A double optical path refractive measurement type precision leveling machining platform and a working method thereof

Abstract

The application provides a double-optical-path refractive measurement type precision leveling machining platform and a working method thereof, and belongs to the technical field of ultra-precision plane machining equipment. In order to solve the problems of low machining precision and low efficiency of the existing plane machining, the machining platform comprises a supporting table, a machining device, a limiting component, a positioning component and a leveling component. The workpiece to be machined is placed on the machining device, and the limiting component can prevent the workpiece to be machined from rotating. The positioning component comprises a first laser emitter, a first photosensitive position sensor, a second laser emitter, a second photosensitive position sensor and a double-face transmission mirror. The positioning component can detect whether the workpiece to be machined is horizontal. The leveling component can adjust the inclination angle between the workpiece to be machined and the horizontal plane. The machining platform can realize plane machining of the workpiece to be machined, detect whether the workpiece to be machined is horizontal and level the workpiece to be machined, realize real-time monitoring and correction, and improve machining precision and machining efficiency.

Description

Technical Field

[0001] This invention belongs to the technical field of ultra-precision planar machining equipment, and in particular relates to a dual-optical-path refraction measurement type precision leveling machining platform and its working method. Background Technology

[0002] In existing technologies, the precision machining of large and heavy workpieces such as grinding plates typically involves placing the workpiece above a grinding wheel or similar machining device, relying on its own weight to press it onto the grinding wheel, and using centerless grinding to machine the bottom surface of the workpiece. This approach presents three significant technical bottlenecks: First, large and heavy workpieces relying solely on their own weight to press onto the grinding wheel are prone to asymmetric deformation under free gravity, easily leading to deviations in the flatness of the machined surface from design tolerances. Second, traditional mechanical leveling mechanisms are limited by the clearances of moving parts and the rigidity of the transmission, making it difficult to achieve high-precision dynamic compensation. Third, the workpiece needs to be removed from the grinding wheel for precision inspection; if it does not meet the standards, it must be placed back on the grinding wheel for reprocessing. This off-site inspection method easily leads to deformation errors, and traditional machining methods lack real-time closed-loop monitoring, making it impossible to correct for reference surface offsets caused by dynamic disturbances such as temperature deformation and stress release in real time. Summary of the Invention

[0003] In view of this, in order to solve the above-mentioned technical problems, the present invention proposes a dual-optical-path refraction measurement precision leveling processing platform and its working method.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A dual-optical-path refraction measurement type precision leveling machining platform includes:

[0006] Support platform;

[0007] The processing device is placed on a support platform, and the workpiece to be processed is placed on the processing device. The processing device is used to process the lower surface of the workpiece to be processed into a plane.

[0008] Limiting components are used to prevent the workpiece from rotating.

[0009] The positioning assembly comprises a first laser emitter, a first photosensitive position sensor, a double-face transmission mirror, a second laser emitter and a second photosensitive position sensor, the double-face transmission mirror is fixedly arranged above the workpiece to be machined, the first laser emitter, the double-face transmission mirror and the first photosensitive position sensor are sequentially arranged on a first straight line, and the laser emitted by the first laser emitter can be projected to the first photosensitive position sensor through refraction of the double-face transmission mirror; the second laser emitter, the double-face transmission mirror and the second photosensitive position sensor are sequentially arranged on a second straight line, the first straight line and the second straight line are arranged perpendicularly, and the laser emitted by the second laser emitter can be projected to the second photosensitive position sensor through refraction of the double-face transmission mirror.

[0010] The leveling assembly comprises a plurality of leveling structures, the plurality of leveling structures are arranged at intervals along the circumference of the workpiece to be machined, the leveling structures abut against the upper surface of the workpiece to be machined, and the position of the workpiece to be machined on the Z-axis can be adjusted so that the inclination angle between the workpiece to be machined and the horizontal plane can be adjusted by cooperation of the plurality of leveling structures.

[0011] As a preferred scheme of the above-mentioned double-light-path refraction measurement type precision leveling machining platform, the leveling structure comprises a support, a support rod, a piezoelectric ceramic actuator and a flexible pressing head, the support is arranged on the support table, one end of the support rod is rotatably arranged on the support, the other end is fixedly connected with the piezoelectric ceramic actuator, and the flexible pressing head is wrapped outside the piezoelectric ceramic actuator and abuts against the upper surface of the workpiece to be machined.

[0012] As a preferred scheme of the above-mentioned double-light-path refraction measurement type precision leveling machining platform, a pressure sensor is arranged on the support rod, and the pressure sensor is used for detecting the pressure of the flexible pressing head on the workpiece to be machined.

[0013] As a preferred scheme of the above-mentioned double-light-path refraction measurement type precision leveling machining platform, the limiting assembly comprises a plurality of limiting structures, the plurality of limiting structures are arranged at intervals along the circumference of the workpiece to be machined, and the limiting structure comprises a base and two telescopic rods, the base is fixedly arranged on the support table, and the two telescopic rods are fixedly arranged on the base and abut against the side surface of the workpiece to be machined.

[0014] As a preferred scheme of the above-mentioned double-light-path refraction measurement type precision leveling machining platform, the double-light-path refraction measurement type precision leveling machining platform further comprises two first adjusting platforms and two second adjusting platforms, the two first adjusting platforms are arranged below the first photosensitive position sensor and the first laser emitter respectively, and are used for adjusting the first photosensitive position sensor and the first laser emitter to be consistent with the height of the center of the double-face transmission mirror and correspond in position; and the two second adjusting platforms are arranged below the second photosensitive position sensor and the second laser emitter respectively, and are used for adjusting the second photosensitive position sensor and the second laser emitter to be consistent with the height of the center of the double-face transmission mirror and correspond in position.

[0015] As a preferred scheme of the above-mentioned double-optical-path refraction measurement type precision leveling machining platform, the double-optical-path refraction measurement type precision leveling machining platform further comprises an inclination measuring instrument capable of detecting the included angle between the table top of the support table and the horizontal plane.

[0016] As a preferred scheme of the above-mentioned double-optical-path refraction measurement type precision leveling machining platform, the double-optical-path refraction measurement type precision leveling machining platform further comprises a table top leveling mechanism arranged between the support table and the ground and capable of adjusting the inclination between the table top of the support table and the horizontal plane.

[0017] As a preferred scheme of the above-mentioned double-optical-path refraction measurement type precision leveling machining platform, the double-optical-path refraction measurement type precision leveling machining platform further comprises a vibration isolator arranged between the table top leveling mechanism and the ground.

[0018] As a preferred scheme of the above-mentioned double-optical-path refraction measurement type precision leveling machining platform, the double-face transmission mirror is bonded above the workpiece to be machined.

[0019] The application further provides a working method of the double-optical-path refraction measurement type precision leveling machining platform, which adopts the above-mentioned double-optical-path refraction measurement type precision leveling machining platform and comprises the following steps.

[0020] The machining device performs planar machining on the entire lower surface of the workpiece to be machined.

[0021] The laser emitted by the first laser emitter is refracted by the double-face transmission mirror and projected to the first photosensitive position sensor, forming a first light spot, and the inclination between the workpiece to be machined and the horizontal plane in the first direction is determined according to the position of the first light spot.

[0022] The laser emitted by the second laser emitter is refracted by the double-face transmission mirror and projected to the second photosensitive position sensor, forming a second light spot, and the inclination between the workpiece to be machined and the horizontal plane in the second direction is determined according to the position of the second light spot.

[0023] According to the inclination between the workpiece to be machined and the horizontal plane in the first direction and the inclination between the workpiece to be machined and the horizontal plane in the second direction, the leveling assembly adjusts the workpiece to be machined to be parallel to the horizontal plane while the machining device is machining the workpiece to be machined.

[0024] Compared with the prior art, the double-optical-path refraction measurement type precision leveling machining platform and the working method thereof have the following beneficial effects:

[0025] This invention provides a dual-path refraction measurement precision leveling machining platform and its working method. The platform employs a collaborative mechanism between an orthogonal dual-path laser emitter and a photosensitive position sensor (PSD). Two sets of spatially orthogonally distributed collimated laser beams are projected onto the PSD via a high-precision double-sided transmission mirror. When the workpiece is ideally horizontal, the laser beam follows a perpendicular incident-perpendicular optical path characteristic; that is, the incident light is perpendicular to the double-sided transmission mirror, and the emitted light is also perpendicular to the double-sided transmission mirror. The light passing through the double-sided transmission mirror projects onto the PSD, forming a spot. The position of the spot when the workpiece is horizontal is pre-recorded. If the workpiece is tilted, the double-sided transmission mirror will produce a refraction effect, causing the laser spot position on the target surface of the PSD to shift relative to the pre-recorded spot position. Based on this shift, the workpiece is leveled using a leveling assembly. Multiple leveling structures directly adjust the Z-axis position of different positions on the workpiece, thereby restoring the workpiece to parallel to the horizontal plane. The limiting component prevents the workpiece from rotating due to the machining device. While the machining device performs planar machining on the workpiece, the positioning component detects whether the workpiece is parallel to the horizontal plane. If the workpiece is not parallel, the leveling component directly levels it. This dual-optical-path refraction measurement precision leveling machining platform constructs a closed-loop dynamic leveling system based on photoelectric sensing. By integrating a dual-axis optical detection module and a multi-axis linkage drive mechanism, it achieves real-time correction of the machined surface, improving machining accuracy and efficiency.

[0026] In this dual-path refraction measurement precision leveling machining platform, the workpiece to be processed is pressed onto the machining device by a leveling component. The different positions of the workpiece are controlled to move along the Z-axis, thereby leveling the workpiece. Compared to existing technologies where the workpiece relies solely on its own weight to press against the grinding wheel, this ensures the flatness of the machined surface meets requirements. Furthermore, the leveling component directly contacts the top of the workpiece, directly controlling its movement along the Z-axis for leveling. This eliminates limitations imposed by kinematic pair clearances and transmission rigidity, enabling high-precision dynamic compensation. This dual-path refraction measurement precision leveling machining platform allows for simultaneous horizontal detection and leveling of the workpiece during planar machining, eliminating the need to remove the workpiece from the machining device for precision testing. This prevents deformation errors, resulting in higher machining accuracy. Moreover, this real-time closed-loop monitoring method can correct for reference surface offsets caused by dynamic disturbances such as temperature deformation and stress release. Attached Figure Description

[0027] The accompanying drawings, which form a part of this application, are included to provide a further understanding of the application, illustrate the preferred embodiments of the application and assist in

[0028] Figure 1 is a structural schematic diagram of a double-optical-path refractive measurement type precision leveling machining platform provided by the embodiment of the application;

[0029] Figure 2 is a structural schematic diagram of a double-optical-path refractive measurement type precision leveling machining platform provided by the embodiment of the application; Figure 1 is an enlarged view of A in FIG. 4;

[0030] Figure 3 is a structural schematic diagram of a double-optical-path refractive measurement type precision leveling machining platform provided by the embodiment of the application;

[0031] Figure 4 is a structural schematic diagram of a double-optical-path refractive measurement type precision leveling machining platform provided by the embodiment of the application;

[0032] Figure 5 is a schematic diagram of establishing a coordinate system with the center of the workpiece to be machined as the center;

[0033] Figure 6 is a schematic diagram of the path of the laser beam when the workpiece to be machined is horizontal;

[0034] Figure 7 is a schematic diagram of the path of the laser beam when the workpiece to be machined is inclined.

[0035] in the drawings:

[0036] 1, support table;

[0037] 21, first laser emitter; 22, first photosensitive position sensor; 23, second laser emitter; 24, second photosensitive position sensor; 25, double-face transmission mirror;

[0038] 31, first leveling structure; 32, second leveling structure; 33, third leveling structure; 34, fourth leveling structure; 301, support; 302, support rod; 303, flexible pressure head;

[0039] 4, inclination measuring instrument;

[0040] 5, vibration isolator;

[0041] 6, table leveling mechanism;

[0042] 7, workpiece to be machined;

[0043] 8, machining device;

[0044] 91, base; 92, telescopic rod;

[0045] 10. the first adjustment platform;

[0046] 11. the second adjustment platform. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0048] In the description of the present application, unless otherwise explicitly specified and limited, the terms “connected”, “connected”, “fixed” should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrated; can be mechanically connected, can be electrically connected; can be directly connected, can be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] In the present application, unless otherwise explicitly specified and limited, the first feature is “on” or “under” the second feature, which can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature “on”, “above” and “above” the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature “under”, “below” and “below” the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0050] In the description of the present embodiment, the terms “up”, “down”, “right”, and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, which is only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms “first” and “second” are only used to distinguish in description, and have no special meaning.

[0051] Reference is made to Figures 1-7The application provides a double-optical-path refraction measurement type precision leveling machining platform and a working method thereof. The double-optical-path refraction measurement type precision leveling machining platform comprises a supporting table 1, a machining device 8, a limiting assembly, a positioning assembly and a leveling assembly. The machining device 8 is placed on the supporting table 1, a workpiece 7 to be machined is placed on the machining device 8, and the machining device 8 is used for machining a lower surface of the workpiece 7 to be machined into a plane. The limiting assembly is used for preventing the workpiece 7 to be machined from rotating. The positioning assembly comprises a first laser emitter 21, a first photosensitive position sensor 22, a second laser emitter 23, a second photosensitive position sensor 24 and a double-face transmission mirror 25. The double-face transmission mirror 25 is fixedly arranged above the workpiece 7 to be machined. The first laser emitter 21, the double-face transmission mirror 25 and the first photosensitive position sensor 22 are sequentially arranged on a first straight line. Laser emitted by the first laser emitter 21 can be projected to the first photosensitive position sensor 22 through refraction of the double-face transmission mirror 25. The second laser emitter 23, the double-face transmission mirror 25 and the second photosensitive position sensor 24 are sequentially arranged on a second straight line. The first straight line and the second straight line are arranged perpendicularly. Laser emitted by the second laser emitter 23 can be projected to the second photosensitive position sensor 24 through refraction of the double-face transmission mirror 25. The leveling assembly comprises a plurality of leveling structures. The leveling structures are arranged at intervals along a circumferential direction of the workpiece 7 to be machined. The leveling structures abut against an upper surface of the workpiece 7 to be machined. The position of the workpiece 7 to be machined on a Z axis can be adjusted, so that the inclination between the workpiece 7 to be machined and a horizontal plane can be adjusted by cooperation of the leveling structures.

[0052] In the double light path refraction measurement type precision leveling machining platform, the orthogonal double light laser emitter and the photosensitive position sensor (PSD) work in cooperation, two groups of space orthogonal collimated laser beams are projected to the photosensitive position sensor through high-precision transmission lenses. When the workpiece 7 to be processed is in the ideal horizontal state, the laser beams follow the light path characteristics of vertical incidence-vertical emission, that is, the incident light is perpendicular to the double-sided transmission lens 25, and the emitted light is also perpendicular to the double-sided transmission lens 25. The light spot formed by the light passing through the double-sided transmission lens 25 on the photosensitive position sensor is pre-recorded as the position of the light spot when the workpiece 7 to be processed is in the horizontal state. If the workpiece 7 to be processed is tilted, the double-sided transmission lens 25 will produce a refraction effect, causing the position of the laser spot on the target surface of the photosensitive position sensor to deviate from the pre-recorded light spot position. According to the deviation, the leveling assembly adjusts the workpiece 7 to be processed in the Z-axis direction. Multiple leveling structures directly adjust the positions of the workpiece 7 to be processed at different positions in the Z-axis direction, so as to adjust the workpiece 7 to be processed to be parallel to the horizontal plane again. The limiting assembly can prevent the workpiece 7 to be processed from being rotated by the machining device 8. While the machining device 8 processes the workpiece 7 to be processed, the positioning assembly detects whether the workpiece 7 to be processed is parallel to the horizontal plane. If the workpiece 7 to be processed is not parallel to the horizontal plane, the leveling assembly directly adjusts the workpiece 7 to be processed. The double light path refraction measurement type precision leveling machining platform constructs a closed-loop dynamic leveling system based on photoelectric sensing. Through the integration of a double-axis optical detection module and a multi-axis linkage driving mechanism, real-time correction of the machined surface can be realized, which can improve the machining precision and efficiency.

[0053] In the double light path refraction measurement type precision leveling machining platform, the leveling assembly presses the workpiece 7 to be processed on the machining device 8, controls the movement of different positions of the workpiece 7 to be processed in the Z-axis direction, and adjusts the workpiece 7 to be processed. Compared with the prior art in which the workpiece is only pressed on the grinding wheel by its own gravity, the flatness of the machined surface of the workpiece 7 to be processed can meet the requirements. Moreover, the leveling assembly directly contacts the upper part of the workpiece 7 to be processed, and adjusts the workpiece 7 to be processed by directly controlling the movement of different positions of the workpiece 7 to be processed in the Z-axis direction, which is not limited by the joint clearance and transmission stiffness, and can realize high-precision dynamic compensation. The double light path refraction measurement type precision leveling machining platform can detect and level the workpiece 7 to be processed while the machining device 8 processes the workpiece 7 to be processed. Therefore, the workpiece 7 to be processed does not need to be removed from the machining device 8 for precision detection, so that deformation error is avoided, the machining precision is higher, and the real-time closed-loop monitoring method can correct the reference surface deviation caused by dynamic interference such as temperature deformation and stress release.

[0054] The double-sided transmission mirror 25 is placed in contact above the workpiece 7, which is placed on the processing device 8 and has undergone rough machining of its surface. This dual-path refraction measurement precision leveling processing platform is suitable for correcting the flatness of both sides of the workpiece 7 after rough machining, as well as for roughing and shaping a single surface. It is suitable for nanoscale planar machining of large-size, high-density workpieces such as cast iron plates and semiconductor wafers. This technology can be extended to fields such as optical component coating and precision measuring tools.

[0055] The specific structure and working principle of the photosensitive position sensor are existing technologies and will not be described in detail here.

[0056] It is understandable that the workpiece 7 to be processed is set perpendicular to the double-sided transmission mirror 25.

[0057] In this embodiment, the processing device 8 is a polishing machine or a grinding wheel.

[0058] In this embodiment, the double-sided transmission mirror 25 is a rectangular three-dimensional glass, and its specific structure is existing technology, which will not be described in detail here.

[0059] Optionally, the double-sided transmission mirror 25 is bonded to the top of the workpiece 7 to be processed. In this embodiment, the double-sided transmission mirror 25 is bonded to the workpiece 7 to be processed with adhesive.

[0060] Optionally, the leveling structure includes a support 301, a support rod 302, a piezoelectric ceramic actuator, and a flexible pressure head 303. The support 301 is disposed on the support platform 1. One end of the support rod 302 is rotatably disposed on the support 301, and the other end is fixedly connected to the piezoelectric ceramic actuator. The flexible pressure head 303 covers the outside of the piezoelectric ceramic actuator and abuts against the upper surface of the workpiece 7 to be processed.

[0061] One end of the support rod 302 is rotatably mounted on the support 301, allowing the rotating bracket to adjust the contact position between the flexible pressure head 303 and the workpiece 7. The piezoelectric ceramic actuator can extend or retract, thus directly pressing down on the workpiece 7 without requiring other transmission structures. It is not limited by the clearance of the moving parts or the rigidity of the transmission, and can achieve high-precision dynamic compensation. The flexible pressure head 303 acts as a buffer between the piezoelectric ceramic actuator and the workpiece 7, preventing rigid collisions.

[0062] like Figure 5 As shown, in this embodiment, there are four leveling structures, namely the first leveling structure 31, the second leveling structure 32, the third leveling structure 33, and the fourth leveling structure 34. A coordinate system is established with the center of the workpiece 7 to be processed as the center. The first leveling structure 31, the second leveling structure 32, the third leveling structure 33, and the fourth leveling structure 34 are located in the first quadrant, the second quadrant, the third quadrant, and the fourth quadrant, respectively.

[0063] As shown in Figures 5-7 recorded on the photosensitive position sensor when the workpiece 7 is horizontal, when the workpiece 7 is tilted, the double-face transmission mirror 25 will produce a refraction effect, causing the position of the light spot on the photosensitive position sensor to shift. After the shift is converted into an optical-electric signal, an error feedback is formed, and the leveling assembly can drive the piezoelectric actuators of the leveling structures in the four quadrants to implement nanoscale displacement compensation. For example, as shown in Figures 5-7 when the double-face transmission mirror 25 is detected to tilt in the negative direction of the X axis, the position of the light spot on the photosensitive position sensor will shift upward, and the photosensitive position sensor captures the light spot displacement signal. The piezoelectric actuators of the first leveling structure 31 and the fourth leveling structure 34 apply a downward force to the workpiece 7, i.e., perform negative displacement compensation in the Z axis direction to the workpiece 7, while the piezoelectric actuators of the second leveling structure 32 and the third leveling structure 33 perform reverse displacement adjustment, thereby leveling the workpiece 7.

[0064] Optionally, the support rod 302 is provided with a pressure sensor for detecting the pressure of the flexible pressure head 303 on the workpiece 7.

[0065] Optionally, the limiting assembly includes a plurality of limiting structures, which are arranged at intervals along the circumference of the workpiece 7. The limiting structure includes a base 91 and two telescopic rods 92. The base 91 is fixedly arranged on the support table 1, and the two telescopic rods 92 are arranged at intervals and fixedly arranged on the base 91. Both of the two telescopic rods 92 abut against the side surface of the workpiece 7. The limiting assembly can prevent the workpiece 7 from rotating with the machining device 8, so that the workpiece 7 can only move in the Z axis direction.

[0066] Optionally, the double-optical-path refraction measurement type precision leveling machining platform further includes two first adjustment platforms 10 and two second adjustment platforms 11. The two first adjustment platforms 10 are arranged below the first photosensitive position sensor 22 and the first laser emitter 21, respectively, for adjusting the first photosensitive position sensor 22 and the first laser emitter 21 to be consistent with the height of the center of the double-face transmission mirror 25 and correspond in position. The two second adjustment platforms 11 are arranged below the second photosensitive position sensor 24 and the second laser emitter 23, respectively, for adjusting the second photosensitive position sensor 24 and the second laser emitter 23 to be consistent with the height of the center of the double-face transmission mirror 25 and correspond in position.

[0067] The two first adjustment platforms 10 can drive the first photosensitive position sensor 22 and the first laser emitter 21 to move in the horizontal direction, so that the positions of the first photosensitive position sensor 22 and the first laser emitter 21 correspond, that is, the first photosensitive position sensor 22, the double-sided transmission mirror 25 and the first laser emitter 21 are on the first straight line, and the two first adjustment platforms 10 can also drive the first photosensitive position sensor 22 and the first laser emitter 21 to move in the vertical direction, so that the first photosensitive position sensor 22 and the first laser emitter 21 are adjusted to be consistent with the height of the center of the double-sided transmission mirror 25.

[0068] The two second adjustment platforms 11 can drive the second photosensitive position sensor 24 and the second laser emitter 23 to move in the horizontal direction, so that the positions of the second photosensitive position sensor 24 and the second laser emitter 23 correspond, that is, the second photosensitive position sensor 24, the double-sided transmission mirror 25 and the second laser emitter 23 are on the second straight line, and the two second adjustment platforms 11 can also drive the second photosensitive position sensor 24 and the second laser emitter 23 to move in the vertical direction, so that the second photosensitive position sensor 24 and the second laser emitter 23 are adjusted to be consistent with the height of the center of the double-sided transmission mirror 25.

[0069] Optionally, the double-optical-path refraction measurement type precision leveling processing platform further comprises an inclination measuring instrument 4 capable of detecting the included angle between the table top of the support table 1 and the horizontal plane. Optionally, the double-optical-path refraction measurement type precision leveling processing platform further comprises a table top leveling mechanism 6 arranged between the support table 1 and the ground and capable of adjusting the inclination between the table top of the support table 1 and the horizontal plane. The inclination measuring instrument 4 cooperates with the table top leveling mechanism 6 to adjust the table top of the support table 1 to be parallel to the horizontal plane.

[0070] Optionally, the double-optical-path refraction measurement type precision leveling processing platform further comprises a vibration isolator 5 arranged between the table top leveling mechanism 6 and the ground. The vibration isolator 5 can prevent the vibration of the ground from being transmitted to the table top of the support table 1, so as to avoid the influence of the vibration on the detection results of the first photosensitive position sensor 22 and the second photosensitive position sensor 24.

[0071] Optionally, the table top of the support table 1 is a plane.

[0072] The application further provides a working method of a double-optical-path refraction measurement type precision leveling processing platform, which adopts the double-optical-path refraction measurement type precision leveling processing platform.

[0073] The processing device 8 performs plane processing on the entire lower surface of the workpiece 7 to be processed.

[0074] The laser emitted by the first laser emitter 21 is refracted by the double-face transmission lens 25 and projected to the first photosensitive position sensor 22 to form a first light spot, and according to the position of the first light spot, the inclination between the workpiece 7 to be processed and the horizontal plane in the first direction is determined.

[0075] The laser emitted by the second laser emitter 23 is refracted by the double-face transmission lens 25 and projected to the second photosensitive position sensor 24 to form a second light spot, and according to the position of the second light spot, the inclination between the workpiece 7 to be processed and the horizontal plane in the second direction is determined.

[0076] According to the inclination between the workpiece 7 to be processed and the horizontal plane in the first direction and the inclination between the workpiece 7 to be processed and the horizontal plane in the second direction, the leveling assembly adjusts the workpiece 7 to be processed to be parallel to the horizontal plane while the machining device 8 is machining the workpiece 7 to be processed.

[0077] Specifically, a coordinate system is established with the center of the workpiece 7 to be processed as the center, the first direction as the X-axis direction, and the second direction as the Y-axis direction, and the first leveling structure 31, the second leveling structure 32, the third leveling structure 33, and the fourth leveling structure 34 are located in the first quadrant, the second quadrant, the third quadrant, and the fourth quadrant, respectively.

[0078] When the double-face transmission lens 25 is inclined to the negative direction of the X-axis, the light spot position on the photosensitive position sensor will be offset upward relative to the pre-recorded light spot position, and according to the offset amount, the piezoelectric ceramic actuators of the first leveling structure 31 and the fourth leveling structure 34 are elongated to exert a downward force on the workpiece 7 to be processed, i.e., to perform displacement compensation to the negative direction of the Z-axis, while the piezoelectric ceramic actuators of the second leveling structure 32 and the third leveling structure 33 are shortened, i.e., to perform reverse displacement adjustment, thereby achieving leveling of the workpiece 7 to be processed.

[0079] When the double-face transmission lens 25 is inclined to the negative direction of the Y-axis, according to the offset amount of the light spot position on the photosensitive position sensor, the piezoelectric ceramic actuators of the first leveling structure 31 and the second leveling structure 32 are elongated to exert a downward force on the workpiece 7 to be processed, i.e., to perform displacement compensation to the negative direction of the Z-axis, while the piezoelectric ceramic actuators of the third leveling structure 33 and the fourth leveling structure 34 are shortened, i.e., to perform reverse displacement adjustment, thereby achieving leveling of the workpiece 7 to be processed.

[0080] Obviously, the above disclosed embodiments of the present application are only used to help explain the present application. The embodiments do not describe all the details and do not limit the present application to the specific embodiments described. According to the content of the present specification, many modifications and changes can be made. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and utilize the present application. It is not necessary and impossible to exhaust all the embodiments.

Claims

1. A dual-path refraction measurement type precision leveling machining platform, characterized in that, include: Support platform (1); The processing device (8) is placed on the support table (1), and the workpiece (7) to be processed is placed on the processing device (8). The processing device (8) is used to process the lower surface of the workpiece (7) to be processed into a plane. A limiting component is used to prevent the workpiece (7) to be processed from rotating; The positioning component includes a first laser emitter (21), a first photosensitive position sensor (22), a second laser emitter (23), a second photosensitive position sensor (24), and a double-sided transmission mirror (25). The double-sided transmission mirror (25) is fixedly disposed above the workpiece (7) to be processed. The first laser emitter (21), the double-sided transmission mirror (25), and the first photosensitive position sensor (22) are sequentially located on a first straight line. The laser emitted by the first laser emitter (21) is refracted by the double-sided transmission mirror (25) and projected onto the first photosensitive position sensor (22). The second laser emitter (23), the double-sided transmission mirror (25), and the second photosensitive position sensor (24) are sequentially located on a second straight line. The first straight line and the second straight line are perpendicular to each other. The laser emitted by the second laser emitter (23) is refracted by the double-sided transmission mirror (25) and projected onto the second photosensitive position sensor (24). The leveling component includes multiple leveling structures, which are spaced apart circumferentially along the workpiece (7) to be processed. The leveling structures abut against the upper surface of the workpiece (7) to be processed, and can adjust the position of the workpiece (7) on the Z-axis so that the multiple leveling structures can cooperate to adjust the tilt angle between the workpiece (7) to be processed and the horizontal plane.

2. The dual-optical-path refraction measurement precision leveling machining platform according to claim 1, characterized in that: The leveling structure includes a support (301), a support rod (302), a piezoelectric ceramic actuator, and a flexible pressure head (303). The support (301) is set on the support platform (1). One end of the support rod (302) is rotatably set on the support (301), and the other end is fixedly connected to the piezoelectric ceramic actuator. The flexible pressure head (303) covers the outside of the piezoelectric ceramic actuator and abuts against the upper surface of the workpiece (7) to be processed.

3. The dual-optical-path refraction measurement precision leveling machining platform according to claim 2, characterized in that: The support rod (302) is equipped with a pressure sensor, which is used to detect the pressure of the flexible pressure head (303) on the workpiece (7) to be processed.

4. The dual-optical-path refraction measurement precision leveling machining platform according to claim 1, characterized in that: The limiting component includes multiple limiting structures, which are spaced apart along the circumference of the workpiece (7) to be processed. Each limiting structure includes a base (91) and two telescopic rods (92). The base (91) is fixedly mounted on the support platform (1), and both telescopic rods (92) are fixedly mounted on the base (91). Both telescopic rods (92) abut against the side of the workpiece (7) to be processed.

5. The dual-optical-path refraction measurement precision leveling machining platform according to claim 1, characterized in that: It also includes two first adjustment platforms (10) and two second adjustment platforms (11). The two first adjustment platforms (10) are respectively disposed below the first photosensitive position sensor (22) and the first laser emitter (21), and are used to adjust the first photosensitive position sensor (22) and the first laser emitter (21) to be at the same height and in the same position as the center of the double-sided transmission mirror (25). The two second adjustment platforms (11) are respectively disposed below the second photosensitive position sensor (24) and the second laser emitter (23), and are used to adjust the second photosensitive position sensor (24) and the second laser emitter (23) to be at the same height and in the same position as the center of the double-sided transmission mirror (25).

6. The dual-optical-path refraction measurement precision leveling machining platform according to claim 1, characterized in that: It also includes an inclination measuring instrument (4), which can detect the angle between the platform surface of the support (1) and the horizontal plane.

7. The dual-optical-path refraction measurement precision leveling machining platform according to claim 1, characterized in that: It also includes a table leveling mechanism (6), which is located between the support platform (1) and the ground and can adjust the tilt angle between the table surface of the support platform (1) and the horizontal plane.

8. The dual-optical-path refraction measurement precision leveling machining platform according to claim 7, characterized in that: It also includes a vibration isolator (5), which is installed between the table leveling mechanism (6) and the ground.

9. The dual-optical-path refraction measurement precision leveling machining platform according to claim 1, characterized in that: The double-sided transmission mirror (25) is bonded to the top of the workpiece (7) to be processed.

10. A working method for a dual-path refraction measurement type precision leveling machining platform, characterized in that: The dual-path refraction measurement precision leveling machining platform according to any one of claims 1-9 includes: The processing device (8) performs planar processing on the entire lower surface of the workpiece (7) to be processed; The laser emitted by the first laser emitter (21) is refracted by the double-sided transmission mirror (25) and projected onto the first photosensitive position sensor (22) to form a first light spot. Based on the position of the first light spot, the tilt angle between the workpiece (7) to be processed and the horizontal plane in the first direction is determined. The laser emitted by the second laser emitter (23) is refracted by the double-sided transmission mirror (25) and projected onto the second photosensitive position sensor (24) to form a second light spot. Based on the position of the second light spot, the tilt angle between the workpiece (7) to be processed and the horizontal plane in the second direction is determined. Based on the angle of inclination between the workpiece (7) to be processed and the horizontal plane in the first direction and the angle of inclination between the workpiece (7) to be processed and the horizontal plane in the second direction, while the processing device (8) is processing the workpiece (7), the leveling component adjusts the workpiece (7) to be processed to be parallel to the horizontal plane.

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