Porous substrate and multi-through-hole machining method based on dynamic partitioning

Abstract

The invention belongs to the technical field of substrate through hole machining, and particularly relates to a porous substrate and a multi-through-hole machining method based on dynamic zoning, a substrate machining area is divided into a plurality of grid units, a spatial distribution density map is constructed, a density ridge line is obtained based on density gradient to serve as a zoning boundary, and efficient dynamic zoning is achieved. And multi-row merging is achieved based on the hole coordinate spacing of the hole coordinate rows, all hole coordinates are connected, a machining path of the sub-machining area is formed, and stroke optimization in the subareas is achieved. And the processing sequence optimization of the sub-processing areas is realized by constructing the target function, so that the path length is relatively small, the processing efficiency is further improved, and the processing cost is reduced. According to the method, through a dynamic partitioning strategy and a multi-row merging algorithm, multi-row through holes are optimized into a single-row continuous machining path, the idle stroke time of a laser head and the inter-row switching frequency are remarkably reduced, and efficient machining of large-scale through holes of the substrate is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of substrate through-hole processing, and in particular relates to a porous substrate and a multi-through-hole processing method based on dynamic partitioning. Background Art

[0002] In the manufacturing process of large-scale, high-density substrates, through-hole processing technology is the core link to achieve electrical interconnection between layers. With the development of electronic equipment towards miniaturization and high performance, the number of through-holes on substrates has increased dramatically, often reaching tens of thousands to hundreds of thousands, and the apertures are becoming increasingly miniaturized and the position distribution is highly complex. In this context, efficient and accurate processing path planning technology has become one of the key bottlenecks to improve overall production efficiency and ensure hole position accuracy and consistency. The core challenge lies in how to meet the strict aperture accuracy, hole wall quality and position tolerance requirements while minimizing the total processing stroke, shortening the single-board processing cycle, balancing tool / equipment wear, and effectively avoiding the risk of interference with the pre-set structure or adjacent holes inside the substrate through intelligent tool or beam movement path optimization strategies.

[0003] Existing large-scale through-hole machining methods, such as line-by-line scanning or raster-based path methods, require frequent switching of machining lines. This results in a high percentage of idle laser head travel, leading to redundant jumps between lines. Static partitioning methods are unable to adapt to uneven hole density distribution, resulting in suboptimal paths within partitions. Traditional manual or simple sequential planning methods are no longer sufficient for the mass production of modern high-density substrates. Advanced path planning methods are urgently needed to enable intelligent decision-making on machining paths under large-scale, multi-constraint conditions, thereby reducing production costs, improving equipment utilization, and ultimately improving product yield. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defects of the existing large-scale through-hole processing method in the art, such as the long idle travel time of the laser head and the long number of switching times between rows, which leads to low processing efficiency, thereby providing a porous substrate and a multi-through-hole processing method based on dynamic partitioning.

[0005] A multi-through hole machining method based on dynamic partitioning includes the following steps: Obtain the hole coordinate set of the substrate multi-through hole processing; Dividing a substrate processing area into a plurality of grid cells, constructing a spatial distribution density map of the substrate processing area based on the hole coordinate set, and identifying dense areas and sparse areas in the spatial distribution density map; Calculating a density gradient for the spatial distribution density map, obtaining a density ridge based on the density gradient, and using the density ridge as a partition boundary to divide a processing area of ​​the substrate into a plurality of sub-processing areas; Divide the hole coordinates in the sub-processing area into multiple hole coordinate rows according to the vertical coordinate, calculate the hole coordinate distance between two adjacent hole coordinate rows, and merge the two hole coordinate rows when the hole coordinate distance is less than a preset threshold; In the sub-processing area, the hole coordinates in the odd-numbered rows are arranged in ascending order, and the hole coordinates in the even-numbered rows are arranged in descending order. From the first row to the last row, all the hole coordinates are connected in sequence to form the processing path of the sub-processing area; Taking the center of the sub-processing area as a node, constructing an objective function, the objective function including the path length connecting all nodes, solving the objective function to obtain the processing order of the sub-processing area; The sub-processing areas are processed in sequence according to the processing order of the sub-processing areas, and each through hole in the sub-processing areas is processed in sequence based on the processing path of the sub-processing areas.

[0006] Furthermore, a spatial distribution density map of the processing area of ​​the substrate is constructed based on the hole coordinate set, including the following method steps: for each grid unit, the number of hole coordinates falling into the grid unit is counted, the hole density of the grid unit is the number of hole coordinates / grid unit area, and the spatial distribution density map of the processing area of ​​the substrate is constructed based on the hole density of each grid unit.

[0007] Furthermore, a spatial distribution density map of the processing area of ​​the substrate is constructed based on the hole coordinate set, including the following method steps: taking each hole coordinate as the center, using a kernel function to calculate its influence on each grid unit, the closer the distance between the hole coordinate and the grid unit, the greater the influence; adding up the influence of all the hole coordinates on the grid unit, that is, the hole density of the grid unit, and constructing a spatial distribution density map of the processing area of ​​the substrate based on the hole density of each grid unit.

[0008] Furthermore, according to the hole density of each grid unit, color is used to represent the size of the hole density, a spatial distribution density map is drawn, the grid units are arranged in order of hole density, the grid units with hole density ranking greater than a preset percentile are defined as dense areas, and the grid units with hole density ranking less than the preset percentile are defined as sparse areas, and the dense areas and sparse areas in the spatial distribution density map are identified.

[0009] Furthermore, after the processing area of ​​the substrate is divided into a plurality of sub-processing areas, the sub-processing area optimization is also included, including the following method steps: Calculating the empty space ratio, hole distribution compactness and density uniformity of each of the sub-processing areas; When the area of ​​the sub-processing area is smaller than the preset threshold and the number of hole coordinates is less than the preset threshold, the sub-processing area is merged into the adjacent sub-processing area with the closest hole density. If the blank space ratio of the merged partition decreases and the hole distribution compactness improves, the merged partition is retained; otherwise, the merged partition is rolled back. When the density uniformity of the sub-processing area is greater than a preset threshold and the blank space ratio is greater than a preset threshold, the sub-processing area is segmented based on the density gradient ridge. If the blank space ratio of the merged partition decreases and the hole distribution compactness improves, the segmented partition is retained, otherwise the segmented partition is rolled back. When the blank space ratio and hole distribution compactness of all the sub-processing areas are within a preset range, the sub-processing area optimization is terminated; When the change in the blank space ratio and the hole distribution compactness of multiple iterations is less than the preset threshold, the sub-processing area optimization is terminated.

[0010] Furthermore, the blank space ratio is calculated as follows: blank space ratio = (total area of ​​the sub-processing area − hole coverage area) / total area of ​​the sub-processing area.

[0011] Furthermore, the calculation method of the blank space ratio is: the hole distribution compactness is the horizontal and vertical standard deviation of the hole coordinates in the sub-processing area: .

[0012] Furthermore, the hole coordinate distance between two adjacent hole coordinate rows in the sub-processing area is calculated, and the two hole coordinate rows are merged when the hole coordinate distance is less than a preset threshold, including the following method steps: For adjacent hole coordinate rows, the average ordinates of the hole coordinates in the two hole coordinate rows are calculated respectively. If the difference between the corresponding average ordinates is less than a preset threshold, the two hole coordinate rows are merged, and the horizontal coordinates of the hole coordinates in the two hole coordinate rows are updated to the average horizontal coordinate. Repeat the above steps until the hole coordinates of all adjacent rows are greater than the preset threshold.

[0013] Furthermore, taking the center of the sub-processing area as a node, an objective function is constructed, wherein the objective function includes the path length connecting all nodes, and further includes the following method steps: A heat load weight is assigned to each sub-processing area, and the temperature of each sub-processing area is monitored in real time by a temperature sensor. When the temperature of the sub-processing area rises, the heat load weight is reduced, and when the temperature of the sub-processing area drops, the heat load weight is increased; the heat load weight is introduced into the objective function.

[0014] A porous substrate is formed by the above-mentioned multi-through hole processing method.

[0015] Beneficial effects: The present invention discloses a multi-through hole processing method and a porous substrate based on dynamic partitioning, which divides the substrate processing area into multiple grid units, constructs a spatial distribution density map, and obtains density ridges as partition boundaries based on density gradients to achieve efficient dynamic partitioning. Multiple rows are merged based on the hole coordinate spacing of the hole coordinate row, and all hole coordinates are connected to form a processing path for the sub-processing area, thereby achieving travel optimization within the partition. The processing sequence of the sub-processing area is optimized by constructing an objective function to ensure that the path length is minimized, further improving processing efficiency and reducing processing costs. The present invention optimizes multiple rows of through holes into a single-row continuous processing path through a dynamic partitioning strategy and a multi-row merging algorithm, significantly reducing the idle travel time of the laser head and the number of switching times between rows, thereby achieving efficient processing of large-scale through holes in substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic block diagram of the main method steps of the present invention. DETAILED DESCRIPTION

[0018] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0019] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0020] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0021] Example 1: Reference Figure 1 As shown, this embodiment provides a multi-through hole processing method based on dynamic partitioning, including the following method steps: Step S1: Obtaining a hole coordinate set for multi-through hole machining of a substrate; Step S2: Divide the substrate processing area into a plurality of grid units, construct a spatial distribution density map of the substrate processing area based on the hole coordinate set, and identify dense areas and sparse areas in the spatial distribution density map; Step S3: calculating a density gradient for the spatial distribution density map, obtaining a density ridge based on the density gradient, and using the density ridge as a partition boundary to divide the processing area of ​​the substrate into a plurality of sub-processing areas; Step S4: Dividing the hole coordinates in the sub-processing area into multiple hole coordinate rows according to the vertical coordinate, calculating the hole coordinate spacing between two adjacent hole coordinate rows, and merging the two hole coordinate rows when the hole coordinate spacing is less than a preset threshold; Step S5: In the sub-processing area, the hole coordinates in the odd-numbered rows are arranged in ascending order, and the hole coordinates in the even-numbered rows are arranged in descending order. All the hole coordinates are connected in sequence from the first row to the last row to form a processing path for the sub-processing area; Step S6: Taking the center of the sub-processing area as a node, constructing an objective function, the objective function including the path length connecting all nodes, solving the objective function, and obtaining the sub-processing area processing order; Step S7: processing the sub-processing areas in sequence according to the processing order of the sub-processing areas, and processing each through hole in the sub-processing areas in sequence based on the processing path of the sub-processing areas.

[0022] The present embodiment provides a porous substrate and a multi-through-hole processing method based on dynamic partitioning, which divides the substrate processing area into multiple grid units, constructs a spatial distribution density map, and obtains density ridges as partition boundaries based on density gradients to achieve efficient dynamic partitioning. Multiple rows are merged based on the hole coordinate spacing of the hole coordinate row, and all hole coordinates are connected to form a processing path of the sub-processing area to achieve travel optimization within the partition. The processing sequence of the sub-processing area is optimized by constructing an objective function to ensure that the path length is minimized, further improve the processing efficiency, and reduce the processing cost. The present invention optimizes multiple rows of through holes into a single-row continuous processing path through a dynamic partitioning strategy and a multi-row merging algorithm, significantly reducing the idle travel time of the laser head and the number of switching times between rows, thereby achieving efficient processing of large-scale through holes in the substrate.

[0023] Specifically, in step S2, the following method steps are also included: for each grid unit, the number of hole coordinates falling into the grid unit is counted, the hole density of the grid unit is the number of hole coordinates / grid unit area, and the spatial distribution density map of the processing area of ​​the substrate is constructed based on the hole density of each grid unit.

[0024] Step S2 also includes the following method steps: taking each hole coordinate as the center, using a kernel function to calculate its influence on each grid unit, the closer the distance between the hole coordinate and the grid unit, the greater the influence; adding up the influence of all the hole coordinates on the grid unit, that is, the hole density of the grid unit, and constructing a spatial distribution density map of the processing area of ​​the substrate based on the hole density of each grid unit.

[0025] As a further improvement of this embodiment, according to the hole density of each grid unit, color is used to represent the size of the hole density, a spatial distribution density map is drawn, the grid units are arranged in order of hole density, the grid units with hole density ranking greater than a preset percentile are defined as dense areas, and the grid units with hole density ranking less than the preset percentile are defined as sparse areas, and the dense areas and sparse areas in the spatial distribution density map are identified.

[0026] After the processing area of ​​the substrate is divided into a plurality of sub-processing areas, the sub-processing area optimization is also included, including the following method steps: Calculating the empty space ratio, hole distribution compactness and density uniformity of each of the sub-processing areas; When the area of ​​the sub-processing area is smaller than the preset threshold and the number of hole coordinates is less than the preset threshold, the sub-processing area is merged into the adjacent sub-processing area with the closest hole density. If the blank space ratio of the merged partition decreases and the hole distribution compactness improves, the merged partition is retained; otherwise, the merged partition is rolled back. When the density uniformity of the sub-processing area is greater than a preset threshold and the blank space ratio is greater than a preset threshold, the sub-processing area is segmented based on the density gradient ridge. If the blank space ratio of the merged partition decreases and the hole distribution compactness improves, the segmented partition is retained, otherwise the segmented partition is rolled back. When the blank space ratio and hole distribution compactness of all the sub-processing areas are within a preset range, the sub-processing area optimization is terminated; When the change in the blank space ratio and the hole distribution compactness of multiple iterations is less than the preset threshold, the sub-processing area optimization is terminated.

[0027] The calculation method of the blank space ratio is: blank space ratio = (total area of ​​sub-processing area - hole coverage area) / total area of ​​sub-processing area.

[0028] The calculation method of the blank space ratio is as follows: the hole distribution compactness is the horizontal and vertical standard deviation of the hole coordinates in the sub-processing area: .

[0029] Density uniformity is calculated as: Coefficient of variation (CV) of density values ​​within the sub-processing area: CV = density standard deviation / density mean.

[0030] For each subregion i, calculate its density ρi: ρi = area of ​​the sub-region and number of holes in the sub-region (number of holes / unit area).

[0031] Calculate the mean and standard deviation: Density mean (μ): ; Density standard deviation (σ): .

[0032] In step S3, the density field gradient is solved by calculating the density change rate of each grid point. By calculating the gradient of the discretized grid points in the continuous space covered by the density field, the density change trend in the space is quantified.

[0033] In step S4, the hole coordinate distance between two adjacent hole coordinate rows in the sub-processing area is calculated, and the two hole coordinate rows are merged when the hole coordinate distance is less than a preset threshold, including the following method steps: For adjacent hole coordinate rows, the average ordinates of the hole coordinates in the two hole coordinate rows are calculated respectively. If the difference between the corresponding average ordinates is less than a preset threshold, the two hole coordinate rows are merged, and the horizontal coordinates of the hole coordinates in the two hole coordinate rows are updated to the average horizontal coordinate. Repeat the above steps until the hole coordinates of all adjacent rows are greater than the preset threshold.

[0034] In step S6, the center of the sub-processing area is used as a node to construct an objective function, which includes the path length connecting all nodes and also includes the following method steps: The distance between nodes is represented by the Euclidean distance: ; in, and Respectively represent the horizontal and vertical coordinates of point i, and Represent the horizontal and vertical coordinates of point i respectively.

[0035] A heat load weight is assigned to each sub-processing area, and the temperature of each sub-processing area is monitored in real time by a temperature sensor. When the temperature of the sub-processing area rises, the heat load weight is reduced, and when the temperature of the sub-processing area drops, the heat load weight is increased; the heat load weight is introduced into the objective function.

[0036] In this embodiment, the objective function is to minimize the weighted total cost, where cost = distance cost + heat load cost, specifically expressed as: ; in, Representation node arrive distance, Indicates the target node Heat load weight (such as number of holes per unit area, power density, etc.), represents the heat load weight coefficient. In this embodiment, =0.5, indicating that the heat load weight accounts for 50% of the total cost.

[0037] Solution methods include: Initialization: Select the starting partition , marked as "visited", path , current heat accumulation ; For the current partition c, calculate its weighted cost with all unvisited partitions u, expressed as: ; in, Indicates the heat accumulation coefficient, which makes the heat load more influential when accumulated. In this embodiment =0.1, Indicates the heat accumulation of the current path, initially 0, and updated each time a partition is accessed: ; Termination condition: After all partitions are visited, return to the starting point to form a closed loop.

[0038] Example 2: This embodiment provides a porous substrate, which is formed by the multi-through-hole processing method described in the first embodiment.

[0039] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A multi-hole machining method based on dynamic partitioning, characterized in that: The method comprises the following steps: Obtain the hole coordinate set of the substrate multi-through hole processing; Dividing a substrate processing area into a plurality of grid cells, constructing a spatial distribution density map of the substrate processing area based on the hole coordinate set, and identifying dense areas and sparse areas in the spatial distribution density map; Calculating a density gradient for the spatial distribution density map, obtaining a density ridge based on the density gradient, and using the density ridge as a partition boundary to divide a processing area of ​​the substrate into a plurality of sub-processing areas; Divide the hole coordinates in the sub-processing area into multiple hole coordinate rows according to the vertical coordinate, calculate the hole coordinate distance between two adjacent hole coordinate rows, and merge the two hole coordinate rows when the hole coordinate distance is less than a preset threshold; In the sub-processing area, the hole coordinates in the odd-numbered rows are arranged in ascending order, and the hole coordinates in the even-numbered rows are arranged in descending order. From the first row to the last row, all the hole coordinates are connected in sequence to form the processing path of the sub-processing area; Taking the center of the sub-processing area as a node, constructing an objective function, the objective function including the path length connecting all nodes, solving the objective function to obtain the processing order of the sub-processing area; The sub-processing areas are processed in sequence according to the processing order of the sub-processing areas, and each through hole in the sub-processing areas is processed in sequence based on the processing path of the sub-processing areas.

2. The multi-hole machining method based on dynamic partitioning according to claim 1, characterized in that: Constructing a spatial distribution density map of the processing area of ​​a substrate based on a hole coordinate set includes the following method steps: for each grid unit, counting the number of hole coordinates falling into the grid unit, the hole density of the grid unit is the number of hole coordinates / grid unit area, and constructing a spatial distribution density map of the processing area of ​​the substrate based on the hole density of each grid unit.

3. The multi-hole machining method based on dynamic partitioning according to claim 1, characterized in that: A spatial distribution density map of a substrate's processing area is constructed based on a set of hole coordinates, comprising the following method steps: taking each hole coordinate as the center, using a kernel function to calculate its influence on each grid unit, wherein the closer the hole coordinate is to the grid unit, the greater the influence; adding the influences of all the hole coordinates on the grid unit to obtain the hole density of the grid unit, and constructing a spatial distribution density map of the substrate's processing area based on the hole density of each grid unit.

4. The multi-hole machining method based on dynamic partitioning according to claim 1, characterized in that: According to the hole density of each grid unit, color is used to represent the size of the hole density, a spatial distribution density map is drawn, the grid units are arranged in order of hole density, the grid units with hole density ranking greater than a preset quantile are defined as dense areas, and the grid units with hole density ranking less than the preset quantile are defined as sparse areas, and the dense areas and sparse areas in the spatial distribution density map are identified.

5. The multi-through hole machining method based on dynamic partitioning according to claim 1, characterized in that: After the processing area of ​​the substrate is divided into a plurality of sub-processing areas, the sub-processing area optimization is also included, including the following method steps: Calculating the empty space ratio, hole distribution compactness and density uniformity of each of the sub-processing areas; When the area of ​​the sub-processing area is smaller than the preset threshold and the number of hole coordinates is less than the preset threshold, the sub-processing area is merged into the adjacent sub-processing area with the closest hole density. If the blank space ratio of the merged partition decreases and the hole distribution compactness improves, the merged partition is retained; otherwise, the merged partition is rolled back. When the density uniformity of the sub-processing area is greater than a preset threshold and the blank space ratio is greater than a preset threshold, the sub-processing area is segmented based on the density gradient ridge. If the blank space ratio of the merged partition decreases and the hole distribution compactness improves, the segmented partition is retained, otherwise the segmented partition is rolled back. When the blank space ratio and hole distribution compactness of all the sub-processing areas are within a preset range, the sub-processing area optimization is terminated; When the change in the blank space ratio and the hole distribution compactness of multiple iterations is less than the preset threshold, the sub-processing area optimization is terminated.

6. The multi-through hole machining method based on dynamic partitioning according to claim 5, characterized in that: The calculation method of the blank space ratio is: blank space ratio = (total area of ​​sub-processing area - hole coverage area) / total area of ​​sub-processing area.

7. The multi-through hole machining method based on dynamic partitioning according to claim 5, characterized in that: The calculation method of the blank space ratio is as follows: the hole distribution compactness is the horizontal and vertical standard deviation of the hole coordinates in the sub-processing area: 。 8. The multi-through hole machining method based on dynamic partitioning according to claim 1, characterized in that: Calculating the hole coordinate spacing between two adjacent hole coordinate rows in a sub-processing area, and merging the two hole coordinate rows when the hole coordinate spacing is less than a preset threshold, includes the following method steps: For adjacent hole coordinate rows, the average ordinates of the hole coordinates in the two hole coordinate rows are calculated respectively. If the difference between the corresponding average ordinates is less than a preset threshold, the two hole coordinate rows are merged, and the horizontal coordinates of the hole coordinates in the two hole coordinate rows are updated to the average horizontal coordinate. Repeat the above steps until the hole coordinates of all adjacent rows are greater than the preset threshold.

9. The multi-through hole machining method based on dynamic partitioning according to claim 1, characterized in that: Taking the center of the sub-processing area as a node, construct an objective function, which includes the path length connecting all nodes and also includes the following method steps: A heat load weight is assigned to each sub-processing area, and the temperature of each sub-processing area is monitored in real time by a temperature sensor. When the temperature of the sub-processing area rises, the heat load weight is reduced, and when the temperature of the sub-processing area drops, the heat load weight is increased; the heat load weight is introduced into the objective function.

10. A porous substrate, characterized in that The porous substrate is formed by the multi-through hole processing method according to any one of claims 1 to 9.

Images