Separable base material layer printing film for electronic product and manufacturing method of separable base material layer printing film

Abstract

According to the separable base material layer printing film for the electronic product, after the functional structure layer of the printing film product is fixedly attached to the surface of a local structure, the base material structure layer can be rapidly and efficiently separated from the boundary of the separable connecting structure layer relative to the functional structure layer; not only is the thickness of a printing film product actually participating in work reduced so as to optimize the internal space layout of an electronic product, but also the working heat dissipation effect of a fitting position can be improved. The separable base material layer printing film comprises a separable connecting structure layer located in the middle, a base material structure layer playing a supporting role is arranged on one side of the separable connecting structure layer, and a functional structure layer is arranged on the other side of the separable connecting structure layer. The functional structure layer can be attached and fixed to the surface of the electronic product; the base material structure layer and the separable connecting structure layer can be separated relative to the functional structure layer, and the functional structure layer is reserved on the surface of the electronic product.

Description

Technical Field

[0001] The present invention relates to the field of functional printed film products inside electronic products, in particular to a detachable substrate layer printed film for electronic products and a manufacturing method thereof. Background Art

[0002] Printed film products used internally in electronic devices primarily include polyester film (PET), polyimide film (PI), PEN film, PC film, and PBT film. Common applications include flexible printed circuits (FPCs), optically transparent films, and electromagnetic shielding films. Flexible printed circuits, using PI film as a substrate, feature printed circuits printed with conductive inks, connecting electronic components and achieving lightweight, thinness, and flexibility. Optically transparent films are primarily used in LCD / LED displays for reflectivity, brightness enhancement, or anti-glare. Electromagnetic shielding films prevent electromagnetic interference and protect the stable operation of electronic components. These film products offer a range of functions, including insulation, conductivity, electromagnetic wave shielding, optical control, and component protection. Their structure typically consists of a substrate layer, a functional coating or printed layer, and a protective layer. Currently, the development of printed film products is characterized by market growth, technological advancements, expanding application areas, and accelerated domestic substitution. With the rapid development of industries such as consumer electronics and new energy, demand for high-performance film materials continues to rise. The maturity of printed electronics technologies, such as roll-to-roll printing, has improved production efficiency, and breakthroughs have been made in the research and development of new conductive inks and high-performance film materials. In addition to traditional fields, printed film products have gradually expanded to emerging fields such as flexible electronics, wearable devices, and medical electronics.

[0003] As mentioned above, although such printed film products used inside various electronic products are usually provided with various functional structural layers or surface coatings, due to the relatively thin and precise structure of these material layers, during the manufacturing process, it is inevitable to provide some material layers with relatively strong structural properties as substrate layers. On the one hand, they can serve as the basis for the setting or coating of other structural layers, and on the other hand, they can also effectively protect the functional layer parts during the actual bonding and setting of such printed film products.

[0004] For example, a light-shielding black electronic printed film is disclosed in the Chinese invention patent application document with application number CN202410726986.4, which includes a light-shielding layer, a substrate, an optical adhesive layer, and a release layer; the light-shielding layer is obtained by evenly coating a light-shielding coating on the side of the substrate away from the optical adhesive layer and then light-curing under AM1.5; the light-shielding coating includes, according to the raw material components: carboxyl acrylate copolymer resin epoxy resin, polyurethane acrylic resin, composite black color paste, photoinitiator, defoaming agent, leveling agent, deionized water, (E) 4-nitrophenyl 3 (4-nitrophenyl) acrylate, wetting agent, and sodium borohydride solution; the composite black color paste is a mixture of carbon black, polyacrylic acid, and black dendritic silicon-carbon hybrid mesoporous spheres loaded with gold nanoparticles. The light-shielding black electronic printed film provided in this scheme has high hardness, good wear resistance and impact resistance, and good structural properties. Another example is a printable antistatic protective film disclosed in the Chinese utility model patent application document with application number CN201721852942.8, which includes a film substrate, an antistatic printable coating and an antistatic coating coated on both sides of the film substrate, and a pressure-sensitive adhesive layer and a release layer compounded in sequence on the side of the antistatic coating facing away from the film substrate. In actual application, the film product provided in the utility model solution can effectively discharge static electricity, prevent static electricity from damaging electronic products and avoid the adsorption of impurities and dust, because antistatic treatment is done on both sides of the film substrate. At the same time, the antistatic printable coating can be printed, and text or labels can be printed on the coating, realizing the dual functions of label and protective film, and having more diverse uses.

[0005] After analyzing and comparing a large number of printed film products with functional layers on the surface that are similar to the above-mentioned reference schemes, the inventors found that although these printed film products inevitably have a substrate layer in their structure during production to enhance their own structural strength and play a protective role while facilitating the coating and setting of other structural layers, when the printed film product is actually attached to the local surface of the internal structure of the electronic product that needs to be covered and bonded, there is no need for the substrate layer to support or protect the printed film product. At this time, the continued existence of the substrate layer will instead cause it to occupy the already extremely densely crowded internal space of the electronic product, and also affect the heat dissipation performance of the local product module when it is working.

[0006] In response to the above problems, the present invention provides a detachable substrate layer printed film for electronic products, which includes a detachable connecting structural layer. After the functional structural layer of the printed film product is fixedly adhered to the local structural surface, the substrate structural layer can be quickly and efficiently separated from the functional structural layer at the boundary of the detachable connecting structural layer. This not only reduces the thickness of the printed film product when it is actually working to optimize the internal space layout of the electronic product, but also improves the working heat dissipation effect of the bonding point. Summary of the Invention

[0007] The present invention provides a detachable substrate layer printed film for electronic products, which includes a detachable connecting structural layer. After the functional structural layer of the printed film product is fixedly adhered to the local structural surface, the substrate structural layer can be quickly and efficiently separated from the functional structural layer from the boundary of the detachable connecting structural layer. This not only reduces the thickness of the printed film product when it is actually in use to optimize the internal space layout of the electronic product, but also improves the working heat dissipation effect of the bonding point.

[0008] The above technical objectives of the present invention are achieved through the following technical solutions: A detachable substrate layer printed film for electronic products includes a detachable connecting structural layer located in the middle, a substrate structural layer is provided on one side of the detachable connecting structural layer, for supporting the overall structure of the printed film, and a functional structural layer is provided on the other side of the detachable connecting structural layer, the functional structural layer can be adhered and fixed to the surface of the electronic product and meet the functional requirements when the printed film is attached to the product surface; the substrate structural layer and the detachable connecting structural layer can be peeled off and separated relative to the functional structural layer together, while retaining the functional structural layer on the surface of the electronic product.

[0009] As a preference of the present invention, an adjustment structure layer for controlling the surface structure state of the functional structure layer is further provided between the substrate structure layer and the detachable connection structure layer, and a light-shielding structure layer is further provided on the outer surface of the functional structure layer.

[0010] As a preferred embodiment of the present invention, the raw material components of the detachable connecting structure layer include high molecular weight polyvinyl alcohol.

[0011] As a preferred embodiment of the present invention, the thickness of the separable connection structure layer is 0.1-1μ.

[0012] As a preferred embodiment of the present invention, it is characterized in that the thickness of the adjustment structure layer is 1-10μ.

[0013] As a preference for the present invention, the thickness of the light-shielding structure layer is 1-10 μm.

[0014] As a preferred embodiment of the present invention, the substrate structural layer contains PET, BOPP or PI material.

[0015] A method for manufacturing a detachable substrate layer printed film for electronic products, used to make the aforementioned detachable substrate layer printed film for electronic products, comprises the following steps: s1. providing a substrate structure layer; s2. providing an adjustment structure layer on the surface of the substrate structure layer; s3. providing a detachable connection structure layer on the surface of the adjustment structure layer; s4. providing a functional structure layer on the surface of the detachable connection structure layer; s5. providing a light-shielding structure layer on the surface of the functional structure layer.

[0016] As a preferred embodiment of the present invention, before providing the detachable connection structure layer, the method further comprises step s21 of curing the adjustment structure layer.

[0017] In summary, the present invention can achieve the following multiple beneficial effects: The detachable substrate layer printed film for electronic products provided in the solution of the present invention realizes that after the functional structural layer is adhered to the interior or surface area of ​​the electronic product that needs to be adhered and covered, the substrate structural layer and the detachable connecting structural layer that are not related to the application of the printed film product are peeled off and removed from the surface of the functional structural layer. This structural form, on the one hand, can use the substrate structural layer to provide stable and reliable support for the structural layers of other parts during the production of the printed film product to ensure sufficient strength to prevent the film product from deformation or damage; and after the printed film is adhered and fixed to the surface of the component or product equipment working area, the other structural layers above the functional structural layer can be completely removed, greatly reducing the actual application thickness of the printed film product when participating in the equipment operation, thereby providing designers and developers with the possibility of further optimization and improvement of the extremely complex and precise spatial layout inside the electronic product, and better adapting to the improvement and optimization needs of miniaturization and lightweighting in the field of electronic products. At the same time, because the printed film can remove the substrate structural layer it contains during application, it also plays a role in enhancing the local heat dissipation capacity of the electronic product. Of course, when such printed film products are made of transparent materials and applied in the optical display field, since the printed film actually removes the substrate structural layer during operation, its overall thickness is reduced. This can achieve a clearer and brighter display effect in the display area, greatly improving the external appearance of the image. In addition, due to its separable structure, the removed substrate structural layer and the corresponding parts such as the detachable connecting structural layer can be recycled and reused, reducing the consumption of substrate material and the generation of waste, making printed film products more suitable for green and environmentally friendly production processes.

[0018] The detachable substrate layer printed film for electronic products provided in the solution of the present invention covers the actual application surface of the functional structural layer with a substrate structural layer with higher structural strength, thereby playing an extremely sufficient protective role and preventing the thin and fragile functional structural layer from being damaged during the transfer or bonding process. At the same time, since the substrate structural layer with higher structural strength will be quickly separated and removed after the rapid printing film product is bonded to the target position, even if the printed film product is first bonded as a whole to some local uneven or bent corner areas of some electronic products, the internal stress of these structures can be greatly reduced by peeling off the substrate structural layer, so that the functional structural layer can be more stably, reliably and firmly attached to the surface of the working area. Of course, since the outer application surface of the functional structural layer is exposed only after peeling, it can further ensure the flatness of the surface of the functional structural layer when it is attached to the local part of the electronic product, so that it is more suitable for subsequent more precise processing technology and improves product quality.

[0019] The removable substrate printed film for electronic products proposed in the present invention preferably utilizes a high-molecular-weight polyvinyl alcohol (PVA) component as the removable connecting structural layer. This material selection allows the two structural layers to be tightly bonded, exhibiting strong adhesion, due to chemical polarity interactions (such as hydrogen bonding) between the hydroxyl groups and surface polar groups of common substrate materials such as PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide). This, combined with the excellent wettability and molecular chain entanglement of the PVA glue, and the mechanical anchoring and uniform film formation during the curing process, results in strong adhesion. In contrast, the functional structural layer of the printed film, made of materials such as polycarbonate (PC), acrylic polymers, and fluoropolymers, exhibits much weaker bonding strength between the PVA glue and the functional structural layer than between the PET, BOPP, and PI substrate layers. Consequently, under external force, the substrate layer can be peeled off from the functional structural layer, carrying the PVA glue layer intact. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the arrangement relationship of the structural layers of the detachable substrate layer printing film; Figure 2 Schematic diagram of the principle of the functional structural layer in the detachable substrate layer printed film being separated from other structural layers after being attached to the product surface; Figure 3 It is a structural arrangement form in which an adjustment structure layer and a light-shielding structure layer are additionally provided in a detachable substrate layer printing film. DETAILED DESCRIPTION

[0021] The following specific embodiments are merely explanations of the present invention and are not limitations of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the embodiments as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

[0022] This solution is achieved through the following technical means: Example: This example provides a detachable substrate layer printed film for electronic products. The structural layout can be found in the accompanying drawings in this specification. The printed film product primarily comprises a central detachable connecting structural layer. A substrate structural layer is disposed on one side of the detachable connecting structural layer to support the overall structure of the printed film. A functional structural layer is disposed on the other side of the detachable connecting structural layer. The functional structural layer can adhere to the surface of the electronic product and meet the functional requirements of the printed film when attached to the product surface. The substrate structural layer and the detachable connecting structural layer can be peeled off from the functional structural layer together, leaving the functional structural layer on the surface of the electronic product.

[0023] Specifically, the substrate structural layer can be made of materials such as PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide), which possess excellent structural strength, chemical stability, and high-temperature resistance. The functional structural layer is typically selected and designed based on different practical application scenarios, with various resin systems and material types being selected based on actual product requirements. In the solution presented in this embodiment, a single-component thermosetting acrylic resin material is selected as the primary component of the functional structural layer for ease of subsequent explanation.

[0024] The specific selection of the separable connecting structural layer provided between the aforementioned substrate structural layer and the functional structural layer can be mainly set to the following categories: ① Silicone system Main ingredients: polydimethylsiloxane (PDMS) containing hydrogen silicone oil and hydroxy silicone oil; ②Non-silicone release agent system Main ingredients: polyvinyl alcohol (water-soluble polymer), water, cross-linking agent (such as glyoxal, boric acid); ③. Fatty acid and derivative systems Main ingredients: fatty acids (stearic acid, oleic acid); fatty acid esters (glyceryl stearate, ethyl palmitate); metal soaps (zinc stearate, calcium stearate); ④. Polyolefin system Main ingredients: polyethylene (PE) wax, polypropylene (PP) wax; mineral oil, paraffin; ⑤ Fluorocarbon modified system Main ingredients: fluorine-modified acrylic resin, fluorine surfactant (such as ammonium perfluorooctane sulfonate); ⑥ Fluorine-based release agent system Main Ingredients: 1. Fluorocarbon polymers (polytetrafluoroethylene (PTFE), perfluoropolyether (PFPE); fluororesin emulsions (such as PTFE aqueous dispersions)) 2. Solvent (fluorinated solvent (perfluoroheptane, fluoroether solvent): dissolves fluororesin, environmentally friendly (no VOC)) 3. Additives (coupling agent (fluorosilane): enhances the bonding strength between the coating and the substrate); ⑦Light-curing release agent Main ingredients: double bond silicone oil (such as vinyl silicone oil), photoinitiator (such as Irgacure 184).

[0025] In the above-mentioned solution, polyvinyl alcohol glue is selected as a preferred material type in this embodiment as the primary component of the removable connecting structural layer. When polyvinyl alcohol glue is selected as the primary component of the removable connecting structural layer, it can be stably bonded to structural layers primarily composed of PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide), while also enabling quick and convenient separation from structural layers primarily composed of a single-component thermosetting acrylic resin material.

[0026] The main reasons are as follows: The reason for stable bonding with PET, BOPP and PI is: Polarity and Wettability: Polyvinyl alcohol (PVA) adhesive possesses a certain degree of polarity. The hydroxyl groups on its molecular chain can form hydrogen bonds and other interactions with polar groups on the surfaces of PET, BOPP, and PI, thereby enhancing adhesion to these materials. Furthermore, PVA adhesive exhibits excellent wettability, effectively soaking into the surfaces of PET, BOPP, and PI, ensuring close contact between the adhesive and the substrate, providing an excellent foundation for bonding.

[0027] Entanglement and penetration of molecular chains: Polyvinyl alcohol molecular chains are relatively flexible. During the glue coating process, they can be entangled and penetrated to a certain extent with the molecular chains on the surfaces of PET, BOPP and PI, forming a structure similar to mechanical meshing, thereby improving the bonding strength and enabling them to be stably fitted and connected.

[0028] Curing characteristics: The curing process of polyvinyl alcohol glue mainly depends on the evaporation of water and the cross-linking reaction between molecules. The adhesive layer formed after curing has certain strength and toughness, which can effectively bond structural layers such as PET, BOPP and PI with adjacent layers. Under normal use conditions, this bonding performance is relatively stable and is not easily affected by environmental factors and fails.

[0029] Like dissolves like principle: From the perspective of chemical properties, polyvinyl alcohol has certain structural similarities with materials such as PET, BOPP and PI. They all have long carbon chain structures. According to the principle of like dissolves like, they have good compatibility with each other. This compatibility is conducive to the spreading and adhesion of glue on the surface of the substrate, thereby achieving a stable fitting connection.

[0030] The reason why the structural layer can be separated quickly and conveniently compared to the single-component thermosetting acrylic resin material is that: Differences in intermolecular forces: The three-dimensional network structure formed by the curing of single-component thermosetting acrylic resins makes the intermolecular forces between them and the substrate strong and difficult to break. In contrast, the bond between polyvinyl alcohol adhesive and the substrate is mainly based on hydrogen bonds and some weaker intermolecular forces. When subjected to external forces, these forces are relatively easy to overcome, resulting in rapid separation.

[0031] Different degrees of curing reaction: Single-component thermosetting acrylic resins undergo a cross-linking reaction during the curing process, forming a highly cross-linked network structure. This structure makes the bond with the substrate very strong and difficult to separate. In contrast, the curing of polyvinyl alcohol glue is mainly a physical process. Although a certain degree of cross-linking occurs, the cross-linking density is relatively low, and the cohesive strength of the adhesive layer is relatively small. Therefore, less force is required for separation, making it easier to achieve quick and convenient separation.

[0032] Impact on substrate surface energy: Single-component thermosetting acrylic resins have high requirements for substrate surface energy. Once a good bond is formed with the substrate, they adhere tightly to the substrate surface and are difficult to separate. Polyvinyl alcohol adhesives, on the other hand, have a wider adaptability to substrate surface energy. After curing, the adhesive layer has a relatively low surface energy and relatively weak adhesion to the substrate. This makes it easier to peel from the substrate surface without damaging the substrate when separation is required.

[0033] Temperature sensitivity differences: Single-component thermosetting acrylic resins have good heat resistance and can maintain good bonding performance at higher temperatures. Polyvinyl alcohol glue, on the other hand, has relatively poor heat resistance. When the temperature rises, the strength and viscosity of the adhesive layer decrease significantly, and the mobility of the molecular segments increases. This makes the bond between the polyvinyl alcohol glue and the substrate more easily broken under high temperature conditions, allowing for quick and convenient separation.

[0034] Furthermore, the inventors will also provide other optional system categories as main components for the aforementioned non-silicone release agent system: Acrylic system: Amino-modified acrylic resins serve as the base resin, forming a release layer through a cross-linking reaction. They are suitable for applications requiring ultra-light release (e.g., in the electronics die-cutting industry). Hydroxyl-containing acrylic resins are combined with isocyanate curing agents to adjust the release force range.

[0035] Fluorocarbon system: Fluoride coating (such as CF series fluorine release film) uses low surface energy fluoropolymer to achieve release, which is suitable for processing electronic materials sensitive to silicon.

[0036] Polyolefin system: High-density polyethylene (HDPE), linear low-density polyethylene (LLDPE), and low-density polyethylene (LDPE) blended laminations are used for substrate treatment. Water-based polyolefin dispersions are used as primers or release layers, offering excellent adhesion and environmental friendliness.

[0037] Polyurethane system: Polyurethane release agents (PU mold release agents) are used to release polyurethane products from the mold, forming a uniform release film for peeling. They are suitable for processes such as integral skinning and rigid foaming. Silicone-based hybrid polyurethane systems combined with acrylate endcapping improve compatibility and residual adhesion.

[0038] Polyether system: Long-chain alkyl polyether, as the main component of non-silicone release agent, forms a stable release layer through cross-linking reaction, which is suitable for release needs in high temperature environment.

[0039] Polyimide system: Polyimide is used as a base material or release layer, which has high temperature resistance and chemical stability and is used for release films in high temperature environments.

[0040] Non-reactive non-silicone release agent: The new release agent avoids reaction with the silicone formula, and solves the silicone transfer problem by adjusting the release force formula to meet different application requirements. For the detachable connecting structure layer made of the above-mentioned various material systems, during the coating or lamination process of actual film product production, the thickness of the detachable connecting structure layer can be set to 0.1-1 μm, preferably 0.2-0.4 μm.

[0041] The inventors also considered that in many cases, in the printed film inside the electronic product, it is necessary to set a light-shielding layer covering treatment on the outside of the functional structural layer. For example: to prevent light interference, such as protecting photosensitive components from external light affecting performance, or reducing screen reflection to improve display effects; hiding the internal structure, protecting intellectual property rights and product design, avoiding exposing details such as circuit layout, and improving the appearance of the product; preventing static electricity accumulation, reducing static electricity damage to electronic components and dust absorption; meeting special functional requirements, such as achieving specific optical effects or assisting electromagnetic shielding. In these application scenarios, shading treatment of local locations inside electronic products not only helps to ensure the performance, stability and service life of electronic products, but also can adapt to different usage environments and functional requirements.

[0042] Therefore, as a preferred structure, the detachable substrate layer printed film for electronic products given in this embodiment is also covered with a light-shielding structure layer on the outer surface of the functional structure layer. Specifically, the second light-shielding layer structure here uses a nano black color paste with a particle size of less than 1μ or a common black color paste for coloring, and the thickness of the light-shielding structure layer is set to 1-10μ, preferably 2-5μ. Of course, similar to the above structure, the outer surface of the functional structure layer or the substrate structure layer given in the above text can also be further provided with other light-shielding covering structure layers by coating or covering according to actual working scenarios or usage requirements, which will not be elaborated here.

[0043] Furthermore, the inventors considered that the surface structure of the functional structural layer would need to be adjusted and controlled according to its actual use scenarios. However, since the functional structural layer itself is relatively thin and precise, if its surface roughness, texture, or local uneven structure were to be processed and controlled through independent process steps, it would greatly increase the processing difficulty of the production process and easily increase the product rejection rate.

[0044] Therefore, in this embodiment, as a preferred structural form, an adjustment structure layer is provided between the aforementioned substrate structure layer and the detachable connection structure layer to control the final exposed surface structure state of the functional structure layer.

[0045] For example, the adjustment structure layer here uses a combination of hydroxyl resin, isocyanate and matting powder, the processing temperature is between 70-150, and micro-concave or gravure printing is used. The roughness is generally RA: 0.2-1.4, preferably 0.3-0.6. At the same time, the thickness of the adjustment structure layer can be set to 1-10μ, preferably 3-5μ.

[0046] The adjustment structure layer formed in the above manner has a higher strength and the ability to maintain the surface structure morphology than other structural layers. At the same time, since the adjustment structure layer itself adopts a micro-concave or gravure printing method, the structural layer can better maintain the roughness state and concave-convex structure state that it has formed and meets the actual requirements. Since the thickness of the aforementioned detachable connecting structure layer is much smaller than that of the other structural layers, and the overall thickness of the detachable connecting structure layer is uniform and has good ductility and deformation ability, when the detachable connecting structure layer is adhered to the surface of the adjustment structure layer, the structural morphology of the surface of the adjustment structure layer can continue to pass downward through the detachable connecting structure layer. That is, at this time, the performance of the detachable connecting structure layer is a controllable structural state that is the same or similar to the surface of the adjustment structure layer. Then, in this structural state, when the surface of the detachable connecting structure layer continues to adhere to the functional structure layer, it is only necessary to apply a certain relative extrusion force to the two separated parts during the adhesion process. Then, the surface structure of the adjustment structure layer will apply an extrusion force downward through the detachable connecting structure layer, thereby causing the surface of the functional structure layer to deform. Through this processing method, precise control of the surface roughness and concave-convex structure of the aforementioned functional structural layer is achieved, while not affecting the connection or peeling effect between the detachable connecting structural layer and the functional structural layer in different usage working scenarios.

[0047] Furthermore, in this embodiment, the inventors also provide a process method and steps for producing the aforementioned detachable substrate layer printed film for electronic products, which are specifically as follows: s1. Setting the substrate structure layer; s2. Adjusting the structural layer provided on the surface of the substrate structural layer; s3. A detachable connecting structure layer is provided on the surface of the adjustment structure layer; s4. A functional structural layer is provided on the surface of the detachable connecting structural layer; s5. Arrange a light-shielding structural layer on the surface of the functional structural layer.

[0048] Furthermore, considering that the thickness of the polyvinyl alcohol glue coated on the surface of the adjustment structure layer as the detachable connecting structure layer is extremely thin, and in order to improve the smoothness and coverage effect of the coating when the structure layer is set, and to avoid the squeezing and collision when the functional structure layer above it is set, causing the adjustment structure layer below to be squeezed and deformed, thereby causing the detachable structure layer to be offset or damaged, affecting the subsequent bonding consistency and the convenience of peeling, the adjustment structure layer can also be cured before the detachable connecting structure layer is set. The curing method here can be a variety of different forms such as light curing or heat curing, depending on the type of material actually selected as the adjustment structure layer, which will not be expanded here.

[0049] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A detachable substrate layer printed film for electronic products, characterized in that: It includes a detachable connecting structural layer located in the middle, a substrate structural layer is arranged on one side of the detachable connecting structural layer, which is used to support the overall structure of the printed film, and a functional structural layer is arranged on the other side of the detachable connecting structural layer. The functional structural layer can be adhered and fixed to the surface of the electronic product and meet the functional requirements when the printed film is attached to the product surface; the substrate structural layer and the detachable connecting structural layer can be peeled off and separated relative to the functional structural layer together, while retaining the functional structural layer on the surface of the electronic product.

2. The detachable substrate layer printed film for electronic products according to claim 1, characterized in that: An adjustment structure layer for controlling the surface structure state of the functional structure layer is further provided between the substrate structure layer and the detachable connection structure layer, and a light-shielding structure layer is further provided on the outer surface of the functional structure layer.

3. The detachable substrate layer printed film for electronic products according to claim 1, characterized in that: The raw material components of the detachable connecting structure layer include high molecular weight polyvinyl alcohol.

4. The detachable substrate layer printed film for electronic products according to claim 3, characterized in that: The thickness of the separable connection structure layer is 0.1-1 μm.

5. The detachable substrate layer printed film for electronic products according to claim 2, characterized in that: The thickness of the regulating structure layer is 1-10 μm.

6. The detachable substrate layer printed film for electronic products according to claim 2, characterized in that: The thickness of the light-shielding structure layer is 1-10 μm.

7. The detachable substrate layer printed film for electronic products according to claim 4, characterized in that: The substrate structural layer contains PET, BOPP or PI material.

8. A method for manufacturing a detachable substrate layer printed film for electronic products, for manufacturing the detachable substrate layer printed film for electronic products according to claim 2, characterized in that: The following steps are involved: s1. Setting the substrate structure layer; s2. An adjustment structure layer is provided on the surface of the substrate structure layer; s3. A detachable connection structure layer is provided on the surface of the adjustment structure layer; s4. Arrange a functional structural layer on the surface of the detachable connection structural layer; s5. Arrange a light-shielding structural layer on the surface of the functional structural layer.

9. The method for manufacturing a detachable substrate layer printed film for electronic products according to claim 9, characterized in that: Before setting the detachable connection structure layer, the method further includes step s21 of curing the adjustment structure layer.

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