Circuit board finished product sand blasting line and processing method

Abstract

The invention discloses a circuit board finished product sand blasting line and a processing method. The circuit board finished product sand blasting line comprises a feeding area, a sand blasting device, a multi-stage washing device, a drying device, a cooling area and a discharging area which are sequentially arranged in the conveying direction. Wherein the multi-stage water washing device innovatively combines six cleaning modes of inclined spraying, circulating water washing, pressurized water washing, high-pressure water washing, ultrasonic cleaning and deionized water rinsing to form a progressive treatment system, and various pollutants can be effectively removed; the drying device adopts a three-stage synergistic drying mode of suction drying, strong wind blow-drying and hot wind drying, so that the drying quality is ensured, and the energy efficiency is improved. The invention further provides a matched processing method, and the technical problems of dispersed procedures, incomplete cleaning and the like of the traditional process are solved by optimizing the procedure flow and parameter control. The technical scheme has the advantages of being high in automation degree, good in cleaning effect, high in drying efficiency and the like, and the quality stability and the production efficiency of circuit board surface treatment are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of circuit board production, and in particular to a sandblasting line and a processing method for a finished circuit board. Background Art

[0002] In the manufacturing process of circuit boards, sandblasting of finished products is a key process to improve the cleanliness of copper or gold surfaces, but traditional sandblasting equipment generally has problems such as low degree of automation, incomplete cleaning, and high energy consumption. In the existing technology, sandblasting and cleaning processes are usually completed by independent equipment, resulting in poor process connection and low production efficiency, and the cleaning process mostly adopts a single water washing method, which makes it difficult to completely remove the micron-sized particles and pollutants remaining from sandblasting. In addition, traditional drying methods mostly rely on natural drying or simple hot air circulation, which have defects such as uneven temperature, high energy consumption, and low drying efficiency, affecting the production yield and consistency of circuit boards. Although some improvement schemes attempt to integrate sandblasting and cleaning functions, they still lack a systematic multi-stage water washing design and an efficient and energy-saving drying system, which cannot meet the high-precision and high-reliability processing requirements of modern circuit boards. Therefore, there is an urgent need for an automated production line and processing method that integrates sandblasting, multi-stage water washing, and efficient drying to solve the technical problems of scattered processes, incomplete cleaning, and excessive energy consumption in the existing technology. Summary of the Invention

[0003] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, the present invention proposes a sandblasting line for finished circuit boards. By integrating sandblasting, multi-stage water washing, and multi-stage drying functions, this line automates the entire circuit board surface treatment process, offering the advantages of increased automation, enhanced cleaning effectiveness, and improved drying efficiency.

[0004] The present invention also provides a processing method using the above-mentioned circuit board finished product sandblasting line.

[0005] According to a first aspect of the present invention, a sandblasting line for finished circuit boards comprises an automatic conveying mechanism for continuously conveying circuit boards, and is sequentially provided along the conveying direction of the automatic conveying mechanism with: a feeding area for placing circuit boards to be processed; a sandblasting device for sandblasting the surface of the circuit boards; a multi-stage water washing device, comprising an inclined water washing mechanism, a circulating water washing mechanism, a pressurized water washing mechanism, a high-pressure water washing mechanism, an ultrasonic water washing mechanism, and a deionized water rinsing mechanism. The inclined water washing mechanism uses an inclined spraying method to wash away residual sand particles on the surface of the circuit boards. The circulating water washing mechanism uses a circulating water flow to perform multi-stage cleaning on the circuit boards. The pressurized water washing mechanism uses a pressurized water flow to remove residues. The high-pressure water washing mechanism uses high-pressure water flow to further remove residues, the ultrasonic water washing mechanism uses ultrasonic vibration to remove fine impurities, and the deionized water rinsing mechanism uses deionized water to remove ionic pollutants from the circuit board; the drying device includes a drying mechanism, a strong wind drying mechanism and a hot air drying mechanism. The drying mechanism includes a sponge roller that absorbs moisture from the surface of the circuit board. The strong wind drying mechanism is provided with a high-pressure fan for drying the circuit board. The hot air drying mechanism includes a drying channel. The drying channel is provided with a hot air circulation system that thoroughly dries the circuit board through hot air circulation; the cooling area includes a cooling channel. The cooling channel is provided with an air cooler for cooling the circuit board; the discharging area is used to take out the processed circuit board.

[0006] A sandblasting line for finished circuit boards according to an embodiment of the present invention has at least the following beneficial effects: By integrating sandblasting, multi-stage water washing, and multi-stage drying functions, the sandblasting line achieves full automation of the circuit board surface treatment process. This technical solution overcomes the technical challenges of fragmented processes, incomplete cleaning, and high energy consumption in traditional processes. An automatic conveying mechanism ensures seamless integration between processes, significantly improving production efficiency. The multi-stage water washing system combines various cleaning methods, including inclined spraying, circulating water washing, pressurized water washing, high-pressure water washing, ultrasonic cleaning, and deionized water rinsing, to form a progressive treatment system that effectively removes various forms of contaminants and ensures that the circuit board surface meets precision cleaning requirements. The drying system utilizes a three-stage drying strategy of suction drying, forced air drying, and hot air drying, ensuring drying quality while reducing overall energy consumption through step-by-step processing. The provision of a cooling zone prevents board surface deformation caused by thermal stress, thereby increasing product qualification rates. The overall solution features a rational layout and seamless integration of various processes, significantly improving production efficiency and product consistency while reducing manual intervention and energy consumption, resulting in significant economic and environmental benefits.

[0007] According to some embodiments of the present invention, the inclined water washing mechanism is provided with two including a first inclined water washing mechanism and a second inclined water washing mechanism, the pressurized water washing mechanism is provided with three including a first pressurized water washing mechanism, a second pressurized water washing mechanism and a third pressurized water washing mechanism, the circulating water washing mechanism is provided with three including a first circulating water washing mechanism, a second circulating water washing mechanism and a third circulating water washing mechanism, and the order of the multi-stage water washing mechanism is the first inclined water washing mechanism, the second inclined water washing mechanism, the first circulating water washing mechanism, the first pressurized water washing mechanism, the ultrasonic water washing mechanism, the second circulating water washing mechanism, the third circulating water washing mechanism, the second pressurized water washing mechanism, the high-pressure water washing mechanism, the third pressurized water washing mechanism and the deionized water rinsing mechanism.

[0008] What is beneficial is that by setting up two inclined water washing mechanisms, three pressurized water washing mechanisms and three circulating water washing mechanisms and arranging them in a specific order, an optimized cleaning process is formed, which can remove pollutants with different adhesion strengths step by step, significantly improving the cleaning effect.

[0009] According to some embodiments of the present invention, the first inclined water washing mechanism and the second inclined water washing mechanism both include a first drainage trough located below the automatic conveying mechanism and an inclined spray pipe with an adjustable spray angle located above the automatic conveying mechanism. The inclined spray pipe flushes residual sand particles on the surface of the circuit board through an inclined spraying method.

[0010] What is beneficial is that the inclined water washing mechanism adopts an adjustable angle spray pipe design, which can adjust the optimal spray angle according to the surface structure of the circuit board, ensuring that the water flow fully covers the board surface, improving cleaning efficiency and quality.

[0011] According to some embodiments of the present invention, the first pressurized water washing mechanism, the second pressurized water washing mechanism, the high-pressure water washing mechanism and the third pressurized water washing mechanism all include a second drainage trough located below the automatic conveying mechanism, the first pressurized water washing mechanism, the second pressurized water washing mechanism and the third pressurized water washing also include a pressurized spray pipe located above the automatic conveying mechanism, and the high-pressure water washing mechanism also includes a high-pressure spray pipe located above the automatic conveying mechanism.

[0012] What is beneficial is that the combined design of the pressurized water washing mechanism and the high-pressure water washing mechanism forms a pressure gradient cleaning system, which can not only effectively remove stubborn pollutants, but also avoid the damage to the circuit board that may be caused by a single high pressure.

[0013] According to some embodiments of the present invention, the first circulating water washing mechanism, the second circulating water washing mechanism and the third circulating water washing mechanism all include a circulating water washing tank, each circulating water washing tank is provided with a water washing spray pipe, and the circulating water washing tank body is provided with a filtering and recovery system, which includes a coarse filter, a fine filter and a circulating pump connected in sequence, and the circulating pump is connected to the water washing spray pipe to form a water circulation.

[0014] What is beneficial is that the circulating water washing mechanism is equipped with a filtration and recovery system, which realizes the recycling of water resources and greatly reduces water consumption. At the same time, the stability of the cleaning water quality is ensured through multi-stage filtration.

[0015] According to some embodiments of the present invention, the ultrasonic water washing mechanism includes an ultrasonic water washing tank, which is provided with an ultrasonic generator, a transducer and a temperature control system.

[0016] The good thing is that the ultrasonic water washing mechanism can deeply remove micron-sized particles in the pores and gaps of the circuit board through the cavitation effect, solving the problem of microscopic pollutants that are difficult to handle with traditional cleaning methods.

[0017] According to some embodiments of the present invention, the deionized water rinsing mechanism includes a deionized water washing tank connected to a deionized water supply system.

[0018] The benefits are: the deionized water rinsing mechanism effectively removes ionic pollutants on the surface of the circuit board, avoids problems such as electrochemical migration that may occur in subsequent processes, and improves product reliability.

[0019] According to some embodiments of the present invention, the automatic conveying mechanism includes a plurality of conveying rollers arranged in parallel, a transmission chain for driving the conveying rollers to rotate, and a conveying motor for driving the transmission chain to move.

[0020] The benefit is that the automatic conveying mechanism adopts a combined design of conveying rollers and transmission chains, which ensures the smooth conveying of circuit boards between various processes and improves the automation level and operation continuity of the production line.

[0021] According to some embodiments of the present invention, a sandblasting apparatus includes a sandblasting machine, an abrasive recovery system, and an air pressure regulating mechanism.

[0022] The sandblasting device is equipped with an abrasive recovery system and an air pressure regulating mechanism, which realizes the efficient recycling of abrasives and the precise control of sandblasting pressure, ensuring the stability of surface treatment quality.

[0023] According to a method for sandblasting a finished circuit board according to an embodiment of the second aspect of the present invention, the operation of the above-mentioned sandblasting line for the finished circuit board comprises the following steps: (1) feeding step: feeding the circuit board to be processed into the automatic conveying mechanism through the feeding area; (2) sandblasting step: sandblasting the surface of the circuit board by a sandblasting device, the sandblasting pressure is controlled at 0.3-0.6 MPa, and the sand particle size is 80-120 mesh; (3) the first inclined water washing step: the circuit board is preliminarily rinsed by a first inclined water washing mechanism, the spray angle is adjusted to 30°-45°, and the water pressure is 0.2-0.4 MPa; (4) the second inclined water washing step: the second inclined water washing mechanism is used for secondary washing, the spray angle is adjusted to 15°-30°, and the water pressure is 0.3-0.5 MPa; (5) the first circulating water washing step: the circuit board is preliminarily circulated and washed by the first circulating water washing mechanism, the water temperature is controlled at 35-45°C, and the circulating flow rate is 3-5 ; (6) First pressurized water washing step: The first pressurized water washing mechanism is used for the first pressurized cleaning, and the water pressure is 0.5-0.8MPa; (7) Ultrasonic water washing step: Deep cleaning is performed by the ultrasonic water washing mechanism, the ultrasonic frequency is 40-68kHz, and the water temperature is controlled at 45-55°C; (8) Second circulation water washing step: Second circulation cleaning is performed by the second circulation water washing mechanism, the water temperature is: 40-50°C, and the circulation flow rate is 4-6 (9) The third cycle water washing step: the final cycle washing is carried out through the third cycle water washing mechanism, the water temperature is controlled at 30-40 ° C, the circulation flow rate is 2-4 ; (10) Second pressure water washing step: The second pressure water washing mechanism is used for the second pressure washing, and the water pressure is 0.6-0.9MPa; (11) High pressure water washing step: The high pressure water washing mechanism is used for ultra-high pressure washing, and the water pressure is 1.0-1.5MPa; (12) Third pressure water washing step: The third pressure water washing mechanism is used for the third pressure washing, and the water pressure is 0.4-0.7MPa; (13) Deionized water rinsing step: The deionized water rinsing mechanism is used for the final Final rinsing; (14) Drying step: Most of the moisture on the surface of the circuit board is absorbed by the sponge roller of the drying mechanism; (15) Strong wind drying step: Use a high-pressure blower for preliminary drying, with a wind speed of 15-25m / s; (16) Hot air drying step: Final drying is carried out by a hot air drying mechanism, with a hot air temperature of 60-80℃; (17) Cooling step: Cool the circuit board to room temperature by the air cooler in the cooling zone; (18) Discharging step: Take out the processed circuit board through the discharging zone.

[0024] A method for sandblasting a finished circuit board according to an embodiment of the present invention has at least the following beneficial effects: the technical solution realizes the automated operation of the entire production line by optimizing the process flow, which has significant advantages over the traditional segmented processing method. Reasonable control of parameters in the sandblasting stage ensures the surface treatment effect, the two inclined water washings adopt a decreasing angle design to treat the surface and edge areas respectively, the three circulating water washings are combined with a multi-stage filtration system to improve the utilization rate of water resources, the pressurized water washing forms a pressure gradient to effectively remove various pollutants, the ultrasonic cleaning is specially used to treat micron-sized particles, the deionized water rinse removes ionic contamination, the drying process adopts a three-stage collaborative method to improve efficiency, and finally the thermal stress is eliminated by cooling. This integrated design solves the problems of scattered traditional process steps and incomplete cleaning. It significantly improves production efficiency and process stability through multi-mode collaborative cleaning methods and systematic parameter control.

[0025] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of an embodiment of the first aspect of the present invention; Figure 2 for Figure 1 Schematic diagram of the middle feeding area and sandblasting device; Figure 3 for Figure 1 Schematic diagram of the middle inclined water washing mechanism; Figure 4 for Figure 1 Schematic diagram of the medium pressure water washing mechanism; Figure 5 for Figure 1 Schematic diagram of medium and high pressure water washing mechanism; Figure 6 for Figure 1 Schematic diagram of the medium-circulation water washing mechanism; Figure 7 for Figure 1 Schematic diagram of ultrasonic water washing mechanism; Figure 8 for Figure 1 Schematic diagram of deionized water rinsing mechanism; Figure 9 for Figure 1Schematic diagram of the medium suction drying mechanism and the strong wind drying mechanism; Figure 10 for Figure 1 Schematic diagram of the hot air drying mechanism, cooling zone and discharge zone; Figure 11 Schematic diagram of an embodiment of the second aspect of the present invention.

[0028] Reference numerals: automatic conveying mechanism 100, feeding area 110, sandblasting device 120, high-pressure water washing mechanism 130, ultrasonic water washing mechanism 140, deionized water rinsing mechanism 150, drying mechanism 160, strong wind drying mechanism 170, hot air drying mechanism 180, sponge roller 190, high-pressure fan 200, drying channel 210, hot air circulation system 220, cooling area 230, cooling channel 240, discharging area 250, first inclined water washing mechanism 260, second inclined water washing mechanism 270, first pressurized water washing mechanism 280, second pressurized water washing mechanism 290, third pressurized water washing mechanism 300, first circulating water washing Mechanism 310, second circulating water washing mechanism 320, third circulating water washing mechanism 330, first drainage trough 340, inclined spray pipe 350, second drainage trough 360, pressurized spray pipe 370, high-pressure spray pipe 380, circulating water washing tank 390, water washing spray pipe 400, coarse filter 410, fine filter 420, circulating pump 430, ultrasonic water washing tank 440, ultrasonic generator 450, transducer 460, temperature control system 470, deionized water washing tank 480, deionized water supply system 490, conveyor roller 500, transmission chain 510, sandblasting machine 520, sand recovery system 530, air pressure regulating mechanism 540. DETAILED DESCRIPTION

[0029] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. If a first or second is mentioned, this is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0032] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted, connected, and connected" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0033] In the existing technology, sandblasting of circuit boards generally uses independent equipment to complete the sandblasting and cleaning processes, resulting in problems such as poor process connection in the production process and large equipment footprint. Traditional cleaning processes mostly rely on a single water washing method, which cannot effectively remove the micron-sized particles left by sandblasting, and pollutants are easily left on the surface of the cleaned circuit board. The drying process mostly uses natural drying or simple hot air circulation, which has defects such as uneven temperature distribution and long drying cycle, affecting product yield and production efficiency. A circuit board manufacturing workshop once had insufficient adhesion of the metal coating due to incomplete cleaning, resulting in the scrapping of batches of products, exposing the technical bottleneck of traditional processes.

[0034] In order to solve the above problems, in order to address the pain point of scattered processes, it is considered to integrate sandblasting and post-processing processes into a continuous production line. Faced with the problem of incomplete cleaning, attempts are made to combine different cleaning mechanisms to form a multi-stage treatment system. In order to address the problem of low drying efficiency, a phased drying strategy is explored. By analyzing the physical properties of sand residues, it is found that large particle residues are suitable for mechanical scouring, micron-sized impurities require physical vibration peeling, and ionic pollutants require chemical neutralization. Based on this, it is proposed to first remove surface sand particles through inclined spraying, then use circulating water washing to improve water resource utilization, combine pressurized water washing to enhance the scouring force, introduce ultrasonic vibration to treat micron-sized impurities, and finally use deionized water to remove ionic pollutants in a progressive cleaning solution. In the drying process, a three-stage collaborative drying mode of physical adsorption, airflow blowing and hot air circulation is designed.

[0035] Therefore, the present application proposes a circuit board finished product sandblasting line including an automatic conveying mechanism 100, such as Figure 1As shown, a feeding area 110, a sandblasting device 120, a multi-stage water washing device, a drying device, a cooling area 230, and a discharging area 250 are sequentially arranged along the conveying direction. The multi-stage water washing device includes an inclined water washing mechanism, a circulating water washing mechanism, a pressurized water washing mechanism, a high-pressure water washing mechanism 130, an ultrasonic water washing mechanism 140, and a deionized water rinsing mechanism 150. The drying device includes a suction drying mechanism 160, a strong air drying mechanism 170, and a hot air drying mechanism 180. The suction drying mechanism 160 is equipped with a sponge roller 190, the strong air drying mechanism 170 is equipped with a high-pressure blower 200, and the hot air drying mechanism 180 is equipped with a drying channel 210 with a hot air circulation system 220. The cooling area 230 is equipped with a cooling channel 240 with an air cooler. It should be noted that an air curtain should be installed between the drying channel and the cooling channel 240 to prevent heat transfer from affecting the drying and cooling effects.

[0036] Among them, the automatic conveying mechanism 100 refers to a mechanical system for realizing continuous transmission of circuit boards, and a combined structure of a conveying roller 500 and a transmission chain 510 can be used to ensure the continuous connection of each process. The inclined water washing mechanism refers to a flushing device with an inclined spray angle, which enhances the coverage and cleaning of special-shaped structures on the surface of the circuit board by adjusting the angle of the spray pipe. The circulating water washing mechanism refers to a water washing device equipped with a filtration and recovery system, which uses a coarse filter 410 to intercept large particles of impurities, a fine filter 420 to remove fine particles, and a circulating pump 430 to achieve the reuse of water resources. The pressurized water washing mechanism refers to a cleaning device that uses a booster pump to generate a high-pressure water flow, and removes firmly attached residues by increasing the impact force of the water flow. The ultrasonic water washing mechanism 140 refers to a cleaning tank equipped with an ultrasonic generator 450, which removes micron-level pollutants through the cavitation effect. The deionized water rinsing mechanism 150 refers to a rinsing device connected to the deionized water supply system 490, which removes charged particles in the water through ion exchange resin. As Figure 9 As shown, the drying mechanism 160 is a dehydrating device equipped with a sponge roller 190, which uses porous materials to physically absorb surface moisture. The strong wind drying mechanism 170 is an airflow drying device equipped with a high-pressure blower 200, which removes the surface water film through high-speed airflow. Figure 10 As shown, the hot air drying mechanism 180 refers to a drying channel 210 provided with a hot air circulation system 220, which achieves deep drying through uniform heat field distribution.

[0037] Specifically, after the circuit board enters the automatic conveying mechanism 100 through the feeding area 110, it first undergoes surface roughening treatment in the sandblasting device 120. It then enters the multi-stage water washing stage: inclined spray water flows at a specific angle to rinse the board surface to remove most of the remaining sand particles; circulating water washing achieves water resource recycling through multi-stage filtration; pressurized water washing uses high-pressure water flow to impact stubborn stains; ultrasonic vibration generates microbubbles to remove fine impurities; and finally deionized water is used to eliminate ion contamination. The cleaned circuit board enters the drying stage: Figure 9 and Figure 10As shown, sponge roller 190 first absorbs surface moisture, high-pressure blower 200 removes any remaining water film, and hot air circulation system 220 provides uniform heating and thorough drying. Cooling zone 230 uses forced air cooling to rapidly cool the circuit boards, preventing thermal stress damage. The entire process is completed continuously in a closed production line, and process parameters can be adjusted to meet specific product requirements.

[0038] Compared with existing technologies, the traditional process of separating sandblasting and cleaning equipment results in multiple loading and unloading operations. This solution achieves seamless process connection through a continuous conveying mechanism. Existing single-stage water washing is difficult to deal with complex pollutants. This solution forms a progressive treatment system through a combination of six cleaning mechanisms. Traditional drying methods have high energy consumption and poor results. This solution adopts a three-stage drying strategy. Physical adsorption reduces subsequent heat energy consumption, air purge increases drying speed, and hot air circulation ensures drying uniformity. The existing technology lacks a cooling link, which can easily lead to thermal deformation. This solution adds forced air cooling to ensure product dimensional stability.

[0039] Through the above technical solution, this application realizes the continuous production of sandblasting, cleaning and drying processes, effectively removes pollutants in different forms, reduces water consumption, improves drying efficiency and reduces energy consumption. The multi-stage water washing device ensures that the surface of the circuit board meets the precision cleaning requirements by combining mechanical flushing, physical vibration and chemical treatment. The three-stage drying strategy reduces overall energy consumption through step-by-step processing while ensuring the drying quality. The introduction of the cooling link avoids the deformation of the board surface caused by thermal stress and improves the product qualification rate. The overall solution solves the technical problems of scattered traditional process steps, incomplete cleaning and high energy consumption.

[0040] The present application further proposes a multi-stage water washing system including two inclined water washing mechanisms, three pressurized water washing mechanisms, and three circulating water washing mechanisms, wherein the cleaning process is arranged in the order of the first inclined water washing mechanism 260, the second inclined water washing mechanism 270, the first circulating water washing mechanism 310, the first pressurized water washing mechanism 280, the ultrasonic water washing mechanism 140, the second circulating water washing mechanism 320, the third circulating water washing mechanism 330, the second pressurized water washing mechanism 290, the high-pressure water washing mechanism 130, the third pressurized water washing mechanism 300, and the deionized water rinsing mechanism 150.

[0041] The inclined water washing mechanism uses different spray angles to flush residual sand from the circuit board surface. This can be achieved by combining an adjustable-angle spray pipe with a drain trough, enhancing the sand removal effect by changing the direction of the water flow. The pressurized water washing mechanism uses water at varying pressure levels to remove residue. This can be achieved by combining a multi-stage booster pump with a spray pipe, increasing the impact coverage through a pressure gradient. The circulating water washing mechanism is a multi-stage cleaning device equipped with a filtration and recovery system. This can be achieved by combining a coarse filter 410, a fine filter 420, and a circulating pump 430. This mechanism maintains the cleanliness of the cleaning medium through water purification. The high-pressure water washing mechanism 130 uses ultra-high-pressure water flow. This can be achieved by combining a high-pressure pump with a specialized nozzle, removing stubborn contaminants with high-kinetic energy. The ultrasonic water washing mechanism 140 uses the cavitation effect to remove microscopic impurities. This can be achieved by combining an ultrasonic generator 450 with a temperature control system 470, breaking down attachments through high-frequency oscillations.

[0042] Specifically, two inclined water wash mechanisms utilize different spray angles to create complementary scouring. The first inclined water wash mechanism 260 sprays at a high angle to remove large sand particles, while the second inclined water wash mechanism 270 uses a lower angle to remove residual residue from crevices. Three circulating water wash mechanisms are installed before and after ultrasonic cleaning. A coarse filter 410 intercepts large impurities, a fine filter 420 removes micron-sized particles, and a circulating pump 430 maintains water cleanliness. The three pressurized water wash mechanisms create a pressure gradient with the high-pressure water wash mechanism 130. The first pressurized water wash mechanism 280 removes surface deposits at a moderate pressure, the second pressurized water wash mechanism 290 removes detached impurities after ultrasonic treatment, and the third pressurized water wash mechanism 300 eliminates residual water marks after high-pressure cleaning. The ultrasonic water wash mechanism 140 decomposes microscopic contaminants on the board surface through cavitation, and the deionized water rinse mechanism 150 finally removes residual ions. These mechanisms are arranged in a specific sequence, forming a progressive cleaning process: scouring, dissolution, stripping, and rinsing.

[0043] Compared with existing technologies, traditional sandblasting lines use only a single water washing process and lack a pressure gradient design, resulting in incomplete cleaning and repeated contamination. This solution effectively intercepts large particles of impurities at the initial cleaning stage through the combination of two inclined flushing and three circulation filtration cycles, avoiding subsequent equipment clogging. The alternating arrangement of three pressurized water washes and ultrasonic cleaning allows the physical impact and chemical cavitation effects to work synergistically to cover contaminants of different sizes. The design of gradually increasing the pressure from 0.5MPa to 1.5MPa and then decreasing it ensures the removal of stubborn dirt while preventing the high-pressure water flow from damaging the circuit board.

[0044] Through the above technical solution, this application achieves the phased removal of sand residues: inclined scouring to remove large surface particles, circulating filtration to maintain stable water quality, pressurized water flow to gradually increase impact force, ultrasonic treatment to break down microscopic attachments, and finally high-pressure water washing and deionized rinsing to ensure board surface cleanliness. This multi-stage coordinated cleaning system achieves a sand removal rate of over 99.8% while reducing water consumption by 40%, resolving the technical shortcomings of traditional cleaning processes, such as low cleaning efficiency and severe repetitive contamination.

[0045] like Figure 3 As shown, the present application further proposes that the first inclined water washing mechanism 260 and the second inclined water washing mechanism 270 both include a first drainage trough 340 located below the automatic conveying mechanism 100 and an inclined spray pipe 350 with an adjustable spray angle located above the automatic conveying mechanism 100. The inclined spray pipe 350 flushes the residual sand on the surface of the circuit board by an inclined spraying method.

[0046] The first drainage trough 340 is a trough structure located below the automatic conveying mechanism 100. Specifically, it can be implemented as a long stainless steel trough, which is used to receive and guide the wastewater generated during the cleaning process. The trough has an inclined bottom surface design that guides the wastewater to a centralized discharge port, preventing wastewater from stagnating in the trough.

[0047] The angled spray pipe 350 with adjustable spray angle is a tubular spray device installed above the automatic conveyor mechanism 100. Specifically, it can be implemented using a multi-section spray pipe with a rotary joint. By adjusting the angle between the spray pipe and the circuit board surface, a directional water flow is generated. Multiple fan-shaped nozzles are distributed on the surface of the spray pipe, forming a spray area that covers the entire width of the circuit board.

[0048] Specifically, when the circuit board passes through the inclined water washing mechanism, the inclined spray pipe 350 sprays water onto the surface of the circuit board at a non-vertical angle. The direction of the water flow impact forms an angle with the direction of travel of the circuit board, so that the sand particles are separated from the surface under the dual action of the scouring force and the inertial force. The first drainage trough 340 collects the flushed sewage in real time and quickly discharges it through the bottom diversion structure. The spray angle can be adaptively adjusted according to the thickness or surface structure of the circuit board. For example, the direction of the water flow impact is adjusted for the concave and convex areas of the surface to ensure that the sand particles at different positions are effectively peeled off. The upper and lower layout of the spray pipe and the drainage trough forms a continuous flushing and drainage cycle to avoid the secondary attachment of residual sewage.

[0049] Compared to existing technologies, traditional water washing systems often use fixed-angle vertical sprays, resulting in a single direction of water flow and inability to effectively clean the complex structures on the circuit board surface. Existing drainage structures are mostly flat troughs, which can easily cause wastewater to accumulate and contaminate subsequent cleaning areas. This solution uses an adjustable angled spray to create a multi-directional impact flow, combined with a diverting drainage trough for rapid waste removal, solving the problems of incomplete cleaning coverage and low drainage efficiency associated with traditional equipment.

[0050] Through the above-mentioned technical solution, this application can remove residual sand from different areas of the circuit board surface in a targeted manner, preventing sand from remaining during the cleaning process due to the single-direction impact of the water flow. The diversion drainage structure prevents the accumulation of wastewater in the cleaning area, reducing the risk of secondary sand adhesion. The adjustable spray angle adapts to various circuit board structures, improving the versatility and reliability of the cleaning process.

[0051] The present application further proposes that the first pressurized water washing mechanism 280, the second pressurized water washing mechanism 290, the high-pressure water washing mechanism 130 and the third pressurized water washing mechanism 300 all include a second drainage trough 360 located below the automatic conveying mechanism 100, such as Figure 4 As shown, the first pressurized water washing mechanism 280, the second pressurized water washing mechanism 290 and the third pressurized water washing mechanism 300 further include a pressurized spray pipe 370 located above the automatic conveying mechanism 100, as shown in FIG. Figure 5 As shown, the high-pressure water washing mechanism 130 further includes a high-pressure spray pipe 380 located above the automatic conveying mechanism 100 .

[0052] The second drain trough 360 is a wastewater collection structure located below the conveying mechanism. Specifically, it can be implemented using a stainless steel trough with an inclined bottom. Its function is to quickly divert cleaning wastewater containing sand particles to prevent internal contamination of the equipment caused by wastewater stagnation. The pressurized spray pipe 370 is a porous spray device installed above the conveying mechanism. Specifically, it can be implemented using a copper pipe with a pressure regulating valve. Its function is to flush the surface of the circuit board in stages using controllable water pressure. The high-pressure spray pipe 380 is a specialized spray structure with higher spray pressure. Specifically, it can be implemented using an alloy steel pipe with a booster pump. Its function is to apply high-intensity water flow to stubborn contaminants.

[0053] Specifically, after sandblasting, when the circuit board enters the multi-stage water wash phase, the pressurized water wash mechanism and the high-pressure water wash mechanism 130 form a coordinated cleaning system. When the circuit board enters the first pressurized water wash mechanism 280, the pressurized spray pipe 370 performs an initial flushing operation at a moderate water pressure. This impact forces sand and contaminants off the board surface and into the second drain trough 360 below. As the circuit board passes through the second and third pressurized water wash mechanisms 290 and 300, the water pressure in the pressurized spray pipe 370 gradually increases, creating a stepped cleaning intensity. This prevents damage from sudden high pressure and ensures that contaminants are removed layer by layer. When the circuit board reaches the high-pressure water wash mechanism 130, the high-pressure water flow from the high-pressure spray pipe 380 provides a final cleansing of any remaining particles. Meanwhile, the second drain trough 360 simultaneously collects wastewater containing micron-sized particles to prevent it from flowing back into the previous cleaning area. The spray pipes and drain troughs of each cleaning unit form a closed water channel, isolating cleaning areas with different pressure levels and eliminating cross-contamination.

[0054] Compared with existing technologies, traditional cleaning equipment typically uses a single drainage system, which causes wastewater from different cleaning stages to mix, affecting subsequent cleaning results. This solution, however, independently provides a second drainage trough 360 beneath each pressurized water washing unit, enabling classified collection and targeted discharge of wastewater, effectively preventing the repeated attachment of pollutants. Existing high-pressure cleaning processes often directly utilize a continuous high-pressure mode, which can easily damage the circuit board surface. This solution, through a combination of staged pressurized cleaning and independent high-pressure cleaning, ensures thorough cleaning while reducing equipment operation risks.

[0055] Through the above technical solution, this application achieves the graded removal of sandblasting residues. By combining staged pressurized cleaning with independent high-pressure impact, contaminants of different particle sizes are removed layer by layer. The independent configuration of the second drainage trough 360 effectively prevents secondary contamination caused by sewage backflow. The multi-stage pressure control mechanism improves cleaning efficiency while protecting the integrity of the circuit board surface, solving the technical problem of incomplete cleaning caused by inaccurate water pressure control and low drainage efficiency in traditional cleaning processes.

[0056] The present application further proposes that the first circulating water washing mechanism 310, the second circulating water washing mechanism 320 and the third circulating water washing mechanism 330 all include a circulating water washing tank 390, such as Figure 6 As shown, each circulating water washing tank 390 is provided with a water washing spray pipe 400, and the circulating water washing tank 390 is provided with a filtering recovery system. The filtering recovery system includes a coarse filter 410, a fine filter 420 and a circulating pump 430 connected in sequence. The circulating pump 430 is connected to the water washing spray pipe 400 to form a water circulation.

[0057] Among them, the circulating water washing tank 390 refers to a tank structure used to hold cleaning water and carry circuit boards for water washing. Specifically, it can be made of stainless steel or corrosion-resistant plastic material. Its function is to provide a stable water washing environment for multi-stage circulating cleaning. The water washing spray pipe 400 refers to a pipeline structure arranged inside the circulating water washing tank 390 for spraying cleaning water. Specifically, it can be arranged in an array of porous spray pipes to flush residues on the surface of the circuit board through a directional spray water flow. The coarse filter 410 refers to a primary filtration device installed at the water outlet of the circulating water washing tank 390. Specifically, a metal mesh screen with an aperture of 0.5-1.0 mm can be used to intercept large particles of impurities remaining from sandblasting. The fine filter 420 refers to a secondary filtration device arranged downstream of the coarse filter 410. Specifically, a filter element structure with a precision of 5-10 microns can be used to further remove micron-level pollutants. The circulation pump 430 refers to a power device connecting the filtration system and the water washing spray pipe 400. Specifically, a centrifugal pump or a plunger pump can be used to build up water pressure to transport the filtered clean water back to the spray pipe to form a closed loop.

[0058] Specifically, the circulating water washing tank 390 serves as the carrier of the cleaning process, and forms a directional flushing water flow covering the surface of the circuit board through the water washing spray pipe 400, thereby realizing the step-by-step stripping of residues. During the cleaning process, the wastewater containing impurities first passes through the coarse filter 410 to intercept large particles such as sand, and then passes through the fine filter 420 to deeply filter micron-level pollutants, and finally the circulating pump 430 re-injects the purified water flow into the spray pipe. This process forms a continuous water circulation system, which not only avoids the continuous drainage of traditional open water washing, but also ensures the stability of the cleaning water quality through multi-stage filtration. The hierarchical layout of the coarse filter 410 and the fine filter 420 can effectively prevent the filter device from being blocked. At the same time, the direct connection design of the circulating pump 430 and the water washing spray pipe 400 maintains the dynamic balance of water pressure, ensuring the consistency of the cleaning effect at each stage.

[0059] Compared to existing technologies, traditional circulating water washing systems typically use a single filter device or an open drainage design, resulting in low filtration efficiency and high water consumption. This solution, by installing a coarse filter 410 and a fine filter 420 in stages, improves impurity interception and extends the service life of the filter element. The closed-loop water circulation system completely eliminates the need for continuous water replenishment, significantly reducing water consumption.

[0060] Through the above technical solution, this application achieves the recycling of cleaning water resources, effectively reducing water consumption during the production process. At the same time, the multi-stage filtration system improves the efficiency of impurity removal and prevents residual secondary contamination of the circuit board surface. The linkage design of the circulation pump 430 and the spray pipe further ensures the stability of the water flow pressure, ensuring the operational consistency and cleaning effect of each circulating water washing stage.

[0061] like Figure 7As shown, the present application further proposes that the ultrasonic water washing mechanism 140 includes an ultrasonic water washing tank 440 , and the ultrasonic water washing tank 440 is provided with an ultrasonic generator 450 , a transducer 460 and a temperature control system 470 .

[0062] Among them, the ultrasonic water washing tank 440 refers to a container for containing cleaning liquid and circuit boards, which can be specifically realized by using a stainless steel tank body with an anti-corrosion coating to provide a stable liquid environment for ultrasonic action. Among them, the ultrasonic generator 450 refers to a device for generating high-frequency electrical signals, which can be specifically realized by using a piezoelectric ceramic oscillator combined with a power amplifier to drive the transducer 460 to generate mechanical vibrations. Among them, the transducer 460 refers to a component that converts electrical energy into mechanical vibrations, which can be specifically realized by using a nickel sheet stacked transducer 460 to form a cavitation effect in the cleaning liquid through high-frequency vibrations. Among them, the temperature control system 470 refers to a device for adjusting the temperature of the cleaning liquid, which can be specifically realized by using a thermocouple sensor and a heating tube to control the linkage to maintain the cleaning liquid in the optimal working temperature range.

[0063] Specifically, ultrasonic generator 450 generates a high-frequency electrical signal to drive transducer 460. Transducer 460 converts the electrical energy into high-frequency mechanical vibrations and transmits them to the cleaning fluid, forming cavitation bubbles within the liquid. The shock waves generated by the cavitation bubbles' collapse act on the circuit board surface, dislodging sand and contaminants trapped in micropores or crevices. Temperature control system 470 monitors the cleaning fluid temperature in real time, for example by adjusting the power of the heating tube to maintain a stable temperature between 45°C and 55°C, ensuring the cavitation effect remains within the optimal intensity range. This synergistic effect of ultrasonic energy and temperature control surpasses the cleaning limits of traditional physical scouring and resolves the problem of residual micron-sized particles.

[0064] Compared to existing technologies, traditional cleaning processes rely on high-pressure water jets, which are ineffective in removing contaminants embedded in the circuit board's microstructure. This solution, however, uses ultrasonic cavitation to directly target the contaminant attachment interface, combined with temperature control to optimize cleaning conditions, achieving targeted removal of micron-sized residues. While existing technologies lack a solution that combines ultrasonic cleaning with precise temperature control, this solution fills a gap in post-sandblasting cleaning.

[0065] Through the above technical solution, the present application achieves efficient removal of residual sand particles on the surface and in the pores of the circuit board, avoids secondary contamination or cleaning dead corners caused by traditional cleaning methods, and significantly improves the surface cleanliness and processing consistency of the circuit board after sandblasting. At the same time, temperature control is used to prevent damage to the circuit board material caused by overheating or overcooling, thereby ensuring product yield.

[0066] like Figure 8As shown, the present application further proposes that the deionized water rinsing mechanism 150 includes a deionized water washing tank 480 , and the deionized water washing tank 480 is connected to a deionized water supply system 490 .

[0067] Deionized water washing tank 480 is a container used to hold deionized water and perform rinsing operations. Specifically, it can be constructed of stainless steel with an internal anti-leakage sealing layer. The opening of the tank forms a seal with the conveying path of the automatic conveying mechanism 100 to prevent the ingress of external contaminants. Deionized water supply system 490 is a device for continuously providing high-purity deionized water. Specifically, it can be implemented by connecting a multi-stage ion exchange resin tower in series with a reverse osmosis membrane module. A conductivity sensor monitors water quality in real time and controls ion concentration.

[0068] Specifically, after completing the pre-cleaning process, the circuit boards enter the deionized water washing tank 480. The sealing structure between the tank and the conveying mechanism prevents external impurities from entering the rinsing environment. The deionized water supply system 490 injects the prepared deionized water into the tank through corrosion-resistant piping. As the water flows over the surface of the circuit boards, the low conductivity of the deionized water neutralizes and dissolves any remaining charged ion contaminants. During the rinsing process, the water level control system inside the tank maintains a constant liquid level to ensure that the circuit boards are completely submerged. The deionized water supply system 490 dynamically adjusts the regeneration cycle of the ion exchange resin based on conductivity monitoring data to ensure that the water quality continues to meet rinsing requirements.

[0069] Compared to existing technologies, traditional cleaning processes often use ordinary tap water or pure water for rinsing, which cannot effectively remove metal ions and chemical contaminants remaining on the circuit board surface after sandblasting. Open rinsing tanks are also prone to secondary contamination. This solution uses a sealed deionized water washing tank 480 and a closed-loop deionized water supply system 490 to achieve targeted removal of ionic contaminants while physically isolating the contamination source.

[0070] Through the above technical solution, this application solves the technical problem that the traditional cleaning process cannot remove ionic contaminants on the surface of the circuit board. By combining the chemical properties of deionized water with a closed rinsing environment, the influence of residual ions on the conductive properties of the circuit board is effectively eliminated, avoiding metal layer oxidation or short circuit caused by residual ions in subsequent processing.

[0071] Specifically, if Figure 2 As shown, the present application further proposes that the automatic conveying mechanism 100 includes a plurality of parallel arranged conveying rollers 500, a transmission chain 510 for driving the conveying rollers 500 to rotate, and a conveying motor for driving the transmission chain 510 to move (the conveying motor is not shown in the figure).

[0072] The conveyor rollers 500 are cylindrical rollers arranged parallel to the conveying direction and forming a continuous bearing surface. Specifically, these rollers can be coated with a non-slip coating and non-slip patterns. Multiple rollers collaboratively support the bottom surface of the circuit board, accommodating the smooth transport of circuit boards of varying sizes. The transmission chain 510 is a chain-type transmission component that connects the ends of the conveyor rollers 500 and transmits power. Specifically, this can be achieved by meshing a double-row roller chain with a sprocket. The linkage between the chain and the conveyor rollers 500 ensures synchronous rotation of all rollers. The conveyor motor is a drive device that provides power to the transmission chain 510. Specifically, this can be achieved by combining a variable-frequency speed-regulating motor with a reducer. The motor speed is adjusted to match the conveying rhythm of different processes.

[0073] Specifically, the conveyor rollers 500 are arranged in parallel to form a continuous load-bearing surface, ensuring uniform support for the circuit board during transport, preventing deviation or jamming caused by partial overhang. The transmission chain 510 meshes with the sprockets at the ends of each conveyor roller 500, and driven by the conveyor motor, drives all conveyor rollers 500 in synchronous rotation, eliminating stagnation or slippage of the circuit board caused by differences in roller speed. The conveyor motor controls the speed of the transmission chain 510 through variable frequency speed regulation, ensuring that the transfer time of the circuit board between processing stations precisely matches the processing cycle of sandblasting, washing, and drying, achieving seamless process transitions.

[0074] Compared to existing technologies, traditional conveying mechanisms employ conveyor belts or chains, which cannot continuously adjust the conveying height, making it difficult to install them into water tanks. This solution, however, utilizes a combination of multiple parallel rollers and synchronous chain transmission to create multiple continuous and stable load-bearing surfaces. This is particularly true in multi-stage water washing units, where the conveyor rollers 500 can enter the water tanks of each washing unit by first descending and then ascending. This simpler structure, compared to conveyor belts and chains, addresses the technical drawback of traditional conveying equipment, which makes it difficult to install them into water tanks.

[0075] Through the above technical solution, this application realizes efficient and stable transportation of circuit boards between sandblasting, cleaning and drying processes, avoids processing interruptions caused by insufficient support or speed mismatch, and improves the degree of automation and operation continuity of the production line.

[0076] like Figure 2 As shown, the present application further proposes that the sandblasting device 120 includes a sandblasting machine 520 , an abrasive recovery system 530 and an air pressure regulating mechanism 540 .

[0077] The sandblaster 520 is the core execution unit for sandblasting, which can be implemented by a closed cavity structure with an adjustable nozzle, and is used to spray abrasive at high speed onto the surface of the circuit board to form a uniform roughness. The sand recovery system 530 is a device for recycling abrasives, which can be implemented by a cyclone separator combined with a multi-layer vibrating screen structure, which is used to separate and recover reusable sand particles and filter impurities. The air pressure regulating mechanism 540 is a device for controlling the sandblasting pressure, which can be implemented by a proportional regulating valve with a pressure sensor, which is used to monitor and dynamically adjust the compressed air output pressure in real time.

[0078] Specifically, the sandblaster 520 uses a sealed cavity structure to create a directional spraying area, preventing sand from leaking out and causing waste. The sand recovery system 530 uses a multi-stage separation device to classify the mixed material after sandblasting by particle size, and the usable sand is returned to the sandblaster 520 for recycling. The air pressure regulating mechanism 540 stabilizes the sandblasting pressure within a preset range through a closed-loop control system. When the pressure sensor detects pressure fluctuations, the proportional control valve automatically adjusts the cross-sectional area of ​​the air flow channel to restore pressure balance. These three subsystems form a collaborative working mechanism. The sandblaster 520 performs basic processing functions, the sand recovery system 530 ensures the reuse rate of the medium, and the air pressure regulating mechanism 540 maintains the stability of process parameters.

[0079] Compared with existing technologies, traditional sandblasting equipment uses an open sandblasting chamber, resulting in an abrasive loss rate of more than 40%. However, this solution increases the abrasive recycling rate to more than 85% through the combination of a closed chamber and an abrasive recovery system 530. Existing equipment relies on manual adjustment of the air pressure valve, resulting in a pressure fluctuation range of ±0.2MPa. This solution uses closed-loop control to control the pressure fluctuation within ±0.05MPa. Traditional technology uses a single-stage sedimentation recovery method, resulting in more than 30% of sand residue. This solution reduces the residue to less than 5% through a combination of cyclone separation and vibrating screen.

[0080] Through the above-mentioned technical solution, the present application effectively reduces abrasive consumption during the sandblasting process, avoids uneven surface treatment caused by unstable pressure, and simultaneously achieves efficient recovery and reuse of abrasive material. The integrated design of the sandblaster 520 and the recovery system reduces the equipment footprint, and the closed-loop control mechanism of the air pressure regulating mechanism 540 improves the accuracy of process parameters, thereby ensuring the stability and consistency of the surface treatment quality of the circuit board.

[0081] This application further proposes a method for processing a finished circuit board using a sandblasting line, such as Figure 11As shown, the process includes the following steps: a feeding step of feeding the circuit board to be processed into the automatic conveying mechanism 100; a sandblasting step of treating the surface of the circuit board with a specific pressure and sand particle size combination; two inclined water washing steps of achieving step-by-step stripping of residual sand particles by adjusting the angle gradient; three circulating water washing steps of coordinating the filtration and recovery system by changing the water temperature and flow gradient; three pressurized water washings and high-pressure water washings of increasing pressure to form an impact force; an ultrasonic water washing step of stripping micron-sized particles by combining a specific frequency and temperature; a deionized water rinsing step of eliminating ion contamination; a drying step of physically adsorbing moisture by a sponge roller 190; a strong wind drying step of using a high-pressure blower 200 to quickly remove surface moisture; a hot air drying step of ensuring drying uniformity by circulating hot air with a gradient temperature increase; a cooling step of cooling the circuit board to room temperature; and a discharging step of taking out the processed circuit board.

[0082] The sandblasting pressure is controlled within a range of 0.3-0.6 MPa, which refers to the pressure range within which compressed air drives sand particles to impact the circuit board surface. This can be achieved by using a pressure regulating valve and a pressure sensor in conjunction with each other. This pressure range ensures surface roughness while reducing excessive embedding of sand particles. The sand particle size of 80-120 mesh refers to the use of medium-sized abrasive media, specifically screened and graded aluminum oxide sand. This particle size range balances cutting efficiency and the risk of surface damage.

[0083] The tilted water washing step's spray angle adjustment of 30°-45° and 15°-30° refers to the angle range between the spray pipe and the circuit board plane. This is achieved using an electric rotating bracket in conjunction with an angle sensor. High-angle washing removes large surface particles, while low-angle washing covers edge gaps. Water pressure control of 0.2-0.5MPa refers to the operating pressure of the washing water flow. This is achieved using a centrifugal pump in conjunction with a pressure regulator. This pressure gradient design allows for the gradual removal of contaminants with varying adhesion strengths.

[0084] The water temperature of the circulating water washing step is controlled at 30-50℃, which refers to the temperature adjustment range of the cleaning liquid. This can be achieved by using an electric heating tube in conjunction with a temperature controller. The temperature gradient change helps dissolve pollutants of different properties. The circulation flow rate is 2-6 It refers to the amount of water that passes through the filtration and recovery system per unit time. It can be achieved by adopting the linkage control of variable frequency water pump and flow meter. The flow decreasing design can improve the utilization rate of water resources.

[0085] The water pressure in the pressurized water wash step, controlled at 0.4-0.9 MPa, refers to the impact pressure of the high-pressure water flow. This can be achieved by using a plunger pump in conjunction with a booster device. Three washes with increasing pressure create a stepped impact force. The 1.0-1.5 MPa in the high-pressure water wash step refers to the operating pressure of the ultra-high-pressure water flow. This can be achieved by using a multi-stage centrifugal pump system to coordinate boosting. This pressure range can effectively remove deep-seated residues.

[0086] The ultrasonic water washing step's frequency of 40-68 kHz refers to the frequency range of the mechanical vibration waves generated by transducer 460. This frequency range can be achieved using a piezoelectric ceramic transducer 460 in conjunction with a frequency generator. This frequency range is capable of removing micron-sized particles without damaging the circuit board. The water temperature of 45-55°C refers to the temperature of the liquid within the cleaning tank, which can be maintained using a constant temperature control system. This temperature range enhances the ultrasonic cavitation effect.

[0087] The hot air drying step, with a temperature of 60-80°C, refers to the hot air temperature within drying duct 210. This can be achieved by coupling an electric heating tube with an air duct temperature sensor, using a gradient heating method to prevent thermal deformation of the circuit boards. The strong air drying step, with a wind speed of 15-25 m / s, refers to the airflow velocity generated by high-pressure fan 200. This can be achieved by adjusting the fan speed using a variable frequency motor. This wind speed range can quickly remove free surface moisture.

[0088] Specifically, this method achieves full line automation through process optimization. During the sandblasting stage, a specific pressure and grit size combination ensures surface roughening while preventing excessive embedding of grit into the substrate. Two inclined water washes utilize a decreasing angle design: the first high-angle rinse removes loose surface sand particles, while the second low-angle rinse covers the edges and holes of the circuit board. Three cyclic water washes utilize gradually decreasing water temperature and flow rate, combined with a multi-stage filtration system to efficiently reuse the cleaning fluid. Three pressurized water washes and a high-pressure water wash form a sequence of increasing pressures from 0.4 to 1.5 MPa, removing contaminants with increasing adhesion strength. Ultrasonic cleaning generates cavitation at a specific temperature to remove residual micron-sized particles. After a deionized water rinse removes surface ionic contamination, the drying process utilizes a three-stage synergy of physical adsorption, airflow, and heat conduction. A sponge roller 190 absorbs free moisture to prevent mechanical damage, high-pressure airflow removes residual water film in gaps, and a gradient hot air circulation ensures uniform drying of the board surface. The cooling process eliminates thermal stress through forced convection, ultimately forming a continuous sandblasting, cleaning, and drying integrated process.

[0089] Compared with the existing technology, the traditional processing method uses independent equipment for segmented processing, resulting in low efficiency in process connection. This method completes all processes in a single production line by integrating multi-stage water washing and drying devices, thereby reducing material turnover time. The single water washing method in the existing technology cannot cope with complex pollutants. This solution realizes step-by-step removal from macro particles to micro ions through multi-mode coordination of inclined flushing, circulating filtration, pressure shock and ultrasonic oscillation. The traditional drying process relies on single hot air drying. This method combines physical adsorption and forced air cooling to reduce energy consumption while avoiding deformation of the substrate caused by high temperature. The existing technology lacks systematic parameter control. This solution forms mutually coordinated cleaning dynamic conditions through gradient settings of pressure, angle, temperature and flow, significantly improving process stability.

[0090] Through the above technical solutions, this application effectively solves the technical problems of incomplete cleaning and high energy consumption for drying in traditional processes. The synergistic effect of the multi-stage water washing process can remove more than 99% of sandblasting residues and avoid contamination in subsequent processes. The integrated drying system reduces energy consumption by more than 30% compared to traditional equipment, while shortening the drying time to 1 / 2 of the original process. The processing flow after parameter optimization enables the surface roughness of the circuit board to be controlled within the ideal range of Ra 1.6-2.4μm, and the adhesion of the metal coating is improved to above 5B level. The continuous production mode increases the unit production capacity by 40%, and the product yield is stabilized at more than 98.5%.

[0091] Throughout this specification, references to terms such as "one embodiment, some embodiments, exemplary embodiments, examples, specific examples, or some examples" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, illustrative uses of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0092] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A PCB finished product sandblasting line, characterized in that: It comprises an automatic conveying mechanism (100) for continuously conveying circuit boards, and is provided in sequence along the conveying direction of the automatic conveying mechanism (100): A feeding area (110) for placing circuit boards to be processed; A sandblasting device (120) for sandblasting the surface of a circuit board; A multi-stage water washing device comprises an inclined water washing mechanism, a circulating water washing mechanism, a pressurized water washing mechanism, a high-pressure water washing mechanism (130), an ultrasonic water washing mechanism (140) and a deionized water rinsing mechanism (150), wherein the inclined water washing mechanism uses an inclined spraying method to wash away residual sand particles on the surface of a circuit board, the circulating water washing mechanism performs multi-stage cleaning of the circuit board through a circulating water flow, the pressurized water washing mechanism uses a pressurized water flow to remove residues, the high-pressure water washing mechanism (130) uses a high-pressure water flow to further remove residues, the ultrasonic water washing mechanism (140) uses ultrasonic vibrations to remove fine impurities, and the deionized water rinsing mechanism (150) uses deionized water to remove ionic contaminants from the circuit board; The drying device comprises a drying mechanism (160), a strong wind drying mechanism (170) and a hot air drying mechanism (180), wherein the drying mechanism (160) comprises a sponge roller (190) for absorbing moisture on the surface of the circuit board, the strong wind drying mechanism (170) is provided with a high-pressure blower (200) for drying the circuit board, and the hot air drying mechanism (180) comprises a drying channel (210), wherein a hot air circulation system (220) is provided in the drying channel (210) for thoroughly drying the circuit board through hot air circulation; A cooling zone (230) includes a cooling channel (240), wherein the cooling channel (240) is provided with an air cooler for cooling the circuit board; The discharging area (250) is used to take out the processed circuit board.

2. A circuit board finished product sandblasting line according to claim 1, characterized in that: The inclined water washing mechanism is provided with two first inclined water washing mechanisms (260) and a second inclined water washing mechanism (270); the pressurized water washing mechanism is provided with three first pressurized water washing mechanisms (280), a second pressurized water washing mechanism (290) and a third pressurized water washing mechanism (300); the circulating water washing mechanism is provided with three first circulating water washing mechanisms (310), a second circulating water washing mechanism (320) and a third circulating water washing mechanism (330); the multi-stage water washing mechanism is arranged in the following order: the first inclined water washing mechanism (260), the second inclined water washing mechanism (270), the first circulating water washing mechanism (310), the first pressurized water washing mechanism (280), the ultrasonic water washing mechanism (140), the second circulating water washing mechanism (320), the third circulating water washing mechanism (330), the second pressurized water washing mechanism (290), the high-pressure water washing mechanism (130), the third pressurized water washing mechanism (300) and the deionized water rinsing mechanism (150).

3. A circuit board finished product sandblasting line according to claim 2, characterized in that: The first inclined water washing mechanism (260) and the second inclined water washing mechanism (270) both comprise a first drainage trough (340) located below the automatic conveying mechanism (100) and an inclined spray pipe (350) with an adjustable spray angle located above the automatic conveying mechanism (100). The inclined spray pipe (350) flushes residual sand particles on the surface of the circuit board by an inclined spraying method.

4. A circuit board finished product sandblasting line according to claim 2, characterized in that: The first pressurized water washing mechanism (280), the second pressurized water washing mechanism (290), the high-pressure water washing mechanism (130) and the third pressurized water washing mechanism (300) all include a second drainage trough (360) located below the automatic conveying mechanism (100); the first pressurized water washing mechanism (280), the second pressurized water washing mechanism (290) and the third pressurized water washing mechanism also include a pressurized spray pipe (370) located above the automatic conveying mechanism (100); and the high-pressure water washing mechanism (130) also includes a high-pressure spray pipe (380) located above the automatic conveying mechanism (100).

5. The circuit board finished product sandblasting line according to claim 2, characterized in that: The first circulating water washing mechanism (310), the second circulating water washing mechanism (320) and the third circulating water washing mechanism (330) all include a circulating water washing tank (390), each of which is provided with a water washing spray pipe (400), and the circulating water washing tank (390) is provided with a filtering and recycling system. The filtering and recycling system includes a coarse filter (410), a fine filter (420) and a circulating pump (430) connected in sequence, and the circulating pump (430) is connected to the water washing spray pipe (400) to form a water circulation.

6. A circuit board finished product sandblasting line according to claim 1, characterized in that: The ultrasonic water washing mechanism (140) comprises an ultrasonic water washing tank (440), and the ultrasonic water washing tank (440) is provided with an ultrasonic generator (450), a transducer, and a temperature control system (460).

7. The circuit board finished product sandblasting line according to claim 1, characterized in that: The deionized water rinsing mechanism (150) comprises a deionized water washing tank (470), and the deionized water washing tank (470) is connected to a deionized water supply system (480).

8. The circuit board finished product sandblasting line according to claim 1, characterized in that: The automatic conveying mechanism (100) comprises a plurality of conveying rollers (490) arranged in parallel, a transmission chain (500) for driving the conveying rollers (490) to rotate, and a conveying motor for driving the transmission chain (500) to move.

9. The circuit board finished product sandblasting line according to claim 1, characterized in that: The sandblasting device (120) comprises a sandblasting machine (510), a sand material recovery system (520), and an air pressure regulating mechanism (530).

10. A method for sandblasting a finished circuit board, characterized in that: The circuit board finished product sandblasting line according to any one of claims 1 to 9 comprises the following steps: (1) Feeding step: feeding the circuit board to be processed into the automatic conveying mechanism (100) through the feeding area (110); (2) Sandblasting step: sandblasting the surface of the circuit board using a sandblasting device (120); (3) First inclined water washing step: using the first inclined water washing mechanism (260) to perform preliminary washing on the circuit board; (4) Second inclined water washing step: using the second inclined water washing mechanism (270) for secondary washing; (5) First circulating water washing step: preliminary circulating washing is performed through the first circulating water washing mechanism (310); (6) First pressure water washing step: using the first pressure water washing mechanism (280) to perform the first pressure washing; (7) Ultrasonic water washing step: deep cleaning is performed by an ultrasonic water washing mechanism (140); (8) Second cycle water washing step: performing secondary cycle washing through the second cycle water washing mechanism (320); (9) Third circulating water washing step: performing final circulating washing through the third circulating water washing mechanism (330); (10) Second pressure water washing step: using the second pressure water washing mechanism (290) to perform a second pressure washing; (11) High-pressure water washing step: ultra-high-pressure cleaning is performed by a high-pressure water washing mechanism (130); (12) Third pressure water washing step: using the third pressure water washing mechanism (300) to perform the third pressure washing; (13) Deionized water rinsing step: performing final rinsing by a deionized water rinsing mechanism (150); (14) Drying step: absorbing most of the moisture on the surface of the circuit board through the sponge roller (190) of the drying mechanism (160); (15) Strong wind drying step: using a high pressure blower (200) for preliminary drying; (16) Hot air drying step: final drying is performed by a hot air drying mechanism (180); (17) Cooling step: cooling the circuit board to room temperature by an air cooler in the cooling zone (230); (18) Discharging step: The processed circuit board is taken out through the discharging area (250).

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