Conductive plate structure of ozone generator, ozone generator and manufacturing method

By adding rare earth element materials to the conductive layer of the ceramic conductive plate, the problems of oxidation resistance and mechanical strength of the silver coating in harsh environments are solved, the conductivity is improved, the production cost is reduced, and the efficiency and energy efficiency of the ozone generator are improved.

CN120793849APending Publication Date: 2025-10-17JIANGSU ZHIHUA SHUNXIN SEMICONDUCTOR TECHNOLOGY CO LTD +2
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Patent Information

Application Number
CN202411781089.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2025-10-17

AI Technical Summary

Technical Problem

The silver coating of existing ceramic conductive plates has poor oxidation resistance, insufficient mechanical strength, and poor conductivity in high temperature, high humidity, or corrosive gas environments, resulting in performance degradation.

Method used

Rare earth element materials, such as neodymium, samarium, lanthanum or yttrium, are added to the conductive layer, and their content is controlled between 0.15% and 0.25%. The conductive layer is covered with 80% to 85% of the upper surface of the substrate layer and cured at a reasonable baking temperature to form a conductive layer.

Benefits of technology

Significantly improve the oxidation resistance, mechanical strength and conductivity of the conductive layer, reduce production costs, increase ozone generation rate and concentration, and reduce energy consumption.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a current-conducting plate structure of an ozone generator, the ozone generator and a manufacturing method. The current-conducting plate structure comprises a base material layer; the conducting layer is arranged on the base material layer, and the materials of the conducting layer comprise a conducting material and a rare earth element material. The rare earth element material is neodymium, samarium, lanthanum or yttrium. The rare earth element material is added into the conducting layer, due to electron arrangement of the rare earth element, the rare earth element is difficult to react with an oxidizing agent, the rare earth element can inhibit the oxidation reaction of the conducting material to a certain extent, and the oxidation resistance of the conducting layer is improved. As the probability of oxidation reaction of the conductive material is greatly reduced, good conductivity of the conductive material can be ensured. The rare earth elements can influence arrangement and distribution of metal atoms in the conducting layer, so that scattering and blocking of electrons in the transmission process are reduced, and the transmission efficiency of the electrons is improved. The addition of the rare earth element material can improve the hardness and mechanical strength of the conductive layer.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of ozone generator, and particularly relates to a conductive plate structure of ozone generator, an ozone generator and a manufacturing method. BACKGROUND

[0002] The ceramic conductive plate is widely used in the electronic and electrical fields and has excellent insulation and conductivity. However, the pure silver coating may have performance degradation problems in some application environments, such as poor oxidation resistance, insufficient mechanical strength, poor conductivity and the like.

[0003] Therefore, it is necessary to provide a conductive plate structure of ozone generator, an ozone generator and a manufacturing method to solve the above problems. SUMMARY

[0004] The present application aims to provide a conductive plate structure of ozone generator, an ozone generator and a manufacturing method to improve the problems of poor oxidation resistance, insufficient mechanical strength and poor conductivity of the existing conductive plate.

[0005] The present application provides a conductive plate structure of ozone generator, comprising: a substrate layer; a conductive layer arranged on the substrate layer, wherein the material of the conductive layer comprises a conductive material and a rare earth element material.

[0006] The conductive plate structure of ozone generator provided by the present application has the beneficial effects that: by adding the rare earth element material in the conductive layer, the rare earth element material is not easy to be oxidized, and the chemical properties of the conductive layer with the rare earth element are more stable, so that the silver atoms are not easy to be oxidized, thereby improving the oxidation resistance of the conductive layer. The rare earth element material has a relatively hard texture, which can improve the hardness of the conductive layer with the rare earth element, thereby improving the mechanical strength of the conductive layer. The rare earth element has good electrical conductivity, and after adding the rare earth element, the number of free electrons in the conductive layer will increase, thereby improving the conductivity of the conductive layer.

[0007] In a possible embodiment, in the conductive layer, the content of the rare earth element material is greater than or equal to 0.15% and less than or equal to 0.25%.

[0008] The scheme has the beneficial effects that: the content of the rare earth element material is controlled in the range of 0.15% to 0.2%, and by reasonably setting the content of the rare earth element material, on the one hand, the problem that the oxidation resistance, mechanical strength and conductivity of the conductive layer cannot be effectively improved due to too little addition can be avoided; on the other hand, the problem that the brittleness of the conductive layer is increased or other adverse reactions due to excessive addition can also be avoided.

[0009] In a possible implementation, the rare earth element material is neodymium, samarium, lanthanum or yttrium.

[0010] In a possible implementation, the edge of the conductive layer has a spacing from the edge of the substrate layer, and the conductive layer covers 80-85% of the upper surface of the substrate layer.

[0011] The conductive layer does not need to completely cover the substrate layer, leaving a small part of the edge area of the substrate layer, and by reasonably setting the coverage ratio of the conductive layer, the conductive layer has high conductivity while reducing the amount of consumables of the conductive layer, thereby reducing the production cost of the conductive plate structure.

[0012] In a possible implementation, the material of the substrate layer is ceramic or sapphire.

[0013] In a possible implementation, the conductive material is silver or gold.

[0014] The application also provides an ozone generator comprising the conductive plate structure of the ozone generator according to any one of the above embodiments.

[0015] The application also provides a method for manufacturing the conductive plate structure of the ozone generator, comprising the following steps: S201: providing a conductive material and a rare earth element material, adding the rare earth element material into the liquid conductive material, and mixing the conductive material and the rare earth element material by stirring to obtain a mixed material; S202: providing a substrate layer, and coating the mixed material on the upper surface of the substrate layer; S203: baking the substrate layer coated with the mixed material at a set temperature, and solidifying the mixed material on the substrate layer to form a conductive layer, thereby obtaining a conductive plate structure.

[0016] The method for manufacturing the conductive plate structure of the ozone generator has the beneficial effect that the performance of the conductive material can be significantly improved by adding the rare earth element material into the conductive material. The rare earth element has unique electronic structure and physical and chemical properties. After the conductive material is mixed with the rare earth element material and coated on the upper surface of the substrate layer, and after baking, the conductive layer is solidified on the substrate layer to form a conductive plate structure. The manufactured conductive plate structure has good oxidation resistance, better mechanical strength and good conductivity.

[0017] In a possible embodiment, when the mixed material is coated, a spacing is provided between the edge of the conductive layer and the edge of the substrate layer, and the conductive layer covers 80-85% of the surface of the substrate layer.

[0018] The conductive layer covers most of the surface of the substrate layer, leaving a small area in the edge region of the substrate layer, which ensures that the conductive layer has high conductivity while reducing the amount of material consumed by the conductive layer, thereby reducing the production cost of the conductive plate structure.

[0019] In a possible embodiment, the set temperature ranges from 700 to 850 degrees Celsius.

[0020] The baking temperature of the substrate layer coated with the mixed material is set reasonably, so that the conductive layer can be firmly cured on the surface of the substrate layer to form a dense conductive layer, and the performance of the conductive layer is not affected by excessively high temperature. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A front view of the conductive plate structure of the ozone generator of the present application in an embodiment.

[0022] Figure 2 A top view of the conductive plate structure of the ozone generator of the present application in an embodiment.

[0023] Figure 3 A flowchart of the manufacturing method of the conductive plate structure of the ozone generator of the present application.

[0024] Figure 4 A data comparison table of the test experiment of the conductive plate structure of the ozone generator of the present application.

[0025] Legend of reference signs: 110, conductive plate structure; 111, substrate layer; 112, conductive layer. DETAILED DESCRIPTION To make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0026] In the prior art, the surface of the ceramic conductive plate of the ozone generator is usually provided with a silver coating. Silver is easily oxidized in air, especially in an environment with high temperature, high humidity or corrosive gas, and the oxidation speed will be faster, so the silver coating has poor oxidation resistance. Silver itself is relatively soft and is easily subjected to physical wear and scratches, and the mechanical strength of the silver coating is insufficient, which may even cause the silver coating to fall off during use. Silver forms an oxide film during oxidation, which causes the silver coating to have poor conductivity.

[0027] To solve the problems in the prior art, embodiments of the present application provide a conductive plate structure of an ozone generator, Figure 1 a front view of the conductive plate structure of the ozone generator of the present application in an embodiment, Figure 2 a top view of the conductive plate structure of the ozone generator of the present application in an embodiment. See Figure 1 and Figure 2 The conductive plate structure 110 includes a substrate layer 111 and a conductive layer 112, the conductive layer 112 is arranged on the substrate layer 111, and the material of the conductive layer 112 includes a conductive material and a rare earth element material.

[0028] Rare earth elements (REEs) are a group of elements with special electronic structure and physical and chemical properties. They are usually located in the lanthanide series and yttrium series of the periodic table, and have an unfilled 4f electron shell, which makes the rare earth elements exhibit unique activity, coordination ability and stability in chemical reactions.

[0029] In actual production, the conductive material may be oxidized to form an oxide, thereby reducing the conductivity and other properties of the conductive layer 112. The present application proposes an improvement scheme: adding a rare earth element to the conductive layer 112, and the addition of the rare earth element can improve the performance of the conductive layer 112 from the following aspects: Firstly, the conductive layer 112 in the present solution not only contains conductive materials, but also adds rare earth element materials. Rare earth elements have a special electronic arrangement. This electronic arrangement makes rare earth elements exhibit high stability in chemical reactions. Specifically, the electronic shell structure of rare earth elements is relatively stable and is not easy to lose or gain electrons, thereby reducing their activity in chemical reactions. When rare earth elements (e.g., neodymium) are added to conductive materials (e.g., silver paste), neodymium atoms can form chemical bonds with silver atoms, thereby changing the microstructure and chemical properties of the silver coating. Because of the stable electronic arrangement of rare earth elements, they can "share" this stability with silver atoms, making the structure of the entire conductive layer 112 more stable. In terms of oxidation resistance, the stable electronic arrangement of rare earth elements helps to protect silver atoms from being oxidized by oxidizing agents (e.g., oxygen, etc.). When the oxidizing agent tries to react with the silver atoms, the presence of rare earth elements will form a "barrier" to slow down or prevent the oxidation reaction. This is because the electronic arrangement of rare earth elements makes it more difficult for them to react with oxidizing agents, thereby protecting silver atoms. Therefore, rare earth elements can inhibit the oxidation reaction of conductive materials (e.g., silver) to some extent, so that the oxidation resistance of the conductive layer 112 after adding rare earth elements is significantly improved.

[0030] Secondly, the conductive layer 112 in the present solution uses a mixture containing conductive materials and rare earth element materials. Rare earth elements have strong hardness and wear resistance, which can enhance the mechanical strength of the conductive layer 112. In addition, rare earth elements form chemical bonds with metal atoms in the conductive layer 112, which is achieved by sharing or transferring electrons, thereby enhancing the interaction force between atoms. When rare earth elements form chemical bonds with metal atoms, they will form a more compact and stable structure inside the conductive layer 112. This structure increases the binding force and cohesion inside the conductive layer 112, making it more difficult to be damaged when subjected to external forces, so that the mechanical strength of the conductive layer 112 is significantly improved. Because the addition of rare earth elements enhances the binding force inside the conductive layer 112, the conductive layer 112 can better resist deformation and fracture when subjected to tensile force. After the mechanical strength of the conductive layer 112 is significantly improved, it can resist physical wear and scratches, improve the adhesion of the conductive layer 112, and reduce the risk of the conductive layer 112 falling off, which makes the conductive layer 112 maintain the stability and integrity of the conductive layer 112 during long-term use or under external forces.

[0031] Thirdly, due to the inhibitory effect of the rare earth element material on the conductive material, the probability of oxidation reaction of the conductive material is greatly reduced, ensuring that the conductive material can maintain its good conductivity. Moreover, since the rare earth element can affect the arrangement and distribution of metal atoms in the conductive layer 112, thereby reducing the scattering and hindrance of electrons during transmission, the transmission efficiency of electrons is improved, and the conductivity of the conductive layer 112 with the addition of the rare earth element material is significantly enhanced, so that the conductive layer 112 can produce a stronger conductive effect on the substrate layer 111.

[0032] Fourthly, in the process of ozone generation, the conductive layer 112 plays a crucial role. The conductive layer 112 not only serves as a channel for current transmission, but also carries the chemical reaction of oxygen molecules being ionized and converted into ozone. Therefore, the conductivity of the conductive layer 112 directly determines the transmission efficiency and energy conversion efficiency of the current in the conductive layer 112. When the conductivity of the conductive layer 112 is enhanced, the transmission of the current in the conductive layer 112 is smoother, which can reduce energy loss and improve energy conversion efficiency, thereby reducing energy consumption and achieving energy-saving effect. This also means that under the same input power, more electrical energy can be effectively converted into chemical energy for the ionization of oxygen molecules and the generation of ozone. In addition, the stronger conductivity of the conductive layer 112 also means that more current can be accommodated through the same surface area of the conductive layer 112, which further increases the opportunity for oxygen molecules to be ionized, thereby improving the generation rate and concentration of ozone.

[0033] In an embodiment, the content ratio of the rare earth element material in the conductive layer 112 is greater than or equal to 0.15% and less than or equal to 0.25%.

[0034] In this embodiment, by reasonably setting the content ratio of the rare earth element material, on the one hand, it ensures that the content ratio of the rare earth element material is not too small to avoid the problem that the improvement effect of the rare earth element material on the oxidation resistance, mechanical strength and conductivity of the conductive layer 112 is poor due to too little addition of the rare earth element material; on the other hand, it ensures that the content ratio of the rare earth element material is not too large to avoid the problem of increased brittleness or other adverse reactions of the conductive layer 112 due to too much addition of the rare earth element material. The increase in brittleness will reduce the mechanical strength and durability of the conductive layer 112, and even may cause cracks or peeling of the conductive layer 112 during use. In addition, by adding a small amount of rare earth element material in this scheme, the conductive layer 112 can have good oxidation resistance, better mechanical strength and good conductivity, and the consumption of rare earth element material can be reduced, thereby reducing the production cost of the conductive plate structure 110.

[0035] In another embodiment, the rare earth element material is neodymium, samarium, lanthanum or yttrium, etc.

[0036] Neodymium (Nd) is one of the lanthanide series elements. The element is a silvery-white metal, with a melting point of 1024 °C and a density of 7.004 g / cm³. At room temperature, neodymium has a hexagonal close-packed structure, which transforms to a body-centered cubic structure at high temperatures. Neodymium is paramagnetic at room temperature, meaning it is attracted to external magnetic fields. Neodymium is one of the most advanced rare-earth magnetic materials, with extremely strong magnetic properties. It is the main component of magnet materials and has a hard texture. Neodymium can maintain stable electrical conductivity in harsh environments such as high temperature and high pressure. The addition of neodymium to the conductive layer 112 makes the conductive layer 112 less susceptible to oxidation.

[0037] Samarium (Sm) is a silvery-white metal with moderate hardness and a density of 7.52 g / cm³. Under ambient conditions, samarium typically exhibits a trigonal structure (α-type). When heated to 731 °C, it transforms into a hexagonal close-packed structure (hcp structure). Metallic samarium has good electrical conductivity. In metallic samarium, the outer electrons of the atoms are easily detached from the nucleus and become free electrons, which can move freely within the metal, thereby transmitting electric current.

[0038] Lanthanum (La) is a silvery-white or silver-gray metal with a luster, a melting point of 920 °C, and a density of 6.162 g / cm³. Lanthanum usually exists in three crystal forms: α-type (hexagonal system), β-type (face-centered cubic packing, stable at 350 °C), and γ-type (> 868 °C). In metallic lanthanum, the outer electrons of the atoms are relatively active and easily detach from the atom to form free electrons. These free electrons move freely within the metal, forming an electric current, making lanthanum have good electrical conductivity. In addition, lanthanum has relatively small resistance, and electrons can easily flow within the metal, further enhancing its electrical conductivity.

[0039] Yttrium (Y) is a silvery-gray or gray-black metal with ductility, a melting point of 1522 °C, and a density of 4.47 g / cm³. Yttrium has a hexagonal close-packed structure. Yttrium and yttrium alloys have high electrical conductivity and can be used to make superconducting materials.

[0040] In one possible embodiment, the edge of the conductive layer 112 has a spacing from the edge of the substrate layer 111, and the conductive layer 112 covers 80% to 85% of the surface of the substrate layer 111. In this embodiment, the substrate layer 111 itself is not conductive, and the coverage of 80% to 85% means that the conductive layer 112 covers most of the surface of the substrate layer 111, leaving only a small portion of the edge area of the substrate layer 111 uncovered. The weak electric field in the uncovered area does not affect the overall conductivity of the conductive plate structure 110, and the electric field efficiency can still be maintained at a high level. Compared with completely covering the substrate layer 111, the conductive layer 112 can achieve higher conductivity while reducing the amount of material used, thereby reducing the production cost of the conductive plate structure 110.

[0041] The specific shapes of the conductive layer 112 and the substrate layer 111 are not limited here. For example, in one example, the conductive layer 112 is circular with a diameter of 101 mm, and the substrate layer 111 is also circular with a diameter of 82 mm. In another example, the conductive layer 112 is square with a side length of 101 mm, and the substrate layer 111 is also square with a side length of 82 mm.

[0042] In some specific embodiments, the material of the substrate layer 111 is ceramic or sapphire, and the purity of the substrate layer 111 is greater than or equal to 99%, for example, the purity of the ceramic material is 99.7%.

[0043] Ceramic materials have high strength, good durability, high temperature resistance, and corrosion resistance. The ceramic substrate layer 111 has good mechanical properties, thermal properties, and electrical properties, especially low thermal expansion coefficient and high thermal conductivity. Ceramic is generally considered an insulator, and its conductivity is poor.

[0044] Sapphire ( ) is a single crystal, has high temperature resistance, good thermal conductivity, high hardness, and good chemical stability. Sapphire has no conductive properties. Sapphire has excellent electrical insulation, transparency, good thermal conductivity, and high rigidity characteristics, making it an ideal substrate material. The sapphire substrate layer 111 has the same crystal structure as GaN, high temperature stability, heat dissipation, and good chemical properties. The sapphire substrate layer 111 also has radiation resistance and high voltage breakdown resistance, which can meet the requirements of modern electronic technology for high temperature, high power, high frequency, high voltage, radiation resistance, and blue light emission.

[0045] In one embodiment, the thickness of the substrate layer 111 ranges from 2 mm to 4 mm.

[0046] In some embodiments, the conductive material is silver or gold, and the purity of the substrate layer 111 is greater than or equal to 99%.

[0047] Silver is an excellent conductor of electricity, with the highest electrical conductivity of all metals. Silver has a very low electrical resistivity, allowing it to efficiently transmit electrical current with minimal energy loss. In addition to its excellent electrical conductivity, silver also has high thermal conductivity. Silver is resistant to corrosion from most chemicals, allowing it to maintain stable electrical conductivity in harsh environments. Silver has moderate mechanical strength, with some ductility and malleability. When subjected to external forces, silver can undergo some plastic deformation without breaking. However, silver may have slightly lower mechanical strength compared to some high-strength metals.

[0048] Gold is also an excellent conductor of electricity, with high electrical conductivity among metals. While slightly less conductive than silver, gold still has very good electrical conductivity. Gold is resistant to corrosion from most chemicals, allowing gold conductive materials to maintain stable electrical conductivity over long periods in harsh environments. Gold is a very stable metal that does not easily react with other substances. Gold has good stability in air and is not easily oxidized. Therefore, gold has better oxidation resistance than silver, allowing it to maintain stable performance over long periods in harsh environments. Gold also has relatively high mechanical strength, with good ductility and malleability.

[0049] In one embodiment, the thickness of the conductive layer 112 ranges from 30 μm to 50 μm. Resistance is the opposition encountered by an electric current as it passes through a conductor, and its size is related to factors such as the material, length, cross-sectional area, and temperature of the conductor. In the case of the same material, length, and temperature, the cross-sectional area of the conductor (i.e., the thickness of the conductive layer 112) is one of the key factors affecting the size of the resistance. According to Ohm's law, resistance is inversely proportional to the cross-sectional area of the conductor. Therefore, under the condition of keeping other conditions unchanged, reducing the thickness of the conductive layer 112 (i.e., reducing the cross-sectional area) will actually increase the resistance value per unit length. Moreover, a thinner conductive layer 112, while maintaining sufficient conductive channels, reduces unnecessary material waste and additional sources of resistance. This allows the current to flow more smoothly through the conductive layer 112, thereby reducing the overall resistance. Since a thinner conductive layer 112 can reduce resistance, it can reduce energy loss during current transmission, which helps to improve energy conversion efficiency, reduce energy consumption and waste.

[0050] In addition, the present application also provides an ozone generator, comprising: the conductive plate structure 110 of the ozone generator in any of the above embodiments. The main principle of the ozone generator is to generate ozone through high-voltage electric field discharge. Under the action of the high-voltage electric field, oxygen molecules are excited and decomposed into single oxygen atoms, which then combine with oxygen molecules to form ozone molecules (O3). .

[0051] In this scheme, the conductive plate structure 110 serves as an electrode. By adding rare earth element materials to the conductive layer 112, the conductive layer 112 with added rare earth elements has higher oxidation resistance, mechanical strength, and electrical conductivity, making it suitable for more demanding application environments. The conductive layer 112 serves as a transmission channel for electrical current, and its electrical conductivity directly affects the efficiency of current transmission. A conductive layer 112 with high electrical conductivity can ensure that the current flows quickly and smoothly, reducing resistance and energy loss. In an ozone generator, the conductive layer 112 is usually located near the discharge gap. When high voltage is applied to the conductive layer 112, corona discharge occurs in the discharge gap. During this process, the electrical conductivity of the conductive layer 112 determines the strength of the electric field, which in turn affects the efficiency of oxygen molecule ionization. The better the electrical conductivity of the conductive layer 112, the higher the energy conversion efficiency. This means that under the same input power, more electrical energy can be converted into chemical energy for oxygen molecule ionization and ozone generation. A conductive layer 112 with high electrical conductivity can reduce energy loss, thereby reducing the energy consumption of the device. This not only improves the energy efficiency of the device, but also helps to reduce operating costs. With the same surface area of the conductive layer 112, stronger electrical conductivity means that more current can be accommodated, increasing the chances of oxygen molecule ionization and thus increasing the rate of ozone generation. Since more oxygen molecules are ionized and recombine to form ozone under the action of the electric field, the enhanced electrical conductivity of the conductive layer 112 also leads to an increase in the concentration of generated ozone.

[0052] In addition, the present application also provides a manufacturing method of the conductive plate structure of the ozone generator, Figure 3 For the flow chart of the manufacturing method of the conductive plate structure of the ozone generator of the present application, see Figure 3 The manufacturing method comprises the following steps: S201: Provide a conductive material and a rare earth element material, add the rare earth element material to the liquid conductive material, mix the conductive material and the rare earth element material thoroughly by stirring, and obtain a mixed material; S202: Provide a substrate layer 111, and coat the mixed material on the upper surface of the substrate layer 111; S203: Bake the substrate layer 111 coated with the mixed material at a set temperature, and the mixed material solidifies on the substrate layer 111 to form a conductive layer 112, thereby obtaining a conductive plate structure 110.

[0053] In the manufacturing method, first, the rare earth element material is added into the liquid conductive material, and the conductive material and the rare earth element material are fully and uniformly mixed by stirring. The uniformity of the mixture can ensure that the conductive layer 112 has consistent conductivity, avoiding local conductivity degradation of the conductive layer 112. The mixed material obtained after mixing is coated on the upper surface of the substrate layer 111, and the mixed material is solidified by high-temperature baking to form a dense conductive layer 112 on the substrate layer 111. Since the conductive layer 112 contains the rare earth element material, the stable electron arrangement of the rare earth element provides protection for the conductive material, slows down or prevents the oxidation reaction of the conductive material, thereby improving the oxidation resistance of the conductive layer 112. The rare earth element has strong hardness and wear resistance, and after mixing with the conductive material, it can improve the overall mechanical strength of the conductive layer 112. The rare earth element has a significant inhibitory effect on the oxidation reaction of the conductive material, reducing the possibility of oxidation of the conductive material. This inhibitory effect ensures that the conductive material can maintain its good conductivity. The rare earth element affects the arrangement and distribution of metal atoms in the conductive layer 112, optimizing its microstructure. The optimized structure reduces the scattering and hindering of electrons during transmission, improves the transmission efficiency of electrons, enhances the conductivity of the conductive layer 112, and enables the conductive layer 112 to produce a stronger conductive effect on the substrate layer 111.

[0054] In one embodiment, when coating the mixed material, a gap is provided between the edge of the conductive layer 112 and the edge of the substrate layer 111, and the coverage area of the conductive layer 112 on the upper surface of the substrate layer 111 is within the range of 80% to 85%.

[0055] In a specific embodiment, the temperature is set to a range of 700°C to 850°C.

[0056] Between the rare earth element and the metal atom, electrons can be transferred from one atom to another or form chemical bonds by sharing electron pairs. This transfer or sharing of electrons results in strong interactions between atoms. Depending on the properties of the rare earth element and the metal atom and the reaction conditions, different types of chemical bonds can be formed between them. For example, when the rare earth element reacts with a metal atom with lower electronegativity, a metal bond may be formed; the metal bond is mainly achieved by sharing the electron cloud between metal atoms. When the rare earth element and the metal atom are mixed, the electron shell structure of the rare earth element is relatively stable and does not easily lose or gain electrons, but can interact with the metal atom to form a metal bond by sharing electrons. The addition of the rare earth element affects the arrangement and distribution of the metal atoms, thereby affecting the interaction force between the atoms.

[0057] At a temperature of 700-850°C, the activity of rare earth elements and metal atoms is moderate, which is conducive to the formation of interatomic forces (such as metal bonds) between rare earth elements and metal atoms. This temperature range neither makes the atoms too active to cause the breakage of chemical bonds, nor makes the atoms too stable to form new chemical bonds. By setting a suitable baking temperature, the interaction between rare earth elements and metal atoms is enhanced. A suitable temperature can promote atomic diffusion and rearrangement, thereby optimizing the configuration and strength of chemical bonds. The conductive layer 112 forms a more compact and stable structure. This helps to improve the mechanical strength, wear resistance, and corrosion resistance of the conductive layer 112. On the one hand, too high a temperature can cause the destruction of the structure of the conductive layer 112, such as the melting of grain boundaries, the growth of grains, etc., thereby reducing the mechanical strength and other properties of the conductive layer 112. High temperature can also cause adverse reactions such as oxidation and corrosion of the conductive material and rare earth elements, further damaging the performance of the conductive layer 112. On the other hand, too low a temperature can reduce the diffusion rate between atoms, and the chemical bonds are not sufficient, resulting in weak binding force between rare earth elements and metal atoms, and further limiting the improvement of the mechanical strength, oxidation resistance, and conductivity of the conductive layer 112.

[0058] In some embodiments, the mixed material is coated on the upper surface of the substrate layer 111 by spraying, printing, sputtering, etc. Spraying: By adjusting the spraying parameters (such as spraying speed, spraying distance, etc.), the thickness and uniformity of the conductive layer 112 can be accurately controlled. Spraying technology can quickly and uniformly coat the mixed material on the substrate surface, improving production efficiency. Printing: Printing technology can accurately coat the mixed material on the substrate surface. Sputtering: Sputtering technology is suitable for plating a variety of metals, alloys, ceramics, etc. It can prepare coatings with special functions such as conductivity, thermal conductivity, magnetism, etc. Sputtering equipment usually has high automation degree, can realize continuous and stable production, and improve production efficiency. High-energy particles bombard the target material, causing target atoms or molecules to sputter and deposit on the upper surface of the substrate layer 111, forming a firm conductive layer 112 with strong adhesion. Sputtering technology can prepare a uniform, dense, and pore-free conductive layer 112 with excellent wear resistance, corrosion resistance, and high-temperature resistance.

[0059] By selecting a suitable coating method, the mixed material is uniformly coated on the upper surface of the substrate layer 111, which can avoid the problem of excessive or insufficient content of rare earth element material in the local area of the solidified conductive layer 112, and further avoid the excessive difference in conductivity between different areas of the conductive layer 112, such as excessive conductivity in some local areas of the conductive layer 112, or insufficient conductivity in other local areas of the conductive layer 112.

[0060] In some embodiments, the liquid conductive material is silver paste or gold paste.

[0061] The improvement effect of the conductive plate structure of the ozone generator of the present application on the ozone concentration is explained below in connection with specific test experiments.

[0062] Take the ceramic substrate layer 111, silver as the conductive material, and neodymium as the rare earth element material as examples. Under the same test conditions, the silver conductive layer 112 without adding neodymium and the silver conductive layer 112 with adding neodymium are tested and compared. The test conditions include that the diameter of the ceramic substrate layer 111 is 101 mm, the coated diameter of the silver conductive layer 112 on the ceramic substrate layer 111 is 82 mm, the voltage is DC 3.6 kV, the gap between the positive and negative electrodes is 0.3 mm, the pressure in the cavity of the ozone generator is 25 psig, and the cooling temperature is 17℃.

[0063] Figure 4 For the data comparison table of the test experiments of the conductive plate structure of the ozone generator of the present application, please refer to Figure 4 Under the oxygen flow of 700 g / cm 3 to 2400 g / cm 3 In this interval range, the upper line segment is the silver conductive layer 112 with adding neodymium, and the lower line segment is the silver conductive layer 112 without adding neodymium. It can be seen that under the same oxygen flow, the ozone concentration generated by the silver conductive layer 112 with adding neodymium is greater than that generated by the silver conductive layer 112 without adding neodymium.

[0064] The technical effects of the conductive plate structure of the ozone generator of the present application are explained below.

[0065] 1. By adding rare earth element materials such as neodymium, samarium, lanthanum, or yttrium in the conductive layer 112, these rare earth elements can effectively improve the oxidation resistance of the conductive layer 112 due to their characteristics of not being easily oxidized. This means that the conductive layer 112 can maintain its stable conductive performance during long-term use and is not easily oxidized and failed.

[0066] 2. The rare earth elements are relatively hard in texture, and after being added to the conductive layer 112, they can significantly improve the hardness of the conductive layer 112, thereby improving its mechanical strength. This makes the conductive plate structure 110 better resist deformation and damage when subjected to external forces, prolonging the service life.

[0067] 3. The rare earth elements have good electrical conductivity, and after being added to the conductive layer 112, they can increase the number of free electrons, thereby improving the electrical conductivity of the conductive layer 112. This is crucial for ozone generators because good electrical conductivity can improve the generation rate of ozone and the concentration of ozone.

[0068] 4. Controlling the rare earth element content within the range of 0.15% to 0.25% ensures improved performance of the conductive layer 112 while avoiding increased brittleness or other adverse reactions caused by excessive addition. This reasonable content ratio setting ensures both improved performance of the conductive layer 112 and controlled production costs.

[0069] 5. The conductive layer 112 does not need to completely cover the substrate layer 111; it only needs to be applied to a majority of the upper surface of the substrate layer 111 (80% to 85% coverage). This design not only ensures high conductivity of the conductive layer 112 but also reduces the amount of consumables for the conductive layer 112, thereby reducing the production cost of the conductive plate structure 110.

[0070] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0071] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0072] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0073] Although embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations of these embodiments are possible. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the invention described herein is susceptible to other embodiments and may be implemented or carried out in a variety of ways. Unless otherwise defined, technical or scientific terms used herein shall have the same ordinary meaning as would be understood by a person of ordinary skill in the art to which this invention pertains.

Claims

1. A conductive plate structure of an ozone generator, characterized in that: include: substrate layer; The conductive layer is provided on the substrate layer, and the material of the conductive layer includes a conductive material and a rare earth element material.

2. The conductive plate structure of the ozone generator according to claim 1, characterized in that: In the conductive layer, the content of the rare earth element material is greater than or equal to 0.15% and less than or equal to 0.25%.

3. The conductive plate structure of the ozone generator according to claim 1, characterized in that: The rare earth element material is neodymium, samarium, lanthanum or yttrium.

4. The conductive plate structure of the ozone generator according to claim 1, characterized in that: There is a distance between the edge of the conductive layer and the edge of the substrate layer, and the coverage area of ​​the conductive layer on the upper surface of the substrate layer is in a range of 80% to 85%.

5. The conductive plate structure of the ozone generator according to any one of claims 1 to 4, characterized in that: The material of the substrate layer is ceramic or sapphire.

6. The conductive plate structure of the ozone generator according to any one of claims 1 to 4, characterized in that: The conductive material is silver or gold.

7. An ozone generator, characterized in that: include: The conductive plate structure of the ozone generator according to any one of claims 1 to 6.

8. A method for manufacturing a conductive plate structure of an ozone generator, characterized in that: The steps include: S201: providing a conductive material and a rare earth element material, adding the rare earth element material into the liquid conductive material, and stirring to fully mix the conductive material and the rare earth element material to obtain a mixed material; S202: providing a substrate layer, and coating the mixed material on the upper surface of the substrate layer; S203: baking the base material layer coated with the mixed material at a set temperature, and the mixed material is solidified on the base material layer to form a conductive layer, thereby obtaining a conductive plate structure.

9. The method for manufacturing the conductive plate structure of the ozone generator according to claim 8, characterized in that: When applying the mixed material, a distance is provided between the edge of the conductive layer and the edge of the substrate layer, and the coverage area of ​​the conductive layer on the upper surface of the substrate layer is in the range of 80% to 85%.

10. The method for manufacturing the conductive plate structure of the ozone generator according to claim 8, characterized in that: The set temperature range is 700°C-850°C.