A clamp and method for locating failure points of encapsulated particles

Abstract

The present disclosure provides a clamp and a method for locating failure points of a packaged particle, and belongs to the technical field of integrated circuit packaging. The clamp comprises a tray and a cover. The tray can have a plurality of adjusting members. The cover can have a plurality of locating points, which are uniformly arranged on the cover. When the cover cooperates with the tray, the failure points of the packaged particle are matched with one of the locating points on the cover by moving the adjusting members. In this way, the failure points required for analysis can be located on the surface of the packaged particle without damaging the surface of the packaged particle, and the electrical failure analysis of the failure points can be performed.

Description

Technical Field

[0001] This disclosure relates to the field of integrated circuit packaging technology, and in particular to a method for locating the failure point of a fixture and packaging particles. Background Technology

[0002] In failure analysis of integrated circuit packaged components, electrical failure analysis (EFA) is typically used to determine the failure points within the packaged components. However, without damaging the packaged components, it is impossible to locate the failure points to be analyzed on the surface of the packaged components, thus making it impossible to perform electrical failure analysis on these failure points.

[0003] The information disclosed in the background section is only for enhancing the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to provide a fixture that can quickly and accurately locate the failure point of packaged particles.

[0005] To achieve the above-mentioned objectives, the present disclosure adopts the following technical solution:

[0006] According to a first aspect of this disclosure, a fixture is provided for locating failure points of encapsulated particles, the fixture comprising:

[0007] The tray has multiple adjustment options;

[0008] A receiving slot is formed inside the tray, and the receiving slot is used to hold the encapsulated particles;

[0009] A cover has multiple positioning points, and the multiple positioning points are evenly arranged on the cover.

[0010] When the cover is engaged with the tray, the failure point of the encapsulated particle is matched with a positioning point on the cover by moving the plurality of adjusting members.

[0011] In one exemplary embodiment of this disclosure, the upper surface of the tray is engraved with a two-dimensional coordinate axis, under which the failure point of the encapsulated particle corresponds to a coordinate.

[0012] In one exemplary embodiment of this disclosure, the upper part of the tray is further provided with a slot, the slot being located inside the two-dimensional coordinate axis, and the cover being able to be inserted into the slot;

[0013] When the cover is inserted into the slot, each positioning point of the cover has coordinates on the two-dimensional coordinate axis.

[0014] In one exemplary embodiment of this disclosure, the bottom of the receiving groove is further engraved with uniformly distributed grid lines.

[0015] In one exemplary embodiment of this disclosure, a plurality of the adjustment members are disposed on the side of the tray through through holes.

[0016] In one exemplary embodiment of this disclosure, the side of the tray includes four first side surfaces connected end to end in sequence, and the adjusting member passes through the first side surface.

[0017] In one exemplary embodiment of this disclosure, the adjusting member is located on the central axis of the first side.

[0018] In one exemplary embodiment of this disclosure, the adjusting member includes an adjusting rod and a support frame connected to the top end of the adjusting rod, the support frame being able to push the encapsulated particles to move under the action of the adjusting rod.

[0019] In one exemplary embodiment of this disclosure, the through hole has an internal thread, the adjusting rod has an external thread, and the top end of the adjusting rod is rotatably connected to the support frame.

[0020] In one exemplary embodiment of this disclosure, the adjusting rod is a bolt, and the top end of the adjusting rod is connected to the support frame via a bearing.

[0021] In one exemplary embodiment of this disclosure, the lower end of the support frame is movably connected to a groove formed at the bottom of the receiving slot.

[0022] In one exemplary embodiment of this disclosure, the tray and the cover are made of ceramic.

[0023] In one exemplary embodiment of this disclosure, each of the positioning points is hollowed out and engraved on the cover.

[0024] According to a second aspect of this disclosure, a method for locating the failure point of an encapsulated particle is provided, applied to the aforementioned fixture, the method comprising:

[0025] The encapsulation particle is placed in the receiving groove, and the coordinates of the failure point of the encapsulation particle are determined.

[0026] Cover the encapsulated particle with a cover, and select a target positioning point from among the multiple positioning points on the cover. The target positioning point is closest to the coordinates of the failure point of the encapsulated particle.

[0027] The encapsulation particle is moved so that its failure point matches the target positioning point.

[0028] In one exemplary embodiment of this disclosure, determining the coordinates of the packaged particle failure point includes:

[0029] The coordinates of the failure point of the encapsulated particle are determined based on the two-dimensional coordinate axes engraved on the upper surface of the tray.

[0030] In one exemplary embodiment of this disclosure, the method for locating the failure point of the encapsulated particle further includes:

[0031] The encapsulation particles are placed in the receiving groove;

[0032] Control the adjusting member so that the support frame of the adjusting member clamps the encapsulated particle;

[0033] The cover is engaged with a slot provided on the upper part of the tray, and the cover covers the encapsulated particles;

[0034] The adjustment element is controlled so that the failure point of the encapsulated particle matches the target positioning point.

[0035] In one exemplary embodiment of this disclosure, the method for locating the failure point of the encapsulated particle further includes:

[0036] Under X-rays, the encapsulation particle is moved so that the failure point of the encapsulation particle matches the target positioning point.

[0037] In one exemplary embodiment of this disclosure, it is characterized in that,

[0038] After the failure point of the encapsulated particle is matched with the target positioning point, the failure point of the encapsulated particle is located on one side of the target positioning point.

[0039] In one exemplary embodiment of this disclosure, moving the encapsulation particle so that the failure point of the encapsulation particle matches the target positioning point further includes:

[0040] The fixture is placed on the laser etching machine stage to form a mark on the surface of the encapsulated particles.

[0041] In one exemplary embodiment of this disclosure, the fixture is placed on the stage of a laser etching machine to form a mark on the surface of the encapsulated particles, and then the mark on the surface of the encapsulated particles is subjected to cross-sectional analysis using a focused ion beam.

[0042] When the cover mates with the tray, multiple adjusting components are moved to align the failure point of the packaged particle with a positioning point on the cover. This allows the failure point to be analyzed to be located on the surface of the packaged particle without damaging its surface, thus enabling electrical failure analysis of the failure point. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the structure of a clamp according to an embodiment of the present disclosure;

[0045] Figure 2 This is a schematic diagram of the structure of a clamp according to an embodiment of the present disclosure;

[0046] Figure 3 yes Figure 1 A cross-sectional view of the structure at clamp AA;

[0047] Figure 4 This is a schematic diagram of the structure of a cover according to an embodiment of the present disclosure.

[0048] The annotations for the main components in the diagram are explained below:

[0049] 10. Encapsulated particles; 11. Tray; 12. Adjusting rod; 13. Support frame; 14. Slot; 15. Bearing surface; 16. Cover; 17. Groove; 18. Receiving slot; 19. Failure point; 20. Positioning point. Detailed Implementation

[0050] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are set forth to give a full understanding of embodiments of this disclosure.

[0051] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details described, or other methods, components, materials, etc., can be employed. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the main technical concept of this disclosure.

[0052] When a structure is "on" other structures, it may mean that the structure is integrally formed on other structures, or that the structure is "directly" set on other structures, or that the structure is "indirectly" set on other structures through another structure.

[0053] The terms “a,” “one,” and “the” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and that other elements / components / etc. may exist in addition to those listed. The terms “first” and “second” are used only as markers and are not a limitation on the number of objects.

[0054] In failure analysis of integrated circuit packaged components, electrical failure analysis (EFA) is typically used to determine the failure points within the packaged components. However, without damaging the packaged components, it is impossible to locate the failure points to be analyzed on the surface of the packaged components, thus making it impossible to perform electrical failure analysis on these failure points.

[0055] This disclosure provides a fixture for locating failure points in encapsulated particles. (See reference...) Figures 1-4 The fixture may include a tray 11 and a cover 16. The tray 11 may have multiple adjusting members. The cover 16 may have multiple positioning points 20, which are evenly distributed on the cover 16. When the cover 16 engages with the tray 11, the multiple adjusting members are moved so that the failure point 19 of the encapsulated particle 10 matches one of the positioning points 20 on the cover 16. This allows the failure point 19 to be analyzed to be located on the surface of the encapsulated particle 10 without damaging it, thus enabling electrical failure analysis of the failure point 19.

[0056] The components of the fixture provided in this embodiment will now be described in detail with reference to the accompanying drawings:

[0057] In one embodiment of this disclosure, the upper surface of the tray 11 may be engraved with a two-dimensional coordinate axis, under which any failure point 19 of the encapsulated particle 10 corresponds to a coordinate. The two-dimensional coordinate axis may have a horizontal axis and a vertical axis, which may be perpendicular to each other, and the scales on the horizontal and vertical axes may be evenly distributed. For example, the horizontal axis of the two-dimensional coordinate axis may be divided into 7 evenly distributed scale values, where the coordinates of each point are (1,0), (2,0), (3,0), (4,0), (5,0), (6,0), and (7,0) respectively. Correspondingly, the vertical axis of the two-dimensional coordinate axis may also be divided into 7 evenly distributed scale values, where the coordinates of each point are (0,1), (0,2), (0,3), (0,4), (0,5), (0,6), and (0,7) respectively. In other embodiments of this disclosure, when there are many failure points 19 of the encapsulated particle 10, the horizontal and vertical axes of the two-dimensional coordinate axis can be divided into several other number of scale values, such as 8 or 9 segments, etc. This disclosure does not impose any special restrictions, and can be adjusted accordingly according to actual needs.

[0058] Optionally, the upper part of the tray 11 may also be provided with a slot 14, which can be located inside the two-dimensional coordinate axis, and the cover 16 can be inserted into the slot 14. When the cover 16 is inserted into the slot 14, each positioning point 20 of the cover 16 has a coordinate value under the two-dimensional coordinate axis. That is, a positioning point 20 can find its corresponding coordinate under the two-dimensional coordinate axis. In this way, when locating the failure point 19 of the packaged particle 10, when the packaged particle 10 is placed on the tray 11, the positioning point 20 closest to the failure point 19 can be found through the packaging structure diagram of the packaged particle 10. And this positioning point 20 has a clear coordinate under the two-dimensional coordinate axis. It is only necessary to move the failure point 19 on the packaged particle 10 to the positioning point 20 to complete the positioning of the failure point 19 of the packaged particle 10.

[0059] Optionally, each positioning point 20 can be engraved on the cover 16 in a hollowed-out state, making it easier to match the failure point 19 of the encapsulated particle 10 with the positioning point 20 on the cover 16.

[0060] Optionally, the cover 16 and the tray 11 can be made of ceramic. When irradiated with X-rays, on the one hand, the specific distribution of the failure points 19 of the encapsulated particles 10 can be seen, making it easier to find the coordinates of the failure points 19. On the other hand, the distribution of the positioning points 20 on the cover 16 can be seen, so that the deviation between the failure points 19 and the positioning points 20 can be directly seen, thereby enabling the failure points 19 to move more accurately to the positioning points 20.

[0061] Optionally, the cover 16 can be provided with 12 positioning points 20, each of which corresponds to coordinates on a two-dimensional coordinate axis. For example, for ease of marking, the positioning point 20 can be denoted as Mark, and the coordinates of each positioning point 20 can be denoted as Mark1(1,2), Mark2(2,2), Mark3(3,2), Mark4(4,2), Mark5(5,2), Mark6(6,2), Mark7(1,3), Mark8(2,3), Mark9(3,3), Mark10(4,3), Mark11(5,3), and Mark12(6,3). This allows for the matching of the positioning points 20 on the cover 16 with their coordinates on the two-dimensional coordinate axis.

[0062] Optionally, a uniformly distributed grid line can be engraved on the bottom of the receiving groove 18. The grid line facilitates the reading of the coordinates of the two-dimensional coordinate axes.

[0063] In one embodiment of this disclosure, multiple adjusting members can be inserted through through holes into the side of the tray 11. The side of the tray 11 may include four first side surfaces connected end-to-end, and the adjusting members are inserted into each of these first side surfaces. That is, one first side surface can correspond to one adjusting member, and the adjusting member can be located on the central axis of the first side surface.

[0064] Optionally, the tray 11 may also be provided with a protrusion, which may have a bearing surface 15 for bearing the encapsulated particles 10.

[0065] In some other embodiments, multiple adjustment members can be inserted through a first side, which can improve the clamping force of the fixture on the packaged particle 10 and improve the displacement accuracy of the adjustment members when moving the packaged particle 10, thereby improving the positioning accuracy of the failure point 19 of the packaged particle 10.

[0066] Optionally, each of the first side surfaces may be provided with a through hole, which may be located on the central axis of the first side surface. The adjusting component can be inserted through the through hole into each of the first side surfaces. It is worth noting that there may be multiple through holes, with one through hole corresponding to one adjusting component.

[0067] In one embodiment of this disclosure, the adjusting member may include an adjusting rod 12 and a support frame 13 connected to the top of the adjusting rod 12. The support frame 13 can drive the encapsulated particle 10 to move under the action of the adjusting rod 12. After the coordinates of the failure point 19 on the encapsulated particle 10 are found, the adjusting rod 12 is moved, so that the support frame 13 drives the encapsulated particle 10 to move under the action of the adjusting rod 12. This moves the failure point 19 on the encapsulated particle 10 to the positioning point 20 closest to the failure point 19, thereby completing the positioning of the failure point 19 of the encapsulated particle 10. This allows for quick positioning of the failure point 19 of the encapsulated particle 10, thereby saving time and improving work efficiency.

[0068] Optional, see reference Figure 3 The bottom of the receiving groove 18 is also provided with a groove 17, within which the support frame 13 can reciprocate. On the one hand, the groove 17 has a guiding function, preventing the support frame 13 from deviating from its direction during movement. On the other hand, when the adjusting rod 12 is a bolt, this restricts the degree of freedom of the support frame, ensuring that the support frame 13 can only maintain linear motion and not rotate.

[0069] Optionally, the through hole may have an internal thread, and the adjusting rod 12 may have an external thread. The external thread of the adjusting rod 12 can mate with the internal thread of the through hole, and the top end of the adjusting rod 12 is rotatably connected to the support frame 13. When the adjusting rod 12 rotates relative to the support frame 13, since the external thread of the adjusting rod 12 can mate with the internal thread of the through hole, the adjusting rod 12 can move towards or away from the through hole while rotating. When the adjusting rod 12 moves towards the through hole, the adjusting rod 12 can drive the support frame 13 to clamp one side of the encapsulated particle 10.

[0070] Optionally, the adjusting rod 12 mentioned in this disclosure can be a bolt with external threads on its outer surface, which can mate with the internal threads of the through hole. The top end of the adjusting rod 12 can be connected to the support frame 13 via a bearing. When the adjusting rod 12 moves toward the through hole, the support frame 13 remains stationary due to the bearing, thereby allowing the support frame 13 to clamp or loosen the encapsulated particles 10.

[0071] In one embodiment of this disclosure, the number of adjusting components can be four, namely, four adjusting rods 12 and four support frames 13. When locating the failure point 19 of the encapsulated particle 10, the encapsulated particle 10 needs to be placed on the bearing surface 15 and clamped to its four sides using the adjusting components. The extension directions of the four adjusting rods 12 are perpendicular to the four sides of the encapsulated particle 10. Then, the cover 16 is inserted into the slot 14, and by adjusting the movement direction of the four adjusting rods 12, a failure point 19 on the encapsulated particle 10 is matched with its nearest positioning point 20. This allows for rapid positioning of the failure point 19 of the encapsulated particle 10, thus saving time.

[0072] This disclosure provides a method for locating the failure point of an encapsulated particle, applied to the aforementioned fixture. The method for locating the failure point of the encapsulated particle may include:

[0073] S110, a packaged particle 10 is placed in the receiving slot 18 of the fixture, and the coordinates of the failure point 19 of the packaged particle 10 are determined.

[0074] S120, cover the encapsulation particle 10 with the cover 16, and select a target positioning point among the multiple positioning points 20 on the cover 16, the target positioning point being closest to the coordinate distance of the failure point 19 of the encapsulation particle 10;

[0075] S130, move the encapsulation particle 10 so that the failure point 19 of the encapsulation particle 10 matches the target positioning point.

[0076] In this disclosure, the failure point 19 of the packaged particle 10 can be quickly located using the above-described failure point 19 location method, thereby enabling electrical analysis of the failure point 19.

[0077] Optionally, in step S110, determining the coordinates of the failure point 19 of the encapsulated particle 10 may include: determining the coordinates of the failure point 19 of the encapsulated particle 10 according to the two-dimensional coordinate axis engraved on the upper surface of the tray 11. It is worth noting that after clamping the encapsulated particle 10, the coordinates of the failure point 19 of the encapsulated particle 10 can be directly obtained from the two-dimensional coordinate axis.

[0078] Optionally, in step S140, the encapsulation particle 10 can be moved using an adjusting member to bring its failure point 19 closer to the positioning point 20. Then, under X-ray irradiation, since the cover 16 is made of ceramic, the X-rays can penetrate the cover 16, allowing the deviation between the failure point 19 of the encapsulation particle 10 and the target positioning point to be observed. At this point, the encapsulation particle 10 can be moved further using the adjusting member to reduce the deviation between the failure point 19 and the target positioning point. This allows the failure point 19 of the encapsulation particle 10 to be accurately moved to the target positioning point without damaging the surface of the encapsulation particle 10.

[0079] Optionally, after the failure point 19 of the packaged particle 10 is matched with the target positioning point on the cover 16, the fixture can be placed under a laser etching machine. The laser can etch the surface of the packaged particle 10 through the target positioning point on the cover 16, thereby enabling vertex profile analysis of the surface of the packaged particle 10 using a focused ion beam. Due to the presence of the positioning point 20 on the cover 16, it is less likely to overcut the failure point 19 of the packaged particle 10 during laser etching, thus saving time costs associated with point profile analysis and improving analysis efficiency.

[0080] It is worth noting that when the failure point 19 of the encapsulated particle 10 matches the target positioning point, the failure point 19 of the encapsulated particle 10 is located on one side of the target positioning point.

[0081] In one embodiment of this disclosure, the method for locating the failure point of the encapsulated particle may further include:

[0082] S210, the encapsulated particle 10 is placed in the receiving groove 18;

[0083] S220, control adjustment component, so that the support frame 13 of adjustment component clamps the encapsulated particle 10;

[0084] S230, the cover 16 is engaged with the slot 14, and the cover 16 covers the encapsulation particle 10;

[0085] S240, move the packaged particle 10 so that the failure point 19 of the packaged particle 10 matches the target positioning point.

[0086] It should be noted that although the steps of the method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps, such as omitting certain steps, combining multiple steps into one step, and / or breaking down one step into multiple steps, should all be considered part of this disclosure.

[0087] It should be understood that this disclosure is not limited to the detailed structure and arrangement of the components presented in this specification. This disclosure is capable of other embodiments and can be implemented and performed in various ways. The foregoing variations and modifications fall within the scope of this disclosure. It should be understood that this disclosure, as disclosed and defined in this specification, extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or drawings. All these different combinations constitute multiple alternative aspects of this disclosure. The embodiments described in this specification illustrate the best known mode for implementing this disclosure and will enable those skilled in the art to utilize this disclosure.

Claims

1. A fixture for locating the failure point of a packaged particle, characterized in that, The clamp comprises: a tray with a plurality of adjusting members; a containing groove opened in the tray, the containing groove being used for placing the packaged particles; a cover with a plurality of positioning points, the positioning points being evenly arranged on the cover; when the cover is matched with the tray, the failure point of the packaged particle is matched with one of the positioning points on the cover by moving the adjusting members.

2. The clamp of claim 1, wherein the upper surface of the tray is engraved with a two-dimensional coordinate axis, and the failure point of the packaged particle corresponds to a coordinate under the two-dimensional coordinate axis.

3. The clamp of claim 2, wherein the upper part of the tray is further provided with a clamping groove, the clamping groove being located inside the two-dimensional coordinate axis, and the cover can be clamped into the clamping groove; when the cover is clamped into the clamping groove, each positioning point of the cover has a coordinate under the two-dimensional coordinate axis.

4. The clamp of claim 3, wherein the bottom of the containing groove is further engraved with evenly distributed grid lines.

5. The clamp of claim 1, wherein the adjusting members are arranged on the side of the tray through through holes.

6. The clamp of claim 5, wherein the side of the tray comprises four first sides connected in sequence, and the adjusting members are arranged on the first sides.

7. The clamp of claim 6, wherein the adjusting members are located on the central axis of the first sides.

8. The clamp of claim 5, wherein the adjusting member comprises an adjusting rod and a support frame connected to the top end of the adjusting rod, and the support frame can drive the packaged particle to move under the driving of the adjusting rod.

9. The clamp of claim 8, wherein, the through hole has an internal thread, the adjusting rod has an external thread, and the top end of the adjusting rod is rotationally connected with the support frame.

10. The clamp of claim 9, wherein, the adjusting rod is a bolt, and the top end of the adjusting rod is connected with the support frame through a bearing.

11. The clamp of claim 10, wherein, the bottom of the containing groove is further provided with a groove, and the support frame can reciprocate in the groove.

12. The clamp of claim 1, wherein the materials of the tray and the cover are ceramics.

13. The clamp of claim 1, wherein each positioning point is hollowed out on the cover.

14. A method of locating a failure point of a packaged particle, characterized by, The positioning method of the failure point of the packaged particle applied to the clamp of any one of claims 1-13 comprises: placing the packaged particle in the containing groove and determining the coordinate of the failure point of the packaged particle; covering the cover on the packaged particle, selecting a target positioning point from the positioning points on the cover, and the target positioning point is closest to the coordinate of the failure point of the packaged particle; moving the packaged particle so that the failure point of the packaged particle matches the target positioning point.

15. The method of claim 14, wherein, The determination of the coordinate of the failure point of the packaged particle comprises: determining the coordinate of the failure point of the packaged particle according to the two-dimensional coordinate axis engraved on the upper surface of the tray.

16. The method of claim 14, wherein, The positioning method of the failure point of the packaged particle further comprises: placing the packaged particle in the containing groove; controlling the adjusting member so that the support frame of the adjusting member clamps the packaged particle; matching the cover with the clamping groove opened on the upper part of the tray, and the cover covers the packaged particle; controlling the adjusting member so that the failure point of the packaged particle matches the target positioning point.

17. The method of claim 14, wherein: The positioning method of the failure point of the packaged particle further comprises: moving the packaged particle under X-ray so that the failure point of the packaged particle matches the target positioning point.

18. The positioning method of the failure point of the packaged particle according to claim 14, wherein After the failure point of the encapsulated particle matches the target positioning point, the failure point of the encapsulated particle is located on one side of the target positioning point.

19. The method of claim 14, wherein, The moving the encapsulated particle so that the failure point of the encapsulated particle matches the target positioning point further comprises: placing the jig on a laser etching machine worktable to form a mark on the surface of the encapsulated particle.

20. The method of claim 19, wherein, After placing the jig on a laser etching machine worktable to form a mark on the surface of the encapsulated particle, using a focused ion beam to profile analyze the mark on the surface of the encapsulated particle.

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