High-voltage multi-core ceramic capacitor and preparation method thereof

Abstract

The invention discloses a high-voltage multi-core ceramic capacitor and a preparation method thereof, and the multi-core ceramic capacitor comprises a pedestal, two connection frames which are oppositely disposed on the pedestal, and a plurality of capacitor modules which are sequentially arranged in the length direction of the connection frames. The capacitor module comprises a plurality of capacitors which are sequentially connected in series between two connecting frames and a plurality of series connecting sheets which are respectively arranged between two adjacent capacitors, and the connecting frames are connected with the opposite capacitors; the capacitor comprises a capacitor body, two parallel frames oppositely arranged on the two sides of the capacitor body, a potting shell used for installing the capacitor body and a potting layer arranged in the potting shell and wrapping the capacitor body. The specific structure of the capacitor module is limited to be matched with the connecting frame, so that parallel capacity increasing and series voltage dividing of the multiple capacitor chips are achieved, other capacitor modules are not affected after a certain capacitor module fails, and the market requirement of higher-voltage products is met.

Description

Technical Field

[0001] This invention belongs to the field of multi-core ceramic capacitor manufacturing, specifically relating to a high-voltage multi-core ceramic capacitor and its manufacturing method. Background Technology

[0002] The withstand voltage limit of a single ceramic capacitor chip is generally several thousand to ten thousand volts. Due to the influence of pulse capacitor materials and processes, increasing the withstand voltage limit design will affect the chip reliability and cannot meet the market demand for higher voltage products, which needs to be further improved. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-voltage multi-core ceramic capacitor and its preparation method.

[0004] The present invention adopts the following technical solution: A high-voltage multi-core ceramic capacitor includes a base, two connecting frames disposed opposite to each other on the base, and a plurality of capacitor modules arranged sequentially along the length of the connecting frames. Each capacitor module includes a plurality of capacitors disposed in series between the two connecting frames and a plurality of series connecting pieces disposed between adjacent capacitors. The connecting frames are connected to the opposite capacitors. Each capacitor includes a capacitor body, two parallel frames disposed opposite to each other on both sides of the capacitor body, a potting shell for mounting the capacitor body, and a potting layer disposed in the potting shell to encapsulate the capacitor body. The upper ends of the parallel frames extend outside the potting layer and are connected to the opposite connecting frames or series connecting pieces.

[0005] Furthermore, the capacitor body includes a plurality of capacitor chips spaced apart and a plurality of spacers respectively disposed between two adjacent capacitor chips. Each capacitor chip has an end electrode at both ends, and the parallel frame is connected to the plurality of end electrodes of the plurality of capacitor chips located on the same side.

[0006] Furthermore, the parallel frame includes a main body portion disposed on one side of the capacitor body and connected to a plurality of opposite end electrodes, and a connecting portion disposed vertically on the upper end of the main body portion and connected to a connecting frame or a series connecting piece.

[0007] Furthermore, the main body is provided with a plurality of first strip-shaped vent holes and a plurality of second strip-shaped vent holes at intervals and alternating. The plurality of first strip-shaped vent holes are respectively opposite to the end electrodes of a plurality of capacitor chips, and the plurality of second strip-shaped vent holes are respectively opposite to a plurality of pads.

[0008] Furthermore, the base is provided with a plurality of positioning grooves extending along the length of the connecting frame, and the plurality of capacitors are respectively embedded in the plurality of opposite positioning grooves. The connecting part is connected to the base and the opposite connecting frame or series connecting piece via a locking member. The locking member includes a first locking hole provided on the connecting part, a second locking hole provided on the base opposite to the first locking hole, a third locking hole provided on the connecting frame or series connecting piece opposite to the first locking hole, and a locking bolt that passes through the third locking hole, the first locking hole and the second locking hole in sequence.

[0009] Furthermore, the potting shell has a mounting cavity for mounting the capacitor body, the main body is disposed in the mounting cavity, and the connecting portion extends to the outside of the potting layer.

[0010] A method for preparing a high-voltage multi-core ceramic capacitor specifically includes the following steps: Step 1: Fix the two parallel frames to both sides of the capacitor body with solder, then fix the capacitor body and the two parallel frames on the welding fixture, and weld them together by reflow soldering. Step 2: Place the potting shell in the potting fixture, then place the welded capacitor body and two parallel frames in the potting shell, and then inject the potting material into the potting shell to wrap and seal the capacitor body to obtain the capacitor. Step 3: Multiple capacitors are sequentially and alternately connected to multiple series connecting pieces via locking components to obtain the capacitor module; Step 4: Arrange multiple capacitor modules sequentially along the length of the connecting frame, so that the connecting frame is connected to the capacitor at the end of the opposite capacitor module, and then fix the two connecting frames to the base with locking components to obtain the high voltage multi-core ceramic capacitor.

[0011] Furthermore, the parallel frame includes a main body portion disposed on one side of the capacitor body and a connecting portion vertically disposed on the upper end of the main body portion and connected to the connecting frame or series connecting piece. The welding fixture includes a welding seat for supporting the capacitor body, two limiting grooves disposed opposite to each other on the welding seat for supporting the opposite connecting portions, a clamping assembly for clamping the two parallel frames at both ends of the capacitor body, a limiting sleeve sleeved on the upper end of the capacitor body, and limiting bolts respectively disposed in the two limiting grooves for fixing the opposite connecting portions.

[0012] Furthermore, the clamping assembly includes two clamping blocks disposed opposite to each other on the sides of the two parallel frames, two clamping screws spaced apart between the two clamping blocks, two clamping springs respectively sleeved on the two clamping screws with one end connected to the opposite clamping block, and two clamping nuts respectively disposed on the two clamping screws and abutting against the other end of the clamping springs.

[0013] Furthermore, the potting fixture includes a potting seat, a receiving cavity disposed on the potting seat for placing the potting shell, two connecting grooves disposed opposite each other at the upper end of the potting seat, and a positioning block disposed on the top of the potting seat. The connecting parts of the two connecting frames are respectively supported in the two connecting grooves, so that when the potting material is potted, the capacitor body is suspended in the potting shell.

[0014] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: This application defines the structure of the ceramic capacitor, realizes the series connection of multiple capacitor modules by the connecting frame, and further defines the structure of the capacitor module, which is formed by multiple capacitors and multiple series connecting pieces connected in series, and the capacitor body is composed of multiple capacitor chips. With the parallel frame on both sides, several capacitor chips can be connected in parallel to increase capacity and series to divide voltage. After the failure of one capacitor module, it will not affect other capacitor modules, thus meeting the market demand for higher voltage products. Among them, after multiple capacitor chips are connected in parallel by the parallel frame, the multiple capacitor chips will be protected by the cooperation of the potting shell, potting layer and gasket. Since there are many components of capacitor chips and the size of the multi-core ceramic capacitor after preparation is large, the preparation method is further defined by setting welding fixtures and potting fixtures, with the base, to ensure that the dimensional accuracy is maintained during the processing and improve the product yield. Attached Figure Description

[0015] Figure 1 Schematic diagram of a high-voltage multi-core ceramic capacitor Figure 1 ; Figure 2 Schematic diagram of a high-voltage multi-core ceramic capacitor Figure 2 ; Figure 3 This is a schematic diagram of a capacitor. Figure 4 This is an exploded view of a capacitor; Figure 5 This is a schematic diagram of the filling fixture. Figure 6 This is a schematic diagram showing the fit between the potting fixture and the capacitor. Figure 7 This is an exploded view of the fit between the potting fixture and the capacitor. Figure 8 Schematic diagram of the welding fixture Figure 1 ; Figure 9 Schematic diagram of the welding fixture Figure 2 ; In the diagram, 1-base, 2-connecting frame, 3-capacitor module, 4-capacitor, 5-series connecting piece, 6-locking component, 7-welding fixture, 8-potting fixture, 11-positioning groove, 21-frame body, 22-lead-out end, 41-capacitor body, 411-capacitor chip, 412-gasket, 413-terminal electrode, 42-parallel frame, 421-main body, 422-connecting part, 423-first strip-shaped vent hole, 424-second strip-shaped vent hole, 43-potting shell, 44-potting Layer, 45-Mounting cavity, 61-First locking hole, 62-Second locking hole, 63-Third locking hole, 64-Locking bolt, 71-Welding seat, 72-Limiting groove, 73-Clamping assembly, 731-Clamping block, 732-Clamping screw, 733-Clamping spring, 734-Clamping nut, 735-Clamping part, 74-Limiting sleeve, 75-Limiting bolt, 81-Pouring seat, 82-Receiving cavity, 83-Connecting groove, 84-Positioning block, 85-Relief area, 86-Positioning part, 87-Positioning bolt. Detailed Implementation

[0016] The present invention will be further described below through specific embodiments.

[0017] Reference Figures 1 to 9 As shown, a high-voltage multi-core ceramic capacitor includes a base 1, two connecting frames 2 disposed opposite to each other on the base 1, and a plurality of capacitor modules 3 arranged sequentially along the length of the connecting frames 2. The connecting frame 2 includes a frame body 21 connected to one side of the plurality of capacitor modules 3 and lead-out terminals 22 disposed on the outside of the frame body 21.

[0018] The capacitor module 3 includes a plurality of capacitors 4 arranged in series between two connecting frames 2 and a plurality of series connecting pieces 5 arranged between adjacent capacitors 4, wherein the connecting frame 2 is connected to the opposite capacitor 4; specifically, the series connecting pieces 5 are rectangular.

[0019] The capacitor 4 includes a capacitor body 41, two parallel frames 42 disposed opposite to each other on both sides of the capacitor body 41, a potting shell 43 for mounting the capacitor body 41, and a potting layer 44 disposed in the potting shell 43 to encapsulate the capacitor body 41 and the two parallel frames 42. The upper ends of the parallel frames 42 extend outside the potting layer 44 and are connected to the opposite connecting frames 2 or series connecting pieces 5. Specifically, the potting shell 43 forms a mounting cavity 45 for mounting the capacitor body 41.

[0020] The capacitor body 41 includes a plurality of capacitor chips 411 spaced apart and a plurality of spacers 412 respectively disposed between two adjacent capacitor chips 411. Each capacitor chip 411 has a terminal electrode 413 at both ends. The parallel frame 42 is connected to the terminal electrodes 413 of the plurality of capacitor chips 411 located on the same side to realize the parallel connection of the plurality of capacitor chips 411 in the capacitor body 41. Correspondingly, the base 1 is provided with a plurality of positioning grooves 11 extending along the length direction of the connecting frame 2. The plurality of positioning grooves 11 are spaced apart between the two connecting frames 2. The plurality of capacitors 4 of the same capacitor module 3 are respectively embedded in the plurality of corresponding positioning grooves 11.

[0021] The parallel frame 42 includes a main body 421 disposed on one side of the capacitor body 41 and connected to multiple terminal electrodes 413, and a connecting part 422 vertically disposed on the upper end of the main body 421 and connected to the connecting frame 2 or series connecting piece 5. The main body 421 is disposed in the mounting cavity 45, and the connecting part 422 extends beyond the potting layer 44. Specifically, the main body 421 is alternately provided with multiple first strip-shaped vent holes 423 and multiple second strip-shaped vent holes 424. The multiple first strip-shaped vent holes 423 are opposite to the terminal electrodes 413 of multiple capacitor chips 411, and the multiple second strip-shaped vent holes 424 are respectively opposite to multiple gaskets 412. The extension length of the first strip-shaped vent holes 423 is longer than the extension length of the second strip-shaped vent holes 424. The first strip-shaped vent holes 423 connect to the terminal electrodes 413 of multiple capacitor chips 411. The two exhaust holes 424 ensure that gas can be discharged during reflow soldering of the parallel frame 42 and the capacitor body 41, thus ensuring the welding quality of the capacitor body 41 and the two parallel frames 42. Furthermore, the connecting part 422 is connected to the base 1 and the opposite connecting frame 2 or the series connecting piece 5 via the locking member 6. The locking member 6 includes a first locking hole 61 on the connecting part 422, a second locking hole 62 on the base 1 opposite to the first locking hole 61, a third locking hole 63 on the connecting frame 2 or the series connecting piece 5 opposite to the first locking hole 61, and a locking bolt 64 that passes through the third locking hole 63, the first locking hole 61 and the second locking hole 62 in sequence. The capacitor 4 and the series connecting piece 5 are connected through the locking member 6 to obtain the capacitor module 3.

[0022] A method for preparing a high-voltage multi-core ceramic capacitor specifically includes the following steps: Step 1: Apply solder to both sides of multiple pads 412 and connect them to the corresponding capacitor chips 411 to form a capacitor body 41. Then, fix two parallel frames 42 to both sides of the capacitor body 41 with solder. Then, fix the capacitor body 41 and the two parallel frames 42 on the welding fixture 7 and weld them together by reflow soldering. Step 2: Place the potting shell 43 into the receiving cavity 82, and then suspend the capacitor body 41 and parallel frame 42 welded in Step 1 in the receiving cavity 82, so that the two connecting parts 422 are respectively embedded in the corresponding connecting grooves 83. Then, inject the potting material into the potting shell 43 through the relief area 85 to wrap and seal the capacitor body 41 and the main body 421, and obtain the capacitor 4. Step 3: Multiple capacitors 4 are sequentially and alternately connected to multiple series connecting pieces 5 via locking member 6 to obtain the capacitor module 3; Step 4: Arrange multiple capacitor modules 3 sequentially along the length of the connecting frame 2, so that the connecting frame 2 is connected to the capacitor 4 located at the end of the capacitor module 3. Then, fix the two connecting frames 2 to the base 1 respectively by the locking piece 6 to obtain a high voltage multi-core ceramic capacitor.

[0023] The welding fixture 7 includes a welding seat 71 for supporting the capacitor body 41, two limiting grooves 72 oppositely disposed on the welding seat 71 for supporting the opposite connecting parts 422, a clamping assembly 73 for clamping the two parallel frames 42 at both ends of the capacitor body 41, a limiting sleeve 74 sleeved on the upper end of the capacitor body 41, and limiting bolts 75 respectively disposed in the two limiting grooves 72 for fixing the opposite connecting parts 422. The welding seat 71 provides support strength for the capacitor body 41 and the parallel frames 42 during welding. The limiting sleeve 74 can limit the multiple capacitor chips 411 to prevent them from shifting in the left and right directions during reflow soldering. Specifically, the limiting sleeve 74 is made of polytetrafluoroethylene.

[0024] The clamping assembly 73 includes two clamping blocks 731 disposed opposite to each other on the sides of the two parallel frames 42, two clamping screws 732 spaced apart between the two clamping blocks 731, two clamping springs 733 respectively sleeved on the two clamping screws 732 with one end connected to the opposite clamping block 731, and two clamping nuts 734 respectively disposed on the two clamping screws 732 and abutting against the other end of the clamping springs 733. Specifically, the clamping blocks 731 and the opposite surfaces of the parallel frames 42 are provided with two clamping portions 735 spaced apart and abutting against the parallel frames 42. The clamping portions 735 only provide support in the easily deformable areas of the parallel frames 42; reflow soldering First, position the two clamping blocks 731 on the sides of the two parallel frames 42 respectively, then tighten the clamping nut 734. Through the cooperation of the clamping nut 734 and the clamping screw 732, the clamping block 731 connected to the clamping spring 733 is driven to move closer to the other clamping block. Finally, the two clamping blocks 731 abut against the opposite parallel frames 42 respectively, completing the limiting of the parallel frames 42 and preventing the parallel frames 42 from shifting during the reflow soldering process, which would affect the welding quality of the capacitor body 41 and the parallel frames 42. Through the structure of the limiting clamping assembly 73 and the two limiting bolts 75, the parallel frames 42 are effectively limited.

[0025] The potting fixture 8 includes a potting seat 81, a receiving cavity 82 disposed on the potting seat 81 for placing the potting shell 43, two connecting grooves 83 disposed opposite each other at the upper end of the potting seat 81, and a positioning block 84 disposed on the top of the potting seat 81. The positioning block 84 has a clearance area 85 opposite to the receiving cavity 82, through which the potting material enters the receiving cavity 82 to form a potting layer 44 covering the capacitor body 41 and the parallel frame 42. The connecting portions 422 of the two parallel frames 42 are respectively supported in the two connecting grooves 83, so that... When the potting material is applied, the capacitor body 41 is suspended in the potting shell 43. Specifically, the positioning block 84 is provided with two positioning parts 86 on both sides, which are supported on the top of the potting base 81. The positioning parts 86 are fixed to the top of the potting base 81 by positioning bolts 87. When the positioning block 84 is fixed to the top of the potting base 81 by the positioning parts 86 and the positioning bolts 87, the two parallel frames 42 will be pressed together, so that the capacitor body 41 can be suspended in the potting shell 43, maintaining the accuracy of the relative position, and also preventing the potting material from overflowing during potting.

[0026] This application defines the structure of the ceramic capacitor, using a connecting frame 2 to connect multiple capacitor modules 3 in series. The structure of the capacitor module 3 is further defined, consisting of multiple capacitors 4 connected in series with multiple series connecting pieces 5. The capacitor body 41 is composed of multiple capacitor chips 411, which, in conjunction with the parallel frames 42 on both sides, enable parallel capacitance increase and series voltage division of the capacitor chips 411. The failure of one capacitor module 3 will not affect other capacitor modules, meeting the market demand for higher voltage products. The multiple capacitor chips 411, connected in parallel via the parallel frames 42, are protected by the potting shell 43, potting layer 44, and gasket 412. Because the number of capacitor chips 411 is large and the resulting multi-core ceramic capacitor is relatively large, the manufacturing method is further defined by setting a welding fixture 7 and a potting fixture 8, along with a base 1, to ensure high dimensional accuracy during processing and improve product yield.

[0027] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A high-voltage multi-core ceramic capacitor, characterized in that: The device includes a base, two connecting frames opposite each other on the base, and multiple capacitor modules arranged sequentially along the length of the connecting frames. Each capacitor module includes multiple capacitors arranged in series between the two connecting frames and multiple series connecting pieces respectively arranged between two adjacent capacitors. The connecting frames are connected to the opposite capacitors. Each capacitor includes a capacitor body, two parallel frames opposite each other on both sides of the capacitor body, a potting shell for mounting the capacitor body, and a potting layer disposed in the potting shell to wrap the capacitor body. The upper ends of the parallel frames extend outside the potting layer and are connected to the opposite connecting frames or series connecting pieces.

2. The high-voltage multi-core ceramic capacitor according to claim 1, characterized in that: The capacitor body includes a plurality of capacitor chips spaced apart and a plurality of spacers disposed between adjacent capacitor chips. Each capacitor chip has an end electrode at both ends. The parallel frame is connected to the multiple end electrodes of the capacitor chips located on the same side.

3. A high-voltage multi-core ceramic capacitor according to claim 2, characterized in that: The parallel frame includes a main body that is disposed on one side of the capacitor body and connected to multiple terminal electrodes, and a connecting part that is vertically disposed on the upper end of the main body and connected to a connecting frame or a series connecting piece.

4. A high-voltage multi-core ceramic capacitor according to claim 3, characterized in that: The main body is provided with a plurality of first strip-shaped vent holes and a plurality of second strip-shaped vent holes at intervals. The plurality of first strip-shaped vent holes are respectively opposite to the end electrodes of a plurality of capacitor chips, and the plurality of second strip-shaped vent holes are respectively opposite to a plurality of pads.

5. A high-voltage multi-core ceramic capacitor according to claim 3, characterized in that: The base is provided with a plurality of positioning grooves extending along the length of the connecting frame. The plurality of capacitors are respectively embedded in the plurality of opposite positioning grooves. The connecting part is connected to the base and the opposite connecting frame or series connecting piece via a locking member. The locking member includes a first locking hole provided on the connecting part, a second locking hole provided on the base opposite to the first locking hole, a third locking hole provided on the connecting frame or series connecting piece opposite to the first locking hole, and a locking bolt that passes through the third locking hole, the first locking hole and the second locking hole in sequence.

6. A high-voltage multi-core ceramic capacitor according to claim 2, characterized in that: The potting shell has a mounting cavity for mounting the capacitor body, the main body is disposed in the mounting cavity, and the connecting portion extends to the outside of the potting layer.

7. The method for preparing a high-voltage multi-core ceramic capacitor according to claim 1, characterized in that: Specifically, the following steps are included: Step 1: Fix the two parallel frames to both sides of the capacitor body with solder, then fix the capacitor body and the two parallel frames on the welding fixture, and weld them together by reflow soldering. Step 2: Place the potting shell in the potting fixture, then place the welded capacitor body and two parallel frames in the potting shell, and then inject the potting material into the potting shell to wrap and seal the capacitor body to obtain the capacitor. Step 3: Multiple capacitors are sequentially and alternately connected to multiple series connecting pieces via locking components to obtain the capacitor module; Step 4: Arrange multiple capacitor modules sequentially along the length of the connecting frame, so that the connecting frame is connected to the capacitor at the end of the opposite capacitor module, and then fix the two connecting frames to the base with locking components to obtain the high voltage multi-core ceramic capacitor.

8. The method for preparing a high-voltage multi-core ceramic capacitor according to claim 7, characterized in that: The parallel frame includes a main body portion disposed on one side of the capacitor body and a connecting portion disposed vertically on the upper end of the main body portion and connected to the connecting frame or series connecting piece. The welding fixture includes a welding seat for supporting the capacitor body, two limiting grooves disposed opposite to each other on the welding seat for supporting the opposite connecting portions, a clamping assembly for clamping the two parallel frames at both ends of the capacitor body, a limiting sleeve sleeved on the upper end of the capacitor body, and limiting bolts respectively disposed in the two limiting grooves for fixing the opposite connecting portions.

9. The method for preparing a high-voltage multi-core ceramic capacitor according to claim 8, characterized in that: The clamping assembly includes two clamping blocks disposed opposite to each other on the sides of the two parallel frames, two clamping screws spaced apart between the two clamping blocks, two clamping springs respectively sleeved on the two clamping screws with one end connected to the opposite clamping block, and two clamping nuts respectively disposed on the two clamping screws and abutting against the other end of the clamping springs.

10. The method for preparing a high-voltage multi-core ceramic capacitor according to claim 8, characterized in that: The potting fixture includes a potting seat, a receiving cavity disposed on the potting seat for placing the potting shell, two connecting grooves disposed opposite each other at the upper end of the potting seat, and a positioning block disposed on the top of the potting seat. The connecting parts of the two connecting frames are respectively supported in the two connecting grooves, so that when the potting material is potted, the capacitor body is suspended in the potting shell.

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