Heat dissipation device and electronic equipment

Abstract

The invention discloses a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation, and the heat dissipation device comprises a cooling liquid source, an inlet liquid collection part, a return liquid collection part, a first heat exchange runner and an air cooling module; through the combination of the first heat exchange runner and the air cooling module, the heat dissipation efficiency and the system suitability of the heat dissipation device are improved. The fluid power cavity in the first heat exchange flow channel provides a mounting space for the air cooling module, and the air cooling module automatically drives the air cooling module to rotate by utilizing the flowing of cooling liquid in the fluid power cavity, so that the heat dissipation system can strengthen the heat exchange effect through the synergistic effect of air cooling and liquid cooling while keeping the compact structure, and the heat dissipation efficiency is improved. The problem that in the prior art, a heat dissipation device is high in dependence degree on environmental conditions is at least solved; and when the environment temperature rises, the heat dissipation capability of air is obviously reduced, and effective cooling is difficult to carry out. The technical effects of flexibly adapting to the heat dissipation requirements in different environments and considering the heat dissipation performance, the system stability and the use flexibility are achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation device and an electronic device. BACKGROUND

[0002] With the rapid development of electronic information technology, various electronic devices such as server power supplies, vehicle-mounted power supplies of new energy vehicles, and high-power power supplies in the field of industrial automation are constantly evolving towards high power and high density, and the heat generated per unit volume increases sharply. The heat dissipation performance has become a key factor restricting the stability of electronic device operation, service life and performance upper limit.

[0003] At present, most devices in the industry still mainly use air cooling for heat dissipation, which relies on a fan to drive air flow to carry away the heat on the surface of the power supply board. Although air cooling has the advantages of simple structure and low cost, its cooling effect is highly dependent on environmental conditions; when the ambient temperature rises, the air cooling capacity will decrease significantly, making it difficult to effectively cool high-power-density devices. SUMMARY

[0004] The present application provides a heat dissipation device and an electronic device to at least solve the problem that the heat dissipation device in the related art is highly dependent on environmental conditions; when the ambient temperature rises, the air cooling capacity will decrease significantly, making it difficult to effectively cool high-power-density devices.

[0005] The present application provides a heat dissipation device, comprising a cooling liquid source, a liquid inlet collection part, a liquid return collection part, a first heat exchange flow channel, and an air cooling module; the liquid inlet collection part is in communication with the outlet of the cooling liquid source; the liquid return collection part is in communication with the liquid return port of the cooling liquid source; the first heat exchange flow channel is connected between the liquid inlet collection part and the liquid return collection part; and a fluid power cavity is formed inside the first heat exchange flow channel; the air cooling module is rotatably installed in the fluid power cavity.

[0006] The present application also provides an electronic device, comprising a device to be cooled and the heat dissipation device described above; the heat dissipation device described above is in heat-conducting cooperation with the device to be cooled.

[0007] The combination of the first heat exchange flow channel and the air cooling module improves the heat dissipation efficiency of the heat dissipation device and the system adaptability. The fluid power cavity in the first heat exchange flow channel provides installation space for the air cooling module, and the air cooling module can be rotatably arranged. The air cooling module is automatically driven to rotate by the flow of the cooling liquid in the fluid power cavity, so that the heat dissipation system can strengthen the heat exchange effect through the cooperation of air cooling and liquid cooling while maintaining compact structure, and at least solves the problem that the heat dissipation device in the related art has high dependence on environmental conditions. When the environmental temperature rises, the air cooling capacity will decrease significantly, so that it is difficult to effectively cool the high-power-density equipment. The technical effects of heat dissipation performance, system stability and use flexibility are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 The structure diagram of the heat dissipation device provided by the embodiments of the present application connected with the device to be cooled; Figure 2 The structure diagram of the heat dissipation device provided by the embodiments of the present application; Figure 3 The exploded structure diagram of the heat dissipation device provided by the embodiments of the present application; Figure 4 The side view of the heat dissipation device provided by the embodiments of the present application; Figure 5 The structure diagram of the air cooling module provided by the embodiments of the present application.

[0010] Among them, the above drawings include the following reference signs: 100, heat dissipation device; 110, cooling liquid source; 111, cooling box; 1111, mounting groove; 112, refrigeration assembly; 1121, semiconductor refrigerator; 1122, heat dissipation fan; 120, liquid inlet collection part; 121, first liquid outlet; 130, liquid return collection part; 140, first heat exchange flow channel; 141, annular flow channel unit; 142, connecting pipeline; 1421, first connecting pipe; 1422, second connecting pipe; 1423, third connecting pipe; 150, air cooling module; 151, power impeller; 152, heat dissipation fan blade; 153, transmission shaft; 154, sealing bearing; 160, second heat exchange flow channel; 170, liquid delivery assembly; 171, power pump; 172, liquid delivery pipeline; 181, temperature sensor; 182, temperature controller; 183, fixing plate; 190, return pipeline. 200, a device to be cooled. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0012] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mount", "connect", "connect" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0013] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0014] Embodiments of the present application provide a heat dissipation device 100 and an electronic device. The device is described in detail in combination with the structure and working principle of the heat dissipation device 100 and the electronic device.

[0015] The embodiments of the present application are described below in combination with Figures 1 to 5 .

[0016] According to the embodiments of the present application, in one aspect, a heat dissipation device 100 is provided, as shown in Figure 2 and Figure 3 , the heat dissipation device 100 comprises a cooling liquid source 110, an inlet liquid collection part 120, a return liquid collection part 130, a first heat exchange flow channel 140 and an air cooling module 150; the inlet liquid collection part 120 is in communication with the outlet of the cooling liquid source 110; the return liquid collection part 130 is in communication with the return liquid port of the cooling liquid source 110; the first heat exchange flow channel 140 is connected between the inlet liquid collection part 120 and the return liquid collection part 130; and a fluid power cavity is formed inside the first heat exchange flow channel 140; and the air cooling module 150 is rotatably installed in the fluid power cavity.

[0017] In the above embodiments, through the combined design of the first heat exchange flow channel 140 and the air cooling module 150 of the present application, the heat dissipation efficiency and system adaptability of the heat dissipation device 100 are improved. The fluid power cavity inside the first heat exchange flow channel 140 provides installation space for the air cooling module 150, and the air cooling module 150 is rotatably arranged, and the air cooling module 150 is automatically driven to rotate by the flow of cooling liquid in the fluid power cavity, so that the heat dissipation system can strengthen the heat exchange effect through the synergistic effect of air cooling and liquid cooling while maintaining compact structure, and at least solves the problem that the heat dissipation device 100 in the related art has high dependence on environmental conditions; when the environmental temperature rises, the air cooling capacity will decrease significantly, thereby it is difficult to effectively cool the high-power-density equipment. The technical effects of flexible adaptation to heat dissipation requirements in different environments, taking into account the heat dissipation performance, system stability and use flexibility are achieved.

[0018] In a specific embodiment, the air cooling module 150 is driven by the cooling liquid flowing through the fluid power cavity to generate air flow.

[0019] In the present embodiment, the inlet liquid collection part 120 and the return liquid collection part 130 are two collection tanks arranged independently and side by side. And the inlet liquid collection part 120 and the return liquid collection part 130 are both fixedly connected to the top of the cooling tank 111, fully utilizing the space at the top of the cooling tank 111, realizing the integration and modularization of components, making the overall structure more compact, facilitating installation and maintenance.

[0020] Further, the liquid inlet collecting part 120 and the liquid return collecting part 130 are arranged side by side along the length direction or width direction of the top of the cooling box 111, and a preset interval is kept between the two to avoid mutual interference, and the interval size can be adaptively adjusted according to actual installation requirements and pipeline connection space. In terms of connection and fixation, the liquid inlet collecting part 120 and the liquid return collecting part 130 are fixedly connected to the top end surface of the cooling box 111 through a detachable connection structure or an integral forming structure.

[0021] Specifically, the first heat exchange flow channel 140 is provided with one or more first heat exchange flow channels 140, and the plurality of first heat exchange flow channels 140 are connected in parallel between the liquid inlet collecting part 120 and the liquid return collecting part 130.

[0022] In an embodiment, the first heat exchange flow channel 140 includes a ring-shaped flow channel unit 141 and a connecting pipeline 142; the ring-shaped flow channel unit 141 forms a fluid power cavity inside; and the connecting pipeline 142 connects the ring-shaped flow channel unit 141 with the liquid inlet collecting part 120 and the liquid return collecting part 130.

[0023] In the above embodiment, the structure of the ring-shaped flow channel unit 141 not only naturally forms a fluid power cavity accommodating the air cooling module 150, provides stable and reasonable installation space for the air cooling module 150, but also enables the cooling liquid to form more uniform circulation in the flow channel, reduces the heat exchange dead angle caused by local flow rate unevenness, and effectively reduces the flow resistance of the cooling liquid; the connecting pipeline 142 can accurately dock the ring-shaped flow channel unit 141 with the liquid inlet collecting part 120 and the liquid return collecting part 130, ensuring that the cooling liquid can smoothly enter and exit the ring-shaped flow channel, avoiding pressure loss caused by poor flow channel connection, and ultimately fully playing the effect of air cooling and liquid cooling collaborative cooling on the basis of ensuring the stability of the liquid cooling cycle. And through the modular design of the ring-shaped flow channel unit 141 and the connecting pipeline 142, the power function unit and the connecting pipeline 142 are clearly separated, which is convenient for manufacturing, assembly and maintenance, and realizes efficient cooperation and integration of liquid cooling and air cooling in limited space.

[0024] In a specific embodiment, the first heat exchange flow channel 140 includes one or more ring-shaped flow channel units 141, and the plurality of ring-shaped flow channel units 141 are connected in series through the connecting pipeline 142.

[0025] In the embodiment, as Figure 2As shown, the first heat exchange flow channel 140 includes two annular flow channel units 141, and the connecting pipeline 142 includes a first connecting pipe 1421, a second connecting pipe 1422 and a third connecting pipe 1423; one end of the first connecting pipe 1421 is connected with the first liquid outlet 121 of the liquid inlet collecting part 120, and the other end is connected with the inlet of one annular flow channel unit 141; one end of the second connecting pipe 1422 is connected with the outlet of the other annular flow channel unit 141, and the other end is connected with the first liquid inlet of the liquid return collecting part 130; one end of the third connecting pipe 1423 is connected with the outlet of one annular flow channel unit 141, and the other end is connected with the inlet of the other annular flow channel unit 141.

[0026] In another implementation of the embodiment, when the first heat exchange flow channel 140 includes one annular flow channel unit 141, the connecting pipeline 142 includes the first connecting pipe 1421 and the second connecting pipe 1422; one end of the first connecting pipe 1421 is connected with the first liquid outlet 121 of the liquid inlet collecting part 120, and the other end is connected with the inlet of the annular flow channel unit 141; one end of the second connecting pipe 1422 is connected with the outlet of the annular flow channel unit 141, and the other end is connected with the first liquid inlet of the liquid return collecting part 130.

[0027] Specifically, the annular flow channel unit 141 is a hollow cylindrical structure.

[0028] In one embodiment, as shown, Figure 5 The air cooling module 150 includes a power impeller 151 and a heat dissipation fan blade 152; the power impeller 151 is rotatably arranged in the fluid power cavity; the heat dissipation fan blade 152 is linked with the power impeller 151 and is located outside the annular flow channel unit 141.

[0029] In the above embodiment, the power impeller 151 is rotatably arranged in the fluid power cavity, and can directly utilize the flow kinetic energy of the cooling liquid in the first heat exchange flow channel 140 to drive itself to rotate, without the need for additional motor or other power components, so as to directly convert the waste heat of the liquid cooling system into mechanical rotation of the heat dissipation fan blade 152, realize self-driven and efficient collaborative heat dissipation from liquid cooling to air cooling, reduce energy consumption and system failure points; the heat dissipation fan blade 152 linked with the power impeller 151 is located outside the annular flow channel unit 141 and can rotate synchronously with the power impeller 151, quickly taking away the heat of the annular flow channel unit 141 and the surrounding area, strengthening the convective heat transfer effect and realizing real-time linkage of liquid cooling and air cooling. Not only the heat dissipation efficiency is ensured, but also the layout and control logic of the overall system are simplified, and the working environment of each part is optimized through functional separation, so that the overall system improves the comprehensive heat dissipation capacity and energy utilization efficiency under zero additional energy consumption.

[0030] In one embodiment, the air cooling module 150 further includes a transmission shaft 153 connected between the power impeller 151 and the heat dissipation fan blade 152.

[0031] In the above embodiment, by arranging the transmission shaft 153 to directly connect the power impeller 151 and the heat dissipation fan blade 152, the rotational kinetic energy generated by the power impeller 151 driven by the cooling liquid is stably and losslessly transmitted to the heat dissipation fan blade 152, ensuring that the two are synchronously linked, avoiding the problem of insufficient rotation speed of the heat dissipation fan blade 152 and reduced heat dissipation efficiency due to poor power transmission. Not only is the shortest power conversion path ensured and the efficiency maximized, but also by integrating the rotating components on a single shaft, the overall structure is simplified, and the operation stability, mechanical strength and service life of the air cooling module 150 are improved. Moreover, by designing the length and installation position of the transmission shaft 153, the distance between the heat dissipation fan blade 152 and the annular flow channel unit 141 can be flexibly adjusted, allowing the heat dissipation fan blade 152 to precisely act on the area that needs to be cooled, while avoiding interference with the flow channel unit, further improving the stability of the air cooling module 150 installation and operation.

[0032] In one embodiment, a sealing bearing 154 is arranged on the wall surface of the annular flow channel unit 141, and the transmission shaft 153 is rotatably supported by the sealing bearing 154.

[0033] In the above embodiment, the sealing bearing 154 is arranged on the wall surface of the annular flow channel unit 141 to support the transmission shaft 153, which can simultaneously ensure transmission stability and flow channel sealing, further improving system reliability. The sealing bearing 154 can provide stable support for the transmission shaft 153, preventing it from shifting or wobbling during rotation, ensuring that the power impeller 151 and the heat dissipation fan blade 152 always remain synchronized and smoothly linked. At the same time, the sealing feature of the sealing bearing 154 can block the leakage of cooling liquid from the shaft hole inside the annular flow channel unit 141, preventing a decrease in heat dissipation efficiency or system failure due to cooling liquid loss, making the liquid cooling and air cooling collaborative cooling process more stable and durable.

[0034] In a specific embodiment, the fluid power cavity is a hollow cavity formed inside the annular flow channel unit 141, which has a profile that matches the outer profile of the power impeller 151, and there is a certain gap between the two to ensure power conversion efficiency.

[0035] Specifically, the power impeller 151 is arranged in the fluid power cavity of the annular flow channel unit 141; the transmission shaft 153 extends in the vertical direction, with its upper end fixed to the center position of the bottom surface of the power impeller 151, and its lower end extending through the annular flow channel unit 141 to the outside, with the heat dissipation fan blade 152 arranged below the annular flow channel unit 141, and its center position fixedly connected to the lower end of the transmission shaft 153. The connection method can be welding or bolt fastening, allowing the heat dissipation fan blade 152 to rotate synchronously with the transmission shaft 153, thereby achieving heat dissipation through air convection.

[0036] Specifically, to realize the sealing support of the transmission shaft 153, a through hole is formed in the bottom surface of the annular flow channel unit 141, which is a circular through hole with an inner diameter matching the outer diameter of the outer ring of the sealing bearing 154. The outer ring of the sealing bearing 154 is fixedly connected in the through hole by interference fit or snap ring positioning, and the inner ring of the bearing is in interference fit with the outer circumferential surface of the transmission shaft 153, which not only ensures the flexible rotation of the transmission shaft 153, but also prevents the cooling liquid in the fluid power cavity from leaking along the gap between the transmission shaft 153 and the through hole through the sealing structure of the sealing bearing 154.

[0037] Specifically, when the device is in operation, the cooling liquid flows into the fluid power cavity inside the annular flow channel unit 141 after being distributed by the liquid inlet collecting part 120. The high-speed flowing cooling liquid generates a continuous impact force on the blades of the power impeller 151. Under the driving action of this impact force, the power impeller 151 rotates along the axis of the transmission shaft 153. Since the bottom surface of the power impeller 151 is fixedly connected with the upper end of the transmission shaft 153, the two form a rigid linkage structure, so the transmission shaft 153 rotates synchronously with the power impeller 151. The outer ring of the sealing bearing 154 is fixedly connected with the through hole in the bottom surface of the annular flow channel unit 141, providing support for the transmission shaft 153; the inner ring of the sealing bearing 154 is in interference fit with the transmission shaft 153, which not only ensures the degree of freedom of rotation, but also blocks the cooling liquid in the fluid power cavity from leaking outward along the gap between the transmission shaft 153 and the through hole through the sealing structure of the sealing bearing 154, achieving a dynamic sealing effect.

[0038] Further, the lower end surface of the transmission shaft 153 is fixedly connected with the center of the heat dissipation fan blade 152. When the transmission shaft 153 rotates, the heat dissipation fan blade 152 rotates at high speed, and its blades push the surrounding air to form a directional airflow. This airflow directly acts on the bottom surface of the device to be cooled 200 and the outer wall of the annular flow channel unit 141, accelerating heat transfer through forced convection effect: the airflow not only quickly carries away the radiant heat on the surface of the device to be cooled 200; but also forms a secondary heat exchange with the cooling liquid flowing through the annular flow channel unit 141 when flowing through the outer wall of the annular flow channel unit 141, enhancing the heat dissipation efficiency of the liquid cooling system.

[0039] Specifically, the power impeller 151 and the heat dissipation fan blade 152 form a mechanical linkage through the transmission shaft 153, and the driving force of the entire air cooling module 150 comes entirely from the flow kinetic energy of the cooling liquid, without the need for additional configuration of a motor or other power source, reducing system complexity and energy consumption. At the same time, the sealing bearing 154 ensures the sealing of the fluid power cavity, effectively avoiding the impact of cooling liquid leakage on the safety of the device operation.

[0040] In one embodiment, a second heat exchange flow channel 160 is further included, which is arranged in parallel with the first heat exchange flow channel 140 and connected between the liquid inlet collecting part 120 and the liquid outlet collecting part 130.

[0041] In the above embodiment, the second heat exchange flow channel 160 and the first heat exchange flow channel 140 are connected in parallel to the liquid inlet collecting portion 120 and the liquid return collecting portion 130, so that the cooling liquid can be simultaneously divided to cool different areas or heat generating components, thereby expanding the heat dissipation coverage range while avoiding the risk of heat dissipation failure caused by single flow channel blockage.

[0042] In a specific embodiment, the second heat exchange flow channel 160 and the first heat exchange flow channel 140 are configured to be in direct physical contact with the bottom of the device to be cooled 200. Preferably, the upper surfaces of the second heat exchange flow channel 160 and the first heat exchange flow channel 140 together form a flat heat exchange plane that is in close abutment with the bottom surface of the device to be cooled 200.

[0043] In the description of the embodiments of the present application, it should be noted that the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0044] Specifically, the close abutment of the second heat exchange flow channel 160 and the first heat exchange flow channel 140 with the bottom of the device to be cooled 200 can minimize the path of heat transfer from the device to be cooled 200 to the cooling liquid. In the working process, the heat generated by the device to be cooled 200 can be rapidly conducted to the cooling liquid flowing in the second heat exchange flow channel 160 and the first heat exchange flow channel 140 through the direct contact interface without passing through complex multi-layer interfaces. The contact thermal resistance and overall heat transfer thermal resistance are reduced, thereby achieving efficient and rapid heat exchange between the device to be cooled 200 and the cooling liquid.

[0045] As a preferred embodiment, to ensure the best abutment effect, the bottom surface of the device to be cooled 200 and / or the upper contact surface of the second heat exchange flow channel 160 and the first heat exchange flow channel 140 can be polished or milled flat for finishing treatment to improve the flatness of the surface and reduce microscopic air gaps, thereby further optimizing the heat conduction efficiency.

[0046] As a preferred embodiment, a high-performance heat-conducting material is filled between the contact interface of the device to be cooled 200 and the second heat exchange flow channel 160 and the first heat exchange flow channel 140 to fill the microscopic unevenness, thereby ensuring the lowest interface thermal resistance and achieving efficient and reliable heat transfer.

[0047] Specifically, the inlet of the second heat exchange channel 160 is in communication with the liquid inlet collecting portion 120, and the outlet of the second heat exchange channel 160 is in communication with the liquid return collecting portion 130. The inlet of the first heat exchange channel 140 is in communication with the liquid inlet collecting portion 120, and the outlet of the first heat exchange channel 140 is in communication with the liquid return collecting portion 130. During operation, the cooling liquid is distributed from the liquid inlet collecting portion 120 into the second heat exchange channel 160 and the first heat exchange channel 140, respectively, absorbs the heat transferred by the device to be cooled 200, and then converges to the liquid return collecting portion 130.

[0048] In one embodiment of the present embodiment, the liquid inlet collecting portion 120 and the liquid return collecting portion 130 are two collecting boxes arranged side by side and independently. Each of the two collecting boxes has an independent cavity, one of which is the liquid inlet collecting portion 120 for receiving the low-temperature cooling liquid input by the cooling liquid source 110 and distributing it to the second heat exchange channel 160 and the first heat exchange channel 140; the other is the liquid return collecting portion 130 for collecting the high-temperature cooling liquid after heat exchange in the second heat exchange channel 160 and the first heat exchange channel 140, and guiding it to the cooling liquid source 110 for cooling treatment. The two collecting boxes are arranged side by side, which can ensure the independence of their respective functions while reducing the space occupied by the overall structure, facilitating the arrangement in limited installation environment.

[0049] In another embodiment of the present embodiment, the liquid inlet collecting portion 120 and the liquid return collecting portion 130 are two independent and spaced cavities separated by a separation structure in an integrally formed member, one of which is the liquid inlet collecting portion 120, and the other is the liquid return collecting portion 130, and the second heat exchange channel 160 and the first heat exchange channel 140 are arranged between the two cavities. The integrally formed structure design can simplify the assembly process of the heat dissipation device 100 and improve the structural stability between the liquid inlet collecting portion 120 and the liquid return collecting portion 130.

[0050] Specifically, the second heat exchange channel 160 can be one or more. When the second heat exchange channel 160 is one, the inlet of the single second heat exchange channel 160 is directly in communication with the liquid inlet collecting portion 120, and the outlet is in communication with the liquid return collecting portion 130. The single second heat exchange channel 160 has a simple structure and is suitable for devices to be cooled 200 with relatively low heat power and low requirements for heat dissipation efficiency.

[0051] In the embodiment, the second heat exchange flow channels 160 are provided in plurality, and the plurality of second heat exchange flow channels 160 are connected in parallel between the liquid inlet collecting portion 120 and the liquid return collecting portion 130. The inlet of each second heat exchange flow channel 160 is independently communicated with the liquid inlet collecting portion 120, and the outlet of each second heat exchange flow channel 160 is also independently communicated with the liquid return collecting portion 130. When the cooling liquid flows out of the liquid inlet collecting portion 120, it is divided into each second heat exchange flow channel 160, flows in the plurality of second heat exchange flow channels 160, and exchanges heat with the bottom of the device to be cooled 200, and then flows into the liquid return collecting portion 130 from the respective outlets. The parallel structure design of the plurality of second heat exchange flow channels 160 can effectively increase the contact area of the cooling liquid with the device to be cooled 200, improve the heat exchange amount per unit time, and thus improve the heat dissipation efficiency, and is suitable for the device to be cooled 200 with high heat power. At the same time, the parallel arrangement makes the cooling liquid flow in each second heat exchange flow channel 160 independent of each other, which can avoid affecting the overall heat dissipation function due to the blockage of a single flow channel, and improves the reliability of the heat dissipation device 100.

[0052] Specifically, a plurality of first liquid outlets 121 are provided on the side of the liquid inlet collecting portion 120 close to the liquid return collecting portion 130 along the length direction thereof. Correspondingly, a plurality of first liquid inlets are also provided on the side of the liquid return collecting portion 130 close to the liquid inlet collecting portion 120 along the length direction thereof. The two ends of the second heat exchange flow channel 160 are respectively sealingly connected with a corresponding first liquid outlet 121 and a first liquid inlet.

[0053] Specifically, the first liquid inlet and the first liquid outlet 121 are both configured as square ports.

[0054] In a specific embodiment, the liquid inlet collecting portion 120, the liquid return collecting portion 130, the first heat exchange flow channel 140, and the second heat exchange flow channel 160 are all made of copper material, which can fully utilize the good heat conduction performance, reduce the resistance in the heat transfer process, and accelerate the transfer speed of heat from the device to be cooled 200 to the cooling liquid, thereby effectively improving the overall heat dissipation effect of the heat dissipation device 100 and ensuring the stable operation of the device to be cooled 200 at a suitable temperature. In addition, the copper material also has good processing performance, which is convenient for making the required flow channel structure and collecting portion shape through forging, stamping, welding and other processes to meet the structural design requirements in different scenarios. At the same time, copper has certain corrosion resistance, which can adapt to the environmental influence brought by the long-term flow of the cooling liquid, and ensure the service life of the heat dissipation device 100.

[0055] In one embodiment, the cooling liquid source 110 includes a cooling tank 111 and a refrigeration assembly 112; the refrigeration assembly 112 is installed in the cooling tank 111.

[0056] In the above embodiment, the cooling tank 111 can be used as a storage container for the cooling liquid, ensuring sufficient circulation of the cooling liquid to avoid interruption of heat dissipation due to insufficient cooling liquid; the refrigeration assembly 112 is installed in the cooling tank 111, which can directly cool the cooling liquid in the tank, keeping the cooling liquid entering the heat exchange channel at a low temperature all the time, improving the efficiency of the subsequent liquid cooling heat exchange from the source, and without relying on external cooling sources, making the entire heat dissipation system more independent and adaptable.

[0057] In a specific embodiment, the cooling tank 111 is internally provided with cooling liquid.

[0058] Specifically, the cooling liquid is selected to be a heat-conducting medium with high specific heat capacity, low viscosity, and good thermal stability, such as ethylene glycol solution or special electronic cooling liquid, to improve heat exchange efficiency and avoid low-temperature icing or high-temperature deterioration.

[0059] In one embodiment, the cooling tank 111 is provided with a mounting groove 1111, and the refrigeration assembly 112 includes a semiconductor refrigerator 1121, which is installed in the mounting groove 1111.

[0060] In the above embodiment, the cooling tank 111 is provided with a mounting groove 1111, and the semiconductor refrigerator 1121 is embedded in the mounting groove 1111, which allows the semiconductor refrigerator 1121 to form a closer contact with the cooling tank 111, shortens the heat transfer path, and makes the cold produced by the refrigeration assembly 112 more efficiently transferred to the cooling liquid in the tank, improving the cooling speed; at the same time, embedded installation does not require additional support to fix, which can reduce the space occupied by the refrigeration assembly 112, optimize the space utilization, make the cooling liquid source 110 more compact in structure, adapt to more installation scenarios, and also reduce the risk of component loosening or displacement, ensuring the stability of the refrigeration effect.

[0061] In a specific embodiment, the cold end surface of the semiconductor refrigerator 1121 and the outer wall surface of the cooling tank 111 are in close thermal contact. When the semiconductor refrigerator 1121 is powered on, its cold end surface rapidly absorbs heat. This cold is efficiently transferred to the wall surface of the cooling tank 111 in direct or indirect contact with the cold end surface through heat conduction, and then continuously and actively cools the cooling liquid stored in the cooling tank 111.

[0062] Preferably, the cooling assembly 112 further includes a cooling fan 1122, which is fixedly installed on the side of the thermoelectric cooler 1121 facing away from the cooling box 111, i.e., directly facing the hot end of the thermoelectric cooler 1121. When the thermoelectric cooler 1121 is working, its cold end absorbs heat from the coolant while its hot end releases a greater amount of heat. If this heat cannot be dissipated to the surrounding environment in a timely and effective manner, the temperature of the hot end will rise sharply, significantly reducing the cooling efficiency of the thermoelectric cooler 1121 and potentially causing damage due to overheating. Therefore, in this embodiment, by setting up the cooling fan 1122, forced convection is used to accelerate the airflow at the hot end of the thermoelectric cooler 1121, quickly dissipating the heat generated at the hot end to the external environment, effectively maintaining the temperature difference between the two ends of the thermoelectric cooler 1121, and preventing a decrease in cooling efficiency due to overheating of the hot end. Simultaneously, the cooling fan 1122 also reduces the workload of the thermoelectric cooler 1121, reduces energy loss, and further improves the heat dissipation efficiency and operational stability of the entire coolant source 110. In practical applications, the cooling fan 1122 can be a speed-adjustable fan, which automatically adjusts its speed according to the hot end temperature of the semiconductor cooler 1121, taking into account both heat dissipation effect and noise control.

[0063] Specifically, to meet the overall heat dissipation requirements of the cooling box 111 and ensure uniform temperature distribution of the coolant inside the cooling box 111, multiple cooling components 112 are evenly arranged along the length of the side wall where the cooling components 112 are installed. The spacing between each cooling component 112 is designed according to the length of the side wall of the cooling box 111, the heat generation power of the device 200 to be cooled, and its distribution, so as to achieve full-coverage cooling of the side wall of the cooling box 111. When multiple cooling components 112 work simultaneously, a uniform cooling distribution area can be formed on the side wall of the cooling box 111, avoiding excessively high or low local coolant temperatures, ensuring the consistency of the overall coolant temperature, and thus keeping the cooling effect of each part of the device 200 to be cooled uniform, preventing stress damage to the device due to excessive local temperature differences. In addition, the arrangement of multiple cooling components 112 also has a redundancy backup function. When one cooling component 112 fails, the remaining cooling components 112 can continue to work, ensuring the basic heat dissipation capacity of the coolant source 110 and improving the reliability and fault tolerance of the entire heat dissipation system.

[0064] In one embodiment, such as Figure 4 As shown, the heat dissipation device 100 also includes an infusion assembly 170, which includes a power pump 171 and an infusion line 172; one end of the infusion line 172 is connected to the outlet end of the power pump 171, and the other end is sealed to the inlet collection part 120.

[0065] In the above embodiment, by setting the power pump 171, the cooling liquid can be actively provided with stable flow power, ensuring that the cooling liquid overcomes the system flow resistance, smoothly transports from the cooling box 111 to the liquid inlet collection part 120, and continuously circulates in the closed circuit including the parallel flow channel, effectively avoiding the problem of slow flow rate of cooling liquid in the heat exchange flow channel and low heat dissipation efficiency due to insufficient natural flow power. At the same time, the liquid delivery pipeline 172 is sealingly connected at both ends to the outlet end of the power pump 171 and the liquid inlet collection part 120, which can prevent leakage of the cooling liquid during transportation, not only avoiding cooling liquid loss and its impact on surrounding components, but also ensuring the stability of system working pressure and flow.

[0066] In a specific embodiment, the liquid inlet collection part 120 is provided with a second liquid inlet for receiving cooling liquid; the power pump 171 is a submersible pump installed inside the cooling box 111. Through the built-in design of the power pump 171, not only the external vibration and noise are reduced, but also the external pipeline connection is reduced, and the volume of the heat dissipation device 100 and the risk of cooling liquid leakage are reduced. Specifically, the types of submersible pumps include but are not limited to direct current submersible pumps, alternating current submersible pumps, etc. One end of the liquid delivery pipeline 172 is connected to the outlet end of the submersible pump, and the other end is sealingly connected to the second liquid inlet of the liquid inlet collection part 120 through the outlet of the cooling box 111.

[0067] Specifically, the outlet of the cooling box 111 is provided with a sealing structure such as a rubber gasket to ensure that the liquid delivery pipeline 172 does not leak when passing through. The connection between the liquid delivery pipeline 172 and the second liquid inlet is sealingly connected, for example, by threaded connection, clamp connection or using sealing glue, to prevent the cooling liquid from leaking out, ensuring long-term stable operation of the heat dissipation device 100.

[0068] Specifically, the cooling liquid is stored in the cooling box 111, and after the submersible pump is started, the cooling liquid is pumped out from the inside of the cooling box 111 and delivered to the second liquid inlet of the liquid inlet collection part 120 through the liquid delivery pipeline 172. The liquid inlet collection part 120 then distributes the cooling liquid to the second heat exchange flow channel 160 and the first heat exchange flow channel 140. The whole system structure is compact and has good sealing, improving the cooling efficiency and reliability.

[0069] In a specific embodiment, the power pump 171 is connected to the cooling tank 111 to provide a power source for the flow of the cooling liquid. When the system is started, the power pump 171 starts to operate to pump the cooling liquid stored in the cooling tank 111 out and stably pump it into the liquid inlet collecting part 120 through the liquid delivery pipeline 172, and then the liquid inlet collecting part 120 performs subsequent distribution processing. In the cooling liquid return link, the liquid return collecting part 130 is provided with at least one second liquid outlet for guiding the cooling liquid collected in the liquid return collecting part 130 after the heat dissipation cycle. The cooling tank 111 is provided with a liquid return port, which is in fluid communication with the second liquid outlet of the liquid return collecting part 130 through the return pipeline 190, thereby constructing a circulation path for the cooling liquid to return from the liquid return collecting part 130 to the cooling tank 111, and realizing the recycling of the cooling liquid.

[0070] As a preferred embodiment, the return pipeline 190 is provided in multiple, one end of each return pipeline 190 is independently connected to one second liquid outlet on the liquid return collecting part 130, and the other end is correspondingly connected to one liquid return port on the cooling tank 111. Through this one-to-one connection mode, it can effectively avoid the problem of uneven distribution of cooling liquid in the return process, ensure that the cooling liquid can be uniformly and efficiently returned to the cooling tank 111, and improve the working efficiency of the entire circulation system.

[0071] Further, the return pipeline 190 and the corresponding second liquid outlet and liquid return port are connected in a sealed manner, for example, through flange connection, thread sealing or rubber sealing ring, etc., to prevent cooling liquid leakage and ensure the airtightness and reliability of the heat dissipation device 100.

[0072] In one embodiment, a temperature control module is further included, which includes a temperature sensor 181 and a temperature controller 182; the temperature sensor 181 is used to monitor the temperature of the device to be cooled 200; the temperature controller 182 is in communication connection with the temperature sensor 181, the refrigeration assembly 112 and the power pump 171, and controls the operation of the refrigeration assembly 112 and the power pump 171 according to the temperature data of the temperature sensor 181.

[0073] In the above embodiment, the temperature sensor 181 of the temperature control module can monitor the temperature of the device to be cooled 200 in real time, providing accurate temperature basis for system adjustment and avoiding blind cooling; the temperature controller 182 is connected with the temperature sensor 181, the refrigeration assembly 112 and the power pump 171, and can automatically control the refrigeration intensity of the refrigeration assembly 112 and the running state of the power pump 171 according to the monitored temperature data, so as to enhance the refrigeration and increase the flow rate of the cooling liquid to strengthen the cooling when the temperature is high; when the temperature is low, the refrigeration power or the flow rate can be reduced to save energy, so that the cooling system always operates in a state suitable for the temperature demand of the device, which not only ensures the stable operation of the device to be cooled 200, but also avoids energy waste, realizes the dynamic balance of cooling performance and energy efficiency optimization, and improves the intelligent level, environmental adaptability and operation economy of the whole cooling device 100.

[0074] In a specific embodiment, the temperature controller 182 is installed on the liquid return collecting part 130.

[0075] In a specific embodiment, the liquid return collecting part 130 is fixedly connected with a fixed plate 183 on the side close to the liquid inlet collecting part 120, and the temperature sensor 181 is fixed on the fixed plate 183. During installation, it should be ensured that the detection end of the temperature sensor 181 is closely attached to the bottom surface of the device to be cooled 200, and high-performance thermal conductive silicone grease is preferably applied between them to minimize the contact thermal resistance, so as to accurately sense the actual working temperature of the device to be cooled 200.

[0076] In a specific embodiment, the fixed plate 183 and the cooling box 111 are spaced apart, and they do not contact each other in physical structure and maintain a predetermined gap. It can be understood that if the fixed plate 183 is too close to or directly contacts the cooling box 111 with low temperature, the low temperature of the cooling box 111 will significantly affect the local temperature field of the fixed plate 183 through the heat conduction path of the solid. This low temperature interference will be transmitted to the temperature sensor 181 on the fixed plate 183, causing the measured value to be low, which cannot truly reflect the heating condition of the device to be cooled 200, and may further cause misjudgment and misoperation of the temperature control system.

[0077] Specifically, by spacing the fixed plate 183 and the cooling box 111, the interference path of the low temperature of the cooling box 111 through heat conduction to the fixed plate 183 and the temperature sensor 181 is effectively cut off in physical structure. It is ensured that the temperature signal sensed by the temperature sensor 181 is purely or mainly from the heat of the device to be cooled 200, greatly improving the independence and accuracy of temperature detection.

[0078] The specific working principle and use method of the present application are as follows: In use, the temperature of the device to be cooled 200 is detected in real time by the temperature sensor 181. When the detected temperature reaches the preset threshold of the temperature controller 182, the temperature controller 182 sends an electric signal to the power pump 171 and the semiconductor refrigerator 1121 simultaneously. Then, the semiconductor refrigerator 1121 starts to operate to actively cool the cooling liquid in the cooling box 111 to reduce the temperature thereof, and the power pump 171 starts to pump the cooled cooling liquid in the cooling box 111 to the liquid inlet collection part 120 at the end of the liquid delivery pipeline 172. The cooling liquid is distributed in the liquid inlet collection part 120 and then flows into the second heat exchange flow channel 160 and the first heat exchange flow channel 140 for multi-stage distribution, and the second heat exchange flow channel 160 and the first heat exchange flow channel 140 are in direct thermal contact with the device to be cooled 200 to efficiently absorb and remove the heat generated by the device to be cooled 200 by liquid cooling. After heat exchange, the cooling liquid with a higher temperature is collected in the liquid return collection part 130 and then returns to the cooling box 111 through the liquid return pipeline 190. Thus, the cooling liquid completes a complete cycle and is cooled again in the cooling box 111 to prepare for the next cooling operation, realizing the closed circulation and continuous use of the cooling liquid.

[0079] In the liquid cooling circulation path, when the cooling liquid flows through the fluid power cavity in the annular flow channel unit 141, the flow of the cooling liquid generates an impact force acting directly on the power impeller 151. The power impeller 151 converts the fluid kinetic energy of the cooling liquid into mechanical energy to drive the transmission shaft 153 to rotate stably. The rotary motion of the transmission shaft 153 is further transmitted to the heat dissipation fan blade 152 to drive the heat dissipation fan blade 152 to rotate to generate cooling air flow for air cooling the bottom of the device to be cooled 200. The combination of active liquid cooling and passive air cooling improves the overall heat dissipation efficiency of the device to be cooled 200.

[0080] According to an embodiment of the present application, in another aspect, an electronic device is also provided, which comprises a device to be cooled 200 and the above-mentioned heat dissipation device 100. Figure 1 As shown, the above-mentioned heat dissipation device 100 is in thermal contact with the device to be cooled 200.

[0081] Specifically, the electronic device includes but is not limited to a server, an on-board power supply of a new energy vehicle, a high-power power supply in the field of industrial automation, etc.

[0082] Specifically, the device to be cooled 200 includes but is not limited to a power supply board body, a chip, etc.

[0083] The heat dissipation device 100 and the electronic equipment provided by the application are described in detail above. The principles and implementation manners of the application are described by applying specific examples in the text, and the above description of the examples is only used to help understand the method of the application and the core idea thereof. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises: a cooling liquid source (110); a liquid inlet collection part (120) in communication with an outlet of the cooling liquid source (110); a liquid return collection part (130) in communication with a liquid return port of the cooling liquid source (110); a first heat exchange flow channel (140) connected between the liquid inlet collection part (120) and the liquid return collection part (130), and a fluid power cavity formed inside the first heat exchange flow channel (140); a wind cooling module (150) rotatably installed in the fluid power cavity.

2. The heat dissipating device according to claim 1, wherein The first heat exchange flow channel (140) comprises: an annular flow channel unit (141) in which the fluid power cavity is formed; a connecting pipeline (142) connecting the annular flow channel unit (141) with the liquid inlet collection part (120) and the liquid return collection part (130).

3. The heat dissipating device according to claim 2, wherein The wind cooling module (150) comprises: a power impeller (151) rotatably arranged in the fluid power cavity; a heat dissipation fan blade (152) linked with the power impeller (151) and located outside the annular flow channel unit (141).

4. The heat dissipating device according to claim 3, wherein The wind cooling module (150) further comprises a transmission shaft (153) connected between the power impeller (151) and the heat dissipation fan blade (152); a sealing bearing (154) arranged on a wall surface of the annular flow channel unit (141), and the transmission shaft (153) is rotatably supported by the sealing bearing (154).

5. The heat dissipating device according to any one of claims 1 to 4, characterized in that, The heat dissipation device further comprises a second heat exchange flow channel (160) arranged in parallel with the first heat exchange flow channel (140) and connected between the liquid inlet collection part (120) and the liquid return collection part (130).

6. The heat dissipating device according to any one of claims 1 to 4, wherein The cooling liquid source (110) comprises: a cooling box (111); a refrigeration assembly (112) installed in the cooling box (111).

7. The heat dissipating device according to claim 6, wherein The cooling box (111) is provided with a mounting groove (1111), and the refrigeration assembly (112) comprises a semiconductor refrigerator (1121) installed in the mounting groove (1111).

8. The heat dissipating device of claim 6, wherein, The heat dissipation device further comprises a liquid delivery assembly (170) comprising: a power pump (171); a liquid delivery pipeline (172) having one end connected with an outlet end of the power pump (171) and the other end sealingly connected with the liquid inlet collection part (120).

9. The heat dissipating device according to claim 8, wherein The heat dissipation device further comprises a temperature control module comprising: a temperature sensor (181) for monitoring the temperature of a device to be cooled (200); a temperature controller (182) in communication connection with the temperature sensor (181), the refrigeration assembly (112) and the power pump (171), and controlling the operation of the refrigeration assembly (112) and the power pump (171) according to the temperature data of the temperature sensor (181).

10. An electronic device, comprising: The heat dissipation device comprises: a device to be cooled (200); the heat dissipation device (100) according to any one of claims 1 to 9 is in heat conduction cooperation with the device to be cooled (200).

Images