Low-temperature testing device suitable for REBCO high-temperature superconducting coil

Abstract

The invention discloses a low-temperature testing device suitable for an REBCO high-temperature superconducting coil. Relates to the technical field of REBCO high-temperature superconducting coil performance testing, and comprises a testing G10 bottom plate, a transverse sliding groove is formed in the middle of the testing G10 bottom plate, longitudinal sliding grooves are formed in the two sides of the transverse sliding groove respectively, two coil base G10 sliding blocks are oppositely arranged on the transverse sliding groove, and two G10 sliding blocks are oppositely arranged on each longitudinal sliding groove; the acrylic cover plate is arranged on the coil base G10 sliding block, and a test coil module is arranged between the acrylic cover plate and the coil base G10 sliding block; the upper copper terminal A and the lower copper terminal D are arranged on the two G10 sliding blocks on the same side, the upper copper terminal B and the lower copper terminal C are arranged on the two G10 sliding blocks on the same side, and the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D are each provided with a B i2223 and a copper terminal adapter. According to the low-temperature testing device suitable for the REBCO high-temperature superconducting coil, it is ensured that the superconducting performance of the coil can be safely tested under the low-temperature condition.

Description

Technical Field

[0001] The present invention relates to the technical field of REBCO high-temperature superconducting coil performance testing, and more particularly to a low-temperature testing device suitable for REBCO high-temperature superconducting coils. Background Art

[0002] High-temperature superconducting materials mainly include the first generation (bismuth strontium calcium copper oxide BSCCO), the second generation (rare earth barium copper oxide REBCO), magnesium diboride and iron-based superconducting materials.

[0003] The first generation of materials has low performance and high cost, and is not cost-effective for large-scale industrialization; magnesium diboride materials have a low critical temperature and limited applications, and are only produced by a few manufacturers worldwide; iron-based superconducting materials are still in the laboratory stage.

[0004] Second-generation high-temperature superconducting tape, based on REBCO, boasts advantages such as high critical temperature, high current-carrying capacity, high critical field strength, high mechanical strength, and low cost. It is currently the most widely used high-temperature superconducting material with the best overall performance. It has important applications in nuclear magnetic resonance (NMR), fusion devices (such as ITER), high-field magnets, and power equipment (such as superconducting cables and current limiters).

[0005] High-field magnet winding methods are primarily categorized as layer winding and double-pancake winding. Layer winding involves stacking the ribbon layer by layer from the inside out, completing the winding process continuously, requiring longer ribbon. The double-pancake winding method, on the other hand, involves winding the ribbon from the center upward and downward in a spiral, first around the upper coil and then around the lower coil, completing a double-pancake coil. These double-pancake coils are stacked one by one to form a high-temperature superconducting magnet. Typically, a single double-pancake coil requires significantly less ribbon than a layer winding method. However, with current ribbon production processes, producing longer ribbons remains a challenge, making double-pancake coils more suitable for current magnet manufacturing.

[0006] However, before superconducting coils can be assembled into high-field magnets, they must undergo rigorous cryogenic performance testing to ensure their critical current (Ic), quench characteristics, and mechanical stability meet requirements. Traditional cryogenic testing methods typically rely on liquid nitrogen (77K), which cannot guarantee the safe testing of the coils' superconducting properties at these low temperatures.

[0007] Therefore, how to provide a low-temperature testing device suitable for REBCO high-temperature superconducting coils to ensure that the superconducting performance of the coils can be safely tested under low-temperature conditions is an urgent problem that needs to be solved by those skilled in the art. Summary of the Invention

[0008] In view of this, the present invention provides a low-temperature testing device suitable for REBCO high-temperature superconducting coils, aiming to solve one of the problems in the above-mentioned background technology and ensure that the superconducting performance of the coils can be safely tested under low-temperature conditions.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] A low-temperature testing device suitable for REBCO high-temperature superconducting coils, comprising:

[0011] Test G10 bottom plate, the middle of the test G10 bottom plate is provided with a horizontal slide groove, both sides of the horizontal slide groove are provided with longitudinal slide grooves, two coil base G10 sliders are provided opposite to each other on the horizontal slide groove, and two G10 sliders are provided opposite to each other on each longitudinal slide groove;

[0012] An acrylic cover plate, the acrylic cover plate is arranged on the slider of the coil base G10, and a test coil module is provided between the acrylic cover plate and the slider of the coil base G10;

[0013] Upper copper terminal A, upper copper terminal B, lower copper terminal C and lower copper terminal D, the upper copper terminal A and lower copper terminal D are arranged on the two G10 sliders on the same side, the upper copper terminal B and lower copper terminal C are arranged on the two G10 sliders on the same side, and the upper copper terminal A, upper copper terminal B, lower copper terminal C and lower copper terminal D are all provided with Bi2223 and copper terminal adapters.

[0014] Furthermore, the Bi2223 arranged at intervals are arranged on the side walls of the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D relative to each other in the horizontal direction, and the copper terminal adapters arranged at intervals are arranged on the top of the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D away from each other in the horizontal direction.

[0015] Furthermore, the acrylic cover is fixed to the test coil module by pre-tightening bolts A.

[0016] Furthermore, the copper terminal adapter is fixed to the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D by means of pre-tightening bolts B.

[0017] Furthermore, the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D move longitudinally along the longitudinal slide groove, and the test coil module moves transversely along the transverse slide groove.

[0018] Furthermore, the longitudinal chute and the transverse chute are both configured as U-shaped chute.

[0019] As can be seen from the above technical solution, compared with the prior art, the present invention provides a low-temperature testing device suitable for REBCO high-temperature superconducting coils. Based on the G10 test base plate, it is provided with simple longitudinal and transverse chutes, and the matching upper copper terminal A, upper copper terminal B, lower copper terminal C, and lower copper terminal D structures are designed. This device can not only measure large-sized high-temperature superconducting coils, but also can increase copper terminals to meet the test requirements of measuring multiple small high-temperature superconducting coils at the same time.

[0020] In addition, the size and position of the test coil can be freely adjusted within a certain range, enabling performance testing of high-temperature superconducting test coils of different lengths and sizes;

[0021] The device has a simple structural design, is easy to install, has a low preparation cost, and is highly efficient in testing high-temperature superconducting coil samples. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0023] Figure 1 A schematic structural diagram of a low-temperature testing device for a REBCO high-temperature superconducting coil provided by the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the copper terminal welding provided by the present invention;

[0025] Figure 3 A schematic structural diagram of the superconducting coil module and the G10 slider provided by the present invention;

[0026] Figure 4 This is a structural schematic diagram of the superconducting coil module provided by the present invention.

[0027] Among them: 1 is the copper terminal adapter; 2 is the upper copper terminal A; 3 is the acrylic cover; 4 is the pre-tightening bolt A; 5 is the test G10 base plate; 6 is Bi2223; 7 is the pre-tightening bolt B; 8 is the upper copper terminal B; 9 is the lower copper terminal C; 10 is the test coil module; 11 is the coil base G10 slider; 12 is the lower copper terminal D; 13 is the G10 slider; 14 is the strip material at the end of the upper coil cake; 15 is the strip material at the end of the lower coil cake. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1-4 The embodiment of the present invention discloses a low-temperature testing device suitable for REBCO high-temperature superconducting coils, comprising:

[0030] Test the G10 base plate 5. A horizontal chute is provided in the middle of the test G10 base plate 5. A longitudinal chute is provided on both sides of the horizontal chute. Two coil base G10 sliders 11 are provided opposite to each other on the horizontal chute. Two G10 sliders 13 are provided opposite to each other on the longitudinal chute. The coil base G10 slider 11 is slidably provided in the horizontal chute, and the G10 slider 13 is slidably provided in the longitudinal chute.

[0031] Acrylic cover plate 3, the acrylic cover plate 3 is arranged on the slider 11 of the coil base G10, and a test coil module 10 is arranged between the acrylic cover plate 3 and the slider 11 of the coil base G10;

[0032] The test coil module 10 is installed in the horizontal slide groove in the middle position of the test G10 base plate 55 through the coil base G10 slider 11. The ends of the coil upper end strip 14 and the coil lower end strip 15 of the test coil module 10 are welded to the copper terminals to form a loop; the distance between the coil base G10 slider 11 and the two copper terminals on the same side is adjusted according to the size of the test coil module 10 to ensure that the test coil module 10 can be welded horizontally; the movable movable coil base G10 slider 11 is installed on the horizontal slide groove of the test G10 base plate 5 by the pre-tightening force between the threaded holes set at the bottom and the bolts;

[0033] The upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 are arranged on two G10 sliders 13 on the same side, the upper copper terminal B8 and the lower copper terminal C9 are arranged on two G10 sliders 13 on the same side, and the upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 are all provided with Bi2223 and a copper terminal adapter 1; the upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 are all provided with through holes adapted to the G10 slider 13, through The G10 slider 13 and the bolt are installed in the longitudinal slide groove of the test G10 base plate 5. The position of the copper terminal can be adjusted by pre-tightening or loosening the bolt; slots and through holes are set on the copper terminal adapter 1, and the through holes on the copper terminal adapter 1 are adapted to the through holes above the copper terminal. The copper terminal adapter 1 is crimped on the top of the copper terminal through bolts and gaskets; the Bi2223 strip is soldered to the side grooves on the upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12, which is convenient for the subsequent rapid completion of welding and replacement of test samples.

[0034] In this embodiment, the spaced Bi2223 are arranged relatively on the side walls of the upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 in the horizontal direction, and the spaced copper terminal adapters 1 are arranged on the top of the upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 away from each other in the horizontal direction.

[0035] In this embodiment, the acrylic cover 3 is fixed to the test coil module 10 by means of pre-tightening bolts A4.

[0036] In this embodiment, the copper terminal adapter 1 is fixed to the upper copper terminal A2 , the upper copper terminal B8 , the lower copper terminal C9 and the lower copper terminal D12 by means of pre-tightening bolts B7 .

[0037] In this embodiment, the upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 move longitudinally along the longitudinal sliding groove, and the test coil module 10 moves transversely along the transverse sliding groove.

[0038] In this embodiment, the longitudinal sliding groove and the transverse sliding groove are both configured as U-shaped grooves.

[0039] In addition, in this embodiment, the bottom of the test G10 base plate 5 is set as an integral lower layer, leaving space for installing bolts to ensure that the test G10 base plate 5 is in a flat state as a whole.

[0040] The G10 base plate 5 is tested using G10 insulation material.

[0041] The upper copper terminal A2, the upper copper terminal B8, the lower copper terminal C9 and the lower copper terminal D12 are all made of TU1 oxygen-free copper material, with square grooves on the sides, through holes on the top and threaded holes on the bottom.

[0042] The copper terminal adapter 1 is slotted and through-hole processed. The slotted end of the copper terminal adapter 1 is connected to the outer current lead, and the through-hole end of the copper terminal adapter 1 is crimped onto the copper terminal by a bolt to form a current path.

[0043] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Reference can be made to the common and similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the method description.

[0044] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A low-temperature testing device suitable for REBCO high-temperature superconducting coils, characterized in that: include: Test G10 bottom plate, the middle of the test G10 bottom plate is provided with a horizontal slide groove, both sides of the horizontal slide groove are provided with longitudinal slide grooves, two coil base G10 sliders are provided opposite to each other on the horizontal slide groove, and two G10 sliders are provided opposite to each other on each longitudinal slide groove; An acrylic cover plate, the acrylic cover plate is arranged on the slider of the coil base G10, and a test coil module is provided between the acrylic cover plate and the slider of the coil base G10; Upper copper terminal A, upper copper terminal B, lower copper terminal C and lower copper terminal D, the upper copper terminal A and lower copper terminal D are arranged on the two G10 sliders on the same side, the upper copper terminal B and lower copper terminal C are arranged on the two G10 sliders on the same side, and the upper copper terminal A, upper copper terminal B, lower copper terminal C and lower copper terminal D are all provided with Bi2223 and copper terminal adapters.

2. A low-temperature testing device for REBCO high-temperature superconducting coils according to claim 1, characterized in that: The Bi2223 arranged at intervals are arranged on the side walls of the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D relatively in the horizontal direction, and the copper terminal adapters arranged at intervals are arranged on the top of the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D away from each other in the horizontal direction.

3. The low-temperature testing device for REBCO high-temperature superconducting coils according to claim 1, characterized in that: The acrylic cover is fixed to the test coil module by pre-tightening bolts A.

4. The low-temperature testing device for REBCO high-temperature superconducting coils according to claim 2, characterized in that: The copper terminal adapter is fixed to the upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D by means of pre-tightening bolts B.

5. The low-temperature testing device for REBCO high-temperature superconducting coils according to claim 1, characterized in that: The upper copper terminal A, the upper copper terminal B, the lower copper terminal C and the lower copper terminal D move longitudinally along the longitudinal sliding groove, and the test coil module moves transversely along the transverse sliding groove.

6. The low-temperature testing device for REBCO high-temperature superconducting coils according to claim 1, characterized in that: The longitudinal chute and the transverse chute are both configured as U-shaped chute.

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