Wafer detection equipment and method
By designing a wafer inspection device that includes front and back inspection devices, using transparent liquid to soak the blue film and moving the module to adjust the distance of the optical module, the problems of the existing technology that wafer inspection equipment cannot simultaneously inspect the front and back sides and the imaging difficulties are solved, and high-precision and automated inspection effects are achieved.
Patent Information
- Application Number
- CN202511258543.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-04
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2045-09-04
AI Technical Summary
Existing wafer inspection equipment cannot simultaneously and efficiently detect defects on the front and back of the wafer, especially defects on the back. Imaging is difficult due to the frosted texture of the blue film, and the sagging problem caused by flipping inspection affects the accuracy and stability of inspection, making it difficult to achieve automated inspection.
A wafer inspection device is designed, which includes front and back inspection devices. The back inspection device uses a transparent liquid in the support part to soak the blue film on the back of the wafer to reduce light scattering, and adjusts the distance between the optical module and the wafer by moving the module to avoid sagging effects, thereby achieving high-precision inspection without flipping.
It achieves simultaneous high-precision detection of the front and back sides of the wafer, solves the problems of blue film imaging obstacles and sagging, meets the needs of automated and efficient detection, and improves the accuracy and stability of detection.