Photovoltaic packaging film composition with anti-PID (Potential Induced Degradation) performance

Abstract

The present disclosure relates to novel encapsulant film compositions that provide anti-PID properties while maintaining good cure, adhesion, volume resistivity properties. The composition comprises: a) a polyolefin polymer; b) an organic peroxide; c) a silane adhesion promoter; and d) a crosslinking aid; and e) an anti-PID agent.

Description

Technical Field

[0001] This disclosure relates to polyolefin polymer compositions for use in photovoltaic (PV) encapsulant films. In one aspect, this disclosure relates to polyolefin polymer compositions resistant to potential-induced degradation (PID). In another aspect, this disclosure relates to PV encapsulant films comprising polyolefin polymer compositions and electronic devices comprising such PV encapsulant films. Background Technology

[0002] Global demand for alternative energy has led to a significant increase in the production of solar panels and PV modules over the past decade. Solar cells, which convert solar energy into electricity (also known as PV cells), are extremely fragile and must be encapsulated in durable encapsulant films. The two main functions of encapsulant films are (1) to bond the solar cells to the glass cover and backsheet, and (2) to protect the PV modules from environmental stresses such as moisture, temperature, shock, vibration, electrical insulation, etc. Current encapsulant films are primarily made of ethylene-vinyl acetate (EVA) because EVA exhibits the good balance of properties necessary for encapsulant films. EVA is an ethylene / unsaturated carboxylic acid ester copolymer, in which the unsaturated carboxylic acid ester comonomer is ethylene carboxylic acid ester.

[0003] Certain polyolefin polymers (such as polyolefin elastomers (POEs) that are not ethylene / unsaturated carboxylic acid ester copolymers) have been identified as alternatives to EVA for forming encapsulant films, and have advantages over EVA in, for example, resistivity, moisture and thermal stability, and weather resistance.

[0004] Because solar modules are used in various environments (such as high temperature, high humidity, and high electrical stress conditions), it has been found that the output efficiency of these PV cells made with EVA and POE-based compositions decreases over time. This efficiency loss caused by electrical stress is called potential-induced degradation (“PID”) and is caused by leakage current generated due to the difference between the potential of the photovoltaic module frame and the potential of the solar cell. The PID effect can lead to power losses of up to 30%.

[0005] The causes of PID are interrelated with factors affecting the power degradation of photovoltaic modules. However, there is no definitive conclusion regarding the true cause of PID. Some speculate that the PID mechanism occurs in humid, high-temperature environments, as water vapor enters the module through the edge-sealed silicone or backsheet. This water vapor intrusion causes condensation on the surface of the crystalline silicon photovoltaic module. This condensation causes sodium ions in the glass to be released, resulting in a negative bias voltage. Under this negative bias voltage, leakage current flows from the cell to the encapsulation adhesive, to the glass surface, to the frame and support, and finally to ground, thus reducing the output power and producing the PID phenomenon. Another potential cause of PID is the polarization of the dielectric layer of the solar cell under electrical stress. The high resistance of the encapsulation film, i.e., volume resistivity (“VR”), reduces the electric field applied to the dielectric layer and its polarization.

[0006] In the case of using EVA encapsulants, it is presumed that a negative bias voltage is generated by the production of acetic acid through the hydrolysis of EVA. This acetic acid then reacts with an alkali precipitated on the glass surface to produce freely moving sodium ions. Furthermore, EVA has low resistance. However, if the resistance of the POE encapsulant is not high enough, PID (Potential Inhibition) is also a known problem with POE encapsulants. Therefore, it is recognized in the art that there is a need for novel encapsulant compositions that provide anti-PID properties while maintaining good curing and glass adhesion properties. Summary of the Invention

[0007] A composition comprising at least the following:

[0008] a) Polyolefin polymers;

[0009] b) Organic peroxides;

[0010] c) Silane adhesion promoters; and

[0011] d) Crosslinking aids; and

[0012] e) Anti-PID agent. Attached Figure Description

[0013] Figure 1 This is an exploded perspective view of an exemplary photovoltaic module. Detailed Implementation

[0014] Currently, encapsulant films are primarily made of EVA. However, polyolefin polymer compositions that do not contain EVA (e.g., polyolefin elastomers (“POE”) as defined herein) are of great interest as a replacement for EVA-based compositions because they can offer certain advantages to encapsulant films, including but not limited to resistivity, moisture and thermal stability, and weather resistance.

[0015] Replacing EVA with a POE-based encapsulant film is not without its challenges. For example, POE-based encapsulant films require a longer lamination time compared to EVA-based encapsulant films. In WO 2019 / 000744 A1, the inventors of this application reported a POE-based encapsulant film that exhibited a shorter time required to soak POE in a curing package compared to conventional crosslinking aids (e.g., triallyl isocyanurate (“TAIC”)). The composition of WO 2019 / 000744 A1 uses a monocyclic organosiloxane of formula (I) further described below instead of a conventional crosslinking aid: [R 1 ,R 2 SiO 2 / 2 ] n However, the inventors have discovered that once the crosslinking aid is converted from TAIC to these monocyclic organosiloxanes, the PID performance becomes unstable. In particular, for some solar cells, the power loss exceeds 5%.

[0016] Therefore, there is a need in the prior art for novel encapsulant film compositions that provide anti-PID properties while maintaining good curing, adhesion, volume resistivity, and other properties. To this end, this disclosure provides a surprising and unexpected POE-based encapsulant film with anti-PID properties by introducing anti-PID agents (such as ethyl sorbate or butyl sorbate) or acrylate compounds (such as TMTPA, TMPTMA, or other acrylate monomers described herein).

[0017] composition

[0018] As discussed above, the present invention provides a composition comprising at least the following:

[0019] a) Polyolefin polymers;

[0020] b) Organic peroxides;

[0021] c) Silane adhesion promoters; and

[0022] d) Crosslinking aids; and

[0023] e) Anti-PID agent.

[0024] The compositions of the present invention may include a combination of two or more embodiments as described herein.

[0025] Each component of the compositions of the present invention may comprise a combination of two or more embodiments as described herein.

[0026] (A) Polyolefin polymers

[0027] The compositions of the present invention comprise a polyolefin polymer. In some embodiments, the compositions of the present invention comprise 85% to 99.5% by weight (e.g., 86% to 99.5% by weight, 87% to 99.5% by weight, 88% to 99.5% by weight, 89% to 99.5% by weight, 90% to 99.5% by weight, 95% to 99.5% by weight, 97% to 99.5% by weight, 97.50% to 98.50% by weight, 97.75% to 98.25% by weight, etc.) of a polyolefin polymer, wherein the total weight percentage is 100% by weight of the total composition. In other words, in some embodiments, the composition of the present invention comprises 85 wt%, or 88 wt%, or 90 wt%, or 95 wt%, or 97 wt%, or 97.50 wt%, or 97.75 wt% to 98.25 wt%, or 98.5 wt%, or 99 wt%, or 99.5 wt% of a polyolefin polymer, wherein the total weight percentage is 100 wt% of the total composition.

[0028] In some embodiments, the polyolefin polymer is a polyolefin elastomer as defined herein. In other embodiments, the polyolefin polymer is a nonpolar polyolefin elastomer.

[0029] In some embodiments, the polyolefin polymer is an ethylene-based polymer comprising 50% to 100% by weight of olefinic monomer units and 50% to 0% by weight of (C3-C4) olefins. 20 The copolymer unit comprises α-olefin-derived comonomer units and optionally 20% to 0% by weight diene comonomer units, wherein the total weight percentage is 100% by weight of the polyolefin polymer. The diene used to make the diene comonomer units may be 1,3-butadiene, 1,5-hexadiene, 1,7-octadiene, ethylidene norbornene, dicyclopentadiene, or vinyl norbornene.

[0030] In some embodiments, the polyolefin polymer is a propylene-based polymer comprising 50% to 100% by weight of propylene monomer units, 50% to 0% by weight of olefins or (C4-C5) 20 The copolymer unit comprises α-olefin-derived comonomer units and optionally 20% to 0% by weight diene comonomer units, wherein the total weight percentage is 100% by weight of the polyolefin polymer. The diene used to make the diene comonomer units may be 1,3-butadiene, 1,5-hexadiene, 1,7-octadiene, ethylidene norbornene, dicyclopentadiene, or vinyl norbornene.

[0031] In some embodiments, the polyolefin polymer contains 99% to 100% by weight (C3-C4). 20 ) α-olefin monomer units poly((C3-C20 α-olefin) homopolymer or containing 99% to 100% by weight of at least two different (C3-C4) olefins. 20 ) α-olefin monomer / comonomer unit poly((C3-C 20 α-olefin copolymer.

[0032] In some embodiments, the polyolefin polymer is an ethylene / α-olefin interpolymer. The ethylene / α-olefin interpolymer can be a random or block interpolymer. Block interpolymers include multiblock copolymers and diblock copolymers. Non-limiting examples of suitable ethylene / α-olefin interpolymers include ethylene / propylene, ethylene / butene, ethylene / 1-hexene, ethylene / 1-octene, ethylene / propylene / 1-octene, ethylene / propylene / 1-butene, and ethylene / butene / 1-octene interpolymers. In some embodiments, the ethylene / α-olefin interpolymer is an ethylene / α-olefin copolymer. Non-limiting examples of suitable ethylene / α-olefin copolymers include ethylene / propylene copolymers, ethylene / butene copolymers, ethylene / 1-hexene copolymers, and ethylene / 1-octene copolymers.

[0033] In some embodiments, the polyolefin polymer is a propylene / α-olefin interpolymer, wherein "α-olefin" includes ethylene. In some embodiments, the propylene / α-olefin interpolymer is a propylene / α-olefin copolymer.

[0034] In some embodiments, the polyolefin polymer has a density of 0.850 g / cc to 0.900 g / cc according to ASTM D792 (e.g., 0.855 g / cc to 0.900 g / cc, 0.860 g / cc to 0.900 g / cc, 0.865 g / cc to 0.900 g / cc, 0.870 g / cc to 0.890 g / cc, 0.875 g / cc to 0.890 g / cc, 0.875 g / cc to 0.885 g / cc and / or 0.880 g / cc to 0.885 g / cc). In other words, the density of the polyolefin polymer, according to ASTM D792, is 0.850 g / cc, or 0.855 g / cc, or 0.860 g / cc, or 0.865 g / cc, or 0.870 g / cc, or 0.875 g / cc, or 0.880 g / cc to 0.885 g / cc, or 0.890 g / cc, or 0.900 g / cc.

[0035] In some embodiments, the polyolefin polymer has a melt index (MI) of 1 g / 10 min to 100 g / 10 min at 190 °C / 2.16 kg according to ASTM D1238 (e.g., 1 g / 10 min to 75 g / 10 min, 1 g / 10 min to 50 g / 10 min, 1 g / 10 min to 45 g / 10 min, 1 g / 10 min to 40 g / 10 min, 1 g / 10 min to 35 g / 10 min, 1 g / 10 min to 30 g / 10 min, 5 g / 10 min to 25 g / 10 min, 10 g / 10 min to 25 g / 10 min, 15 g / 10 min to 25 g / 10 min, 15 g / 10 min to 20 g / 10 min and / or 18 g / 10 min to 20 g / 10 min). In other words, in some embodiments, the polyolefin has a melt index (MI) of 1 g / 10 min, or 5 g / 10 min, or 10 g / 10 min, or 15 g / 10 min, or 18 g / 10 min to 20 g / 10 min, or 25 g / 10 min, or 30 g / 10 min, or 35 g / 10 min, or 40 g / 10 min, or 45 g / 10 min, or 50 g / 10 min, or 75 g / 10 min, or 100 g / 10 min, according to ASTM D1238 at 190 °C / 2.16 kg.

[0036] In some embodiments, the melting point of the polyolefin polymer is 40°C to 125°C. In other words, in some embodiments, the melting point of the polyolefin polymer is 40°C, or 45°C, or 50°C, or 55°C to 60°C, or 65°C, or 70°C, or 80°C, or 90°C, or 95°C, or 100°C, or 110°C, or 120°C, or 125°C.

[0037] In some embodiments, the glass transition temperature (Tg) of the polyolefin polymer is -35°C to -100°C. In other words, in some embodiments, the glass transition temperature (Tg) of the polyolefin polymer is -35°C, or -40°C, or -45°C, or -50°C to -80°C, or -85°C, or -90°C, or -95°C, or -100°C.

[0038] In some implementations, the volume resistivity of the polyolefin polymer is ≥1.0 × 10⁻⁶. 14 Ω-cm, or ≥5.0×10 15 Ω-cm, ≥1.0×10 16 Ω-cm, or ≥2.0×10 16 Ω-cm, or ≥3.0×10 16 Ω-cm, or ≥4.0×10 16 Ω-cm, or ≥5.0×1016 Ω-cm.

[0039] In another embodiment, the polyolefin polymer of this disclosure is an ethylene / α-olefin interpolymer that does not include ethylene / propylene copolymers (e.g., ethylene-propylene rubber and / or ethylene-propylene terpolymers).

[0040] In some embodiments, the polyolefin polymer is an ethylene / α-olefin interpolymer having one, some, or all of the following properties:

[0041] (i) A density of 0.850 g / cc, 0.853 g / cc, or 0.855 g / cc, or 0.860 g / cc, or

[0042] 0.863g / cc, or 0.865g / cc, or 0.870g / cc, or 0.873g / cc, or

[0043] 0.875g / cc, or 0.880g / cc, or 0.883g / cc, or 0.885g / cc, or

[0044] 0.890g / cc, or 0.893g / cc, or 0.895g / cc, or 0.900g / cc;

[0045] (ii) Melt index of 1 g / 10 min, or 5 g / 10 min, or 10 g / 10 min, or

[0046] 15g / 10min, or 18g / 10min to 20g / 10min, or 25g / 10min, or

[0047] 30g / 10min, or 35g / 10min, or 40g / 10min, or 45g / 10min, or

[0048] 50g / 10min, or 75g / 10min, or 100g / 10min; and / or

[0049] (iii) Melting point (Tm) of 40°C, or 45°C, or 50°C, or 55°C to 60°C, or 65°C, or 70°C, or 80°C, or 90°C, or 95°C, or 100°C, or

[0050] 110℃, or 120℃, or 125℃;

[0051] (iv) Volume resistivity ≥ 1.0 × 10 14 Ω-cm, or ≥5.0×10 15 Ω-cm, ≥1.0×10 16 Ω-cm, or ≥2.0×1016 Ω-cm, or ≥3.0×10 16 Ω-cm, or ≥4.0×10 16 Ω-cm, or ≥5.0×10 16 Ω-cm.

[0052] The polyolefin polymer can be a blend or combination of two or more of the polymers described in the foregoing embodiments. The polyolefin polymer can also be blended with or diluted with one or more other polymers.

[0053] Polyolefin polymers can be produced by any suitable method known in the art. The polyolefin polymers disclosed herein can be prepared using any conventional or hereafter discovered production methods for producing polyolefin polymers. Exemplary non-limiting production methods include one or more polymerization reactions, such as high-pressure polymerization or coordination polymerization using one or more polymerization catalysts, including but not limited to Ziegler-Natta, chromium oxide, metallocene, confined geometry, and post-metallocene catalysts. Suitable temperatures are from 0°C to 250°C, or 30°C or 200°C. Suitable pressures are from atmospheric pressure (101 kPa) to 10,000 atmospheres (approximately 1,013 megapascals (“MPa”)). In most polymerization reactions, the molar ratio of the catalyst to the polymerizable olefin (monomer / comonomer) is 10:1. -12 :1 to 10 -1 :1 or 10 -9 :1 to 10 -5 :1.

[0054] Non-limiting examples of polyolefin polymers include ENGAGE from The Dow Chemical Company. TM AFFINITY, a polyolefin elastomer from Dow Chemical Company TM Polyolefin plastide, INFUSE from Dow Chemical Company TM olefin block copolymer, from Dow Chemical's INTUNE TM PP-based olefin block copolymers, EXACT from Exxon Chemical Company TM Resin, TAFMER from Mitsui Chemicals. TM Resin, LUCENE from LG Chemical. TM The resin, EASTOFLEX, is from Eastman Chemical Company. TMResin and FLEXOMER from Dow Chemical Company TM Resin.

[0055] (B) Organic peroxides

[0056] The compositions of the present invention comprise organic peroxides. In some embodiments, the compositions of the present invention comprise 0.01 wt% to 2 wt% (e.g., 0.01 wt% to 2 wt%, 0.05 wt% to 1.5 wt%, and / or 0.1 wt% to 1.5 wt%, 0.2 wt% to 1 wt%, 0.3 wt% to 0.8 wt%, 0.4 wt% to 0.6 wt%) of organic peroxides, wherein the total weight percentage is 100 wt% of the total composition. In other words, the compositions of the present invention comprise 0.01 wt%, or 0.05 wt%, or 0.1 wt% to 0.2 wt%, or 0.3 wt%, or 0.4 wt%, or 0.5 wt%, or 0.6 wt%, or 1 wt% or 2 wt% of organic peroxides, wherein the total weight percentage is 100 wt% of the total composition.

[0057] In some embodiments, the organic peroxide is: a molecule containing carbon atoms, hydrogen atoms and two or more oxygen atoms and having at least one -OO- group, provided that when more than one -OO- group is present, each -OO- group is indirectly bonded to another -OO- group via one or more carbon atoms; or a collection of such molecules.

[0058] Organic peroxides can be dialkyl peroxides. Organic peroxides can be of formula R O -OOR O The single peroxide, wherein each R O Independently for (C1-C 20 )alkyl group or (C6-C 20 ) aryl group. Each (C1-C 20 The alkyl group is independently unsubstituted or occupied by one or two (C6-C) alkyl groups. 12 Aryl group substitution. Each (C6-C) 20 The aryl group is unsubstituted or surrounded by one to four (C1-C4) atoms. 10 Alkyl group substitution. Alternatively, the organic peroxide can be of formula R O -OOROOR O Diperoxides, where R is a divalent hydrocarbon group, such as (C2-C 10 )alkylene, (C3-C 10 ) cycloalkylene or phenylene, and each R O As defined above.

[0059] Non-limiting examples of suitable organic peroxides include dicumyl peroxide; 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyn-3; 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane; bis(1,1-dimethylethyl)peroxide; bis(1,1-dimethylpropyl)peroxide; 2,2-di(tert-butylperoxy)butane; di-tert-pentyl peroxide (“DTAP”); bis(α-tert-butylperoxyisopropyl)benzene (“BIPB”); isopropylcumyl tert-butyl peroxide; tert-butylcumyl peroxide; butyl 4,4-di(tert-butylperoxy)valerate; di(isopropylcumyl)peroxide; and so on.

[0060] Peroxides can be peroxycarbonates containing at least one of the following structures:

[0061]

[0062] Non-limiting examples of suitable peroxycarbonate-type peroxides include isopropyl percarbonate; tert-butyl peroxy-2-ethylhexyl carbonate, tert-amyl peroxy-2-ethylhexyl carbonate, tert-butyl peroxyisopropyl carbonate, and tert-butyl peroxy-3,5,5-trimethylhexanoate.

[0063] Peroxides can be diacyl peroxides containing at least one of the following structures:

[0064]

[0065] Non-limiting examples of suitable acyl peroxide type peroxides include dilauryl peroxide; benzoyl peroxide; and didecyl peroxide;

[0066] Peroxides can be peroxide esters containing at least one of the following structures:

[0067]

[0068] Non-limiting examples of suitable peroxy ester peroxides include tert-butyl peroxybenzoate, tert-butyl peracetate, tert-amyl peroxybenzoate, tert-butyl peroxy-3,5,5-trimethylhexanoate; tert-butyl peroxyisobutyrate; tert-butyl peroxydiethylacetate; tert-butyl peroxy-2-ethylhexanoate; tert-amyl peroxy-2-ethylhexanoate; 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate; and 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane.

[0069] Peroxides can be peroxyketals containing at least one of the following structures:

[0070]

[0071] Non-limiting examples of suitable peroxyketal peroxides include 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane; 1,1-di(tert-butylperoxy)cyclohexane; and 1,1-di(tert-pentylperoxy)cyclohexane.

[0072] The peroxide can be a cyclic ketone peroxide containing at least one of the following structures:

[0073]

[0074] Non-limiting examples of suitable cyclic ketone peroxides include 3,6,9-triethyl-3,6,9-trimethyl-1,4,7-triperoxynonane.

[0075] Non-limiting examples of suitable commercially available organic peroxides include those from AkzoNobel. and from Arkema

[0076] (C) Silane Adhesion Accelerator

[0077] The compositions of the present invention comprise a silane coupling agent. In some embodiments, the compositions of the present invention comprise 0.01 wt% to 1 wt% (e.g., 0.05 wt% to 1 wt%, 0.10 wt% to 1 wt%, 0.15 wt% to 0.5 wt%, 0.2 wt% to 0.4 wt%, and / or 0.25 wt% to 0.3 wt%) of a silane adhesion promoter, wherein the total weight percentage is 100 wt% of the total composition. In other words, the compositions of the present invention comprise 0.01 wt%, or 0.05 wt%, or 0.10 wt%, or 0.15 wt%, or 0.20 wt%, or 0.25 wt% to 0.3 wt%, or 0.4 wt%, or 0.5 wt%, or 1 wt% of a silane adhesion promoter, wherein the total weight percentage is 100 wt% of the total composition.

[0078] In some embodiments, the silane adhesive promoter contains at least one alkoxy group. Non-limiting examples of suitable silane adhesive promoters include γ-chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyl-tri-(β-methoxy)silane, allyltrimethoxysilane, γ-methacryloyloxypropyltrimethoxysilane, β-(3,4-ethoxy-cyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, and 3-(trimethoxysilyl)propyl methacrylate. 3-(trimethoxysilyl)propyl acrylate, tetraethyl orthosilicate, tetramethyl orthosilicate, tetrapropyl orthosilicate, vinyltriisopropoxysilane, 3-(triethoxysilyl)propyl methacrylate, 3-(triisopropoxysilyl)propyl 2-methacrylate, vinyltriethoxysilane, 3-[diethoxy(methyl)silyl]propyl methacrylate.

[0079] In some embodiments, the silane adhesion promoter is vinyltrimethoxysilane, 3-(trimethoxysilyl)propyl methacrylate, or 3-(trimethoxysilyl)propyl acrylate.

[0080] (D) Crosslinking aids

[0081] The compositions of the present invention comprise a crosslinking aid comprising a monocyclic organosiloxane of formula (I):

[0082] [R 1 ,R 2 SiO 2 / 2 ] n (I),

[0083] Where the subscript n is an integer greater than or equal to 3; each R 1 Independently (C2-C4) alkenyl; and each R 2 Independently for H, (C1-C 20 )alkyl, phenyl or R 1 .

[0084] In some embodiments, the monocyclic organosiloxane of formula (I) is further described by any of the following limitations: (i) the subscript n is 3; (ii) each R 1 Independently (C2-C3) alkenyl; and each R 2 (iii) Each R is independently H, (C1-C2)alkyl or (C2-C3)alkenyl; 1 It is vinyl; and each R 2 (iv) Each R is independently (C1-C2) alkyl;1 It is vinyl; and each R 2 It is methyl; (v) each R 1 It is allyl; and each R 2 Independently, each R is a (C1-C2) alkyl group; (vi) each R 1 It is allyl; and each R 2 It is a methyl group.

[0085] In some embodiments, the monocyclic organosiloxane of formula (I) is further described by any of the following limitations: (i) the subscript n is 4; (ii) each R 1 Independently (C2-C3) alkenyl; and each R 2 (iii) Each R is independently H, (C1-C2)alkyl or (C2-C3)alkenyl; 1 It is vinyl; and each R 2 (iv) Each R is independently (C1-C2) alkyl; 1 It is vinyl; and each R 2 It is methyl; (v) each R 1 It is allyl; and each R 2 Independently, each R is a (C1-C2) alkyl group; (vi) each R 1 It is allyl; and each R 2 It is a methyl group.

[0086] In some embodiments, the monocyclic organosiloxane of formula (I) is further described by any of the following limitations: (i) the subscript n is 5 or 6; (ii) each R 1 Independently (C2-C3) alkenyl; and each R 2 (iii) Each R is independently H, (C1-C2)alkyl or (C2-C3)alkenyl; 1 It is vinyl; and each R 2 (iv) Each R is independently (C1-C2) alkyl; 1 It is vinyl; and each R 2 It is methyl; (v) each R 1 It is allyl; and each R 2 Independently, each R is a (C1-C2) alkyl group; (vi) each R 1 It is allyl; and each R 2 It is a methyl group.

[0087] In some embodiments, the monocyclic organosiloxane of formula (I) is an alkenyl-functional monocyclic organosiloxane. In some embodiments, the monocyclic organosiloxane of formula (I) is a cyclic molecule that does not contain carbon or nitrogen in its ring.

[0088] In some embodiments, the monocyclic organosiloxane of formula (I) is a molecule comprising: a monocyclic substructure consisting of silicon atoms and oxygen atoms arranged in an alternating configuration; and an unsaturated organic group; and optionally an H, saturated, or aromatic substituent; wherein at least two unsaturated organic groups are present, and each of the at least two silicon atoms in the cyclic substructure has at least one unsaturated organic group bonded thereto, and wherein any remaining valence of the silicon atom, after taking into account the unsaturated organic group and the oxygen atom, is bonded to the H, saturated, or aromatic substituent; or a collection of such molecules.

[0089] The monocyclic organosiloxane of formula (I) can be a monocyclic organosiloxane composed of a 6-membered ring (n=3), an 8-membered ring (n=4), a 10-membered ring (n=5), or a 12-membered ring (n=6). The cyclic substructure is composed of units of formula (I): [R 1 ,R 2 SiO 2 / 2 ] n (I), where the subscripts n and R 1 and R 2 As previously defined. In each [R 1 ,R 2 SiO 2 / 2 ] n In the unit, its R 1 Groups and R 2 The group is bonded to its silicon atom. The unit can be simply named D using the conventional organosiloxane shorthand notation. R1,R2 This makes equation (I) become [D] R1,R2 ] n In this respect, the superscripts R1 and R2 are respectively related to R 1 and R 2 Interchangeable. In some respects, R 1 and R 2 Same, but different locations.

[0090] In some embodiments of monocyclic organosiloxanes of formula (I), R 1 It is vinyl and R 2 It is ethyl, and the monocyclic organosiloxane of formula (I) is D. Vi,Et Where Vi is vinyl and Et is ethyl; alternatively, R 1 It is allyl and R 2 It is ethyl, and the monocyclic organosiloxane of formula (I) is D. 烯丙基，Et Alternatively, R 1 It is butenyl (H2C=C(H)CH2CH2-) and R 2 It is ethyl, and the monocyclic organosiloxane of formula (I) is D. 丁烯基，Et In some respects, R 1 It is vinyl and R2 It is a vinyl group, and the monocyclic organosiloxane of formula (I) is D. Vi,Vi Alternatively, R 1 It is allyl and R 2 It is allyl, and the monocyclic organosiloxane of formula (I) is D. 烯丙基，烯丙基 Alternatively, R 1 It is butenyl (H2C=C(H)CH2CH2-) and R 2 It is butenyl, and the monocyclic organosiloxane of formula (I) is D. 丁烯基，丁烯基 In some respects, R 1 It is vinyl and R 2 It is phenyl, and the monocyclic organosiloxane of formula (I) is D. Vi,Ph Ph is phenyl; alternatively, R 1 It is allyl and R 2 It is phenyl, and the monocyclic organosiloxane of formula (I) is D. 烯丙基，Ph Alternatively, R 1 It is butenyl (H2C=C(H)CH2CH2-) and R 2 It is phenyl, and the monocyclic organosiloxane of formula (I) is D. 丁烯基，Ph When R 2 When it is a methyl group (CH3), the unit can be more simply named D. R1 This makes equation (I) become [D] R1 ] n In some respects, R 1 It is vinyl and R 2 It is methyl, and the monocyclic organosiloxane of formula (I) is D. Vi Alternatively, R 1 It is allyl and R 2 It is methyl, and the monocyclic organosiloxane of formula (I) is D. 烯丙基 Alternatively, R 1 It is butenyl (H2C=C(H)CH2CH2-) and R 2 It is methyl, and the monocyclic organosiloxane of formula (I) is D-butenyl. In some embodiments, the monocyclic organosiloxane of formula (I) is 2,4,6-trimethyl-2,4,6-trivinyl-cyclotrisiloxane, "(D Vi )3” (CAS No. 3901-77-7); 2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotritetrasiloxane, “(D Vi )4” (CAS No. 2554-06-5); or a combination thereof.

[0091] In some embodiments, the crosslinking aid of the compositions of the present invention consists only of monocyclic organosiloxanes of formula (I).

[0092] In some embodiments, the compositions disclosed herein comprise 0.01 wt% to 5 wt% (e.g., 0.05 wt% to 4.5 wt%, 0.1 wt% to 4 wt%, 0.15 wt% to 3.5 wt%, 0.2 wt% to 3 wt%, 0.25 wt% to 2.5 wt%, 0.3 wt% to 2 wt%, 0.35 wt% to 1.5 wt%, 0.4 wt% to 1.25 wt%, 0.45 wt% to 1 wt%, 0.5 wt% to 1 wt%, 0.55 wt% to 0.75 wt%, 0.6 wt% to 0.7 wt%, etc.) of a crosslinking aid comprising a monocyclic organosiloxane of formula (I), wherein the total weight percentage is 100 wt% of the total composition. In other words, the compositions disclosed herein comprise 0.01 wt%, or 0.05 wt%, or 0.1 wt%, or 0.15 wt%, or 0.2 wt%, or 0.25 wt%, or 0.3 wt%, or 0.35 wt%, or 0.4 wt%, or 0.45 wt%, or 0.5 wt%, or 0.55 wt%, or 0.6 wt% to 0.7 wt%, or 0.75 wt%, 1 wt%, or 1.25 wt%, or 1.5 wt%, or 2 wt%, or 2.5 wt%, or 3 wt%, or 3.5 wt%, or 4 wt%, or 4.5 wt%, or 5 wt% of a crosslinking aid comprising a monocyclic organosiloxane of formula (I), wherein the total weight percentage is 100 wt% of the total composition. In some embodiments, the compositions of the present invention comprise a crosslinking aid comprising a monocyclic organosiloxane of formula (I), provided that the composition is free of (i.e., lacks) a phosphazene base. In some embodiments, the compositions of the present invention are free of any ring-opening catalyst. In other embodiments, when the polyolefin polymer is an ethylene-containing polymer and the subscript n (the subscript n of the monocyclic organosiloxane of formula (I)) is 4, the compositions of the present invention do not contain 24% by weight or more, alternatively do not contain 22% by weight or more, alternatively do not contain 20.0% by weight or more, alternatively do not contain 15% by weight or more, alternatively do not contain 10% by weight or more, and alternatively do not contain inorganic fillers selected from the group consisting of: alumina, aluminum silicate, calcium silicate, magnesium silicate, silicon dioxide, titanium dioxide, and mixtures thereof. In other embodiments, the compositions of the present invention do not contain 20% by weight or more, alternatively 15% by weight or more, alternatively 10% by weight or more, and alternatively do not contain any inorganic fillers selected from the group consisting of: solids containing Al, solids containing Ca, solids containing Mg, solids containing Si, solids containing Ti, and mixtures thereof. In other embodiments, the compositions of the present invention do not contain silsesquioxanes, and alternatively do not contain any siloxanes other than the monocyclic organosiloxanes of formula (I). In some embodiments, the compositions of the present invention do not contain silsesquioxanes or any of the inorganic fillers mentioned above.

[0093] In some embodiments, the compositions disclosed herein comprise conventional crosslinking aids, such as triallyl isocyanurate, triallyl cyanurate, and high-vinyl polybutadiene.

[0094] (E) Anti-PID agent

[0095] The compositions of this invention contain an anti-PID agent. In some embodiments, the compositions disclosed herein contain 0.001 wt% to 1 wt% (e.g., 0.001 wt% to 0.99 wt%, 0.001 wt% to 0.96 wt%, 0.001 wt% to 0.94 wt%, 0.001 wt% to 0.90 wt%, 0.002 wt% to 1.0 wt%, 0.005 wt% to 1 wt%, 0.01 wt% to 1 wt%, 0.02 wt% to 1 wt%). Anti-PID agents (0.03 wt% to 1 wt%, 0.04 wt% to 1 wt%, 0.05 wt% to 1 wt%, 0.06 wt% to 1 wt%, 0.07 wt% to 1 wt%, 0.08 wt% to 1 wt%, 0.09 wt% to 1 wt%, 0.1 wt% to 1 wt%, 0.25 wt% to 1 wt%, 0.5 wt% to 1 wt%, etc.), wherein the total weight percentage is 100 wt% of the total composition. In other words, the compositions disclosed herein comprise 0.001 wt%, or 0.003 wt%, or 0.005 wt%, or 0.01 wt%, or 0.02 wt%, or 0.03 wt%, or 0.04 wt%, or 0.05 wt%, or 0.06 wt%, or 0.07 wt%, or 0.08 wt%, or 0.09 wt%, or 0.10 wt%, or 0.20 wt%, or 0.30 wt%, or 0.40 wt%, or 0.45 wt%, or 0.50 wt% to 1 wt% of an anti-PID agent, wherein the total weight percentage is 100 wt% of the total composition.

[0096] In some embodiments, the anti-PID agent comprises at least one structure of formula (II):

[0097]

[0098] R1, R2, and R3 are each independently H, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, cycloyl, aromatic, heteroalkyl, or heteroalkenyl. In some embodiments, R2 also contains heteroatoms such as Si, S, N, or O.

[0099] In some embodiments, R1 and R3 are each independently an alkyl group selected from the group consisting of: methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl.

[0100] In some embodiments, R1 and R3 are each independently a cyclic alkyl group selected from the group consisting of cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl.

[0101] In some embodiments, R2 further comprises alkyl acrylates or polyalkyl acrylates, such as formula (III):

[0102]

[0103] R1 and R3 are each independently H, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, or cycloyl, or heteroalkyl, or heteroalkenyl.

[0104] R' is selected from C1-C30 alkylene groups;

[0105] Y is selected from CR 4-n (where n = 1 to 4), OR 2-n (where n = 1 to 2), NR 3-n (where n = 1 to 3), SR 2-n (where n = 1 to 2), PR 3-n (where n = 1 to 3), PR 5-n (where n = 1 to 5), SiR 4-n (where n = 1 to 4), bifunctional CC cores, phenyl cores, ester-substituted phenyl cores, amide-substituted phenyl cores, triisocyanurate cores or melamine cores; and combinations thereof;

[0106] In some embodiments, the bifunctional CC core is selected from the following structures, wherein each R' represents a divalent R' group in formula (III) above:

[0107]

[0108] In some embodiments, the phenyl core is selected from the following structures, wherein each R' represents a divalent R' group in formula (III) above:

[0109]

[0110] In some embodiments, the ester-substituted phenyl nucleus is selected from the following structures, wherein each R' represents a divalent R' group in formula (III) above:

[0111]

[0112] In some embodiments, the amide-substituted phenyl core is selected from the following structures, wherein each R' represents a divalent R' group in formula (III) above:

[0113]

[0114] In some embodiments, the triisocyanurate core is as follows, wherein each R' represents a divalent R' group in formula (III) above;

[0115]

[0116] In some embodiments, the melamine core is as follows, wherein each R' represents a divalent R' group in formula (III) above;

[0117] and

[0118] Each R' group is independently selected from H, an unsubstituted hydrocarbon group, a substituted hydrocarbon group, an unsubstituted heterohydrocarbon group, or a substituted heterohydrocarbon group.

[0119] In some embodiments, the compositions of the present invention comprise an anti-PID agent comprising an ester of sorbic acid, such as methyl sorbate, ethyl sorbate, propyl sorbate, butyl sorbate, and glycidyl sorbate.

[0120] Non-limiting examples of suitable anti-PID agents include methyl acrylate, ethyl acrylate, butyl acrylate, cyclopropyl acrylate, ethyl methacrylate, methyl methacrylate, bisphenol A-glycidyl methacrylate, trimethylolethane trimethacrylate, trimethylolethane trimethacrylate, trimethylolpropane trimethacrylate (“TMPTMA”), trimethylolpropane trimethacrylate (“TMPTA”), glyceryl triacrylate, pentaerythritol triacrylate, methyl sorbate, ethyl sorbate, propyl sorbate, butyl sorbate and glycidyl sorbate, trimethylolpropane triacrylate; trimethylolpropane trimethacrylate; ethylene glycol dimethacrylate; ethylene glycol diacrylate; diethylene glycol diacrylate; triethylene glycol diacrylate; tetra(ethylene glycol) diacrylate; 1,6-hexanediol diacrylate; 1,6-hexanediol dimethacrylate; neopentyl acrylate Dimethacrylate; neopentyl glycol diacrylate; octadecyl acrylate; butyl acrylate; ethyl acrylate; methyl acrylate; hydroxyethyl acrylate; methyl methacrylate; butyl methacrylate; ethyl methacrylate; glycidyl methacrylate; hydroxyethyl methacrylate; 2-ethylhexyl acrylate; 2-ethylhexyl methacrylate; dodecyl acrylate; isodecanyl acrylate; di(propylene glycol) diacrylate; tri(propylene glycol) diacrylate; lauryl acrylate; alkoxylated lauryl acrylate; cyclohexanediol diacrylate; tridecyl methacrylate; tridecyl acrylate; pentaerythritol triacrylate; pentaerythritol tetraacrylate; dipentaerythritol hexaacrylate; tri(2-hydroxyethyl) isocyanurate triacrylate; dipentaerythritol pentaacrylate; propoxylated (3) glyceryl triacrylate; zinc diacrylate; zinc dimethacrylate; and sorbate.

[0121] In some implementations, the anti-PID agent comprises a monocyclic organosiloxane of formula (I): [R 1 ,R 2 SiO 2 / 2 ] n (I), where the subscript n is an integer greater than or equal to 3; each R 1 H2C = C(R) independently 1a )-C(=O)-O-(CH2) m -, where R 1a It is H or methyl, and the subscript m is an integer from 1 to 4; and each R 2 Independently H, (C1-C20) alkyl, phenyl or R 1 Non-limiting examples of suitable crosslinking aids include, but are not limited to, 2,4,6-trimethyl-2,4,6-trivinylcyclotrisiloxane, "(D Vi)3” (CAS No. 3901-77-7); 2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotritetrasiloxane, “(D Vi )4” (CAS No. 2554-06-5); 2,4,6,8,10-pentavinyl-2,4,6,8,10-pentamethylcyclopentasiloxane (CAS No. 17704-22-2); 1,3,5,7,9-pentamethacrylate-1,3,5,7,9-pentamethylcyclopentasiloxane; or combinations thereof.

[0122] Surprisingly, the inventors of this application have found that these anti-PID agents (such as TMPTMA and TMPTA) can effectively improve the anti-PID properties of the compositions described in WO 2019 / 000744 A1. Unbound by theory, it is believed that the distribution of silane adhesion promoters (e.g., VMMS) in the film is determined by free radical competition between different double bonds from different types of crosslinking aids. The conversion of crosslinking aids from TAIC to monocyclic organosiloxanes (such as VD4) described in WO 2019 / 000744 A1 may result in high localized concentrations of silane adhesion promoters. These regions of higher concentration are considered to be the root cause of power loss due to PID in solar cells fabricated with POE encapsulant films, as they are more capable of transferring ionic matter and reducing the VR of the encapsulant film. Additional anti-PID agents containing Michael acceptor groups (such as acrylates or sorbates) reduce these localized concentrations of silane adhesion promoters by competing with them for free radicals.

[0123] In some embodiments, the ratio of silane adhesion promoter to anti-PID agent is ≥1, ≥2.5, ≥5.0, ≥7.5, or ≥10. In some embodiments, the ratio of silane adhesion promoter to anti-PID agent is ≤50, ≤25, ≤15, ≤10, ≤5, or ≤1.

[0124] (F) Optional additives

[0125] In some embodiments, the compositions of the present invention comprise one or more optional additives. Non-limiting examples of suitable additives include antioxidants, anti-caking agents, stabilizers, colorants, ultraviolet (UV) absorbers or stabilizers, flame retardants, compatibilizers, fillers, hindered amine stabilizers, tree retardants, methyl radical scavengers, scorch inhibitors, nucleating agents, and processing aids.

[0126] In some embodiments, the hindered amine comprises the following structure:

[0127]

[0128] R1 is selected from the group consisting of: hydrogen, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, or cycloyl, alkoxy with oxygen attached to nitrogen, and R2 is selected from the group consisting of: hydrogen, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, or cycloyl, and also includes heteroatoms such as Si, S, N, O.

[0129] In some embodiments, the hindered amine is selected from bis(2,2,6,6,-tetramethyl-4-piperidinyl) sebacate; bis(2,2,6,6,-tetramethyl-4-piperidinyl) dibutyrate 4-acetoxy-2,2,6,6-tetramethylpiperidine; 2,2,6,6-tetramethylpiperidine; 4-hydroxy-2,2,6,6-tetramethylpiperidine; bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate; bis(2,2,6,6-tetramethyl-1-(octoxy)-4-piperidinyl) ester; bis(2,2,6,6-tetramethyl-1-(methoxy)-4-piperidinyl) ester; N,N′-bis(formyl)-N,N′-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexanediamine

[0130] Optional additives are present in amounts greater than 0% by weight, or 0.01% by weight, or 0.02% by weight, or 0.04% by weight, or 0.06% by weight, or 0.08% by weight to 0.1% by weight, or 0.1% by weight to 1% by weight, or 2% by weight, or 3% by weight, or 5% by weight, based on the total weight of the compositions of the present invention.

[0131] Encapsulant film

[0132] In some embodiments, this disclosure relates to an encapsulant film comprising a curable composition comprising: (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a silane adhesion promoter auxiliary comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent. In some embodiments, the curable composition forms the entire encapsulant film.

[0133] In some embodiments, this disclosure relates to an encapsulant film comprising a crosslinked polymer composition comprising reaction products of: (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent. In some embodiments, the crosslinked polymer composition forms the entire encapsulant film.

[0134] In some embodiments, this disclosure relates to a method for forming an encapsulant film comprising a curable composition or a crosslinkable polymer composition. In some embodiments, (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent and any optional additives are premixed and the premix is ​​added to the (A) polyolefin polymer via any method known in the art (e.g., soaking, compounding, etc.) before or during further processing (e.g., compounding, extrusion, molding, etc.). In some embodiments, dried granules of the (A) polyolefin polymer are soaked in the premix (i.e., a curing package consisting of (B) an organic peroxide, (C) a silane adhesion promoter, (D) a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent and any optional additives), and then the soaked granules are further processed (e.g., compounding, extrusion, molding, etc.). In some embodiments, the crosslinked polymer composition and encapsulant film of this disclosure are formed by film extrusion or compression molding.

[0135] In some embodiments, this disclosure relates to a method for forming an encapsulant film, the method comprising (a) impregnating a polyolefin polymer with a premix to form an impregnated polyolefin polymer, wherein the premix comprises an organic peroxide, a silane adhesion promoter, a crosslinking aid comprising a monocyclic organosiloxane of formula (I), and an anti-PID agent. In another embodiment, step (a) is performed at a temperature of 0°C to 100°C (e.g., 5°C to 75°C, 10°C to 50°C, 15°C to 45°C, 20°C to 40°C, etc.). In another embodiment, step (a) is performed for a duration of 0 minutes to 300 minutes (e.g., 0 minutes to 225 minutes, 25 minutes to 200 minutes, 50 minutes to 175 minutes, 60 minutes to 160 minutes, etc.) (i.e., impregnation time).

[0136] In some embodiments, (A) the granules impregnated with the polyolefin polymer are transformed into a film during further processing (e.g., compounding, extrusion, casting, or molding). Therefore, in some embodiments, the method for forming the encapsulant film further includes: (2) curing and further processing the impregnated polyolefin polymer to form the encapsulant film. In this regard, the temperature during further processing of the impregnated polyolefin polymer is above the polymer's Tm and at least 20°C lower than the lamination temperature determined by the peroxide type, for example, 80°C, or 90°C to 100°C, or 105°C, or 110°C, or 115°C, or 120°C, or 125°C, or 130°C, or 140°C, or 150°C, or 160°C, or 170°C.

[0137] In another embodiment, it is desirable to avoid or limit curing until other steps, such as laminating a solar cell with two cover sheets or one cover sheet and a backsheet to prepare a PV module, as discussed below. Premature crosslinking and / or premature decomposition of organic peroxides can lead to reduced glass adhesion of the encapsulant film. In other words, the encapsulant film containing the curable composition remains reactive until lamination, at which point crosslinking is complete and the crosslinked polymer composition of the encapsulant film becomes a reaction product of the polyolefin polymer, organic peroxide, silane adhesion promoter, crosslinking aid containing a monocyclic organosiloxane of formula (I), and anti-PID agent. Therefore, in another embodiment, the method for forming the encapsulant film includes further processing the impregnated polyolefin polymer to form a curable film. Subsequent steps include, but are not limited to, curing the curable film to form the encapsulant film, or curing the curable film during the lamination step to form the encapsulant film.

[0138] Therefore, the temperature for further processing and impregnation of the polyolefin polymer can be below the decomposition temperature of the organic peroxide. In this regard, in some embodiments, the temperature during further processing and impregnation of the polyolefin polymer is 80°C, or 90°C to 100°C, or 110°C, or 120°C.

[0139] Curing as discussed herein can be a free radical curing process by irradiating the composition of the invention with an effective curing dose and / or heating the composition of the invention at a curing effect temperature to form a crosslinked product. The irradiation source can be an electron beam, gamma radiation, ultraviolet light, or any combination thereof. In another embodiment, crosslinking of the composition of the invention occurs without a platinum-based catalyst.

[0140] The encapsulant film disclosed herein can have any thickness.

[0141] In one embodiment, the encapsulant film is a single layer, wherein a single layer is composed of the composition of the present invention. In another embodiment, the encapsulant film has two or more layers, wherein at least one layer is composed of the composition of the present invention.

[0142] electronic devices

[0143] The encapsulant film disclosed herein is used to construct electronic device modules. The encapsulant film serves as one or more "skins" of the electronic device, i.e., applied to one or both surfaces of the electronic device, for example, as a front encapsulant film or a back encapsulant film, or both, for example, in which the device is completely encapsulated within the material.

[0144] In one embodiment, the electronic device module includes (i) at least one electronic device, typically a plurality of such devices arranged in a linear or planar pattern, (ii) at least one cover sheet, and (iii) at least one encapsulant film according to the present disclosure. The encapsulant film is located between the cover sheet and the electronic device, and the encapsulant film exhibits good adhesion to both the electronic device and the cover sheet.

[0145] In one embodiment, the electronic device module includes (i) at least one electronic device, typically a plurality of such devices arranged in a linear or planar pattern, (ii) a front cover sheet, (iii) a front encapsulant film, (iv) a rear encapsulant film, and (v) a backplate, wherein at least one of (iii) the front encapsulant film and (iv) the rear encapsulant film is an encapsulant film of the present disclosure. The electronic device is sandwiched between the front and rear encapsulant films, wherein two cover sheets or one cover sheet and a backplate encapsulate the front encapsulant film / electronic device / rear encapsulant film unit.

[0146] In one embodiment, the cover sheet is glass, acrylic resin, polycarbonate, polyester, or a fluoropolymer. In another embodiment, the cover sheet is glass.

[0147] In one embodiment, the backsheet is a single-layer or multi-layer film made of glass, metal, or polymer resin. In another embodiment, the backsheet is a multi-layer film made of a fluoropolymer layer and a polyethylene terephthalate layer.

[0148] In one implementation, the electronic device is a solar cell or a photovoltaic (PV) cell.

[0149] In one implementation, the electronic device module is a PV module.

[0150] Figure 1 An exemplary PV module is shown. A rigid PV module 10 includes a photovoltaic cell 11 (PV cell 11) surrounded or encapsulated by a front encapsulant film 12a and a rear encapsulant film 12b. A glass cover sheet 13 covers the front surface of the portion of the front encapsulant film 12a disposed on the PV cell 11. A backplate 14, such as a second glass cover sheet or a polymer substrate, supports the rear surface of the portion of the rear encapsulant film 12b disposed on the rear surface of the PV cell 11. The backplate does not need to be transparent if the surface of the PV cell opposite to the backplate 14 is not reactive to sunlight. In this embodiment, the encapsulant films 12a and 12b completely encapsulate the PV cell 11. Figure 1In the illustrated embodiment, the front encapsulant film 12a directly contacts the glass cover sheet 13, and the rear encapsulant film 12b directly contacts the backplate 14. The PV cell 11 is sandwiched between the front encapsulant film 12a and the rear encapsulant film 12b, such that both the front encapsulant film 12a and the rear encapsulant film 12b are in direct contact with the PV cell 11. The front encapsulant film 12a and the rear encapsulant film 12b are also in direct contact with each other in locations where there is no PV cell 11.

[0151] The encapsulant film disclosed herein can be a front encapsulant film, a rear encapsulant film, or both a front encapsulant film and a rear encapsulant film. In one embodiment, the encapsulant film of this disclosure is a front encapsulant film. In another embodiment, the encapsulant film of this disclosure is both a front encapsulant film and a rear encapsulant film.

[0152] The encapsulation film disclosed herein may be a single-layer film comprising (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a silane adhesion promoter auxiliary comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent. Alternatively, it may be a co-extruded film comprising at least one layer comprising (A) a polyolefin polymer, (B) an organic peroxide, (C) a silane adhesion promoter, (D) a silane adhesion promoter auxiliary comprising a monocyclic organosiloxane of formula (I), and (E) an anti-PID agent.

[0153] In one embodiment, the encapsulant film of this disclosure is applied to an electronic device using one or more lamination techniques. Through lamination, a cover sheet is brought into direct contact with a first facet surface of the encapsulant film, and the electronic device is brought into direct contact with a second facet surface of the encapsulant film. The cover sheet is brought into direct contact with the first facet surface of the front encapsulant film, the backplate is brought into direct contact with the second facet surface of the rear encapsulant film, and the electronic device is positioned between and in direct contact with the second facet surface of the front encapsulant film and the first facet surface of the rear encapsulant film.

[0154] In one embodiment, the lamination temperature is sufficient to activate the organic peroxide and crosslink the composition, i.e., a curable composition comprising a polyolefin polymer, an organic peroxide, a silane adhesion promoter, a crosslinking aid, and an anti-PID agent. During crosslinking, chemical bonds between two or more molecular chains of the polyolefin polymer are formed via silane bonds. A "silane bond" has the structure -Si-O-Si-. Each silane bond can connect two or more, or three or more, molecular chains of the polyolefin polymer. The silane adhesion promoter also interacts with the surface of the cover sheet to increase the adhesion between the encapsulant film and the cover sheet. After lamination, the composition is a reaction product of the polyolefin polymer, the organic peroxide, the silane adhesion promoter, the crosslinking aid, and the anti-PID agent.

[0155] In one embodiment, the lamination temperature for manufacturing the electronic device is 130°C, or 135°C, or 140°C, or 145°C to 150°C, or 155°C, or 160°C. In one embodiment, the lamination time is 8 minutes, or 10 minutes, or 12 minutes, or 15 minutes to 18 minutes, or 20 minutes, or 22 minutes, or 25 minutes.

[0156] definition

[0157] Any reference to the periodic table is as in the version published by CRC Press, Inc. in 1990-1991. A group of elements in the table is referred to using a new notation for numbering the groups.

[0158] For the purposes of U.S. patent practice, any reference to the contents of a patent, patent application, or publication, particularly disclosures relating to the definitions (limited to not being inconsistent with any definition specifically provided in this disclosure) and general knowledge in the art, is incorporated, in its entirety, by reference (or its equivalent U.S. version thereof).

[0159] The numerical ranges disclosed herein include all values ​​from the lower limit to the upper limit, and include both the lower limit and the upper limit. For ranges containing exact values ​​(e.g., 1, or 2, or 3 to 5, or 6, or 7), any subranges between any two exact values ​​are included (e.g., 1 to 2; 2 to 6; 5 to 7; 3 to 7; 5 to 6, etc.).

[0160] Unless stated to the contrary, implied by the context, or as is customary in the art, all parts and percentages are based on weight, and all test methods are current methods as of the date of this disclosure.

[0161] Unless stated to the contrary, all test methods are current methods as of the date of this disclosure.

[0162] The terms "blend" and "polymer blend" mean a composition of two or more polymers. Such blends may or may not be miscible. Such blends may or may not be phase-separated. Such blends may or may not contain one or more domain configurations, as determined by transmission electron spectroscopy, light scattering, X-ray scattering, and any other method for measuring and / or identifying domain configurations. Blends are not laminates, but one or more layers of a laminate may contain blends.

[0163] As used herein, “composition” includes mixtures of materials constituting the composition, as well as reaction products and decomposition products formed from the materials of the composition.

[0164] The terms “comprising,” “including,” “having,” and their derivatives are not intended to exclude the presence of any additional components, steps, or procedures, whether or not such components, steps, or procedures are specifically disclosed. For the avoidance of any doubt, unless stated otherwise, all compositions claimed using the term “comprising” may include any additional additives, adjuvants, or compounds, whether polymerized or otherwise. In contrast, the term “consistently comprising” excludes any other components, steps, or procedures from any subsequently listed scope, except those that are not essential for operability. The term “consisting of” does not include any components, steps, or procedures not specifically listed. Unless otherwise stated, the term “or” refers to the listed members individually and in any combination. Use of the singular includes use of the plural, and vice versa.

[0165] The term "anti-PID" refers to a composition that resists potential-induced decay or PID.

[0166] "Direct contact" refers to a layer configuration where the first layer is positioned immediately adjacent to the second layer, and there are no intermediate layers or structures between the first and second layers.

[0167] The term "coagent" refers to a compound that enhances crosslinking, i.e., a curing aid. The terms "coagent," "co-agent," "crosslinking coagent," and "crosslinking co-agent" are used interchangeably herein. A "conventional coagent" is an acyclic or cyclic compound that enhances crosslinking and contains carbon atoms in its respective main chain or cyclic substructure. Therefore, the main chain or cyclic substructure of a conventional coagent is based on carbon (a carbon-based substructure). Conversely, a silicon-based coagent refers to an acyclic or cyclic compound that enhances crosslinking and contains silicon atoms in its respective main chain or cyclic substructure. The monocyclic organosiloxane of formula (I) is a cyclic silicon-based coagent. The use of conventional coagents in POE-based compositions is representative of the prior art.

[0168] The terms “curing” and “crosslinking” are used interchangeably in this document, referring to the formation of crosslinked products (network polymers) without ring-opening polymerization.

[0169] As used herein, “polymer” refers to a polymeric compound prepared by polymerizing monomers of the same or different types. Therefore, the general term polymer encompasses the terms homopolymer (used to refer to a polymer prepared from only one type of monomer, where it should be understood that trace impurities may be incorporated into the polymer structure) and interpolymer, as defined herein. Trace impurities (e.g., catalyst residues) may be incorporated into and / or within the polymer.

[0170] As used herein, “interpolymer” refers to a polymer prepared by polymerizing at least two different types of monomers. The general term interpolymer therefore includes copolymers (used to refer to polymers prepared from two different types of monomers) and polymers prepared from more than two different types of monomers.

[0171] "Propylene-based," "propylene-based polymer," "polypropylene," and similar terms refer to polymers containing 50% by weight (wt%) to 100% by weight of polymerizable propylene monomers (based on the total amount of polymerizable monomers) and optionally containing at least one comonomer. These terms include propylene homopolymers and propylene interpolymers (meaning units derived from propylene and one or more comonomers, such as propylene / α-olefin interpolymers).

[0172] "Ethylene-based," "ethylene-based polymer," "polyethylene," and similar terms are polymers containing 50% to 100% by weight of polymerizable ethylene monomers (based on the total amount of polymerizable monomers) and optionally containing at least one comonomer. These terms include ethylene homopolymers and ethylene interpolymers (meaning units derived from ethylene and one or more comonomers, such as ethylene / α-olefin interpolymers).

[0173] As used herein, "α-olefin" refers to a hydrocarbon molecule with an olefinic unsaturation at the primary (α) position. For example, as used herein, "(C3-C 20 "α-olefins" are hydrocarbon molecules comprising (i) only one degree of olefinic unsaturation (located between the first and second carbon atoms) and (ii) at least three carbon atoms, or hydrocarbon molecules consisting of three to twenty carbon atoms. For example, (C3-C) as used herein. 20 α-Alkenes refer to H₂C=C(H)-R, where R is a straight-chain (C₁-C₂) olefin. 18 )alkyl group. (C1-C 18 The alkyl group is a monovalent, unsubstituted saturated hydrocarbon having 1 to 18 carbon atoms. Non-limiting examples of R are methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecanyl, and octadecyl. (C3-C) 20 Non-limiting examples of α-olefins include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-dodecene, and mixtures of two or more of these monomers. (C3-C) 20 α-olefins can have cyclic structures, such as cyclohexane or cyclopentane, producing α-olefins such as 3-cyclohexyl-1-propene (allylcyclohexane) and vinylcyclohexane. (C3-C) 20α-olefins can be used as comonomers together with ethylene monomers.

[0174] The term "polymer containing ethylene" refers to a macromolecule containing repeating units derived from H2C=CH2.

[0175] "Polyolefin elastomer" or "POE" refers to an elastomeric polymer containing 50% by weight or more of a polymeric α-olefin monomer (including ethylene). "Polyolefin elastomer" includes, but is not limited to, ethylene-based polymers and propylene-based polymers as described herein. As used herein, the term "polyolefin elastomer" does not include ethylene-vinyl acetate (EVA) copolymers.

[0176] "Nonpolar polymer" and similar terms refer to polymers that do not have a permanent dipole, i.e., polymers that do not have positive and negative ends and do not contain heteroatoms and functional groups. "Functional group" and similar terms refer to the atomic part or group responsible for causing a particular compound to undergo its characteristic reaction. Non-limiting examples of functional groups include heteroatom-containing parts, oxygen-containing parts (e.g., alcohol, aldehyde, ester, ether, ketone, and peroxide groups), and nitrogen-containing parts (e.g., amide, amine, azo, imide, imine, nitrate, nitrile, and nitrite groups). A "heteroatom" is an atom other than carbon or hydrogen.

[0177] The terms "photovoltaic cell," "PV cell," and similar terms refer to a structure containing one or more of a variety of inorganic or organic photovoltaic materials known in the art. For example, commonly used photovoltaic materials include one or more known photovoltaic materials, including but not limited to crystalline silicon, polycrystalline silicon, amorphous silicon, (ii) copper indium gallium selenide (CIGS), copper indium selenide (CIS), cadmium telluride, gallium arsenide, dye-sensitized materials, and organic solar cell materials. Figure 1 As shown, PV cells typically employ a laminated structure and have at least one photo-reactive surface that converts incident light into electric current. Photovoltaic cells are well-known to those skilled in the art and are often encapsulated within photovoltaic modules to protect the cells and allow them to be used in their various application environments, typically outdoor applications. PV cells can be flexible or rigid in nature and include photovoltaic effect materials and any protective coating surface materials applied in their production, along with appropriate wiring and electronic drive circuitry.

[0178] "Photovoltaic module," "PV module," and similar terms refer to a structure that includes PV cells. A PV module may also include a cover sheet, a front encapsulant film, a rear encapsulant film, and a backsheet, wherein the PV cells are sandwiched between the front encapsulant film and the rear encapsulant film.

[0179] "Room temperature" refers to the temperature range of approximately 20°C to approximately 25°C.

[0180] "Further processing," "further processed," and similar terms refer to manufacturing process steps of polyolefins, including but not limited to compounding, blending, melt blending, extrusion (e.g., film extrusion), kneading, absorption, injection molding, and molding (e.g., injection molding, compression molding, blow molding, etc.). Non-limiting examples of suitable compounding equipment include internal batch mixers (e.g., BANBURY and BOLLING internal mixers) and continuous single-screw or twin-screw mixers (e.g., FARREL continuous mixers, BRABENDER single-screw mixers, WERNER and PFLEIDERER twin-screw mixers, and BUSS kneading continuous extruders). The type of mixer used and the operating conditions of the mixer can affect the properties of the composition, such as viscosity, volume resistivity, and the surface smoothness of the extrusion.

[0181] Volume resistivity is defined as the ratio of DC voltage to current passing between two electrodes (with a specified configuration) on opposite sides of the material of an object during a contact test. Volume resistivity is reported in ohms.

[0182] Volume resistivity is defined as the ratio of the DC voltage drop per unit thickness to the current flowing through a unit area of ​​the material. Volume resistivity indicates how easily a material conducts electricity through its bulk. Volume resistivity is expressed in ohm-cm (Ω-cm).

[0183] Some embodiments of this disclosure will now be described in detail in the following examples.

[0184] Example

[0185] Test methods

[0186] Density was measured according to ASTM D792. Results are expressed in grams (g) per cubic centimeter (g / cc or g / cm³). 3 )Record.

[0187] The glass transition temperature (Tg) is measured according to ASTM D7028.

[0188] Melt flow index (MI) is measured according to ASTM D1238 at 190°C and 2.16 kg and reported in grams per 10 minutes (g / 10min).

[0189] Melting point was measured according to ASTM D3418.

[0190] Module-level PID testing is performed according to the procedures described in IEC 62804-1.

[0191] The initial power output of the module samples was recorded using a pulsed solar simulator (Burger PS8 / PSS8) with the procedure described in IEC 60904. The PID stress process was conducted in an environmental chamber at 85°C / 85%RH. The module samples were connected to a power source to generate a typical negative bias voltage of 1500V. The standard test lasted 96 hours. After the stress process, the power output of all module samples was retested. The results were compared with the initial measurements to further calculate power loss.

[0192] The IEC standard for power loss after 96 hours of PID testing is less than 5% for both the front and back sides of the PV module.

[0193] Material

[0194] The following materials were used to prepare the embodiments of this disclosure.

[0195] POE: Ethylene / octene copolymer, density 0.873 g / cc (ASTM D782) and melt flow index 14.0 g / 10 min (ASTM D1238, at 190°C / 2.16 kg), available from Dow Chemical Company. Measured volume resistivity (VR).

[0196] TBEC: tert-butylperoxy-2-ethylhexyl carbonate, a peroxide available from J&K Scientific Ltd.

[0197] TAEC: Tert-amyl peroxy-2-ethylhexyl carbonate, Lanzhou Additives.

[0198] TAIC: Triallyl isocyanurate, available from Farida Chemicals Co., Ltd., has the following structure:

[0199]

[0200] TAC: Triallyl cyanurate, available from Sinopharm.

[0201] Vinyl-D4: 2,4,6,8-Tetramethyl-2,4,6,8-tetravinyl-cyclotetrasiloxane, an auxiliary agent purchased from Alfa Aser, and having the following structure:

[0202]

[0203] VMMS: 3-(trimethoxysilyl)propyl methacrylate, a silane coupling agent available from Dow Chemical Company.

[0204] VTMS: Vinyltrimethoxysilane, a silane coupling agent available from Dow Chemical Company.

[0205] ATM: 3-(trimethoxysilyl)propyl acrylate, a silane coupling agent available from Dow Chemical Company.

[0206] TMPTA: Trimethylolpropane triacrylate, commercially available from Fangruida.

[0207] TMPTMA: Trimethylolpropane trimethacrylate, commercially available from Fangruida.

[0208] AMSD: α-methylstyrene dimer (2,4-diphenyl-4-methyl-1-pentene), commercially available from Wuxi Zhiyuan Chemical Company.

[0209] Ethyl sorbate is commercially available from Sinopharm Group.

[0210] Butyl acrylate (“BA”) is commercially available from Sinopharm Group.

[0211] Tinuvin 770 (T770), bis(2,2,6,6,-tetramethyl-4-piperidinyl) sebacate, is commercially available from BASF.

[0212] P-type bifacial PERC solar cells are available from the market.

[0213] Sample preparation

[0214] soak The compositions were prepared according to the formulations in Tables 1 and 2 below by first premixing polymer granules with curing additives (peroxide, crosslinking aid, and silane coupling agent) in a fluorinated HDPE bottle. The soaking process was carried out by shaking and absorbed at 50°C for 5 hours until no liquid residue was visible to the naked eye adhering to the bottle.

[0215] Compression molding After soaking, the soaked granules are compressed using an embossing mold to prepare a film with a thickness of 0.5 mm. Compression molding is performed using a hydraulic press. The composition is preheated at 95°C without pressure for 3.5 minutes, followed by degassing and filling. Subsequently, the composition is pressed at 95°C at 10 MPa for 2.5 minutes. Finally, the temperature is cooled to room temperature under 10 MPa pressure for 3.5 minutes.

[0216] laminatedGlass slides were cut into 4×6 square inch specimens, cleaned with water, and then dried before use. The P-type bifacial PERC cell, two encapsulant films, and two glass specimens were then stacked together and laminated using a PENERGY L036 laminator. The samples were laminated under the following conditions: 150°C for 20 minutes (4 minutes of vacuum process and 16 minutes of pressing to crosslink the encapsulant films). The laminated samples were used for glass adhesion testing. Two identical single-cell module samples were prepared for PID testing to obtain an average value.

[0217] The PV glass and P-type PERC bifacial cells used in these embodiments are commercially available.

[0218] formula

[0219] Table 1

[0220]

[0221] Table 2

[0222] CE-6 CE-7 IE-9 CE-8 CE-9 IE-11 IE-12 IE-13 IE-14 PV8669 98.6 98.53 98.49 98.5 98.7 98.3 98.4 98.5 98.3 TBEC 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 VD4 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 TAC TAIC Ethyl sorbate 0.04 BA 0.2 TMPTA 0.1 0.1 TMPTMA 0.2 ATM 0.1 0.1 0.1 VTMS 0.2 VMMS 0.2 0.2 0.1 0.2 T770 0.07 0.07 total 100 100 100 100 100 100 100 100 100

[0223] result

[0224] Table 3

[0225]

[0226] As shown in Table 3, the comparison between CE-1 and IE-1 shows that TMPTA significantly improves anti-PID performance, with power loss after 96 hours of PID testing decreasing from about 9% on the back side and 3.2% on the front side to less than 0.5%.

[0227] Comparisons of CE-2 and CE-3 with IE-2 through IE-5 also demonstrate a significant improvement in anti-PID performance in the presence of TMPTA. However, CE-4 shows that low loads of TMPTA (e.g., VMMS / TMPTA = 10) do not reduce power losses to below 5% compared to VMMS. Furthermore, IE-8 indicates that TMPTMA further improves anti-PID performance compared to CE-2. CE-5 shows that AMSD does not exhibit anti-PID performance.

[0228] Table 4

[0229] CE-6 CE-7 IE-9 CE-8 CE-9 IE-11 IE-12 IE-13 IE-14 Positive power loss, % 3.57 3.29 0.38 2.57 0.40 0.49 0.44 0.27 0.66 Standard deviation, % 2.59 0.20 0.01 0.23 0.05 0.49 0.60 0.17 0.88 Power loss on the back, % 10.08 9.93 1.40 5.49 0.44 1.65 2.06 0.46 2.29 Standard deviation, % 6.45 1.46 0.72 0.33 0.08 1.81 1.63 0.51 1.56

[0230] As shown in Table 4, ethyl sorbate also significantly reduced PID loss (e.g., CE-6 / CE-7 and IE-9). Furthermore, CE-9 in Table 4 indicates that VD4 itself does not cause PID loss in the absence of silane adhesion promoters.

[0231] Finally, IE-15 and IE-16 demonstrate that very low PID loss was achieved via TMPTA in the presence of conventional adjuvants such as TAIC and TAC.

[0232] In summary, compounds based on sorbate and acrylate reduced power loss after PID testing.

Claims

1. A curable composition for forming an encapsulant film, wherein the composition comprises: A) Polyolefin polymers; B) Organic peroxides; C) Silane adhesion promoters; and D) Crosslinking aid, namely the monocyclic organosiloxane of formula (I): [R 1 ,R 2 SiO 2 / 2 ] n (I), where the subscript n is an integer greater than or equal to 3; each R 1 Independently for (C2-C) 20 alkenyl groups and combinations thereof; and E) An anti-PID agent, said anti-PID agent comprising at least one structure of formula (II): R1, R2 and R3 are each independently H, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, or cycloyl, or heteroalkyl, or heteroalkenyl.

2. The curable composition according to claim 1, wherein the polyolefin polymer further comprises an ethylene / α-olefin copolymer, the ethylene / α-olefin copolymer having a volume resistivity (VR) greater than 1.0 × 10⁻⁶ at 23°C. 14 Ω-cm, density is 0.85 g / cm³ 3 Up to 0.92 g / cm 3 The MI at 190℃ ranges from 1 g / 10 min to 50 g / 10 min.

3. The curable composition according to any one of claims 1 or 2, wherein the peroxide is selected from the group consisting of: isopropyl percarbonate; tert-butylperoxy-2-ethylhexyl carbonate; tert-amylperoxy-2-ethylhexyl carbonate, tert-butylperoxyisopropyl carbonate; tert-butyl peroxy-3,5,5-trimethylhexanoate; 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane; 1,1-di(tert-butylperoxy)cyclohexane; 1,1-di(tert-amylperoxy)cyclohexane; dicumyl peroxide; di-tert-amyl peroxide ("DTAP"); bis(α-tert-butylperoxyisopropyl)benzene; and combinations thereof.

4. The curable composition according to any one of claims 1 to 3, wherein the crosslinking aid is selected from the group consisting of: 2,4,6-trimethyl-2,4,6-trivinyl-cyclotrisiloxane; 2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotetrasiloxane; 2,4,6,8,10-pentavinyl-2,4,6,8,10-pentamethylcyclopentasiloxane; 1,3,5,7,9-pentamethacrylate-1,3,5,7,9-pentamethylcyclopentasiloxane; or combinations thereof.

5. The curable composition according to any one of claims 1 to 4, wherein the anti-PID agent is selected from the group consisting of: trimethylolpropane trimethacrylate, trimethylolpropane trimethacrylate, trimethylolpropane trimethacrylate; trimethylolpropane trimethacrylate; ethylene glycol dimethacrylate; ethylene glycol dimethacrylate; diethylene glycol dimethacrylate; triethylene glycol dimethacrylate; tetra(ethylene glycol) dimethacrylate; 1,6-hexanediol diacrylate; 1,6-hexanediol dimethacrylate; neopentyl glycol dimethacrylate; neopentyl glycol dimethacrylate; octadecyl acrylate; butyl acrylate; ethyl acrylate; methyl acrylate; hydroxyethyl acrylate; methyl methacrylate; butyl methacrylate; methacrylate Ethyl methacrylate; glycidyl methacrylate; hydroxyethyl methacrylate; 2-ethylhexyl acrylate; 2-ethylhexyl methacrylate; dodecyl acrylate; isodecanyl acrylate; di(propylene glycol) diacrylate; tri(propylene glycol) diacrylate; lauryl acrylate; alkoxylated lauryl acrylate; cyclohexanediol diacrylate; tridecyl methacrylate; tridecyl acrylate; pentaerythritol triacrylate; pentaerythritol tetraacrylate; dipentaerythritol hexaacrylate; tri(2-hydroxyethyl) isocyanurate triacrylate; dipentaerythritol pentaacrylate; propoxylated (3) glyceryl triacrylate; zinc diacrylate; zinc dimethacrylate; esters of sorbic acid, such as ethyl sorbate; monocyclic organosiloxanes of formula (I): [R 1 ,R 2 SiO 2 / 2 ] n (I), where the subscript n is an integer greater than or equal to 3; each R 1 H2C = C(R) independently 1a )-C(=O)-O-(CH2) m -, where R 1a It is H or methyl, and the subscript m is an integer from 1 to 4; and each R 2 Independently for H, (C1-C 20 )alkyl, phenyl or R 1 ; and their combinations.

6. The composition according to any one of claims 1 to 5, wherein the composition further comprises: A) 85% to 99.5% by weight of the polyolefin polymer; B) 0.01% to 2% by weight of the organic peroxide; C) 0.01% to 1% by weight of the silane adhesive accelerator; D) 0.01% to 5% by weight of the silane crosslinking aid; and E) 0.001% to 1% by weight of the anti-PID agent.

7. The composition according to any one of claims 1 to 6, wherein the anti-PID agent comprising formula II in the anti-PID agent is further described by any one of limitations (i) to (ii): (i) R1 is H, methyl, ethyl, propyl, or butyl; and (ii) R3 is H, methyl, ethyl, propyl, butyl, vinyl, or a substituted vinyl group. R2 further comprises an alkyl acrylate or an alkyl polyacrylate, such as that of formula (III): R1 and R3 are each independently H, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, or cycloyl, or heteroalkyl, or heteroalkenyl. R' is selected from C1-C30 alkylene groups; Y selects from the following groups: CR 4-n Where n = 1 to 4; OR 2-n , where n = 1 to 2; NR 3-n , where n = 1 to 3; SR 2-n , where n = 1 to 2; PR 3-n , where n = 1 to 3; PR 5-n Where n = 1 to 5; SiR 4-n , where n = 1 to 4; a bifunctional CC core, a phenyl core, an ester-substituted phenyl core, an amide-substituted phenyl core, a triisocyanurate core, a melamine core, or a combination thereof.

8. The composition according to any one of claims 1 to 6, wherein the anti-PID agent is selected from the group consisting of: methyl acrylate, ethyl acrylate, butyl acrylate, cyclopropyl acrylate, ethyl methacrylate, methyl methacrylate, bisphenol A-glycidyl methacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, trimethylolethane trimethacrylate, trimethylolethane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, glyceryl triacrylate, pentaerythritol triacrylate, and combinations thereof.

9. An encapsulant film comprising a crosslinked polymer composition, the crosslinked polymer composition comprising a reaction product of the following substances: A) Polyolefin polymers; B) Organic peroxides; C) Silane adhesion promoters; and D) Crosslinking aid, namely the monocyclic organosiloxane of formula (I): [R 1 ,R 2 SiO 2 / 2 ] n (I), where the subscript n is an integer greater than or equal to 3; each R 1 Independently for (C2-C) 20 alkenyl groups and combinations thereof; and E) An anti-PID agent, said anti-PID agent comprising at least one structure of formula (II): R1, R2 and R3 are each independently H, methyl, alkyl, alkenyl, straight-chain or branched alkyl or alkenyl, or cycloyl, or heteroalkyl, or heteroalkenyl.

10. The encapsulant film of claim 10, wherein the encapsulant film comprises a crosslinked polymer composition, the crosslinked polymer composition comprising a reaction product of the following substances: A) 85% to 99.5% by weight of the polyolefin polymer; B) 0.01% to 2% by weight of the organic peroxide; C) 0.01% to 1% by weight of the silane adhesive accelerator; D) 0.01% to 5% by weight of the crosslinking aid; and E) 0.001% to 1% by weight of the anti-PID agent.

11. The encapsulant film according to claim 10 or 11, wherein the polyolefin polymer is an ethylene / α-olefin copolymer having a density of 0.850 g / cc to 0.890 g / cc (ASTM D792) and a melt index of 1.0 g / 10 min to 50.0 g / 10 min (ASTM D1238, at 190°C / 2.16 kg).

12. The encapsulant film according to any one of claims 10 to 12, wherein the anti-PID agent is selected from the group consisting of: methyl acrylate, ethyl acrylate, butyl acrylate, cyclopropyl acrylate, ethyl methacrylate, methyl methacrylate, bisphenol A-glycidyl methacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, trimethylolethane trimethacrylate, trimethylolethane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, glycerol triacrylate, pentaerythritol triacrylate, and combinations thereof.

13. A multilayer encapsulation film comprising at least one layer formed of the composition according to claims 1 to 9.

14. The encapsulant film according to any one of claims 10 to 13, wherein the power loss of the encapsulant film after the PID on the front and back sides is less than 5%.

15. An electronic device module, the electronic device module comprising: A) Electronic devices B) Cover sheet, and C) The encapsulant film according to any one of claims 10 to 14.

16. The electronic device of claim 15, wherein the electronic device is derived from p-type double-sided PERC (passivated emitter and back cell) and n-type TOPCon (tunneling oxide passivated contact).

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