Light-emitting device preparation method, light-emitting device and display panel

Abstract

The invention provides a light-emitting device preparation method, a light-emitting device and a display panel, and the method comprises the steps: preparing a suspension structure on a driving backboard, enabling the suspension structure to be prepared on the driving backboard through a weak connection structure, and enabling the suspension structure to be arranged between two adjacent pixel units, any first planar projection of the suspension structure comprises a second planar projection; preparing a light-emitting layer on the driving back plate; the suspension structure is disconnected from the weak connection structure, and the suspension structure is removed; and preparing the residual film layer on the light-emitting layer. By arranging the overhanging structure, the connection of the light-emitting materials of the two adjacent pixel units can be cut off during the preparation of the light-emitting layer, color cast is avoided, and after the preparation of the light-emitting layer is completed, the overhanging structure is removed, so that the influence of the overhanging structure on subsequent packaging can be avoided.

Description

Technical Field

[0001] The present invention relates to the field of display panels, and in particular to a method for preparing a light-emitting device, a light-emitting device and a display panel. Background Art

[0002] During the OLED (Organic Light-Emitting Diode) production process, luminescent materials are typically deposited using a Fine Metal Mask (FMM) to form the luminescent material pattern. However, due to the limited precision of the FMM, when the PPI of an OLED display is high, the distance between pixels is very close, which can easily cause the luminescent material to shift during evaporation. This can lead to contact between different colors of luminescent materials, resulting in color shift and other problems.

[0003] In the prior art, an overhang structure is usually formed before evaporation to isolate adjacent pixels. Due to the presence of the overhang structure, the light-emitting material is completely disconnected from the opening area and the overhang structure, thereby avoiding the color shift problem.

[0004] However, the presence of the overhanging structure will affect the packaging effect and shorten the life of the OLED display. Summary of the Invention

[0005] The main purpose of the present invention is to provide a method for preparing a light-emitting device, a light-emitting device and a display panel, aiming to solve the problem in the prior art that the presence of an overhanging structure affects the packaging effect.

[0006] To achieve the above object, the present invention provides a method for preparing a light-emitting device, the method comprising: An overhang structure is prepared on a driving backplane, wherein the overhang structure is prepared on the driving backplane via a weak link structure, the overhang structure is disposed between two adjacent pixel units, and any first plane projection of the overhang structure includes a second plane projection, wherein the first plane projection is a projection of a cross section of the overhang structure on the driving backplane corresponding to the first plane, and the second plane projection is a projection of a cross section of the overhang structure on the driving backplane corresponding to the second plane, the first plane and the second plane are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane; preparing a light-emitting layer on the driving backplane; disconnecting the overhanging structure from the weak link structure and removing the overhanging structure; The remaining film layers are prepared on the light-emitting layer.

[0007] Optionally, a pixel definition layer is provided on the driving backplane; and preparing the overhang structure on the driving backplane includes: Coating a photoresist layer on the driving backplane; Digging a hole in the photoresist area on the pixel definition layer to obtain a connection hole, and preparing an overhanging trench, wherein the overhanging trench is electrically connected to the pixel definition layer through the connection hole; Preparing an overhang structure film layer on the photoresist layer to obtain the overhang structure, wherein the overhang structure film layer at the overhang groove constitutes the overhang structure, and the overhang structure film layer at the connection hole constitutes the weak connection structure, wherein the projection of the overhang structure on the pixel definition layer is included in the pixel definition layer; The photoresist layer is removed.

[0008] Optionally, the step of drilling a hole in the photoresist area on the pixel definition layer to obtain a connection hole comprises: forming a first hole in the photoresist region on the pixel definition layer, wherein the first hole is electrically connected to the pixel definition layer; A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than the first hole, and the second hole is connected to the pixel definition layer through the first hole.

[0009] Optionally, the cross section of the overhang structure is an inverted trapezoid, wherein the oblique side of the cross section is arranged opposite to the pixel unit, and the upper bottom side of the cross section is arranged on the driving backplane through the weak connection structure.

[0010] Optionally, disconnecting the overhanging structure from the weak link structure and removing the overhanging structure includes: aligning the auxiliary substrate with the overhang structure, wherein a first adhesive layer is provided on a side of the auxiliary substrate facing the overhang structure; disconnecting the weak link structure; The auxiliary substrate to which the overhanging structure is attached is removed.

[0011] Optionally, a pixel definition layer is provided on the driving backplane; and preparing the overhang structure on the driving backplane includes: preparing a second adhesion layer on the pixel definition layer; affix the auxiliary substrate with the overhang structure attached thereto to the driving backplane, wherein the side with the overhang structure attached thereto faces the driving backplane, and the overhang structure is attached to the second adhesive layer of the pixel definition layer; Debonding the first adhesive layer on the auxiliary substrate; The auxiliary substrate is removed.

[0012] Optionally, attaching the auxiliary substrate with the overhanging structure attached thereto to the driving backplane comprises: Etching the weak connection structure on the overhanging structure to make the weak connection structure flush; The auxiliary substrate with the overhanging structure adhered thereto is attached to the driving backplane.

[0013] Optionally, preparing a remaining film layer on the light-emitting layer includes: preparing a cathode film layer on the light-emitting layer; A packaging layer is prepared on the cathode film layer.

[0014] In addition, to achieve the above object, the present invention also provides a light-emitting device, which is prepared by the light-emitting device preparation method as described above.

[0015] In addition, to achieve the above-mentioned object, the present invention further provides a display panel comprising the above-mentioned light-emitting device.

[0016] The present invention proposes a method for preparing a light-emitting device, a light-emitting device, and a display panel, wherein an overhang structure is prepared on a driving backplane, wherein the overhang structure is prepared on the driving backplane through a weak connection structure, the overhang structure is arranged between two adjacent pixel units, and any first plane projection of the overhang structure includes a second plane projection, wherein the first plane projection is the projection of the cross section of the overhang structure on the driving backplane corresponding to the first plane, and the second plane projection is the projection of the cross section of the overhang structure on the driving backplane corresponding to the second plane, the first plane and the second plane are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane; a light-emitting layer is prepared on the driving backplane; the overhang structure is disconnected from the weak connection structure and removed; and a remaining film layer is prepared on the light-emitting layer. By providing the overhang structure, the connection between the light-emitting materials of two adjacent pixel units can be cut off when the light-emitting layer is prepared to avoid color cast, and the overhang structure is removed after the light-emitting layer is prepared, thereby preventing the overhang structure from affecting subsequent packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] Figure 1 Schematic diagram of the preparation method of the light emitting device of the present invention; Figure 2 A schematic diagram of the preparation of a light-emitting layer in the prior art; Figure 3 A schematic diagram of the preparation of the remaining film layer in the prior art; Figure 4 A schematic diagram of a pixel definition layer in a method for preparing a light-emitting device according to the present invention; Figure 5 Schematic diagram of the photoresist layer in the method for preparing a light-emitting device of the present invention; Figure 6 Schematic diagram of the preparation of the overhanging structure in the method for preparing the light-emitting device of the present invention; Figure 7 A schematic diagram of a photoresist layer in another embodiment of the method for preparing a light-emitting device according to the present invention; Figure 8 Schematic diagram of the auxiliary substrate in the method for preparing a light-emitting device of the present invention; Figure 9 Schematic diagram of removing the overhanging structure in the method for preparing a light-emitting device of the present invention; Figure 10 A schematic diagram of the alignment of the weak link structure in the auxiliary substrate in the method for preparing the light-emitting device of the present invention; Figure 11 Schematic diagram of the second adhesion layer in the method for preparing a light-emitting device of the present invention; Figure 12 Schematic diagram of removing the auxiliary substrate in the method for preparing a light-emitting device of the present invention; Figure 13 Schematic diagram of the light-emitting layer in the method for preparing a light-emitting device of the present invention; Figure 14 Schematic diagram of the remaining film layers in the method for preparing a light-emitting device of the present invention.

[0021] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments.

[0022] Description of Figure Numbers: DETAILED DESCRIPTION

[0023] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The disclosure below provides many different embodiments or examples for implementing different configurations of the present invention. To simplify the disclosure of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

[0025] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only embodiments of a part of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application.

[0026] The present invention provides a method for preparing a light emitting device, see Figure 1 , Figure 1 This is a functional module diagram of an embodiment of a method for preparing a light-emitting device according to the present invention. In this embodiment, the method for preparing a light-emitting device includes: An overhang structure 200 is formed on a driving backplane 100, wherein the overhang structure 200 is formed on the driving backplane 100 via a weak link structure 300, and the overhang structure 200 is disposed between two adjacent pixel units. Any first plane projection of the overhang structure 200 includes a second plane projection, wherein the first plane projection is a projection of a cross section of the overhang structure 200 on the driving backplane 100 corresponding to the first plane, and the second plane projection is a projection of a cross section of the overhang structure 200 on the second plane corresponding to the driving backplane 100. The first plane and the second plane are parallel to the driving backplane 100, and the second plane is closer to the driving backplane 100 than the first plane. A light-emitting layer 400 is prepared on the driving backplane 100; disconnecting the overhanging structure 200 from the weak link structure 300 and removing the overhanging structure 200; A remaining film layer 500 is formed on the light-emitting layer 400 .

[0027] The pixel unit is an independent light-emitting unit, such as a pixel corresponding to a red, green or blue OLED.

[0028] It is understandable that in order to block the light emitting material of the adjacent pixel units, the overhang structure 200 in the prior art is usually arranged in an inverted trapezoidal or inverted triangle shape. Taking the inverted trapezoidal shape as an example, see Figure 2 During the preparation of the light-emitting layer 400, the light-emitting material falls from above and is deposited on the driving backplane 100 to form the light-emitting layer 400. Due to the inverted trapezoidal arrangement of the overhang structure 200, the light-emitting material cannot form a connection between two pixel units on the overhang structure 200, thereby blocking the contact between the light-emitting materials of the two pixel units. Current cannot flow between the two pixel units through the light-emitting material, thereby avoiding the color cast problem. During packaging, the inverted trapezoidal overhang structure 200 will affect the packaging process, see Figure 3 After the overhang structure 200 is set, the encapsulation layer is also affected by the overhang structure 200 and cannot completely fill the bottom of the overhang structure 200. Therefore, an encapsulation gap will be generated near the overhang structure 200, which is easy to cause water vapor intrusion and affect the life of the display panel.

[0029] In this embodiment, a suspension structure 200 is first provided on the driving backplane 100. At the same time, any first plane projection of the suspension structure 200 includes a second plane projection, and the first plane is parallel to the driving backplane 100 and is farther away from the driving backplane 100 relative to the second plane, so that the portion of the suspension structure 200 closer to the driving backplane 100 is smaller, and the portion farther away from the driving backplane 100 is larger. At the same time, the lower portion does not exceed the upper portion, so that an extension toward the pixel unit can appear on the suspension structure 200, so that the side of the suspension structure 200 body constitutes an isolation space 600 for the light-emitting material; the specific material of the suspension structure 200 can be set based on actual needs. Since the suspension structure 200 needs to be removed later, a brittle material such as silicon nitride SiNx can be used; the specific size of the suspension structure 200 can be set based on actual needs, such as 3um.

[0030] On the basis of the arrangement of the overhang structure 200 , the light-emitting layer 400 is prepared, so that the overhang structure 200 can cut off the connection between the light-emitting materials of two adjacent pixel units to avoid color cast.

[0031] The weak connection structure 300 is a structure with relatively weak connection strength.

[0032] After the light-emitting layer 400 is prepared, if the remaining film layer 500 is prepared directly, the overhang structure 200 will affect the package and generate a package gap during preparation; therefore, in order to avoid the influence of the overhang structure 200 on the package, a weak connection structure 300 is provided in this embodiment to connect the driving backplane 100 and the overhang structure 200; and after the light-emitting layer 400 is prepared, the overhang structure 200 is disconnected at the weak connection structure 300, so that the overhang structure 200 can be removed; after the overhang structure 200 is removed, the package will not be affected by the overhang structure 200, so that the complete preparation of the package can be achieved.

[0033] The remaining film layers 500 include the remaining film layers above the light-emitting layer 400 ; the remaining film layers 500 include cathode film layers, encapsulation layer layers, and the like.

[0034] In this embodiment, by providing an overhang structure 200, the connection between the light-emitting materials of two adjacent pixel units can be cut off when the light-emitting layer 400 is prepared, thereby avoiding color cast. After the light-emitting layer 400 is prepared, the overhang structure 200 is removed, thereby avoiding the overhang structure 200 from affecting subsequent packaging.

[0035] Further, see Figure 4 The driving backplane 100 is provided with a pixel definition layer 700; the preparation of the overhang structure 200 on the driving backplane 100 includes: Coating a photoresist layer 800 on the driving backplane 100; A connection hole 810 is formed by drilling a hole in the photoresist area on the pixel definition layer 700 , and an overhanging trench 820 is formed. The overhanging trench 820 is electrically connected to the pixel definition layer 700 through the connection hole 810 . A film layer of an overhang structure 200 is formed on the photoresist layer 800 to obtain the overhang structure 200, wherein the film layer of the overhang structure 200 at the overhang trench 820 constitutes the overhang structure 200, and the film layer of the overhang structure 200 at the connection hole 810 constitutes the weak link structure 300, wherein the projection of the overhang structure 200 on the pixel definition layer 700 is included in the pixel definition layer 700; The photoresist layer 800 is removed.

[0036] The PDL (Pixel Definition Layer) 700 is used to define and separate each pixel unit in the OLED display; and the overhang structure 200 is also set to isolate adjacent pixel units. Therefore, preparing the overhang structure 200 on the PDL can meet the setting requirements for pixel unit separation.

[0037] It can be understood that the pixel definition layer 700 is set based on the actual pixel separation needs, and the pixel units constructed by the pixel definition layer 700 need to be prepared with the light-emitting layer 400. Therefore, in order to avoid the overhang structure 200 affecting the preparation of the light-emitting layer 400 in the pixel unit, the projection of the overhang structure 200 on the pixel definition layer 700 is set to be included in the pixel definition layer 700, so that the light-emitting layer 400 can be completely prepared in the pixel unit.

[0038] The specific structure of the pixel definition layer 700 can be set based on actual needs. For example, if the interface of the pixel definition layer 700 is a trapezoid, the lower base of the trapezoidal cross section is set on the driving backplane 100; then, in the specific setting, the upper base of the cross section of the overhang structure 200 can be set smaller than the upper base of the pixel definition layer 700. Since the farther the center of the overhang structure 200 is from the plane of the driving backplane 100, the larger the corresponding plane projection is, the overhang structure 200 as a whole can be ensured not to exceed the area of ​​the pixel definition layer 700.

[0039] See also Figure 5 The photoresist layer 800 is used to construct a manufacturing support for the overhang structure 200 and the weak link structure 300. The specific material and preparation method of the photoresist layer 800 can be set based on actual needs. It is understandable that the photoresist layer 800 needs to be removed later. Therefore, the preparation material of the photoresist layer 800 can be set to an easily removable material, such as a photoresist material, which can be coated and photolithographically obtained.

[0040] It is understood that the overhang structure 200 needs to be connected to the pixel definition layer 700 via the weak link structure 300. If it is directly fabricated on the photoresist layer 800, it will be blocked by the photoresist layer 800 and unable to contact the pixel definition layer 700. Therefore, it is necessary to provide a fabrication location for the weak link structure 300 and the overhang structure 200 on the photoresist layer 800. Specifically, for the weak link structure 300, a hole is dug in the photoresist layer 800 to form a connection hole 810. Since the weak link structure 300 needs to directly contact the pixel definition layer 700, when digging the hole, the photoresist region on the pixel definition layer 700 is hollowed out, so that the resulting connection hole 810 can contact the pixel definition layer 700. The photoresist region is the region of the photoresist layer 800 located above the pixel definition layer 700. The specific type of connection hole 810 can be set based on actual needs, such as a cylindrical hole or a prismatic hole. The specific size and number of the connection holes 810 can be set based on actual needs, such as setting two connection holes 810 symmetrically based on the pixel definition layer 700. The specific method of digging the holes can be set based on actual needs, such as etching.

[0041] See also Figure 6After the connection hole 810 is dug, the overhang structure 200 is constructed. Specifically, an overhang trench 820 is formed on the connection hole 810. The overhang trench 820 does not directly contact the pixel definition layer 700, but is connected to the pixel definition layer 700 through the connection hole 810. Therefore, on this basis, the film layer of the overhang structure 200 is prepared, so that after the overhang material is filled into the connection hole 810 and the overhang trench 820, the overhang structure 200 and the weak link structure 300 are formed. The distance between the overhang structure 200 and the pixel definition layer 700, that is, the length of the weak link structure 300, can be set based on actual needs, such as less than 500nm.

[0042] Further, see Figure 7 The step of drilling a hole in the photoresist area on the pixel definition layer 700 to obtain a connection hole 810 includes: forming a first hole in the photoresist region on the pixel definition layer 700 , wherein the first hole is electrically connected to the pixel definition layer 700 ; A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than the first hole, and the second hole is connected to the pixel definition layer 700 through the first hole.

[0043] In this embodiment, in the preparation of the weak link structure 300, the connection hole 810 includes multiple holes, and the holes with smaller diameters are closer to the pixel definition layer 700; thus, the prepared weak link structure 300 is composed of multiple supporting steps, and the closer to the pixel definition layer 700, the smaller the diameter of the steps, making the weak link structure 300 easier to break.

[0044] The specific number of hollowing out can also be set based on actual application needs.

[0045] Furthermore, the cross section of the overhang structure 200 is an inverted trapezoid, wherein the hypotenuse of the cross section is arranged opposite to the pixel unit, and the upper bottom edge of the cross section is arranged on the driving backplane 100 through the weak connection structure 300 .

[0046] It is understandable that the upper base of the trapezoid is smaller than the lower base. Therefore, by setting the cross section of the overhanging base to be an inverted trapezoid, an isolation space 600 can be provided in the overhanging base itself, thereby generating a packaging gap.

[0047] In other embodiments, the cross-section of the overhanging base may be set to other shapes, such as setting the cross-section of the trapezoid to be a trapezoid and setting the inclined surface of the trapezoid to be an arc edge.

[0048] Further, see Figure 8, disconnecting the overhanging structure 200 from the weak link structure 300 and removing the overhanging structure 200 includes: Attaching the auxiliary substrate 900 to the overhang structure 200 , wherein a first adhesive layer 910 is provided on the side of the auxiliary substrate 900 facing the overhang structure 200 ; Disconnecting the weak link structure 300; The auxiliary substrate 900 to which the overhanging structure 200 is attached is removed.

[0049] See also Figure 9 A first adhesive layer 910 is provided on the auxiliary substrate 900. The auxiliary substrate 900 and the overhang structure 200 are aligned, so that the first adhesive layer 910 adheres to the overhang structure 200. When the auxiliary substrate 900 is removed, the overhang structure 200 adheres to the first adhesive layer 910. Therefore, the overhang structure 200 is pulled by the auxiliary substrate 900 and separated from the weak link structure 300, and is removed along with the auxiliary substrate 900. To facilitate the removal of the overhang structure 200, the weak link structure 300 is made of a brittle material such as silicon nitride SiNx or silicon oxide SiOx.

[0050] In order to ensure that the auxiliary substrate 900 can remove the overhang arm from the overhang base, when setting the first adhesive layer 910, the first adhesive layer 910 can be made of a material with a viscosity greater than the fixing force of the weak connection structure 300; the specific material can be set based on actual needs.

[0051] Further, see Figure 11 The driving backplane 100 is provided with a pixel definition layer 700; the preparation of the overhang structure 200 on the driving backplane 100 includes: preparing a second adhesion layer 710 on the pixel definition layer 700; The auxiliary substrate 900 with the overhang structure 200 attached thereto is attached to the driving backplane 100 , wherein the side with the overhang structure 200 attached thereto faces the driving backplane 100 , and the overhang structure 200 is attached to the second adhesive layer of the pixel definition layer 700 ; The first adhesive layer 910 on the auxiliary substrate 900 is debonded; The auxiliary substrate 900 is removed.

[0052] It can be understood that after the overhang structure 200 is removed, the removed overhang structure 200 is still a complete overhang structure 200; in order to reduce material consumption and save costs, the removed overhang structure 200 can be reused, and the overhang structure 200 removed by the auxiliary substrate 900 in the previous preparation can be used as the overhang structure 200 of the newly prepared light-emitting device.

[0053] Specifically, since the overhang structure 200 on the auxiliary substrate 900 is adhered from the actually prepared light-emitting device, the overhang structure 200 corresponds to the pixel definition layer 700 on the driving substrate of the same model; and the overhang structure 200 needs to be set on the pixel definition layer 700, therefore, a second adhesion layer 710 is prepared on the pixel definition layer 700, and the auxiliary substrate 900 is attached to the driving backplane 100, so that the overhang structure 200 on the auxiliary substrate 900 is in contact with the second adhesion layer 710; since the auxiliary substrate 900 is equipped with a first adhesion layer 910, in order to enable the overhang structure 200 to be separated from the first adhesion layer 910, the first adhesion layer 910 needs to be debonded; the specific debonding method can be set based on actual needs, such as laser debonding, thermal debonding, etc.

[0054] See also Figure 12 After the first adhesive layer 910 is debonded, the overhang structure 200 is detached from the first adhesive layer 910 . At this time, the auxiliary substrate 900 is removed, and the overhang structure 200 is adhered to the second adhesive layer 710 , completing the preparation of the overhang structure 200 .

[0055] Furthermore, the step of attaching the auxiliary substrate 900 with the overhang structure 200 attached thereto to the driving backplane 100 includes: Etching the weak connection structure 300 on the overhang structure 200 to make the weak connection structure 300 flush; The auxiliary substrate 900 with the overhang structure 200 attached thereto is attached to the driving backplane 100 .

[0056] See also Figure 10 It can be understood that the overhang structure 200 is removed by disconnecting the auxiliary substrate 900 from the weak connection structure 300. Therefore, the removed overhang structure 200 will include a portion of the weak connection structure 300, and the weak connection structure 300 is broken and uneven. Therefore, in order to enable the overhang structure 200 to adhere smoothly to the second adhesion layer 710, in this embodiment, the weak connection structure 300 on the overhang structure 200 is first etched to make the weak connection structure 300 flush, so that the overhang structure 200 can be stably adhered to the second adhesion layer 710 through the flush weak connection structure 300.

[0057] It should be noted that since the overhang structure 200 needs to be etched each time it is reused, the length of the weak link structure 300 on the overhang structure 200 will gradually shorten. When the weak link structure 300 is too short, it is difficult to break it. Therefore, the length of the weak link structure 300 on the overhang structure 200 can be detected. When it is detected that the length of the weak link structure 300 on the overhang structure 200 is less than the preset length threshold, the overhang structure 200 will no longer be reused.

[0058] In other embodiments, when the overhang structure 200 is connected to the pixel definition layer 700 through the second adhesion layer 710, when removing the overhang structure 200, after the overhang structure 200 is adhered to the first adhesion layer 910, the overhang structure 200 can be removed by debonding the second adhesion layer 710; in this way, in the subsequent reuse of the overhang structure 200, there is no need to etch the overhang structure 200, and the length of the weak connection structure 300 will not be shortened, so it can be reused more times.

[0059] Furthermore, the step of preparing the remaining film layer 500 on the light-emitting layer 400 includes: Preparing a cathode film layer on the light-emitting layer 400; A packaging layer is prepared on the cathode film layer.

[0060] After the light-emitting layer 400 is prepared, the cathode film layer is prepared first to realize the structure of the pixel unit. After the pixel unit structure is prepared, the encapsulation layer is prepared to realize the preparation of the light-emitting device.

[0061] The specific preparation method of the cathode film layer and the encapsulation layer can be set based on actual needs; it is understandable that, in addition to the cathode film layer and the encapsulation layer, other film layers can be prepared on the light-emitting layer 400 based on actual needs.

[0062] The overall preparation process of this application is described below: 1. Complete the preparation of the driving backplane 100 and the pixel definition layer 700; 2. See Figure 5 , coating a photoresist layer 800 on the pixel definition layer 700 , drilling holes in the photoresist region on the pixel definition layer 700 to obtain connection holes 810 , and preparing overhanging trenches 820 ; 3. See Figure 6 , preparing a film layer of the overhang structure 200 on the photoresist layer 800 to obtain the overhang structure 200 and the weak link structure 300; 4. See Figure 13 , preparing a light-emitting layer 400, where the light-emitting material of the light-emitting layer 400 is discontinuous between adjacent pixel units due to the presence of the overhanging structure 200; 5. See Figure 8 , the auxiliary substrate 900 is attached to the overhang structure 200 , and the first adhesive layer 910 adheres to the overhang structure 200 ; 6. See Figure 9 , the auxiliary substrate 900 is removed. Since the overhanging structure 200 is adhered to the first adhesive layer 910 , the overhanging structure 200 is pulled by the auxiliary substrate 900 and separated from the weak link structure 300 , and is removed together with the auxiliary substrate 900 ; 7. See Figure 14 , prepare the remaining film layer 500.

[0063] The present invention further protects a light-emitting device, which is prepared by the light-emitting device preparation method as described above, and the light-emitting device preparation method comprises: An overhang structure is prepared on a driving backplane, wherein the overhang structure is prepared on the driving backplane via a weak link structure, the overhang structure is disposed between two adjacent pixel units, and any first plane projection of the overhang structure includes a second plane projection, wherein the first plane projection is a projection of a cross section of the overhang structure on the driving backplane corresponding to the first plane, and the second plane projection is a projection of a cross section of the overhang structure on the driving backplane corresponding to the second plane, the first plane and the second plane are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane; preparing a light-emitting layer on the driving backplane; disconnecting the overhanging structure from the weak link structure and removing the overhanging structure; The remaining film layers are prepared on the light-emitting layer.

[0064] Furthermore, a pixel definition layer is provided on the driving backplane; and preparing the overhang structure on the driving backplane includes: Coating a photoresist layer on the driving backplane; Digging a hole in the photoresist area on the pixel definition layer to obtain a connection hole, and preparing an overhanging trench, wherein the overhanging trench is electrically connected to the pixel definition layer through the connection hole; Preparing an overhang structure film layer on the photoresist layer to obtain the overhang structure, wherein the overhang structure film layer at the overhang groove constitutes the overhang structure, and the overhang structure film layer at the connection hole constitutes the weak connection structure, wherein the projection of the overhang structure on the pixel definition layer is included in the pixel definition layer; The photoresist layer is removed.

[0065] Furthermore, the step of drilling a hole in the photoresist area on the pixel definition layer to obtain a connection hole comprises: forming a first hole in the photoresist region on the pixel definition layer, wherein the first hole is electrically connected to the pixel definition layer; A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than the first hole, and the second hole is connected to the pixel definition layer through the first hole.

[0066] Furthermore, the cross section of the overhang structure is an inverted trapezoid, wherein the oblique side of the cross section is arranged opposite to the pixel unit, and the upper bottom side of the cross section is arranged on the driving backplane through the weak connection structure.

[0067] Furthermore, disconnecting the overhanging structure from the weak link structure and removing the overhanging structure includes: aligning the auxiliary substrate with the overhang structure, wherein a first adhesive layer is provided on a side of the auxiliary substrate facing the overhang structure; disconnecting the weak link structure; The auxiliary substrate to which the overhanging structure is attached is removed.

[0068] Furthermore, a pixel definition layer is provided on the driving backplane; and preparing the overhang structure on the driving backplane includes: preparing a second adhesion layer on the pixel definition layer; affix the auxiliary substrate with the overhang structure attached thereto to the driving backplane, wherein the side with the overhang structure attached thereto faces the driving backplane, and the overhang structure is attached to the second adhesive layer of the pixel definition layer; Debonding the first adhesive layer on the auxiliary substrate; The auxiliary substrate is removed.

[0069] Furthermore, the step of attaching the auxiliary substrate having the overhanging structure attached thereto to the driving backplane includes: Etching the weak connection structure on the overhanging structure to make the weak connection structure flush; The auxiliary substrate with the overhanging structure adhered thereto is attached to the driving backplane.

[0070] Furthermore, the step of preparing a remaining film layer on the light-emitting layer comprises: preparing a cathode film layer on the light-emitting layer; A packaging layer is prepared on the cathode film layer.

[0071] The present invention also protects a display panel comprising the light-emitting device as described above.

[0072] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a..." does not exclude the presence of other identical elements in the process, method, article or system comprising the element. The serial numbers of the above-mentioned embodiments of the present invention are for description only and do not represent the advantages and disadvantages of the embodiments.

[0073] In the present invention, the terms "first", "second", "third", "fourth" and "fifth" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0074] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

Claims

1. A method for preparing a light-emitting device, characterized in that: The light emitting device preparation method comprises: An overhang structure is prepared on a driving backplane, wherein the overhang structure is prepared on the driving backplane via a weak link structure, the overhang structure is disposed between two adjacent pixel units, and any first plane projection of the overhang structure includes a second plane projection, wherein the first plane projection is a projection of a cross section of the overhang structure on the driving backplane corresponding to the first plane, and the second plane projection is a projection of a cross section of the overhang structure on the driving backplane corresponding to the second plane, the first plane and the second plane are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane; preparing a light-emitting layer on the driving backplane; disconnecting the overhanging structure from the weak link structure and removing the overhanging structure; The remaining film layers are prepared on the light-emitting layer.

2. The method for preparing a light-emitting device according to claim 1, wherein: The driving backplane is provided with a pixel definition layer; and the preparation of the overhang structure on the driving backplane includes: Coating a photoresist layer on the driving backplane; Digging a hole in the photoresist area on the pixel definition layer to obtain a connection hole, and preparing an overhanging trench, wherein the overhanging trench is electrically connected to the pixel definition layer through the connection hole; Preparing an overhang structure film layer on the photoresist layer to obtain the overhang structure, wherein the overhang structure film layer at the overhang groove constitutes the overhang structure, and the overhang structure film layer at the connection hole constitutes the weak connection structure, wherein the projection of the overhang structure on the pixel definition layer is included in the pixel definition layer; The photoresist layer is removed.

3. The method for preparing a light-emitting device according to claim 2, wherein: The step of drilling a hole in the photoresist area on the pixel definition layer to obtain a connection hole comprises: forming a first hole in the photoresist region on the pixel definition layer, wherein the first hole is electrically connected to the pixel definition layer; A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than the first hole, and the second hole is connected to the pixel definition layer through the first hole.

4. The method for preparing a light-emitting device according to claim 1, wherein: The cross section of the overhang structure is an inverted trapezoid, wherein the oblique side of the cross section is arranged opposite to the pixel unit, and the upper bottom side of the cross section is arranged on the driving backplane through the weak connection structure.

5. The method for preparing a light-emitting device according to claim 1, wherein: The step of disconnecting the overhanging structure from the weak link structure and removing the overhanging structure includes: aligning the auxiliary substrate with the overhang structure, wherein a first adhesive layer is provided on a side of the auxiliary substrate facing the overhang structure; disconnecting the weak link structure; The auxiliary substrate to which the overhanging structure is attached is removed.

6. The method for preparing a light-emitting device according to claim 1, wherein: The driving backplane is provided with a pixel definition layer; and the preparation of the overhang structure on the driving backplane includes: preparing a second adhesion layer on the pixel definition layer; affix the auxiliary substrate with the overhang structure attached thereto to the driving backplane, wherein the side with the overhang structure attached thereto faces the driving backplane, and the overhang structure is attached to the second adhesive layer of the pixel definition layer; Debonding the first adhesive layer on the auxiliary substrate; The auxiliary substrate is removed.

7. The method for preparing a light-emitting device according to claim 6, wherein: The step of attaching the auxiliary substrate having the overhanging structure attached thereto to the driving backplane comprises: Etching the weak connection structure on the overhanging structure to make the weak connection structure flush; The auxiliary substrate with the overhanging structure adhered thereto is attached to the driving backplane.

8. The method for preparing a light-emitting device according to claim 1, wherein: The preparing of the remaining film layer on the light-emitting layer comprises: preparing a cathode film layer on the light-emitting layer; A packaging layer is prepared on the cathode film layer.

9. A light emitting device, characterized in that: The light-emitting device is prepared by the light-emitting device preparation method according to claims 1 to 8.

10. A display panel, characterized in that: The light emitting device according to claim 9 is included.

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