Multi-stage HFO refrigerant condensing device and cooling system

Abstract

The invention provides a multi-stage HFO refrigerant condensing device and a control method, and relates to the technical field of refrigeration equipment, the device comprises a first water distributor and a spiral water distributor, and the spiral water distributor is used for collecting cooling water passing through a first gas channel and guiding the cooling water into a second gas channel; a second water distributor and a condensation evaporation heat exchanger are arranged in the second gas channel; the second gas channel is used for cooling circulating gas through second cooling water and conducting heat exchange between the cooled gas and third cooling water sprayed out of the second water distributor and the HFO refrigerant in the condensation evaporation heat exchanger. Through the synergistic effect of multi-stage cooling and low-temperature water and low-temperature air, the system can still maintain the condensation temperature of an HFO refrigerant to be lower than the wet bulb temperature even in the extreme humid and hot environment with the wet bulb temperature as high as 30 DEG C, it is ensured that natural cooling and continuous and stable operation are conducted all the year round, and dependence on mechanical refrigeration energy supplementation is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of refrigeration equipment, and in particular to a multi-stage HFO refrigerant condensing device and a cooling system. Background Art

[0002] Data center servers generate a lot of heat when running. If cooling measures are not taken for components such as chips, local overheating can easily occur, affecting equipment reliability. Therefore, a cooling system for chips and other components is necessary.

[0003] Currently, mainstream data centers mostly use mechanical compression refrigeration systems, which rely on electricity to drive the compressor to complete the cooling cycle. This is particularly true in high-temperature and high-humidity environments, where the compressor operates under high load for extended periods, resulting in significant energy consumption. According to statistics, cooling system energy consumption accounts for approximately 40% of a data center's total energy consumption, severely restricting the optimization of overall power usage effectiveness (PUE).

[0004] To reduce cooling energy consumption, the industry has attempted to utilize natural cooling sources for cooling. Currently, mainstream liquid cooling systems mostly use water or ethylene glycol solutions as refrigerants, exchanging heat with natural cooling sources through cooling towers or dry coolers. However, their condensing temperature typically needs to be 3-5°C higher than the wet-bulb temperature, and mechanical refrigeration must still be activated in hot and humid summer climates, making it difficult to achieve year-round natural cooling. Furthermore, the secondary side of traditional liquid cooling systems often relies on forced circulation pumps to drive the refrigerant flow, resulting in a significant proportion of pumping energy consumption. Furthermore, the single cooling circuit design struggles to adapt to the differentiated needs of high-density heat dissipation at the chip level and low-density heat dissipation in server backplanes, leading to local overheating or energy efficiency loss.

[0005] Therefore, a new cooling architecture is urgently needed to solve the above problems through multi-stage collaborative heat exchange, low-resistance and high-efficiency circulation and intelligent control technology. Summary of the Invention

[0006] The embodiments of the present application provide a multi-stage HFO refrigerant condensing device and a cooling system to solve the problems of high energy consumption and poor stability of cooling systems in the prior art.

[0007] In a first aspect, an embodiment of the present application provides a multi-stage HFO refrigerant condensing device, comprising:

[0008] The interior of the housing is divided into a first gas channel and a second gas channel;

[0009] a first water distributor provided in the first gas channel, for spraying first cooling water into the first gas channel;

[0010] a spiral water distributor provided between the first gas channel and the second gas channel, the spiral water distributor being used to collect second cooling water passing through the first gas channel and introduce the second cooling water into the second gas channel; the second cooling water being the first cooling water after heat and moisture exchange with the gas flowing through the first gas channel;

[0011] A second water distributor and a condensing evaporative heat exchanger are provided in the second gas channel; the second gas channel is used to cool the circulating gas using the second cooling water, and use the cooled gas and the third cooling water sprayed from the second water distributor to exchange heat with the HFO refrigerant in the condensing evaporative heat exchanger to condense the gaseous HFO refrigerant into liquid HFO refrigerant.

[0012] Optionally, the housing includes a first air inlet, a second air inlet, a first EC fan unit, and a second EC fan unit; wherein the first air inlet and the second air inlet are located on the same side wall of the housing, and the first air inlet is located above the second air inlet; the first EC fan unit is located on the top surface of the housing; and the second EC fan unit is located on the other side wall of the housing;

[0013] The first air inlet is located at the entrance of the first gas channel, and the first EC fan unit is located at the outlet of the first gas channel;

[0014] The second air inlet is located at the entrance of the second gas channel, and the second EC fan unit is located at the outlet of the second gas channel.

[0015] Optionally, a first filler is further provided in the first gas channel, and the first water distributor is located above the first filler and is used to evenly distribute first cooling water on the surface of the first filler.

[0016] Optionally, the first gas channel is further provided with:

[0017] a first water baffle, the first water baffle being located between the first filler and the first EC fan unit;

[0018] The water guide groove connected to the spiral water distributor is used to guide the second cooling water in the first gas channel into the spiral water distributor.

[0019] Optionally, a fin-type dew-point heat exchanger and a second filler are sequentially provided in the second gas channel along the direction from the second air inlet to the condensing evaporation heat exchanger; the inner side of the fin-type dew-point heat exchanger is connected to the spiral water distributor; and the second filler is located below the spiral water distributor.

[0020] Optionally, a second water baffle is further provided in the second gas channel, and the second water baffle is located between the condensing and evaporating heat exchanger and the second EC fan unit.

[0021] Optionally, a water tank is provided at the bottom of the shell; the water tank is connected to the first water distributor through a first pipe, and a first water pump is provided on the first pipe; the water tank is connected to the second water distributor through a second pipe, and a second water pump is provided on the second pipe.

[0022] In a second aspect, the present application further provides a cooling system, comprising:

[0023] The multi-stage HFO refrigerant condensing device according to the first aspect;

[0024] Liquid cooling distribution unit; the liquid cooling distribution unit and the condensing evaporation heat exchanger in the multi-stage HFO refrigerant condensing device form a cooling circulation pipeline for the HFO refrigerant, which is used to condense the HFO refrigerant using the multi-stage HFO refrigerant condensing device;

[0025] The secondary side of the liquid cooling system; the secondary side of the liquid cooling system includes a CO2 circulation pipeline; the liquid cooling distribution unit includes an HFO heat exchange pipeline, and the HFO heat exchange pipeline is used to exchange heat with the CO2 circulation pipeline to cool the CO2 cooling medium in the CO2 circulation pipeline.

[0026] Optionally, the liquid cooling distribution unit includes:

[0027] Low-pressure circulation barrel; the low-pressure circulation barrel is connected to the inlet of the condensing evaporative heat exchanger through the fourteenth pipe, and is connected to the outlet of the condensing evaporative heat exchanger through the third pipe; the low-pressure circulation barrel is connected to the inlet of the secondary side of the liquid cooling system through the fourth pipe, and is connected to the outlet of the secondary side of the liquid cooling system through the thirteenth pipe.

[0028] The solution provided by this application has the following beneficial effects:

[0029] 1. This application uses HFO phase change cooling to construct a condensing device, combined with year-round natural cooling technology, abandoning the traditional compressor refrigeration mode, achieving oil-free operation of the system, and significantly reducing energy consumption. The thermosiphon cycle reduces the flow demand of the working fluid pump. Compared with the traditional water refrigerant system, the flow rate is reduced to 1 / 5 (for example, only 2m3 / h is required at a cooling capacity of 116kW), greatly reducing pumping energy consumption. At the same time, the annual PUE (power utilization efficiency) is significantly reduced, achieving the goal of energy conservation and carbon reduction.

[0030] 2. This application uses a new type of condensing device to integrate indirect cooling of dew point on the air side, two-stage cooling on the water side, and HFO evaporative cooling technology of low-temperature water and low-temperature air to reduce the condensation temperature of HFO refrigerant to below the wet-bulb temperature (it can still be below 30°C when the domestic maximum wet-bulb temperature is 30°C), breaking through the traditional limitation that the condensation temperature must be 8°C higher than the wet-bulb temperature, maximizing the use of natural cooling sources, adapting to high temperature and high humidity environments, and improving the system's operational stability throughout the year.

[0031] Third, this application utilizes the density difference between the HFO gas and liquid phases to achieve a thermosiphon cycle, eliminating the need for forced delivery by a pump. This system offers low operating resistance and high circulation efficiency. Compared to traditional pump-driven systems, this further reduces energy consumption and equipment complexity, while also minimizing the risk of system downtime due to mechanical pump failure, thereby improving overall energy efficiency and reliability.

[0032] Fourth, in the cooling system provided by this application, the secondary side of the liquid cooling system utilizes a split design of CO2-powered heat pipes and gravity-based heat pipes, serving the chip cold plate and backplane cooling, respectively. The powered heat pipes are actively driven by electromagnetic pumps, adapting to the rapid heat dissipation requirements of high-power density chips; the gravity-based heat pipes utilize natural convection to achieve passive and efficient heat exchange under low load or normal operating conditions. These two elements work together to ensure system flexibility and stability under varying load conditions while reducing secondary-side energy consumption.

[0033] 5. The condensing and evaporating heat exchangers in this application may utilize corrosion-resistant materials such as hot-dip galvanized carbon steel pipes, stainless steel pipes, or honeycomb corrugated plates. Combined with a low-resistance flow path design (operating resistance ≤ 5kPa), this effectively reduces fluid flow pressure drop and extends equipment life. Furthermore, the low-resistance design reduces overall energy consumption in the circulation system, further enhancing energy conservation.

[0034] 6. This application uses multi-stage cooling (indirect dew point cooling on the wind side, two-stage evaporative cooling on the water side, and HFO evaporative condensation) in synergy with low-temperature water and low-temperature air. Even in an extremely hot and humid environment with a wet-bulb temperature of up to 30°C, the system can still maintain the HFO refrigerant condensation temperature below the wet-bulb temperature, ensuring continuous and stable operation of natural cooling throughout the year and avoiding reliance on mechanical refrigeration for energy replenishment. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic structural diagram of a multi-stage HFO refrigerant condensing device provided in some embodiments of the present application;

[0036] Figure 2 A schematic structural diagram of a cooling system provided in an embodiment of the present application;

[0037] Figure 3 A schematic structural diagram of a liquid cooling distribution unit in a cooling system according to an embodiment of the present application;

[0038] Figure 4This is a schematic structural diagram of the secondary side of the liquid cooling system in the cooling system provided in an embodiment of the present application.

[0039] Description of reference numerals:

[0040] 1-First air inlet; 2-First water distributor; 3-First filler; 4-Water guide trough; 5-First water baffle; 6-First EC fan unit; 7-Second air inlet; 8-Spiral water distributor; 9-Wound-type dew-point heat exchanger; 10-Second filler; 11-Second water distributor; 12-Condensation-evaporation heat exchanger; 13-Second water baffle; 14-Second EC fan unit; 15-First water pump; 16-Water tank; 17-Second water pump; 18-Valve A; 19-Valve B; 20-Low-pressure circulation tank; 21-HFO working fluid pump; 22-Pressure sensor A; 23-Temperature sensor A; 24-On / Off electric stop valve; 25-Electric throttle valve A; 26-Plate heat exchanger A; 27-Electric pump; 28-cold plate; 29-pressure sensor B; 30-temperature sensor B; 31-pressure sensor C; 32-temperature sensor C; 33-electric throttle valve B; 34-plate heat exchanger B; 35-electric throttle valve C; 36-back plate; 37-pressure sensor D; 38-temperature sensor D; 39-pressure sensor E; 40-temperature sensor E; 41-first pipeline; 42-second pipeline; 43-third pipeline; 44-fourth pipeline; 45-fifth pipeline; 46-sixth pipeline; 47-seventh pipeline; 48-eighth pipeline; 49-ninth pipeline; 50-tenth pipeline; 51-eleventh pipeline; 52-twelfth pipeline; 53-thirteenth pipeline; 54-fourteenth pipeline. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0042] It should be noted that in this application, the carbon dioxide (CO2) involved is used as a natural refrigerant. Its main properties are GWP of 1, ODP of 0, non-toxicity and high latent heat transfer capacity, which can achieve efficient energy transmission during the heat exchange process; hydrofluoroolefin (HFO) refrigerants have both low environmental impact and high-efficiency thermodynamic properties. HFO can be in both gaseous and liquid forms during the heat exchange process, and heat transfer is achieved by switching between gas and liquid. HFO is used as an intermediate cooling medium in this application and is combined with the CO2 system to form a composite refrigeration cycle. Its low viscosity characteristics can optimize the pipeline design and improve the overall energy efficiency of the system through phase change latent heat; in the pipelines mentioned in the embodiments of this application, the heat exchange tubes involved can achieve rapid heat transfer through phase change of the working fluid. For example, a heat pipe with a thermal conductivity of more than 100 times that of copper can be used. Micro heat pipe technology has been widely used in CPU / GPU heat dissipation, which can accurately match the chip heat flux density and is also applicable to the solution of the embodiments of this application.

[0043] See also Figure 1 , is a schematic structural diagram of a multi-stage HFO refrigerant condensing device provided in some embodiments of the present application;

[0044] like Figure 1 As shown, the present application provides a multi-stage HFO refrigerant condensing device, comprising:

[0045] Shell (not shown in the figure); it should be considered that the shell is a component that provides support for the remaining components. The remaining sub-components mentioned in the embodiments of this application can be considered to be arranged inside a shell of a certain shape. The shape of the shell can be set accordingly according to actual needs and the setting positions between the components, and is not limited here.

[0046] In some examples, the interior of the housing can be divided into two independent spaces, namely, a first gas channel and a second gas channel. The terms "first gas channel" and "second gas channel" are intended only to illustrate the gas flow path and are not limited to straight lines. Furthermore, in this application, the gas flowing in the first gas channel and the gas flowing in the second gas channel differ not only in the spaces in which they flow but also in the functions of the gases, as described below.

[0047] A first water distributor 2 may be provided in the first gas channel for spraying first cooling water into the first gas channel. The gas flowing in the first gas channel may cool the first cooling water, thereby lowering the temperature of the first cooling water to obtain second cooling water with a lower temperature. At the same time, the gas carrying the heat of the first cooling water may be discharged from the outlet of the first gas channel.

[0048] A spiral water distributor 8 may be provided between the first gas channel and the second gas channel. The spiral water distributor 8 is used to collect the second cooling water passing through the first gas channel and introduce the second cooling water into the second gas channel; the second cooling water is the cooling water obtained by heat and moisture exchange between the first cooling water and the gas flowing in the first gas channel.

[0049] In the present embodiment, the spiral water distributor 8 is designed to establish a cooling water flow channel between the first and second gas channels. Its spiral shape not only increases the contact area between the cooling water and the gas, but also promotes uniform distribution of the cooling water within the distributor, improving the efficiency of heat and moisture exchange. Furthermore, the spiral water distributor 8 is constructed of a corrosion-resistant, high-strength alloy, ensuring its stability and durability during long-term operation.

[0050] Furthermore, the cross-sectional shapes of the first and second gas channels can be optimized based on actual needs. For example, rectangular, circular, or other polygonal cross-sections can be used to accommodate different gas flow and pressure loss requirements. Furthermore, the inner walls of the channels should be smooth and flawless to reduce resistance to gas flow and improve overall heat exchange efficiency.

[0051] Continue to see Figure 1 A second water distributor 11 and a condensing evaporative heat exchanger 12 are provided in the second gas channel; the second gas channel is used to cool the circulating gas using the second cooling water, and use the cooled gas and the third cooling water sprayed from the second water distributor 11 to exchange heat with the HFO refrigerant in the condensing evaporative heat exchanger 12, so that the gaseous HFO refrigerant is condensed into liquid HFO refrigerant.

[0052] In some feasible embodiments, the shell includes a first air inlet 1, a second air inlet 7, a first EC fan group 6 and a second EC fan group 14; wherein, the first air inlet 1 and the second air inlet 7 are located on the same side wall of the shell, and the first air inlet 1 is located above the second air inlet 7; the first EC fan group 6 is located on the top surface of the shell; and the second EC fan group 14 is located on the other side wall of the shell.

[0053] The first air inlet 1 is located at the entrance of the first gas channel, and the first EC fan unit 6 is located at the outlet of the first gas channel;

[0054] The second air inlet 7 is located at the entrance of the second gas channel, and the second EC fan unit 14 is located at the outlet of the second gas channel.

[0055] In this embodiment, the EC fan unit intelligently adjusts its speed based on gas flow and pressure requirements, thereby ensuring efficient gas circulation while reducing energy consumption. The synergistic effect of the first EC fan unit 6 and the second EC fan unit 14 ensures uniform gas flow within the first and second gas channels, further improving heat and moisture exchange and cooling efficiency.

[0056] The multi-stage HFO refrigerant condensing device can also include a control system (not shown) that monitors and controls the overall operating status of the device. Specifically, the control system monitors parameters such as temperature, humidity, and gas flow within the first and second gas channels in real time. Based on a pre-set control strategy, the control system intelligently regulates the first and second water distributors 2, 11, condensing and evaporating heat exchangers 12, and the EC fan unit, ensuring the device is always operating optimally.

[0057] Further, in some feasible embodiments, see Figure 1 , a first filler 3 is also provided in the first gas channel, and the first water distributor 2 is located above the first filler 3, and is used to evenly distribute the first cooling water on the surface of the first filler 3. The first filler 3 can be made of PVC material. The PVC material has good corrosion resistance and hydrophilicity, and can improve the heat and moisture exchange efficiency between the first cooling water and the gas. The shape and structure of the first filler 3 can be optimized according to actual needs. For example, corrugated plates, honeycomb or other shaped fillers can be used to increase the contact area and residence time between the cooling water and the gas, thereby improving the heat and moisture exchange effect. At the same time, the arrangement of the first filler 3 can also be flexibly adjusted to adapt to different gas flow and pressure loss requirements.

[0058] Further, in some feasible embodiments, see Figure 1 , the first gas channel is further provided with:

[0059] A first water baffle 5 is located between the first filler 3 and the first EC fan unit 6. In this embodiment of the present application, the first water baffle 5 can effectively prevent cooling water from being carried out of the condensing device, thereby avoiding large-scale cooling water loss. The design of the first water baffle 5 must take into account the splash angle and force of the cooling water to ensure that it can effectively block the cooling water while not affecting the smooth flow of gas. In addition, the first water baffle 5 can be made of corrosion-resistant, high-strength materials to ensure its long-term stability and durability.

[0060] For further information, see Figure 1 A water guide groove 4 connected to the spiral water distributor 8 can also be provided in the first gas channel to guide the second cooling water in the first gas channel into the spiral water distributor.

[0061] In some possible embodiments, see Figure 1 In the second gas channel, a fin-type dew-point heat exchanger 9 and a second filler 10 are sequentially provided along the direction from the second air inlet 7 to the condensation evaporation heat exchanger 12; the inner side of the fin-type dew-point heat exchanger 9 is connected to the spiral water distributor 8; the second filler 10 is located below the spiral water distributor 8.

[0062] In the embodiment of the present application, the second cooling water collected from the spiral water distributor 8 has two functions: one is to pass into the wound-plate dew-point heat exchanger 9 to perform the first cooling on the gas entering the second air inlet 7; the other is to fall directly from the spiral water distributor 8 to the surface of the second filler 10, and use evaporation to exchange heat with the flowing gas again.

[0063] Further, in some feasible embodiments, see Figure 1 A second water baffle 13 is further provided in the second gas channel and is located between the condensing evaporative heat exchanger 12 and the second EC fan unit 14. The second water baffle 13 can effectively prevent the cooling water from being carried away by the gas after the condensing evaporative heat exchanger 12, thereby ensuring full utilization of the cooling water.

[0064] Further, in some feasible embodiments, see Figure 1 A water tank 16 is provided at the bottom of the shell; the water tank 16 is connected to the first water distributor 2 through a first pipe 41, and a first water pump 15 is provided on the first pipe 41; the water tank 16 is connected to the second water distributor 11 through a second pipe 42, and a second water pump 17 is provided on the second pipe 42.

[0065] It can be seen from the above technical solution that the working process of the multi-stage HFO refrigerant condensing device provided in the embodiment of the present application is as follows:

[0066] Primary cooling process: Air enters from the first air inlet 1 and exchanges heat and moisture with water from the water tank 16, which is delivered to the first water distributor 2 by the first water pump 15, in the first filler 3. The treated air passes through the first water baffle 5 to remove water droplets and is discharged by the first EC fan unit 6. In this way, the cooling water is cooled for the first time by the air, and the cooled secondary cooling water is obtained.

[0067] Secondary Cooling Process: The secondary cooling water collected during the primary cooling process flows into the lower spiral water distributor 8 via the spiral water distributor 8 or the water guide trough 4. The air entering through the second air inlet 7 first exchanges heat with the water flowing into the inner side of the spiral dew-point heat exchanger 9 via the spiral water distributor 8 on the outside of the spiral dew-point heat exchanger 9. This secondary cooling water first cools the incoming air, resulting in relatively lower temperature air. The water, which has completed the heat and moisture exchange, falls into the lower water tank 16.

[0068] Three-stage cooling process: A portion of the second cooling water collected in the first-stage cooling process is directly sprayed into the second filler 10 by the spiral water distributor 8. At the same time, the air after the second-stage cooling process also enters the second filler 10. The air and the cooling water undergo a direct evaporative cooling process, thereby further reducing the temperature of the air. The water after the heat and moisture exchange falls into the lower water tank 16.

[0069] The fourth-stage cooling process: The air after the third-stage cooling process continues to enter the outside of the condensing evaporative heat exchanger 12 and cooperates with the water that flows into the second water distributor 11 through the second water pump 17 and is sprayed onto the condensing evaporative heat exchanger 12, thereby cooling the HFO refrigerant inside the condensing evaporative heat exchanger 12. Subsequently, the air passes through the second water baffle 13 and is discharged from the second EC fan unit 14.

[0070] It can be seen from the above technical solution that the multi-stage HFO refrigerant condensing device of the present application fully utilizes the heat and moisture exchange between cooling water and air through a multi-stage cooling process, effectively reduces the temperature of the HFO refrigerant, and improves the condensation efficiency. During the four-stage cooling process, the air passes through the first gas channel and the second gas channel respectively, and exchanges heat and moisture with the cooling water at different stages, thereby achieving step-by-step cooling. At the same time, the design of components such as the spiral water distributor, filler, and water baffle further optimizes the heat and moisture exchange effect and improves the utilization rate of cooling water. In addition, the device of the embodiment of the present application can also ensure that the entire device is always in the optimal working state by combining the intelligent adjustment of the EC fan unit and the intelligent regulation of the control system, thereby achieving an efficient and energy-saving cooling effect.

[0071] In some examples, the above technical effects can be utilized to establish a new structural relationship between the multi-stage HFO refrigerant condensing device provided by the present application and components in related technologies, thereby forming a cooling system with more advantages.

[0072] See also Figure 2 , is a schematic structural diagram of a cooling system provided in an embodiment of the present application;

[0073] like Figure 2 As shown, the present application also provides a cooling system, comprising:

[0074] The multi-stage HFO refrigerant condensing device A provided in any of the aforementioned embodiments;

[0075] Liquid cooling distribution unit B; the liquid cooling distribution unit B and the condensing evaporation heat exchanger 12 in the multi-stage HFO refrigerant condensing device A form a cooling circulation pipeline for the HFO refrigerant, which is used to condense the HFO refrigerant using the multi-stage HFO refrigerant condensing device A;

[0076] The secondary side C of the liquid cooling system; the secondary side C of the liquid cooling system includes a CO2 circulation pipeline; the liquid cooling distribution unit includes an HFO heat exchange pipeline, and the HFO heat exchange pipeline is used to exchange heat with the CO2 circulation pipeline to cool the CO2 cooling medium in the CO2 circulation pipeline.

[0077] See also Figure 3 , is a structural diagram of a liquid cooling distribution unit in a cooling system provided in an embodiment of the present application;

[0078] In some possible embodiments, see Figure 3 , the liquid cooling distribution unit B includes:

[0079] Low-pressure circulation barrel 20; the low-pressure circulation barrel 20 is connected to the inlet of the condensing evaporating heat exchanger 12 through the fourteenth pipe 54, and is connected to the outlet of the condensing evaporating heat exchanger 12 through the third pipe 43; the low-pressure circulation barrel 20 is connected to the inlet of the secondary side C of the liquid cooling system through the fourth pipe 44, and is connected to the outlet of the secondary side C of the liquid cooling system through the thirteenth pipe 53.

[0080] See also Figure 3 The liquid cooling distribution unit B may further include: an HFO working medium pump 21, a pressure sensor A22, a temperature sensor A23, and a switch electric stop valve 24. The two branches of the fourth pipeline 44 are respectively provided with an HFO working medium pump 21, a pressure sensor A22, and a temperature sensor A23, and one of the branches is also provided with a switch electric stop valve 24. Figure 2 The third pipeline 43 is provided with a valve A18, and the fourteenth pipeline 54 is provided with a valve B19.

[0081] See also Figure 4 , is a schematic structural diagram of the secondary side of the liquid cooling system in the cooling system provided in an embodiment of the present application;

[0082] like Figure 4As shown, the secondary side C of the liquid cooling system may include an electric throttle valve A25, a plate heat exchanger A26, an electromagnetic pump 27, a cold plate 28, a pressure sensor B29, a temperature sensor B30, a pressure sensor C31, a temperature sensor C32, an electric throttle valve B33, a plate heat exchanger B34, an electric throttle valve C35, a back plate 36, a pressure sensor D37, a temperature sensor D38, a pressure sensor E39, and a temperature sensor E40. The fourth pipeline 44 branches into a fifth pipeline 45 and an eighth pipeline 48. The fifth pipeline 45 is provided with an electric throttle valve A25, the sixth pipeline 46 is provided with an electromagnetic pump 27, the seventh pipeline 47 is provided with a pressure sensor B29 and a temperature sensor B30, the eighth pipeline 48 is provided with an electric throttle valve B33, the ninth pipeline 49 is provided with an electric throttle valve C35, the tenth pipeline 50 is provided with a pressure sensor D37 and a temperature sensor D38, the eleventh pipeline 51 is provided with a pressure sensor E39 and a temperature sensor E40, and the twelfth pipeline 52 is provided with a pressure sensor C31 and a temperature sensor C32.

[0083] In some examples, the sixth pipe 46 and the seventh pipe 47 may be carbon dioxide powered heat pipes, which together with the plate heat exchanger A26, the cold plate 28, the electromagnetic pump 27, the pressure sensor B29, and the temperature sensor B30 form a power separation heat pipe loop.

[0084] In some examples, the ninth pipe 49 and the tenth pipe 50 may be carbon dioxide gravity heat pipes, which together with the plate heat exchanger B34, the back plate 36, the electric throttle valve C35, the pressure sensor D37, and the temperature sensor D38 constitute a gravity separation heat pipe loop.

[0085] From the above technical solution, it can be seen that the working process of the cooling system provided by the embodiment of the present application is:

[0086] The HFO refrigerant in the low-pressure circulation barrel 20 enters the plate heat exchanger A26 through the fourth and fifth pipes 44 and 45, where it exchanges heat with the carbon dioxide entering through the seventh pipe 47, thereby condensing the carbon dioxide. The HFO refrigerant, having condensed the carbon dioxide, flows out of the plate heat exchanger A26 and enters the twelfth pipe 52. It then returns to the low-pressure circulation barrel 20 through the thirteenth pipe 53 for further circulation. The condensed carbon dioxide in the plate heat exchanger A26 enters the cold plate 28 through the sixth pipe 46, where it evaporates and absorbs heat to cool the server chips. The evaporated carbon dioxide in the cold plate 28 enters the plate heat exchanger A26 through the seventh pipe 47 for condensation, thus completing the carbon dioxide-powered heat pipe cycle.

[0087] The HFO refrigerant in the low-pressure circulation barrel 20 enters the plate heat exchanger B34 through the fourth and eighth pipes 44 and 48, where it exchanges heat with the carbon dioxide entering through the tenth pipe 50, thereby condensing the carbon dioxide. The HFO refrigerant, having condensed the carbon dioxide, flows out of the plate heat exchanger B34 and enters the eleventh pipe 51. It then returns to the low-pressure circulation barrel 20 through the thirteenth pipe 53 for recirculation. The condensed carbon dioxide in the plate heat exchanger B34 enters the backplate 36 through the ninth pipe 49, where it evaporates and absorbs heat to cool the servers. The evaporated carbon dioxide in the backplate 36 enters the plate heat exchanger B34 through the tenth pipe 50 for condensation, thus completing the carbon dioxide gravity heat pipe cycle.

[0088] It can be seen from the above technical solution that the cooling system provided in this application realizes efficient condensation of HFO refrigerant and cooling of CO2 cooling medium by integrating a multi-stage HFO refrigerant condensing device with a liquid cooling distribution unit and the secondary side of the liquid cooling system, thereby providing an effective heat dissipation solution for server chips and servers.

[0089] The multi-stage HFO refrigerant condensing unit serves as the core component of this cooling system. Through its four-stage cooling process, it fully utilizes the heat and moisture exchange between cooling water and air, effectively reducing the temperature of the HFO refrigerant and improving condensation efficiency. Furthermore, the synergistic effect of the liquid cooling distribution unit and the secondary side of the liquid cooling system further enhances the overall performance of the cooling system.

[0090] In addition, the secondary side of the liquid cooling system utilizes two designs: a power-separated heat pipe circuit and a gravity-separated heat pipe circuit, cooling the server chips and servers, respectively. The power-separated heat pipe circuit uses components such as electromagnetic pumps to circulate the carbon dioxide working fluid between the plate heat exchanger and the cold plate, achieving efficient cooling of the server chips. The gravity-separated heat pipe circuit, on the other hand, utilizes the gravity of the carbon dioxide working fluid to circulate naturally between the plate heat exchanger and the backplate, providing stable heat dissipation for the servers.

[0091] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application based on the several embodiments provided in the present application to obtain other embodiments, and these embodiments do not exceed the scope of protection of the present application.

[0092] The above specific implementation methods further explain in detail the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only specific implementation methods of the embodiments of the present application and are not intended to limit the scope of protection of the embodiments of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the scope of protection of the embodiments of the present application.

Claims

1. A multi-stage HFO refrigerant condensing device, characterized in that: include: case; The interior of the shell is divided into a first gas channel and a second gas channel; a first water distributor provided in the first gas channel, for spraying first cooling water into the first gas channel; a spiral water distributor provided between the first gas channel and the second gas channel, the spiral water distributor being used to collect second cooling water passing through the first gas channel and introduce the second cooling water into the second gas channel; the second cooling water being the first cooling water after heat and moisture exchange with the gas flowing through the first gas channel; A second water distributor and a condensing evaporative heat exchanger are provided in the second gas channel; the second gas channel is used to cool the circulating gas using the second cooling water, and use the cooled gas and the third cooling water sprayed from the second water distributor to exchange heat with the HFO refrigerant in the condensing evaporative heat exchanger to condense the gaseous HFO refrigerant into liquid HFO refrigerant.

2. The multi-stage HFO refrigerant condensing device according to claim 1, characterized in that: The housing includes a first air inlet, a second air inlet, a first EC fan unit, and a second EC fan unit; wherein the first air inlet and the second air inlet are located on the same side wall of the housing, and the first air inlet is located above the second air inlet; the first EC fan unit is located on the top surface of the housing; and the second EC fan unit is located on the other side wall of the housing; The first air inlet is located at the entrance of the first gas channel, and the first EC fan unit is located at the outlet of the first gas channel; The second air inlet is located at the entrance of the second gas channel, and the second EC fan unit is located at the outlet of the second gas channel.

3. The multi-stage HFO refrigerant condensing device according to claim 2, characterized in that: A first filler is further provided in the first gas channel. The first water distributor is located above the first filler and is used for uniformly distributing first cooling water on the surface of the first filler.

4. The multi-stage HFO refrigerant condensing device according to claim 3, characterized in that: The first gas channel is further provided with: a first water baffle, the first water baffle being located between the first filler and the first EC fan unit; The water guide groove connected to the spiral water distributor is used to guide the second cooling water in the first gas channel into the spiral water distributor.

5. The multi-stage HFO refrigerant condensing device according to claim 2, characterized in that: A fin-type dew-point heat exchanger and a second filler are sequentially provided in the second gas channel along the direction from the second air inlet to the condensing evaporation heat exchanger; the inner side of the fin-type dew-point heat exchanger is connected to the spiral water distributor; the second filler is located below the spiral water distributor.

6. The multi-stage HFO refrigerant condensing device according to claim 5, characterized in that: A second water baffle is further provided in the second gas channel, and the second water baffle is located between the condensing and evaporating heat exchanger and the second EC fan unit.

7. The multi-stage HFO refrigerant condensing device according to any one of claims 1 to 6, characterized in that: A water tank is provided at the bottom of the shell; the water tank is connected to the first water distributor through a first pipe, and a first water pump is provided on the first pipe; the water tank is connected to the second water distributor through a second pipe, and a second water pump is provided on the second pipe.

8. A cooling system, characterized in that: include: The multi-stage HFO refrigerant condensing device according to any one of claims 1 to 7; Liquid cooling distribution unit; the liquid cooling distribution unit and the condensing evaporation heat exchanger in the multi-stage HFO refrigerant condensing device form a cooling circulation pipeline for the HFO refrigerant, which is used to condense the HFO refrigerant using the multi-stage HFO refrigerant condensing device; The secondary side of the liquid cooling system; the secondary side of the liquid cooling system includes a CO2 circulation pipeline; the liquid cooling distribution unit includes an HFO heat exchange pipeline, and the HFO heat exchange pipeline is used to exchange heat with the CO2 circulation pipeline to cool the CO2 cooling medium in the CO2 circulation pipeline.

9. The cooling system according to claim 8, characterized in that The liquid cooling distribution unit comprises: Low-pressure circulation barrel; the low-pressure circulation barrel is connected to the inlet of the condensing evaporative heat exchanger through the fourteenth pipe, and is connected to the outlet of the condensing evaporative heat exchanger through the third pipe; the low-pressure circulation barrel is connected to the inlet of the secondary side of the liquid cooling system through the fourth pipe, and is connected to the outlet of the secondary side of the liquid cooling system through the thirteenth pipe.

Images