Preparation method of novel high-heat-dissipation chemical-resistant anti-static material

Abstract

The invention belongs to the technical field of high polymer materials, and discloses a high-heat-dissipation chemical-resistant anti-static new material which is prepared from the following components in percentage by mass: 40-65% of a basic resin component, 15-30% of functional filler and 1-5% of an auxiliary agent, and the high-heat-dissipation chemical-resistant anti-static new material is prepared from the following components in percentage by mass: 40-65% of a basic resin component, 15-30% of a functional filler and 1-5% of an auxiliary agent by virtue of precise parameter control of gradient pressure rise, multi-temperature-zone temperature control and The nano-scale carbon tubes, the graphene, the hexagonal boron nitride and other functional fillers are uniformly dispersed in a resin matrix to form a continuous heat conduction and dissipation network, a heat conduction and dissipation exchange channel similar to the chimney effect is constructed, an internal heat source flows to the outside in the form of air rheology to dissipate heat, the heat dissipation efficiency is greatly improved, and the corrosion resistance is excellent. The material replaces metal to become a good thermoplastic heat conduction and dissipation / static electricity / corrosion-resistant material, the problem of heat deposition on photoelectric energy, microelectronics, electric appliances, lighting, automobiles and industrial products at present is solved, and the material is full of the emerging field and wide application of diversified industrial system engineering.

Description

Technical Field

[0001] This invention belongs to the field of polymer materials technology, specifically a method for preparing a new material with high heat dissipation, chemical resistance, and antistatic properties. Background Technology

[0002] With the rapid development of optoelectronic energy, microelectronics, electrical appliances, lighting, automobiles, and industrial products, related equipment and components are constantly evolving towards miniaturization, high integration, and high power. The problem of heat accumulation during operation is becoming increasingly prominent. If heat cannot be dissipated effectively and in a timely manner, it will cause the operating temperature of the equipment to rise, which will not only reduce the operating efficiency of the components and shorten their service life, but may also lead to circuit failures, performance degradation, and even safety accidents. Therefore, extremely high requirements are placed on the heat dissipation performance of materials. Meanwhile, in fields such as microelectronics and electrical appliances, the accumulation and release of static electricity can cause irreversible damage to precision electronic components, such as chip breakdown and interference with signal transmission. Therefore, materials must have stable static dissipation capabilities. In application scenarios such as automobiles and industrial products, materials are often in contact with chemical media such as acid and alkali solutions and oil stains. Their chemical corrosion resistance directly determines the reliability and environmental adaptability of the products. Currently, commonly used heat dissipation materials in the industry mainly include metallic materials (such as aluminum, copper, and their alloys) and traditional polymer materials. Although metallic materials have high thermal conductivity, they suffer from drawbacks such as high density, high processing difficulty, susceptibility to corrosion, high cost, and lack of electrostatic dissipation, making it difficult to meet the application requirements of lightweight and multifunctional integration. Traditional polymer materials (such as pure PC and PET resins) have problems such as low heat dissipation coefficient (usually only 0.1-0.5 W / mK), poor electrostatic dissipation performance (surface resistance is mostly greater than 1×10¹² Ω), and insufficient chemical corrosion resistance, making it impossible to meet the comprehensive performance requirements of heat dissipation, antistatic properties, and chemical corrosion resistance. To improve the performance of traditional polymer materials, existing technologies often modify them by adding single-functional fillers (such as graphene or carbon nanotubes). However, adding a single filler cannot simultaneously achieve a synergistic effect of high heat dissipation, stable electrostatic dissipation, and excellent chemical corrosion resistance. For example, while adding carbon nanotubes can improve antistatic properties, the heat dissipation uniformity is poor and the improvement in chemical corrosion resistance is limited; while adding hexagonal boron nitride can improve heat dissipation, its electrostatic dissipation capacity is insufficient. In addition, in existing preparation processes, the functional fillers have poor compatibility with the resin matrix, which easily leads to agglomeration and unstable material properties. At the same time, the lack of precise control over key process steps such as doping chelation, blending, and compounding makes it difficult to construct efficient heat conduction and heat exchange channels, further limiting the improvement of the overall material performance. Summary of the Invention

[0003] The purpose of this invention is to provide a method for preparing a novel material with high heat dissipation, chemical resistance, and antistatic properties, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a novel high heat dissipation, chemical resistance, and antistatic material, wherein the novel high heat dissipation, chemical resistance, and antistatic material is composed of the following components by mass percentage: 40%-65% base resin component, 15%-30% functional filler, and 1%-5% additives; The base resin components include 30%-50% polycarbonate, 20%-30% polyethylene terephthalate, 10%-20% acrylonitrile-butadiene-styrene elastomer, and 5%-10% grafted maleic anhydride blend; The functional fillers include 3%-5% carbon nanotubes, 2%-4% graphene, 5%-8% hexagonal boron nitride, 2%-3% zirconium oxide, 1%-2% yttrium oxide, and 2%-3% fine alumina; The auxiliary agent is a silane coupling agent; The new material has a heat dissipation coefficient of 5-20 W / mK and an electrostatic dissipation index of ≥10. 4 ~1×10 11 It has a shielding coupling energy of <50nJ and excellent corrosion resistance.

[0005] A method for preparing a novel high-heat-dissipation, chemical-resistant, and antistatic material, comprising the following steps: S1. Raw material pretreatment: The functional filler is doped and chelated with a silane coupling agent to obtain the modified functional filler; S2. Blending and compounding: The base resin components are blended and compounded with modified functional fillers to obtain a composite preform; S3. Melt Plasticizing Extrusion: The composite preform is melt plasticized and extruded, cooled, and pelletized to obtain the target new material.

[0006] Preferably, in step S1, the specific conditions for the doping chelation treatment are as follows: the functional filler and the silane coupling agent are added to a high-speed mixer and stirred for 1-3 hours at a temperature of 80-120℃ and a speed of 500-1000r / min, and nitrogen gas is introduced for protection during the stirring process, with a nitrogen flow rate of 10-20L / min.

[0007] Preferably, in step S1, the silane coupling agent is at least one of KH-550, KH-560 or KH-570, and its addition amount is 1%-3% of the total mass of the functional filler.

[0008] Preferably, in step S2, the blending process uses a twin-screw mixer, with the temperature controlled at 180-220℃, the screw speed at 300-500 r / min, and the blending time at 20-40 min; and the twin-screw mixer barrel is divided into five temperature zones from the feed port to the die head, with temperatures of 180℃, 190℃, 200℃, 210℃, and 220℃ respectively.

[0009] Preferably, in step S2, the composite treatment is carried out using a composite molding machine, with the pressure controlled at 10-20 MPa and the temperature at 200-240℃, and the heat and pressure maintained for 1-2 hours; and the heat and pressure maintenance adopts a gradient pressure increase, first increasing the pressure to 10 MPa at 2 MPa / min and maintaining the temperature for 30 min, and then increasing the pressure to 20 MPa at 1 MPa / min and maintaining the temperature for 90 min.

[0010] Preferably, in step S3, the melt plasticizing extrusion adopts a single screw extruder, and the barrel is divided into six temperature zones from the feed port to the die head, with temperatures of 220℃, 230℃, 240℃, 250℃, 260℃ and 260℃ respectively, and the die head temperature is controlled at 250-260℃.

[0011] Preferably, in step S3, the screw speed of the single-screw extruder is controlled at 200-400 r / min to ensure that the composite preform is fully melted and plasticized.

[0012] Preferably, in step S3, water cooling is used, with a cooling water temperature of 20-30℃ and a cooling time of 5-10 minutes; the pellet size is controlled to be 2-4 mm to ensure particle uniformity.

[0013] Preferably, before the raw material pretreatment in step S1, the functional filler is first placed in a vacuum drying oven for drying at a temperature of 100-130℃, a vacuum degree of -0.08 to -0.1MPa, and a drying time of 2-4 hours to remove moisture from the functional filler and avoid generating bubbles during the doping and chelation process, which would affect the material properties.

[0014] The beneficial effects of this invention are as follows: 1. In this invention, by precisely controlling the ratio of basic resin components, functional fillers, and additives (such as the synergistic combination of PC, PET, and acrylonitrile-butadiene-styrene elastomer in the basic resin components, and the composite of multiple components such as nanoscale carbon nanotubes, graphene, and hexagonal boron nitride in the functional fillers), combined with the optimization of doping chelation, blending, compounding, and melt plasticizing extrusion processes, the prepared new material simultaneously possesses high heat dissipation, stable electrostatic dissipation, and excellent chemical corrosion resistance. The heat dissipation coefficient reaches 5-20 W / mK, far exceeding that of traditional polymer materials and comparable to some metal materials; the electrostatic dissipation index is stable at ≥10. 4With a strength of ~1×10¹¹Ω, it can effectively suppress the accumulation and release of static electricity; after soaking in 5% hydrochloric acid and 5% sodium hydroxide solutions for 72 hours, the mass loss rate is <0.5%, the mechanical property retention rate is ≥90%, and it has excellent chemical corrosion resistance. It solves the pain point of existing materials that are "outstanding in a single property but lacking in comprehensive performance", and can be widely adapted to diverse application scenarios such as optoelectronic energy, microelectronics, electrical appliances, lighting, automobiles and industrial products.

[0015] 2. In this invention, during the preparation process, the functional filler is doped and chelated using a silane coupling agent, effectively improving the compatibility between the functional filler and the resin matrix and preventing filler agglomeration. Simultaneously, through gradient pressure increase, multi-temperature zone temperature control, and precise parameter control during melt plasticizing extrusion in the blending and compounding process, functional fillers such as nanoscale carbon nanotubes, graphene, and hexagonal boron nitride are uniformly dispersed in the resin matrix, forming a continuous heat-conducting network and constructing a heat exchange channel similar to the "chimney effect." This channel utilizes the principles of air rheology to rapidly guide heat sources from inside the material to the outside, significantly improving heat dissipation efficiency and effectively solving the heat deposition problem in highly integrated equipment, ensuring the stable and efficient operation of the equipment.

[0016] 3. In this invention, clear and controllable parameter ranges are set for key process steps in the preparation process (such as vacuum drying of functional fillers, temperature and speed of doping and chelation, temperature distribution of blending, pressure and holding time of compounding, screw speed and die temperature of melt extrusion, etc.). These ranges include vacuum drying temperature of 100-130℃, vacuum degree of -0.08 to -0.1MPa, doping and chelation temperature of 80-120℃, and speed of 500-1000r / min. This not only facilitates industrial-scale production but also ensures the consistency and stability of the performance of each batch of products, avoiding product performance fluctuations caused by ambiguous process parameters. Attached Figure Description

[0017] Figure 1 This is a flowchart of the preparation process of the present invention. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] like Figure 1As shown, this embodiment of the invention provides a new material with high heat dissipation, chemical resistance, and antistatic properties. This new material, by mass percentage, consists of the following components: 40%-65% base resin, 15%-30% functional filler, and 1%-5% additives. The base resin components include 30%-50% PC (polycarbonate), 20%-30% PET (polyethylene terephthalate), 10%-20% acrylonitrile-butadiene-styrene elastomer, and 5%-10% grafted maleic anhydride blend (based on the total mass of the base resin components). The functional fillers include 3%-5% carbon nanotubes, 2%-4% graphene, 5%-8% hexagonal boron nitride, 2%-3% zirconium oxide, 1%-2% yttrium oxide, and 2%-3% fine alumina (based on the total mass of the new material); the additives are silane coupling agents. The new material has a heat dissipation coefficient of 5-20 W / mK and an electrostatic dissipation index of ≥10. 4 ~1×10 11 It has a shielding coupling energy of <50nJ and excellent corrosion resistance.

[0020] A method for preparing a novel high-heat-dissipation, chemical-resistant, and antistatic material, comprising the following steps: S1. Raw material pretreatment: The functional filler is doped and chelated with a silane coupling agent to obtain the modified functional filler; S2. Blending and compounding: The base resin components are blended and compounded with modified functional fillers to obtain a composite preform; S3. Melt Plasticizing Extrusion: The composite preform is melt plasticized and extruded, cooled, and pelletized to obtain the target new material.

[0021] In step S1, the specific conditions for the doping chelation treatment are as follows: the functional filler and silane coupling agent are added to a high-speed mixer and stirred for 1-3 hours at a temperature of 80-120℃ and a speed of 500-1000r / min, and nitrogen gas is introduced for protection during the stirring process, with a nitrogen flow rate of 10-20L / min.

[0022] In step S1, the silane coupling agent is at least one of KH-550, KH-560 or KH-570, and its addition amount is 1%-3% of the total mass of the functional filler.

[0023] In step S2, the blending process uses a twin-screw mixer, with the temperature controlled at 180-220℃, the screw speed at 300-500 r / min, and the blending time at 20-40 min. The twin-screw mixer barrel is divided into five temperature zones from the feed port to the head, with temperatures of 180℃, 190℃, 200℃, 210℃, and 220℃ respectively.

[0024] In step S2, the composite treatment is carried out using a composite molding machine, with the pressure controlled at 10-20 MPa and the temperature at 200-240℃, and the heat and pressure maintained for 1-2 hours; and the heat and pressure maintenance adopts a gradient pressure increase, first increasing the pressure at 2 MPa / min to 10 MPa and maintaining the temperature for 30 min, and then increasing the pressure at 1 MPa / min to 20 MPa and maintaining the temperature for 90 min.

[0025] In step S3, the melt plasticizing extrusion uses a single screw extruder. The barrel is divided into six temperature zones from the feed port to the die head, with temperatures of 220℃, 230℃, 240℃, 250℃, 260℃, and 260℃ respectively. The die head temperature is controlled at 250-260℃.

[0026] In step S3, the screw speed of the single-screw extruder is controlled at 200-400 r / min to ensure that the composite preform is fully melted and plasticized.

[0027] In step S3, water cooling is used, with a water temperature of 20-30℃ and a cooling time of 5-10 minutes; the particle size is controlled to be 2-4 mm to ensure particle uniformity.

[0028] In step S1, before the raw material pretreatment, the functional filler is first placed in a vacuum drying oven for drying. The drying temperature is 100-130℃, the vacuum degree is -0.08~-0.1MPa, and the drying time is 2-4h, in order to remove the moisture in the functional filler and avoid the generation of bubbles during the doping and chelation process, which would affect the material performance.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel material with high heat dissipation, chemical resistance, and antistatic properties, characterized in that: The high heat dissipation, chemical resistance, and antistatic new material is composed of the following components by mass percentage: 40%-65% base resin, 15%-30% functional filler, and 1%-5% additives; The base resin components include 30%-50% polycarbonate, 20%-30% polyethylene terephthalate, 10%-20% acrylonitrile-butadiene-styrene elastomer, and 5%-10% grafted maleic anhydride blend; The functional fillers include 3%-5% carbon nanotubes, 2%-4% graphene, 5%-8% hexagonal boron nitride, 2%-3% zirconium oxide, 1%-2% yttrium oxide, and 2%-3% fine alumina; The auxiliary agent is a silane coupling agent; The new material has a heat dissipation coefficient of 5-20 W / mK and an electrostatic dissipation index of ≥10. 4 ~1×10 11 It has a shielding coupling energy of <50nJ and excellent corrosion resistance.

2. The preparation method of a novel high heat dissipation, chemical resistance, and antistatic material according to claim 1, characterized in that: The preparation method of the novel high heat dissipation, chemical resistance, and antistatic material includes the following steps: S1. Raw material pretreatment: The functional filler is doped and chelated with a silane coupling agent to obtain the modified functional filler; S2. Blending and compounding: The base resin components are blended and compounded with modified functional fillers to obtain a composite preform; S3. Melt Plasticizing Extrusion: The composite preform is melt plasticized and extruded, cooled, and pelletized to obtain the target new material.

3. The preparation method of a novel high heat dissipation, chemical resistance, and antistatic material according to claim 2, characterized in that: In step S1, the specific conditions for the doping chelation treatment are as follows: the functional filler and silane coupling agent are added to a high-speed mixer and stirred for 1-3 hours at a temperature of 80-120℃ and a speed of 500-1000r / min, and nitrogen gas is introduced for protection during the stirring process, with a nitrogen flow rate of 10-20L / min.

4. The preparation method of a novel high heat dissipation, chemical resistance, and antistatic material according to claim 2, characterized in that: In step S1, the silane coupling agent is at least one of KH-550, KH-560 or KH-570, and its addition amount is 1%-3% of the total mass of the functional filler.

5. The preparation method of a novel high heat dissipation, chemical resistance, and antistatic material according to claim 2, characterized in that: In step S2, the blending process uses a twin-screw mixer, with the temperature controlled at 180-220℃, the screw speed at 300-500 r / min, and the blending time at 20-40 min. The twin-screw mixer barrel is divided into five temperature zones from the feed port to the head, with temperatures of 180℃, 190℃, 200℃, 210℃, and 220℃ respectively.

6. The method for preparing a novel high-heat-dissipation, chemically resistant, and antistatic material according to claim 2, characterized in that: In step S2, the composite treatment is carried out using a composite molding machine, with the pressure controlled at 10-20MPa and the temperature at 200-240℃, and the heat and pressure maintained for 1-2 hours. Furthermore, the heat preservation and pressure maintenance adopts a gradient pressure increase method, first increasing the pressure from 2MPa / min to 10MPa and maintaining the temperature for 30min, then increasing the pressure from 1MPa / min to 20MPa and maintaining the temperature for 90min.

7. The method for preparing a novel high-heat-dissipation, chemically resistant, and antistatic material according to claim 2, characterized in that: In step S3, the melt plasticizing extrusion uses a single screw extruder. The barrel is divided into six temperature zones from the feed port to the die head, with temperatures of 220℃, 230℃, 240℃, 250℃, 260℃, and 260℃ respectively. The die head temperature is controlled at 250-260℃.

8. The preparation method of a novel high heat dissipation, chemical resistance, and antistatic material according to claim 2, characterized in that: In step S3, the screw speed of the single-screw extruder is controlled at 200-400 r / min to ensure that the composite preform is fully melted and plasticized.

9. The preparation method of a novel high heat dissipation, chemical resistance, and antistatic material according to claim 2, characterized in that: In step S3, cooling is performed using water at a temperature of 20-30°C for 5-10 minutes; the particle size is controlled to be 2-4 mm to ensure uniform particle size.

10. The method for preparing a novel high-heat-dissipation, chemically resistant, and antistatic material according to claim 2, characterized in that: Before the raw material pretreatment in step S1, the functional filler is first placed in a vacuum drying oven for drying. The drying temperature is 100-130℃, the vacuum degree is -0.08 to -0.1MPa, and the drying time is 2-4 hours to remove moisture from the functional filler and avoid the generation of bubbles during the doping and chelation process, which would affect the material performance.

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