Wafer production line dispatching method and device, computer equipment and medium

Abstract

The invention provides a dispatching method and device for a wafer production line, computer equipment and a medium, and the method comprises the steps: obtaining a dispatching request for a to-be-dispatched machine table on the wafer production line, responding to the dispatching request, respectively obtaining dispatching priorities of multiple groups of to-be-processed wafers corresponding to the to-be-dispatched machine table, and sending the dispatching priorities to the to-be-processed machine table; and according to the dispatching priorities of the multiple groups of to-be-processed wafers, dispatching dispatching is carried out on the multiple groups of to-be-processed wafers, so that the multiple groups of to-be-processed wafers are all dispatched to a to-be-dispatched machine table and then corresponding process processing is carried out. Therefore, through dispatching priority calculation, the obtained dispatching priority is combined with the information of the to-be-processed wafer, and subsequent scheduling processing can be carried out in real time based on the condition of the to-be-processed wafer, so that corresponding process processing is carried out after a plurality of groups of to-be-processed wafers are all scheduled to the to-be-dispatched machine; and the productivity and the machine utilization rate of the to-be-dispatched machine are further improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically, to a method, apparatus, computer equipment, and medium for dispatching and scheduling wafer production lines. Background Art

[0002] In the semiconductor production process, dispatching is a key link in optimizing the production process, improving efficiency and yield. By allocating and scheduling semiconductor production tasks, production efficiency can be improved, production costs can be reduced, and product quality can be guaranteed.

[0003] In the related art, after a group of wafers completes the pre-processing, they are directly dispatched to a machine corresponding to the post-processing, and the machine is dispatched to perform the post-processing on this group of wafers.

[0004] However, since the number of wafer groups that can be processed simultaneously by a process tool is not limited to one group, the above-mentioned dispatching and scheduling method may result in waste of process tool production capacity and low utilization rate. Summary of the Invention

[0005] In view of this, embodiments of the present application provide a method, apparatus, computer equipment, and medium for dispatching and scheduling wafer production lines to solve the problems of wasteful production capacity and low utilization of process tools.

[0006] In a first aspect, an embodiment of the present application provides a method for dispatching and scheduling wafer production lines, comprising:

[0007] Obtain dispatch requests for machines to be dispatched on the wafer production line;

[0008] In response to the dispatch request, respectively obtaining dispatch priorities of a plurality of groups of wafers to be processed corresponding to the machines to be dispatched;

[0009] According to the dispatching priorities of the plurality of groups of wafers to be processed, the plurality of groups of wafers to be processed are dispatched respectively, so that all the plurality of groups of wafers to be processed are dispatched to the machines to be dispatched for corresponding process processing.

[0010] In an optional embodiment, respectively obtaining the dispatching priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched includes:

[0011] Obtaining wafer information of each group of wafers to be processed and equipment information of current processing machines of each group of wafers to be processed on the wafer production line;

[0012] According to the wafer information and the equipment information of the current processing machine, the dispatching priority of each group of wafers to be processed is obtained.

[0013] In an optional embodiment, obtaining the dispatching priority of each group of wafers to be processed based on the wafer information and the equipment information of the current processing machine includes:

[0014] Obtaining first dispatch parameters of each group of wafers to be processed relative to the current processing tool according to the equipment information of the current processing tool;

[0015] According to the wafer information, obtaining second dispatch parameters of each group of wafers to be processed relative to the wafer batch;

[0016] Obtain the dispatch priority of each group of wafers to be processed according to the first dispatch parameter and the second dispatch parameter.

[0017] In an optional embodiment, the equipment information of the current processing machine includes: equipment utilization rate, equipment downtime risk factor, and equipment idle time. The obtaining, based on the equipment information of the current processing machine, first dispatching parameters of each group of wafers to be processed relative to the current processing machine includes:

[0018] The first work dispatching parameter is calculated according to the equipment utilization rate, the equipment downtime risk coefficient, the equipment idle time and a preset idle time threshold.

[0019] In an optional embodiment, the wafer information includes: processing priorities of the groups of wafers to be processed and wafer batch data corresponding to the groups of wafers to be processed, and obtaining the second dispatch parameters of the groups of wafers to be processed relative to the wafer batch based on the wafer information includes:

[0020] The second dispatch parameter is calculated according to the processing priority and the wafer batch data.

[0021] In an optional embodiment, the dispatching of the plurality of groups of wafers to be processed respectively according to their dispatching priorities includes:

[0022] Determining the dispatch order of each group of wafers to be processed according to the dispatch priority of each group of wafers to be processed, the current processing status of each group of wafers to be processed, and the preset process interval time between the machine to be dispatched and the current processing machine of each group of wafers to be processed, wherein the current processing status is the processing status of each group of wafers to be processed under the current processing machine;

[0023] According to the dispatching sequence, the plurality of groups of wafers to be processed are dispatched in sequence.

[0024] In an optional embodiment, before respectively obtaining the dispatch priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched in response to the dispatch request, the method further includes:

[0025] In response to a wafer information input operation input through the visual interface, determining a plurality of groups of input wafers;

[0026] In response to the process information of the plurality of groups of input wafers input through the visualization interface, the plurality of groups of wafers to be processed are determined from the plurality of groups of input wafers.

[0027] In a second aspect, an embodiment of the present application further provides a device for dispatching and scheduling wafer production lines, comprising:

[0028] An acquisition module is used to obtain a dispatch request for a machine to be dispatched on a wafer production line;

[0029] The acquisition module is further configured to respectively acquire the dispatching priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched in response to the dispatching request;

[0030] The scheduling module is used to schedule the multiple groups of wafers to be processed according to their dispatch priorities, so as to schedule all the multiple groups of wafers to be processed to the machines to be dispatched for corresponding process processing.

[0031] In a third aspect, an embodiment of the present application further provides a computer device comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the computer device is running, the processor communicates with the memory through the bus, and the processor executes the machine-readable instructions to execute any one of the methods described in the first aspect.

[0032] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the method described in any one of the first aspects is executed.

[0033] The present application provides a method, device, computer equipment and medium for dispatching a wafer production line, wherein the method includes: obtaining a dispatch request for a machine to be dispatched on the wafer production line, and in response to the dispatch request, respectively obtaining the dispatch priorities of multiple groups of wafers to be processed corresponding to the machine to be dispatched, and dispatching the multiple groups of wafers to be processed according to the dispatch priorities of the multiple groups of wafers to be processed, so that all the multiple groups of wafers to be processed are dispatched to the machine to be dispatched and then subjected to corresponding process processing. Thus, through the dispatch priority calculation, the dispatch priority obtained is combined with the information of the wafers to be processed, and subsequent dispatch processing can be performed in real time based on the situation of the wafers to be processed, so that all the multiple groups of wafers to be processed are dispatched to the machine to be dispatched before the corresponding process processing is performed, thereby improving the capacity utilization rate of the machine to be dispatched. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 1 ;

[0036] Figure 2 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 2 ;

[0037] Figure 3 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 3 ;

[0038] Figure 4 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 4 ;

[0039] Figure 5 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 5 ;

[0040] Figure 6 A schematic diagram of the structure of a wafer production line dispatching and scheduling device provided in an embodiment of the present application;

[0041] Figure 7 A schematic diagram of the structure of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0043] Before introducing the technical solution of this application, the application scenarios involved in this application are first described.

[0044] During the wafer manufacturing process, a wafer production line is typically equipped with a variety of machines corresponding to different steps in the wafer manufacturing process. These machines are divided into different tasks and work together according to the process flow (such as photolithography, etching, deposition, diffusion, ion implantation, polishing, cleaning, etc.) to complete the process of wafer manufacturing. The types of machines may include, for example, photolithography machines, etchers, deposition equipment, diffusion furnaces, ion implanters, chemical mechanical polishing equipment, cleaning equipment, etc., and there may be multiple of each type of machine. Among them, the photolithography machine is used to transfer the circuit pattern to the wafer surface through photoresist exposure, the etcher is used to remove the material in a specific area using plasma or chemical solution, the deposition equipment is used to deposit an insulating layer, a conductive layer, or a semiconductor layer on the wafer surface, the diffusion furnace is used to achieve the diffusion of dopant atoms through high-temperature heat treatment and adjust the electrical properties of the wafer, the ion implanter is used to implant dopant ions into a specific area of ​​the wafer at high speed to form a PN junction, the chemical mechanical polishing equipment is used to flatten the wafer surface through mechanical grinding and chemical etching, and the cleaning equipment is used to remove particles, organic matter, metal contaminants, and residual chemicals on the wafer surface.

[0045] It is worth noting that wafers usually exist in the form of lots. Lot refers to a group of wafers placed in a container. These wafers usually belong to the same batch and have the same production process and product parameters. In other words, processing wafers refers to processing a group of wafers in the lot.

[0046] In the prior art, after a tool completes pre-processing on a group of wafers within a lot, a human operator selects a tool corresponding to the subsequent processing and dispatches that group of wafers directly to that tool. This tool is then dispatched to perform subsequent processing on this group of wafers. However, because some tools can process more than one group (lot) of wafers simultaneously—for example, a diffusion furnace can process multiple lots simultaneously—using this dispatching method can lead to wasted tool capacity and low capacity utilization.

[0047] Based on this, the present application responds to dispatch requests for machines to be dispatched, obtains the dispatch priorities of multiple groups of wafers to be processed corresponding to the machines to be dispatched, and dispatches the multiple groups of wafers to be processed, so that all the multiple groups of wafers to be processed are dispatched to the machines to be dispatched and then subjected to corresponding process processing. Thus, through dispatch priority calculation, the dispatch priority obtained is combined with the information of the wafers to be processed, and subsequent scheduling can be performed in real time based on the situation of the wafers to be processed, so that all the multiple groups of wafers to be processed are dispatched to the machines to be dispatched before the corresponding process processing is carried out, thereby improving the production capacity and utilization rate of the machines to be dispatched.

[0048] The following describes the wafer production line dispatching and scheduling method provided by the present application in conjunction with several embodiments.

[0049] Figure 1 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 1 The execution subject of this embodiment may be a computer device, such as a server, on which a Manufacturing Execution System (MES) that integrates and coordinates all manufacturing systems may be deployed.

[0050] like Figure 1 As shown, the method may include:

[0051] S101: Obtain a dispatch request for a machine to be dispatched on a wafer production line.

[0052] The machine to be dispatched is any machine in any processing node (process flow) on the wafer production line, such as a diffusion furnace. When the machine to be dispatched is idle, the machine to be dispatched can initiate a dispatch request for the machine to be dispatched. Accordingly, the MES system can be used to receive the dispatch request.

[0053] In some embodiments, an automatic machine availability management (AMA) module can be used to periodically scan the load status (Loading Port, LP) of the machine to be dispatched. If the load status indicates that the machine to be dispatched is in an idle state, that is, there are no processable wafers on the machine to be dispatched, the AMA module is used to send a dispatch request for the machine to be dispatched to the MES system.

[0054] S102 , in response to the dispatch request, respectively obtaining dispatch priorities of multiple groups of wafers to be processed corresponding to the machines to be dispatched.

[0055] The multiple groups of wafers to be processed corresponding to the machine to be dispatched may be wafer groups pre-configured to the machine to be dispatched. The wafer groups may be processed simultaneously. A group of wafers to be processed refers to a lot.

[0056] The current processing machine for multiple groups of wafers to be processed can be a predecessor machine to the machine to be dispatched. The processing corresponding to the predecessor machine precedes the processing corresponding to the machine to be dispatched. For example, if the machine to be dispatched is a diffusion furnace, the predecessor machine can be a deposition equipment. In other words, the diffusion process for multiple groups of wafers to be processed precedes the deposition process.

[0057] In this embodiment, while a preceding machine is processing multiple groups of wafers to be processed, multiple groups of wafers to be processed that can be processed simultaneously can be pre-assigned to the machine to be dispatched, thereby pre-assembling the multiple groups of wafers to be processed for the machine to be dispatched. The multiple groups of wafers to be processed are referred to as a batch, and a batch includes multiple groups of wafers to be processed.

[0058] In this embodiment, the steps (process steps), recipes (process parameters), products, etc. of the multiple groups of wafers to be processed that constitute a batch are the same.

[0059] Specifically, when pre-assigning multiple groups of wafers to be processed that can be processed simultaneously to the dispatching machines, the step, recipe, and product of each group of wafers to be processed on the wafer production line can be determined to determine that multiple groups of wafers to be processed that meet the same step, recipe, and product form a batch.

[0060] In this embodiment, the MES system obtains the dispatching priorities of the multiple groups of wafers to be processed corresponding to the machines to be dispatched in response to the dispatching request, and performs dispatching scheduling based on the dispatching priorities.

[0061] Among them, the dispatch priority refers to the priority of scheduling each group of wafers to be processed among multiple groups of wafers to be processed corresponding to the machines to be dispatched. The higher the dispatch priority, the earlier the dispatch, and the lower the dispatch priority, the later the dispatch.

[0062] In some embodiments, in response to a dispatch request, the MES system calls a Dynamic Dispatching Efficiency Index (DDEI) module to calculate and determine the dispatch priority of each group of wafers to be processed.

[0063] S103 , dispatching the plurality of groups of wafers to be processed respectively according to their dispatching priorities, so as to dispatch all of the plurality of groups of wafers to be processed to the dispatching machines for corresponding process processing.

[0064] In this embodiment, the multiple groups of wafers to be processed are dispatched in sequence according to their dispatch priorities until all the multiple groups of wafers to be processed are dispatched to the machines to be dispatched, and then the multiple groups of wafers to be processed are simultaneously subjected to corresponding process processing on the machines to be dispatched.

[0065] For example, if the machine to be dispatched is a diffusion furnace, multiple groups of wafers to be processed are dispatched to the diffusion furnace according to the dispatch priority, so that the diffusion furnace performs diffusion process on multiple groups of wafers to be processed at the same time.

[0066] In some embodiments, based on the dispatching priorities of multiple groups of wafers to be processed, an MES system is used to send operating instructions to a material control system (MCS), so that the MCS controls an automated material handling system (AMHS) to sequentially transport each group of wafers to be processed to a preset temporary storage area. After all the multiple groups of wafers to be processed arrive at the preset temporary storage area, the AMHS is controlled to transport the multiple groups of wafers to be processed from the preset temporary storage area to the machines to be dispatched. The AMHS may include a conveyor belt and a robotic arm. The robotic arm may be used to grab each group of wafers to be processed and place them on the conveyor belt and transport them to the machines to be dispatched. Then, the robotic arm may be used to remove each group of wafers to be processed from the conveyor belt and transport them to the machines to be dispatched.

[0067] It is understood that the MES system, AMA module, MCS, and DDEI module mentioned in this embodiment can be deployed on different computer devices or on the same computer device according to actual needs, and this embodiment does not specifically limit this. In addition, the MES system, also known as the control module, integrates the execution system to connect all systems, the AMA module, also known as the periodic execution module, regularly scans the machine load status and issues work dispatch requests to the MES system, the MCS module, also known as the output module, is used to control the handling system to execute handling work and actual work dispatch scheduling, and the DDEI module is a calculation module that implements the algorithm scoring logic.

[0068] In this embodiment, the corresponding process processing is performed only after all the groups of wafers to be processed are dispatched to the machines to be dispatched, thereby improving the production capacity and machine utilization rate of the machines to be dispatched.

[0069] In an optional embodiment, before performing work scheduling for the multiple groups of wafers to be processed according to their work priorities in step S103, the method may further include:

[0070] Lock the machines to be dispatched.

[0071] Among them, locking the machine means temporarily stopping the operation of the machine and locking it. Before dispatching, the machine to be dispatched will be locked to prevent other wafer groups from being dispatched to the machine to be dispatched for corresponding process processing, so that multiple groups of wafers to be processed can avoid waiting after being dispatched to the machine to be dispatched. In addition, after multiple groups of wafers to be processed are all dispatched to the machine to be dispatched, the machine to be dispatched can be unlocked, further improving the production capacity and machine utilization of the machine to be dispatched.

[0072] It is worth mentioning that MES can send a lock command to the machine to be dispatched to control the machine to be dispatched to execute the lock.

[0073] Figure 2 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 2 ,like Figure 2 As shown, in an optional embodiment, in the above step S102, respectively obtaining the dispatching priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched may include:

[0074] S201 , obtaining wafer information of each group of wafers to be processed and equipment information of current processing machines of each group of wafers to be processed on a wafer production line.

[0075] The wafer information of each group of wafers to be processed may include the processing priority of each group of wafers to be processed, and / or the number of wafers in each group of wafers to be processed, wherein the processing priority of each group of wafers to be processed is the processing priority pre-configured for each group of wafers to be processed, and the processing priority of each group of wafers to be processed can also be understood as the order priority, with a value range of 1.0 to 2.0, and the larger the value, the more urgent it is.

[0076] The current processing machine of each group of wafers to be processed on the wafer production line is the processing machine where each group of wafers to be processed is currently located. The current processing machine may be the predecessor machine of the machine to be dispatched. The current processing machines of different groups of wafers to be processed may be different or the same. Among them, the equipment information of the current processing machine may include at least one of equipment utilization rate, equipment downtime risk coefficient, and equipment idle time.

[0077] Among them, the equipment utilization rate can be the ratio of the actual production time of the current processing machine to the planned operating time. The actual production time is the actual time for the current processing machine to perform process processing on the wafer, and the planned operating time is the pre-planned operating time of the current processing machine. Taking 168 hours a week as an example, the actual production time is 150 hours and the planned operating time is 168 hours, then the equipment utilization rate is 150 / 168=89.3%, among which the value range of the equipment utilization rate is between 0 and 1.

[0078] The equipment downtime risk coefficient can be the ratio of the fault downtime to the planned operating time, wherein the larger the equipment downtime risk coefficient, the greater the equipment downtime risk, and the smaller the equipment downtime risk coefficient, the smaller the equipment downtime risk. The value range of the equipment downtime risk coefficient is between 0 and 1, where 0 indicates no risk and 1 indicates the maximum risk.

[0079] The equipment idle time can be the idle time of the current processing machine within the planned operating time. The idle time is the difference between the planned operating time and the actual production time and downtime. Taking a 168-hour week as an example, the planned available time is 168 hours, the actual production time is 120 hours, and the downtime is 4 hours. The equipment idle time is 168-120-4 = 44 hours.

[0080] The unit of the device idle time may be minutes, and the maximum tolerable idle time (the upper limit threshold of the device idle time) may be Tmax=120 minutes.

[0081] S202 : Obtain the dispatching priority of each group of wafers to be processed based on the wafer information and the equipment information of the current processing machine.

[0082] Taking wafer information as the measurement parameter of the order dimension and the equipment information of the current processing machine as the measurement parameter of the equipment dimension, the measurement parameters of the order dimension and the measurement parameters of the equipment dimension are integrated to obtain the dispatch priority of each group of wafers to be processed. Thus, the dispatch priority of each group of wafers to be processed can be comprehensively determined from the order dimension and the equipment dimension. The obtained dispatch priority integrates the equipment information of the wafers to be processed and the current processing machine. Priority adjustment and subsequent scheduling processing can be performed in real time based on the equipment status and the situation of the wafers to be processed, thereby improving the accuracy of the dispatch priority.

[0083] Figure 3 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 3 ,like Figure 3 As shown, in an optional embodiment, the above step S202, obtaining the dispatching priority of each group of wafers to be processed based on the wafer information and the equipment information of the current processing machine, may include:

[0084] S301 , obtaining first dispatching parameters of each group of wafers to be processed relative to the current processing machine according to equipment information of the current processing machine.

[0085] The first dispatching parameter is a measurement parameter of each group of wafers to be processed in the equipment dimension. According to the equipment information of the current processing machine, the preset calculation rules are used to calculate the first dispatching parameter of each group of wafers to be processed relative to the current processing machine, wherein the equipment information includes: equipment utilization rate, equipment downtime risk coefficient, and equipment idle time. The higher the equipment utilization rate, the smaller the equipment downtime risk coefficient, and the longer the equipment idle time, it means that the current processing machine has enough time to perform process processing on each group of wafers to be processed, that is, each group of wafers to be processed may complete the corresponding process processing as soon as possible on the current processing machine, and then the dispatching priority of each group of wafers to be processed may be higher, that is, each group of wafers to be processed can be dispatched to the machine to be dispatched as soon as possible.

[0086] Among them, the higher the equipment utilization rate, the smaller the equipment downtime risk coefficient, and the longer the equipment idle time, the larger the first work dispatch parameter.

[0087] In an optional embodiment, the equipment information of the current processing machine includes: equipment utilization rate, equipment downtime risk factor, and equipment idle time. Based on the equipment information of the current processing machine, the first dispatching parameters of each group of wafers to be processed relative to the current processing machine are obtained, including:

[0088] The first dispatching parameters are calculated based on the equipment utilization rate, equipment downtime risk factor, equipment idle time, and the preset idle time threshold.

[0089] The first dispatch parameter is calculated using the following formula:

[0090]

[0091] Among them, U j is the equipment utilization rate, R j is the equipment downtime risk factor, T j is the device idle time, T maz The idle time threshold is preset, that is, the maximum idle time threshold, which can be selected according to actual conditions and is not particularly limited.

[0092] S302 : Obtain second dispatch parameters of each group of wafers to be processed relative to the wafer batch according to the wafer information.

[0093] The second dispatching parameter is a measurement parameter of each group of wafers to be processed under the order dimension. According to the wafer information, the preset calculation rules are used to calculate the second dispatching parameter of each group of wafers to be processed relative to the wafer batch. Among them, the wafer information includes: the processing priority of each group of wafers to be processed and the wafer batch data corresponding to each group of wafers to be processed.

[0094] Among them, the higher the processing priority, the more priority is required to be given to processing the group of wafers to be processed, that is, the orders with higher processing priorities are processed first, so the higher the processing priority, the larger the second dispatching parameter.

[0095] Among them, a batch can also be called an order, and one order can correspond to multiple groups of wafers.

[0096] Specifically, the wafer batch data may include the number of wafers to be processed in the order corresponding to each group of wafers to be processed.

[0097] Similarly, the more wafer batch data there is, the higher the priority is for processing wafer groups with more wafer batch data in order to improve the production capacity and utilization rate of the machines to be dispatched. Therefore, the more wafer batch data there is, the larger the second dispatch parameter is.

[0098] In an optional embodiment, the wafer information includes: the processing priority of each group of wafers to be processed and the wafer batch data corresponding to each group of wafers to be processed. According to the wafer information, the second dispatching parameters of each group of wafers to be processed relative to the wafer batch are obtained, including:

[0099] Determine the second dispatch parameters based on processing priority and wafer batch data.

[0100] Furthermore, the total number of wafers for all orders on the wafer production line can be obtained, that is, the total number of wafers can be obtained based on the number of wafers in each order.

[0101] In this embodiment, the second dispatching parameters are calculated based on the processing priority of each group of wafers to be processed and the wafer batch data corresponding to each group of wafers to be processed, which can include: determining the second dispatching parameters based on the processing priority of each group of wafers to be processed, the number of wafers to be processed in the order corresponding to each group of wafers to be processed, and the total number of wafers.

[0102] Specifically, the second dispatch parameter can be calculated using the following formula:

[0103]

[0104] Among them, P m To process the priority, Q m is the number of wafers to be processed in each group, Q max is the total number of wafers.

[0105] In actual applications, each order on the wafer production line changes in real time, so Q m and Q max It will be dynamically adjusted based on real-time data and can be selected according to actual conditions without any special restrictions.

[0106] S303 : Obtain the dispatching priority of each group of wafers to be processed according to the first dispatching parameter and the second dispatching parameter.

[0107] Among them, the dispatch priority is positively correlated with the first dispatch parameter and the second dispatch parameter. The larger the first dispatch parameter, the greater the dispatch priority, and the smaller the first dispatch parameter, the smaller the dispatch priority. Similarly, the larger the second dispatch parameter, the greater the dispatch priority, and the smaller the second dispatch parameter, the smaller the dispatch priority.

[0108] Specifically, the dispatch priority is calculated based on the first dispatch parameter and the second dispatch parameter. The dispatch priority DDEI can be calculated using the following formula:

[0109]

[0110] The following describes in detail the determination of the work assignment priority with reference to specific embodiments.

[0111] Table 1 is a parameter table of equipment information and wafer information of five products. As shown in Table 1, one product is a group of wafers to be processed.

[0112] product <![CDATA[U j ]]> <![CDATA[R j ]]> <![CDATA[T j ]]> <![CDATA[P m ]]> <![CDATA[Q m ]]> <![CDATA[Q max ]]> A 0.90 0.10 60 1.8 80 100 B 0.75 0.30 90 1.5 50 100 C 0.60 0.50 30 1.0 120 100 D 0.85 0.20 45 2.0 30 100 E 0.95 0.15 15 1.2 100 100

[0113] Table 1

[0114] Table 2 is a ranking table of the dispatching priorities of the five products. As shown in Table 2, product A has the highest comprehensive score due to its high equipment utilization (90%), low risk factor (10%), and high processing priority (1.8), and should be dispatched first. Product C ranks last due to its high equipment risk factor (50%), low processing priority (1.0), and low equipment utilization (60%). Although product D has the highest processing priority (2.0), it ranks third due to the small number of wafers (30 pieces) and insufficient equipment idle time (45 minutes). The algorithm uses good equipment status and order characteristics to achieve a dynamic trade-off between multiple objectives, which can effectively improve the dispatching efficiency in wafer generation and manufacturing.

[0115]

[0116]

[0117] Table 2

[0118] Figure 4 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 4 ,like Figure 4 As shown, in an optional embodiment, the above step S103, respectively scheduling the multiple groups of wafers to be processed according to their dispatch priorities, may include:

[0119] S401 , determining the dispatch order of each group of wafers to be processed according to the dispatch priority of each group of wafers to be processed, the current processing status of each group of wafers to be processed, and the preset process interval time between the machine to be dispatched and the current processing machine of each group of wafers to be processed.

[0120] The current processing status refers to the processing status of each group of wafers to be processed on the current processing machine, including a completed status and an unfinished status. The completed status indicates that the process processing of each group of wafers to be processed on the current processing machine has been completed, and the unfinished status indicates that the process processing of each group of wafers to be processed on the current processing machine has not been completed. When dispatching each group of wafers to be processed, the current processing status of each group of wafers to be processed needs to be taken into consideration to ensure that when the process processing of each group of wafers to be processed on the current processing machine is completed, each group of wafers to be processed will be dispatched to the waiting machine for the corresponding process processing.

[0121] The preset process interval time between the machine to be dispatched and the current processing machine of each group of wafers to be processed refers to the maximum time interval between the completion of the process processing of the wafer on the current processing machine and the start of the process processing on the machine to be dispatched. During this time interval, the performance of each group of wafers to be processed will not change, nor will they be contaminated or scrapped.

[0122] It should be noted here that if the preset process interval is too long, it may cause oxidation, contamination, scrapping, etc. of the wafers after completing the previous process, which will affect the next process. Therefore, when dispatching each group of wafers to be processed, the preset process time interval needs to be taken into consideration to ensure that each group of wafers to be processed is dispatched to the machine to be dispatched for corresponding process processing within the preset process time interval.

[0123] Taking the dispatch priority, current processing status and preset process interval time of each group of wafers to be processed into consideration, the dispatch order of each group of wafers to be processed is comprehensively determined, so that when each group of wafers to be processed is scheduled to the machine to be dispatched under this dispatch order, the current processing status of each group of wafers to be processed is completed and does not exceed the preset process interval time.

[0124] S402 , dispatching and scheduling multiple groups of wafers to be processed in sequence according to the dispatching order.

[0125] Among them, the earlier the dispatch order, the first the dispatch will be scheduled, and the later the dispatch order, the later the dispatch will be scheduled. Therefore, multiple groups of wafers to be processed can be dispatched in sequence according to the dispatch order, so that each group of wafers to be processed can complete the process processing of the current processing machine, and avoid changes in wafer performance. Multiple groups of wafers to be processed will be dispatched to the waiting machine to carry out corresponding process processing at the same time.

[0126] In some embodiments, the MES system can also be used to call a real-time dispatch (RTD) system to execute step S401 above to determine the dispatch order for each group of wafers to be processed. The RTD system, also known as the pre-processing module, uses various dispatch priority rules to implement real-time scheduling of wafer production, aiming to achieve faster production shipments and maximize tool utilization efficiency. The RTD system can be deployed on a different computer device than the MES, or on the same computer device depending on actual needs, without any specific limitations.

[0127] In addition, it is worth mentioning that after each group of wafers to be processed are dispatched to the machine to be dispatched, the RTD system can be used to verify whether all the multiple groups of wafers to be processed have arrived. If not all of them have arrived, dispatching is not allowed. If all of them have arrived, dispatching is allowed. That is, multiple groups of wafers to be processed are processed simultaneously on the machine to be dispatched. Of course, in this process, it can also be verified whether the wafers that have arrived are the wafers to be processed in each group. For details, please refer to the existing relevant description, which will not be repeated here.

[0128] In this embodiment, the dispatch order of each group of wafers to be processed is determined based on the dispatch priority, current processing status, and preset process interval time to perform dispatch scheduling. This can ensure that each group of wafers to be processed completes the previous process processing and avoid performance changes, thereby improving the flexibility of dispatch scheduling.

[0129] Figure 5 Schematic diagram of the process of dispatching and scheduling method of wafer production line provided in the embodiment of the present application Figure 5 ,like Figure 5 As shown, in an optional embodiment, before the above step S102, in response to the dispatch request, respectively obtaining the dispatch priorities of the multiple groups of wafers to be processed corresponding to the machines to be dispatched, the method may further include:

[0130] S501 : In response to a wafer information input operation input through a visual interface, determine multiple groups of input wafers.

[0131] The user inputs wafer information input operation through the visual interface, which is used to input wafer information of different groups. In response to the wafer information input operation, multiple groups of input wafers are determined, that is, wafer groups are pre-assembled through the visual interface.

[0132] S502 : In response to process information of multiple groups of input wafers input through a visual interface, determine multiple groups of wafers to be processed from the multiple groups of input wafers.

[0133] The user inputs the process information of each group of input wafers through a visual interface. The process information may include process nodes (steps), process recipes (recipes), and product information (products). The process nodes are the target process nodes input by the user to schedule each group of input wafers. One process node corresponds to one machine and one process treatment. The process recipe may include machine setting parameters such as temperature and humidity. The product information may include the wafer size of each group of input wafers, such as 17 nanometers, where the size of the wafers in a group of input wafers is consistent.

[0134] According to the process information of multiple groups of input wafers, wafer groups with the same process information are determined from the multiple groups of input wafers as multiple groups of wafers to be processed, wherein the process nodes corresponding to the wafer groups with the same process information are used as nodes to be dispatched.

[0135] That is to say, if it is necessary to schedule work for the node to be dispatched, the user inputs the information of multiple groups of input wafers and the process information of each group of input wafers through the visual interface. In this way, the wafer groups that meet the above three conditions can be determined from the multiple groups of input wafers as the multiple groups of wafers to be processed for the node to be dispatched.

[0136] It should be noted here that, since the premise for simultaneously processing multiple groups of wafers to be processed on the machine to be dispatched is that the process recipes and product information of the multiple groups of wafers to be processed are the same to ensure the consistency of the process processing, the above three conditions need to be taken into consideration when pre-assembling the wafer groups to determine the multiple groups of wafers to be processed on the machine to be dispatched, so that the multiple groups of wafers to be processed can be subsequently dispatched to the machine to be dispatched and the corresponding process processing can be carried out at the same time.

[0137] In some embodiments, MES can be used to pre-estimate the time it takes for multiple groups of input wafers to be processed from the current processing machine to the machine to be dispatched. Users can manually select based on time to pre-group multiple groups of input wafers with similar time into multiple groups of wafers to be processed (Batch). In addition, the information of wafer groups with similar time can be color-coded in the visual interface to remind users to pre-group wafer groups with similar time into Batches, and BatchID can be generated after pre-grouping.

[0138] Figure 6 This is a structural diagram of a wafer production line dispatching and scheduling device provided in an embodiment of the present application, which can be integrated into a computer device.

[0139] like Figure 6 As shown, the device may include:

[0140] The acquisition module 601 is used to obtain a dispatch request for a machine to be dispatched on a wafer production line;

[0141] The acquisition module 601 is further configured to obtain, in response to a dispatch request, dispatch priorities of multiple groups of wafers to be processed corresponding to the machines to be dispatched;

[0142] The scheduling module 602 is used to schedule the multiple groups of wafers to be processed according to their dispatch priorities, so as to schedule all the multiple groups of wafers to be processed to the dispatching machines for corresponding process processing.

[0143] In an optional implementation, the acquisition module 601 is specifically configured to:

[0144] Obtain wafer information of each group of wafers to be processed and equipment information of the current processing machines of each group of wafers to be processed on the wafer production line;

[0145] Based on the wafer information and the equipment information of the current processing machine, the dispatch priority of each group of wafers to be processed is obtained.

[0146] In an optional implementation, the acquisition module 601 is specifically configured to:

[0147] According to the equipment information of the current processing machine, the first dispatching parameters of each group of wafers to be processed relative to the current processing machine are obtained;

[0148] According to the wafer information, a second dispatching parameter of each group of wafers to be processed relative to the wafer batch is obtained;

[0149] The dispatching priority of each group of wafers to be processed is obtained according to the first dispatching parameter and the second dispatching parameter.

[0150] In an optional embodiment, the equipment information of the current processing machine includes: equipment utilization rate, equipment downtime risk coefficient, and equipment idle time. The acquisition module 601 is specifically used to:

[0151] The first dispatching parameters are calculated based on the equipment utilization rate, equipment downtime risk factor, equipment idle time, and the preset idle time threshold.

[0152] In an optional embodiment, the wafer information includes: the processing priority of each group of wafers to be processed and the wafer batch data corresponding to each group of wafers to be processed. The acquisition module 601 is specifically configured to:

[0153] The second dispatch parameter is calculated based on the processing priority and wafer batch data.

[0154] In an optional implementation, the scheduling module 602 is specifically configured to:

[0155] Determine the dispatch order of each group of wafers to be processed based on the dispatch priority of each group of wafers to be processed, the current processing status of each group of wafers to be processed, and the preset process interval between the machine to be dispatched and the current processing machine of each group of wafers to be processed. The current processing status is the processing status of each group of wafers to be processed under the current processing machine;

[0156] According to the dispatching order, multiple groups of wafers to be processed are dispatched in turn.

[0157] In an optional embodiment, the device further comprises:

[0158] A determination module 603 is configured to determine a plurality of groups of input wafers in response to a wafer information input operation input through the visual interface;

[0159] The determination module 603 is further configured to determine a plurality of groups of wafers to be processed from the plurality of groups of input wafers in response to process information of the plurality of groups of input wafers input through the visual interface.

[0160] For descriptions of the processing flow of each module in the device and the interaction flow between each module, reference can be made to the relevant descriptions in the above method embodiment, which will not be described in detail here.

[0161] Figure 7 A schematic diagram of the structure of a computer device provided in an embodiment of the present application is shown in FIG. Figure 7As shown, the device may include: a processor 701, a memory 702 and a bus 703. The memory 702 stores machine-readable instructions executable by the processor 701. When the computer device is running, the processor 701 and the memory 702 communicate through the bus 703, and the processor 701 executes the machine-readable instructions to perform the above method.

[0162] An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the above method is executed.

[0163] In the embodiment of the present application, the computer program can also execute other machine-readable instructions when run by the processor to execute other methods described in the embodiment. For the specific execution method steps and principles, please refer to the description of the embodiment and will not be repeated here.

[0164] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interface, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0165] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0166] In addition, each functional unit in the embodiments provided in the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0167] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0168] It should be noted that similar numbers and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and are not to be understood as indicating or implying relative importance.

[0169] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The scope of protection of the present application is not limited thereto. Although the present application has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-described embodiments within the technical scope disclosed in the present application, or make equivalent replacements for some of the technical features thereof. However, these modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present application. They should all be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A method for dispatching work in a wafer production line, characterized in that: include: Obtain dispatch requests for machines to be dispatched on the wafer production line; In response to the dispatch request, respectively obtaining dispatch priorities of a plurality of groups of wafers to be processed corresponding to the machines to be dispatched; According to the dispatching priorities of the plurality of groups of wafers to be processed, the plurality of groups of wafers to be processed are dispatched respectively, so that all the plurality of groups of wafers to be processed are dispatched to the machines to be dispatched for corresponding process processing.

2. The method according to claim 1, characterized in that The step of respectively obtaining the dispatching priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched comprises: Obtaining wafer information of each group of wafers to be processed and equipment information of current processing machines of each group of wafers to be processed on the wafer production line; According to the wafer information and the equipment information of the current processing machine, the dispatching priority of each group of wafers to be processed is obtained.

3. The method according to claim 2, characterized in that The obtaining, based on the wafer information and the equipment information of the current processing machine, the dispatching priority of each group of wafers to be processed includes: Obtaining first dispatch parameters of each group of wafers to be processed relative to the current processing tool according to the equipment information of the current processing tool; According to the wafer information, obtaining second dispatch parameters of each group of wafers to be processed relative to the wafer batch; Obtain the dispatch priority of each group of wafers to be processed according to the first dispatch parameter and the second dispatch parameter.

4. The method according to claim 3, characterized in that The equipment information of the current processing machine includes: equipment utilization rate, equipment downtime risk factor, and equipment idle time. The first dispatching parameters of each group of wafers to be processed relative to the current processing machine are obtained based on the equipment information of the current processing machine, including: The first work dispatching parameter is calculated according to the equipment utilization rate, the equipment downtime risk coefficient, the equipment idle time and a preset idle time threshold.

5. The method according to claim 3, characterized in that The wafer information includes: processing priorities of the groups of wafers to be processed and wafer batch data corresponding to the groups of wafers to be processed. The obtaining, based on the wafer information, second dispatch parameters of the groups of wafers to be processed relative to the wafer batch includes: The second dispatch parameter is calculated according to the processing priority and the wafer batch data.

6. The method according to claim 1, characterized in that The step of respectively dispatching the plurality of groups of wafers to be processed according to their dispatch priorities comprises: Determining the dispatch order of each group of wafers to be processed according to the dispatch priority of each group of wafers to be processed, the current processing status of each group of wafers to be processed, and the preset process interval time between the machine to be dispatched and the current processing machine of each group of wafers to be processed, wherein the current processing status is the processing status of each group of wafers to be processed under the current processing machine; According to the dispatching sequence, the plurality of groups of wafers to be processed are dispatched in sequence.

7. The method according to claim 1, characterized in that Before respectively obtaining the dispatch priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched in response to the dispatch request, the method further includes: In response to a wafer information input operation input through the visual interface, determining a plurality of groups of input wafers; In response to the process information of the plurality of groups of input wafers input through the visualization interface, the plurality of groups of wafers to be processed are determined from the plurality of groups of input wafers.

8. A wafer production line dispatching and scheduling device, characterized in that: include: An acquisition module is used to obtain a dispatch request for a machine to be dispatched on a wafer production line; The acquisition module is further configured to respectively acquire the dispatching priorities of the plurality of groups of wafers to be processed corresponding to the machines to be dispatched in response to the dispatching request; The scheduling module is used to schedule the multiple groups of wafers to be processed according to their dispatch priorities, so as to schedule all the multiple groups of wafers to be processed to the machines to be dispatched for corresponding process processing.

9. A computer device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the computer device is running, the processor and the memory communicate via the bus, and the processor executes the machine-readable instructions to perform the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 is executed.

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