Compact integrated 5G communication module structure and assembling method thereof

Abstract

The invention relates to the technical field of 5G communication modules, in particular to a compact integrated 5G communication module structure and an assembling method thereof.The compact integrated 5G communication module structure comprises a shielding shell, a sealing upper cover is installed at the upper end of the shielding shell, positioning units are installed at the four corners of the inner side of the shielding shell, and PCB stacking daughter boards and positioning middle frames are installed on the outer sides of the positioning units; the sealing upper cover comprises a plate body, the lower end of the plate body is fixedly connected with a buckle and a positioning ring plate, control grooves are formed in the four corners of the lower end of the plate body, and penetrating holes are formed in the four corners of the plate body. The positioning unit comprises a positioning column, vertical grooves are formed in the two sides of the positioning column, a plurality of fixing mechanisms are installed on the inner sides of the vertical grooves, the inner side of the positioning column is rotationally connected with a driving shaft through a circular plate, and edge grooves are formed in the two sides of the driving shaft. And the problems of contact resistance drift, signal integrity deterioration and creep failure after thermal circulation caused by insufficient pre-tightening of the middle layer are avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of 5G communication module, in particular to a compact integrated 5G communication module structure and an assembling method thereof. BACKGROUND

[0002] The compact integrated 5G communication module structure integrates the radio frequency front end, the baseband SoC, the power management, the eSIM and the antenna array system in package (SiP) into one body in the millimeter level package, and the common size is only 15 mm*15 mm*2.9 mm; the internal multi-layer HDI substrate+embedded passive device is adopted, and the double-sided SMT, LGA / BGA pad and the mainboard are welded once to realize assembly, so that the volume is reduced by 60 times, the power efficiency is retained by 43%, and the shielding cover buckle and the heat pipe interface are reserved to meet the 5G connection requirements of terminal miniaturization, high integration and low power consumption. In the existing 5G communication module, when multiple PCBs are fixed by bolts, the layer thickness tolerance, hole position deviation and uneven pre-tightening force transmission cause the top layer and the bottom layer to be cracked due to excessive pressure, and the middle layer is insufficiently pre-tightened, which causes contact resistance drift, signal integrity degradation and creep failure after thermal cycling, therefore, the compact integrated 5G communication module structure and the assembling method thereof are proposed to solve the above problems. SUMMARY

[0003] The present application aims to provide a compact integrated 5G communication module structure and an assembling method thereof to solve the problems of the existing 5G communication module, that is, when multiple PCBs are fixed by bolts, the layer thickness tolerance, hole position deviation and uneven pre-tightening force transmission cause the top layer and the bottom layer to be cracked due to excessive pressure, and the middle layer is insufficiently pre-tightened, which causes contact resistance drift, signal integrity degradation and creep failure after thermal cycling.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: A compact integrated 5G communication module structure and an assembling method thereof, comprising a shielding shell, a sealing upper cover is installed on the upper end of the shielding shell, a positioning unit is installed on the inner side of the shielding shell at four corners, and a PCB stacking sub-board and a positioning middle frame are installed on the outer side of the positioning unit; the sealing upper cover comprises a plate body, a buckle and a positioning ring plate are fixedly connected to the lower end of the plate body, control grooves are formed at four corners of the lower end of the plate body, and through holes are formed at four corners of the plate body; the positioning unit comprises a positioning column, vertical grooves are formed at both sides of the positioning column, a plurality of fixing mechanisms are installed in the inner side of the vertical grooves, a driving shaft is rotatably connected to the inner side of the positioning column through a circular plate, side grooves are formed at both sides of the driving shaft, and an inclined block is fixedly connected to the upper end of the driving shaft; the fixing mechanism comprises a rotating plate, a rotating shaft is fixedly connected to the inner side of the rotating plate, fixed shells are rotatably connected to the outer side of both ends of the rotating shaft through clockwork springs, and the fixed shells and the inner walls of the vertical grooves are fixedly connected.

[0005] As a further optimization of the present application, wherein: the shielding shell comprises a shell, a buckle hole and a threaded hole are opened inside the shell, the threaded hole is connected with the bolt penetrating the sealing cover, and the transverse projection of the buckle hole is L-shaped.

[0006] As a further optimization of the present application, wherein: the buckle and the buckle hole are matched and one-to-one corresponding, the positioning ring plate and the inner wall of the shell are matched, and the control groove and the inclined block are one-to-one corresponding.

[0007] As a further optimization of the present application, wherein: the PCB stack sub-board comprises a circuit board, mounting holes are opened inside the four corners of the circuit board, the PCB stack sub-board comprises a radio frequency sub-board, a GNSS / Wi-Fi sub-board, a main control sub-board, a power management sub-board and an interface sub-board, wherein the radio frequency sub-board and the interface sub-board are respectively installed at the uppermost end and the lowermost end.

[0008] As a further optimization of the present application, wherein: the positioning unit is provided with four, the positioning unit mounting holes are one-to-one corresponding, the positioning units are parallel, and the positioning units and the top end of the shell are arranged on the same horizontal plane.

[0009] As a further optimization of the present application, wherein: the positioning middle frame comprises a metal plate, cross holes are opened at both ends of the metal plate, a plurality of linearly equidistantly distributed heat dissipation holes are opened between the metal plates, and the transverse projection of the heat dissipation hole is square.

[0010] As a further optimization of the present application, wherein: the PCB stack sub-board and the positioning middle frame are staggered, the lower end of the PCB stack sub-board arranged at the lowermost end and the upper end of the PCB stack sub-board arranged at the uppermost end are both installed with the positioning middle frame.

[0011] As a further optimization of the present application, wherein: the number of the positioning units and the bottom support column shell is equal, the bottom support column shell is arranged outside the lower end of the positioning unit, the bottom support column shell is fixedly connected between the bottom end and the shell, and the bottom support column shell is coaxially arranged with the positioning column.

[0012] As a further optimization of the present application, wherein: the driving shaft is coaxially arranged with the positioning column, the fixing mechanism is connected with the metal plate through the cross hole, the edges of both ends of the rotating plate are arc-shaped, and the side of the rotating plate away from the center point of the positioning column is exposed outside the positioning column.

[0013] As a further optimization of the present application, wherein: S1: the bottom support column shell is in place: Four bottom support column shells are fixed in advance at the bottom end of the inner wall of the shielding shell, coaxial and vertical to the shell, and a positioning column is inserted into the bottom support column shell; S2: mounting of the middle frame and the heat sink plate The cross holes at both ends of the positioning middle frame are aligned with the fixing mechanisms of the four positioning units, and the preliminary clamping is achieved by means of the clock spring and the fixed shell; S3: stacking and positioning of the PCB sub-boards The interface sub-board, the power management sub-board, the main control sub-board, the GNSS / Wi-Fi sub-board and the radio frequency sub-board are inserted in turn from bottom to top, and the four corners of each layer of sub-boards are sleeved into the positioning column through the mounting holes; after installation, the positioning middle frame and the stacked PCB sub-boards are installed alternately; S4: correction of the stacked PCB sub-boards The radio frequency sub-board and the lower layer of sub-boards are pressed together through the board-to-board connector; the parallelism and the gap of each layer of sub-boards are checked, and the gap is less than or equal to 0.1mm; S5: installation of the sealing upper cover Firstly, the clasp is aligned with the clasp hole to realize the pre-fixing between the sealing upper cover and the shielding shell; after the fixing is completed, the sealing upper cover is aligned with the top end of the shielding shell, the four corner perforations are inserted into the bolts to be connected with the threaded holes to realize the installation and fixation; In this process, the control groove is in contact with the inclined block, and then in the process of moving the plate body downward, the inclined block is controlled to rotate through the control groove; in the process of rotating the inclined block, the driving shaft is driven to rotate; in the process of rotating the driving shaft, the side groove is rotated; then the rotating plate is positioned through the position of the driving shaft which is not provided with the side groove; and then the rotating plate and the driving shaft are positioned at a 90° angle, thereby further improving the positioning of the rotating plate to realize the positioning of each positioning middle frame; S6: function and size verification The size of the whole machine is measured, and the fit of the clasp and the clasp hole is checked; then electrical conduction test, radio frequency matching test and thermal resistance measurement are carried out to confirm that the performance indicators meet the design requirements.

[0014] Compared with the prior art, the present application has the following advantages: 1、In the present application, the positioning unit is provided, and multiple PCBs are fixed by bolts at the same time, so that the pre-tightening force of each PCB stacked sub-board is the same, thereby avoiding insufficient pre-tightening of the middle layer, causing contact resistance drift, signal integrity degradation and creep failure after thermal cycling; 2、In the present application, the positioning middle frame is provided, and the PCB stacked sub-boards can be equally spaced as needed, thereby ensuring the heat dissipation effect of the PCB stacked sub-boards, and the multiple heat dissipation holes can further improve the overall heat dissipation effect of the PCB stacked sub-boards, effectively ensuring the stability of the 5G communication module in operation; 3、The sealing upper cover is arranged, so that the shell and the plate are pre-fixed through the buckle and the buckle hole during positioning of the upper end of the shielding shell, then fixed through the bolt, and the stability of the shell after installation is further ensured. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 2 It is a schematic diagram of the sealing upper cover structure of the present application; Figure 3 It is a schematic diagram of the structure at A in the present application; Figure 2 Figure 4 It is a schematic diagram of the PCB stacking sub-plate structure of the present application; Figure 5 It is a schematic diagram of the positioning unit structure of the present application; Figure 6 It is a schematic diagram of the structure at B in the present application; Figure 5 Figure 7 It is a schematic diagram of the positioning middle frame structure of the present application.

[0016] In the figure: 1, shielding shell; 11, shell; 12, buckle hole; 13, threaded hole; 2, sealing upper cover; 21, plate; 22, buckle; 23, perforation; 24, positioning ring plate; 25, control groove; 3, PCB stacking sub-plate; 31, circuit board; 32, mounting hole; 4, positioning unit; 41, positioning column; 42, vertical slot; 43, fixing mechanism; 431, rotating plate; 432, fixing shell; 433, clockwork spring; 434, rotating shaft; 44, drive shaft; 45, round plate; 46, edge slot; 47, inclined block; 5, bottom support column shell; 6, positioning middle frame; 61, metal plate; 62, heat dissipation hole; 63, cross hole; 7, bolt. DETAILED DESCRIPTION

[0017] Please refer to Figures 1-7 The present application provides a technical solution: ​​A compact integrated 5G communication module structure and its assembly method, comprising a shielding shell 1, a sealing upper cover 2 is installed on the upper end of the shielding shell 1, a positioning unit 4 is installed on the inner side of the four corners of the shielding shell 1, a PCB stacking subboard 3 and a positioning middle frame 6 are installed on the outer side of the positioning unit 4; the sealing upper cover 2 comprises a plate body 21, the lower end of the plate body 21 is fixedly connected with a buckle 22 and a positioning ring plate 24, control grooves 25 are formed at the lower end of the four corners of the plate body 21, and through holes 23 are formed at the four corners of the plate body 21; the positioning unit 4 comprises a positioning column 41, vertical grooves 42 are formed on the two sides of the positioning column 41, a plurality of fixing mechanisms 43 are installed on the inner side of the vertical grooves 42, a driving shaft 44 is rotatably connected to the inner side of the positioning column 41 through a circular plate 45, side grooves 46 are formed on the two sides of the driving shaft 44, and an inclined block 47 is fixedly connected to the upper end of the driving shaft 44; the fixing mechanism 43 comprises a rotating plate 431, a rotating shaft 434 is fixedly connected to the inner side of the rotating plate 431, fixed shells 432 are rotatably connected to the outer sides of the two ends of the rotating shaft 434 through clockwork springs 433, and the fixed shells 432 are fixedly connected between the inner walls of the vertical grooves 42.

[0018] As a further embodiment of the present scheme, the shielding shell 1 comprises a shell 11, a buckle hole 12 and a threaded hole 13 are formed on the inner side of the shell 11, the threaded hole 13 is screw-connected between the threaded hole 13 and the bolt 7 penetrating the sealing upper cover 2, and the horizontal projection of the buckle hole 12 is L-shaped. Through the above arrangement, the stability of the connection between the shielding shell 1 and the sealing upper cover 2 can be further improved. As a further embodiment of the present scheme, the buckle 22 is adapted to the buckle hole 12, and the buckle 22 and the buckle hole 12 correspond one-to-one, the positioning ring plate 24 is adapted to the inner wall of the shell 11, and the control groove 25 and the inclined block 47 correspond one-to-one. Through the above arrangement, the smoothness of the butt joint between the shielding shell 1 and the sealing upper cover 2 can be improved. As a further embodiment of the present scheme, the PCB stacking subboard 3 comprises a circuit board 31, mounting holes 32 are formed on the inner side of the four corners of the circuit board 31, the PCB stacking subboard 3 comprises a radio frequency subboard, a GNSS / Wi-Fi subboard, a main control subboard, a power management subboard and an interface subboard, wherein the radio frequency subboard and the interface subboard are respectively installed at the uppermost end and the lowermost end. Through the above arrangement, the rationality of the installation of the 5G communication module can be ensured. As a further embodiment of the present scheme, four positioning units 4 are provided, the mounting holes 32 of the positioning units 4 correspond one-to-one, the positioning units 4 are parallel to each other, the top ends of the positioning units 4 and the shell 11 are arranged on the same horizontal plane. Through the above arrangement, the stability of the installation of the plurality of PCB stacking subboards 3 in the shielding shell 1 can be ensured. As a further implementation of the present scheme, the positioning middle frame 6 comprises a metal plate 61, cross holes 63 are formed at both ends of the metal plate 61, and a plurality of linear equidistantly distributed heat dissipation holes 62 are formed between the metal plates 61, the transverse projection of the heat dissipation hole 62 is a square, through the above setting, the reasonable and safe gap distribution between the PCB stacked sub-boards 3 can be ensured; As a further implementation of the present scheme, the PCB stacked sub-boards 3 and the positioning middle frame 6 are staggered, the lowermost end of the PCB stacked sub-boards 3 and the uppermost end of the PCB stacked sub-boards 3 are both provided with the positioning middle frame 6, through the above setting, the stability of the overall installation of the device can be further improved; As a further implementation of the present scheme, the number of the positioning units 4 and the bottom support column shells 5 is equal, the bottom support column shells 5 are arranged outside the lower end of the positioning units 4, the bottom end of the bottom support column shell 5 is fixedly connected with the shell 11, and the bottom support column shell 5 is coaxially arranged with the positioning column 41, through the above setting, the stability of the installation of the lowermost end of the positioning middle frame can be ensured; As a further implementation of the present scheme, the driving shaft 44 is coaxially arranged with the positioning column 41, the fixing mechanism 43 is connected with the metal plate 61 through the cross hole 63, the edges of the two ends of the rotating plate 431 are arc-shaped, and the side of the rotating plate 431 away from the center point of the positioning column 41 is exposed outside the positioning column 41, through the above setting, the stability of the connection between the rotating plate 431 and the metal plate 61 can be improved; As a further implementation of the present scheme, S1: the bottom support column shell 5 is in place: Four bottom support column shells 5 are first fixed at the bottom end of the inner wall of the shielding shell 11, coaxial and perpendicular to the shell, and the positioning column 41 is inserted into the bottom support column shell 5; S2: installation of the middle frame and the heat dissipation plate The cross holes 63 at both ends of the positioning middle frame 6 are aligned with the fixing mechanisms 43 of the four positioning units 4, and the initial clamping is realized by means of the clock spring 433 and the fixing shell 432; S3: PCB sub-board stacking and positioning The interface sub-board, the power management sub-board, the main control sub-board, the GNSS / Wi-Fi sub-board, and the radio frequency sub-board are sequentially inserted from bottom to top, the four corners of each layer of sub-boards are sleeved into the positioning column 41 through the mounting hole 32, and the positioning middle frame 6 and the PCB stacked sub-boards 3 are staggered after installation; S4: correction of the PCB stacked sub-boards 3 The radio frequency sub-board and the lower layer of sub-boards are pressed together through the board-to-board connector; the parallelism and the gap of each layer of sub-boards are checked, and the gap is less than or equal to 0.1 mm; S5: the sealing upper cover 2 is in place Firstly, the sealing upper cover 2 and the shielding shell 1 are pre-fixed through the alignment of the buckle 22 and the buckle hole 12, and after the fixing is completed, the sealing upper cover 2 is aligned with the top end of the shielding shell 1, the four corner perforations 23 are inserted into the threaded holes 13 to be connected with the bolts 7 to realize the installation and fixation; In this process, the control groove 25 is in contact with the inclined block 47, and then in the process of moving down the plate body 21, the inclined block 47 is controlled to rotate through the control groove 25, and in the process of rotating the inclined block 47, the driving shaft 44 is driven to rotate, and in the process of rotating the driving shaft 44, the side groove 46 is rotated, and then the position of the driving shaft 44 which is not provided with the side groove 46 is used to position the rotating plate 431, and then the rotating plate 431 is positioned at a 90° angle with the driving shaft 44, further improving the positioning of the rotating plate 431 to realize the positioning of each positioning frame 6; S6: Function and size verification The size of the whole machine is measured, and the fit of the buckle 22 and the buckle hole 12 is checked; then electrical conduction test, radio frequency matching test and thermal resistance measurement are carried out to confirm that the performance indicators meet the design requirements.

[0019] In this paper, specific examples are used to illustrate the principles and implementation methods of the present application. The above examples are only used to help understand the method and its core idea. The above description is only the preferred embodiment of the present application. It should be pointed out that due to the limitation of language expression, there are infinite specific structures, and for ordinary technical personnel in this technical field, without departing from the principles of the present application, some improvements, refinements or changes can be made, and the above technical features can be combined in a proper way; these improvements, refinements, changes or combinations, or without improvement, the concept and technical scheme of the present application are directly applied to other occasions, which should be regarded as the protection scope of the present application.

Claims

1. A compact integrated 5G communication module structure comprising a shielded case (1), characterized in that, The shielding shell (1) is provided with a sealing upper cover (2) at the upper end, and is provided with a positioning unit (4) at each of the four corners on the inner side, and is provided with a PCB stacking sub-board (3) and a positioning middle frame (6) on the outer side of the positioning unit (4). The sealing upper cover (2) comprises a plate body (21), the lower end of the plate body (21) is fixedly connected with a buckle (22) and a positioning ring plate (24), the lower end of the plate body (21) is provided with a control groove (25) at each of the four corners, and the plate body (21) is provided with a through hole (23) at each of the four corners. The positioning unit (4) comprises a positioning column (41), the two sides of the positioning column (41) are provided with a vertical groove (42), a plurality of fixing mechanisms (43) are installed in the vertical groove (42), the inner side of the positioning column (41) is rotatably connected with a driving shaft (44) through a circular plate (45), the two sides of the driving shaft (44) are provided with a side groove (46), and the upper end of the driving shaft (44) is fixedly connected with an inclined block (47). The fixing mechanism (43) comprises a rotating plate (431), the inner side of the rotating plate (431) is fixedly connected with a rotating shaft (434), the outer side of the two ends of the rotating shaft (434) is rotatably connected with a fixed shell (432) through a clockwork spring (433), and the fixed shell (432) and the inner wall of the vertical groove (42) are fixedly connected. 2.The compact integrated 5G communication module structure of claim 1, wherein: The shielding shell (1) comprises a shell (11), the inner side of the shell (11) is provided with a buckle hole (12) and a threaded hole (13), the threaded hole (13) is spirally connected with a bolt (7) penetrating the sealing upper cover (2), and the horizontal projection of the buckle hole (12) is L-shaped. 3.The compact integrated 5G communication module structure of claim 1, wherein: The buckle (22) is matched with the buckle hole (12), and the buckle (22) and the buckle hole (12) are one-to-one corresponding, the positioning ring plate (24) is matched with the inner wall of the shell (11), and the control groove (25) is one-to-one corresponding with the inclined block (47). 4.The compact integrated 5G communication module structure of claim 1, wherein: The PCB stacking sub-board (3) comprises a circuit board (31), the inner side of each of the four corners of the circuit board (31) is provided with a mounting hole (32), the PCB stacking sub-board (3) comprises a radio frequency sub-board, a GNSS / Wi-Fi sub-board, a main control sub-board, a power management sub-board and an interface sub-board, wherein the radio frequency sub-board and the interface sub-board are respectively installed at the uppermost end and the lowermost end. 5.The compact integrated 5G communication module structure of claim 1, wherein: The positioning unit (4) is provided with four, the mounting holes (32) of the positioning unit (4) are one-to-one corresponding, the positioning units (4) are parallel, and the top ends of the positioning units (4) and the shell (11) are arranged on the same horizontal plane. 6.The compact integrated 5G communication module structure of claim 1, wherein: The positioning middle frame (6) comprises a metal plate (61), the two ends of the metal plate (61) are provided with a cross hole (63), a plurality of linearly equidistantly distributed heat dissipation holes (62) are formed between the metal plates (61), and the horizontal projection of the heat dissipation hole (62) is square. 7.The compact integrated 5G communication module structure of claim 1, wherein: The PCB stacking sub-board (3) and the positioning middle frame (6) are staggered, the lower end of the PCB stacking sub-board (3) arranged at the lowermost end and the upper end of the PCB stacking sub-board (3) arranged at the uppermost end are both provided with a positioning middle frame (6). 8.The compact integrated 5G communication module structure of claim 1, wherein: The positioning units (4) are equal in number to the bottom support column shells (5), the bottom support column shells (5) are arranged outside the lower ends of the positioning units (4), the bottom ends of the bottom support column shells (5) are fixedly connected with the shell (11), and the bottom support column shells (5) are coaxially arranged with the positioning columns (41). 9.The compact integrated 5G communication module structure of claim 1, wherein: The driving shaft (44) is coaxially arranged with the positioning column (41), the fixing mechanism (43) is connected with the metal plate (61) through the cross hole (63), the two end edges of the rotating plate (431) are arc-shaped, and the side of the rotating plate (431) away from the center point of the positioning column (41) is exposed outside the positioning column (41).

10. A method of assembling a compact integrated 5G communication module structure according to any one of claims 1-9, characterized in that: S1: the bottom support column shell (5) is in place: Four bottom support column shells (5) are first fixed at the bottom end of the inner wall of the shielding shell (11), coaxial with the shell, vertical and stable, and the positioning column (41) is inserted into the bottom support column shell (5); S2: middle frame and heat sink installation Align the cross hole (63) at both ends of the positioning middle frame (6) with the fixing mechanism (43) of the four positioning units (4), and preliminarily engage with the help of the clock spring (433) and the fixed shell (432); S3: PCB sub-board stacking and positioning Insert the interface sub-board, power management sub-board, main control sub-board, GNSS / Wi-Fi sub-board, and radio frequency sub-board in turn from bottom to top, and the four corners of each layer of sub-boards are sleeved into the positioning column (41) through the mounting hole (32), and the installed positioning middle frame (6) and the PCB stacked sub-board (3) are staggered. S4: PCB stacked sub-board (3) correction Press the radio frequency sub-board and the lower layer sub-board through the board-to-board connector; check the parallelism and gap of each layer of sub-boards, which is ≤0.1mm; S5: sealing upper cover (2) in place First, align the buckle (22) with the buckle hole (12) to realize the pre-fixing of the sealing upper cover (2) and the shielding shell (1), and after the fixing is completed, align the sealing upper cover (2) with the top end of the shielding shell (1), insert the four corner perforations (23) into the threaded holes (13) connected with the bolts (7) to realize installation and fixation; In this process, the control groove (25) is in contact with the inclined block (47), and then in the process of moving down the plate body (21), the inclined block (47) is rotated through the control groove (25), and in the process of rotating the inclined block (47), the driving shaft (44) is rotated, and in the process of rotating the driving shaft (44), the side groove (46) is rotated, and then the rotating plate (431) is positioned through the position of the driving shaft (44) which is not provided with the side groove (46), and then the rotating plate (431) and the driving shaft (44) are positioned at an angle of 90°, further improving the positioning of the rotating plate (431) to each positioning middle frame (6); S6: function and size verification Measure the size of the whole machine, check the adhesion of the buckle (22) and the buckle hole (12), and then test the electrical conduction, radio frequency matching and thermal resistance to confirm that the performance indicators meet the design requirements.

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