Moire fringe-based photoetching alignment system and method

By combining the moiré fringe lithography alignment system with geometric imaging and moiré fringe precision alignment, the problems of insufficient lithography alignment accuracy and high complexity of interference alignment are solved, achieving high-precision, low-cost nanometer-level positioning, which is suitable for emerging technologies such as three-dimensional integrated circuits.

CN120704080APending Publication Date: 2025-09-26PUYU TECHNOLOGY (SUZHOU) CO LTD
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Patent Information

Application Number
CN202510957032.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-01-21
Filing Date
2025-07-11
Publication Date
2025-09-26

AI Technical Summary

Technical Problem

Existing photolithography alignment technology is difficult to achieve sub-wavelength accuracy, and the interference alignment scheme is highly complex and costly, which cannot meet the high precision and low cost requirements of emerging technologies such as three-dimensional integrated circuits.

Method used

A lithography alignment system based on moiré fringe is adopted, which combines geometric imaging with moiré fringe precision alignment, uses complementary cross marks and telecentric lenses, and calculates position deviations through fast Fourier transform to achieve nanometer-level positioning.

Benefits of technology

It breaks through the optical diffraction limit, achieves 10-100 nanometer alignment accuracy, reduces system complexity and cost, is suitable for compact lithography machines, and improves alignment efficiency and robustness.

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Abstract

The invention belongs to the technical field of photoetching for manufacturing micro-nano devices, and particularly relates to a photoetching alignment system and method based on Morie fringes. The system comprises a template and a substrate, wherein the surfaces of the template and the substrate are respectively provided with coarse alignment marks distributed at four corners and Moire fringe marks distributed at four sides; the illumination imaging unit comprises a camera, a telecentric lens group and a coaxial light source; the displacement mechanism drives the template or the substrate to move. The method comprises the following steps of: coarsely aligning to precision through geometric imaging of a cross mark, overlapping a Morie fringe mark to form a fringe with an amplified displacement effect, calculating deviation through phase analysis, and returning to zero. According to the invention, the optical diffraction limit is broken through, the alignment precision of 10-100 nm is realized, and the complexity and high cost of a traditional interference system are avoided.
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