LED device and LED lamp panel

Abstract

The invention relates to the technical field of LED packaging, and discloses an LED device and an LED lamp panel. The LED device comprises a substrate, an LED chip, a light-transmitting separator and packaging glue, the LED chip is inversely arranged on the substrate, the light-transmitting separator is arranged on the outer side of the LED chip, and the packaging glue covers the outer side of the light-transmitting separator, so that the LED chip is isolated from the packaging glue. According to the LED device provided by the invention, the inverted LED chip and the packaging adhesive are completely isolated by arranging the light-transmitting isolation piece, so that the solder paste at the welding part of the inverted LED chip is prevented from being pulled by the thermal expansion force generated by the packaging adhesive during secondary melting at a high temperature; solder paste at the welding position of an inverted LED chip under high-temperature backflow can be smoothly melted back to be connected with a bonding pad, the phenomenon that a lamp is dead due to insufficient soldering or unsoldering of the chip is avoided, and finally the high reliability of the LED device and lamp drive integrated display module is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and in particular to an LED device and an LED lamp board. Background Art

[0002] With the rapid advancement of LCD display technology in recent years, the trend towards larger screens, high dynamic range (HDR), and the demand for the "stay-at-home economy," Mini-LED display technology has gradually penetrated medium and large-sized display applications, including TVs, commercial displays, and esports. The current mainstream Mini-LED backlight product is a lamp-driver integrated board, which contains LEDs and other components, including integrated circuits, soldered together on a printed circuit board (PCB). This is achieved by packaging the LED chips into individual SMD LEDs, which are then packaged together with the driver IC and other components on a PCB, often known as POB (Package on Board) packaging. POB is currently the most widely used packaging technology, particularly prevalent in current Mini-LED display products.

[0003] Due to the high power, high integration and high heat dissipation requirements of Mini-LED products, more and more lamp beads are packaged using flip-chip LED chips. Lamp beads are only part of the components of Mini-LED products. Generally, the lamp beads are manufactured first and then packaged on the PCB together with components such as driver ICs. However, when the lamp beads and driver ICs and other components are packaged on the PCB together, the lamp beads will undergo a secondary reflow process, resulting in secondary melting of the solder at the LED chip packaging welding point in the lamp beads, causing the LED chip in the lamp beads to have a cold solder joint, resulting in chip dead light, affecting the quality of the lamp beads, resulting in defective products, and even affecting the rework of the display module.

[0004] Therefore, the lamp beads in the prior art are prone to the problem of poor soldering of the LED chips inside the lamp beads when they are packaged together with other electronic components, resulting in defective products. Summary of the Invention

[0005] In response to the above problems, the present invention aims to provide an LED device and an LED lamp board, which can solve the problem in the prior art that the LED chip inside the lamp bead is easily soldered during packaging, resulting in defective products.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] An LED device includes a substrate, an LED chip, a light-transmitting spacer and a packaging adhesive. The LED chip is flip-chip arranged on the substrate, the light-transmitting spacer is arranged on the outside of the LED chip, and the packaging adhesive is covered on the outside of the light-transmitting spacer to isolate the LED chip from the packaging adhesive.

[0008] In a feasible embodiment, the light-transmitting isolation member is an isolation cover, and the light-transmitting isolation cover is provided on the substrate and surrounds the outer side of the LED chip.

[0009] In a feasible embodiment, a mounting groove is provided on the substrate, and the bottom edge of the light-transmitting isolation member is fixedly disposed in the mounting groove.

[0010] In a feasible embodiment, the LED device further includes a reflective cup, which is disposed on the substrate and surrounds the outside of the light-transmitting isolation member. The packaging glue is filled in the reflective cup and is located outside the light-transmitting isolation member.

[0011] In a feasible embodiment, the light-transmitting isolation member is in the shape of a spherical shell, a quasi-spherical shell or a square shell structure, or a combination of these.

[0012] In a feasible embodiment, the light-transmitting isolation member is an isolation sheet, the LED device further includes a reflective cup, the reflective cup is arranged on the substrate, the light-transmitting isolation member is mounted on the inner wall of the reflective cup, the light-transmitting isolation member and the reflective cup form an isolation space for isolating the LED chip, and the packaging glue is filled in the reflective cup and is located outside the light-transmitting isolation member.

[0013] In a feasible embodiment, a supporting structure is provided on the inner wall of the reflective cup, and the supporting structure is used to fix and support the edge of the light-transmitting isolation member.

[0014] In a feasible embodiment, the light-transmitting spacer bulges from a side close to the LED chip to a side close to the packaging adhesive.

[0015] The present invention also provides an LED lamp board, comprising a circuit board, a driver chip and the LED device, wherein a circuit route is preset on the circuit board, and the driver chip and the LED device are arranged on the circuit board and electrically connected through the circuit route.

[0016] In a feasible embodiment, the LED chip is flip-chip mounted on the substrate via a first solder, and the driver chip is mounted on the circuit board via a second solder, wherein the melting point of the second solder is higher than that of the first solder.

[0017] Due to the adoption of the above technical solution, the present invention has at least the following beneficial effects:

[0018] The LED device provided by the present invention completely isolates the flip-chip LED chip from the packaging glue by arranging a light-transmitting isolation piece, thereby preventing the solder paste at the welding point of the flip-chip LED chip from being pulled by the thermal expansion force generated by the packaging glue when it melts for the second time at high temperature. The solder paste at the welding point of the flip-chip LED chip can be smoothly remelted and connected to the solder pad under high-temperature reflow without causing chip cold soldering or desoldering and dead light. In addition, the subsequent assembly of the integrated lamp-driver display module can select a temperature compatible with the tin plating soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp-driver display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the first structure of the LED device provided by an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of a second structure of an LED device provided by an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the third structure of the LED device provided by an embodiment of the present invention;

[0022] Figure 4 1 is a fourth structural schematic diagram of an LED device provided in an embodiment of the present invention;

[0023] Figure 5 1 is a schematic diagram of a fifth structure of an LED device provided in an embodiment of the present invention;

[0024] Figure 6 1 is a sixth structural diagram of an LED device provided by an embodiment of the present invention;

[0025] Figure 7 1 is a seventh structural diagram of an LED device provided by an embodiment of the present invention;

[0026] Figure 8 1 is a schematic diagram of an eighth structure of an LED device provided by an embodiment of the present invention;

[0027] Figure 9 This is a schematic structural diagram of an LED light board provided by an embodiment of the present invention;

[0028] Figure 10 It is a flowchart of the method for manufacturing an LED device provided by an embodiment of the present invention.

[0029] In the accompanying drawings, 1 is a substrate; 11 is a mounting groove; 2 is an LED chip; 3 is a light-transmitting spacer; 4 is a packaging adhesive; 5 is a reflective cup; 51 is a supporting structure; 10 is a circuit board; 20 is a driver chip; and 30 is an LED device. DETAILED DESCRIPTION

[0030] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0032] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0033] Example 1

[0034] See also Figure 1 , Figure 1 This is a first structural schematic diagram of the LED device provided in this embodiment. This embodiment provides an LED device, including a substrate 1, an LED chip 2, a light-transmitting spacer 3 and a packaging glue 4. The LED chip 2 is flip-chip arranged on the substrate 1, and the light-transmitting spacer 3 is arranged on the outside of the LED chip 2. The outer side of the light-transmitting spacer 3 is covered with the packaging glue 4 to isolate the LED chip 2 from the packaging glue 4.

[0035] It is understood that the substrate 1 in this embodiment is mainly used to install and set the LED chip 2. The LED chip 2 and the substrate 1 can be fixedly connected by solder paste. The specific implementation of the flip-chip LED chip 2 belongs to the mature technology in this field and will not be further described here. The substrate 1 in this field is generally a PCB board or a carrier board, etc., which generally includes a substrate body. The shape of the substrate body is not strictly limited and can be square, round or irregular. The substrate body can be made of a rigid material, such as but not limited to phenolic paper laminate, epoxy paper laminate, polyester glass felt laminate, epoxy glass cloth laminate, BT resin board, or glass plate; the substrate body can also be made of a flexible material, such as but not limited to polyester film, polyimide film, and fluorinated ethylene propylene film. In some examples, corresponding circuits can be integrated in or on the substrate body according to application requirements, including but not limited to circuits connected to the LED chip 2 and driving circuits, etc., or a conductive layer can be passed through the substrate 1 to lead out solder pads on both sides of the substrate 1, so as to facilitate the connection of the flip-chip LED chip 2 on one side, and the solder pads on the other side are electrically connected to the PCB or other components, so that the LED chip 2 is connected to other display modules. More specific situations are not further described here.

[0036] It can be understood that the light-transmitting isolation member 3 in this embodiment is mainly used to form an isolation between the LED chip 2 and the packaging glue 4, so as to prevent the packaging glue 4 from expanding due to heat and pulling the LED chip 2 when the LED device in this embodiment and other components are packaged together on the circuit board for reflow soldering. At the same time, in addition to playing an isolation role, it is also necessary to ensure that the most basic light-emitting function of the LED device itself is not affected. Therefore, the isolation member in this embodiment is selected to ensure both the light transmission effect and the isolation effect. The specific light-transmitting isolation member 3 can be a quartz glass-like material with high transparency, high temperature resistance, and high light radiation resistance, such as quartz glass, high borosilicate glass, transparent ceramic microcrystalline glass, etc.

[0037] It can be understood that the encapsulation glue 4 is a conventional material in this field, which is mainly used to protect the LED chip 2 and play a light-transmitting role. The type of encapsulation glue 4 can be selected and set according to actual needs. For example, the LED device in this embodiment can use fluorescent glue or various resin materials, etc., which will not be further described here.

[0038] It can be understood that the isolation of the LED chip 2 and the packaging glue 4 by the light-transmitting isolation member 3 in this embodiment mainly means that the packaging glue 4 cannot enter the inner side of the light-transmitting isolation member 3, that is, it cannot contact the LED chip 2; it should also be noted that the outer side of the light-transmitting isolation member 3 in this embodiment mainly refers to the side away from the LED chip 2, and the inner side mainly refers to the side facing the LED chip 2.

[0039] like Figure 1 As shown, in this embodiment, the light-transmitting isolation member 3 is an isolation cover, and the light-transmitting isolation member 3 is disposed on the substrate 1 and surrounds the outer side of the LED chip 2 .

[0040] It can be understood that the isolation cover is meant to cover the LED chip 2 so that the LED chip 2 is isolated from the subsequent packaging glue 4. The advantage of using the isolation cover is that it can be directly covered on the substrate 1 without the help of a reflective cup 5 or other supporting structure 51 to isolate the packaging glue 4 and the LED chip 2, thereby improving the flexibility of use.

[0041] like Figure 2 As shown, it is a second structural schematic diagram of the LED device provided in this embodiment. In this embodiment, a mounting groove 11 is provided on the substrate 1, and the bottom edge of the light-transmitting isolation member 3 is fixedly provided in the mounting groove 11. It can be understood that the mounting groove 11 is consistent with the shape of the bottom edge of the light-transmitting isolation member 3. For example, if the light-transmitting isolation member 3 is spherical, the mounting groove 11 is a circular groove provided on the substrate 1 around the LED chip 2. More specific shapes are not further described here. The provision of the mounting groove 11 can realize the rapid positioning and installation of the light-transmitting isolation member 3, and after fixation, the mounting groove 11 can be used to limit the light-transmitting isolation member 3 to avoid loosening and relative displacement of the light-transmitting isolation member 3 on the substrate 1.

[0042] In addition, it can be understood that the light-transmitting isolation member 3 in this embodiment can be fixed on the substrate 1 by high-temperature curing through silicone bonding, or other conventional glues can be used, such as inorganic high-temperature glue or high-temperature resistant glass glue, etc., which mainly realize the fixation of the light-transmitting glass parts and can withstand high temperatures to prevent the light-transmitting isolation member 3 from loosening when the LED device is subsequently packaged into the display module for reflow soldering.

[0043] like Figure 3 FIG. 1 is a schematic diagram of a third structure of the LED device provided in this embodiment. In this embodiment, the LED device further includes a reflective cup 5, which is disposed on the substrate 1 and surrounds the outer side of the light-transmitting spacer 3. The encapsulating glue 4 is filled in the reflective cup 5 and is located outside the light-transmitting spacer 3. It will be understood that the specific shape of the reflective cup 5 is not limited in this embodiment and is primarily used to reflect and adjust the light emitted by the LED chip 2.

[0044] like Figure 1 and Figure 4 As shown, Figure 4This is a fourth structural diagram of the LED device provided in this embodiment. The light-transmitting spacer 3 is a spherical shell, a quasi-spherical shell, or a square shell structure, or a combination thereof. It can be understood that the light-transmitting spacer 3 in this embodiment is mainly used to cover the outside of the LED chip 2, and a cavity for accommodating the LED chip 2 is provided on the inside thereof. The external shape can be adjusted according to actual needs, for example, Figure 4 The selection of a spherical or quasi-spherical shape as shown can reduce stress concentration and enable the light emitted by the LED chip 2 to be emitted perpendicularly to the spherical surface to avoid refraction. Those skilled in the art can understand and implement more specific situations in combination with the above description, which will not be further described here.

[0045] It is understandable that if Figure 5 As shown, Figure 5 This is the fifth structural diagram of the LED device provided in this embodiment. When the light-transmitting isolation member 3 in this embodiment uses an isolation cover, the light-transmitting isolation member 3 can be set close to the LED chip 2, so that there is enough space outside the light-transmitting isolation member 3 to facilitate the dispensing of the packaging glue 4, thereby ensuring the packaging effect of the packaging glue 4.

[0046] The LED device provided in this embodiment completely isolates the flip-chip LED chip 2 from the packaging glue 4 by providing a transparent isolation member 3, thereby preventing the solder paste at the welding point of the flip-chip LED chip 2 from being pulled by the thermal expansion force generated by the packaging glue 4 when it melts for the second time at high temperature. The solder paste at the welding point of the flip-chip LED chip 2 can be smoothly remelted and connected to the solder pad under high-temperature reflow without causing chip cold soldering or desoldering and dead light. In addition, the subsequent assembly of the integrated lamp-driver display module can select a temperature that is compatible with the tin plating soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp-driver display module.

[0047] Example 2

[0048] See also Figure 6 , Figure 6 This is the sixth structural schematic diagram of the LED device provided in this embodiment. This embodiment provides an LED device, including a substrate 1, an LED chip 2, a light-transmitting spacer 3 and a packaging glue 4. The LED chip 2 is flip-chip arranged on the substrate 1, and the light-transmitting spacer 3 is arranged on the outside of the LED chip 2. The outer side of the light-transmitting spacer 3 is covered with the packaging glue 4 to isolate the LED chip 2 from the packaging glue 4.

[0049] like Figure 6As shown, different from Example 1, in this embodiment, the light-transmitting isolation member 3 is an isolation sheet, and the LED device further includes a reflective cup 5, which is arranged on the substrate 1, and the light-transmitting isolation member 3 is mounted on the inner wall of the reflective cup 5. The light-transmitting isolation member 3 and the reflective cup 5 form an isolation space for isolating the LED chip 2, and the packaging glue 4 is filled in the reflective cup 5 and is located outside the light-transmitting isolation member 3.

[0050] It is understood that in this embodiment, the light-transmitting spacer 3 is primarily a sheet-like structure. While it cannot be independently mounted on the substrate 1 to isolate the LED chip 2, its structure is simpler. By forming an isolation space on the inner wall of the reflector cup 5, the LED chip 2 is isolated inside. This also prevents the encapsulation adhesive 4 from pulling on the LED chip 2 due to thermal expansion when the LED device and other components are packaged together on the circuit board for reflow soldering. Similarly, the materials and fixing methods of the sheet-like light-transmitting spacer 3 can be understood and implemented with reference to the aforementioned embodiments and will not be further described here.

[0051] It is understandable that the light-transmitting spacer 3 can be directly fixed on the inclined inner wall of the reflective cup 5 by means of glue or silicone, or a corresponding structural design can be made on the inner wall of the reflective cup 5. Figure 7 As shown, Figure 7 This is a seventh structural diagram of the LED device provided in this embodiment. In this embodiment, a support structure 51 is provided on the inner wall of the reflective cup 5 , and the support structure 51 is used to fix and support the edge of the light-transmitting isolation member 3 .

[0052] In this embodiment, if Figure 7 As shown, support structure 51 is used as an example for the support plane. It is understood that since reflector cup 5 is a dam structure disposed around LED chip 2, support structure 51 is also disposed around LED chip 2 to facilitate the surrounding and fixed arrangement of light-transmitting spacer 3 and prevent encapsulation adhesive 4 from leaking into the isolation space inside light-transmitting spacer 3. Furthermore, support structure 51 can also be a simple variation of other structures, such as protrusions or grooves. These are not further detailed here, and those skilled in the art can simply adjust them according to actual needs.

[0053] like Figure 8 As shown, Figure 8This is the eighth structural schematic diagram of the LED device provided in this embodiment. In this embodiment, the light-transmitting isolation member 3 bulges from the side close to the LED chip 2 to the side close to the packaging glue 4. The bulge can be formed into an arc shape, a sphere or a spherical shape or other curved shapes, which can make the light emitted by the LED chip 2 be perpendicular to the light-transmitting isolation member 3 and reduce the refraction of light. Those skilled in the art can understand and implement more specific situations in combination with the above description, which will not be further described here.

[0054] The LED device provided in this embodiment completely isolates the flip-chip LED chip 2 from the packaging glue 4 by providing a transparent isolation member 3, thereby preventing the solder paste at the welding point of the flip-chip LED chip 2 from being pulled by the thermal expansion force generated by the packaging glue 4 when it melts for the second time at high temperature. The solder paste at the welding point of the flip-chip LED chip 2 can be smoothly remelted and connected to the solder pad under high-temperature reflow without causing chip cold soldering or desoldering and dead light. In addition, the subsequent assembly of the integrated lamp-driver display module can select a temperature that is compatible with the tin plating soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp-driver display module.

[0055] Example 3

[0056] See also Figure 9 , is a structural schematic diagram of an LED lamp board provided in this embodiment. The LED lamp board provided in this embodiment includes a circuit board 10, a driver chip 20 and the LED device 30 described in the present invention. A circuit route (not shown) is preset on the circuit board 10. The driver chip 20 and the LED device 30 are arranged on the circuit board 10 and are electrically connected through the circuit route.

[0057] It is understandable that the number of driver chips 20 and LED devices 30 on the LED lamp board can be adjusted according to actual needs, and this is only a simple illustration.

[0058] In this embodiment, the LED chip is flip-chip mounted on the substrate via a first solder, and the driver chip is mounted on the circuit board via a second solder, wherein the melting point of the second solder is higher than that of the first solder.

[0059] Specifically, the first solder in this embodiment can be a conventional low-melting-point solder paste such as tin paste or gold-based material solder paste or silver-based material solder paste, and the corresponding second solder can be tin, silver or other solders with relatively higher melting points. Those skilled in the art can select and set it according to actual needs. Generally speaking, due to the difference in packaging process between LED chips and electronic components, the melting point of the first solder for packaging LED chips will be lower than the melting point of the second solder for packaging components such as lamp beads and driver chips. The specific selection of solder will not be further described here.

[0060] For example, in a specific embodiment, solder paste is used for flip-chip LED chip welding in the LED device, and tin plating is used when the LED device and components such as the driver IC are packaged together on the PCB. However, the melting point of the solder paste is lower than the melting point of tin plating. For example, the melting point of the solder paste for packaging the LED chip in the LED device is generally 227°C, and the melting point of tin plating for components such as the driver IC is above 230°C. When packaging the LED device and components such as the driver IC together on the circuit board, it is necessary to ensure that the LED device and components such as the driver IC are well soldered. The furnace temperature needs to exceed 230°C, which will cause secondary melting of the solder paste at the LED chip packaging welding point in the LED device. At the same time, due to the high temperature, the packaging glue on the outside of the LED chip in the LED device will expand due to heat, which will exert an upward pulling force on the LED chip, causing a cold solder joint at the junction of the LED chip and the solder paste, resulting in a dead chip lamp, affecting the quality of the LED device, and producing defective products, which affects the rework of the LED lamp board. In addition, even if the LED chip package and other component packages of the LED device use the same solder, there may be a situation where the solder at the welding point of the LED chip in the LED device undergoes secondary melting and is expanded and pulled by the packaging glue when the LED device and other components are packaged together on the circuit board.

[0061] Therefore, the LED device included in the LED lamp board provided in this embodiment completely isolates the flip-chip LED chip from the packaging glue by setting a transparent isolation piece, thereby avoiding the solder paste at the welding point of the flip-chip LED chip from being pulled by the thermal expansion force generated by the packaging glue when it melts for the second time under high temperature. The solder paste at the welding point of the flip-chip LED chip under high-temperature reflow can be smoothly remelted and connected to the solder pad without the chip being cold-soldered or desoldering and dead. This also allows the lamp board to use a temperature that is compatible with the tin plating soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED lamp board.

[0062] It can be understood that soldering the driver chip 20 and the LED device 30 to the circuit board 10 together is a step of the conventional SMT patch process (Surface Mounted Technology) in this field, which will not be elaborated here. The main point is that the display module in this embodiment adopts the LED device 30 in the embodiment of the present invention, so that when the display module patch package is reflow soldered, the LED device 30 can completely isolate the flip-chip LED chip from the packaging glue by setting a transparent isolation member, thereby avoiding the solder paste at the flip-chip LED chip welding point being pulled by the thermal expansion force generated by the packaging glue during the secondary melting at high temperature. The solder paste at the flip-chip LED chip welding point under high-temperature reflow can be smoothly remelted and connected to the solder pad without the chip being cold-soldered or desoldering and dead light. It can also enable the display module to use a temperature compatible with the tin plating soldering of components such as the driver chip and connector during reflow soldering, and ultimately achieve high reliability of the lamp-driven integrated display module.

[0063] For the contents not elaborated in detail in this embodiment, those skilled in the art may refer to the aforementioned embodiments for understanding and implementation, and no further description is given here.

[0064] Example 4

[0065] See also Figure 10 , is a flowchart of a method for manufacturing an LED device provided in this embodiment. The present invention provides a method for manufacturing an LED device, comprising:

[0066] Step S1, flip-chipping the LED chip onto the substrate and performing die bonding;

[0067] Step S2, fixing the light-transmitting spacer on the substrate or the inner wall of the reflective cup, with the LED chip located inside the light-transmitting spacer, so that the light-transmitting spacer forms an isolation for the LED chip;

[0068] Step S3, providing packaging glue on the outside of the light-transmitting isolation member, baking and curing the packaging glue to obtain an LED device.

[0069] It can be understood that in step S1, the solder paste and the flip-chip LED chip can be solidified by using a tinning or printing process, and then passed through a reflow oven to complete the solidification. For more specific details of the process, those skilled in the art can make simple adjustments based on the existing technology, which will not be further elaborated here.

[0070] It can be understood that step S2 in this embodiment includes two situations. The first situation is that the light-transmitting isolation member is fixedly set on the substrate. Regardless of whether the LED device package includes a reflective cup, the light-transmitting isolation member adopts the structural form of an isolation cover, thereby covering and isolating the LED chip. For details, please refer to the description in the aforementioned embodiment 1 for understanding; the second situation is that the light-transmitting isolation member is fixedly set on the inner wall of the reflective cup. At this time, the LED device is required to have a reflective cup structure, and the light-transmitting isolation member is a sheet structure type. The light-transmitting isolation member, the reflective cup and the substrate form an isolation space for isolating the LED chip. For details, please refer to the description in the aforementioned embodiment 2 for understanding, and no repeated description is given here.

[0071] The LED device manufactured by the LED device manufacturing method provided in this embodiment completely isolates the flip-chip LED chip from the packaging glue by setting a transparent isolation piece, thereby preventing the solder paste at the welding point of the flip-chip LED chip from being pulled by the thermal expansion force generated by the packaging glue when it melts for the second time at high temperature. The solder paste at the welding point of the flip-chip LED chip can be smoothly remelted and connected to the solder pad under high-temperature reflow without causing chip cold soldering or desoldering and dead light. In addition, the subsequent assembly of the integrated lamp-driver display module can select a temperature that is compatible with the tin plating soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp-driver display module.

[0072] Although the present invention has been described in detail above using general descriptions and specific embodiments, it will be apparent to those skilled in the art that modifications and improvements may be made thereto. Therefore, such modifications and improvements, without departing from the spirit of the present invention, are intended to be within the scope of protection claimed herein.

Claims

1. An LED device, characterized in that: The invention comprises a substrate, an LED chip, a light-transmitting spacer and a packaging adhesive. The LED chip is flip-chip arranged on the substrate, the light-transmitting spacer is arranged on the outside of the LED chip, and the packaging adhesive is covered on the outside of the light-transmitting spacer to isolate the LED chip from the packaging adhesive.

2. The LED device according to claim 1, wherein The light-transmitting isolation member is an isolation cover, which is arranged on the substrate and surrounds the outer side of the LED chip.

3. The LED device according to claim 2, characterized in that A mounting groove is provided on the substrate, and the bottom edge of the light-transmitting isolation member is fixedly arranged in the mounting groove.

4. The LED device according to claim 2, wherein: The LED device further includes a reflective cup, which is arranged on the substrate and surrounds the outside of the light-transmitting isolation member. The packaging glue is filled in the reflective cup and is located outside the light-transmitting isolation member.

5. The LED device according to claim 2, wherein: The light-transmitting isolation piece is in the shape of a spherical shell, a quasi-spherical shell or a square shell structure, or a combination of these.

6. The LED device according to claim 1, wherein The light-transmitting isolation member is an isolation sheet, and the LED device also includes a reflective cup. The reflective cup is arranged on the substrate, and the light-transmitting isolation member is mounted on the inner wall of the reflective cup. The light-transmitting isolation member and the reflective cup form an isolation space for isolating the LED chip, and the packaging glue is filled in the reflective cup and is located outside the light-transmitting isolation member.

7. The LED device according to claim 6, characterized in that The inner wall of the reflective cup is provided with a supporting structure, and the supporting structure is used to fix and support the edge of the light-transmitting isolation member.

8. The LED device according to claim 6, characterized in that The light-transmitting isolation member bulges from a side close to the LED chip to a side close to the packaging adhesive.

9. An LED light board, characterized in that: The invention comprises a circuit board, a driver chip and the LED device according to any one of claims 1 to 8, wherein a circuit path is preset on the circuit board, and the driver chip and the LED device are arranged on the circuit board and are electrically connected through the circuit path.

10. The LED light board according to claim 9, characterized in that: The LED chip is flip-chip mounted on the substrate via a first solder, and the driver chip is mounted on the circuit board via a second solder, wherein the melting point of the second solder is higher than that of the first solder.

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