IGBT (Insulated Gate Bipolar Translator) module packaging equipment based on fusion welding and bubble control method

Abstract

The invention discloses IGBT module packaging equipment based on fusion welding and a bubble control method, and relates to the technical field of IGBT machining, the IGBT module packaging equipment comprises a dispensing assembly mounted on a machine body, the machine body is connected with a mounting cover, a guide plate is rotatably connected in the mounting cover, the machine body is provided with an upper limiting plate, and a side limiting plate is slidably connected with a supporting rod; the device has the advantages that the side faces of the IGBT module are limited through the two side limiting plates, the upper surface of the IGBT module can be limited through the arrangement of the upper limiting plate, the IGBT module before entering the dispensing assembly is limited, the phenomenon that the IGBT module turns over and inclines before entering the working range of the dispensing assembly, and then dispensing fails can be prevented, and the working efficiency of the dispensing assembly is improved. And the angle of the guide plate is changed, the direction of hot air sprayed out of the air outlet pipe is changed, the phenomenon of unsoldering caused by local uneven heating and local excessive heating is avoided, and the reliability of the device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of IGBT processing, in particular to an IGBT module packaging device based on fusion welding and a bubble control method. BACKGROUND

[0002] The IGBT based on fusion welding is obtained by heating solder (such as nano-silver paste, tin-lead alloy, etc.) to a molten state to realize metallurgical bonding between a chip and a substrate and other key components.

[0003] In the prior art, the applicant has found, through retrieval, a packaging device for nano-silver paste IGBT processing with the application number 202221839631.9, which specifically relates to the technical field of nano-silver paste IGBT processing and comprises a base frame, a feeding mechanism fixedly installed at the top end of the base frame, a plurality of IGBT module housings provided on the feeding mechanism, a point gluing assembly fixedly installed at one side of the top end of the feeding mechanism, a drying assembly fixedly installed at the side of the top end of the feeding mechanism away from the point gluing assembly, and the point gluing assembly comprising a point gluing support in an L-shaped structure, a linear electric cylinder fixedly clamped to the inner upper wall of the point gluing support, a lifting rod fixedly installed at the driving end of the linear electric cylinder, and a mounting seat fixedly installed at the driving end of the lifting rod. The application improves the point gluing efficiency of the IGBT module housing by setting the point gluing assembly, cooperating with the feeding mechanism to automatically transport the plurality of IGBT module housings, and automatically point gluing the IGBT module housing, so as to facilitate the subsequent packaging of the IGBT module.

[0004] However, when the IGBT module is placed on the conveying mechanism, the IGBT module may be offset, overturned and tilted due to vibration, which may cause subsequent point gluing failure. Therefore, the application provides an IGBT module packaging device based on fusion welding. SUMMARY

[0005] The application aims to provide an IGBT module packaging device based on fusion welding and a bubble control method.

[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme: an IGBT module packaging device based on fusion welding, comprising a point gluing assembly installed on a machine body, a mounting cover connected to the machine body, a guide plate rotatably connected in the mounting cover, and an air outlet pipe connected to the guide plate.

[0007] The body is provided with an upper limiting plate, a moving plate and a side limiting plate, the body is connected with a supporting rod and a limiting rod, the body is rotationally connected with a side rotating mechanism, the side rotating mechanism is threadedly connected with the upper limiting plate, the upper limiting plate is slidably connected with the limiting rod on the side, the upper limiting plate is rotationally connected with a worm, the worm is meshed with a worm wheel on the side, the worm wheel is connected with a screw rod on the side, and the screw rod is threadedly connected with the moving plate.

[0008] The side limiting plate is slidably connected with the supporting rod, a limiting groove is formed in the side of the side limiting plate, and a limiting block is arranged in the limiting groove.

[0009] As a further scheme of the present application, the mounting cover is provided with a connecting hose, the mounting cover is connected with a heat-conducting frame, a heating rod is arranged in the heat-conducting frame, and a fan is arranged on the heat-conducting frame.

[0010] As a further scheme of the present application, the mounting cover is provided with a connecting hose, the mounting cover is connected with a heat-conducting frame, a heating rod is arranged in the heat-conducting frame, and a fan is arranged on the heat-conducting frame.

[0011] As a further scheme of the present application, the heat-conducting frame is connected with a connecting pipe on the side, and the connecting pipe is connected with the connecting hose in the mounting cover.

[0012] As a further scheme of the present application, the connecting hose is connected with the air outlet pipe at the other end.

[0013] As a further scheme of the present application, the screw rod is fixedly connected with a circular plate at the other end, and the circular plate is in a circular plate structure.

[0014] As a further scheme of the present application, the limiting block is in an "L" plate structure, the limiting block slides along the limiting groove, and the limiting groove is in an "L" groove structure.

[0015] As a further scheme of the present application, a IGBT module packaging bubble control method based on fusion welding comprises the following steps:

[0016] S1, preheating and degassing: the air in the heat-conducting frame is heated to 120-150 DEG C by the heating rod, the fan is started to make hot air blow out from the air outlet pipe through the connecting pipe and the connecting hose, the servo motor drives the guide plate to rotate to 45 DEG with the surface of the IGBT module, the module welding area is preheated for 30-60s, and the volatile gas remaining in the solder is discharged by the hot air flow;

[0017] S2, glue dispensing temperature control: when the glue dispensing assembly is working, the hot air temperature of the air outlet pipe is kept at 180-200 DEG C, the air flow direction is covered by the guide plate to cover the glue dispensing area, so that the solder is kept in a molten state (viscosity 300-500 cP) during glue dispensing, and the bubble wrapping caused by sudden temperature drop is reduced.

[0018] S3, gradient curing: after glue dispensing is completed, the heating rod is controlled to gradually reduce the hot air temperature (temperature drop rate 5-10 DEG C / min), and the servo motor drives the guide plate to reciprocate (angle range 30-60 DEG), so that the hot air uniformly acts on the surface of the solder, promotes the bubble to float and escape, and the curing is completed until the temperature drops to below 80 DEG C.

[0019] As a further scheme of the application: in S1, the air speed of the hot air is controlled to be 2-3 m / s, the IGBT module is limited by the side limiting plate and the upper limiting plate, and the distance between the module and the air outlet pipe is kept at 50-80 mm, and the temperature difference on the surface of the module during preheating is ≤5 DEG C.

[0020] As a further scheme of the application: in S2, the glue dispensing pressure of the glue dispensing assembly is 0.2-0.3 MPa, the glue dispensing speed is linked with the hot air flow (flow ratio 1:1.5); when bubbles appear on the surface of the solder (through image recognition), the servo motor drives the guide plate to focus the hot air on the bubble area, and the local temperature is raised to 220-230 DEG C for 5-10 s, so as to promote the bubble to break and discharge.

[0021] Compared with the prior art, the application has the following advantages:

[0022] 1、The IGBT module is limited by the two side limiting plates, and the upper surface of the IGBT module is limited by the upper limiting plate, so that the IGBT module is prevented from tilting before entering the glue dispensing assembly, and the phenomenon of glue dispensing failure caused by tilting is avoided, and the reliability of the device is improved.

[0023] 2、The air in the heat conduction frame is heated by the heating rod, the air is discharged into the heat conduction frame by starting the fan, the hot air flows into the connecting hose through the connecting pipe, the hole is opened on the air outlet pipe, the servo motor is started to drive the guide plate to change the angle, the direction of the hot air sprayed by the air outlet pipe is changed, the IGBT module can be uniformly dried and heated, the phenomenon of local overheating and delamination is avoided, and the reliability of the device is improved.

[0024] Other advantages, objectives and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from an examination of the following, or may be learned from the practice of the invention. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the device in an embodiment of the present invention;

[0026] Figure 2 This is a schematic cross-sectional view of a partial structure of the device in an embodiment of the present invention;

[0027] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle;

[0028] Figure 4 for Figure 2 Enlarged structural diagram at point B;

[0029] Figure 5 This is a schematic diagram of the device structure in an embodiment of the present invention.

[0030] In the diagram: 1. Body; 2. Dispensing assembly; 3. Mounting cover; 4. Heat-conducting frame; 5. Heating rod; 6. Fan; 7. Connecting pipe; 8. Connecting hose; 9. Air outlet pipe; 10. Guide plate; 11. Servo motor; 12. Limiting rod; 13. Side rotation mechanism; 14. Upper limit plate; 15. Worm gear; 16. Worm wheel; 17. Screw; 18. Moving plate; 19. Limiting block; 20. Side limiting plate; 21. Limiting groove; 22. Support rod; 23. Circular plate. Detailed Implementation

[0031] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that the description of these embodiments is for the purpose of helping to understand the present invention, but does not constitute a limitation of the present invention.

[0032] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] Please see the appendix Figure 1 - Appendix Figure 5This invention relates to an IGBT module packaging device based on fusion welding, comprising a dispensing assembly 2 mounted on a body 1, a mounting cover 3 connected to the body 1, a guide plate 10 rotatably connected inside the mounting cover 3, an exhaust pipe 9 connected to the guide plate 10, an upper limit plate 14, a moving plate 18, and a side limit plate 20 mounted on the body 1, a support rod 22 and a limit rod 12 connected to the body 1, a side rotation mechanism 13 rotatably connected to the body 1, the side rotation mechanism 13 being threadedly connected to the upper limit plate 14, a limit rod 12 slidably connected to the side of the upper limit plate 14, a worm gear 15 rotatably connected to the upper limit plate 14, the side of the worm gear 15 meshing with a worm wheel 16, a screw 17 connected to the side of the worm wheel 16, the screw 17 being threadedly connected to the moving plate 18, the side limit plate 20 being slidably connected to the support rod 22, a limit groove 21 formed on the side of the side limit plate 20, a limit block 19 disposed within the limit groove 21, and the other end of the limit block 19 being connected to the moving plate. 18. Side connection: In specific use, by rotating the worm gear 15, the worm gear 15 meshes with the worm wheel 16 for transmission. The screws 17 fixedly connected to both sides of the worm wheel 16 have opposite thread directions. By rotating the worm wheel 16, the screws 17 rotate along the threaded holes on the movable plate 18, causing the two side limiting plates 20 to move closer or further apart along the support rod 22. This changes the distance between the two side limiting plates 20, limiting the side of the IGBT module. Personnel can rotate the side rotation mechanism 13, causing it to rotate along the threaded holes on the upper limit plate 14. This allows the upper limit plate 14 to slide up and down along the limiting rod 12. By setting the upper limit plate 14, the upper surface of the IGBT module can be limited, thus limiting the IGBT module before it enters the dispensing assembly 2. This prevents the IGBT module from flipping or tilting before entering the working range of the dispensing assembly 2.

[0034] In the first embodiment, the other end of the screw 17 is fixedly connected to the circular plate 23. The circular plate 23 has a circular plate structure, and the movement position of the side limiting plate 20 is limited by the circular plate 23.

[0035] The limiting block 19 has an "L" shaped plate structure. The limiting block 19 slides along the limiting groove 21, which has an "L" shaped groove structure. The limiting block 19 slides up and down along the limiting groove 21, thereby limiting the moving plate 18.

[0036] In Example 2, a connecting hose 8 is provided inside the mounting cover 3, a heat-conducting frame 4 is connected to the mounting cover 3, a heating rod 5 is installed inside the heat-conducting frame 4, and a fan 6 is installed on the heat-conducting frame 4. The air inside the heat-conducting frame 4 is heated by the heating rod 5, and the air is discharged into the heat-conducting frame 4 by starting the fan 6.

[0037] A connecting pipe 7 is connected to the side of the heat-conducting frame 4. The other end of the connecting pipe 7 passes through the mounting cover 3 and is connected to the connecting hose 8, so that hot air flows into the connecting hose 8 through the connecting pipe 7.

[0038] The other end of the connecting hose 8 is connected to the vent pipe 9, and the vent is discharged through the hole opened on the vent pipe 9 to heat and cure the adhesive at the dispensing point of the IGBT module.

[0039] A servo motor 11 is fixedly connected to the side of the mounting cover 3. The drive shaft of the servo motor 11 is fixedly connected to the side of the guide plate 10. During the process, the servo motor 11 can be started to drive the guide plate 10 to change the angle and change the direction of the hot air ejected from the air outlet pipe 9. This can evenly dry and heat the IGBT module, avoid uneven heating and overheating in some areas, and prevent desoldering, thus improving the reliability of the device.

[0040] This invention also includes a method for controlling air bubbles in IGBT module packaging based on fusion welding, comprising the following steps:

[0041] S1. Preheating and degassing: The air inside the heat-conducting frame 4 is heated to 120-150℃ by the heating rod 5. The fan 6 is started so that the hot air is sprayed out from the air outlet pipe 9 through the connecting pipe 7 and the connecting hose 8. The servo motor 11 drives the guide plate 10 to rotate to a 45° angle with the surface of the IGBT module, preheating the module welding area for 30-60 seconds. The hot air flow is used to expel the volatile gases remaining in the solder.

[0042] S2. Dispensing temperature control: When the dispensing assembly 2 is working, the hot air temperature of the air outlet pipe 9 is maintained at 180-200℃. The airflow direction is adjusted by the guide plate 10 to cover the dispensing area, so that the solder remains in a molten state (viscosity 300-500cP) during the dispensing process, reducing the bubble encapsulation caused by sudden temperature drop.

[0043] S3. Gradient curing: After dispensing, control the heating rod 5 to gradually reduce the hot air temperature (cooling rate 5-10℃ / min), while the servo motor 11 drives the guide plate 10 to swing back and forth (angle range 30°-60°), so that the hot air acts evenly on the solder surface, promotes the rise and escape of air bubbles, until the temperature drops below 80℃ to complete curing.

[0044] In S1, the wind speed of the hot air is controlled at 2-3 m / s. The IGBT module is limited by the side limiting plate 20 and the upper limiting plate 14 to ensure that the distance between the module and the air outlet pipe 9 is maintained at 50-80 mm. During the preheating process, the temperature difference on the surface of the module is ≤5℃.

[0045] In S2, the dispensing pressure of the dispensing component 2 is 0.2-0.3MPa, and the dispensing speed is adjusted in conjunction with the hot air flow rate (flow rate ratio 1:1.5). When bubbles are detected on the solder surface (through image recognition), the servo motor 11 drives the guide plate 10 to focus hot air onto the bubble area, locally raising the temperature to 220-230℃ for 5-10 seconds, causing the bubbles to burst and be discharged.

[0046] Working principle:

[0047] First, the IGBT module is limited on the sides by two side limiting plates 20, and the upper surface of the IGBT module is limited by the upper limiting plate 14. The IGBT module is limited before entering the dispensing assembly 2. This prevents the IGBT module from flipping or tilting before entering the working range of the dispensing assembly 2, which would lead to dispensing failure and improve the reliability of the device. By starting the servo motor 11 to drive the guide plate 10 to change the angle and change the direction of the hot air sprayed from the air outlet pipe 9, the IGBT module can be dried and heated evenly, avoiding uneven heating and overheating in some areas, which could lead to desoldering and improve the reliability of the device. At this point, the entire workflow is completed.

[0048] The terms "front," "back," "left," "right," "top," and "bottom" all refer to the figures in the accompanying drawings. Figure 1 Based on.

[0049] In the description of this invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0050] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments.

[0051] For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. An IGBT module packaging device based on fusion welding, comprising a dispensing assembly (2) mounted on a body (1), wherein a mounting cover (3) is connected to the body (1), characterized in that: A guide plate (10) is rotatably connected inside the mounting cover (3), and an air outlet pipe (9) is connected to the guide plate (10); The machine body (1) is provided with an upper limit plate (14), a moving plate (18) and a side limit plate (20). The machine body (1) is connected with a support rod (22) and a limit rod (12). The machine body (1) is rotatably connected with a side rotation mechanism (13). The side rotation mechanism (13) is threadedly connected to the upper limit plate (14). The limit rod (12) is slidably connected to the side of the upper limit plate (14). The worm (15) is rotatably connected to the upper limit plate (14). The side of the worm (15) meshes with a worm wheel (16). The side of the worm wheel (16) is connected with a screw (17). The screw (17) is threadedly connected to the moving plate (18). The side limiting plate (20) is slidably connected to the support rod (22). The side limiting plate (20) has a limiting groove (21) on its side. A limiting block (19) is provided in the limiting groove (21). The other end of the limiting block (19) is connected to the side of the moving plate (18).

2. The IGBT module packaging equipment based on fusion welding according to claim 1, characterized in that: A connecting hose (8) is provided inside the mounting cover (3), a heat-conducting frame (4) is connected to the mounting cover (3), a heating rod (5) is installed inside the heat-conducting frame (4), and a fan (6) is installed on the heat-conducting frame (4).

3. The IGBT module packaging equipment based on fusion welding according to claim 1, characterized in that: A servo motor (11) is fixedly connected to the side of the mounting cover (3), and the transmission shaft of the servo motor (11) is fixedly connected to the side of the guide plate (10).

4. The IGBT module packaging equipment based on fusion welding according to claim 2, characterized in that: The heat-conducting frame (4) is connected to a connecting pipe (7) on its side, and the other end of the connecting pipe (7) passes through the mounting cover (3) and is connected to the connecting hose (8).

5. The IGBT module packaging equipment based on fusion welding according to claim 4, characterized in that: The other end of the connecting hose (8) is connected to the air outlet pipe (9).

6. The IGBT module packaging equipment based on fusion welding according to claim 1, characterized in that: The other end of the screw (17) is fixedly connected to the circular plate (23), which has a circular plate structure.

7. The IGBT module packaging equipment based on fusion welding according to claim 1, characterized in that: The limiting block (19) has an "L" shaped plate structure. The limiting block (19) slides along the limiting groove (21), which has an "L" shaped groove structure.

8. A method for controlling air bubbles in IGBT module packaging based on fusion welding, applied to the IGBT module packaging equipment according to any one of claims 1-7, characterized in that, Includes the following steps: S1. Preheating and degassing: The air inside the heat-conducting frame (4) is heated to 120-150°C by the heating rod (5). The fan (6) is started so that the hot air is sprayed out from the air outlet pipe (9) through the connecting pipe (7) and connecting hose (8). The servo motor (11) drives the guide plate (10) to rotate to a 45° angle with the surface of the IGBT module. The module welding area is preheated for 30-60 seconds. The hot air flow is used to expel the volatile gases remaining in the solder. S2, Dispensing temperature control: When the dispensing assembly (2) is working, the hot air temperature of the air outlet pipe (9) is kept at 180-200℃. The airflow direction is adjusted by the guide plate (10) to cover the dispensing area, so that the solder remains in a molten state during the dispensing process, and the bubble wrap caused by the sudden drop in temperature is reduced. S3. Gradient curing: After dispensing, control the heating rod (5) to gradually reduce the hot air temperature, while the servo motor (11) drives the guide plate (10) to swing back and forth, so that the hot air acts evenly on the surface of the solder, promotes the bubbles to rise and escape, until the temperature drops below 80°C to complete the curing.

9. The bubble control method according to claim 8, characterized in that: In S1, the wind speed of the hot air is controlled at 2-3 m / s. The IGBT module is limited by the side limiting plate (20) and the upper limiting plate (14) to ensure that the distance between the module and the air outlet pipe (9) is kept at 50-80 mm. During the preheating process, the temperature difference on the surface of the module is ≤5℃.

10. The bubble control method according to claim 8, characterized in that: In S2, the dispensing pressure of the dispensing assembly (2) is 0.2-0.3MPa, and the dispensing speed is adjusted in conjunction with the hot air flow rate. When bubbles are detected on the surface of the solder, the servo motor (11) drives the guide plate (10) to focus hot air onto the bubble area, and the local temperature is raised to 220-230℃ for 5-10 seconds, causing the bubbles to burst and be discharged.

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