Machining method and device for improving water-jet guided laser thick plate material cutting efficiency

Abstract

The invention discloses a processing method for improving the cutting efficiency of a water-guided laser thick plate material, which comprises the following steps: in the initial cutting stage, establishing an initial drainage channel with the outer vertical surface of the thick plate material through a lead or a spiral line drill hole; after the initial channel is established, the thick plate material is cut along the cutting channel with the initial drainage channel as the starting point, and a target cutting workpiece is obtained; wherein in the process of cutting along the cutting channel, a feed type reciprocating cutting mode and / or a swing cutting scanning strategy are / is adopted for penetrating type cutting. On the basis, the stability of the water jet and the continuity of the total reflection condition in the cutting process are guaranteed to the maximum extent, and therefore the cutting efficiency can be greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of water-guided laser processing, and in particular to a processing method and device for improving the efficiency of water-guided laser cutting of thick plate materials. Background Art

[0002] Figure 1 This is a schematic diagram of the water-guided laser processing technology. In this technology, high-pressure water passes through a nozzle (typically with a diameter of 30 to 120 microns) to form an extremely fine high-pressure water jet. Focused laser light (with a spot size slightly smaller than the nozzle diameter) also passes through the nozzle and is transmitted through the high-pressure water jet by total internal reflection. This "water fiber"-like laser conduction creates a high-energy laser water jet suitable for processing. According to empirical formulas, the maximum stable jet length is approximately 1000 times the nozzle diameter. For example, using an 80μm nozzle, the maximum cutting length can reach over 80mm.

[0003] However, in the actual processing process: (1) As the cutting depth continues to increase, a large amount of water will remain in the cut, and the accumulated water will destroy the full reflection condition of the water jet (such as Figure 2 As shown in Figure 2, when the water jet hits the accumulated water, it will quickly diverge and overflow), which will greatly reduce the cutting efficiency and even make further cutting impossible; (2) As the cutting depth continues to increase, the high-pressure water jet (such as Figure 3 As shown in the figure, when the cutting depth is deep, the water jet will flow back) and a return water jet will be formed, which will also destroy the water jet and even cause damage to the nozzle.

[0004] In the field of water-guided laser cutting, the importance of drainage on cutting quality and effect has been recognized. For example, the reference document (202210645298.6) establishes a drainage channel within the cutting seam, connecting the main cutting path with the material facade through an auxiliary path, and draining the accumulated water in the main path through the auxiliary path. The limitation of the reference document is that it has certain requirements for the shape and size of the material and the shape and size of the cutting pattern, which are specifically manifested as follows:

[0005] (1) The comparative document is only applicable to small amount of removal with high material utilization. In simple terms, it is applicable when the cut material is slightly smaller than the original material. Otherwise, the auxiliary path stroke is too large, resulting in low material utilization and low cutting efficiency.

[0006] (2) The comparative document established four auxiliary drainage paths, but the accumulated water in the main path had to pass through a long and narrow passage to enter the auxiliary path and eventually flow to the facade of the material. The drainage capacity was limited and the accumulated water could not be drained in a timely and effective manner;

[0007] (3) The reference document shows that for irregular shapes, such as right-angled edges or even sharp-angled edges, the corner position further limits the timeliness and effectiveness of drainage. Therefore, the reference document has certain feasibility for wafer rounding, but its wide application is limited. Summary of the Invention

[0008] To overcome the problems of water accumulation, water jet backflow, and limited application in the above-mentioned existing water-guided laser processing technology, the present invention provides a processing method and device for improving the efficiency of water-guided laser cutting of thick plate materials. By quickly establishing a water jet discharge channel, the stability of the water jet and the continuity of the total reflection conditions during the cutting process are guaranteed to the greatest extent, thereby significantly improving cutting efficiency.

[0009] According to one aspect of the present invention, a processing method for improving the efficiency of water-guided laser cutting of thick plate materials is provided, comprising: in the initial stage of cutting, establishing an initial drainage channel through wire or spiral line drilling and the outer surface of the thick plate material; after the initial channel is established, cutting is performed on the thick plate material along a cutting path starting from the initial drainage channel to obtain a target cutting workpiece; wherein, during the cutting process along the cutting path, a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy is adopted to perform through-cutting.

[0010] Furthermore, an initial drainage channel is established through spiral drilling and the outer surface of the thick plate material, including: determining a target drilling position on the cutting and removal area of ​​the thick plate material; cutting along a spiral trajectory from the outside to the inside at the target drilling position, and then switching to cutting along a spiral trajectory from the inside to the outside; cyclically switching between the two cutting trajectories until a drill hole is formed that penetrates the outer surface of the thick plate material, thereby obtaining an initial drainage channel.

[0011] Furthermore, the drill hole is tangent to the cutting path.

[0012] Furthermore, an initial drainage channel is established through the lead and the outer surface of the thick plate material, including: planning the lead from the cutting path to the outer surface of the thick plate material; performing a through-cut along the lead from the outer surface of the thick plate material, and when the outer surface of the thick plate material is connected to the cutting path, an initial drainage channel is obtained.

[0013] Furthermore, the lead is tangent to the cutting path.

[0014] Furthermore, a feed-type reciprocating cutting method is used for through-cutting, including: dividing the cutting path into several cutting segments; reciprocatingly cutting the initial cutting segment until the initial cutting segment is cut through, and then reciprocatingly cutting the next cutting segment until all cutting segments are cut through.

[0015] Furthermore, the swing cutting scanning strategy includes an ∞-shaped scanning trajectory, an 8-shaped scanning trajectory, a clockwise circular scanning trajectory, a counter-circular scanning trajectory or a vertical scanning trajectory.

[0016] Furthermore, the overall swing amplitude of the swing cutting is 1 to 3 times the diameter of the water column.

[0017] According to one aspect of the present invention, a processing device for improving the efficiency of water-guided laser cutting of thick plate materials is provided. The processing device includes: a water-guided laser for emitting a laser water jet; a controller for controlling the water-guided laser to establish an initial drainage channel with the outer surface of the thick plate material by drilling holes with a lead or spiral line in the initial stage of cutting; after the initial channel is established, controlling the water-guided laser to cut along a cutting path on the thick plate material starting from the initial drainage channel to obtain a target cut workpiece; wherein, during the cutting process along the cutting path, a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy are used for through-cutting.

[0018] Furthermore, the swing cutting scanning strategy includes an ∞-shaped scanning trajectory, an 8-shaped scanning trajectory, a clockwise circular scanning trajectory, a counter-circular scanning trajectory or a vertical scanning trajectory.

[0019] The above technical solution forms an initial drainage channel that penetrates the upper and lower parts in the initial stage of the cutting process, and adopts a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy for through-cutting, so that the through-cutting position always follows the laser cutting position, allowing the accumulated water to be discharged directly from the bottom surface of the thick plate material to ensure smooth drainage to the greatest extent.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] (1) Avoid laser overflow caused by water jet damage, so that the laser water jet can continue to cut the material. Under the premise of ensuring cutting quality, the material removal rate per unit time is improved, thereby shortening the processing cycle and solving the problem of low efficiency in cutting thick plate materials.

[0022] (2) Avoid nozzle damage caused by water jet backflow at a large cutting depth.

[0023] (3) It is conducive to the discharge of slag, accumulated water, etc. generated during the cutting process, keeping the cutting seam unobstructed, avoiding these impurities from having adverse effects on the cutting process and the processed surface, and helping to improve the surface quality of the cutting. Even when cutting thicker materials, the flatness and smoothness of the cutting surface can be guaranteed.

[0024] (4) Under better drainage conditions, the laser energy can act on the material more concentratedly and stably under the guidance of water, and can better maintain the effective utilization and transmission of energy when cutting thick materials, thus making it possible to achieve effective processing of thicker materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The schematic diagram of the water-guided laser provided by the existing technology.

[0026] Figure 2 Schematic diagram of bottom water accumulation destroying total reflection provided by existing technology.

[0027] Figure 3 A schematic diagram of the effect of water jet backflow when the cutting depth is deep provided in the prior art.

[0028] Figure 4 The present invention provides a flow chart of a processing method for improving the efficiency of water-guided laser cutting of thick plate materials.

[0029] Figure 5 The cutting removal area provided in the first embodiment of the present invention is a schematic diagram of a closed figure located inside a thick plate material.

[0030] Figure 6 This is a first schematic diagram of establishing an initial drainage channel by spiral drilling provided in the first embodiment of the present invention.

[0031] Figure 7 This is a second schematic diagram of establishing an initial drainage channel by spiral drilling provided in the first embodiment of the present invention.

[0032] Figure 8 This is a schematic diagram of establishing a drainage channel through a lead provided in the second embodiment of the present invention.

[0033] Figure 9 Schematic diagram of the feed-type reciprocating cutting method provided by the present invention for achieving thick plate penetration.

[0034] Figure 10 A schematic diagram of increasing the cutting track width by the swing track provided by the present invention. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions of various embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0036] Please refer to Figure 4The present invention also provides a processing method for improving the efficiency of water-guided laser cutting of thick plate materials.

[0037] (including steps S10-S20).

[0038] Step S10: In the initial stage of cutting, an initial drainage channel is established through wire or spiral wire drilling and the facade of the thick plate material.

[0039] In step S10, the thick plate material refers to the original material with a large thickness and needs to be cut deeply (for example, the cutting depth is ≥4mm). The facade of the thick plate material refers to the outer surface (including the side and bottom surfaces) of the thick plate material except the processing surface (i.e., the top surface). The thick plate material includes a cutting retention area, a cutting removal area, and a cutting path. Among them, the cutting retention area is the part that needs to be retained in the thick plate material, the cutting removal area is the part that needs to be removed in the thick plate material, and the cutting path is located between the cutting retention area and the cutting removal area. The cutting path refers to a preset cutting path. Cutting along the cutting path can separate the cutting retention area and the cutting removal area to obtain the target cutting workpiece. It can be understood that the cutting removal area of ​​the present invention can be located inside the cutting retention area or outside the cutting retention area, and even the cutting removal area can be in a unilateral adjacent relationship with the retention area, which is not limited here.

[0040] It should be noted that the present invention can choose to establish an initial drainage channel with the outer surface of the thick plate material through lead wire or spiral wire drilling according to the relative position relationship between the cutting retention area and the cutting removal area. It can be understood that when the cutting removal area is located inside the cutting retention area (that is, the cutting removal area is a closed figure located inside the thick plate material), it is impossible to directly establish an initial drainage channel with the side of the thick plate material. In this case, an initial drainage channel can be established with the bottom surface of the thick plate material through spiral wire drilling. When the cutting removal area is located outside the cutting retention area, a drainage channel can be directly established with the side of the thick plate material. In this case, the initial drainage channel can be established either through spiral wire drilling or through lead wire. For example, when the distance from the cutting path to the side of the thick plate material is short, the required lead wire is shorter, and it is chosen to establish the initial drainage channel through lead wire; when the distance from the cutting path to the side of the thick plate material is long, the required lead wire is longer, and it is chosen to establish the initial drainage channel through spiral wire drilling.

[0041] The specific steps of establishing an initial drainage channel through wire or spiral wire drilling and the facade of a thick plate material will be described below in conjunction with two embodiments.

[0042] Please refer to the attached Figures 5 to 7In the first embodiment, an initial drainage channel is established through spiral drilling and the facade of the thick plate material. Specifically, the target drilling position is first determined on the cutting and removal area of ​​the thick plate material. The target circular boundary of the drilling (i.e., the outer cutting contour) is established with the target drilling position as the center of the circle. Cutting is performed along the outer cutting contour (i.e., cutting along the first circle trajectory from the outside to the inside). Then, cutting is performed along the spiral trajectory from the outside to the inside until the target drilling position is reached. Then, cutting is switched to cutting along the spiral trajectory from the inside to the outside. The two cutting trajectories are cyclically switched so that the cutting part can be cut and lowered at the same height until a drill hole is formed that penetrates the facade of the thick plate material, thereby forming the initial drainage channel.

[0043] Preferably, the drill hole is tangent to the cutting path. Once a drill hole is cut, it can directly serve as an initial drainage channel, connecting the cutting path to the bottom surface of the thick plate material. Furthermore, in some feasible embodiments, when the drill hole is not tangent to the cutting path, a wire can be used to connect the drill hole and the cutting path. The wire refers to an auxiliary path that runs through the thick plate material, starting from the drill hole and ending at the cutting path. In this case, the drill hole and the wire together form an initial drainage channel, connecting the cutting path to the bottom surface of the thick plate material.

[0044] Please refer to the attached Figure 8 In the second embodiment, an initial drainage channel is established through a lead line connected to the outer surface of the thick plate material. Specifically, a lead line is first planned from the cutting path to the outer surface of the thick plate material. Then, a through-cut is performed along the lead line from the outer surface of the thick plate material until the outer surface of the thick plate material (i.e., the side of the thick plate material) is connected to the cutting path, thereby forming the initial drainage channel. Preferably, the lead line is the shortest lead line that is tangent to the cutting path.

[0045] Step S20, after establishing the initial drainage channel, cutting is performed along the cutting path on the thick plate material starting from the initial drainage channel to obtain the target cutting workpiece; wherein, during the cutting process along the cutting path, a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy is used for through-cutting.

[0046] In step S20, whether the initial drainage channel is established by the lead wire and the outer surface of the thick plate material, or by spiral drilling and the outer surface of the thick plate material, the initial drainage channels obtained by both methods can connect the cutting path with the outer surface of the thick plate material. Therefore, with the initial drainage channel as the starting point, drainage can be carried out through the initial drainage channel in the initial stage of cutting along the cutting path. It should be noted that in the present invention, during the cutting process along the cutting path, only the feed-type reciprocating cutting method can be used for through-cutting, only the swing cutting scanning strategy can be used for through-cutting, and the feed-type reciprocating cutting method can be used for through-cutting while combining the swing cutting scanning strategy to increase the width of the cutting path. It can be understood that no matter which of the above-mentioned cutting methods is used, the drainage channel always follows the cutting position to drain the accumulated water in the cutting seam in time, avoid the backflow of the water jet due to the residual accumulated water in the cutting seam and the destruction of the total reflection condition of the water jet, thereby improving the cutting efficiency. The following is an example of using both the feed-type reciprocating cutting method and the swing cutting scanning strategy.

[0047] Please refer to the attached Figure 9 Because the cutting depth of a single water-guided laser cut is limited, it's impossible to achieve a complete cut in a single pass for thick plate materials. To ensure complete penetration and that the penetration point remains below the cutting position, a feed-type reciprocating cutting method is used along the cutting path. Specifically, the cutting path is divided into several cutting segments; the initial cutting segment is reciprocated until it is cut through, and then the next cutting segment is reciprocated until all cutting segments are cut through. At this point, the drainage channel can drain water from top to bottom to prevent water accumulation. For example, for ±1mm cutting, the process advances 1mm, then reverses 1mm repeatedly until the cut is complete, and then advances 1mm again.

[0048] It can be understood that the penetration position is always located below the cutting position, so that each cutting segment will be cut through before the reciprocating cutting of the next cutting segment will be carried out. At this time, the vertical cut obtained by the previous cutting segment and having penetrated the thick plate material can serve as the drainage channel of the next cutting segment, so that the accumulated water generated when cutting the next cutting segment is discharged directly from the bottom surface of the thick plate material along the drainage channel, thereby ensuring the smooth drainage to the greatest extent. In other words, the present invention can drain the accumulated water in a timely and effective manner without the need for drainage through a narrow and long channel. For irregular figures, such as right-angled edges or even acute-angled edges, the corner position will not limit the timeliness and effectiveness of drainage. In addition, since the drainage channel always follows the cutting position, that is, the drainage channel has a short stroke, the problem of low cutting efficiency due to excessive drainage channel stroke will not occur. Therefore, the present invention is not only suitable for small-scale removal of materials with high utilization rate, but also for large-scale removal of materials with low utilization rate.

[0049] During the cutting process along the cutting path, the present invention also adopts an oscillating cutting scanning strategy to increase the width of the cutting path. It can be understood that for materials that are particularly difficult to cut or materials with thicker thickness, increasing the width of the cutting path can prevent the laser water jet from contacting the inner wall of the material when passing through the slit to reach the cutting bottom surface, thereby avoiding turbulence of the water jet and making drainage smoother. Figure 10 As shown, the swing cutting scanning strategy includes but is not limited to an infinity scanning trajectory, an 8-shaped scanning trajectory, a clockwise circular scanning trajectory, a counter-circular scanning trajectory, or a vertical scanning trajectory. In this embodiment, the overall swing amplitude of the swing cutting is 1 to 3 times the diameter of the water column.

[0050] Based on the same inventive concept as the aforementioned embodiment, the present invention also provides a processing device for improving the efficiency of water-guided laser cutting of thick plate materials, and the processing device includes a water-guided laser and a controller. The water-guided laser is used to emit a laser water jet. In the initial stage of cutting, the controller controls the water-guided laser to establish an initial drainage channel with the outer surface of the thick plate material through lead wire or spiral wire drilling. After the initial channel is established, the controller controls the water-guided laser to cut along the cutting path on the thick plate material starting from the initial drainage channel to obtain the target cutting workpiece. In the process of cutting along the cutting path, a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy are adopted for through-cutting. In the specific structure of the water-guided laser is a prior art and will not be described in detail here.

[0051] In summary, the core of this invention is to create an initial drainage channel that penetrates vertically at the initial stage of the cutting process. This through-cutting process is performed using a feed-type reciprocating cutting method, ensuring that the through-cut position always follows the laser cutting position, allowing accumulated water to drain directly from the bottom surface of the thick plate material, thereby ensuring maximum drainage. Furthermore, the cutting path width is increased by using an oscillating trajectory to enhance drainage.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present invention.

Claims

1. A processing method for improving the efficiency of water-guided laser cutting of thick plate materials, characterized in that: include: At the initial stage of cutting, the initial drainage channel is established through wire or spiral drilling and the facade of the thick plate material; After establishing the initial drainage channel, cutting is performed along the cutting path on the thick plate material starting from the initial drainage channel to obtain the target cutting workpiece; wherein, during the cutting process along the cutting path, a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy is used for through-cutting.

2. A method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 1, characterized in that: The initial drainage channel is established by spiral drilling and thick plate material facade, including: determining a target drilling position in the cutting removal area of ​​the thick plate material; Cutting along a spiral trajectory from outside to inside at the target drilling position, and then switching to cutting along a spiral trajectory from inside to outside; The two cutting paths are switched cyclically until a drill hole is formed through the facade of the thick plate material, thereby obtaining an initial drainage channel.

3. A method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 2, characterized in that: The drilled hole is tangent to the cutting path.

4. The method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 1, characterized in that: Establish initial drainage channels through leads and thick plate facades, including: Planning the lead from the cutting path to the outer surface of the thick plate material; A through-cut is performed along the lead line from the outer surface of the thick plate material, and when the outer surface of the thick plate material is connected with the cutting path, an initial drainage channel is obtained.

5. A method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 4, characterized in that: The lead is tangent to the cutting street.

6. The method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 1, characterized in that: The feed-type reciprocating cutting method is used for through-cutting, including: dividing the cutting path into a plurality of cutting segments; The initial cutting segment is cut back and forth until the initial cutting segment is cut through, and then the next cutting segment is cut back and forth until all the cutting segments are cut through.

7. The method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 1, characterized in that: The swing cutting scanning strategy includes an ∞-shaped scanning trajectory, an 8-shaped scanning trajectory, a clockwise circular scanning trajectory, a counter-clockwise circular scanning trajectory or a vertical scanning trajectory.

8. The method for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 1, characterized in that: The overall swing amplitude of the swing cutting is 1 to 3 times the diameter of the water column.

9. A processing device for improving the efficiency of water-guided laser cutting of thick plate materials, characterized in that: The processing device comprises: Water-guided laser, used to emit laser water jets; The controller controls the water-guided laser to establish an initial drainage channel with the outer surface of the thick plate material by drilling holes with a lead wire or a spiral line in the initial cutting stage; after the initial channel is established, the water-guided laser is controlled to cut along a cutting path on the thick plate material starting from the initial drainage channel to obtain a target cutting workpiece; wherein, during the cutting process along the cutting path, a feed-type reciprocating cutting method and / or an oscillating cutting scanning strategy are adopted for through-cutting.

10. A processing device for improving the efficiency of water-guided laser cutting of thick plate materials according to claim 9, characterized in that: The swing cutting scanning strategy includes an ∞-shaped scanning trajectory, an 8-shaped scanning trajectory, a clockwise circular scanning trajectory, a counter-clockwise circular scanning trajectory or a vertical scanning trajectory.

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