High-temperature-resistant resin, light-cured composition and application of light-cured composition

Abstract

The invention belongs to the technical field of materials, and particularly relates to high-temperature-resistant resin, a light-cured composition and application of the light-cured composition. The high-temperature-resistant resin is at least polymerized from the following raw materials: a hydrocarbon compound with an olefinic unsaturated double-bond chain segment at the tail end; a terminal unsaturated carboxylic acid; and a substituted maleimide compound, in which a substituent group is a substituted or unsubstituted polynuclear cyclic hydrocarbon group, and a substitution site is hydrogen on N. The photocuring composition comprises high-temperature-resistant resin, a resin monomer, a photopolymerization initiator, an auxiliary agent and a solvent. The photocuring composition provided by the invention is applied to the fields of preparation of organic display light-emitting devices, liquid crystal displays and the like, and has the advantages of good heat resistance, high bonding strength, good chemical resistance and the like.

Description

Technical Field

[0001] The present invention belongs to the field of material technology, and in particular relates to a high-temperature resistant resin, a photocurable composition and an application of the photocurable composition. Background Art

[0002] Photoresist is a photosensitive thin film material. It is a key basic processing material for micro-processing technology in the optoelectronic information industry. It is mainly used for fine graphic processing of integrated circuits, semiconductor devices, flat panel displays, etc. In recent years, as display technology has developed towards higher integration and smaller size, the resolution requirements of graphics are getting higher and higher, and therefore the requirements for photoresist are also getting higher and higher.

[0003] Photoresist is composed of film-forming resin, photosensitizer, solvent and additives. The film-forming resin is the skeleton and basic material of photoresist, and it has a decisive influence on the performance of photoresist. Among them, high-temperature resistant resin is a key component of photoresist, and its performance plays a decisive role in the stability and reliability of photoresist in high-temperature environments. During the photoresist pattern formation process, photoresist needs to undergo multiple high-temperature processing steps, such as baking after photolithography and high-temperature reactions during etching. If the resin in the photoresist is not resistant to high temperatures, deformation and decomposition may occur during these high-temperature steps, resulting in a decrease in the accuracy of the photoresist pattern. Therefore, the development of high-performance, high-temperature resistant resins is of vital importance to improving the performance of photoresist and meeting the requirements of pattern accuracy. Summary of the Invention

[0004] To address the shortcomings of the prior art, the present invention provides a high-temperature resistant resin, a photocurable composition, and applications of the photocurable composition. The photocurable composition, comprising the high-temperature resistant resin, is applied in the preparation of organic light-emitting devices, liquid crystal displays, and other fields, exhibiting advantages such as excellent heat resistance, high bonding strength, and good chemical resistance.

[0005] The technical solutions provided by the present invention are as follows:

[0006] A high temperature resistant resin, which is polymerized from at least the following raw materials:

[0007] A hydrocarbon compound, an unsaturated carboxylic acid, or a maleimide compound having an olefinically unsaturated double bond at the end; wherein the hydrogen atom connected to nitrogen on the functional group of the maleimide compound is replaced by a substituted or unsubstituted polynuclear cyclic hydrocarbon group.

[0008] The weight average molecular weight of the high temperature resistant resin is 5000-20000.

[0009] Specifically: the polynuclear cyclic hydrocarbon group is any one of a polynuclear aromatic hydrocarbon group, a polynuclear heteroaromatic hydrocarbon group or a polynuclear alicyclic hydrocarbon group.

[0010] Preferably, the polynuclear cyclic hydrocarbon group contains at least two five-membered rings and / or six-membered rings, and the rings are connected by any one or more of a single bond connection and a shared pair of chemical bonds.

[0011] More preferably, the total number of five-membered rings and / or six-membered rings in the polynuclear cyclic hydrocarbon group is 2-4, specifically 2, 3 or 4.

[0012] Specifically, the polynuclear aromatic hydrocarbon group comprises two or more substituted or unsubstituted six-membered aromatic rings, and the six-membered aromatic rings are connected by one or more of a single bond, an alkyl group having 1 to 5 carbon atoms, a carbonyl group, a heteroatom, or a shared pair of chemical bonds;

[0013] Preferably, the six-membered aromatic ring is a benzene ring.

[0014] Preferably, the polynuclear aromatic hydrocarbon group contains two or more benzene rings, and examples thereof include naphthalene, anthracene, dibenzonaphthalene, benzanthracene, dibenzoanthracene, biphenyl, benzophenone, fluorene, 9-fluorenone, and the like.

[0015] Specifically, the polynuclear heteroaromatic group comprises a five-membered heterocyclic ring or a six-membered heterocyclic ring, and the five-membered heterocyclic ring or the six-membered heterocyclic ring is connected to at least one or more substituted or unsubstituted six-membered aromatic rings via a single bond, or by sharing one or more chemical bonds.

[0016] Preferably, the five-membered heterocyclic ring has at least one to two heteroatoms selected from N, O, and S. Examples of the five-membered heterocyclic ring include furan, pyrrole, thiophene, oxazole, isoxazole, thiazole, and isothiazole.

[0017] Preferably, the six-membered heterocyclic ring is selected from a saturated or unsaturated heterocyclic ring containing any one of N, O, and S. Examples thereof include, but are not limited to, pyridine, pyran, and pyrimidine.

[0018] More preferably, the polynuclear heteroaromatic group is selected from benzofuran, benzothiophene, benzopyridine, benzodioxolane and the like.

[0019] Specifically, the polynuclear alicyclic hydrocarbon group is a monomer comprising two or more substituted or unsubstituted five-membered or six-membered alicyclic rings, wherein the alicyclic rings are connected by single bonds or share one or more chemical bonds. In other words, the polynuclear alicyclic hydrocarbon group is a monomer comprising two or more substituted or unsubstituted alicyclic rings, wherein each alicyclic ring is independently a five-membered or six-membered alicyclic ring, wherein the alicyclic rings are connected by single bonds or share one or more chemical bonds.

[0020] Preferably, the five-membered alicyclic ring is cyclopentyl, and the six-membered alicyclic ring is cyclohexyl.

[0021] Preferably, the polynuclear aliphatic group is a polycyclic ring formed by 2-3 five-membered alicyclic rings or six-membered alicyclic rings sharing one or more chemical bonds.

[0022] For example, the polynuclear aliphatic group is selected from dicyclohexyl, norbornyl, adamantane, bridged cyclooctane, bridged cyclononane, bridged cyclodecane and the like.

[0023] Specifically, in the hydrocarbon compound having an ethylenically unsaturated double bond at the end, the first ethylenically unsaturated double bond is selected from (methyl)ethylene, (methyl)propylene or (methyl)acrylate.

[0024] The hydrocarbon compound having ethylenically unsaturated double bonds includes at least one monomer containing a substituted or unsubstituted phenyl group.

[0025] Furthermore, the hydrocarbon compound having an ethylenically unsaturated double bond includes at least one monomer containing a substituted or unsubstituted phenyl group, that is, at least one or more aromatic vinyl compounds.

[0026] More preferably, the aromatic vinyl compound contains substituted or unsubstituted C 6-30 Aryl. C 6-30 The aryl group is preferably a phenyl group, 2-5 phenyl groups are connected by direct bonds, shared one or more chemical bonds, C 1-5 The polynuclear aromatic group is a polynuclear aromatic group connected to an alkyl group, a carbonyl group, a heteroatom, an amino group, etc. The polynuclear aromatic group includes, but is not limited to, substituted or unsubstituted naphthalene, substituted or unsubstituted anthracene, substituted or unsubstituted dibenzonaphthalene, substituted or unsubstituted benzanthracene, substituted or unsubstituted dibenzoanthracene, substituted or unsubstituted biphenyl, substituted or unsubstituted benzophenone, substituted or unsubstituted fluorene, substituted or unsubstituted 9-fluorenone, etc.

[0027] As the aromatic vinyl compound, there can be mentioned styrene, methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, distyrene, vinylnaphthalene, vinyltoluene, vinylbenzyl methyl ether and the like.

[0028] The hydrocarbon compound having ethylenically unsaturated double bonds also includes (meth)acrylate compounds.

[0029] More preferably, the (meth)acrylate compound is a mixture of one or more of an alkyl (meth)acrylate compound and an aryl (meth)acrylate compound.

[0030] Furthermore, the (meth)acrylic acid alkyl ester compound contains substituted or unsubstituted C 1-25 The linear alkyl, (meth) acrylate compound contains substituted or unsubstituted C 6-30 aromatic groups, substituted or unsubstituted C 6-30of heteroaryl.

[0031] C 1-25 The linear alkyl group is preferably a long-chain alkyl group containing 15 carbon atoms or more.

[0032] Substituted or unsubstituted C 6-30 The aryl group is preferably 2-5 phenyl groups connected by direct bonds, sharing a pair or more chemical bonds, C 1-5 The polynuclear aromatic group connected to the alkyl, carbonyl, heteroatom, amino group, etc. The substituted or unsubstituted C 6-30 The heteroaryl group includes at least one heterophenyl group containing any one of N, O, and S heteroatoms.

[0033] Preferably, the alkyl (meth)acrylate compound is a monofunctional (meth)acrylate.

[0034] The alkyl (meth)acrylate compound may include, but is not limited to, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, isopropyl (meth)acrylate, and the like.

[0035] Preferably, the aryl (meth)acrylate compound includes, but is not limited to, phenyl (meth)acrylate, benzyl (meth)acrylate, toluene (meth)acrylate, naphthyl (meth)acrylate, and the like.

[0036] The "substitution" mentioned herein can be selected from aldehyde, methyl ketone, C1-C5 alkyl, hydroxyl, amine, carboxyl, amino and the like.

[0037] The heteroatom mentioned herein refers to any one or a combination of N, O, and S.

[0038] Preferably, the unsaturated carboxylic acid does not contain a phenyl group.

[0039] More preferably, the terminal unsaturated carboxylic acid having an ethylenically unsaturated double bond is selected from (meth) acrylic acid compounds, wherein the (meth) acrylic acid compound contains C 1-25 Examples include, but are not limited to, (meth)acrylic acid, (meth)butenoic acid, (meth)pentenoic acid, (meth)heptenoic acid, (meth)nonenoic acid, and the like.

[0040] Specifically, the substituted maleimide compound is selected from a monofunctional maleimide compound, a bismaleimide compound or a mixture thereof.

[0041] Preferably, the high temperature resistant resin comprises at least: any one or more monomers of (meth)acrylate compounds, any one or more monomers of aromatic vinyl compounds and / or ethylenically unsaturated carboxylic acids, and any one or more compounds of the maleimide compounds polymerized together.

[0042] In the above technical solution, the weight ratio of the hydrocarbon compound having an ethylenically unsaturated double bond segment at the end, the terminal unsaturated carboxylic acid, and the substituted maleimide compound is (5-40):(3-10):(1-10). The initiator can be any of the initiators known in the art.

[0043] In a second aspect, the present invention further provides a photocurable composition comprising at least the high temperature resistant resin.

[0044] The photocurable composition comprises the following components in parts by weight: (10-25) parts of a main resin (the high-temperature resistant resin of the present invention), (10-25) parts of a resin monomer, (0.1-5) parts of a photoinitiator (corresponding to the photopolymerization initiator of the present invention), (0.1-5) parts of an auxiliary agent, (50-70) parts of a solvent, etc.

[0045] The auxiliary agent is selected from any one or more of a pigment, a surfactant, a photoacid generator, an adhesion enhancer, a defoamer, a leveling agent, a plasticizer, an antioxidant, a stabilizer or an inhibitor.

[0046] In a third aspect, the present invention further provides an application of a photocurable composition, wherein the photocurable composition is used in a display device and can be cured by UV to form a film layer in the display device.

[0047] Display devices may include thin film transistor liquid crystal displays, organic light emitting diode displays, quantum dot light emitting diode displays, and micro light emitting diode displays.

[0048] The photocurable composition provided by the present invention is used for preparing black photoresist, color photoresist, protective film photoresist, PS spacer and the like in display devices.

[0049] The high-temperature resistant resin provided by the present invention is used in a photocurable composition. The prepared photocurable composition exhibits superior performance in terms of bonding strength, heat resistance, and chemical resistance. It is particularly suitable for use in black matrix photocurable compositions (black photoresists) for display devices. While having excellent light-shielding properties, it also maintains the high photosensitivity of the photocurable composition, allowing the black photoresist to be thoroughly cured and tightly bonded to the substrate. Optical properties such as refractive index, as well as mechanical properties such as heat resistance, impact resistance, and hardness are all superior. Application of such photocurable compositions results in smooth films with complete and clear patterns. DETAILED DESCRIPTION

[0050] The principles and features of the present invention are described below. The examples are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. In the examples, where specific conditions are not specified, the experiments were performed under conventional conditions or the conditions recommended by the manufacturer. All reagents or instruments used, where the manufacturer is not specified, are commercially available conventional products.

[0051] Resin Preparation Example 1:

[0052] S1: Add 12 parts by weight of propylene glycol methyl ether acetate to a 500 ml reaction bottle, stir at 200 rpm, protect with nitrogen, and heat to 120°C;

[0053] S2: In a three-necked flask, 1 part by weight of azobisisobutyronitrile and 16 parts by weight of propylene glycol methyl ether acetate were added and stirred at 500 rpm. 15 parts by weight of butyl methacrylate, 3.8 parts by weight of styrene, and 5 parts by weight of N-naphthalenemaleimide were weighed and added to the three-necked flask. After the solution was completely dissolved, 5 parts by weight of methacrylic acid was added to the reaction flask, stirred for 15 minutes, and replaced with nitrogen three times, and stirred for 15 minutes;

[0054] S3: The solution obtained in S2 was added dropwise to the reaction bottle in S1 for 3 hours. The reaction was carried out at 120°C for 1 hour, and then the temperature was lowered to 95°C.

[0055] S4: Weigh 0.1 parts by weight of azobisisobutyronitrile, dissolve it in 2 parts by weight of propylene glycol methyl ether acetate, add it to the reaction flask, and react at 95°C for 1 hour; weigh 0.1 parts by weight of azobisisobutyronitrile again, dissolve it in 2 parts by weight of propylene glycol methyl ether acetate, add it to the reaction flask, and react at 95°C for 2 hours;

[0056] S5: cooling to 70° C., adding 38 parts by weight of propylene glycol methyl ether acetate, stirring for 1 hour, and cooling to room temperature to obtain a high temperature resistant resin (weight average molecular weight Mw is 13200).

[0057] The structural formula of N-naphthalenemaleimide is as follows:

[0058]

[0059] Resin Preparation Example 2:

[0060] The preparation method was the same as that of Example 1, except that the raw materials for Resin 2 included 5 parts by weight of methacrylic acid, 15 parts by weight of eicosyl methacrylate, 5 parts by weight of N-(5-hydroxynaphthalene)maleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 13,000.

[0061] The structural formula of N-(5-hydroxynaphthalene)maleimide is as follows:

[0062]

[0063] Resin Preparation Example 3:

[0064] The preparation method was the same as that of Example 1, except that the raw materials of Resin 3 included: 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-biphenylmaleimide, and 3.8 parts by weight of styrene. The obtained high-temperature resistant resin had a weight-average molecular weight Mw of 13,400.

[0065] The structural formula of N-biphenylmaleimide is as follows:

[0066]

[0067] Resin Preparation Example 4:

[0068] The preparation method was the same as that of Example 1, except that the raw materials for Resin 4 included 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-(3-fluorofuryl)maleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 13020.

[0069] The structural formula of N-(3-fluorofuryl)maleimide is as follows:

[0070]

[0071] Resin Preparation Example 5:

[0072] The preparation method was the same as that of Example 1, except that the raw materials of Resin 5 included 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-fluorenemaleimide, and 3.8 parts by weight of styrene. The obtained high-temperature resistant resin had a weight-average molecular weight Mw of 12,800.

[0073] The structural formula of N-fluorenemaleimide is as follows:

[0074]

[0075] Resin Preparation Example 6:

[0076] The preparation method was the same as that of Example 1, except that the raw materials for Resin 6 included 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-(9-fluorenone)maleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 13,100.

[0077] The structural formula of N-(9-fluorenone)maleimide is as follows:

[0078]

[0079] Resin Preparation Example 7:

[0080] The preparation method was the same as that of Example 1, except that the raw materials for Resin 7 included 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-benzodioxolanemaleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 12,730.

[0081] The structural formula of N-benzodioxolane maleimide is as follows:

[0082]

[0083] Resin Preparation Example 8:

[0084] The preparation method was the same as that of Example 1, except that the raw materials for Resin 8 included 5 parts by weight of methacrylic acid, 15 parts by weight of behenyl methacrylate, 5 parts by weight of N-(4-quinolyl)maleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 12,900.

[0085] The structural formula of N-(4-quinolinyl)maleimide is as follows:

[0086]

[0087] Resin Preparation Example 9:

[0088] The preparation method is the same as that of Example 1, except that the raw materials of Resin 9 include: 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-adamantane maleimide, and 3.8 parts by weight of styrene. The obtained high-temperature resistant resin has a weight-average molecular weight Mw of 13,300. The structural formula of N-adamantane maleimide is as follows:

[0089]

[0090] Resin Preparation Example 10:

[0091] The preparation method was the same as that of Example 1, except that the raw materials for resin 10 included: 5 parts by weight of methacrylic acid, 10 parts by weight of butyl methacrylate, 5 parts by weight of acrylic epoxy resin, 5 parts by weight of 1,1'-(1,4-naphthalenediyl)bismaleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 12,600.

[0092] The structural formula of 1,1'-(1,4-naphthalenediyl)bismaleimide is as follows:

[0093]

[0094] Resin Preparation Example 11:

[0095] The preparation method was the same as that of Example 1, except that the raw materials for Resin 11 included: 5 parts by weight of methacrylic acid, 10 parts by weight of butyl methacrylate, 5 parts by weight of acrylic epoxy resin, 5 parts by weight of 1,1'-[methylenebis(2-methyl-4,1-cyclohexadienyl)]bismaleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 13250.

[0096] The structural formula of 1,1'-[methylenebis(2-methyl-4,1-cyclohexadienyl)]bismaleimide is as follows:

[0097]

[0098] Resin Preparation Example 12:

[0099] The preparation method was the same as that of Example 4, except that the raw materials for resin 12 included 5 parts by weight of methacrylic acid, 15 parts by weight of eicosyl methacrylate, 5 parts by weight of N-(3-fluorofuryl)maleimide, and 3.8 parts by weight of styrene. The resulting high-temperature-resistant resin had a weight-average molecular weight (Mw) of 13,200.

[0100] Resin Comparative Example 1:

[0101] The preparation method was the same as that of Example 1, except that the raw materials of the resin comparative example 1 included: 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-phenylmaleimide, and 3.8 parts by weight of styrene. The obtained high-temperature resistant resin had a weight-average molecular weight Mw of 12,700.

[0102] The structural formula of N-phenylmaleimide is as follows:

[0103]

[0104] Resin Comparative Example 2:

[0105] The preparation method was the same as that of Example 1, except that the raw materials for Comparative Example 2 included 5 parts by weight of methacrylic acid, 15 parts by weight of butyl methacrylate, 5 parts by weight of N-cyclohexylmaleimide, and 3.8 parts by weight of styrene. The resulting high-temperature resistant resin had a weight-average molecular weight (Mw) of 13,300.

[0106] The structural formula of N-cyclohexylmaleimide is as follows:

[0107]

[0108] Preparation Example 1 of Photocurable Composition:

[0109] 60 parts by weight of propylene glycol methyl ether acetate, 10 parts by weight of high temperature resistant resin 1, 19 parts by weight of butyl methacrylate, 7 parts by weight of bisether fluorene acrylate and 2 parts by weight of polyether modified polydimethylsiloxane were added into a reaction kettle and stirred. The temperature was controlled at about 35° C. and stirred evenly. Then, 2 parts by weight of isopropylthioxanthone (ITX) was added and stirred evenly to obtain a photocurable composition.

[0110] Preparation Examples 2-12 of Photocurable Compositions

[0111] The preparation process is the same as Example 1 of the photocurable composition, except that the high temperature resistant resins of Examples 2 to 12 are used to replace the high temperature resistant resin of Example 1.

[0112] Preparation Example 13 of Photocurable Composition:

[0113] 60 parts by weight of propylene glycol methyl ether acetate, 10 parts of high temperature resistant resin 1, 15 parts by weight of butyl methacrylate, 7 parts by weight of bisether fluorene acrylate and 2 parts by weight of polyether modified polydimethylsiloxane were added into a reaction kettle and stirred. The temperature was controlled at about 35°C and stirred evenly. Then, 2 parts by weight of isopropylthioxanthone (ITX) and 4 parts by weight of carbon black were added and stirred evenly to obtain a black photocurable composition.

[0114] Comparative Example 1 of Photocurable Composition:

[0115] The method is the same as Example 1 for preparing the photocurable composition, except that the resin of Resin Comparative Example 1 is used instead of the high temperature resistant resin.

[0116] Comparative Example 2 of Photocurable Composition:

[0117] The method is the same as Example 1 for preparing the photocurable composition, except that the resin of Resin Comparative Example 2 is used instead of the high temperature resistant resin.

[0118] Comparative Example 3 of Photocurable Composition:

[0119] The method is the same as Example 13 for preparing the photocurable composition, except that the resin of Resin Comparative Example 1 is used instead of the high temperature resistant resin.

[0120] Performance testing:

[0121] Thermal decomposition temperature: The thermal decomposition temperature of the samples was measured using a thermogravimetric-differential thermal analyzer under a N2 atmosphere.

[0122] Sensitivity: Stick the dry film on the copper-clad board and use a 41-level Stouffer exposure ruler to measure the sensitivity. Use 2 times the shortest development time as the residence time in the developer chamber. The level that retains at least 50% of the photopolymer is the maintenance level, which is recorded as the sensitivity. The exposure energy required for a sensitivity of level 23 is the photosensitivity.

[0123] Contrast: Contrast is tested according to GB / T 43793.2-2024.

[0124] OD value: A 100 mm square PC substrate was cleaned with pure water and dried in a 160°C oven. The black photosensitive resin composition obtained in Example 13 and Comparative Example 3 was applied to the dried glass substrate using a spin coater. After UV curing, a 10 μm thick coating film was obtained, which served as the test sample. OD value was measured using an optical densitometer.

[0125] The test results are shown in Table 1 below:

[0126] Table 1

[0127]

[0128]

[0129] As can be seen from the table above, with reference to Examples 1-13 and D1-3, the photocurable compositions prepared from the heat-resistant resins provided by the present invention exhibit superior performance in terms of bonding strength and heat resistance. Furthermore, the prepared photoresists exhibit high sensitivity and contrast, meeting the requirements for precise patterning. With reference to Examples 13 and D3, the black photocurable compositions containing the heat-resistant resins of the present invention exhibit excellent performance in terms of transmittance and other aspects.

[0130] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high temperature resistant resin, characterized in that: At least the following raw materials are polymerized: A hydrocarbon compound, an unsaturated carboxylic acid, or a maleimide compound having an olefinically unsaturated double bond at the end; wherein the hydrogen atom connected to nitrogen on the functional group of the maleimide compound is replaced by a substituted or unsubstituted polynuclear cyclic hydrocarbon group.

2. The high temperature resistant resin according to claim 1, characterized in that: The polynuclear cyclic hydrocarbon group is any one of a polynuclear aromatic hydrocarbon group, a polynuclear heteroaromatic hydrocarbon group or a polynuclear alicyclic hydrocarbon group.

3. The high temperature resistant resin according to claim 2, characterized in that: The polynuclear aromatic hydrocarbon group comprises two or more substituted or unsubstituted six-membered aromatic rings, and the six-membered aromatic rings are connected by one or more of a single bond, an alkyl group having 1 to 5 carbon atoms, a carbonyl group, a heteroatom, or a pair of shared chemical bonds; The polynuclear heteroaromatic hydrocarbon group comprises a five-membered heterocyclic ring or a six-membered heterocyclic ring, and the five-membered heterocyclic ring or the six-membered heterocyclic ring is connected to at least one or more substituted or unsubstituted six-membered aromatic rings via a single bond, or by sharing one or more chemical bonds; The polynuclear alicyclic hydrocarbon group comprises two or more substituted or unsubstituted five-membered or six-membered alicyclic rings, and the alicyclic rings are connected by single bonds, or by sharing one or more chemical bonds.

4. The high temperature resistant resin according to claim 1, characterized in that: The ethylenically unsaturated double bond is selected from a (meth)vinyl group, a (meth)propylene group or a (meth)acrylate group.

5. The high temperature resistant resin according to claim 1, characterized in that: The hydrocarbon compound having an ethylenically unsaturated double bond at the terminal includes at least one monomer containing a substituted or unsubstituted phenyl group.

6. The high temperature resistant resin according to claim 4, characterized in that: The hydrocarbon compound having an ethylenically unsaturated double bond at the end includes at least a (meth)acrylate monomer, and the (meth)acrylate monomer contains a substituted or unsubstituted C 1-25 Linear alkyl, substituted or unsubstituted C 6-30 aromatic groups, substituted or unsubstituted C 6-30 of heteroaryl.

7. The high temperature resistant resin according to claim 1, characterized in that: The unsaturated carboxylic acid does not contain a phenyl group.

8. The high temperature resistant resin according to claim 1, characterized in that: The substituted maleimide compound is selected from a monofunctional maleimide compound, a bismaleimide compound or a mixture thereof.

9. A photocurable composition, characterized in that: The invention comprises the high temperature resistant resin according to any one of claims 1 to 8, a resin monomer, a photopolymerization initiator, an auxiliary agent and a solvent.

10. A use of the photocurable composition according to claim 9, characterized in that: Forming film layers in display devices.

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