Thermal analysis device

Abstract

The invention provides a thermal analyzer which can be effectively used for materials generated by volatilization of a plurality of components with different boiling points due to heating. A thermal analysis device (51) for checking physical properties associated with temperature changes of a material in which a low-boiling-point component having a relatively low boiling point and a high-boiling-point component having a relatively high boiling point than the low-boiling-point component volatilize due to heating are used as objects, the thermal analysis device (51) being provided with: a precipitate generation unit (52) for generating a precipitate; a heating step for heating the sample of the material to separate out a high-boiling-point component in a generated gas generated thereby, thereby generating a precipitate for analysis; and a gas generation unit (53) that heats the sample of the material and generates an analysis gas containing a low-boiling-point component.

Description

Technical Field

[0001] This application claims the benefit of priority based on Japanese Patent Application No. 2024-041614, filed on March 15, 2024. The entire contents of this Japanese patent application are incorporated herein by reference.

[0002] The present invention relates to a thermal analysis device. Background Art

[0003] For example, when using raw materials, materials, products, parts, or components made of resin materials, metal materials, ceramic materials, or other various materials, their components may be volatilized by heating.

[0004] In order to understand in advance the various effects of volatilization of components in such situations, the material may be analyzed using a thermal analyzer to confirm the material's physical properties as it changes with temperature.

[0005] As a related technology, for example, Patent Document 1 describes "a thermal analysis device with a gas analysis function, comprising: a protective tube surrounding a sample; a sample temperature control mechanism for changing the temperature of the sample; and a gas analysis mechanism connected to the protective tube via a gas conduit. The thermal analysis device is characterized in that it comprises: a gas conduit temperature control mechanism for changing the temperature of the gas conduit; a sample temperature detection mechanism for detecting the temperature of the sample; and a control mechanism for controlling the gas conduit temperature control mechanism based on a temperature detection result of the sample temperature detection mechanism, wherein the control mechanism controls the gas conduit temperature control mechanism so that the temperature of the gas conduit is equal to the temperature of the sample."

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 5-60709

[0007] However, some of the above materials volatilize to produce different components in different temperature ranges when heated.

[0008] For example, when such materials are heated at relatively low temperatures, certain components may volatilize, while other components do not volatilize and remain in solid form, which may have certain effects on the use of raw materials composed of such materials. Therefore, a thermal analysis device that can effectively determine the physical properties of such materials is desired. Summary of the Invention

[0009] The present invention aims to solve such a problem, and an object thereof is to provide a thermal analysis device that can be effectively used for a material produced by volatilizing a plurality of components having different boiling points by heating.

[0010] A thermal analysis device capable of solving the above-mentioned problems is a device for determining the physical properties of a material produced by the volatilization of a low-boiling-point component having a relatively low boiling point and a high-boiling-point component having a relatively higher boiling point than the low-boiling-point component upon heating. The device comprises: a precipitate generating unit for heating a sample of the material to precipitate the high-boiling-point component in the generated gas to produce a precipitate for analysis; and a gas generating unit for heating the sample of the material to produce a gas for analysis containing the low-boiling-point component.

[0011] Effects of the Invention

[0012] The above-mentioned thermal analysis apparatus can be effectively used for a material in which a plurality of components having different boiling points are volatilized by heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a cross-sectional view showing an example of an injection molding machine that can use, as a molding material, a material that can be used in the thermal analysis apparatus according to one embodiment of the present invention.

[0014] Figure 2 This is a piping and instrumentation diagram schematically showing a thermal analysis device according to one embodiment of the present invention.

[0015] Explanation of symbols

[0016] 1-Injection molding machine, 2-Base, 11-Injection device, 12-Cylinder, 12a-Supply port, 12b-Nozzle, 12c-Water-cooled cylinder, 13-Screw, 14-Heating element, 15-Motor box, 21-Moving device, 22-Hydraulic pump, 23-Pumping motor, 24-Hydraulic cylinder, 25-Sliding base, 26-Guide, 31-Mold clamping device, 32-Press plate, 32a-Fixed press plate, 32b-Movable press plate, 32c-Connecting rod, 32d-Guide component, 33-Press plate operating mechanism Structure, 34-rear pressure plate, 35-mold clamping motor, 36-motion conversion mechanism, 36a-screw shaft, 36b-nut, 37-toggle mechanism, 37a~37c-connecting rod, 37d-crosshead, 38-mold thickness adjustment motor, 41-ejection device, 42-ejection rod, 43-rod driving source, 51-thermal analysis device, 52-precipitate generation part, 53-gas generation part, 54-heating reaction part, 54a-heating furnace, 54b-reaction tube, 55-cooling part, 55a-precipitate adhesion part , 55b-cooling device, 55c, 55d-adhesion surface, 55e-rotating axis, 56-heating reaction part, 56a-heating furnace, 56b-reaction tube, 56c-capturing part, 57-gas analysis part, 58a-first gas storage room (gas storage room), 58b-second gas storage room (gas storage room), 58c-third gas storage room (gas storage room), 59, 59a, 59h~59j-gas distribution pipe, 59b, 59e-first branch road, 59c, 59f-second branch road Branch, 59d, 59g-third branch, 60a~60g, 61c, 61d, 64a~64d, 67a~67c-valves, 61a, 61b-gas supply pipe, 62a~62c-gas supply source, 63a~63c-gas flow path, 65-six-way valve, 65a~65f-port, 66a~66c-vacuum exhaust pipe, 68-vacuum pump, 69-exhaust piping, 101-mold device, 102-fixed mold, 103-movable mold, 104-movable part. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0018] A thermal analysis device according to one embodiment of the present invention analyzes a material whose target material is a low-boiling-point component with a relatively low boiling point and a high-boiling-point component with a relatively high boiling point, which volatilizes upon heating. The device is used to determine the physical properties of such a material as they change with temperature.

[0019] As the above-mentioned materials, there are various materials such as resin materials, metal materials such as steel materials, ceramic materials, etc. Here, as an example, Figure 1The case where a resin material is used as a molding material in injection molding by the injection molding machine 1 as exemplified in FIG will be described in detail. However, the material to be used in the thermal analysis device of the present invention is not limited to the molding material.

[0020] (Overview of Injection Molding Machine)

[0021] Figure 1 The injection molding machine 1 shown generally comprises: an injection unit 11, which melts a molding material such as a thermoplastic resin and injects it into a mold unit 101 by rotating and advancing a screw 13 disposed therein and heating it with a heater 14 disposed therearound; a moving unit 21, which moves the injection unit 11 forward and backward relative to the mold unit 101; a clamping unit 31, which opens and closes the mold unit 101 between a closed state and an open state; and an ejector unit 41, which removes a molded product from the mold unit 101 in the open state.

[0022] In the illustrated example, the mold assembly 101 mounted on the injection molding machine 1 comprises a fixed mold 102 and a movable mold 103, which define a cavity in the closed mold state; and movable components 104, such as ejector pins, which are displaced by the ejector assembly 41 to eject and remove the molded product. This mold assembly 101 can be considered a two-plate mold, primarily divided into two parts: the fixed mold 102 and the movable mold 103. However, it can also be a three-plate mold, further divided into three parts by including a sliding mold, a sliding core, or a stripper plate. The mold assembly 101 is appropriately mounted on the injection molding machine 1 and is replaceable, depending on the shape of the molded product to be manufactured. Here, the mold assembly 101 is not considered part of the injection molding machine 1. Equipment or machinery comprising the injection molding machine 1 and the mold assembly 101 mounted on the injection molding machine 1 is sometimes referred to as an injection molding system.

[0023] In injection molding using the injection molding machine 1, a mold clamping process is performed as described later. In the mold clamping process, after the molding material has been measured and arranged in a predetermined amount inside the injection device 11 in the previous metering process, the mold device 101 is closed using the mold clamping device 31 to put it into a mold clamping state.

[0024] Next, the following are carried out in sequence: a filling process, in which the screw 13 is advanced to inject the above-mentioned molding material into the mold device 101, thereby filling the molding material into the cavity in the mold device 101; and a pressure holding process, in which the screw 13 is further advanced to maintain the molding material inside the front end of the injection device 11 at a specified pressure.

[0025] Next, a cooling step is performed, in which the molding material filled in the cavity of the mold unit 101 is cooled and solidified, thereby obtaining a molded product. At this point, a metering step is performed, in which the molding material, which has been separately introduced into the injection unit 11, is heated by the heater 14 and melted while being conveyed toward the front end of the injection unit 11 by the rotation of the screw 13, thereby filling the front end with a predetermined amount of molding material.

[0026] Then, a removal process is performed in which the mold clamping device 31 is operated to open the mold device 101 to bring it into a mold-open state, and the ejector device 41 moves the movable member 104 to remove the molded product from the mold device 101 .

[0027] (Thermal Analysis Equipment)

[0028] In the injection molding process described above, a molding material heated in the injection unit 11 is injected into the mold unit 101. At this point, the molding material, which is a resin material, decomposes due to the heating. The low-boiling-point components generated from the molding material have lower boiling points than the high-boiling-point components. Therefore, even when the mold unit 101 cools, the low-boiling-point components do not precipitate, but are discharged to the outside through an exhaust port or the like provided in the mold unit 101.

[0029] On the other hand, high-boiling-point components generated from the molding material along with low-boiling-point components cool and precipitate within the mold device 101, and adhere to the surfaces of gaps and spaces within the mold device 101 to form deposits (so-called mold deposits). These deposits prevent the molding material from being smoothly filled into the mold device 101, causing not only shape defects in the molded product but also molding defects such as clogging the exhaust port and causing gas burning.

[0030] Under such circumstances, it is desirable to understand or study molding conditions that can suppress molding defects before mass production when using a molding material that is a resin material of a predetermined composition or type. In such a case, the thermal analysis apparatus of this embodiment can be preferably used.

[0031] Figure 2 An example of a thermal analysis device 51 is shown in FIG. The illustrated thermal analysis device 51 targets materials such as the aforementioned molding material, which produce components such as low-boiling-point components and high-boiling-point components that volatilize upon heating. The terms "low boiling point component" and "high boiling point component" here refer to the relative difference in boiling point between these components, such as whether the boiling point of one component is higher or lower than that of another component, and do not indicate relative differences relative to a specific temperature. The material to be analyzed is not particularly limited, as long as it produces multiple components that volatilize at different temperatures upon heating.

[0032] In the case of a resin material used as a molding material for injection molding, an example of such a resin material is PBT, which is an ester-based polymer material. When PBT is heated, its main chain is thermally decomposed and cut, thereby generating high-boiling-point components such as terephthalic acid and oligomers, and low-boiling-point components including linear or branched saturated or unsaturated hydrocarbons. The low-boiling-point components are sometimes composed of, for example, C n H 2n+2 (n≥1) represented by alkanes, C n H 2n (n≥2) represented by olefins, n H 2n-2 (n≥2) represents an alkyne or diene, etc.

[0033] Other examples of the resin materials include polyester-based polymers, polyamide-based polymers, polyolefin-based polymers, acrylonitrile-butadiene-styrene copolymers, polycarbonate resins, polyphenylene sulfide resins, and acrylic resins. Examples of polyester-based polymers include polyethylene terephthalate, polypropylene terephthalate, and polybutylene terephthalate (PBT). Furthermore, the resin materials may be a single resin material or a mixture of multiple resin materials. Furthermore, they may contain different types of monomer units, as in copolymers.

[0034] Thermal analysis apparatus 51, used to determine the physical or thermal properties of such materials as they change temperature, includes a precipitate generator 52 for precipitating high-boiling-point components to generate analytical precipitates, and a gas generator 53 for generating analytical gas containing low-boiling-point components. In precipitate generator 52 and gas generator 53, a sample of the material is heated to generate the analytical precipitate and analytical gas, respectively.

[0035] Furthermore, by analyzing the components of the analytical precipitate obtained in the precipitate generating section 52 and the analytical gas obtained in the gas generating section 53, and identifying and quantifying them, it is possible to confirm the physical properties of the material when heated at a predetermined temperature. Therefore, it can be said that the thermal analysis apparatus 51 of this embodiment is effectively applicable to materials produced by the volatilization of multiple components having different boiling points upon heating.

[0036] In the illustrated thermal analysis apparatus 51, the precipitate generation unit 52 includes a heating reaction unit 54 and a cooling unit 55. The heating reaction unit 54, which heats the sample, can be configured as long as it is capable of heating the sample. For example, it can be configured by placing at least a portion of a U-shaped or other shaped reaction tube 54b filled with the sample within a heating furnace 54a. The reaction tube 54b is preferably made of heat-resistant glass (such as borosilicate glass, alumina glass, or quartz). This allows for visual inspection of the interior during post-use cleaning and, if made of metal such as stainless steel, prevents unintended catalytic effects of the metal on the sample.

[0037] The cooling section 55 of the precipitate generating section 52 is located downstream of the flow direction of the generated gas produced by heating the sample in the heating reaction section 54. The generated gas delivered from the heating reaction section 54 is cooled in the cooling section 55, causing the high-boiling-point components in the generated gas to precipitate. This produces a precipitate for analysis containing the high-boiling-point components.

[0038] In the illustrated example, the cooling unit 55 comprises a plate-shaped precipitate attachment portion 55a positioned near the outlet or opening of the reaction tube 54b disposed in the heating reaction unit 54 so that the generated gas flowing therefrom contacts it; and a cooling device 55b disposed behind the precipitate attachment portion 55a. The location of the cooling device 55b is not particularly limited, as long as it can cool the attachment surface 55c of the precipitate attachment portion 55a that contacts the generated gas. When the generated gas is blown from the outlet of the reaction tube 54b in the heating reaction unit 54 toward the attachment surface 55c of the precipitate attachment portion 55a, the generated gas is cooled by the cooling device 55b, generating analytical precipitates from the generated gas and adhering to the attachment surface 55c. The analytical precipitates are collected from the attachment surface 55c and can be used for component identification, quantitative analysis, and other analyses using known machinery.

[0039] After obtaining an analytical precipitate in the precipitate generating section 52, if the next analytical precipitate is continuously generated in the precipitate generating section 52 for the same or different sample while the analytical precipitate is being analyzed, the cooling section 55 can be provided with multiple attachment surfaces 55c and 55d for depositing analytical precipitates. This allows the collection and analysis of the analytical precipitate on one attachment surface 55c to proceed while the next analytical precipitate is being generated on another attachment surface 55d. As shown in the figure, the multiple attachment surfaces 55c and 55d can be provided at different locations on the same precipitate attaching section 55a. Furthermore, although not shown in the figure, multiple precipitate attaching sections can also be provided, with the multiple attachment surfaces 55c and 55d being provided on each of these precipitate attaching sections. Alternatively, three or more attachment surfaces can be provided.

[0040] In this case, the cooling unit 55 may be provided with a driving mechanism for driving the precipitate adhering portion 55 a so as to change the adhering surface with which the generated gas comes into contact among the plurality of adhering surfaces 55 c and 55 d . Figure 2 5. A rotating shaft 55e is shown as a part of an example of the driving mechanism. The rotating shaft 55e is attached to the precipitate adhering portion 55a to rotate the precipitate adhering portion 55a, thereby causing either the adhering surface 55c or 55d of the precipitate adhering portion 55a to move alternately or sequentially to a position facing the outlet of the reaction tube 54b.

[0041] The gas generating section 53 of the thermal analysis device 51 may include, for example, a heating reaction section 56 for heating the sample and a gas analysis section 57 disposed downstream of the heating reaction section 56 in the flow direction of the analytical gas generated in the heating reaction section 56 for analyzing the analytical gas.

[0042] The heating reaction section 56 of the gas generating section 53 can be comprised of a heating furnace 56a and a U-shaped reaction tube 56b, similar to those of the heating reaction section 54 of the precipitate generating section 52. However, in order to separate high-boiling-point components from the analytical gas generated in the heating reaction section 56, the gas generating section 53 preferably includes a capture section 56c downstream of the heating reaction section 56 in the direction of flow, which precipitates and captures the high-boiling-point components. Meanwhile, the capture section 56c can be set to a temperature that prevents the precipitation of low-boiling-point components, preventing them from being captured in the capture section 56c and allowing them to pass through the capture section 56c. This allows the analytical gas, from which the high-boiling-point components have been removed, to be delivered to the gas analysis section 57 downstream in the direction of flow, thereby improving the accuracy of the analysis of the low-boiling-point components in the gas analysis section 57.

[0043] The capture section 56c can be provided with a cooler for cooling it so that high-boiling-point components are precipitated. However, as in the illustrated embodiment, even if such a cooler is not provided and the position where the capture section 56c is provided in the heating reaction section 56 is simply located outside the heating furnace 56a, the analytical gas can sometimes be appropriately cooled in the capture section 56c to a temperature at which high-boiling-point components are precipitated.

[0044] The gas analysis unit 57 is preferably capable of identifying and quantifying the components in the analytical gas. In one example, the gas analysis unit 57 may be a known gas chromatograph capable of identifying and quantifying the components in the gas. Furthermore, if necessary, the gas analysis unit 57 may be provided with a flow meter to measure the flow rate of the analytical gas.

[0045] Gas generation section 53 may include multiple gas storage chambers 58a to 58c, each capable of storing analytical gas, located downstream of heating reaction section 56 and upstream of gas analysis section 57 in the direction of analytical gas flow. In this case, until analysis of a given analytical gas in gas analysis section 57 is completed, the analytical gas subsequently generated in heating reaction section 56 can be stored in gas storage chamber 58a, 58b, or 58c. In the illustrated example, three gas storage chambers 58a, 58b, and 58c are provided, but two or four or more gas storage chambers may also be provided.

[0046] Before storing the analytical gas, the gas storage chamber 58a, 58b, or 58c is preferably purged by the vacuum pump 68. This allows components other than the analytical gas to be removed, and thus improves the analytical accuracy.

[0047] Furthermore, after analyzing the analytical gas stored in the gas storage chamber 58a, 58b or 58c in the gas analysis unit 57, the gas in the gas storage chamber 58a, 58b or 58c can be removed using the vacuum pump 68 by opening the valve 67a, 67b or 67c provided in the vacuum exhaust pipe 66a, 66b or 66c.

[0048] Gas piping 59, located downstream of heating reaction section 56 of gas generating section 53 in the direction of gas flow, is connected to gas piping 59a only when analytical gas is stored in gas storage chamber 58a, 58b, or 58c via six-way valve 65, and is otherwise connected to exhaust piping 69. Specifically, gas piping 59 is connected to port 65a of six-way valve 65, and except when analytical gas generated in heating reaction section 56 is stored in gas storage chamber 58a, 58b, or 58c, gas components such as ambient gas flowing from heating reaction section 56 are discharged through port 65f and exhaust piping 69 via the solid line portion of six-way valve 65.

[0049] Meanwhile, port 65c is connected to gas piping 63, which communicates with ambient air. Unless the analytical gas generated in heating reaction section 56 is stored in gas storage chamber 58a, 58b, or 58c, ambient air flows through port 65b to gas piping 59a. In this case, valves 60a to 60f are closed, and only valve 60g is open, so ambient air is introduced into gas analysis section 57 via gas piping 59i, 59h, and ports 65e and 65d.

[0050] When storing the analytical gas generated in the heating reaction section 56 in the gas storage chamber 58a, 58b, or 58c, valve 60g is closed, and the valves provided on the heating and analysis sides of the gas storage chamber where the gas is stored are opened, and the gas is then passed through the dotted line portion of the six-way valve 65. As a result, the analytical gas generated in the heating reaction section 56 passes from port 65b through the gas storage chamber 58a, 58b, or 58c, and then through gas piping 59h, port 65e, and is discharged from port 65f through exhaust piping 69.

[0051] Next, the valves on the heating and analysis sides of the gas storage chamber, which stores analytical gas, are closed, and valve 60g is opened. This stores analytical gas in gas storage chamber 58a, 58b, or 58c. Furthermore, at this point, the ambient gas introduced through port 65c flows out of port 65d and into gas analysis unit 57, bypassing gas pipes 59, 59a, 59h-59j.

[0052] When analyzing analytical gas stored in gas storage chamber 58a, 58b, or 58c in gas analysis unit 57, the gas is switched to flow through the solid line portion of six-way valve 65, valve 60g is closed, and the valves on the heating and analysis sides of the gas storage chamber storing the analytical gas are opened. This allows the analytical gas stored in gas storage chamber 58a, 58b, or 58c, along with ambient gas supplied from port 65c, to be delivered to gas analysis unit 57 through ports 65e and 65d for component identification and quantitative analysis.

[0053] In the illustrated example, gas piping 59a connected to reaction tube 56b of heating reaction section 56 branches midway into a first branch path 59b on the heating side, a second branch path 59c, and a third branch path 59d. These branches are connected to first, second, and third gas storage chambers 58a, 58b, and 58c, respectively. Furthermore, first, second, and third gas storage chambers 58a, 58b, and 58c are connected to first, second, and third branch paths 59e, 59f, and 59g on the analysis side, respectively. These branches merge midway into gas piping 59h, which is connected to gas analysis section 57.

[0054] Valves 60a to 60f, such as on-off valves, are provided on the first, second, and third branched passages 59b, 59c, and 59d on the heating side, and on the first, second, and third branched passages 59e, 59f, and 59g on the analysis side. Operation of valves 60a to 60f controls the flow of analytical gas from the heating reaction section 56 into the gas storage chambers 58a to 58c and the outflow of analytical gas from the gas storage chambers 58a to 58c to the gas analysis section 57.

[0055] However, the thermal analysis apparatus 51 preferably includes gas supply pipes 61a and 61b capable of supplying ambient gas to the precipitate generating section 52 and / or the gas generating section 53. The gas supply pipes 61a and 61b are provided so that one end thereof is connected to the upstream openings in the flow direction of the reaction tubes 54b and 56b of the precipitate generating section 52 and the gas generating section 53, respectively. The gas supply pipes 61a and 61b and the aforementioned gas piping 59 may be made of stainless steel.

[0056] The other ends of the gas supply pipes 61a and 61b are connected to a gas storage unit such as a gas tank storing ambient gas, or one or more other gas supply sources 62a to 62c. The thermal analysis device 51 may further include the gas supply sources 62a to 62c, but the gas supply sources 62a to 62c are not necessarily limited to forming part of the thermal analysis device 51.

[0057] By providing the gas supply pipes 61a and 61b, it is possible to adjust the ambient environment during heating of the sample in the heating reaction section 54 and / or 56 of the precipitate generating section 52 and / or the gas generating section 53. In the illustrated example, valves 61c and 61d are provided on each of the gas supply pipes 61a and 61b. By opening and closing the valves 61c and 61d, it is possible to supply or stop the ambient gas to one or both of the precipitate generating section 52 and the gas generating section 53.

[0058] As the ambient gas supplied from the gas supply pipes 61a and 61b to the precipitate generating unit 52 and / or the gas generating unit 53, at least one selected from the group consisting of oxygen, nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton can be preferably used, or a mixture of two or more thereof can be used. For example, a mixed gas such as nitrogen and oxygen, helium and oxygen, or nitrogen and carbon dioxide can also be preferably used. Air is sometimes used as the ambient gas.

[0059] When the sample is heated in the heating reaction section 54 and / or 56 in an environment in which oxygen is present, in addition to using a single gas, such as oxygen, nitrogen or carbon dioxide may be mixed with the oxygen, or a rare gas such as argon, helium, xenon, neon, or krypton may be mixed with the oxygen. Furthermore, when the sample is heated in the heating reaction section 54 and / or 56 in an environment in which oxygen is insufficient, in addition to preferably using at least one gas selected from the group consisting of nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton, two or more gases may be mixed. For example, a mixed gas such as nitrogen and oxygen, helium and oxygen, or nitrogen and carbon dioxide may also be preferably used.

[0060] In this embodiment, the three gas supply sources 62a-62c can each supply an ambient gas containing any one or more of oxygen, nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton. The gas supply pipes 61a and 61b temporarily merge at the gas supply sources 62a-62c and then branch into three, thereby forming three gas flow paths 63a-63c for each type of ambient gas. The valves 64a-64c provided in each gas flow path 63a-63c can be operated appropriately depending on whether one or more of the multiple ambient gases is supplied.

[0061] During injection molding, the molding material is likely to undergo combustion decomposition caused by oxygen, and the resin may undergo thermal decomposition. In thermal analysis apparatus 51, by supplying oxygen while simultaneously supplying one or more of nitrogen, carbon dioxide, argon, helium, xenon, neon, or krypton, the resin can be subjected to combustion decomposition in an oxygen environment in heating reaction section 54 and / or 56. Furthermore, by supplying one or more of nitrogen, carbon dioxide, argon, helium, xenon, neon, or krypton instead of oxygen, the resin can be thermally decomposed in an oxygen-deficient environment in heating reaction section 54 and / or 56.

[0062] According to the thermal analysis device 51, when a sample of a specified material is heated at a specified temperature under a specified ambient environment in the precipitate generation unit 52 and the heating reaction units 54 and 56 of the gas generation unit 53, the components and amounts of the analytical precipitate and analytical gas obtained thereby can be determined by analyzing them. Based on these results, for example, when the material is used as a molding material for injection molding in the injection molding machine 1, the components and amounts of deposits within the mold device 101 and gases emitted from the mold device 101 under molding conditions such as the specified heating temperature can be estimated. This allows, for example, repeated analysis using the thermal analysis device 51 by varying the conditions to enable preliminary research and setting of molding conditions that are less likely to cause molding defects.

[0063] Furthermore, the thermal analysis apparatus 51 of this embodiment does not require a precise machine requiring a high vacuum, such as a mass spectrometer, and therefore can be made into a relatively small apparatus that can be easily carried manually.

[0064] (Injection device)

[0065] The injection unit 11 primarily comprises a cylindrical cylinder 12 extending toward the mold assembly 101; a screw 13 disposed within the cylinder 12 parallel to its central axis and having a helical thread formed around its circumference; a heater 14, such as a belt, disposed on the outer periphery of the cylinder 12 so as to surround the cylinder 12; and a motor housing 15 disposed behind the cylinder 12 and screw 13. Although not shown, the motor housing 15 includes a metering motor for rotating the screw 13 about its central axis, an injection motor for advancing and retracting the screw 13 toward and away from the mold assembly 101, and a pressure sensor for detecting the pressure exerted on the screw 13 by the molding material, in order to accumulate a predetermined amount of molding material at the front end of the cylinder 12.

[0066] Here, the direction of the fixed platen 32a of the mold clamping device 31 that approaches the fixed mold 102 of the mold assembly 101 is defined as the front side, and the direction away from the fixed platen 32a is defined as the rear side. Figure 1 When observing the injection device 11 located on the right side of the fixed platen 32a, the left side close to the fixed platen 32a is the front side, and the right side away from the fixed platen 32a is the rear side.

[0067] A supply port 12a is provided on the rear side of the cylinder body 12, near the motor box 15, to which a hopper for feeding molding material into the cylinder body 12 can be attached. Furthermore, a nozzle 12b with a reduced cross-sectional area is provided on the front side of the front end of the cylinder body 12, near the mold assembly 101. Furthermore, a water-cooled cylinder 12c, for example, can be provided near the supply port 12a.

[0068] As shown in the figure, the heating element 14 disposed around the cylinder 12, including around the nozzle 12b, can be divided into multiple sections in the cylinder axial direction, so that the interior of the cylinder 12 inside each heating element section can be heated at different temperatures. A temperature detector can be provided in each heating element section.

[0069] Although not shown in the figure, a check ring is sometimes disposed around the reduced diameter portion of the screw 13 at the front end thereof. The check ring moves forward and backward along with the screw 13 to prevent molding material fed forward of the screw 13 from flowing backward. For example, the check ring moves forward and backward relative to the screw 13 in response to pressure from molding material located forward or backward of the screw 13, thereby allowing only molding material to flow from the rear toward the front.

[0070] According to the injection device 11 having such a structure, the molding material injected into the cylinder 12 from the supply port 12a is heated by the heater 14 on the outer peripheral side of the cylinder 12 during the metering process. As the screw 13 driven by the metering motor rotates, it is melted and transported forward within the cylinder 12, thereby accumulating at the front end of the cylinder 12. At this time, the screw 13 is moved backward by the injection motor, forming a space at the front end of the cylinder 12 for accumulating the molding material. Furthermore, as described above, this metering process can be performed during the cooling process of the previous molding process, for example.

[0071] Then, in the filling process, screw 13 is moved forward, thereby injecting the molding material at the front end of cylinder 12 through nozzle 12b into mold device 101. Furthermore, in the subsequent pressure holding process, the molding material remaining at the front end of cylinder 12 exerts pressure on the molding material filled in the cavity of mold device 101. At this time, any molding material that is insufficient in the cavity of mold device 101 due to cooling and shrinkage of the molding material can be replenished.

[0072] Furthermore, the injection molding machine 1 is of an inline screw type, but may also be a screw pre-plasticizing type injection molding machine which is structurally and functionally divided into a plasticizing cylinder and a plasticizing screw, and an injection cylinder and an injection plunger.

[0073] (Mobile device)

[0074] The moving device 21 is, for example, provided at the lower portion of the motor box 15 of the injection device 11 and is an advance / retract drive mechanism that moves the injection device 11 forward and backward relative to the fixed platen 32 a .

[0075] Various mechanisms can be used as the forward and backward driving mechanism constituting the moving device 21. The moving device 21 shown in the figure is constructed to include a hydraulic pump 22 such as oil pressure, a pump-actuating motor 23 based on electric power or the like for actuating the hydraulic pump 22, and a double-acting hydraulic cylinder 24 that supplies working fluid from the hydraulic pump 22 to cause a piston rod whose front end is fixed to a fixed pressure plate 32a to perform a push-out and pull-in movement.

[0076] The moving device 21 further includes a sliding base 25 on which the hydraulic pump 22, pumping motor 23, and hydraulic cylinder 24 are mounted, and a guide 26 provided on the base 2 to guide the linear motion of the sliding base 25. This allows the injection device 11, which is mounted on the sliding base 25, to be moved forward and backward.

[0077] The moving device 21 can move the injection device 11 away from the mold device 101 or can bring the injection device 11 closer to the mold device 101 to perform so-called nozzle contact, in which the nozzle 12b of the cylinder 12 of the injection device 11 is pressed against the mold device 101 at a predetermined pressure.

[0078] (Mold clamping device)

[0079] The mold clamping device 31 displaces the movable mold 103 of the mold assembly 101 relative to the fixed mold 102 to open and close the mold assembly 101, placing the mold assembly 101 in a clamped, closed, or open state. The mold clamping device 31 includes a platen 32 comprising a fixed platen 32a, a movable platen 32b, and connecting rods 32c, and a platen operating mechanism 33 for operating the platen 32.

[0080] As described above, the fixed platen 32a of the platen 32 is fixed and mounted on the platen mounting plate of the base 2. On the other hand, the movable platen 32b is arranged on the guide member 32d laid on the guide plate of the base 2, and can slide away from and toward the fixed platen 32a.

[0081] The pressure plate operating mechanism 33 includes a rear pressure plate 34 arranged on the base 2, a mold clamping motor 35 provided on the rear pressure plate 34, a motion conversion mechanism 36 that converts the rotational motion of the mold clamping motor 35 into linear motion in the displacement direction of the movable pressure plate 32b, and a toggle mechanism 37 that increases the force transmitted to the motion conversion mechanism 36 and transmits it to the movable pressure plate 32b.

[0082] The motion conversion mechanism 36 can be any structure capable of converting rotational motion into linear motion. In this example, it includes a screw shaft 36a that is rotationally driven by the mold clamping motor 35 and a nut 36b that is threadedly engaged with the screw shaft 36a. Alternatively, the motion conversion mechanism 36 can be a ball screw.

[0083] Furthermore, the toggle mechanism 37 for increasing the transmission force from the motion conversion mechanism 36 swingably connects a plurality of links 37a to 37c connecting the rear pressure plate 34 and the nut 36b with the movable pressure plate 32b via joints.

[0084] The number and shape of the connecting rods and joints can be changed appropriately, such as Figure 1 As shown, a pair of link groups consisting of links 37a to 37c located on upper and lower sides with the cross head 37d interposed therebetween are swingably connected to a cross head 37d connected to the nut 36b and extending in the vertical direction.

[0085] In addition to the mold clamping motor 35, a mold thickness adjustment motor 38 may be provided on the rear platen 34. This mold thickness adjustment motor 38 applies a rotational driving force to the screw shaft 36a and nut 36b connected to the extensions of the connecting rods 32c of the platen 32, thereby adjusting the gap between the fixed platen 32a and the rear platen 34, which is movably mounted on the base 2. This allows the mold thickness to be adjusted to achieve the desired clamping force when the mold assembly 101 is replaced or its thickness is changed due to temperature fluctuations. Although not shown in the figure, mold thickness adjustment can be achieved even if the fixed platen side is movable and the rear platen side is fixed on the base 2.

[0086] The mold clamping device 31 shown in the figure is a horizontal device in which the moving direction of the movable platen 32b is parallel to the horizontal direction, but may be a vertical device in which the moving direction is the vertical direction.

[0087] (Ejector device)

[0088] The ejection device 41 arranged on the movable pressure plate 32b includes: an ejection rod 42, which extends through the movable pressure plate 32b and is driven forward and backward so as to press the movable parts 104 such as the ejection pin of the mold device 101 from the rear side; and a rod driving source 43, such as a motion conversion mechanism including a motor and a ball screw, so as to enable the ejection rod 42 to move.

[0089] During the molded product removal process, the ejector device 41 advances the ejector rod 42 driven by the rod drive source 43, thereby protruding the movable member 104 within the mold device 101 and ejecting the molded product from the mold device 101. Furthermore, after protruding the movable member 104, the ejector rod 42 can be retracted by the rod drive source 43 and returned to its original position.

Claims

1. A thermal analysis device for determining the physical properties of a material produced by volatilization of a low-boiling-point component having a relatively low boiling point and a high-boiling-point component having a relatively high boiling point compared to the low-boiling-point component by heating, the thermal analysis device comprising: a precipitate generating section that heats a sample of the material to precipitate high-boiling-point components in the generated gas to generate a precipitate for analysis; and The gas generating unit heats the sample of the material to generate an analytical gas containing a low-boiling-point component.

2. The thermal analysis device according to claim 1, wherein The precipitate generating portion includes: heating the reaction part to heat the sample; and The cooling unit is provided downstream of the heating reaction unit in the flow direction of the generated gas, and cools the generated gas to precipitate the high-boiling-point component.

3. The thermal analysis device according to claim 1, wherein The gas generating unit includes: heating the reaction part to heat the sample; and The gas analysis unit is provided downstream of the heating reaction unit in the flow direction of the analytical gas and analyzes the analytical gas.

4. The thermal analysis device according to claim 3, wherein The gas analysis unit can identify and quantify components in the analytical gas.

5. The thermal analysis device according to claim 3, wherein A trapping section is provided downstream in the flow direction of the heating reaction section of the gas generating section. The trapping section allows low-boiling-point components in the analytical gas to pass therethrough and precipitates and traps high-boiling-point components in the analytical gas. The thermal analysis device according to claim 3 , wherein: The gas generating unit includes a plurality of gas storage chambers located downstream of the heating reaction unit and upstream of the gas analyzing unit in the flow direction.

7. The thermal analysis device according to any one of claims 1 to 3, wherein A gas supply pipe capable of supplying an ambient gas to the precipitate generating portion and / or the gas generating portion is provided.

8. The thermal analysis device according to claim 7, wherein The gas supply pipe includes a plurality of gas flow paths for each of different types of ambient gases.

9. The thermal analysis device according to claim 7, wherein The ambient gas contains at least one selected from the group consisting of oxygen, nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton.

10. The thermal analysis device according to any one of claims 1 to 3, wherein As the material, a resin material is targeted.

11. The thermal analysis device according to claim 10, wherein The resin material is a molding material used for injection molding.

Images