Photoelectric co-packaging temperature control framework based on embedded glass-based micro-channel

By using embedded glass-based microchannels and independent heat dissipation paths in the optoelectronic co-packaging structure, the thermal crosstalk and heat dissipation problems in the multi-chip package are solved, efficient chip-level heat dissipation management is achieved, and the integration and heat dissipation capacity of the package are improved.

CN120652628APending Publication Date: 2025-09-16UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Patent Information

Application Number
CN202510691604.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-27
Publication Date
2025-09-16

AI Technical Summary

Technical Problem

In existing optoelectronic co-packaged modules, as the number of chips in the package increases, the heat dissipation difficulty increases, the thermal efficiency of TEC decreases, resulting in failure of the optical interconnect chip and serious thermal crosstalk, which hinders the improvement of the package's integration.

Method used

Embedded glass-based microfluidic channel technology is used to design independent heat dissipation paths for optical interconnect chips and electrical interconnect chips respectively. Glass-based microfluidic channels are used for zoned heat dissipation, and metal thin film temperature sensors are used for real-time monitoring and control. Combined with thermal insulation layers and insulating condensate, heat isolation and efficient heat dissipation between chips are achieved.

Benefits of technology

It effectively solves the thermal crosstalk problem in multi-chip co-package, improves heat dissipation efficiency, increases the integration of the package, enables high-power devices to be integrated into the package, and avoids the failure of optical interconnect chips.

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Abstract

The invention belongs to the field of photoelectric co-packaging, and particularly relates to a photoelectric co-packaging temperature control framework based on an embedded glass-based micro-channel. Independent lower-layer heat dissipation is carried out on a heat-sensitive component optical interconnection chip through an embedded glass-based micro-channel technology, an electric interconnection heat dissipation channel continues to use existing upper-layer heat dissipation, mutual isolation of two heat dissipation channels in the whole common packaging body is achieved, heat dissipation partition is achieved from a new dimension, and thermal crosstalk is avoided; the whole common packaging body dissipates heat at the upper layer and the lower layer, so that the effective heat dissipation area is greatly increased, and the heat dissipation capability of the packaging body is greatly improved; and the guidance quality of the heat dissipation channel is better through material selection and additional arrangement of the heat insulation layer. And a metal film temperature sensor can be additionally arranged, so that the temperature of a component can be monitored in real time, heat management regulation and control can be performed in a targeted manner, the temperature rise of a heating device and the heat contact efficiency between the micro-channels are balanced, and more efficient heat dissipation is realized.
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