Double-station wafer scribing machine

Abstract

The invention relates to the technical field of wafer scribing processing, and discloses a double-station wafer scribing machine which comprises a main shaft cutting module, a working disc module, a feeding module, a discharging module and a guide plate module capable of being closed. The discharging module is used for moving from an initial position and taking out a workpiece in a material box, a sensing assembly arranged on the guide plate module is used for positioning the workpiece, when the workpiece moves to a sensing position along with the discharging module, the guide plate module is closed to clamp the workpiece to form a transfer station, and then the discharging module is reset; the feeding module is used for conveying the workpieces located on the transfer station to the working disc module and then resetting the workpieces. According to the scribing machine, through the arrangement of the feeding module, the discharging module and the openable guide plate, the scribing machine can be matched with the working disc capable of moving in a directional mode, the operations of automatic feeding, material preparation in scribing and cutting and discharging are completed, the internal space of the scribing machine is efficiently utilized, and the overall machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer scribing processing, and in particular to a dual-station wafer scribing machine. Background Art

[0002] Abrasive wheel dicing machines are precision CNC devices that integrate hydro-gas-electric technology, an air-static high-speed spindle, a precision mechanical transmission system, sensor technology, and automated control technology. They are widely used in dicing processes for silicon wafers, integrated circuits, semiconductor wafers, optoelectronic devices, discrete devices, sensors, communications, and medical industries. They can process a variety of materials, including silicon wafers, glass, PCBs, aluminum oxide, aluminum nitride, silicon carbide, gallium arsenide, and bismuth antimonide. As a technological advancement of traditional abrasive wheel dicing machines, fully automatic abrasive wheel dicing machines achieve a high level of automation and precision in the dicing process through the deep integration of advanced automated control systems and precision mechanical design.

[0003] In the existing fully automatic grinding wheel dicing machine, when loading and unloading wafer workpieces in the material box, how to ensure the loading and unloading efficiency while rationally utilizing the internal space of the entire machine is an urgent problem that needs to be solved to improve cutting efficiency. Summary of the Invention

[0004] In view of the deficiencies in the prior art, the present invention provides a dual-station wafer dicing machine, which solves the problem of how to rationally utilize the internal space of the dicing machine while ensuring the efficiency of automatic loading and unloading of wafer workpieces.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: The guide plate module is reset synchronously; after cutting is completed, the cut workpiece is reset along with the working disk module, and the cut workpiece is unloaded to the material box by the unloading module.

[0006] Preferably, the guide plate module includes two guide plates that move toward or away from each other, the vertical cross-section of the guide plate is L-shaped, and the workpiece is clamped and arranged between the two guide plates.

[0007] Preferably, the guide plate is driven by a bidirectional drive module, and the sensing component includes a plurality of photoelectric switches, which are detachably embedded in pairs on a single guide plate to determine whether the workpiece has reached a preset position.

[0008] Preferably, the unloading module includes multiple first vacuum suction nozzles for vacuum adsorption of workpieces and a clamping jaw assembly that can be rotated from a horizontal direction to a vertical direction. When the clamping jaw assembly is rotated to a horizontal state, it is used to clamp the workpiece in the material box; when the clamping jaw assembly is rotated to a vertical state, it is used to converge and make the main body located above the adsorption plane of the first vacuum suction nozzle.

[0009] Preferably, the blanking module further comprises an air knife assembly, which is started periodically to perform air blowing treatment on the workpiece surface, the guide plate and the induction assembly during the movement of the blanking module.

[0010] Preferably, the blanking module also includes a first mounting frame plate, which is moved up and down by a driving cylinder, and the vacuum nozzles are arranged in groups of two on the first mounting frame plate. A rotating cylinder is fixedly provided on one side of the driving cylinder through an extension base, and the rotating cylinder is used to drive the rotation of the clamping jaw assembly. An extension frame is fixedly provided between the driving cylinder and the extension base, and one end of the extension frame is provided with a first linear moving module for driving the blanking module to move linearly along a fixed stroke.

[0011] Preferably, the loading module includes a second mounting plate and a plurality of second vacuum nozzles arranged on the second mounting plate, and the second mounting plate is driven by the second linear moving module to move in the vertical direction.

[0012] Preferably, it also includes an outer shell and a support frame, the outer shell cover is arranged on the outer surface of the support frame, and an inner concave cavity is arranged at one corner of the outer shell for externally storing the material box.

[0013] Preferably, a display assembly is provided on one side of the housing, a control assembly is integrated and installed in the support frame, the control assembly is electrically and communicatively connected to the display assembly, the display assembly can be freely rotated within a range of 180° and is equipped with a concave part underneath that can be flipped and stored.

[0014] Preferably, a dust extraction component is provided on the housing, and an air inlet of the dust extraction component is opened above the cutting station through a pipeline or a channel; the cooling system of the spindle cutting module monitors the cooling water flow through a turbine flow sensor.

[0015] The present invention has the following beneficial effects: This dual-station wafer dicing machine, through the provision of a closable guide plate module, can form a closable transfer station, effectively avoiding the need for the loading and unloading modules to design a larger stroke in order to avoid interference with the fixed-position transfer station during the application of traditional dicing machines, resulting in higher investment costs and larger space. Due to the opening and closing function of the transfer station combined with the movable work plate module, the loading module only needs to ensure uniaxial movement to complete loading, and the unloading module only needs to be designed with two-axis movement to complete the unloading operation, thus reducing the number of motion modules and strokes for loading and unloading. At the same time, the loading module can be used to prepare materials in advance during the cutting process, greatly reducing the loading and unloading time of the entire machine and improving overall processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention from a first viewing angle; Figure 2 This is a schematic diagram of the overall structure of the present invention from a second viewing angle; Figure 3 This is a schematic structural diagram of the main part of the present invention from a second viewing angle; Figure 4 This is a schematic diagram of the layout structure of the main part of the present invention from the first perspective; Figure 5 This is a schematic diagram of the layout structure of the blanking module of the present invention; Figure 6 This is a schematic diagram of the layout structure of the feeding module of the present invention; Figure 7 This is a schematic diagram of the layout structure of the blanking module of the present invention; Figure 8 This is a structural diagram of the blanking module of the present invention; Figure 9 This is a schematic diagram of the layout structure of the feeding module and the guide plate module of the present invention; Figure 10 This is a structural diagram of the feeding module of the present invention.

[0017] In the figure: 1. Housing; 2. Display assembly; 3. Material box; 4. Guide plate module; 41. Bidirectional drive module; 42. Guide plate; 43. Photoelectric switch; 5. Unloading module; 51. First mounting frame plate; 52. First vacuum nozzle; 53. Drive cylinder; 54. Extension base; 55. Rotary cylinder; 56. Clamping claw assembly; 57. Air knife assembly; 58. Extension frame; 59. First linear motion module; 6. Loading module; 61. Second linear motion module; 62. Second mounting frame plate; 63. Second vacuum nozzle; 7. Working disk module; 8. Drive assembly; 9. Spindle cutting module; 10. Dust extraction assembly. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] Example 1

[0020] A dual-station wafer dicing machine includes a spindle cutting module 9, a work disk module 7, a loading module 6, an unloading module 5, and a closable guide plate module 4; the unloading module 5 is used to move and remove the workpiece in the material box 3 from the initial position, and the sensing component provided on the guide plate module 4 is used to locate the workpiece. When the workpiece moves to the sensing position with the unloading module 5, the guide plate module 4 closes to clamp the workpiece to form a transfer station, and then the unloading module 5 is reset; the loading module 6 is used to transport the workpiece at the transfer station to the work disk module 7 and then reset. A driving assembly 8 is provided on one side of the working disk module 7, which is used to drive the working disk module 7 to move to the cutting station, and the guide plate module 4 is reset before the workpiece is loaded; during the cutting process, the unloading module 5 moves from the initial position again to take out the new workpiece in the material box 3 and load it to the transfer station. At the same time, the loading module 6 takes out the workpiece at the transfer station and resets the material, and the guide plate module 4 is reset synchronously; after cutting is completed, the cut workpiece is reset with the working disk module 7, and the unloading module 5 unloads the cut workpiece into the material box 3 for storage and finally resets it.

[0021] Specific as Figure 3 and Figure 4 As shown, in this technical solution, a closable transfer station can be formed by setting a closable guide plate module 4, which effectively avoids the need to design a larger stroke for the loading module 6 and the unloading module 5 in order to avoid interference with the fixed-position transfer station during the application of the traditional dicing machine, thereby increasing the investment cost and occupying a larger space; due to the opening and closing function of the transfer station combined with the movable work disk module 7, the loading module 6 only needs to ensure uniaxial movement to complete the loading, and the unloading module 5 only needs to design a two-axis movement to complete the unloading operation, reducing the number of motion modules and strokes for loading and unloading. At the same time, the loading module 6 can be used to prepare materials in advance during the cutting process, greatly reducing the time for loading and unloading the entire machine and improving the overall processing efficiency.

[0022] like Figure 6 and Figure 9As shown, the guide plate module 4 includes two guide plates 42 that move toward or away from each other. The vertical cross-section of the guide plates 42 is L-shaped, and the workpiece is clamped between the two guide plates 42. In this technical solution, the use of L-shaped guide plates 42 can stably support and clamp the workpiece, avoiding the need to ensure stability during the clamping process. At the same time, the use of mechanical clamping effectively avoids the instability caused by vacuum adsorption or magnetic attraction in traditional processes, allowing the subsequent loading and unloading modules 5 to accurately remove the material.

[0023] In this technical solution, the guide plate 42 is driven by a bidirectional drive module 41, and the sensing component includes a plurality of photoelectric switches 43, which are detachably embedded in pairs on a single guide plate 42 to locate whether the workpiece has reached a preset position. Figure 9 By adopting the bidirectional drive module 41 to drive the guide plate 42 to move synchronously, the installation and application cost can be reduced while ensuring the transmission efficiency.

[0024] In actual application, four photoelectric switches 43 are usually provided to respectively locate two sides of the workpiece to ensure the accuracy of positioning. Of course, the number of photoelectric switches 43 can also be increased as needed to ensure the accuracy of positioning and reduce the error of positioning.

[0025] Example 2

[0026] The unloading module 5 includes a plurality of first vacuum suction nozzles 52 for vacuum adsorption of workpieces and a clamping jaw assembly 56 that can be rotated from a horizontal direction to a vertical direction. When the clamping jaw assembly 56 is rotated to a horizontal state, it is used to clamp the workpiece in the material box 3; when the clamping jaw assembly 56 is rotated to a vertical state, it is used to converge and make the body above the adsorption plane of the first vacuum suction nozzle 52. Figure 5 and Figure 7 As shown. In conventional applications, the workpieces in the magazine 3 are pre-positioned and positioned before the unloading module 5 retrieves the workpieces. However, in this solution, the unloading module 5 can quickly rotate the clamping jaw assembly 56 to a horizontal position to grasp the workpiece. By simply moving the clamping jaw assembly 56 horizontally a fixed distance, the clamping jaws can quickly grasp the workpieces in the magazine 3. Compared to traditional retrieving methods, this approach reduces travel distance and the required transmission structure, saving costs and significantly improving retrieving efficiency.

[0027] Furthermore, in the above technical solution, by rotating the clamping jaw assembly 56 to a vertical state, it is possible to effectively avoid the protruding clamping jaw assembly 56 from causing motion interference with the subsequent loading module 6.

[0028] The blanking module 5 also includes an air knife assembly 57, which is started regularly. During the movement of the blanking module 5, the workpiece surface, the guide plate 42 and the induction assembly are blown. Figure 7 and Figure 9 As shown, in this technical solution, the periodically activated air knife assembly 57 can automatically blow away the residue and water droplets on the surface of the workpiece, and can also clean the guide plate 42 and the sensing assembly to improve the accuracy of subsequent positioning.

[0029] In this technical solution, the unloading module 5 also includes a first mounting frame plate 51, which is moved up and down by a driving cylinder 53. The vacuum nozzles are arranged in groups of two on the first mounting frame plate 51. A rotating cylinder 55 is fixedly provided on one side of the driving cylinder 53 through an extension base 54. The rotating cylinder 55 is used to drive the rotation of the clamping jaw assembly 56. An extension frame 58 is fixedly provided between the driving cylinder 53 and the extension base 54. One end of the extension frame 58 is provided with a first linear moving module 59 for driving the unloading module 5 to move linearly along a fixed stroke.

[0030] In this technical solution, the loading module 6 includes a second mounting plate 62 and a plurality of second vacuum nozzles 63 arranged on the second mounting plate 62. The second mounting plate 62 is driven by the second linear moving module 61 to move in the vertical direction, as shown in FIG. Figure 10 By adopting the same structural design of the loading module 6 and the unloading module 5, the design and processing costs can be effectively reduced, while ensuring the consistency of the accessories and facilitating subsequent maintenance and replacement.

[0031] The dual-station wafer dicing machine also includes a housing 1 and a support frame. The housing 1 is covered on the outer surface of the support frame. An inner concave cavity is provided at one corner of the housing 1 for storing the material box 3. Figure 1 In this technical solution, by storing the material box 3 externally, it is convenient to quickly replace the material box 3 on a daily basis without opening the shell, thereby improving efficiency.

[0032] See also Figure 1 As shown, in this technical solution, a display assembly 2 is mounted on one side of the housing 1, and a control assembly is integrated within the support frame. The control assembly and the display assembly 2 are electrically and communicatively connected. The display assembly can rotate freely within a range of 180 degrees and is equipped with a reversible recessed member underneath for storage. The display assembly 2 can rotate freely within a range of 180 degrees and is equipped with a recessed member underneath for accommodating operating accessories such as a keyboard and mouse, greatly improving the operator's convenience in daily use.

[0033] A dust extraction assembly 10 is provided on the housing 1 , and an air inlet of the dust extraction assembly 10 is opened above the cutting station through a pipeline or a channel; the cooling system of the spindle cutting module 9 monitors the cooling water flow through a turbine flow sensor.

[0034] Specific as Figure 2As shown, in this technical solution, a dust extraction assembly 10 is provided to treat waste chips generated during the cutting process, preventing them from escaping onto the surface of subsequent workpieces and affecting the precision of the workpiece cutting. Conventional spindle cooling systems use pressure sensors for monitoring, which can easily lead to misjudgments when external water pressure fluctuates. Instead, a turbine flow sensor is provided, which operates normally when water flows through it, significantly enhancing the accuracy and reliability of spindle cooling monitoring.

[0035] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprise," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations. The phrase "includes an element defined by..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0036] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A dual-station wafer dicing machine, characterized in that: It includes a spindle cutting module, a work disk module, a loading module, an unloading module and a closable guide plate module; the unloading module is used to move from an initial position and take out the workpiece in the material box, and the sensing component arranged on the guide plate module is used to position the workpiece. When the workpiece moves to the sensing position with the unloading module, the guide plate module closes to clamp the workpiece to form a transfer station, and then the unloading module is reset; the loading module is used to transport the workpiece located at the transfer station to the work disk module and then reset. A driving component is provided on one side of the work disk module to drive the work disk module to move to the cutting station, and the guide plate module is reset before the workpiece is loaded; during the cutting process, the unloading module moves from the initial position again to take out the new workpiece in the material box and load it to the transfer station. At the same time, the loading module takes out the workpiece located at the transfer station and resets to prepare the material, and the guide plate module is reset synchronously; after the cutting is completed, the cut workpiece is reset with the working disk module, and the unloading module unloads the cut workpiece to the material box for storage and finally resets it.

2. The dual-station wafer dicing machine according to claim 1, characterized in that: The guide plate module includes two guide plates that move toward or away from each other. The vertical cross-section of the guide plate is L-shaped, and the workpiece is clamped and arranged between the two guide plates.

3. The dual-station wafer dicing machine according to claim 2, wherein: The guide plate is driven by a bidirectional drive module, and the sensing component includes a plurality of photoelectric switches, which are detachably embedded in pairs on a single guide plate to determine whether the workpiece has reached a preset position.

4. The dual-station wafer dicing machine according to claim 2, wherein: The unloading module includes multiple first vacuum suction nozzles for vacuum adsorption of workpieces and a clamping jaw assembly that can be rotated from a horizontal direction to a vertical direction. When the clamping jaw assembly is rotated to a horizontal state, it is used to clamp the workpiece in the material box; when the clamping jaw assembly is rotated to a vertical state, it is used to converge and make the main body located above the adsorption plane of the first vacuum suction nozzle.

5. The dual-station wafer dicing machine according to claim 4, characterized in that: The blanking module also includes an air knife assembly, which is started regularly and blows air to the workpiece surface, the guide plate and the induction assembly during the movement of the blanking module.

6. The dual-station wafer dicing machine according to claim 5, characterized in that: The blanking module also includes a first mounting frame plate, which is moved up and down by a driving cylinder. The vacuum suction nozzles are arranged in groups of two on the first mounting frame plate. A rotating cylinder is fixedly provided on one side of the driving cylinder through an extension base. The rotating cylinder is used to drive the rotation of the clamping jaw assembly. An extension frame is fixedly provided between the driving cylinder and the extension base. One end of the extension frame is provided with a first linear moving module for driving the blanking module to move linearly along a fixed stroke.

7. The dual-station wafer dicing machine according to claim 4, characterized in that: The loading module includes a second mounting plate and a plurality of second vacuum nozzles arranged on the second mounting plate. The second mounting plate moves in a vertical direction under the drive of the second linear motion module.

8. The dual-station wafer dicing machine according to any one of claims 1 to 7, characterized in that: It also includes an outer shell and a supporting frame. The outer shell cover is arranged on the outer surface of the supporting frame. An inner concave cavity is arranged at one corner of the outer shell for externally storing a material box.

9. The dual-station wafer dicing machine according to claim 8, characterized in that: A display assembly is provided on one side of the shell, and a control assembly is integrated and installed in the supporting frame. The control assembly is electrically and communicatively connected to the display assembly. The display assembly can be freely rotated within a range of 180 degrees and is equipped with a concave part underneath that can be flipped and stored.

10. The dual-station wafer dicing machine according to claim 9, wherein: A dust extraction component is provided on the housing, and an air inlet of the dust extraction component is opened above the cutting station through a pipeline or a channel; the cooling system of the spindle cutting module monitors the cooling water flow through a turbine flow sensor.

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