Temperature and humidity control shunting device and gluing developing machine

Abstract

The invention discloses a temperature and humidity control shunting device and a gluing developing machine, and relates to the technical field of wafer processing. A main pipeline is connected with an air outlet of THC equipment, so that the temperature and humidity of gas supplied into a shunting box are the same, and the temperature and humidity of the gas are equal by means of shunting of four uniformly distributed shunting pipelines and conveying of pipelines with the same length and specification; homologous constant-temperature and constant-humidity gas is conveyed into the four cavities, synchronous control over the supply temperature and humidity of airflow in the four cavities is achieved, interference to the constant-temperature and constant-humidity gas in the conveying process can be reduced, and the precision control over the temperature and humidity in the wafer gluing operation process can be effectively improved; the stability of the working environment of the equipment is effectively ensured, and the device is suitable for precision equipment with higher environmental requirements.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a temperature and humidity control shunt device and a glue coating and developing machine. BACKGROUND

[0002] In the semiconductor manufacturing process, the glue coating and developing machine is a key equipment in the photoetching process matched with the photoetching machine. Its main function is to complete a series of important process such as photoresist coating, curing, developing and hardening of the wafer. Through the glue coating device in the glue coating and developing machine, the wafer is driven to rotate at high speed, and the photoresist is uniformly sprayed on the wafer surface. During the process of coating the wafer with photoresist, the change of temperature and humidity of the working environment plays a crucial role in the spraying and film forming of the photoresist.

[0003] The glue coating and developing machine in the prior art is connected with multiple air outlets of the THC (temperature and humidity control) device through independent pipelines respectively. Although this connection mode realizes the regulation of the temperature and humidity of each chamber to some extent, in the actual operation process, multiple air pipes share one control unit, and the control unit can only control the temperature and humidity of one heat preservation air pipe, and the controlled precision of the remaining heat preservation air pipes is greatly reduced. This leads to the fact that the constant temperature and humidity gas output from the multiple air outlets of the THC device is easy to be out of control during a long time operation, and due to the different distances between the multiple air outlets on the THC device and the corresponding glue coating device chambers, the differences in pipe length and pipe diameter, etc., it is impossible to ensure that the constant temperature and humidity gas output from the multiple heat preservation air pipes has the same air speed, thus leading to the fact that the difference of the gas entering different chambers is large, which easily causes the fluctuation difference of the temperature and humidity inside the chambers, and has an adverse effect on the precision of the whole wafer glue coating process.

[0004] Therefore, the present application provides a temperature and humidity control shunt device and a glue coating and developing machine to solve the problems in the prior art. SUMMARY

[0005] The present application aims to solve the problem in the prior art that the glue coating and developing machine for wafer processing uses the multiple air outlets of the THC device to be independently connected with different glue coating chambers to respectively transport constant temperature and humidity gas for temperature and humidity control of the environment, which easily causes the fluctuation difference of the temperature and humidity in different chambers, and affects the precision of the wafer glue coating process. The present application provides a temperature and humidity control shunt device and a glue coating and developing machine.

[0006] In order to solve the problems in the prior art, the present application adopts the following technical scheme: The application discloses a temperature and humidity control shunt device and a gluing and developing machine, which comprises a machine table, a gluing area and a developing area are arranged on the machine table respectively, four gluing devices are arranged in the gluing area, a plurality of developing devices are arranged in the developing area, a mechanical hand is arranged on the top of the machine table and located between the gluing devices and the developing devices, the gluing device comprises a cavity fixed on the top of the machine table, a rotating table is arranged in the cavity, a first servo motor is fixed in the machine table, a driving shaft of the first servo motor is in transmission connection with the rotating table, a plurality of first suction holes are arranged on the top of the rotating table and are uniformly distributed, a support is fixed on the top of the machine table and located outside the cavity, a first electric push rod is vertically arranged on the support, a nozzle is fixed on the extension end of the first electric push rod, a shunt device is arranged on the machine table and comprises a shunt box fixed on the top of the machine table, a main pipeline is arranged on one side of the shunt box, four shunt pipelines are arranged on the other side of the shunt box and are uniformly distributed, the four shunt pipelines are connected with the four gluing devices respectively, and the lengths of the connecting pipelines are equal.

[0007] Preferably, a connecting arm extending to the top of the cavity is fixed on the support, a cover plate matched with the cavity is arranged on the connecting arm, a through hole matched with the nozzle is arranged on the cover plate, the bottom of the support is rotationally connected to the top of the machine table, a second servo motor is fixed in the machine table, and a driving shaft of the second servo motor is fixedly connected with the support.

[0008] Preferably, a spraying pipe is fixed on the cover plate and is arranged in a surrounding mode, a plurality of spraying holes are arranged on the spraying pipe and are distributed in a surrounding mode, and the spraying holes are directed into the cavity, and the spraying pipes in the four gluing devices are communicated with the four shunt pipelines respectively.

[0009] Preferably, a guide column vertically arranged is slidingly inserted into the connecting arm, the bottom end of the guide column is fixedly connected with the cover plate, a first spring elastically supported between the top of the connecting arm and the top end of the guide column is movably sleeved outside the guide column, and a pressing block is fixed on the extension end of the first electric push rod.

[0010] Preferably, a second electric push rod vertically arranged is fixed in the machine table, the extension end of the second electric push rod is movably penetrated into the rotating table, a supporting table movably arranged on the inner side of the rotating table is arranged on the extension end of the second electric push rod, and a plurality of second suction holes are arranged on the top of the supporting table and are uniformly distributed.

[0011] Preferably, the extension end of the second electric push rod is arranged in a structure penetrating up and down, a first channel vertically arranged is arranged at the axial position of the second electric push rod, the second suction holes are communicated with the first channel, and a rotating joint communicated with the first channel is rotationally arranged on the bottom end of the extension end of the second electric push rod.

[0012] Preferably, the support table is provided with a valve chamber communicated below the second suction hole, a second channel communicated between the first channel and the inner wall of the valve chamber, a first hole communicated below the valve chamber is formed in the bottom of the support table, a vertically arranged insertion pipe is slidably inserted into the first hole, a valve plate matching the inner size of the valve chamber is fixed to the top end of the insertion pipe, a second hole communicated with the inner chamber of the valve chamber is formed in the inner wall of the insertion pipe, a second spring is arranged above the valve plate for elastically supporting the valve plate, a butt joint hole corresponding to the insertion pipe is formed in the rotary table and communicated with the first suction hole.

[0013] Preferably, the support table is rotatably arranged on the top of the second electric push rod, and the rotary table and the support table are provided with magnet stones magnetically attracted to each other.

[0014] Preferably, the humidity control shunt device is suitable for a glue coating and developing machine, the flow capacity of the main pipeline in the shunt device is set as the sum of the flow capacities of the four shunt pipelines, a cross plate is fixed in the shunt box, the shunt box is divided into four independent chambers of the same size by the cross plate, the four independent chambers are one-to-one corresponding to the four shunt pipelines, and a connecting bucket connected with the corresponding shunt pipeline is fixed in each independent chamber.

[0015] Preferably, the shunt device further comprises a pipeline assembly corresponding to the four shunt pipelines, the pipeline assembly comprises a storage box, and a shaft tube is fixed at the center position in the storage box, a sleeve pipe is rotatably arranged on the shaft tube and located in the storage box, a through hole communicated with the sleeve pipe is formed in the end wall of the shaft tube, one end of the shaft tube extends out of the storage box and is connected with the corresponding shunt pipeline through a first hose, a second hose is fixedly connected to the sleeve pipe and coiled in the storage box, and the outer end of the second hose extends out of the storage box, a spring structure is arranged in the end wall of the second hose as a support, a clock spring is arranged in the storage box and fixedly connected with the storage box at the outer end, and the inner end of the clock spring is fixedly connected with the sleeve pipe.

[0016] Compared with the prior art, the present application has the following advantages: 1. In the present application, the main pipeline is connected with one air outlet of the THC device, so that the temperature and humidity of the gas supplied into the shunt box are the same, the same length and specification pipeline is used for conveying, the same source constant temperature and humidity gas is conveyed into the four chambers, the temperature and humidity of the gas supplied into the four chambers are synchronously controlled, the interference on the constant temperature and humidity gas in the conveying process is reduced, the precision control of the temperature and humidity in the wafer gluing operation process is improved, the stability of the equipment working environment is effectively ensured, and the present application is suitable for precise equipment with higher environmental requirements. 2、In the application, by setting the support table inside the rotary table and mounting the support table on the telescopic end of the vertically arranged second electric push rod, the support table is controlled to rise and fall by the second electric push rod when the wafer enters and exits the cavity, and the wafer is gripped by the mechanical hand, so that the wafer taking and placing operation can be completed outside the cavity, avoiding the wafer taking and placing operation in the narrow cavity, which is beneficial to improve the convenience and safety of wafer taking and placing in the wafer coating process. At the same time, by opening the second suction hole on the support table and arranging the valve chamber between the second suction hole and the first suction hole, and cooperating with the elastic support of the second spring, the valve plate moves up and down in the valve chamber during the lifting process of the support table, so as to realize the automatic switching of the air flow suction of the first suction hole and the second suction hole by the external air pump. Through mutual cooperation, the stability of the wafer during the lifting and transfer by the support table can be effectively guaranteed. 3、In the application, the cross plate divides the shunt box into independent cavities corresponding to four shunt pipelines respectively, and the guide of the connecting bucket arranged in the funnel-shaped structure in each independent cavity can further guarantee the stability and uniformity of the constant temperature and humidity gas shunted to four shunt pipelines through a main pipeline, which is beneficial to guarantee the stability of the device in shunting and conveying the constant temperature and humidity gas of the same source. 4、In the application, by connecting a plurality of pipeline assemblies with the same size between the shunt pipeline and the corresponding spray pipe, the paths of the constant temperature and humidity gas delivered by each shunt pipeline into the corresponding cavity are consistent, which is beneficial to further guarantee the accuracy of the environment temperature and humidity control in each cavity. At the same time, by the elastic support of the clock spring, the second hose is wound in the storage box, which can effectively arrange the pipeline without changing the total length of the gas flow path, which is beneficial to avoid the pipeline being in disorder on the machine, and to guarantee the stability of the device during actual use to a certain extent. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings described herein are used to provide further understanding of the application, and constitute a part of the application. The schematic embodiments of the application and their descriptions are used to explain the application, and do not constitute an improper limitation on the application. In the drawings: Figure 1 It is a perspective view of the coating and developing machine of the application; Figure 2 It is a top view of the coating and developing machine of the application; Figure 3 It is a sectional view of A-A in the application; Figure 2 Figure 4 It is an enlarged view of C in the application; Figure 3 Figure 5 It is an enlarged view of D in the application; Figure 4 Figure 6 It is an enlarged view of D in the application;​​​Figure 2 Cross-sectional view at B-B; Figure 7 Perspective view of the shunt box of the present application; Figure 8 Exploded view of the shunt box and the cross plate of the present application; Figure 9 Perspective view of the shunt device of the present application; Figure 10 Exploded view of the pipe assembly of the present application; Figure 11 Top view of the shunt device of the present application; Figure 12 Cross-sectional view at A-A of the present application Figure 11 Cross-sectional view at E-E of the present application Figure 13 Cross-sectional view at D-D of the present application Figure 11 Cross-sectional view at F-F of the present application Figure 14 Cross-sectional view at C-C of the present application Figure 11 Cross-sectional view at G-G of the present application

[0018] Reference numerals in the drawings: 1. machine; 101. gluing area; 102. developing area; 103. robot; 2. cavity; 201. turntable; 202. first servo motor; 203. first suction hole; 204. support; 205. first electric push rod; 206. spray head; 3. connecting arm; 301. cover plate; 302. second servo motor; 303. spray pipe; 304. guide column; 305. first spring; 306. pressing block; 4. second electric push rod; 401. support table; 402. second suction hole; 403. first channel; 404. adapter; 5. valve chamber; 501. second channel; 502. first hole; 503. insertion pipe; 504. valve plate; 505. second hole; 506. second spring; 507. abutting hole; 6. shunt box; 601. main pipe; 602. shunt pipe; 7. cross plate; 701. connecting hopper; 8. storage box; 801. shaft tube; 802. sleeve; 803. first hose; 804. second hose; 805. spring. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.

[0020] Embodiment 1: the embodiment provides a gumming developing machine, referring to Figure 1 Figure 6 Specifically, the machine table 1 is provided with a gumming area 101 and a developing area 102, four gumming devices are installed in the gumming area 101, and a plurality of developing devices are installed in the developing area 102. A mechanical hand 103 is installed on the top of the machine table 1 between the gumming devices and the developing devices. The gumming device includes a cavity 2 fixed on the top of the machine table 1, and a turntable 201 rotating in the cavity 2. A first servo motor 202 is fixed in the machine table 1, and the driving shaft of the first servo motor 202 is in transmission connection with the turntable 201. A plurality of first suction holes 203 are evenly distributed on the top of the turntable 201. A support 204 is fixed on the top of the machine table 1 outside the cavity 2, and a first electric push rod 205 is vertically arranged on the support 204. A nozzle 206 is fixed on the extension end of the first electric push rod 205. A shunt device is installed on the machine table 1, and the shunt device includes a shunt box 6 fixed on the top of the machine table 1. A main pipeline 601 is formed on one side of the shunt box 6, and four shunt pipelines 602 are evenly distributed on the other side of the shunt box 6. The four shunt pipelines 602 are respectively connected with the four gumming devices, and the lengths of the connecting pipelines are equal.

[0021] When the device is used, the staff uses the device to perform gumming and developing operation on the wafer. The nozzles 206 in the four gumming devices are connected in turn, and the wafer is placed in the four gumming devices in the gumming area 101 by the mechanical hand 103. A plurality of nozzles 206 are arranged in each gumming device. One of the nozzles 206 is connected with a solvent supply device for spraying solvent on the surface of the wafer, another nozzle 206 is connected with a photoresist supply device for spraying photoresist on the surface of the wafer, and the other two nozzles 206 are connected with cleaning water and are directed to the edge position of the wafer for cleaning the wafer after film forming. The two nozzles 206 for cleaning the edge position of the wafer are respectively mounted on the extension end of the first electric push rod 205 and in the cavity 2, and are respectively directed to the upper and lower edge positions of the wafer. The cavities 2 corresponding to the four gumming devices are supplied with airflow by the shunt device. The airflow sources are consistent, and the airflow is evenly distributed by the communication of the shunt box 6, the main pipeline 601 and the four shunt pipelines 602. The lengths of the connecting pipelines are equal, so that the airflow temperature and humidity in the four cavities 2 are consistent.

[0022] ​In actual operation, the wafer is grabbed by the mechanical hand 103, and the wafer is controlled to move in and out of the four glue coating devices and the plurality of developing devices to perform glue coating and developing operation of the wafer. When the wafer is placed inside the cavity 2 in the glue coating device, it will be placed on the top of the turntable 201. At this time, the air pump outside the first suction hole 203 is started, and the airflow is sucked through the first suction hole 203, so that the wafer is firmly connected to the top of the turntable 201. Then, the first servo motor 202 is powered on to drive the turntable 201 to rotate the wafer in the cavity 2. During the rotation, the solvent and photoresist are coated on the wafer through the nozzle 206, and the glue on the edge position of the wafer is removed. In the first step, the wafer is rotated at low speed by the turntable 201, and high exhaust operation is performed in the cavity 2. During the rotation, the surface of the wafer is sprayed with solvent through the nozzle 206. In the second step, the wafer is rotated at high speed by the turntable 201, and high exhaust operation is maintained in the cavity 2. During the rotation, the surface of the wafer is sprayed with photoresist through the nozzle 206. In the third step, the wafer is rotated at high speed by the turntable 201, and low exhaust operation is performed in the cavity 2. During the rotation, the photoresist is uniformly coated on the surface of the wafer to form a film. In the fourth step, the wafer is rotated at high speed by the turntable 201. During the rotation, the upper and lower surfaces of the wafer are sprayed with cleaning water through the nozzle 206 to wash the edges of the wafer.

[0023] The wafer that has completed the glue coating operation needs to be baked and then grabbed into the developing device to perform developing operation. The structure of the developing device is similar to that of the glue coating device. When the wafer is placed on the turntable 201 in the developing device, it is driven to rotate. The nozzle 206 in the developing device sprays developing liquid on the surface of the wafer to start developing operation. After the specified developing time ends, the wafer is washed with ionized water, and finally the wafer is spun dry by high-speed rotation of the turntable 201 in the developing device.

[0024] In the glue coating link of the photoetching process, the requirements for environmental temperature and humidity are very strict. Generally, the best glue coating conditions are temperature 20-25℃, temperature stability ±1℃, relative air humidity 30%-50%RH, and humidity stability ±0.5%RH. The relative temperature and humidity have a great influence on the stability of the photoresist. In the glue coating link, when the environmental temperature changes and other conditions remain unchanged, the evaporation of the solvent will accelerate with the increase of temperature, which will increase the viscosity of the photoresist. Similarly, the change of the temperature of the photoresist will also cause the change of the evaporation rate of the solvent, thereby affecting the viscosity and flowability of the photoresist. The poor flowability of the photoresist will cause the poor uniformity of the film thickness. When the temperature is too high, the photoresist will dry quickly, which will reduce its adhesion and quality, thereby affecting the progress of pattern transfer. When the temperature is too low, the performance of the electronic elements and sensors of the photoetching machine may be affected and reduced.

[0025] And, in the case of a single factor change in environmental humidity, the evaporation of the solvent accelerates as the humidity decreases, and the effect of humidity on uniformity is not as obvious as that of temperature. Generally, humidity mainly affects the average film thickness. If the humidity is too low, the photoresist will become too dry, which can easily cause problems such as bubbles, cracks, and particles, affecting the quality of the lithography result. If the humidity is too high, the photoresist coating will become thick, and a 1% decrease in humidity will cause a 9% increase in film thickness, resulting in a decrease in pattern resolution and a breakdown of the architecture.

[0026] In addition, changes in relative humidity can affect the precise size control of subsequent production. The higher the temperature and humidity accuracy, the smaller the change in environmental temperature and humidity, the more stable the system, the higher the yield of the coating process, and it is also beneficial to the precise size control of subsequent production. Therefore, it is necessary to perform wafer photoresist coating operations in a relatively stable environment.

[0027] In the process of coating and developing the photoresist, the conventional wafer coating and developing device uses a super-precision temperature and humidity control device (THC) dedicated to semiconductor lithography process when supplying air flow to each coating device. The constant temperature and humidity gas in the THC device is transported to the four cavities 2 of the coating and developing machine for coating through four heat preservation air pipes. The four air pipes of the THC device share one control unit, and the control unit can only control the temperature and humidity of one heat preservation air pipe, and the remaining three heat preservation air pipes are not controlled. Therefore, the constant temperature and humidity gas output from the air outlet of the THC device is in an uncontrolled state. Moreover, due to the different distances from the four different air outlets of the THC device to the air inlets of the four cavities 2 of the coating and developing machine, it is impossible to ensure that the constant temperature and humidity gas entering the four heat preservation air pipes has the same air speed. Therefore, the gas difference in the four cavities increases, causing the temperature and humidity fluctuation difference in the cavities to increase, which has a negative impact on the coating of the wafer.

[0028] When using the coating and developing machine in the present application to perform the coating operation, the four air outlets of the THC device in the prior art are adjusted to one, which is then connected to the main pipeline 601, so that the temperature and humidity of the gas supplied into the distribution box 6 are the same. Then the gas flows out through the four evenly distributed distribution pipelines 602 and is transported to the four cavities 2 through pipelines of the same length, realizing the synchronous control of the temperature and humidity of the air flow supplied to the four cavities 2. Compared with the prior art, the device can effectively improve the precision control of the temperature and humidity in the wafer coating operation process, and can increase the temperature precision from 0.2℃ before use to 0.05℃, and increase the humidity precision from 0.5%RH to 0.3%RH. It is a leap in the precision control of temperature and humidity, which more effectively ensures the stability of the working environment of the device and is suitable for more precise devices with higher environmental requirements.

[0029] In the specific implementation process, for example, Figure 3 -Figure 4 And Figure 6 As shown in the figure, the bracket 204 is fixed with a connecting arm 3 extending to the top of the cavity 2, and the connecting arm 3 is installed with a cover plate 301 matched with the cavity 2, the cover plate 301 is provided with a through hole matched with the nozzle 206, the bottom of the bracket 204 is rotatably connected to the top of the machine table 1, the machine table 1 is fixed with a second servo motor 302, and the driving shaft of the second servo motor 302 is fixedly connected with the bracket 204, the cover plate 301 is fixedly provided with a surrounding spray pipe 303, and the spray pipe 303 is provided with a plurality of spray holes distributed around, and the spray holes point to the cavity 2, and the spray pipes 303 in the four glue coating devices are respectively communicated with the four shunt pipes 602. When the device is used, the cover plate 301 is used to cover the top of the cavity 2 to block the top of the cavity 2, so that the cavity 2 is in a relatively closed environment. The rotation of the driving shaft of the second servo motor 302 can control the bracket 204 to rotate 90° forward and backward, so as to realize the operation of moving the nozzle 206 and the cover plate 301 away from the top of the cavity 2 or moving the nozzle 206 and the cover plate 301 to the top of the cavity 2. The operation is convenient, and the top of the cavity 2 can be adjusted to be unobstructed, which is beneficial to ensure the convenience and efficiency of the wafer entering and leaving the cavity 2.

[0030] When the shunt device is used to supply air flow to the four cavities 2, the constant temperature and humidity gas is communicated with the main pipe 601 through the air outlet of the THC equipment, enters the shunt box 6, and then is evenly shunted to the four spray pipes 303 through the connection of the four shunt pipes 602. The gas is uniformly and stably sent into the cavity 2 through the spray holes arranged below the circumferentially arranged spray pipes 303. The bottom of the cavity 2 is connected with an exhaust pipe, and the air is supplied from top to bottom, which can effectively ensure the constant temperature and humidity working environment in the cavity 2.

[0031] In the specific implementation process, as Figure 4As shown, the connecting arm 3 is slidably inserted with a vertically arranged guide column 304, and the bottom end of the guide column 304 is fixedly connected with the cover plate 301, and the outer side of the guide column 304 is movably sleeved with a first spring 305 elastically supported between the top of the connecting arm 3 and the top end of the guide column 304, and the telescopic end of the first electric push rod 205 is fixedly connected with a pressing block 306, and when the device is used, the elastic connection of the first spring 305 makes the cover plate 301 in the initial state above the upper opening of the cavity 2, and there is a height difference of 1cm between the bottom of the cover plate 301 and the upper opening of the cavity 2, when the second servo motor 302 controls the bracket 204 to rotate and moves the cover plate 301 to the top of the cavity 2, if it is necessary to close the cavity 2 for gluing work, the telescopic end of the first electric push rod 205 drives the nozzle 206 and the pressing block 306 to move downward synchronously, the pressing block 306 moves downward and presses on the top of the cover plate 301, drives the cover plate 301 to move downward and tightly press on the port of the cavity 2, and the nozzle 206 moves downward and enters the cavity 2 through the through hole formed on the cover plate 301, the pressing block 306 provides extrusion force for the cover plate 301 from top to bottom, which can effectively guarantee the airtightness of the cover plate 301 closing the upper opening of the cavity 2.

[0032] In the specific implementation process, as shown in Figure 3 and Figure 4 , a second electric push rod 4 is fixedly arranged in the machine table 1 and the telescopic end of the second electric push rod 4 movably penetrates into the rotary table 201, a supporting table 401 movably arranged on the inner side of the rotary table 201 is installed on the telescopic end of the second electric push rod 4, a plurality of second suction holes 402 evenly distributed are formed on the top of the supporting table 401, the telescopic end of the second electric push rod 4 is arranged in an up-down penetrating structure, a first channel 403 vertically arranged is formed in the shaft center position of the second electric push rod 4, the second suction holes 402 and the first channel 403 are communicated, and a connector 404 communicated with the first channel 403 is rotatably installed on the bottom end of the telescopic end of the second electric push rod 4.

[0033] When the device is in use, in the process of the wafer entering and exiting the cavity 2, the second electric push rod 4 is started, and the upper and lower lifting of the supporting table 401 can be controlled by the up and down lifting of the telescopic end of the second electric push rod 4. In the process of placing the wafer into the cavity 2, the second electric push rod 4 drives the supporting table 401 to project outwards from the opening above the cavity 2. In this state, the device can place the wafer on the supporting table 401 by the mechanical hand 103. The second suction hole 402 is externally connected to the air pump, and the air flow suction is performed through the second suction hole 402. When the wafer is placed on the supporting table 401, the wafer can be stably connected to the supporting table 401 by the negative pressure adsorption formed by the air flow suction. Then, the second electric push rod 4 drives the supporting table 401 to carry the wafer to move downwards, and drives the wafer to enter the cavity 2. The supporting table 401 enters the turntable 201, and the wafer is arranged on the turntable 201. The wafer is stably lifted on the turntable 201 by the air flow suction at the first suction hole 203. When the wafer needs to be taken out from the cavity 2, the wafer can be lifted to the opening of the cavity 2 only by controlling the lifting of the supporting table 401 by the second electric push rod 4. The wafer can be taken and placed outside the cavity 2 by controlling the lifting of the supporting table 401 by the second electric push rod 4 and the grasping of the wafer by the mechanical hand 103. Compared with the wafer taking and placing operation in the narrow cavity 2 by the mechanical hand 103 in the prior art, the structure is convenient and efficient, and the wafer is not easy to be damaged, which is conducive to the widespread use.

[0034] In the specific implementation process, for example, Figure 4 and Figure 5As shown, the support table 401 is provided with a valve chamber 5 communicated below the second suction hole 402, and a second channel 501 communicated between the first channel 403 and the inner wall of the valve chamber 5, and the bottom of the support table 401 is provided with a first hole 502 communicated below the valve chamber 5, and a vertically arranged insertion pipe 503 is slidingly inserted into the first hole 502, the top end of the insertion pipe 503 is fixed with a valve plate 504 matched with the internal size of the valve chamber 5, the inner wall of the insertion pipe 503 is provided with a second hole 505 communicated with the inside of the valve chamber 5, a second spring 506 is installed above the valve plate 504 for elastically supporting the valve plate 504, the rotary table 201 is provided with a corresponding butt joint hole 507, and the butt joint hole 507 is communicated with the first suction hole 203, the support table 401 is rotatably installed on the top of the extension end of the second electric push rod 4, and the rotary table 201 and the support table 401 are installed with magnetic stones magnetically attracted to each other, when the device is used, during the process of using the support table 401 to lift and assist the wafer to be placed into or taken out, if the support table 401 is controlled by the second electric push rod 4 to be lifted upward, the bottom of the support table 401 is separated from the inside of the rotary table 201, the bottom end of the insertion pipe 503 loses the extrusion of the rotary table 201, and under the elastic support of the second spring 506, the insertion pipe 503 drives the valve plate 504 to move downward to below the connection position of the second channel 501 and the valve chamber 5, in this state, the first channel 403, the second channel 501, the valve chamber 5 and the second suction hole 402 are in a communicated state, the airflow suction implemented by the air pump will act on the second suction hole 402 through the communication of the adapter 404 and the first channel 403, which facilitates the reinforcement connection when the wafer is placed on the top of the support table 401, if the support table 401 is moved downward to be retracted into the rotary table 201, the bottom of the support table 401 is attached to the inside of the rotary table 201, the bottom of the insertion pipe 503 is supported by the inside of the rotary table 201, which moves upward to overcome the elastic support of the second spring 506, the insertion pipe 503 drives the valve plate 504 to move upward to above the connection position of the second channel 501 and the valve chamber 5, in this state, the first channel 403, the second channel 501, the valve chamber 5, the second hole 505, the insertion pipe 503, the butt joint hole 507 and the first suction hole 203 are in a communicated state, the airflow suction implemented by the air pump will act on the first suction hole 203, which facilitates the reinforcement connection when the wafer is placed on the top of the rotary table 201, and at this time, the second suction hole 402 is blocked by the valve plate 504 and there is no airflow suction, which makes the device in use, through the lifting of the support table 401, the control of the airflow suction at the first suction hole 203 and the second suction hole 402 can be realized, so that when the support table 401 is lifted, the airflow suction at the first suction hole 203 is automatically interrupted, the airflow suction at the second suction hole 402 is automatically started, after the support table 401 is lowered in place, the suction at the first suction hole 203 is automatically started, and the airflow suction at the second suction hole 402 is automatically interrupted, which can effectively guarantee the stability and convenience of the wafer transferred by the support table 401.

[0035] By installing magnets with magnetic attraction in the turntable 201 and the supporting table 401, and rotatingly connecting the supporting table 401 at the top of the second electric push rod 4, the turntable 201 will not interfere with the docking of the insertion tube 503 and the docking hole 507 when rotating the wafer, which is beneficial to ensure the stability of the device during operation.

[0036] Embodiment 2: Based on embodiment 1, this embodiment further comprises: a temperature and humidity control shunt device, see Figure 1 Figure 14 Specifically, the shunt device is suitable for the glue coating and developing machine in embodiment 1, the flow capacity of the main pipeline 601 in the shunt device is set as the sum of the flow capacities of the four shunt pipelines 602, the shunt box 6 is fixed with a cross plate 7, the shunt box 6 is divided into four independent cavities of equal size by the cross plate 7, the four independent cavities are one-to-one corresponding to the four shunt pipelines 602, and each independent cavity is fixed with a connecting bucket 701 connected with the corresponding shunt pipeline 602, the connecting bucket 701 is provided in a funnel structure, when the device is used, the shunt box 6 is divided into independent cavities corresponding to the four shunt pipelines 602 by the cross plate 7, and the stability and uniformity of the constant temperature and humidity gas shunted into the four shunt pipelines 602 through the funnel structure of the connecting bucket 701 in each independent cavity can be further ensured, which is beneficial to ensure the stability of the constant temperature and humidity gas shunted and delivered by the device.

[0037] In the specific implementation process, as shown in Figure 10 and Figure 14 , the shunt device further comprises a pipeline assembly corresponding to the four shunt pipelines 602, the pipeline assembly comprises a storage box 8, and a shaft tube 801 is fixed at the center position in the storage box 8, a sleeve tube 802 located in the storage box 8 is rotatably sleeved on the shaft tube 801, a through hole is formed in the end wall of the shaft tube 801 and communicates with the sleeve tube 802, one end of the shaft tube 801 extends out of the storage box 8 and is connected with the corresponding shunt pipeline 602 through a first hose 803, the sleeve tube 802 is fixedly connected with a second hose 804 coiled in the storage box 8, and the outer end of the second hose 804 extends out of the storage box 8, a spring structure is arranged in the end wall of the second hose 804 as a support, a clock spring 805 is arranged in the storage box 8, and the outer end of the clock spring 805 is fixedly connected with the storage box 8, and the inner end of the clock spring 805 is fixedly connected with the sleeve tube 802.

[0038] ​When the device is used, the constant-temperature and constant-humidity gas is discharged through the outlet of the THC equipment, is transported through the shunt device, and is evenly and stably introduced into the cavity 2 in each gluing device. In order to ensure that the flow rates and heat losses in the gas transportation processes of each path are the same, the lengths of the pipeline assemblies connected between each shunt pipeline 602 and the gluing device are set to be the same. The gas enters the first hose 803 through the shunt pipeline 602, then enters the shaft tube 801, enters the sleeve tube 802 through the through hole, and finally flows to the gluing device through the second hose 804. The lengths and sizes of the first hose 803, the shaft tube 801, the sleeve tube 802 and the spring 805 in each pipeline assembly are consistent. This makes it possible that, when each pipeline assembly is used for gas transportation, interference caused by different gas transportation paths does not occur. In the actual use process, the spring 805 is in a winding state. The second hose 804 is wound in the storage box 8 through the elastic winding of the spring 805. When different pipeline assemblies are connected to different gluing devices, the worker only needs to pull out the second hose 804 with an appropriate length for connection operation according to the position of the gluing device. In the case that the total length of the gas flow path is not changed, the pipeline is effectively arranged, the pipeline is prevented from being in disorder on the machine table 1, and the stability of the device in actual use is beneficially ensured. The spring structure arranged in the end wall of the second hose 804 can support the end wall, prevent the second hose 804 from being crushed and collapsed when it is wound in the storage box 8, and beneficially ensure the stability of the pipeline assembly in transporting constant-temperature and constant-humidity gas.

[0039] Specifically, the working principle and operation method of the present application are as follows: In the glue coating operation, the device controls the support 204 to swing counterclockwise 90° by the second servo motor 302, and the spray head 206 and the cover plate 301 are moved away from the top of the cavity 2, and then the second electric push rod 4 controls the support platform 401 to rise upward, the wafer is grabbed to the top of the support platform 401 by the mechanical hand 103, and the wafer is connected stably to the top of the support platform 401 by the air suction of the second suction hole 402, the second electric push rod 4 controls the support platform 401 to drive the wafer to enter the cavity 2 downward, and finally the wafer is parked on the turntable 201, and the wafer is connected stably to the turntable 201 by the air suction of the first suction hole 203, the second servo motor 302 controls the support 204 to rotate reversely 90°, and the spray head 206 and the cover plate 301 are reset above the cavity 2, and then the first electric push rod 205 controls the spray head 206 and the pressing block 306 to move downward, and the cover plate 301 is pressed tightly on the cavity 2, and the spray head 206 enters the cavity 2, at this time, the constant temperature and humidity gas provided by the THC device is delivered to the cavities 2 in the plurality of glue coating devices through the shunt device, and the environment in the plurality of cavities 2 is ensured to be constant, and then the first servo motor 202 starts to drive the turntable 201 to rotate with the wafer, and the operation of coating and film forming on the wafer surface is realized by the solvent, the photoresist and the cleaning water sprayed in the different spray heads 206 in turn, after the glue coating is completed, the second electric push rod 4 controls the support platform 401 to drive the wafer to rise to the outside of the cavity 2 in the state that the cover plate 301 is opened, the wafer is grabbed to the developing device by the mechanical hand 103 for developing operation, and finally the glue coating and developing processing of the wafer is realized.

[0040] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A gumming and developing machine comprising a machine table (1), characterized in that: The machine table (1) is provided with a glue applying area (101) and a developing area (102), the glue applying area (101) is provided with four glue applying devices, the developing area (102) is provided with a plurality of developing devices, the top of the machine table (1) is provided with a mechanical hand (103) between the glue applying devices and the developing devices, the glue applying device comprises a cavity (2), the cavity (2) is provided with a rotating table (201), the machine table (1) is provided with a first servo motor (202), the driving shaft of the first servo motor (202) is connected with the rotating table (201), the top of the rotating table (201) is provided with a plurality of first suction holes (203), the top of the machine table (1) is provided with a support (204) outside the cavity (2), the support (204) is provided with a first electric push rod (205) vertically, the first electric push rod (205) is provided with a nozzle (206), the machine table (1) is provided with a shunt device, the shunt device comprises a shunt box (6), the shunt box (6) is provided with a main pipeline (601), the shunt box (6) is provided with four shunt pipelines (602) uniformly, the four shunt pipelines (602) are connected with the four glue applying devices, and the lengths of the connecting pipelines are equal.

2. The gluing and developing machine according to claim 1, characterized in that: The support (204) is provided with a connecting arm (3) extending to the top of the cavity (2), the connecting arm (3) is provided with a cover plate (301) matched with the cavity (2), the cover plate (301) is provided with a through hole matched with the nozzle (206), the bottom of the support (204) is connected with the top of the machine table (1), the machine table (1) is provided with a second servo motor (302), and the driving shaft of the second servo motor (302) is connected with the support (204).

3. The glue applicator and developer according to claim 2, wherein: The cover plate (301) is provided with a nozzle (303) arranged around, the nozzle (303) is provided with a plurality of nozzles (303) arranged around, and the nozzles (303) are arranged in the cavity (2), the nozzles (303) in the four glue applying devices are communicated with the four shunt pipelines (602).

4. The glue applicator and developer according to claim 2, wherein: The connecting arm (3) is provided with a guide column (304) arranged vertically, the bottom of the guide column (304) is connected with the cover plate (301), the outer side of the guide column (304) is provided with a first spring (305) elastically supported between the top of the connecting arm (3) and the top of the guide column (304), and the telescopic end of the first electric push rod (205) is provided with a pressing block (306).

5. The glue applicator and developer machine of claim 1, wherein: The machine table (1) is provided with a second electric push rod (4) arranged vertically, the telescopic end of the second electric push rod (4) is connected with the rotating table (201), the telescopic end of the second electric push rod (4) is provided with a supporting table (401) arranged movably in the rotating table (201), and the top of the supporting table (401) is provided with a plurality of second suction holes (402) arranged uniformly.

6. The glue applicator and developer according to claim 5, wherein: The telescopic end of the second electric push rod (4) is provided with a through structure from top to bottom, and a first channel (403) vertically arranged is formed in the inner shaft position of the second electric push rod (4), the second suction hole (402) is communicated with the first channel (403), and a connector (404) communicated with the first channel (403) is rotatably arranged at the bottom end of the telescopic end of the second electric push rod (4).

7. The glue applicator and developer according to claim 6, wherein: A valve chamber (5) communicated below the second suction hole (402) is formed in the support table (401), a second channel (501) communicated between the inner wall of the valve chamber (5) and the first channel (403) is formed in the support table (401), a first hole (502) communicated below the valve chamber (5) is formed in the bottom of the support table (401), a vertically arranged insertion pipe (503) is slidably inserted into the first hole (502), a valve plate (504) with a size matched with the valve chamber (5) is fixed to the top end of the insertion pipe (503), a second hole (505) communicated with the inside of the valve chamber (5) is formed in the inner wall of the insertion pipe (503), a second spring (506) for elastically supporting the valve plate (504) is arranged above the valve plate (504), and a butt joint hole (507) corresponding to the insertion pipe (503) is formed in the rotary table (201) and communicated with the first suction hole (203).

8. The glue applicator and developer according to claim 7, wherein: The support table (401) is rotatably arranged at the top of the telescopic end of the second electric push rod (4), and the rotary table (201) and the support table (401) are arranged with magnet stones magnetically attracted to each other.

9. A temperature and humidity control flow splitting device, said flow splitting device being suitable for use in a gluing and developing machine as claimed in any one of the claims 1-8, characterized in that: The flow capacity of the main pipeline (601) in the shunt device is set as the sum of the flow capacities of four shunt pipelines (602), a cross plate (7) is fixed in the shunt box (6), the shunt box (6) is divided into four independent cavities with the same size by the cross plate (7), the four independent cavities are one-to-one corresponding to the four shunt pipelines (602), an interface bucket (701) connected with the corresponding shunt pipeline (602) is fixed in each independent cavity, and the interface bucket (701) is provided in a funnel shape.

10. The temperature and humidity control flow splitting device of claim 9, wherein: The shunt device further comprises a pipeline assembly corresponding to the four shunt pipelines (602), the pipeline assembly comprises a storage box (8), and a shaft pipe (801) is fixed at the center position in the storage box (8), a sleeve pipe (802) located in the storage box (8) is rotatably arranged on the shaft pipe (801), a through hole communicated with the sleeve pipe (802) is formed in the end wall of the shaft pipe (801), one end of the shaft pipe (801) extends out of the storage box (8) and is connected with the corresponding shunt pipeline (602) through a first hose (803), the sleeve pipe (802) is fixedly connected with a second hose (804) coiled in the storage box (8), and the outer end of the second hose (804) extends out of the storage box (8), a clock spring (805) is arranged in the storage box (8), the outer end of the clock spring (805) is fixedly connected with the storage box (8), and the inner end of the clock spring (805) is fixedly connected with the sleeve pipe (802).

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