecting pipe is integrally welded to the outer edge of the spiral blade. Several atomizing nozzles are equidistantly embedded and connected on the connecting pipe. A PID temperature controller is installed on the frame.
[0008] Furthermore, the connecting box is fixedly installed on the frame, the bottom end of the conveying pipe is fixedly installed with a discharge pipe, the connecting box is fixedly installed with a motor, and the output shaft of the motor is fixedly connected to the central shaft.
[0009] Furthermore, a connecting pipe is fixedly installed at one end of the connecting pipe, and the other end of the connecting pipe passes through the interior of the central shaft and exits from the central axis of the central shaft.
[0010] Furthermore, the feeding pipe is connected to the connecting box, a high-pressure water pump is installed at one end of the conveying pipe, and a rotary joint is connected between the discharge pipe of the high-pressure water pump and the connecting pipe.
[0011] Furthermore, a distribution pipe is installed at the upper end of the storage compartment, and several branch pipes are fixedly installed at equal intervals at the bottom of the distribution pipe. Each branch pipe is connected to each of the air passages, and a pulse solenoid valve is installed on each branch pipe.
[0012] Furthermore, the surface of the central shaft is coated with a polytetrafluoroethylene anti-stick coating.
[0013] Furthermore, the pore size of the micropores is 0.1-0.3 mm.
[0014] Furthermore, the connecting pipe is spiral-shaped, and the atomizing nozzles are distributed perpendicular to the spiral blades.
[0015] Furthermore, a temperature sensor is installed inside the storage compartment, and the temperature sensor and the semiconductor cooling chip assembly are electrically connected to a PID temperature controller.
[0016] Furthermore, the outer wall of the outer layer of the housing is provided with a heat sink for dissipating heat from the semiconductor cooling chip assembly.
[0017] Compared with the prior art, the present invention has the following beneficial effects:
[0018] I. Through the synergistic effect of low temperature environment, nitrogen environment and ultrasound, multi-dimensional antibacterial effect is achieved. The semiconductor cooling chip group, temperature sensor and PID temperature controller work together to control the temperature in the storage chamber at 4±1℃, which effectively inhibits the protein synthesis of thermophilic bacteria and reduces their reproduction rate. Nitrogen gas is sprayed out of the micropores of the chamber wall to form a dynamic gas film layer, creating a low oxygen environment and inhibiting the activity of aerobic microorganisms. The low-frequency ultrasound generated by the ultrasonic transducer uses the cavitation effect to destroy the structure of microbial biofilm, interfere with the aggregation of bacteria, and comprehensively delay the fermentation and putrefaction of sludge, thereby improving the quality of sludge storage.
[0019] Second, the nano-ceramic coating on the inner wall of the storage silo is made by gradient sintering process and has superhydrophobic properties, which can significantly reduce the adhesion between sludge and the silo wall. At the same time, the dynamic gas film layer formed by nitrogen sprayed from the micropores forms a physical isolation between the sludge and the silo wall, further weakening the adhesion. In addition, the surface of the central shaft is coated with polytetrafluoroethylene anti-stick coating, and the atomizing nozzles on the spiral blades form shear force through high-pressure water flow to remove the sludge attached to the surface of the spiral blades in time, avoiding material sticking and accumulation inside the equipment, and ensuring the continuous and efficient operation of the sludge treatment process.
[0020] Third, the atomizing nozzles on the spiral blades are vertically distributed and form a large-area cleaning coverage area when the central axis rotates. This not only achieves the mixing of sludge but also efficiently cleans the internal components of the equipment, ensuring processing efficiency. The coordinated work of each module significantly improves the overall processing performance and effectively solves the problems of material fermentation, decay, and stickiness in traditional sludge storage processes. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall dynamic antibacterial device for sludge treatment according to the present invention.
[0022] Figure 2 This is a schematic diagram of the ultrasonic transducer of the present invention.
[0023] Figure 3 This is a schematic diagram of the connecting box of the present invention.
[0024] Figure 4 This is a schematic diagram of the cross-section of the delivery pipe of the present invention.
[0025] Figure 5 This is the present invention. Figure 4 An enlarged schematic diagram of point A in the middle.
[0026] Figure 6 This is a top-view cross-section diagram of the storage compartment of the present invention.
[0027] Figure 7 This is a schematic diagram of the storage compartment of the present invention viewed from the side.
[0028] In the diagram, the correspondence between component names and drawing numbers is as follows:
[0029] 1. Frame; 11. PID temperature controller; 2. Storage bin; 22. Feed pipe; 201. Inner shell layer; 202. Middle shell layer; 203. Outer shell layer; 204. Air duct; 205. Connecting part; 206. Interlayer; 207. Nano-ceramic coating; 208. Micropores; 209. Radiator; 3. Ultrasonic transducer; 4. Connecting box; 41. Conveying pipe; 42. Discharge pipe; 43. Motor; 5. Central shaft; 51. Spiral blade; 6. Connecting pipe; 61. Atomizing nozzle; 62. Connecting pipe; 7. High-pressure water pump; 71. Rotary joint; 8. Distribution pipe; 81. Branch pipe; 82. Pulse solenoid valve; 9. Semiconductor refrigeration chip assembly. Detailed Implementation
[0030] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.
[0031] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0033] Example:
[0034] As attached Figure 1 To be continued Figure 7 As shown:
[0035] This invention provides a dynamic antibacterial device for sludge treatment, including a frame 1 and a storage chamber 2 installed on the frame 1. The storage chamber 2 includes an inner shell layer 201, a middle shell layer 202, and an outer shell layer 203. A plurality of connecting parts 205 are provided between the inner shell layer 201 and the middle shell layer 202, and the connecting parts 205 are divided into multiple sets of air channels 204. An interlayer 206 is formed between the middle shell layer 202 and the outer shell layer 203. A semiconductor cooling chip group 9 is embedded in the interlayer 206. A plurality of connecting parts 205 are provided between the inner shell layer 201 and the middle shell layer 202. The multiple equidistantly distributed connecting parts 205 increase the contact area between the middle shell layer 202 and the inner shell layer 201, allowing the cold energy to be transferred through more contact points, so that the inner shell layer 201 can receive the cold energy more quickly and evenly, ensuring the temperature uniformity inside the storage chamber 2.
[0036] The inner wall of the inner layer 201 of the shell is coated with a nano-ceramic coating 207. Several micropores 208 communicating with the air passage 204 are provided on the inner layer 201 and the nano-ceramic coating 207 for introducing nitrogen into the storage chamber 2. The bottom of the storage chamber 2 is conical to facilitate material discharge.
[0037] A feeding pipe 22 is fixedly installed at the bottom of the storage bin 2. Several ultrasonic transducers 3 are equidistantly arranged in the conical part of the storage bin 2. A conveying assembly is arranged below the storage bin 2. The conveying assembly includes a connecting box 4 and a central shaft 5. A conveying pipe 41 is fixedly installed at one end of the connecting box 4. The central shaft 5 is rotatably installed in the connecting box 4 and the conveying pipe 41. A spiral blade 51 is fixedly installed on the central shaft 5.
[0038] The connecting box 4 is fixedly installed on the frame 1. The bottom end of the conveying pipe 41 is fixedly installed with the discharge pipe 42. The connecting box 4 is fixedly installed with the motor 43. The output shaft of the motor 43 is fixedly connected to the central shaft 5. The motor 43 is used to drive the central shaft 5 to rotate.
[0039] One end of the connecting pipe 6 is fixedly installed with a connecting pipe 62, and the other end of the connecting pipe 62 passes through the interior of the central shaft 5 and exits from the central axis of the central shaft 5, so that the connecting pipe 62 and the central shaft 5 are designed to be coaxial, so as to prevent the rotary joint 71 from disengaging when the connecting pipe 62 rotates, and to ensure that the connecting pipe 62 can be stably connected to the rotary joint 71.
[0040] A distribution pipe 8 is installed at the upper end of the storage bin 2. Several branch pipes 81 are fixedly installed at equal intervals at the bottom of the distribution pipe 8. Each branch pipe 81 is connected to each air channel 204. Each branch pipe 81 is equipped with a pulse solenoid valve 82. An external nitrogen source enters each branch pipe 81 through the distribution pipe 8, and then enters the air channel 204 through each branch pipe 81. Finally, it is sprayed out from the micropore 208. The pulse solenoid valve 82 controls the spray cycle (e.g., 10 minutes / time) and pressure (0.2MPa), forming a dynamic air film layer of 0.5-1mm on the bin wall, realizing the physical isolation between the sludge and the bin wall, weakening the adhesion force, while the nitrogen environment can inhibit the activity of some aerobic microorganisms.
[0041] A connecting pipe 6 is integrally welded to the outer edge of the spiral blade 51. Several atomizing nozzles 61 are fixedly embedded and connected on the connecting pipe 6 at equal intervals. A high-pressure water pump 7 is installed at one end of the delivery pipe 41. A rotary joint 71 is connected between the discharge pipe of the high-pressure water pump 7 and the connecting pipe 62. The surface of the central shaft 5 is coated with a 50μm polytetrafluoroethylene anti-stick coating. The connecting pipe 6 is spiral in shape. The atomizing nozzles 61 are distributed perpendicular to the spiral blade 51. 3MPa high-pressure water flows through the rotary joint 71 and is sprayed from the atomizing nozzles 61 at a 90° spray angle, forming a cleaning coverage area with a diameter of about 0.8m, forming a shearing water flow to remove the surface layer of the spiral blade 51.
[0042] A PID temperature controller 11 is installed on the frame 1, a semiconductor cooling chip group 9 is installed in the interlayer 206, and a temperature sensor (not shown in the figure) is installed in the storage compartment 2. The temperature sensor and the semiconductor cooling chip group 9 are electrically connected to the PID temperature controller 11 to control the temperature in the storage compartment 2 in the low temperature range of 4±1℃.
[0043] The outer wall of the outer shell 203 is provided with a heat sink 209 for dissipating heat from the semiconductor cooling chip assembly 9, so as to dissipate heat from the hot end of the semiconductor cooling chip assembly 9 and facilitate its stable and continuous operation.
[0044] The working principle of this embodiment:
[0045] Step 1: The nano-ceramic coating 207 on the inner wall of storage bin 2 is made by gradient sintering process. It has superhydrophobic properties to reduce the adhesion between sludge and bin wall. The micropores 208 on the surface of the inner layer 201 of the shell are connected to the air channel 204. The air channel 204 is connected to the top distribution pipe 8 via the branch pipe 81. The external nitrogen source enters the air channel 204 through the distribution pipe 8 and is sprayed out through the micropores 208. The pulse solenoid valve 82 controls the spray cycle (e.g., 10 minutes / time) and pressure (0.2MPa) to form a dynamic air film layer of 0.5-1mm on the bin wall, realizing the physical isolation between sludge and bin wall. While weakening the adhesion, the nitrogen environment can inhibit the activity of some aerobic microorganisms.
[0046] Step 2: The semiconductor cooling chip assembly 9 is installed in the interlayer 206. Through the combined action of the PID temperature controller 11, the semiconductor cooling chip assembly 9, and sensors, the temperature inside the storage chamber 2 is maintained at a low temperature range of 4±1℃. At this temperature, protein synthesis by thermophilic bacteria is inhibited, and their reproduction rate is significantly reduced, thus delaying sludge fermentation and putrefaction. Ultrasonic transducers 3, with a frequency of 28kHz and a power density of 0.5W / cm³, are equidistantly arranged at the conical bottom of the storage chamber 2. 2 It starts for 10 minutes every 2 hours. Low-frequency ultrasound destroys the physical structure of microbial biofilm through cavitation effect, interferes with quorum sensing signal and inhibits bacterial aggregation. The bottom of storage chamber 2 is conical to facilitate material discharge.
[0047] Step 3: A 50μm polytetrafluoroethylene anti-stick coating is sprayed onto the surface of the central shaft 5. As the spiral blades 51 rotate with the central shaft 5, they push the sludge towards the conveying pipe 41 and complete the mixing, preventing local accumulation. The atomizing nozzles 61 at the edge of the spiral blades 51 are connected to the high-pressure water pump 7 through the connecting pipe 6. When the central shaft 5 rotates, 3MPa high-pressure water flows through the rotary joint 71 and sprays out from the atomizing nozzles 61 at a 90° spray angle, forming a cleaning coverage area with a diameter of about 0.8m. This forms a shearing water flow to remove the surface layer of the spiral blades 51. At the same time, the central shaft 5 pushes the sludge from the feed pipe 22 to the conveying pipe 41 and discharges it through the discharge pipe 42.
[0048] Step 4: During material storage, the nano-ceramic coating 207 and the air film layer prevent sticking. The semiconductor cooling chip group 9, temperature sensor and PID temperature controller 11 work together to maintain low temperature. The ultrasonic transducer 3 is periodically activated to inhibit bacteria. During the stirring and conveying stage, the central shaft 5 and the spiral blades 51 push the material. The high-pressure water pump 7 and the atomizing nozzle 61 clean the spiral blades 51 simultaneously. The air film parameters are optimized based on the rheological characteristics of sludge. The ultrasonic parameters conform to the low-frequency biofilm removal theory. The low temperature range matches the thermophilic bacteria inhibition mechanism. The multi-module collaboration solves the problems of material fermentation, spoilage and stickiness in traditional storage processes.
[0049] Finally, it should be noted that the ultrasonic transducer 3, the pulse solenoid valve 82, the semiconductor cooling chip group 9, and the PID temperature controller 11 are existing devices or equipment in the prior art, or devices or equipment that can be implemented in the prior art. Their power supply, specific composition, and principle are clear to those skilled in the art and are common knowledge in the field, so they will not be described in detail.
[0050] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.
Claims
1. A dynamic antibacterial device for sludge treatment, comprising a frame (1) and a storage bin (2) installed on the frame (1), characterized in that: The storage chamber (2) includes an inner shell layer (201), a middle shell layer (202), and an outer shell layer (203). Several connecting parts (205) are provided between the inner shell layer (201) and the middle shell layer (202), and the connecting parts (205) are divided into multiple air channels (204). An interlayer (206) is formed between the middle shell layer (202) and the outer shell layer (203). A semiconductor cooling chip group (9) is embedded in the interlayer (206). The inner wall of the inner shell layer (201) is sprayed with a nano-ceramic coating (207). Several micropores (208) communicating with the air channels (204) are provided on the inner shell layer (201) and the nano-ceramic coating (207). The storage chamber (2) has a conical bottom design. A feed pipe (22) is fixedly installed at the bottom of the storage chamber (2). The storage chamber (2) has several ultrasonic transducers (3) equidistantly arranged in a conical part. A conveying assembly is arranged below the storage chamber (2). The conveying assembly includes a connecting box (4) and a central shaft (5). A conveying pipe (41) is fixedly installed at one end of the connecting box (4). The central shaft (5) is rotatably installed in the connecting box (4) and the conveying pipe (41). A spiral blade (51) is fixedly installed on the central shaft (5). A connecting pipe (6) is integrally welded to the outer edge of the spiral blade (51). Several atomizing nozzles (61) are fixedly embedded and connected on the connecting pipe (6) at equal intervals. A PID temperature controller (11) is arranged on the frame (1).
2. The dynamic antibacterial device for sludge treatment as described in claim 1, characterized in that: The connecting box (4) is fixedly installed on the frame (1), and the bottom end of the conveying pipe (41) is fixedly installed with the discharge pipe (42); the connecting box (4) is fixedly installed with the motor (43), and the output shaft of the motor (43) is fixedly connected to the central shaft (5).
3. The dynamic antibacterial device for sludge treatment as described in claim 2, characterized in that: One end of the connecting pipe (6) is fixedly installed with a connecting pipe (62), and the other end of the connecting pipe (62) passes through the interior of the central shaft (5) and exits from the central axis of the central shaft (5).
4. The dynamic antibacterial device for sludge treatment as described in claim 3, characterized in that: The feeding pipe (22) is connected to the connecting box (4), and a high-pressure water pump (7) is installed at one end of the conveying pipe (41). A rotary joint (71) is connected between the discharge pipe of the high-pressure water pump (7) and the connecting pipe (62).
5. The dynamic antibacterial device for sludge treatment as described in claim 4, characterized in that: The storage chamber (2) is equipped with a distribution pipe (8) at the upper end. Several branch pipes (81) are fixedly installed at equal intervals at the bottom of the distribution pipe (8). Each branch pipe (81) is connected to each air passage (204). Each branch pipe (81) is equipped with a pulse solenoid valve (82).
6. The dynamic antibacterial device for sludge treatment as described in claim 5, characterized in that: The surface of the central shaft (5) is coated with a polytetrafluoroethylene anti-stick coating.
7. The dynamic antibacterial device for sludge treatment as described in claim 6, characterized in that: The pore size of the micropores (208) is 0.1-0.3 mm.
8. The dynamic antibacterial device for sludge treatment as described in claim 7, characterized in that: The connecting pipe (6) is spiral-shaped, and the atomizing nozzle (61) is distributed perpendicular to the spiral blade (51).
9. The dynamic antibacterial device for sludge treatment as described in claim 8, characterized in that: A temperature sensor is installed inside the storage compartment (2), and the temperature sensor and the semiconductor cooling chip group (9) are electrically connected to the PID temperature controller (11).
10. The dynamic antibacterial device for sludge treatment as described in claim 9, characterized in that: The outer wall of the outer shell (203) is provided with a heat sink (209) for dissipating heat from the semiconductor cooling chip assembly (9).
Citation Information
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