A bare-die integrated component

Abstract

This invention discloses a bare-chip integrated assembly, relating to the technical field of bare-chip integrated assemblies. A copper base plate is fixed to the lower end of the plastic shell, and a DBC substrate is welded and fixed to the copper base plate. A chip, an NTC, and a diode are welded and fixed to the DBC substrate. The DBC substrate is electrically connected to power terminals mounted on the plastic shell via bonding wires. The plastic shell and a drive board are nested together, and the drive board is positioned by contacting a boss inside the plastic shell. This bare-chip integrated assembly employs a self-adjusting locking wireline connector mechanism. When the wireline connector is inserted into the mechanism, the distance between the two conductive copper plates is greater than the diameter of the insertion rod on the wireline connector, thereby reducing the resistance encountered during insertion and improving ease of connection. Furthermore, after assembly, the conductive copper plates and the insertion rod on the wireline connector are fixed and self-locked, ensuring normal conductivity and thus guaranteeing the normal operation of the device.

Description

Technical Field

[0001] This invention relates to the field of bare-die integrated component technology, specifically to a bare-die integrated component. Background Technology

[0002] Bare die integrated components are a technology that integrates and packages multiple functional modular chips into a single device through a DBC substrate. Its core lies in breaking down a complex system into multiple prefabricated chips with specific functions, and then combining them into a complete system through a DBC substrate to meet actual use requirements.

[0003] Traditional bare-core integrated components mainly adopt a discrete structure design. Components such as driver boards, main power boards and interface boards are installed separately by plugging or soldering. Due to the dispersed layout of components, heat is difficult to conduct evenly and tends to accumulate in local areas, affecting long-term reliability. Summary of the Invention

[0004] The purpose of this invention is to provide a bare-die integrated component to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a bare-chip integrated component, comprising a plastic shell, a copper base plate fixed to the lower end of the plastic shell, a DBC substrate welded to the copper base plate, and a chip, an NTC, and a diode welded to the DBC substrate. The DBC substrate is electrically connected to power terminals mounted on the plastic shell via bonding wires. The plastic shell and a drive board are nested together, and the drive board is positioned by contacting a boss inside the plastic shell. The drive board is welded to corresponding terminals on the DBC substrate. A busbar connector is also mounted on the drive board. The plastic shell is fixed to a main power board by bolts. The main power board is welded to corresponding terminals on the DBC substrate. An interface board is disposed above the main power board.

[0006] Preferably, the main power board is fixed with four connecting posts, and the main power board is also provided with an opening for the cable connector to pass through. Through the above structure, a basic guarantee can be provided for the assembly of the entire device.

[0007] Preferably, a positioning sleeve is also fixed on the lower end face of the interface board, and the positioning sleeve and the connecting post are distributed in a one-to-one correspondence, and the positioning sleeve and the connecting post are nested. Through the nesting effect between the positioning sleeve and the connecting post, accurate positioning and assembly between the main power board and the interface board can be achieved.

[0008] Preferably, the lower end face of the interface board is fixed with a cable tray connector mechanism and a heat dissipation mechanism, and the cable tray connector mechanism and the cable tray connector are distributed in a one-to-one correspondence. The cable tray connector mechanism includes a housing fixed to the lower end face of the interface board, and a movable plate is provided inside the housing. The movable plate is symmetrically fixed with convex shafts at the front and back, and the convex shafts are slidably connected to the housing. When the movable plate moves, the sliding guide effect between the convex shafts and the housing can ensure the stability of the movable plate's movement.

[0009] Preferably, the convex shaft is slidably connected to the slide groove formed on the movable plate, and the slide groove is inclined. A connecting rod is fixed between the upper and lower movable plates, and the connecting rod is slidably connected to the fixed plate fixed in the housing. The movable plate drives the slide groove to move, and the sliding action between the slide groove and the convex shaft can provide a basic guarantee for the position adjustment of the movable plate.

[0010] Preferably, a spring is fixed between the movable plate and the fixed plate, and a top rod is also fixed on the lower movable plate. The top rod is slidably connected to the housing. Through the elastic action of the spring, a basic force can be provided for the automatic reset of the movable plate and the top rod.

[0011] Preferably, an arc-shaped conductive copper plate is fixed on the movable plate, and the conductive copper plate contacts the busbar connector to achieve electrical connection. An elastic copper frame is fixed between the two conductive copper plates, and a copper terminal is fixed on the elastic copper frame. The copper terminal is welded and fixed to the interface plate. Through the above structure, normal electrical conductivity between devices can be ensured, thereby ensuring the normal use of the device.

[0012] Preferably, the heat dissipation mechanism includes a fixed shell fixed to the lower end face of the interface board, and the fixed shell penetrates the main power board and the drive board. An air inlet is provided on the fixed shell, and a motor is fixed inside the fixed shell. A rotating shaft is fixed to the output end of the motor, and a fan blade is fixed on the rotating shaft. Through the above structure, the internal air cooling function of the device can be realized, thereby effectively ensuring the heat dissipation effect inside the device.

[0013] Preferably, a crossbar is also fixed on the rotating shaft, and the crossbar is fixed on the air outlet. A limit ring is fixed on the air outlet, and the limit ring is slidably connected to the fixed shell. The air outlet is located in the gap between the drive plate and the DBC base plate. With the above structure, the air outlet can be limited when it rotates, thus ensuring the stability of the air outlet rotation.

[0014] Preferably, the air outlet is in contact with a rolling ball bearing, and the ball bearing is installed in a fixed housing. The air outlet is also provided with an air outlet, which is located in the gap between the drive plate and the DBC substrate. By rotating the air outlet, the air outlet is driven to automatically adjust the air outlet direction, thereby effectively accelerating the air flow inside the device and further ensuring the heat dissipation effect of the device.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This bare core integrated component adopts a self-adjusting locking wire strip connector mechanism, which ensures that when the wire strip connector is inserted into the wire strip connector mechanism, the distance between the two conductive copper plates is greater than the diameter of the insertion rod on the wire strip connector. This reduces the resistance encountered when inserting the insertion rod on the wire strip connector, improves the ease of insertion, and also enables the conductive copper plates to be fixed and self-locked to the insertion rod on the wire strip connector after the device is assembled, ensuring normal conductivity and thus ensuring the normal operation of the device.

[0017] 2. This bare-core integrated component adopts a nested heat dissipation mechanism, which can reduce redundant space, make the overall structure more compact, and enhance the internal air convection efficiency of the device, improving heat dissipation performance by more than 30%. It effectively reduces the operating temperature of key components inside the device. In addition, the rotating air outlet structure can automatically adjust the airflow direction according to the temperature distribution to achieve dynamic air cooling coverage, avoid local overheating, and ensure uniform heat dissipation. Attached Figure Description

[0018] Figure 1 This is a frontal view of the three-dimensional structure of the device of the present invention in a disassembled state;

[0019] Figure 2 This is a frontal three-dimensional structural diagram of the overall composition of the device of the present invention;

[0020] Figure 3 This is a bottom-view three-dimensional structural diagram of the interface board of the present invention;

[0021] Figure 4 This is a front cross-sectional three-dimensional structural schematic diagram of the wire strip connector mechanism of the present invention;

[0022] Figure 5 This is a schematic diagram of the disassembled structure of the movable plate and the conductive copper plate of the present invention.

[0023] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point A in the middle;

[0024] Figure 7 This is a frontal cross-sectional three-dimensional structural diagram of the heat dissipation mechanism of the present invention.

[0025] In the diagram: 1. Plastic shell; 101. Boss; 2. Copper base plate; 3. DBC substrate; 4. Power terminal; 5. Drive board; 6. Cable connector; 7. Main power board; 701. Connecting post; 702. Opening; 8. Interface board; 801. Positioning sleeve; 9. Cable connector mechanism; 901. Housing; 902. Movable plate; 903. Protruding shaft; 904. Slide groove; 905. Moving plate; 906. Connecting rod; 9 07. Fixing plate; 908. Spring; 909. Top rod; 910. Conductive copper plate; 911. Elastic copper frame; 912. Copper terminal; 10. Heat dissipation mechanism; 1001. Fixing shell; 1002. Air inlet; 1003. Motor; 1004. Rotating shaft; 1005. Fan blade; 1006. Crossbar; 1007. Air outlet; 1008. Limiting ring; 1009. Ball bearing; 1010. Air outlet. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figures 1-7 This invention provides a technical solution: a bare-chip integrated component, including a plastic shell 1, a copper base plate 2 fixed to the lower end of the plastic shell 1, a DBC substrate 3 welded to the copper base plate 2, and a chip, NTC and diode welded to the DBC substrate 3. The DBC substrate 3 is electrically connected to the power terminals 4 mounted on the plastic shell 1 through bonding wires. The plastic shell 1 and the drive board 5 are nested together, and the drive board 5 is positioned by contacting the inner boss 101 of the plastic shell 1. The drive board 5 is welded to the corresponding terminals on the DBC substrate 3. A wire connector 6 is also installed on the drive board 5. The plastic shell 1 is fixed to the main power board 7 by bolts. The main power board 7 is welded to the corresponding terminals on the DBC substrate 3. An interface board 8 is provided above the main power board 7.

[0028] Four connecting posts 701 are fixed on the main power board 7, and the main power board 7 is also provided with a through opening 702 for the cable connector 6; a positioning sleeve 801 is also fixed on the lower end face of the interface board 8, and the positioning sleeve 801 and the connecting posts 701 are distributed in a one-to-one correspondence, and the positioning sleeve 801 and the connecting posts 701 are nested together.

[0029] When using assembled bare-die integrated components, such as Figures 1-7As shown, firstly, the DBC substrate 3, which is soldered with chips, NTC and diodes, is soldered and fixed to the copper base plate 2. Then, the drive board 5 is nested with the plastic shell 1. At this time, the terminals on the DBC substrate 3 pass through the openings on the drive board 5 until the drive board 5 contacts the inner boss 101 of the plastic shell 1 to achieve positioning. At this time, there is a gap between the drive board 5 and the DBC substrate 3. Then, the corresponding terminals on the drive board 5 that need to be connected to the DBC substrate 3 are soldered to achieve the assembly of the drive board 5. After the assembly is completed, the main power board 7 is locked to the plastic shell 1 with self-tapping screws. At this time, some terminals on the DBC substrate 3 pass through the corresponding holes on the main power board 7 and are soldered to the main power board 7 to complete the assembly of the main power board 7. At this time, the plug rod on the cable connector 6 passes through the opening 702. Finally, the positioning sleeve 801 and the connecting post 701 are nested and locked with self-tapping screws to achieve the positioning and assembly of the main power board 7 and the interface board 8. At this time, the plug rod on the cable connector 6 and the cable connector mechanism 9 are connected to achieve the conductive function.

[0030] A cable tray connector mechanism 9 and a heat dissipation mechanism 10 are fixed to the lower end face of the interface board 8. The cable tray connector mechanism 9 and the cable tray connector 6 are distributed in a one-to-one correspondence. The cable tray connector mechanism 9 includes a housing 901 fixed to the lower end face of the interface board 8. A movable plate 902 is provided inside the housing 901. A convex shaft 903 is symmetrically fixed on the movable plate 902. The convex shaft 903 is slidably connected to the housing 901. The convex shaft 903 is slidably connected to a groove 904 opened on a movable plate 905. The groove 904 is inclined. A connecting rod 906 is fixed between the upper and lower movable plates 905. The connecting rod 906 is slidably connected to the fixed plate 907 fixed inside the housing 901; a spring 908 is fixed between the moving plate 905 and the fixed plate 907, and a top rod 909 is also fixed on the lower moving plate 905, and the top rod 909 is slidably connected to the housing 901; an arc-shaped conductive copper plate 910 is fixed on the movable plate 902, and the conductive copper plate 910 contacts the wire connector 6 to achieve electrical connection, and an elastic copper frame 911 is fixed between the two conductive copper plates 910, and a copper terminal 912 is fixed on the elastic copper frame 911, and the copper terminal 912 is welded and fixed to the interface plate 8;

[0031] When assembling the main power board 7 and the interface board 8, such as Figures 1-7As shown, when the positioning sleeve 801 contacts the connecting post 701, the push rod 909 is in contact with the main power board 7, and the plug rod on the cable connector 6 is inserted between two adjacent conductive copper plates 910. At this time, the distance between the two adjacent conductive copper plates 910 is greater than the diameter of the plug rod on the cable connector 6, which facilitates the insertion and insertion operation. During the nesting process of the positioning sleeve 801 and the connecting post 701, the distance between the interface plate 8 and the main power board 7 decreases, causing the push rod 909 to be moved upward under force, thereby driving the moving plate 905 and the connecting rod 906 to move upward. With the sliding guide effect between the connecting rod 906 and the fixed plate 907, the moving plate 905 and the connecting rod 906 can be kept in place. The stability of the movement of rod 906 is ensured, and the movement of moving plate 905 can synchronously drive the movement of sliding groove 904. With the sliding action between sliding groove 904 and convex shaft 903, two adjacent moving plates 905 can move towards each other, thereby driving the conductive copper plate 910 to move, reducing the distance between the two conductive copper plates 910. When the positioning sleeve 801 and connecting post 701 are nested, the two conductive copper plates 910 are in contact with the plug rod on the wire connector 6 to achieve clamping and fixing, thereby ensuring the plug-in conductivity of the device. Finally, the main power board 7 and interface board 8 are locked with self-tapping screws to ensure the stability of the device.

[0032] The heat dissipation mechanism 10 includes a fixed housing 1001 fixed to the lower end face of the interface board 8, and the fixed housing 1001 penetrates the main power board 7 and the drive board 5. An air inlet 1002 is provided on the fixed housing 1001. A motor 1003 is fixed inside the fixed housing 1001, and a rotating shaft 1004 is fixed to the output end of the motor 1003. A fan blade 1005 is fixed to the rotating shaft 1004. A crossbar 1006 is also fixed to the rotating shaft 1004 and is fixed to the air outlet 100. 7. A limiting ring 1008 is fixed on the air outlet 1007, and the limiting ring 1008 is slidably connected to the fixed shell 1001. The air outlet 1007 is located in the gap between the drive plate 5 and the DBC substrate 3. The air outlet 1007 is in contact with a rollable ball 1009, and the ball 1009 is installed in the fixed shell 1001. An air outlet 1010 is also provided on the air outlet 1007, and the air outlet 1010 is located in the gap between the drive plate 5 and the DBC substrate 3.

[0033] After the main power board 7 and interface board 8 are assembled, as follows Figures 1-7As shown, at this time, the lower end fixing shell 1001 of the interface board 8 passes through the central circular hole of the main power board 7 and the drive board 5, so that the air outlet 1007 and the air outlet 1010 are located in the gap between the drive board 5 and the DBC substrate 3. During the subsequent use of the device, when the electronic components on the DBC substrate 3 generate heat due to operation, the motor 1003 is started. The motor 1003 drives the rotating shaft 1004, the fan blades 1005 and the crossbar 1006 to rotate. The fan blades 1005 can draw outside air into the fixing shell 1001 through the air inlet 1002 and out through the air outlet. 1010 is fed into the gap between the drive board 5 and the DBC substrate 3, thereby realizing the air cooling heat dissipation of the electronic components on the DBC substrate 3. When the crossbar 1006 rotates, it can simultaneously drive the air outlet 1007 and the air outlet 1010 to rotate. With the limiting effect of the limiting ring 1008 and the rolling effect of the ball 1009, the stability of the rotation of the air outlet 1007 and the air outlet 1010 can be ensured. Furthermore, the rotation of the air outlet 1010 can realize the adjustment of the air outlet direction, thereby achieving dynamic air cooling coverage, avoiding local overheating, and ensuring uniform heat dissipation.

[0034] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A bare-core integrated component, comprising a plastic shell (1), characterized in that: A copper base plate (2) is fixed to the lower end of the plastic shell (1). A DBC substrate (3) is welded and fixed on the copper base plate (2). A chip, NTC and diode are welded and fixed on the DBC substrate (3). The DBC substrate (3) is electrically connected to the power terminal (4) mounted on the plastic shell (1) through bonding wires. The plastic shell (1) and the drive board (5) are nested together. The drive board (5) is positioned by contacting the inner boss (101) of the plastic shell (1). The corresponding terminals on the drive board (5) are welded together. A wire bus connector is also installed on the drive board (5). (6) The plastic shell (1) is fixed to the main power board (7) by bolts. The main power board (7) is welded to the corresponding terminal on the DBC substrate (3). An interface board (8) is provided above the main power board (7). An opening (702) for the cable connector (6) to pass through is also provided on the main power board (7). A cable connector mechanism (9) and a heat dissipation mechanism (10) are fixed on the lower end face of the interface board (8). The cable connector mechanism (9) and the cable connector (6) are distributed in a one-to-one correspondence. The cable connector mechanism (9) includes a shell (901) fixed on the lower end face of the interface board (8). The housing (901) contains a movable plate (902), and convex shafts (903) are symmetrically fixed on the movable plate (902). The convex shafts (903) are slidably connected to the housing (901). The convex shafts (903) are slidably connected to a groove (904) on the movable plate (905), and the groove (904) is inclined. A connecting rod (906) is fixed between the upper and lower movable plates (905), and the connecting rod (906) is slidably connected to a fixed plate (907) fixed inside the housing (901). 5) A spring (908) is fixed between the fixed plate (907) and the lower movable plate (905) is also fixed with a top rod (909), and the top rod (909) is slidably connected to the housing (901). An arc-shaped conductive copper plate (910) is fixed on the movable plate (902), and the conductive copper plate (910) contacts the wire connector (6) to achieve electrical connection. An elastic copper frame (911) is fixed between the two conductive copper plates (910), and a copper terminal (912) is fixed on the elastic copper frame (911). The copper terminal (912) is welded and fixed to the interface plate (8).

2. The bare-chip integrated component according to claim 1, characterized in that: Four connecting posts (701) are fixed on the main power board (7).

3. A bare-chip integrated component according to claim 2, characterized in that: The lower end face of the interface board (8) is also fixed with a positioning sleeve (801), and the positioning sleeve (801) and the connecting post (701) are distributed in a one-to-one correspondence, and the positioning sleeve (801) and the connecting post (701) are nested together.

4. A bare-die integrated component according to claim 3, characterized in that: The heat dissipation mechanism (10) includes a fixed shell (1001) fixed to the lower end face of the interface board (8), and the fixed shell (1001) penetrates the main power board (7) and the drive board (5), and an air inlet (1002) is provided on the fixed shell (1001). At the same time, a motor (1003) is fixed inside the fixed shell (1001), and a rotating shaft (1004) is fixed to the output end of the motor (1003), and a fan blade (1005) is fixed on the rotating shaft (1004).

5. A bare-die integrated component according to claim 4, characterized in that: A crossbar (1006) is also fixed on the rotating shaft (1004), and the crossbar (1006) is fixed on the air outlet (1007). A limiting ring (1008) is fixed on the air outlet (1007), and the limiting ring (1008) is slidably connected to the fixed shell (1001). The air outlet (1007) is located in the gap between the drive plate (5) and the DBC substrate (3).

6. A bare-die integrated component according to claim 5, characterized in that: The air outlet (1007) is in contact with a rolling ball (1009), and the ball (1009) is installed in the fixed housing (1001). The air outlet (1007) is also provided with an air outlet (1010), and the air outlet (1010) is located in the gap between the drive plate (5) and the DBC substrate (3).

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