Radiation transfer and temperature measurement deviation analysis method based on thin film thermocouple multilayer structure

Abstract

The invention discloses a radiation transfer and temperature measurement deviation analysis method based on a multilayer structure of a thin film thermocouple. The method comprises the following steps: firstly, establishing a three-dimensional physical model of the thin film thermocouple with the multilayer structure; then finishing theoretical calculation and analysis of the radiation process of the high-temperature fuel gas to the film thermocouple and the radiation process between film layers of the film thermocouple; carrying out grid independence test and simulation calculation of a plurality of working conditions; analyzing the temperature distribution of each film layer of the film thermocouple obtained by simulation calculation; and finally, calculating a temperature measurement deviation value between the node temperature of the thin film thermocouple and the surface temperature of the measured piece under each working condition by using a temperature measurement deviation calculation formula. The radiation transfer process from the high-temperature gas to the film thermocouple and the radiation transfer process among multilayer structures of the film thermocouple can be relatively completely analyzed, simulation calculation verifies that the method is reasonable, a theoretical calculation result has considerable precision and reference value, and the method has wide applicability.

Description

Technical Field

[0001] The present invention belongs to the technical field of thin film thermocouple temperature measurement, and in particular relates to a radiation transfer and temperature measurement deviation analysis method based on a thin film thermocouple multilayer structure. Background Art

[0002] Thermocouples are the most widely used temperature sensors for measuring wall temperatures. Their fundamental principle is the Seebeck effect. Bare thermocouples are difficult to withstand in extremely high-temperature and high-pressure environments. Therefore, researchers have designed armored thermocouples with various materials and structures to improve their adaptability to high-temperature environments. However, this approach alters the airflow over the surface being measured, ultimately causing changes in the surface temperature and distribution. Furthermore, these thermocouples suffer from shortcomings such as slow response, large temperature measurement errors, and susceptibility to shedding.

[0003] Unlike traditional thermocouples, thin-film thermocouples, as a new type of temperature sensor, offer significant advantages, including high-temperature resistance, minimal mass, enhanced transient temperature measurement performance, the ability to operate in confined spaces, and no damage to the structure of the device being measured. For these reasons, thin-film thermocouples have become an optimal solution for measuring temperature in extreme high-temperature environments in recent years, and are widely used to measure the temperature of high-temperature components in gas turbines and aircraft engines.

[0004] According to existing process designs, thin-film thermocouples used for temperature measurement in high-temperature environments generally have a multilayer structure. In their 2023 paper, "Breakthrough Progress in the Development of Thin-Film Thermocouples for Surfaces of High-Temperature Alloy Special-Shaped Parts," Luo Bingwei et al. designed a platinum-iridium thin-film thermocouple consisting of a transition layer, a composite insulation layer, a temperature measurement layer, and a protective layer. This multilayer structure complicates the heat transfer process between the thin-film thermocouple layers, especially considering the influence of radiation heat transfer. Currently, research methods for this problem are still incomplete.

[0005] Under high-temperature operating conditions, such as those found in aircraft engines, thin-film thermocouples' temperature measurements are affected by the heat transfer from the high-temperature gases, including radiation and convection, as well as heat conduction between the thermocouple and the component being measured. This can cause the measured temperature to fail to accurately reflect the temperature of the component being measured. To improve the accuracy of thin-film thermocouple temperature measurements, it is necessary to calibrate these deviations caused by radiation, conduction, and convection.

[0006] The calibration of temperature measurement deviation is generally carried out through CFD simulation calculation to obtain the heat transfer mechanism, but the existing simulation calculation research can rarely fully analyze the deviation factors caused by the three heat transfer modes: Wang Yufang et al. from the Beijing Great Wall Metrology and Testing Technology Institute of Aviation Industry published "Research on Thermal Resistance Correction Model of Thin Film Thermocouple Based on CFD Technology" in 2021, in which a CFD numerical simulation three-dimensional heat transfer model with thermal resistance correction was established, that is, only the influence of thermal conductivity was studied, and there was a lack of research on temperature measurement deviation and calibration caused by thermal radiation; Kumar et al. published "Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements" in 2013, in which a semi-infinite body was modeled to predict surface heat flux from transient temperature, but only an appropriate one-dimensional heat conduction model was used; Sarantis P et al. published "Conjugate heat transfer simulations of athermocouple sensor in a low temperature nitrogen gas environment" in 2014. The three-dimensional model established in the ambient environment studies the conjugate effects of heat conduction and convection, while ignoring the deviation caused by thermal radiation.

[0007] Based on the current insufficient research on the radiation heat transfer mechanism of thin film thermocouple multilayer structures and the fact that the radiation deviation correction method under the three-dimensional coupled heat transfer conditions of thin film thermocouples is still not perfect. Summary of the Invention

[0008] In order to overcome the shortcomings of the existing technology, the present invention provides a method for analyzing radiation transfer and temperature measurement deviation based on a multi-layer structure of a thin film thermocouple. First, a three-dimensional physical model of a thin film thermocouple with a multi-layer structure is established; then, theoretical calculation and analysis of the radiation process of high-temperature gas on the thin film thermocouple and the radiation process between the thin film thermocouple film layers are completed; next, a grid independence test and simulation calculations of multiple working conditions are carried out; then, the temperature distribution of each film layer of the thin film thermocouple obtained by simulation calculation is analyzed; finally, the temperature measurement deviation value between the thin film thermocouple node temperature and the surface temperature of the measured object under each working condition is calculated using the calculation formula of temperature measurement deviation. The present invention can relatively completely analyze the radiation transfer process of high-temperature gas to the thin film thermocouple and the radiation transfer process between the multi-layer structure of the thin film thermocouple. It is verified to be reasonable through simulation calculation. The theoretical calculation results have considerable accuracy and reference value and are widely applicable.

[0009] The technical solutions adopted by the present invention to solve the technical problems are as follows:

[0010] Step 1: Establish a three-dimensional physical model of a thin-film thermocouple with a multi-layer structure, and build the measured object and the high-temperature gas fluid domain during the temperature measurement process;

[0011] Step 2: Complete theoretical calculation and analysis of the radiation process of high-temperature gas on thin-film thermocouples and the radiation process between thin-film thermocouple layers;

[0012] Step 3: Conduct grid independence tests and simulate multiple operating conditions. Under the radiation-convection-conduction coupled setting, change the radiation characteristic parameters of the operating condition to obtain multiple sets of numerical results.

[0013] Step 4: Analyze the temperature distribution of each film layer of the thin film thermocouple obtained by simulation calculation to verify the theoretical calculation process in step 2;

[0014] Step 5: Use the temperature measurement deviation calculation formula to calculate the temperature measurement deviation value between the thin film thermocouple node temperature and the surface temperature of the measured object under various working conditions.

[0015] Preferably, the three-dimensional physical model includes a high-temperature gas inlet, a cooling gas inlet, a test piece, a thin-film thermocouple, a high-temperature gas outlet, and a cooling gas outlet.

[0016] Preferably, the radiation process of the high-temperature gas on the thin-film thermocouple is calculated using the equivalent blackbody radiation temperature, and the radiation process between the thin-film thermocouple layers is calculated according to the properties of a translucent body.

[0017] Preferably, in step 3, CFD software is used for simulation calculation, and the radiation-convection-conduction coupled heat transfer setting is ensured to be completed during the setting.

[0018] Preferably, the radiation characteristic parameters are strongly related to radiation heat exchange, including the temperature and velocity of the high-temperature fuel gas or the composition of the high-temperature fuel gas.

[0019] Preferably, the calculation formula of the temperature measurement deviation is as follows:

[0020] Absolute temperature measurement deviation:

[0021] ΔT ab =|T tc -T dut |

[0022] Relative temperature measurement deviation:

[0023]

[0024] Where ΔT ab is the absolute temperature measurement deviation value, is the relative temperature measurement deviation value, T tc is the temperature of the thin film thermocouple hot node, T dutis the surface temperature of the measured object.

[0025] A computer program enables a computer to execute the above-mentioned radiation transfer and temperature measurement deviation analysis method.

[0026] An electronic device comprises: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device performs the above-mentioned radiation transfer and temperature measurement deviation analysis method.

[0027] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the above-mentioned radiation transfer and temperature measurement deviation analysis method.

[0028] A chip includes: a processor for calling and running a computer program from a memory, so that a device equipped with the chip executes the above-mentioned radiation transfer and temperature measurement deviation analysis method.

[0029] A computer program product includes a computer storage medium storing a computer program, wherein the computer program includes instructions that can be executed by at least one processor, and when the instructions are executed by the at least one processor, the above-mentioned radiation transfer and temperature measurement deviation analysis method is implemented.

[0030] The beneficial effects of the present invention are as follows:

[0031] 1. By simplifying the thin-film thermocouple film layer as a semi-transparent medium surface, the present invention can more completely analyze the radiation transfer process from high-temperature gas to the thin-film thermocouple and the radiation transfer process between the thin-film thermocouple multilayer structures. The rationality is verified by simulation calculations, and the theoretical calculation results have considerable accuracy and reference value, and have wide applicability.

[0032] 2. This paper also presents the factors affecting thin-film thermocouple temperature measurement deviation under coupled heat exchange conditions and the corresponding variation patterns. Compared to simulation results that do not consider radiation heat exchange, this pattern is more consistent with actual conditions and has general applicability, providing a theoretical basis for improving the temperature measurement accuracy of thin-film thermocouples and implementing thin-film thermocouple temperature measurement deviation calibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 Schematic diagram of the process of the present invention;

[0034] Figure 2 Schematic diagram of the semi-infinite flat plate temperature measurement physical model with flow field of the present invention, (a) is a three-dimensional view of the entire flat plate temperature measurement model, (b) is the relative position of the thin film thermocouple and the flat plate, and (c) is an enlarged view of the thin film thermocouple film layer structure;

[0035] Figure 3 This is a simplified structural diagram of the platinum-iridium thin film thermocouple film layer of the present invention;

[0036] Figure 4 Schematic diagram of a simplified multi-layer plate model involved in radiation transmission according to the present invention;

[0037] Figure 5 Schematic diagram of the equivalent semi-transparent flat plate radiation transfer model of the present invention;

[0038] Figure 6 The cross-sectional temperature distribution cloud diagram of each film layer of the flat plate and thin film thermocouple of the present invention;

[0039] Figure 7 Schematic diagram of the change of relative temperature measurement deviation values ​​corresponding to various thermophysical variables in an embodiment of the present invention, (a) shows the change law of relative temperature measurement deviation with the inlet gas temperature, and (b) shows the change law of relative temperature measurement deviation with the proportion of H2O and CO2 components. DETAILED DESCRIPTION

[0040] The present invention will be further described below with reference to the accompanying drawings and examples.

[0041] The purpose of the present invention is to fill the deficiencies in the prior art and to propose a method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure.

[0042] To achieve the above object, the present invention provides the following technical solutions:

[0043] A method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure includes the following steps:

[0044] Step 1: Establish a three-dimensional physical model of a thin-film thermocouple with a multi-layer structure, and build the measured object and the high-temperature gas fluid domain during the temperature measurement process;

[0045] Step 2: Complete theoretical calculation and analysis of the radiation process of high-temperature gas on thin-film thermocouples and the radiation process between thin-film thermocouple layers;

[0046] Step 3: Conduct grid independence tests and simulation calculations for multiple typical operating conditions. Under the radiation-convection-conduction coupled setting, change the radiation characteristic parameters of the operating conditions to obtain multiple sets of numerical results.

[0047] Step 4: Analyze the temperature distribution of each film layer of the thin film thermocouple obtained by simulation calculation to verify the theoretical calculation process in step 2;

[0048] Step 5: Use the temperature measurement deviation calculation formula to calculate the temperature measurement deviation value between the thin film thermocouple node temperature and the surface temperature of the measured object under various working conditions.

[0049] The three-dimensional model established in step 1 should include six parts: high-temperature gas inlet, cooling gas inlet, test piece, thin-film thermocouple, high-temperature gas outlet, and cooling gas outlet, so as to restore the high-temperature and high-pressure working environment of the aircraft engine including the cooling device as much as possible.

[0050] In step 2, the radiation process of high-temperature gas on the thin-film thermocouple should be calculated using the equivalent blackbody radiation temperature, and the radiation process between the thin-film thermocouple layers should be calculated according to the properties of a translucent body.

[0051] In step 3, a grid independence test is necessary to prevent the number of grids from significantly affecting the simulation results. As the number of grids increases, multiple grids are set up for calculation, balancing accuracy and computing power to determine the optimal grid set for subsequent calculations.

[0052] In step 3, it's recommended to use mainstream CFD software, which often has powerful radiation transfer and coupled heat transfer calculation capabilities. When setting up, ensure that the radiation-convection-conduction coupled heat transfer settings are complete. The specific setting method should be determined according to the actual situation of the CFD simulation software used.

[0053] In step 3, typical radiation characteristic parameters are selected that are strongly correlated with radiation heat transfer, such as the temperature and velocity of the high-temperature gas or its composition. In particular, if the temperature or radiation heat flux changes dramatically within a relatively small parameter range, it is necessary to interpolate within this range and add additional calculation examples to obtain a more accurate picture of the variation.

[0054] In step 4, the temperature distribution obtained by simulation calculation is displayed through cloud map or contour map, and the results are more intuitive and clear at a glance.

[0055] In step 5, use the following formula to calculate the temperature measurement deviation:

[0056] Absolute temperature measurement deviation:

[0057] ΔT ab =|T tc -T dut |

[0058] Relative temperature measurement deviation:

[0059]

[0060] Where ΔT ab is the absolute temperature measurement deviation value, is the relative temperature measurement deviation value, T tc is the temperature of the thin film thermocouple hot node, T dut is the surface temperature of the measured object.

[0061] The variation pattern of the temperature measurement deviation calculated in step 5 with the radiation characteristic parameters can be displayed in the form of a line graph or a bar graph, which makes it easier to observe and summarize the variation pattern.

[0062] Example:

[0063] This embodiment is a study on the radiation transfer process and temperature measurement deviation analysis of a multilayer structure of platinum-iridium thin film thermocouples under coupled heat transfer conditions. Figure 1 The implementation scheme flow chart shown in the figure has the following specific implementation details:

[0064] Step 1: Establish a three-dimensional physical model of a thin-film thermocouple with a multi-layer structure, and build the measured object and high-temperature gas fluid domain during the temperature measurement process.

[0065] Establish a semi-infinite plate temperature measurement physical model with flow field as follows Figure 2 Figures (a), (b), and (c) show a semi-infinite plate, a thin-film thermocouple mounted on the plate, and the inlet gas flow field and cooling airflow field. The high-temperature gas flow field is located above the plate, while the cooling airflow field is located below. The flow directions of the airflow fields are normal to each other, maximizing the simulation of temperature measurement by the thin-film thermocouple on an aircraft engine turbine blade.

[0066] In reality, the thickness of a thin-film thermocouple is negligible relative to the blade. However, when using software simulation, the thickness cannot be completely ignored due to the scale difference between the plate and the thermocouple junction modeling. Modeling outside the plate can still cause flow changes, resulting in velocity errors. To ensure the highest possible computational accuracy, the thin-film thermocouple hot junction is modeled embedded in the plate.

[0067] like Figure 3 As shown, the platinum-iridium thin-film thermocouple studied in this example has a multilayer structure: from bottom to top, it comprises a NiCrAlY transition layer, a YSZ / Al2O3 composite insulating layer, a platinum-iridium alloy dipole sensitive layer, and an Al2O3 protective layer. The transition layer ensures adhesion between the thermocouple and the object being measured; the insulating layer ensures electrical insulation of the temperature-sensing layer from high temperatures. The sensitive layer electrode outputs an electrical signal to provide feedback on the measured temperature at the hot end, making it the thermocouple's primary functional layer. To prevent the platinum-iridium alloy in the sensitive layer from high-temperature oxidation and failure, a high-temperature anti-oxidation protective layer is typically applied over it. In this model, the aluminum oxide protective layer is approximately 3μm thick, the platinum-iridium temperature-sensing layer is approximately 3μm thick, the aluminum oxide insulating layer is approximately 4μm thick, the YSZ insulating layer is approximately 50μm thick, and the NiCrAlY transition layer is approximately 50μm thick.

[0068] Step 2: Complete the theoretical calculation and analysis of the radiation process of high-temperature gas on thin-film thermocouples and the radiation process between thin-film thermocouple layers.

[0069] A review of literature on radiation from the walls of aircraft engine turbine blades reveals that the radiation energy from the high-temperature combustion gases within the turbine is primarily distributed in the infrared band, particularly the near-infrared (0.76-3μm) and mid-infrared (3-6μm) bands. Based on the Stefan-Boltzmann law and Planck's law, the equivalent blackbody radiation intensity can be calculated. Some literature suggests that the radiation intensity at the combustion chamber outlet is approximately 100,000W / m 2 Since there is no fixed reference value for the emissivity of high-temperature gas, the final value is about 0.3 to simplify the calculation, which can be converted into the blackbody radiation intensity at a temperature of about 1530K. For the convenience of calculation, the gas radiation intensity is normalized to obtain a simplified multi-layer plate model participating in radiation transmission as follows Figure 4 shown.

[0070] In this embodiment, the platinum-iridium thin film thermocouple is micron-sized and can be considered as a semi-transparent film for calculation from the perspective of optical properties. Furthermore, the interaction between the radiation energy beam and the semi-transparent medium is equivalent to the interaction between the radiation and the two surfaces of the medium. That is, the semi-transparent medium is equivalent to two semi-transparent surfaces with absorption, reflection, transmission or refraction capabilities, and the equivalent radiation characteristic parameters are given: equivalent reflectivity ρ e , equivalent absorption rate k e and equivalent transmittance τ e Among them are

[0071] κ e =1-τ e

[0072] If the radiation beam is transmitted by the interface but remains in the multilayer structure system, the beam will be refracted into the adjacent dielectric layer, and the refraction direction follows Snell's refraction law:

[0073]

[0074] Assume that the refractive index of the incident medium is n i , the output side is n j , when n i <n j When n i >n j When the incident angle is greater than a certain critical angle, total internal reflection occurs. If it is less than the critical angle, Snell's refraction law is still satisfied. Therefore, when refraction occurs, the transmission position is used as the emission position, and the tracking calculation continues according to the new refraction direction until the energy beam is absorbed or transmitted out of the model.

[0075] In summary, we can get a radiation transfer model that can more completely describe the radiation process between thin film thermocouple layers. Since the transmission process of each layer is basically the same, we take one layer as an example. Figure 5Therefore, the attenuation change of the radiation heat flux passing through the film layer can be calculated through this theoretical analysis process, and the corresponding temperature can be obtained.

[0076] Step 3: Carry out grid independence tests and simulation calculations of multiple typical working conditions. Under the radiation-convection-heat conduction coupling setting, change the radiation characteristic parameters of the working conditions to obtain multiple sets of numerical results.

[0077] The flat plate model was meshed. Mesh independence was verified by performing coupled radiation-convection-conduction heat transfer calculations at an inlet gas temperature of 1600K. The temperature difference between the top surface of the plate and the platinum-iridium thermocouple's temperature measuring layer was compared for different mesh sizes, analyzing the change in the difference. Ultimately, balancing accuracy and efficiency, a relatively optimal mesh size of 1,739,487 and 3,286,599 nodes was selected for subsequent simulations.

[0078] In this example, typical radiation characteristic parameters were selected: inlet gas temperature (1200K, 1400K, 1600K, 1800K, and 2000K), and the ratios of gas components H2O, CO2, N2, and air (primarily focusing on H2O to CO2 ratios such as 1:2, 1:1, and 2:1). The results were used to set up the calculations and analyze the impact of these variables on temperature measurement deviation. The turbine blade surface temperature and the thin-film thermocouple hot node temperature were calculated for each case.

[0079] Step 4: Analyze the temperature distribution of each film layer of the thin film thermocouple obtained by simulation calculation to verify the theoretical calculation process in step 2.

[0080] Through CFD simulation calculation, the temperature distribution of each film layer of the flat plate and thin film thermocouple can be obtained. The cross-sectional temperature distribution cloud diagram of each film layer of the flat plate and thin film thermocouple is as follows: Figure 6 As shown (the inlet gas temperature of the selected example is 1600K, and the proportions of gas components H2O, CO2, N2 and air are 0.06, 0.11, 0.7 and 0.13 respectively).

[0081] As can be seen from the figure, there is a gradual temperature change at the interface between the flat plate and the thin-film thermocouple. Therefore, the temperature value in this area cannot be used as a reference. The temperature should be taken at the point where the thin-film thermocouple has a uniform temperature to obtain the specific temperature of each film layer, or the average temperature of each film layer can be directly calculated using simulation software for comparison and verification. In this example, the temperature of the alumina protective layer is 1403.7452K, the temperature of the platinum-iridium temperature sensitive layer is 1403.7146K, the temperature of the alumina insulating layer is 1403.6816K, the temperature of the YSZ insulating layer is 1391.8445K, and the temperature of the NiCrAlY transition layer is 1380.111K.

[0082] The theoretical calculation parameters used an inlet gas temperature of 1600K, a radiation beam wavelength of 2μm, and a gas emissivity of 0.3. Each thermocouple film layer was assigned an equivalent reflectivity, absorptivity, and transmittance, ultimately calculating the difference in equivalent radiation temperature between the layers. The temperature differences between the layers during radiation transfer were distributed within a certain range, closely matching the results of coupled heat transfer simulation calculations. This validates the rationality of the theoretical calculation results and enables a relatively accurate analysis of the radiation transfer process in thin-film thermocouple multilayer structures.

[0083] Step 5: Use the temperature measurement deviation calculation formula to calculate the temperature measurement deviation value between the thin film thermocouple node temperature and the surface temperature of the measured object under various working conditions.

[0084] Apply the temperature measurement deviation calculation formula:

[0085] ΔT ab =|T tc -T dut |

[0086]

[0087] Based on the simulation calculation data, the absolute temperature measurement deviation and relative temperature measurement deviation of the thin film thermocouple can be obtained, and a series of conclusions about the temperature measurement deviation can be obtained:

[0088] (1) As the inlet gas temperature increases, the temperature measurement deviation of the thin film thermocouple will become larger and larger, such as Figure 7 As shown in (a), the temperature of the platinum-iridium temperature measuring layer in this embodiment is always higher than the suction surface of the blade.

[0089] (2) When the total proportion of H2O and CO2 increases, the heat conduction and radiation heat transfer effect of the gas on the solid domain becomes more obvious, and the temperature measurement deviation value of the thin film thermocouple also increases. Figure 7 As shown in (b), compared with CO2, the increase in the proportion of H2O has a more significant effect on enhancing the thermal conductivity and radiation heat transfer of the gas.

Claims

1. A method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure, characterized in that: The steps include: Step 1: Establish a three-dimensional physical model of a thin-film thermocouple with a multi-layer structure, and build the measured object and the high-temperature gas fluid domain during the temperature measurement process; Step 2: Complete theoretical calculation and analysis of the radiation process of high-temperature gas on thin-film thermocouples and the radiation process between thin-film thermocouple layers; Step 3: Conduct grid independence tests and simulate multiple operating conditions. Under the radiation-convection-conduction coupled setting, change the radiation characteristic parameters of the operating condition to obtain multiple sets of numerical results. Step 4: Analyze the temperature distribution of each film layer of the thin film thermocouple obtained by simulation calculation to verify the theoretical calculation process in step 2; Step 5: Use the temperature measurement deviation calculation formula to calculate the temperature measurement deviation value between the thin film thermocouple node temperature and the surface temperature of the measured object under various working conditions.

2. The method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure according to claim 1, characterized in that: The three-dimensional physical model includes a high-temperature fuel gas inlet, a cooling gas inlet, a test piece, a thin-film thermocouple, a high-temperature fuel gas outlet, and a cooling gas outlet.

3. The method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure according to claim 1, characterized in that: The radiation process of the high-temperature gas on the thin-film thermocouple is calculated using the equivalent blackbody radiation temperature, and the radiation process between the thin-film thermocouple layers is calculated according to the properties of a translucent body.

4. The method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure according to claim 1, characterized in that: In step 3, CFD software is used for simulation calculation, and the radiation-convection-conduction coupled heat transfer setting is ensured to be completed during the setting.

5. The method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure according to claim 1, characterized in that: The radiation characteristic parameters are strongly related to radiation heat transfer, including the temperature and velocity of the high-temperature fuel gas or the composition of the high-temperature fuel gas.

6. The method for analyzing radiation transfer and temperature measurement deviation based on a thin film thermocouple multilayer structure according to claim 1, characterized in that: The calculation formula of the temperature measurement deviation is as follows: Absolute temperature measurement deviation: ΔT ab =|T tc -T dut | Relative temperature measurement deviation: Where ΔT ab is the absolute temperature measurement deviation value, is the relative temperature measurement deviation value, T tc is the temperature of the thin film thermocouple hot node, T dut is the surface temperature of the measured object.

7. A computer program, characterized in that The computer program enables a computer to execute the method according to any one of claims 1 to 6.

8. An electronic device, characterized in that: include: processor and memory; The memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device performs the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 6 is implemented.

10. A chip, characterized in that: include: A processor, configured to call and run a computer program from a memory, so that a device equipped with the chip executes the method according to any one of claims 1 to 6.

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