Conductive device for improving clamp of horizontal pulse electroplating equipment
By installing dust recovery mechanisms at both ends of the copper cylinder guide rail in the horizontal pulse electroplating equipment and attaching corrosion-resistant heat-shrink tubing to the wires, the problems of copper wire corrosion and insufficient dust recovery were solved, thereby improving conductivity stability and electroplating uniformity.
Patent Information
- Application Number
- CN202511347289.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-19
- Publication Date
- 2025-11-07
AI Technical Summary
Existing horizontal pulse electroplating equipment fixtures have problems with conductive devices, such as easy corrosion of copper wires and insufficient dust recovery, resulting in poor contact and shortened service life.
Dust collection mechanisms are installed at both ends of the copper cylinder guide rail to collect and clean the dust inside the copper cylinder guide rail. Corrosion-resistant heat-shrink tubing is then fitted onto the wires to isolate them from the corrosive environment.
It improves the conductivity of the fixture, extends the service life of the slider and copper cylinder guide rail, ensures current stability and electroplating uniformity, and increases the electroplating yield.
Smart Images
Figure CN120905753A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of horizontal electroplating equipment, and particularly relates to an improved horizontal pulse electroplating equipment clamp conductive device. BACKGROUND
[0002] Electroplating is a key important process technology for printed circuit boards (PCB), which can realize electrical connection between different layers of the circuit board, good conductivity, improve reliability, mechanical strength, solderability, corrosion resistance and yield. The horizontal pulse electroplating equipment is the core electroplating equipment for high-end PCB manufacturing. Through the deep integration of pulse current technology and horizontal conveying system, the uniformity and reliability of the plated layer of high-density interconnection (HDI) board, carrier board and thick copper board are significantly improved. For fine wires and narrow pitch design, horizontal electroplating can accurately control the copper thickness of the circuit, meet the impedance consistency requirements of high-frequency signal transmission (such as G communication board impedance fluctuation reduction of 20%), and enhance the solderability of the solder pad. The core of the horizontal pulse electroplating equipment is a copper plating cylinder, which mainly consists of a pulse power supply, a clamp and a titanium basket. After the PCB board enters the copper cylinder, it is conveyed by the entrance roller and then transferred to the clamp plate to run in the copper. After the copper plating is completed, the PCB board is conveyed by the roller.
[0003] However, the existing horizontal pulse electroplating equipment clamp conductive device has the following defects: 1. During use, the copper cylinder has strong copper sulfate corrosion, which can cause corrosion of the surrounding metal copper and wires under certain temperature conditions. The copper wires on the clamp are prone to corrosion damage, which causes poor contact and poor conductivity due to corrosion of the clamp wires; 2. The existing horizontal pulse electroplating equipment clamp conductive device lacks a dust recovery device, and the copper cylinder guide rail dust is particularly serious, which seriously damages the copper rail and the clamp slider, seriously affects the service life of the clamp slider and the copper rail, and causes poor contact between the clamp slider and the guide rail. Because the clamp current is relatively large, it is easy to cause sparking and large current fluctuation. Therefore, in order to solve the above problems, an improved horizontal pulse electroplating equipment clamp conductive device is proposed. SUMMARY
[0004] The purpose of the present application is to provide an improved horizontal pulse electroplating equipment clamp conductive device. By installing a dust recovery mechanism at both ends of the copper cylinder guide rail, the dust inside the copper cylinder guide rail can be brought into the position of the dust recovery mechanism by the slider, and the dust can be collected and cleaned by the dust recovery mechanism, so that there is no obvious dust in the copper cylinder guide rail, the contact between the slider and the copper cylinder guide rail is good, the stability of the clamp main current is guaranteed, and the service life of the slider and the copper cylinder guide rail is prolonged, achieving the good effect of improving the horizontal pulse electroplating equipment clamp conductive device, and solving the problems in the above background technology.
[0005] To achieve the above purpose, the application adopts the following technical scheme: The utility model provides an improved horizontal pulse electroplating equipment clamp conductive device, including carousel, a plurality of clamp body and dust recovery mechanism, A plurality of said clamp body is installed in the four around carousel, each said clamp body is installed with sliding block, one side of carousel is provided with copper cylinder guide rail used with sliding block, Said dust recovery mechanism is located in the input end and output end of copper cylinder guide rail.
[0006] Preferably, one side of the carousel is provided with a limiting groove at both ends, and the dust recovery mechanism is installed in the limiting groove.
[0007] Preferably, the upper end of the clamp body is provided with a wire, the wire is made of copper wire, the surface of the wire is provided with a protective sleeve, and the protective sleeve is a corrosion-resistant heat-shrinkable sleeve.
[0008] Preferably, the dust recovery mechanism comprises a dust collecting box one and a dust collecting box two, the dust collecting box one is installed in the limiting groove at the input end of the copper cylinder guide rail, and the dust collecting box two is installed in the limiting groove at the output end of the copper cylinder guide rail.
[0009] Preferably, the dust collecting box one and the dust collecting box two are both L-shaped, one end of the dust collecting box one and the dust collecting box two is transversely clamped in the limiting groove, and the other end of the dust collecting box one and the dust collecting box two is clamped in the inner side of the carousel and extends to the inner side of the carousel.
[0010] Preferably, the end of the dust collecting box one clamped in the limiting groove is chamfered and provided with a collecting notch one, symmetrical positions in the collecting notch one are provided with a flow guide hole one, the other end of the dust collecting box one is fixedly connected with a vacuum pipeline one, and the lower end of the vacuum pipeline one is in communication with the flow guide hole one.
[0011] Preferably, the end of the dust collecting box two clamped in the limiting groove is provided with a collecting notch two, symmetrical positions in the collecting notch two are provided with a flow guide hole two, the other end of the dust collecting box two is fixedly connected with a vacuum pipeline two, and the lower end of the vacuum pipeline two is in communication with the flow guide hole two. Preferably, the lower end of the inner wall of the vacuum pipeline one and the vacuum pipeline two is fixedly connected with a limiting ring, and the limiting ring is located above the flow guide hole one and the flow guide hole two. Preferably, the outer edge of the upper port of the vacuum pipeline one and the vacuum pipeline two is arc-shaped, and the diameter of the vacuum pipeline one and the vacuum pipeline two is 50mm.
[0012] Compared with the prior art, the improved horizontal pulse electroplating equipment clamp conductive device has the following advantages: 1. This invention provides a protective sleeve for the wires used on the fixture body. By using corrosion-resistant heat-shrink tubing as the protective sleeve, the wires can be physically isolated and protected. The addition of the protective sleeve not only increases the service life of the wires but also improves the conductivity of the fixture body. 2. This invention, by installing dust collection mechanisms at both ends of the copper cylinder guide rail, can bring the dust inside the copper cylinder guide rail to the dust collection mechanism through the slider. The dust is then collected and cleaned by the dust collection mechanism, resulting in no obvious dust inside the copper cylinder guide rail. This ensures good contact between the slider and the copper cylinder guide rail, guarantees stable current in the fixture body, and extends the service life of the slider and the copper cylinder guide rail, thus achieving a good effect in improving the conductivity of the fixture in horizontal pulse electroplating equipment. Attached Figure Description
[0013] Figure 1 This is a flowchart of the present invention; Figure 2 This is a schematic diagram of the main structure of the turntable and clamp of the present invention; Figure 3 This is a schematic diagram of the dust collection box structure of the present invention; Figure 4 This is a schematic diagram of the dust collection box II structure of the present invention; Figure 5 This is a partial cross-sectional view of the conductor and protective sleeve structure of the present invention.
[0014] In the diagram: 1. Turntable; 2. Fixture body; 3. Dust collection mechanism; 31. Dust collection box one; 311. Collection slot one; 312. Guide hole one; 313. Vacuum pipe one; 32. Dust collection box two; 321. Collection slot two; 322. Guide hole two; 323. Vacuum pipe two; 4. Slider; 5. Copper cylinder guide rail; 6. Limiting groove; 7. Wire; 8. Protective sleeve; 9. Limiting ring. Detailed Implementation
[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0016] This invention provides, for example Figures 1-5 The invention shown is a device for improving the conductivity of clamps in a horizontal pulse electroplating equipment, comprising a turntable 1, multiple clamp bodies 2, and a dust collection mechanism 3; A plurality of clamp bodies 2 are installed around the rotating disc 1, and a sliding block 4 is installed on each clamp body 2. One side of the rotating disc 1 is provided with a copper cylinder guide rail 5 for cooperating with the sliding block 4. The dust recovery mechanism 3 is located at the input end and the output end of the copper cylinder guide rail 5.
[0017] Limiting grooves 6 are formed at both ends of one side of the rotating disc 1, and the dust recovery mechanism 3 is installed in the limiting grooves 6. Before installing the dust recovery mechanism 3, the limiting grooves 6 (pre-set installation grooves) at both ends of the side of the rotating disc 1 close to the copper cylinder guide rail 5 are positioned, and then the corresponding components (such as a dust collection box) of the dust recovery mechanism 3 are accurately clamped into the limiting grooves 6, and the dust recovery mechanism 3 is fixed by the structure of the limiting grooves 6. During equipment operation, the rotating disc 1 continuously rotates, the sliding block 4 slides along the guide rail, and the dust recovery mechanism 3 is always kept at the pre-set position of the input end and the output end of the copper cylinder guide rail 5 under the fixing action of the limiting grooves 6, and will not be displaced due to equipment vibration or component movement. During the operation of the horizontal pulse electroplating equipment, the conductive device is first integrated into the copper plating cylinder area of the equipment, and a plurality of clamp bodies 2 are uniformly installed around the rotating disc 1 for clamping the PCB to be electroplated. After starting the equipment, the rotating disc 1 drives the clamp bodies 2 around it to rotate synchronously, and the sliding block 4 on each clamp body 2 will stably slide along the pre-set copper cylinder guide rail 5 on one side of the rotating disc 1, and the PCB will enter the copper cylinder with the clamp body 2 to complete the copper plating process. At the same time, the dust recovery mechanism 3 at the input end (the end where the PCB enters the guide rail) and the output end (the end where the PCB leaves the guide rail) of the copper cylinder guide rail 5 is started synchronously, and the dust in the guide rail area is treated in real time. The core defect that the existing horizontal pulse electroplating equipment clamp conductive device lacks a dust recovery device is solved, and the dust recovery mechanism 3 is arranged at the key position of the guide rail to actively treat the dust generated by the copper cylinder guide rail 5 and avoid dust accumulation. The good contact between the sliding block 4 and the copper cylinder guide rail 5 is ensured, the problem of large spark current fluctuation caused by poor contact is prevented, the stable transmission of the clamp body 2 is ensured, and the uniformity of the PCB plating layer (such as meeting the impedance consistency requirement of high-frequency signal transmission) is improved. The service life of the sliding block 4 and the copper cylinder guide rail 5 is prolonged, and the frequency of replacing components due to dust abrasion is reduced.
[0018] A wire 7 is installed at the upper end of the clamp body 2, the wire 7 is made of copper wire, and a protective sleeve 8 is sleeved on the surface of the wire 7. The protective sleeve 8 is a corrosion-resistant heat-shrinkable sleeve. In the assembly of the clamp body 2, the copper wire made of the lead wire 7 is connected to the conductive interface at the upper end of the clamp body 2 for transmitting the pulse current required for electroplating; then the corrosion-resistant heat-shrinkable sleeve (protective sleeve 8) is sleeved on the surface of the lead wire 7, and the heat-shrinkable sleeve is tightly attached to the surface of the lead wire 7 by heating; when the equipment is running, the clamp body 2 with the lead wire 7 enters the copper cylinder, the copper sulfate solution (with strong corrosive property) in the copper cylinder directly contacts the protective sleeve 8 on the surface of the lead wire 7, the protective sleeve 8 isolates the copper wire lead wire 7 from the corrosive environment, solves the problem that the existing clamp copper lead wire 7 is easily corroded and damaged by copper sulfate, and the corrosion-resistant heat-shrinkable sleeve forms a physical isolation barrier to effectively resist the corrosion of copper sulfate and avoid the breakage and poor contact of the lead wire 7 due to corrosion.
[0019] The dust recovery mechanism 3 includes a dust collecting box one 31 and a dust collecting box two 32, the dust collecting box one 31 is installed in the limiting groove 6 at the input end of the copper cylinder guide rail 5, and the dust collecting box two 32 is installed in the limiting groove 6 at the output end of the copper cylinder guide rail 5; When the dust recovery mechanism 3 is installed, the dust collecting box one 31 is installed in the limiting groove 6 at the input end of the copper cylinder guide rail 5, and the dust collecting box two 32 is installed in the limiting groove 6 at the output end of the guide rail; when the equipment is running, when the slider 4 with the PCB board enters from the input end of the guide rail (before starting electroplating), the dust carried on the surface of the slider 4 or the dust accumulated at the input end of the copper cylinder guide rail 5 will fall into the dust collecting box one 31; when the slider 4 with the PCB board after electroplating exits from the output end of the copper cylinder guide rail 5, the dust generated by the friction of the slider 4 at the output end of the copper cylinder guide rail 5 or the residual dust on the surface will fall into the dust collecting box two 32, realizing the dust collection in the whole process of input-output; Avoiding the accumulation of dust at both ends of the guide rail to cause the jamming of the slider 4, ensuring the smoothness of the slider 4 sliding on the guide rail, and reducing the damage of the PCB board caused by the jamming of the slider 4; Further reducing the wear of the slider 4 and the guide rail caused by the dust, prolonging the service life of the slider 4 and the guide rail, and reducing the influence of the dust entering the copper cylinder on the purity of the plating solution, and improving the electroplating yield.
[0020] The dust collecting box one 31 and the dust collecting box two 32 are both L-shaped, one end of the dust collecting box one 31 and the dust collecting box two 32 is transversely clamped in the limiting groove 6, and the other end of the dust collecting box one 31 and the dust collecting box two 32 is clamped in the inner side of the turntable 1 and extends to the inner side of the turntable 1; When installing the dust collection box one 31 and the dust collection box two 32, the L-shaped structure is used: the horizontal end (long side) of the dust collection box one 31 and the dust collection box two 32 is accurately clamped into the limiting groove 6 of the turntable 1, and the horizontal end is fixed; the longitudinal end (short side) of the dust collection box one 31 and the dust collection box two 32 extends to the inside of the turntable 1, so that it is close to the contact area of the sliding block 4 and the guide rail; when the equipment is running, the dust generated by the sliding of the sliding block 4 will be shaken off by gravity or the sliding block 4 or the spring on the clamp body 2, and directly fall into the corner collection area of the L-shaped structure, and the extended longitudinal end can cover the area below the sliding path of the sliding block 4, so as to avoid the dust from falling.
[0021] The end of the dust collection box one 31 clamped in the limiting groove 6 is chamfered and provided with a collection slot one 311, and the collection slot one 311 is provided with a flow guide hole one 312 at a symmetrical position; the other end of the dust collection box one 31 is fixedly connected with a vacuum pipeline one 313, and the lower end of the vacuum pipeline one 313 is communicated with the flow guide hole one 312; When the sliding block 4 with the PCB board enters from the copper cylinder guide rail 5 input end, the dust on the surface slides into the collection slot one 311; the flow guide hole one 312 in the collection slot one 311 is communicated with the vacuum pipeline one 313 at the other end of the dust collection box, and after the external vacuum equipment is started, the flow guide hole one 312 generates negative pressure, the dust in the collection slot one 311 is sucked into the vacuum pipeline one 313, and finally collected by the vacuum equipment; The inclination angle of the chamfered surface (adapted to the sliding direction of the sliding block 4) can guide the sliding block 4 to naturally enter the copper cylinder guide rail 5.
[0022] The end of the dust collection box two 32 clamped in the limiting groove 6 is provided with a collection slot two 321, and the collection slot two 321 is provided with a flow guide hole two 322 at a symmetrical position; the other end of the dust collection box two 32 is fixedly connected with a vacuum pipeline two 323, and the lower end of the vacuum pipeline two 323 is communicated with the flow guide hole two 322; When the sliding block 4 exits from the copper cylinder guide rail 5 output end, the new dust generated by the friction of the sliding block 4 at the output end of the guide rail, and the dust formed by the dryness of the plating solution remaining on the surface of the sliding block 4, will directly fall into the collection slot two 321 of the dust collection box two 32; the flow guide hole two 322 in the collection slot two 321 is communicated with the vacuum pipeline two 323, and the external vacuum equipment generates negative pressure at the flow guide hole two 322 through the vacuum pipeline two 323, so that the dust in the slot is quickly sucked into the pipeline, and the complete recovery of the dust at the output end is completed; since the dust at the output end may be mixed with a small amount of plating solution residue, the pore diameter of the flow guide hole two 322 is designed to adapt to the mixture of dust and a small amount of liquid, so as to avoid blockage; The cooperation of the flow guide hole two 322 and the vacuum pipeline two 323 ensures that the dust at the output end does not accumulate, maintains the smoothness of the sliding of the sliding block 4 at the output end, avoids the accumulation of dust causing the sliding block 4 to be stuck, and guarantees the stability of the PCB board transmission.
[0023] The lower end of the inner wall of the vacuum pipeline one 313 and the vacuum pipeline two 323 is fixedly connected with a limiting ring 9, and the limiting ring 9 is located above the flow guide hole one 312 and the flow guide hole two 322; When the vacuum pipeline one 313 and the vacuum pipeline two 323 are connected with the external vacuum equipment, the pipeline on the external vacuum equipment is prevented from being excessively inserted into the vacuum pipeline one 313 and the vacuum pipeline two 323, so as to avoid blocking the flow guide hole one 312 and the flow guide hole two 322, and a limiting effect is provided.
[0024] The outer edge of the upper port of the vacuum pipeline one 313 and the vacuum pipeline two 323 is arc-shaped, and the diameter of the vacuum pipeline one 313 and the vacuum pipeline two 323 is 50mm; When the vacuum pipeline one 313 and the vacuum pipeline two 323 are connected with the external vacuum equipment, the arc-shaped outer edge of the upper port of the pipeline can prevent the operator from being cut by a sharp edge during the installation process, and the arc-shaped structure has higher fitting degree with the interface of the vacuum equipment, so that the quick alignment and connection are facilitated, and the installation time is reduced; through flow calculation of the pipeline diameter of 50mm, it can be ensured that the dust (including a small amount of dust group mixed with plating solution) can smoothly pass through the pipeline, and the dust is not blocked due to too thin pipeline, and the dust suction effect is not affected due to too thick pipeline.
[0025] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. An improved horizontal pulse plating equipment clamp conductive device, characterized in that: it comprises a rotating disc (1), a plurality of clamp bodies (2) and a dust recovery mechanism (3); a plurality of said clamp bodies (2) are installed around the rotating disc (1), a sliding block (4) is installed on each of said clamp bodies (2), and one side of the rotating disc (1) is provided with a copper cylinder guide rail (5) matched with the sliding block (4); the dust recovery mechanism (3) is located at the input end and the output end of the copper cylinder guide rail (5).
2. One end of one side of the rotating disc (1) is provided with a limiting groove (6), and the dust recovery mechanism (3) is installed in the limiting groove (6).
3. The upper end of the clamp body (2) is provided with a wire (7) made of copper wire, and the surface of the wire (7) is sleeved with a protective sleeve (8) which is a corrosion-resistant heat-shrinkable sleeve.
4. The dust recovery mechanism (3) comprises a dust collecting box one (31) and a dust collecting box two (32), the dust collecting box one (31) is installed in the limiting groove (6) at the input end of the copper cylinder guide rail (5), and the dust collecting box two (32) is installed in the limiting groove (6) at the output end of the copper cylinder guide rail (5).
2. An improved horizontal plating apparatus clamp conductor as defined in claim 1, wherein:
5. The dust collecting box one (31) and the dust collecting box two (32) are both L-shaped, one end of the dust collecting box one (31) and the dust collecting box two (32) is transversely clamped in the limiting groove (6), and the other end of the dust collecting box one (31) and the dust collecting box two (32) is clamped in the inner side of the rotating disc (1) and extends to the inner side of the rotating disc (1).
3. An improved horizontal plating apparatus clamp conductor as defined in claim 2, wherein:
6. The end of the dust collecting box one (31) clamped in the limiting groove (6) is chamfered and provided with a collecting notch one (311), the collecting notch one (311) is provided with a flow guide hole one (312) at the symmetrical position, the other end of the dust collecting box one (31) is fixedly connected with a vacuum pipeline one (313), and the lower end of the vacuum pipeline one (313) is in communication with the flow guide hole one (312).
4. The improved horizontal plating apparatus clamp conductor of claim 3, wherein:
7. The end of the dust collecting box two (32) clamped in the limiting groove (6) is provided with a collecting notch two (321), the collecting notch two (321) is provided with a flow guide hole two (322) at the symmetrical position, the other end of the dust collecting box two (32) is fixedly connected with a vacuum pipeline two (323), and the lower end of the vacuum pipeline two (323) is in communication with the flow guide hole two (322).
5. An improved horizontal plating apparatus clamp conductor assembly as defined in claim 4 wherein:
8. The lower end of the inner wall of the vacuum pipeline one (313) and the vacuum pipeline two (323) is fixedly connected with a limiting ring (9), and the limiting ring (9) is located above the flow guide hole one (312) and the flow guide hole two (322).
6. An improved horizontal plating apparatus clamp conductor assembly as defined in claim 5 wherein:
9. The outer edge of the upper port of the vacuum pipeline one (313) and the vacuum pipeline two (323) is arc-shaped, and the diameter of the vacuum pipeline one (313) and the vacuum pipeline two (323) is 50mm.
7. An improved horizontal plating apparatus clamp conductor assembly as defined in claim 6 wherein: 8. An improved horizontal plating apparatus clamp conductor assembly as defined in claim 7 wherein: 9. An improved horizontal plating apparatus clamp conductor assembly as defined in claim 8 wherein: