Circuit board and test interface board for chip electrical failure analysis

Abstract

The invention discloses a circuit board and a test interface board for electrical failure analysis of a chip, and the circuit board comprises a slide rail disposed on the surface of the circuit board, and the slide rail is provided with a movable slot in a sliding manner; the fixed slot is arranged on the surface of the circuit board, the fixed slot is opposite to the movable slot, the fixed slot and the movable slot are respectively used for being inserted into one of a group of opposite sides of the plugboard and being electrically connected with the inserted side, and the group of opposite sides of the plugboard are also used for being electrically connected with a chip placed on the plugboard; and the conductive through hole is arranged on the circuit board and is electrically connected with one of the movable slot and the fixed slot. According to the invention, the test efficiency and the test precision can be improved and the test cost can be reduced in the chip electrical failure analysis process.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a circuit board and a test interface board for chip electrical failure analysis. Background Art

[0002] During the electrical failure analysis (EFA) process on a chip, it is necessary to electrically connect the chip to a source monitor unit (SMU) through a test interface board, so that various tests can be performed on the chip through the SMU. Currently, different types of test interface boards are selected according to the different shapes of the chips, and the chip is electrically connected to the selected test interface board through bonding. Then, the corresponding wiring method is determined based on the selected test interface board to achieve the connection between the test interface board and the SMU. However, existing test interface boards have limitations, resulting in low test efficiency, poor test accuracy, and high test costs. Summary of the Invention

[0003] In view of the above problems, the purpose of this application is to provide a circuit board and a test interface board for chip electrical failure analysis, which can improve the test efficiency and test accuracy and reduce the test cost by improving the structure on the board.

[0004] According to a first aspect of the present invention, there is provided a circuit board for chip electrical failure analysis, comprising: A slide rail is provided on the surface of the circuit board, and a movable slot is slidably provided on the slide rail; A fixed slot is provided on the surface of the circuit board, the fixed slot being opposite to the movable slot, the fixed slot and the movable slot being respectively used to be inserted into one of a set of opposite edges of the plugboard and electrically connected to the inserted edge, the set of opposite edges of the plugboard being further used to electrically connect a chip placed on the plugboard; A conductive through hole is provided on the circuit board, and the conductive through hole is electrically connected to one of the movable slot and the fixed slot.

[0005] Optionally, contacts are provided on a set of opposite slot walls in the slots of each of the fixed slot and the movable slot, and the contacts provided on a set of opposite slot walls are insulated from each other. The fixed slot and the movable slot are each electrically connected to the edge of the plug-in board through the contacts.

[0006] Optionally, there are multiple contact pins and multiple conductive through holes, and the contact pins and the conductive through holes are electrically connected one-to-one. The circuit board also includes an identification symbol set on the surface of the circuit board, and different conductive through holes are identified by different identification symbols.

[0007] Optionally, the contact pins and the conductive through holes are electrically connected via connecting wires, and the connecting wires are hidden inside the circuit board.

[0008] Optionally, the circuit board further comprises: a supporting component provided on the surface of the circuit board, the supporting component being located between the movable slot and the fixed slot, and being used to support a chip inserted into the fixed slot at one of a set of opposite sides.

[0009] Optionally, the circuit board further includes pin holes provided on the circuit board, and the pin holes are used to fix the circuit board on the carrier of the test machine by vacuuming.

[0010] According to a second aspect of the present invention, there is provided a test interface board for chip electrical failure analysis, comprising: Any circuit board described in the first aspect; The interposer includes a set of opposite edges and an opening area for placing a chip arranged in the area between the set of opposite edges. The set of opposite edges are each electrically connected to the fixed slot or the movable slot inserted therein by setting pins, and the pins are also used to electrically connect the chip.

[0011] Optionally, the interposer further comprises a plurality of mutually insulated metal sheets arranged around the opening area, wherein the metal sheets are used to connect the pins at one end and the chip at the other end so that the chip is electrically connected to the pins, and the size of the opening area is limited by the area of ​​the central remaining area after the pins and the metal sheets are arranged on the interposer.

[0012] Optionally, the chip is packaged in the opening area of ​​the plugboard on the bottom surface of the plugboard through a COB packaging method, and the connection between the pin and the metal sheet, the metal sheet, the connection between the metal sheet and the chip, and the chip are all packaged in the insulating glue used in the COB packaging method.

[0013] Optionally, a first reference line is provided on the board surface around the opening area, and the first reference line is used to assist in determining the placement position of the chip when the chip is placed on the board; And / or, a second reference line is provided on the board surface of the plugboard in an area near the pin, and the second reference line is used to assist in determining the insertion depth of each of a group of opposite edges of the plugboard when the group of opposite edges are respectively inserted into the fixed slot and the movable slot.

[0014] The unexpected technical effects of this application are: The circuit board for chip electrical failure analysis provided by the present application includes: a slide rail provided on the surface of the circuit board, a movable slot slidably provided on the slide rail; a fixed slot provided on the surface of the circuit board, the fixed slot being opposite to the movable slot, the fixed slot and the movable slot being respectively used to insert one of a set of opposite sides of the plug board and electrically connect the inserted sides, the set of opposite sides of the plug board being also used to electrically connect the chip placed on the plug board; a conductive through-hole provided on the circuit board, the conductive through-hole being electrically connected to one of the movable slot and the fixed slot. Therefore, the circuit board can adaptively and stably support plug boards of different sizes through the fixed slots and the movable slots with variable spacing and has a larger space for setting the connection point between the plug board and the plug board. The conductive through-hole can also be inserted into the conductive column at the end of the wire to achieve a quick and accurate connection with the wire, thereby improving test efficiency and test accuracy and reducing test costs.

[0015] Furthermore, the circuit board provided in the present application also includes a supporting component arranged on the surface of the circuit board, which is located between the movable slot and the fixed slot, and is used to support a chip inserted into the fixed slot in a set of opposite edges, so that when the movable slot is slid away from the fixed slot to remove the chip, it can be ensured that the chip does not fall under the support of the fixed slot and the supporting component.

[0016] The test interface board for chip electrical failure analysis provided in the present application includes: an insert board and any one of the circuit boards described in the first aspect, the insert board including a set of relative edges and an opening area for placing the chip arranged in the area between the set of relative edges, the set of relative edges are each electrically connected to a fixed slot or a movable slot inserted therein by setting pins, so that more pins are allowed to be set on the insert board, and the pins are also used to electrically connect the chip, so that the chip is allowed to have a number of pins between it and the test interface board that meets the test requirements, so that the optimization of the test process can be supported, which is conducive to improving test efficiency and test accuracy and reducing test costs.

[0017] Furthermore, in the test interface board provided by the present application, the plug-in board also includes a plurality of mutually insulated metal sheets arranged around the opening area. The metal sheets are used to connect the pins at one end and the chip at the other end, so that the chip is electrically connected to the pins. The size of the opening area on the plug-in board is limited by the area of ​​the central remaining area after the pins and metal sheets are set on the plug-in board. Therefore, the opening area can be set larger. This not only meets the placement requirements of chips of different sizes and shapes, but also meets the different wiring requirements of different chips, thereby expanding the range of usable chips. In addition, when the opening area is larger, various chips are packaged in the opening area of ​​the plug-in board on the bottom surface of the plug-in board. The test lens can accurately observe the chips from the front of the plug-in board, thereby avoiding many unfavorable factors such as the instability of the test machine caused by the need to disassemble the test machine and debug parameters when replacing chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present application will become more apparent through the following description of the embodiments of the present application with reference to the accompanying drawings, in which: Figure 1 The figure shows a schematic diagram of a test interface board with 12 pins used for chip testing; Figure 2 The figure shows a schematic diagram of a test interface board with 256 pins used for chip testing; Figure 3 FIG2 is a schematic top view of a circuit board provided in an embodiment of the present application; Figure 4 FIG2 is a cross-sectional view of an exemplary movable slot and a fixed slot inserted into a set of opposite sides of a plugboard according to an embodiment of the present application; Figure 5 The figure shows a schematic top view of an insert board provided in an embodiment of the present application.

[0019] Explanation of Reference Numerals: 10 - first test interface board; 11 - chip on first test interface board 10; 12 - pin on first test interface board 10; 20 - simple homemade board; 21 - wire; 30 - second test interface board; 31 - chip on second test interface board 30; 32 - metal strip; 33 - pin on second test interface board 30; 100 - circuit board; 110 - slide rail; 120 - removable slot; 121 - first contact pin; 122 - second contact pin; 130 - fixed slot; 131-third contact pin; 132-fourth contact pin; 140-conductive through hole; 141-input through hole; 142-output through hole; 150-support component; 160-pin hole; 200-plug board; 210-opening area; 220-pin on plug board 200; 230-metal sheet; 240-first baseline; 241-first sub-baseline; 242-second sub-baseline; 243-third sub-baseline; 244-fourth sub-baseline; 250-second baseline; 260-baseline point. DETAILED DESCRIPTION

[0020] The present application will be described in more detail below with reference to the accompanying drawings. In each of the drawings, identical elements are represented by similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, some well-known parts may not be shown.

[0021] This application may be embodied in various forms, some examples of which are described below.

[0022] During electrical failure analysis of a chip, a test interface board (TIB) is required to electrically connect the chip to a source-measurement unit (SMU), enabling various chip tests to be performed using the SMU. Currently, different types of TIBBs are selected based on the chip's shape. For example, a 12-pin TIBB is used for a long, rectangular chip, while a 256-pin TIBB is used for a square chip. Wire bonding is then used to electrically connect the chip to the selected TIBB, and a corresponding wiring method is determined based on the selected TIBB to connect the TIBB to the SMU.

[0023] Figure 1 The figure shows a schematic diagram of a test interface board with 12 pins used for chip testing. Figure 1 As shown in Figure (a), the first test interface board 10 is provided with an opening area of ​​3mm×2.7mm. A custom long glass sheet is placed on the surface and then the chip 11 is attached to the opening area. The chip 11 is electrically connected to the pins 12 provided on the first test interface board 10 by wire bonding. Although multiple pins 12 are provided on both sides AB and CD on the surface of the first test interface board 10, since only one side of the first test interface board 10 can be used, such as Figure 1 As shown in Figure (b), a simple homemade board 20 is inserted for power-on testing. Figure 1 In FIG. (a), the chip 11 is only connected to the pins on the side AB by bonding wires. Figure 1 In FIG. 2( b ), the surface of the simple homemade board 20 is provided with conductive posts, so a wire 21 with a socket is selected to realize the electrical connection between the simple homemade board 20 and the source measurement unit.

[0024] Figure 2 The figure shows a schematic diagram of a test interface board with 256 pins used for chip testing. Figure 2 As shown, the second test interface board 30 is provided with an opening area with a size of 10mm×10mm. The square glass sheet placed on the bottom is adhered to the opening area after the chip 31 is adhered. The chip 31 is electrically connected to the metal strip 32 provided on the surface of the second test interface board 30 by bonding. The metal strip 32 is also electrically connected to the pin 33 provided on the surface of the second test interface board 30. Then, a wire is connected to the pin 33 by welding to realize the connection between the second test interface board 30 and the source measurement unit.

[0025] Both of the above-mentioned two test interface boards have limitations during chip testing. Figure 1The first test interface board 10 shown has fewer pins. If there are multiple groups of test conditions and complex test conditions cannot be completed at one time, the test process requires multiple wire breaks and re-wires, which increases the risk of rework and directly damages the chip 11, thereby increasing the test cost. In addition, only one end of the first test interface board 10 is inserted into the simple homemade board 20, so the simple homemade board 20 needs to be pressed with a heavy object to maintain balance, and the first test interface board 10 is placed in the air. In this way, there is an error in the placement position of the first test interface board 10 and the placement is relatively unstable. When the lens of the test machine is replaced or the external environment is messy, the chip 11 will be shifted, so that the actual measured positioning signal diagram will be shifted, affecting the accuracy of the failure point positioning on the chip 11. Figure 2 Although the second test interface board 30 shown has more pins, it is only suitable for testing square chips; in addition, Figure 2 The second test interface board 30 shown connects wires to pins 33 via soldering, which can lead to numerous problems. For example, soldering wires to pins 33 requires temperatures exceeding 200°C, which can easily damage the sample board and cause personal injury. Furthermore, soldering to pins 33 with small gaps between them can easily result in short circuits, even at a reduced soldering rate, which can damage the chip 31 during power-on testing. Furthermore, when soldering wires to pins 33 and then connecting wires to wires, the wires prevent the wires from being placed horizontally, and the uneven size of the solder joints can prevent the second test interface board 30 from being placed horizontally on the test platform when the surface of the second test interface board 30 is relative to the platform surface. Consequently, the chip 31 cannot be fully focused. Unfocused areas of the chip 31 can cause a deviation between the failure location point in the positioning signal diagram and the actual failure location point.

[0026] In view of this, an embodiment of the present application provides a circuit board for chip electrical failure analysis. Figure 3 FIG. 1 is a top view of a circuit board provided in an embodiment of the present application. Figure 3As shown, the circuit board 100 includes a slide rail 110, a movable slot 120, a fixed slot 130 and a conductive through hole 140, wherein the slide rail 110 is arranged on the surface of the circuit board 100, and the number can be two as shown in the figure, and the two slide rails 110 are arranged parallel to each other; the movable slot 120 is slidably arranged on the slide rail 110, and the fixed slot 130 is fixed on the surface of the circuit board 100 and is arranged opposite to the movable slot 120, so that the movable slot 120 and the fixed slot 130 can stably support the plugboard after being respectively inserted into one of a group of opposite sides of the plugboard, and at the same time, the movable slot 120 and the fixed slot 130 can stably support the plugboard. The fixed slots 130 are each electrically connected to the inserted edges, thereby increasing the space for setting connection points between the circuit board 100 and the plug-in board. In addition, the movable slot 120 can change the distance between itself and the fixed slot 130 by sliding on the slide rail 110, so that plug-in boards of different sizes can be electrically connected between the movable slot 120 and the fixed slot 130; the conductive through-hole 140 is set on the circuit board 100, and the conductive through-hole 140 is electrically connected to one of the movable slot 120 and the fixed slot 130, so that the movable slot 120 and the fixed slot 130 can be connected to the source measurement unit through the conductive through-hole 140.

[0027] Specifically, the fixing slot 130 can be directly fixed on the surface of the circuit board 100; the fixing slot 130 can also be fixed at both ends. Figure 3 On the two slide rails 110 shown, since the slide rails 110 are fixed to the surface of the circuit board 100, the fixed slots 130 are indirectly fixed to the surface of the circuit board 100 in this case. The movable slots 120 and the fixed slots 130 jointly stably support the plugboard, making the plugboard position stable without the need for a heavy object, so that the chip on the plugboard is not easily displaced. It is also easy to place the chip parallel to the carrier of the test machine so that the entire chip can be accurately focused, thus improving the accuracy of the failure location point on the chip. The chips on the plugboard include the elongated chip 11 on the first test interface board 10 and the square chip 31 on the second test interface board 30. The spacing between the movable slots 120 and the fixed slots 130 is variable, achieving maximum adaptability to plugboards of different sizes. The range of applicable chips is correspondingly expanded to a certain extent. The width between a set of opposite sides of the plugboard inserted into the movable slots 120 and the fixed slots 130 can be set according to the physical limitations of the wire bonding machine.

[0028] The opposite sides of the board, which are inserted into the removable slot 120 and the fixed slot 130, are also used to electrically connect the chip placed on the board. The increased space for setting connection points between the circuit board 100 and the board allows the board to be provided with more pins, each of which connects the chip to the circuit board 100. In this way, even if there are multiple sets of test conditions, there is no need to reuse the same pins on the board, which helps avoid damage to the board caused by multiple wire breaks and can reduce testing costs.

[0029] The conductive vias 140 can be divided into Figure 3 The circuit board 100 can be used to perform some tests on the chip that require analysis of the chip output signal. The output through hole 142 can be used as shown in FIG. Figure 3 As shown in the figure, in the area between the two slide rails 110 on the circuit board 100, the input through hole 141 can be as shown in the figure. Figure 3 As shown, it is arranged in the right area of ​​the right one of the two slide rails 110 on the circuit board 100. A plurality of connection points are set between the circuit board 100 and the plug board, and the number of the conductive through-holes 140 is correspondingly multiple, which can be multiple input through-holes 141 and multiple output through-holes 142. Among them, some of the multiple input through-holes 141 can be connected in series and passed through two external source measurement units in some test processes as needed, and the multiple output through-holes 142 must ensure insulation between each other. The conductive through-hole 140 is connected to the wire by inserting a conductive post at the end of the wire, so there is no need for welding, which saves the labor cost and material cost required for welding. For the testing of the same batch of chips, the wiring efficiency when switching between different chips can be significantly improved, and the circuit board 100 does not have many problems caused by welding.

[0030] Figure 3 In the circuit board 100, there is an open area between the movable slot 120 and the fixed slot 130, adjacent to the fixed slot 130, in the area between the two slide rails 110. In this way, when the plug-in board is supported between the movable slot 120 and the fixed slot 130, the chip on the plug-in board can be observed from the bottom through this open area, which is of great significance for meeting the needs of observing different sides of the chip. Moreover, since there are no conductive through-holes 140 in this open area, the upper lens observing the chip above this area and the lower lens observing the chip below this area can avoid the risk of being scratched by the wires. In addition, with the support of the movable slot 120 and the fixed slot 130, the height of the plug-in board can be accurately controlled, so that the plug-in board can be higher than the lower lens and lower than the upper lens, so that the upper lens and the lower lens can also avoid the risk of being scratched by the plug-in board surface.

[0031] Figure 4 The figure shows a cross-sectional view of an exemplary movable slot and a fixed slot inserted into a set of opposite sides of the plugboard, the cross section being parallel to Figure 3 The slide rail 110 shown in the figure has a through hole in the movable slot that is parallel to the slide rail 110 and passes through the movable slot. Figure 4As shown, the upper and lower opposing walls of the removable slot 120 are respectively provided with first and second contacts 121, 122. The first and second contacts 121, 122 are insulated from each other. The removable slot 120 is electrically connected to the edge of the plugboard 200 inserted into the removable slot 120 via the first and second contacts 121, 122. The upper and lower opposing walls of the fixed slot 130 are respectively provided with third and fourth contacts 131, 132. The third and fourth contacts 131, 132 are insulated from each other. The fixed slot 130 is electrically connected to the edge of the plugboard 200 inserted into the fixed slot 130 via the third and fourth contacts 131, 132. The removable slot 120's slot is part of a through hole, located on the side adjacent to the fixed slot 130. The movable slot 120 and the fixed slot 130 have more connection points with the inserted edge by setting contact pins on a set of opposite slot walls in their respective slots, and such setting of contact pins also allows the front and back side insertion to meet the different observation requirements of different sides of the chip.

[0032] Furthermore, the contact pins and the conductive through-holes 140 provided in the respective notches of the movable slot 120 and the fixed slot 130 are electrically connected one-to-one. The circuit board 100 also includes an identification symbol provided on the surface of the circuit board 100. Different conductive through-holes 140 are identified by different identification symbols. In this way, the wires connected to the conductive through-holes 140 can be distinguished by the identification symbols on the surface of the circuit board 100 without the need for labeling, which is beneficial to improving the efficiency of chip testing.

[0033] Furthermore, the contact pins and the conductive through-holes 140 provided in the respective notches of the movable slot 120 and the fixed slot 130 are electrically connected via connecting wires, which are hidden inside the circuit board 100. This helps to avoid chip damage caused by short circuits between the connecting wires and short circuits between the connecting wires and the metal interfaces of the test machine, and helps to avoid test data errors caused by incorrect connections between the contact pins and the conductive through-holes 140 during testing.

[0034] In an optional embodiment, the circuit board 100 is as follows Figure 3 The figure also includes a support component 150 arranged on the surface of the circuit board 100. The support component 150 is located between the movable slot 120 and the fixed slot 130, and is used to support a chip inserted into the fixed slot 130 on one of a set of opposite sides.

[0035] The embodiment of the present application does not limit the number of the supporting components 150. The supporting components 150 may be as follows: Figure 3 The settings shown are two, Figure 3A support component 150 is provided near one of the slide rails 110 to support the chip. Furthermore, the present embodiment does not limit the specific structure of the support component 150, as long as the support component 150 can support the chip inserted into the fixed slot 130. For example, the support component 150 can be configured to include a support rod and a flat plate fixed to the top of the support rod. Another example is that the support component 150 can be configured to include a support rod and an open slot fixed to the top of the support rod, with the opening direction of the open slot facing the chip inserted into the fixed slot 130.

[0036] For the circuit board 100 including the support component 150, in use: when starting the test, first insert one of the opposite sides of the plugboard 200 into the through hole from the side of the movable slot 120 away from the fixed slot 130, then move the opposite side of the plugboard 200 through the through hole of the movable slot 120, reach between the movable slot 120 and the fixed slot 130 and at a certain distance from the movable slot 120, then insert the opposite side into the notch of the fixed slot 130 under the support of the support component 150, and then move the movable slot 120 so that the other one of the opposite sides of the plugboard 200 reaches the movable slot 120. The method of installing the plugboard 200 is as follows: first, insert the plugboard 200 into the slot of the movable slot 120; or, move one of the opposite sides of the plugboard 200 through the through hole of the movable slot 120, first make the other side of the pair of opposite sides of the plugboard 200 reach the slot of the movable slot 120, and then, with the support of the support member 150, fix the opposite side that first passed through the movable slot 120 to the slot of the fixed slot 130; when the test is completed, slide the movable slot 120 so that the side of the plugboard inserted into the movable slot 120 is withdrawn from the movable slot 120. At this time, the plugboard will not fall due to the presence of the support member 150, and then the plugboard is withdrawn from the fixed slot 130. This method of installing the plugboard 200 can improve the length adaptability of the plugboard 200, so that the plugboard 200 can be fixed even when the distance between the pair of opposite sides of the plugboard 200 is equal to the maximum distance between the movable slot 120 and the fixed slot 130. For an inserting board 200 in which the distance between a set of opposite sides is smaller than the maximum distance between the movable slot 120 and the fixed slot 130, during installation, the movable slot 120 may be first moved to the farthest point from the fixed slot 130, and then one of the set of opposite sides of the inserting board 200 may be inserted into the fixed slot 130 with the support of the support component 150, and then the movable slot 120 may be slid close to the inserting board 200 and the other one of the set of opposite sides of the inserting board 200 may be inserted into the movable slot 120.

[0037] In another optional embodiment, the circuit board 100 is as follows: Figure 3The circuit board 100 is also provided with a foot hole 160. The foot hole 160 is used to fix the circuit board 100 on the carrier of the test machine by vacuuming, thereby avoiding test data errors caused by the movement of the circuit board 100. The foot hole 160 can be connected to the air path of the test machine through an air pipe to achieve vacuuming of the foot hole 160. In order to fix the circuit board 100 more firmly, it is usually necessary to Figure 3 As shown in FIG, a foot hole 160 is provided at each corner of the circuit board 100. Considering that the movable slot 120 slides on the slide rail 110 and indirectly touches the circuit board 100 due to the touch of the slide rail 110, the two ends of each slide rail 110 can be as shown. Figure 3 As shown, each foot hole 160 is provided. In addition, Figure 3 The right side area of ​​one of the two slide rails 110 is centrally provided with conductive through holes 140. Inserting and removing wires in the conductive through holes 140 will indirectly contact the circuit board 100, thus Figure 3 A pin hole 160 is also provided on the right edge of the circuit board 100 .

[0038] Corresponding to the circuit board 100 provided in the above embodiment, another embodiment of the present application provides a test interface board for chip electrical failure analysis, which includes an insert board and any circuit board 100 provided in the above embodiment. Figure 5 The figure shows a top view of the plug board provided in the embodiment of the present application. Figure 5 As shown, the interposer 200 includes a set of opposite edges EF and edges GH and an opening area 210 for placing a chip set in the area between the set of opposite edges. The edges EF and the edges GH are each electrically connected to the removable slot 120 or the fixed slot 130 inserted therein by setting pins 220. The pins 220 are also used to electrically connect the chip, so that the chip is connected to the circuit board 100 through the pins 220.

[0039] Specifically, for the case where only one contact pin is provided on the wall of the movable slot 120 and the fixed slot 130, the plugboard 200 can be provided with pins 220 on the surface accordingly, so that both the upper and lower sides of the plugboard 200 can be directly plugged in for power-on testing; for the case where contact pins are provided on a set of opposite walls in the respective slots of the movable slot 120 and the fixed slot 130, the plugboard 200 can be provided with pins 220 on the surface accordingly. Figure 4 As shown, pins 220 are provided on both the top and bottom surfaces of the plugboard 200, allowing both the top and bottom surfaces of the plugboard 200 to be plugged in and tested. The plugboard 200 and circuit board 100 work together to enable chip testing via a test interface board, meeting the requirements of complex testing conditions, improving test efficiency and accuracy, and reducing test costs.

[0040] Furthermore, the board 200 can be Figure 5The illustrated circuit board also includes a plurality of mutually insulated metal sheets 230 disposed around the opening area 210. The metal sheets 230 are used to electrically connect the chip to the pins 220 via one end and the chip via the other end. The size of the opening area 210 is limited by the area of ​​the remaining central area of ​​the interposer 200 after the pins 220 and metal sheets 230 are installed. Thus, the opening area of ​​the opening area 210 is not limited to the area of ​​a single chip. Therefore, the opening area 210 can be larger, not only accommodating the placement requirements of chips of different sizes and shapes, but also meeting the different wiring requirements of different chips. This expands the range of chips that can be placed on the interposer 200. Long chips, square chips, and even artificially split trapezoidal chips can all be placed on the interposer 200 for testing. Furthermore, with a larger opening area, various chips are packaged within the opening area on the bottom surface of the interposer. The test lens can accurately observe the chips from the front of the interposer 200, thus avoiding the many disadvantages of test machine instability caused by the need to disassemble the test machine and adjust parameters for chip replacement.

[0041] In some examples, the chip can be packaged on the bottom surface of the plugboard 200 in the opening area 210 of the plugboard 200 using a COB (chip on board) packaging method. The connection between the pins 220 and the metal sheet 230, the metal sheet 230, the connection between the metal sheet 230 and the chip, and the chip are all encapsulated in the insulating glue used in the COB packaging method. In this way, after the plugboard 200 is inserted into the circuit board 100, the board surface of the plugboard 200 is insulated, which helps to avoid chip damage caused by short circuits between the metal interface of the plugboard 200 and the test machine.

[0042] Furthermore, at least one of a first reference line 240 and a second reference line 250 is provided on the surface of the plugboard 200. The first reference line 240 is provided around the opening area 210 to assist in determining the placement of the chip when placing it on the plugboard 200. The second reference line 250 is provided near the pins 220 to assist in determining the insertion depth of each of a set of opposing sides of the plugboard 200 when the sides are inserted into the removable slot 120 and the fixed slot 130, respectively. The first reference line 240 and the second reference line 250 are insulated lines that assist in testing operations. Furthermore, insulated reference points 260 may be provided on the surface of the plugboard 200 according to actual needs.

[0043] Figure 5The first reference line 240 includes a first sub-reference line 241, a second sub-reference line 242, a third sub-reference line 243 and a fourth sub-reference line 244, wherein the third sub-reference line 243 is an extension of the symmetrical axis of the opening area 210 in the horizontal direction, and the fourth sub-reference line 244 is an extension of the symmetrical axis of the opening area 210 in the vertical direction. The first sub-reference line 241 and the second sub-reference line 242 are symmetrical with respect to the fourth sub-reference line 244 and are respectively located at the upper and lower sides of the opening area 210. Considering that the size of the opening area 210 in the horizontal direction is larger than that in the vertical direction, Figure 5 Three sub-reference lines are arranged horizontally and one sub-reference line is arranged vertically on the board surface of the middle insert board 200. In practice, the number of sub-reference lines arranged in a certain direction is determined according to the size of the opening area 210 in that direction.

[0044] for Figure 5 The first reference line 240 shown is used to determine the vertical placement position of the chip based on the third sub-reference line 243 when placing the chip on the plugboard 200. As for the horizontal placement position of the chip, the horizontal placement area of ​​the chip can be determined first, and then a sub-reference line located in the determined placement area is selected from the first sub-reference line 241, the second sub-reference line 242, and the fourth sub-reference line 244, and the horizontal placement position of the chip is determined based on the selected sub-reference line.

[0045] Figure 5 The three sub-reference lines in the middle horizontal direction are located, from left to right, in the left, middle, and right regions of opening area 210, respectively. The placement area is determined from the left, middle, and right regions of opening area 210. After the opening area 210 is divided into regions, placement areas can be determined from the three divided regions for chips of different sizes based on the chip test lead requirements. For example, for a chip whose horizontal dimension is less than half the horizontal dimension of opening area 210, if only the left side of the chip requires lead output, the left region of opening area 210 is determined as the placement area.

[0046] Figure 5 The second reference line 250 is set parallel to the edge EF and the edge GH, wherein a second reference line 250 is set on the edge EF and intersects with the pin 220 on the edge EF, and the depth of the edge EF inserted into the removable slot 120 or the fixed slot 130 is the distance between the edge EF and the second reference line 250 set on the edge EF; similarly, a second reference line 250 is set on the edge GH and intersects with the pin 220 on the edge GH, and the depth of the edge GH inserted into the removable slot 120 or the fixed slot 130 is the distance between the edge GH and the second reference line 250 set on the edge GH.

[0047] The plug board 200 described above includes pins 220 and metal sheets 230 , which are relatively simple and universal. This not only allows for replacement of accessories at a relatively low cost, but also allows for a wide range of applicable chips.

[0048] Finally, it should be noted that the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The embodiments of the present application are described above, and these embodiments do not describe all details in detail, nor do they limit the application to only the specific embodiments described. Obviously, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and its modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A circuit board for chip electrical failure analysis, comprising: A slide rail is provided on the surface of the circuit board, and a movable slot is slidably provided on the slide rail; A fixed slot is provided on the surface of the circuit board, the fixed slot being opposite to the movable slot, the fixed slot and the movable slot being respectively used to be inserted into one of a set of opposite edges of the plugboard and electrically connected to the inserted edge, the set of opposite edges of the plugboard being further used to electrically connect a chip placed on the plugboard; A conductive through hole is provided on the circuit board, and the conductive through hole is electrically connected to one of the movable slot and the fixed slot.

2. The circuit board according to claim 1, wherein Contact pins are provided on a group of opposite slot walls in the slots of each of the fixed slot and the movable slot. The contact pins provided on a group of opposite slot walls are insulated from each other. The fixed slot and the movable slot are each electrically connected to the side of the plug-in board through the contact pins.

3. The circuit board according to claim 2, wherein: There are multiple contact pins and multiple conductive through holes, and the contact pins and the conductive through holes are electrically connected one-to-one. The circuit board also includes an identification symbol set on the surface of the circuit board, and different conductive through holes are identified by different identification symbols.

4. The circuit board according to claim 3, wherein: The contact pins and the conductive through holes are electrically connected via connecting wires, and the connecting wires are hidden inside the circuit board.

5. The circuit board according to claim 1, further comprising: A supporting component is provided on the surface of the circuit board, and is located between the movable slot and the fixed slot, and is used to support a chip inserted into the fixed slot at one of a set of opposite sides.

6. The circuit board according to claim 1, further comprising: The pin holes are provided on the circuit board, and the pin holes are used to fix the circuit board on the carrier of the testing machine by vacuuming.

7. A test interface board for chip electrical failure analysis, comprising: The circuit board according to any one of claims 1 to 6; The interposer includes a set of opposite edges and an opening area for placing a chip arranged in the area between the set of opposite edges. The set of opposite edges are each electrically connected to the fixed slot or the movable slot inserted therein by setting pins, and the pins are also used to electrically connect the chip.

8. The test interface board according to claim 7, wherein: The interposer further includes a plurality of mutually insulated metal sheets arranged around the opening area. The metal sheets are used to connect the pins at one end and the chip at the other end so that the chip is electrically connected to the pins. The size of the opening area is limited by the area of ​​the central remaining area of ​​the interposer after the pins and the metal sheets are arranged.

9. The test interface board according to claim 8, wherein: The chip is packaged in the opening area of ​​the plugboard on the bottom surface of the plugboard through the COB packaging method, and the connection between the pins and the metal sheet, the metal sheet, the connection between the metal sheet and the chip, and the chip are all packaged in the insulating glue used in the COB packaging method.

10. The test interface board according to claim 7, wherein: A first reference line is provided on the board surface around the opening area, and the first reference line is used to assist in determining the placement position of the chip when the chip is placed on the board; And / or, a second reference line is provided on the board surface of the plugboard in an area near the pin, and the second reference line is used to assist in determining the insertion depth of each of a group of opposite edges of the plugboard when the group of opposite edges are respectively inserted into the fixed slot and the movable slot.

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