Anti-grid-breakage screen printing plate structure

Abstract

The invention discloses a grid breaking prevention screen printing plate structure. The grid breaking prevention screen printing plate structure comprises an insulating glue printing screen printing plate and a solder paste printing screen printing plate, the insulating glue printing screen printing plate is provided with an annular insulating glue printing channel, the two inner edges, in the first direction, of the insulating glue printing channel are sunken inwards, the solder paste printing screen printing plate is provided with a solder paste printing channel, and the two inner edges, in the first direction, of the solder paste printing channel are sunken inwards. The solder paste printing channel protrudes oppositely along the opposite inner edges in the first direction, and the shape of the solder paste printing channel is consistent with the shape defined by the insulation paste printing channel, or the shape of the solder paste printing channel is an inscribed pattern of the shape defined by the insulation paste printing channel. The first direction is the same as the extension direction of the main grid lines. According to the anti-broken grid screen structure, the risk that the solder paste pierces the insulation paste can be reduced, the collapse scale of the solder paste is increased, meanwhile, the welding tension is guaranteed, the broken grid improvement effect is remarkable, the solder paste consumption is reduced, and the production cost of a photovoltaic module is reduced.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a structure for preventing grid breakage. Background Technology

[0002] In the photovoltaic industry, back-contact solar cells are a new type of cell technology that can improve the efficiency of cells and modules. Its main characteristic is that there are no grid lines obstructing the front of the cell; the positive and negative electrodes are located on the back of the cell. These electrodes consist of fine grid lines and solder joints. The fine grid lines are distributed in a finger-like pattern on the cell. Since the grid lines are all on the same side, to prevent short circuits caused by direct overlap of the positive and negative grid lines during soldering, insulating adhesive is printed at the tip of each fine grid line and on the main grid line before soldering. During cell soldering, the insulating adhesive softens, and after cooling, it shrinks. When the shrinkage of the insulating adhesive is significant, the grid lines become exposed.

[0003] Currently, when interconnecting back-contact solar cells, the solder ribbon and solder joints are connected and located on the back of the cell. There is a certain height difference between the solder joints and the fine grid lines on the cell. Combined with the insulating adhesive printed on the grid lines, the overall height difference is typically between 50μm and 150μm. Before soldering, a layer of solder paste is printed on the solder joints to compensate for this height difference. The main component of the solder joints is metallic Ag, while the main components of the solder paste are tin-lead alloy and flux. The solder paste collapses during printing, drying, and soldering. When soldering, the bottom edge of the solder paste extends beyond the solder joint and comes into direct contact with the insulating adhesive. After printing, drying, and soldering, the edge of the solder paste extends beyond the solder joint. Simultaneously, the softening of the insulating adhesive during soldering causes the solder paste to penetrate, or shrinkage after soldering exposes the grid lines, allowing the solder paste to directly contact and react with the fine grid lines. Furthermore, the negative electrode grid line is a silver grid line, and the temperature used in the welding process is usually greater than 150°C or even up to 350°C. At such a high temperature, metallic Ag will quickly dissolve in the tin-lead alloy to form a brittle intermetallic compound Ag3Sn (IMC), which leads to excessive consumption of metallic Ag. Moreover, because IMC is brittle, its bonding force with the silicon wafer is greatly reduced, making it easy to fall off during module transportation, testing, and service, resulting in grid breakage and affecting the reliability and efficiency of photovoltaic modules.

[0004] The current methods to solve this grid breakage problem are generally to increase the design size of the solder joint, reduce the mesh size of the solder paste printing stencil, and improve the performance of the solder paste and insulating adhesive. However, these methods have the following disadvantages: (1) The solder joint is made of metallic silver, and increasing the design size of the solder joint increases the production cost; (2) Increasing the solder joint requires redesigning the battery drawings, which increases the workload; (3) After reducing the mesh size of the solder paste printing stencil, the amount of ink penetrating the solder paste decreases, the wet weight decreases, the solder paste printing height decreases, the bottom area decreases, the contact area between the solder strip and the solder paste decreases, the welding pull decreases, which increases the risk of poor soldering and has an adverse effect on the power of the component; (4) The modification of the solder paste and insulating adhesive requires a long time and is not suitable for current production. Summary of the Invention

[0005] Therefore, it is necessary to provide a grid breakage prevention screen structure. This invention addresses the problem of solder paste piercing the insulating adhesive or the silver grid lines being exposed due to the insulating adhesive shrinking, leading to a reaction between the solder paste and the silver grid lines and resulting in grid breakage, by modifying the graphic design of the insulating adhesive printing screen and the solder paste printing screen. The grid breakage prevention screen structure of this invention reduces the risk of solder paste piercing the insulating adhesive, increases the collapsible dimensions of the solder paste while ensuring welding tensile strength, significantly improves grid breakage prevention, reduces solder paste usage, and lowers the production cost of photovoltaic modules.

[0006] One embodiment of this application provides a breakage-resistant grid structure.

[0007] An anti-breakage grid screen structure includes an insulating adhesive printing screen and a solder paste printing screen. The insulating adhesive printing screen has an annular insulating adhesive printing channel, and the two inner edges of the insulating adhesive printing channel are recessed inward along a first direction. The solder paste printing screen has a solder paste printing channel, and the two inner edges of the solder paste printing channel are convex towards each other along the first direction. The shape of the solder paste printing channel is consistent with the shape enclosed by the insulating adhesive printing channel, or the shape of the solder paste printing channel is an inscribed figure of the shape enclosed by the insulating adhesive printing channel. The first direction is the same as the extension direction of the main grid line.

[0008] In some embodiments, the inner edge of the insulating adhesive printing channel that is recessed inward is an arc-shaped recess or a pointed recess, and correspondingly, the inner edge of the solder paste printing channel that is convex in opposite directions is an arc-shaped protrusion or a pointed protrusion.

[0009] In some embodiments, the area of ​​the insulating adhesive printing channel is equal to or smaller than the area of ​​the region enclosed by the insulating adhesive printing channel.

[0010] In some embodiments, when the shape of the solder paste printing channel is consistent with the shape enclosed by the insulating adhesive printing channel, the maximum spacing between the two inner edges of the insulating adhesive printing channel along the first direction is equal to the maximum width of the solder paste printing channel along the first direction, and the minimum spacing between the two inner edges of the insulating adhesive printing channel along the first direction is equal to the minimum width of the solder paste printing channel along the first direction.

[0011] In some embodiments, when the shape of the solder paste printing channel is an inscribed pattern of the shape enclosed by the insulating adhesive printing channel, the minimum spacing between the two inner edges of the insulating adhesive printing channel along the first direction is equal to the maximum width of the solder paste printing channel along the first direction.

[0012] In some embodiments, the two inner edges of the insulating adhesive printing channel along the second direction are parallel, the two inner edges of the solder paste printing channel along the second direction are parallel, and the width of the solder paste printing channel along the second direction is less than or equal to the spacing between the two inner edges of the insulating adhesive printing channel along the second direction, wherein the second direction is perpendicular to the first direction.

[0013] In some embodiments, the insulating adhesive printing channels extend along mutually perpendicular first and second directions, such that the insulating adhesive printing channels as a whole have a cross-shaped structure.

[0014] In some embodiments, the length of the insulating adhesive printing channel along the first direction is the same as the length along the second direction.

[0015] In some embodiments, the insulating adhesive printing screen has a plurality of spaced-apart insulating adhesive printing channels.

[0016] In some embodiments, the solder paste printing stencil has multiple spaced solder paste printing channels.

[0017] The aforementioned anti-breakage grid screen structure features a graphical design for the mesh distribution of the insulating adhesive printing screen and the solder paste printing screen. Unlike screens used in traditional technologies, the insulating adhesive printing screen of this application has one pair of opposing inner edges of the insulating adhesive printing channels recessed inward. After the insulating adhesive is printed, the insulating adhesive at these opposing positions forms closer "ear"-shaped protrusions. More insulating adhesive is printed at both ends of the solder joints along the main grid line extension direction, extending beyond the grid line head. This results in greater shrinkage margin for the insulating adhesive after the cell soldering and cooling. Simultaneously, the increased amount of insulating adhesive reduces the risk of solder paste puncture, thus providing stronger protection for the main grid lines. Correspondingly, the solder paste printing channels of the solder paste printing screen have two opposing inner edges that bulge towards each other along the first direction, ensuring that the shape of the solder paste printing channels matches the shape enclosed by the insulating adhesive printing channels, or that the shape of the solder paste printing channels is an inscribed shape of the shape enclosed by the insulating adhesive printing channels. This allows the solder paste printed through the solder paste printing channels to be contained within the central area enclosed by the insulating adhesive after printing through the insulating adhesive printing channels. The anti-breakage grid structure of the present invention can reduce the risk of solder paste piercing the insulating adhesive, increase the collapse size of the solder paste while ensuring welding tensile strength, significantly improve the grid breakage effect, reduce the amount of solder paste used and reduce the production cost of photovoltaic modules. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0020] Figure 1 This is a schematic diagram of an insulating adhesive printing screen for an anti-breakage grid structure according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of a solder paste printing screen with an anti-breakage grid structure according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of an insulating adhesive printing screen for an anti-breakage grid structure according to another embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of a solder paste printing screen with an anti-breakage grid structure according to another embodiment of the present invention.

[0024] Explanation of reference numerals in the attached figures

[0025] 100. Insulating adhesive printing screen; 101. Insulating adhesive printing channel; 200. Solder paste printing screen; 201. Solder paste printing channel. Detailed Implementation

[0026] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] This application provides an anti-breakage grid screen structure to solve at least one of the following problems in traditional methods for solving grid breakage: (1) The solder joints are made of metallic silver, and increasing the design size of the solder joints increases production costs; (2) Increasing the size of the solder joints requires redesigning the battery drawings, increasing workload; (3) After reducing the mesh size of the solder paste printing screen, the amount of solder paste penetrating the ink decreases, the wet weight decreases, the solder paste printing height decreases, the bottom area decreases, the contact area between the solder strip and the solder paste decreases, the welding tensile force decreases, increasing the risk of poor soldering and adversely affecting the power of the component; (4) The modification of solder paste and insulating adhesive requires a long time and is not suitable for current production. The anti-breakage grid screen structure will be described below with reference to the accompanying drawings.

[0033] The anti-breakage grid structure provided in this application embodiment is exemplary; please refer to [link / reference]. Figure 1 As shown, Figure 1 This is a schematic diagram of the anti-breakage grid structure provided in an embodiment of this application. The anti-breakage grid structure of this application can be used in the production of photovoltaic modules.

[0034] To more clearly illustrate the structure of the anti-breakage grid panel, the following description, in conjunction with the accompanying drawings, will explain its structure. For an example, please refer to... Figure 1 As shown, Figure 1 This is a schematic diagram of the anti-breakage grid structure provided in the embodiments of this application.

[0035] A screen printing stencil structure for preventing screen breakage includes an insulating adhesive printing stencil 100 and a solder paste printing stencil 200. The insulating adhesive printing stencil 100 has an annular insulating adhesive printing channel 101, see [reference needed]. Figure 1 As shown, the ring refers to Figure 1The area indicated by 101 is cut out on the insulating adhesive printing screen 100 for printing insulating adhesive. The printed insulating adhesive has a ring-shaped structure, and the central area of ​​the ring-shaped insulating adhesive is used for printing solder paste. The two inner edges of the insulating adhesive printing channel 101 are recessed inward along the first direction. The solder paste printing screen 200 has solder paste printing channels 201. The inner edges of the solder paste printing channels 201 are convex towards each other along the first direction. The shape of the solder paste printing channels 201 is consistent with the shape enclosed by the insulating adhesive printing channels 101, or the shape of the solder paste printing channels 201 is an inscribed figure of the shape enclosed by the insulating adhesive printing channels 101, and the first direction is the same as the extension direction of the main grid lines.

[0036] After the insulating adhesive is printed on the insulating adhesive printing screen 100 and the solder paste is printed on the solder paste printing screen 200, the insulating adhesive has an overall ring structure. The area enclosed in the middle of the printed insulating adhesive is a blank area, which is used for printing solder paste.

[0037] This application designs the insulating adhesive printing channel 101 of the insulating adhesive printing screen 100 so that one pair of inner edges of the printed insulating adhesive protrude towards each other, similar to adding "ears." This increases the shrinkage size of the insulating adhesive after soldering and cooling, reducing the risk of solder paste puncturing the insulating adhesive. Correspondingly, the solder paste printing channel 201 of the solder paste printing screen 200 is designed to protrude towards each other in the direction of the main grid lines. After solder paste is printed, this increases the collapse size of the solder paste while ensuring soldering pull strength. Under the combined effect of these two improvements, the grid breakage improvement effect is significant. This application achieves the effect of improving grid breakage by changing the mesh size of the insulating adhesive printing screen 100 and the solder paste printing screen 200, with low improvement cost. At the same time, the reduction in solder paste usage also reduces the production cost of photovoltaic modules.

[0038] In some embodiments, preferably, the solder paste printing channel 201 is an inscribed rectangle of the shape enclosed by the insulating adhesive printing channel 101.

[0039] In some embodiments, the inner edge of the inwardly recessed insulating adhesive printing channel 101 is arc-shaped or pointed, and correspondingly, the inner edge of the opposing convex solder paste printing channel 201 is arc-shaped or pointed. It is easy to understand that in other embodiments, the arc-shaped recess of the inwardly recessed inner edge of the insulating adhesive printing channel 101 can be a single arc or a continuously meandering arc shape, and correspondingly, the arc-shaped protrusion of the opposing convex inner edge of the solder paste printing channel 201 can be a single arc or a continuously meandering arc shape. Similarly, the pointed recess of the inwardly recessed inner edge of the insulating adhesive printing channel 101 can be a single point or multiple points, and correspondingly, the pointed protrusion of the opposing convex inner edge of the solder paste printing channel 201 can be a single point or multiple points.

[0040] In some embodiments, the area of ​​the insulating adhesive printing channel 101 is equal to or smaller than the area of ​​the region enclosed by the insulating adhesive printing channel 101.

[0041] In some of these embodiments, please refer to Figure 1 , Figure 2 and Figure 3 As shown, when the shape of the solder paste printing channel 201 matches the shape enclosed by the insulating adhesive printing channel 101, the maximum spacing between the two inner edges of the insulating adhesive printing channel 101 along the first direction is equal to the maximum width of the solder paste printing channel 201 along the first direction, and the minimum spacing between the two inner edges of the insulating adhesive printing channel 101 along the first direction is equal to the minimum width of the solder paste printing channel 201 along the first direction. In this application, the solder paste printing screen 200 has two sides in the main grid line direction designed to be convex inward, while the overall length and width in the first and second directions remain unchanged.

[0042] In some of these embodiments, please refer to Figure 1 , Figure 2 and Figure 4 As shown, when the shape of the solder paste printing channel 201 is an inscribed rectangle of the shape enclosed by the insulating adhesive printing channel 101, the minimum spacing between the two inner edges of the insulating adhesive printing channel 101 along the first direction is equal to the maximum width of the solder paste printing channel 201 along the first direction. In this case, after using the solder paste printing screen 200, the printing size of the solder paste in the main grid line direction is reduced, while the dimensions on the other two sides remain unchanged. After printing, drying, and soldering, no contact between the solder paste and the main grid line is observed in the battery cell.

[0043] It should be noted that the appendix to this application Figure 1 Appendix Figure 3 The diagram only shows one of the insulating adhesive printing channels 101; the appendix of this application Figure 2 Appendix Figure 4 The diagram only shows one solder paste printing channel 201. In actual production, the insulating adhesive printing screen 100 has multiple insulating adhesive printing channels 101, which can be regularly distributed. The solder paste printing screen 200 also has multiple solder paste printing channels 201, which can be regularly distributed.

[0044] In some embodiments, the two inner edges of the insulating adhesive printing channel 101 along the second direction are parallel, the two inner edges of the solder paste printing channel 201 along the second direction are parallel, and the width of the solder paste printing channel 201 along the second direction is less than or equal to the spacing between the two inner edges of the insulating adhesive printing channel 101 along the second direction, wherein the second direction is perpendicular to the first direction.

[0045] When the width of the solder paste printing channel 201 along the second direction is equal to the distance between the two inner edges of the insulating adhesive printing channel 101 along the second direction, the printing size of the solder paste in the main grid line direction is reduced after using the solder paste printing screen 200, while the size on the other two sides remains unchanged. In actual production, no contact between the solder paste and the main grid line is found after the battery cells are printed, dried, and soldered.

[0046] Alternatively, the two inner edges of the insulating adhesive printing channel 101 along the first and second directions are parallel, respectively. The width of the solder paste printing channel 201 along the second direction is smaller than the distance between the two inner edges of the insulating adhesive printing channel 101 along the second direction. In this case, the solder paste printing screen 200 reduces the overall size of the solder paste printing mesh, while maintaining a square shape. After using the solder paste printing screen 200, the dimensions of all four sides of the solder paste are reduced. In actual production, no contact between the solder paste and the main grid lines was found after the battery cells were printed, dried, and soldered.

[0047] In some embodiments, the insulating adhesive printing channel 101 extends along a first direction and a second direction that are perpendicular to each other, such that the insulating adhesive printing channel 101 generally has a cross-shaped structure.

[0048] In some embodiments, the length of the insulating adhesive printing channel 101 along the first direction is the same as the length along the second direction.

[0049] In some embodiments, the insulating adhesive printing screen 100 has a plurality of spaced insulating adhesive printing channels 101.

[0050] In some embodiments, the solder paste printing screen 200 has a plurality of spaced solder paste printing channels 201.

[0051] The aforementioned anti-breakage grid screen structure features a graphical design for the mesh distribution of the insulating adhesive printing screen 100 and the solder paste printing screen 200. Unlike screens used in traditional technologies, the insulating adhesive printing channel 101 of the insulating adhesive printing screen 100 in this application has one pair of opposing inner edges recessed inward. After the insulating adhesive is printed, the insulating adhesive at these opposing positions will form closer "ear"-shaped protrusions. More insulating adhesive is printed at both ends of the solder joint in the direction of the main grid line extension, and more extends beyond the head of the grid line. After the battery cell is soldered and cooled, the insulating adhesive has a larger shrinkage margin. At the same time, the increased amount of insulating adhesive reduces the risk of solder paste puncture, thus providing stronger protection for the main grid line. Correspondingly, the solder paste printing channels of the solder paste printing stencil 200 have two opposing inner edges that bulge towards each other along the first direction, so that the shape of the solder paste printing channel 201 is consistent with the shape enclosed by the insulating adhesive printing channel 101, or the shape of the solder paste printing channel 201 is an inscribed shape of the shape enclosed by the insulating adhesive printing channel 101. In this way, the solder paste printed through the solder paste printing channel 201 can be contained within the central area enclosed by the insulating adhesive after printing through the insulating adhesive printing channel 101. The anti-breakage stencil structure of the present invention can reduce the risk of solder paste puncturing the insulating adhesive, increase the collapse dimension of the solder paste while ensuring the welding pull force, significantly improve the breakage effect, reduce the amount of solder paste used, and also reduce the production cost of photovoltaic modules.

[0052] This application Figures 1-4 The two sizes of solder paste printing screens 200 shown in the paper have smaller mesh sizes than the original screens in traditional technology, resulting in less solder paste usage, lower production costs, and reduced erosion of the solder joint silver. This application... Figures 1-4 The soldering pull of the battery cells printed by the two sizes of solder paste printing screens 200 shown in the figure is compared. The results are shown in Table 1. As can be seen from Table 1, the anti-breakage grid screen structure of the technical solution of this application embodiment can reduce the soldering pull. Figure 2 The soldering pull of the 200mm solder paste printing screen is higher than that of the others. Figure 4 The tensile force of the 200mm solder paste printing screen is 1.0N. This is because... Figure 2 The solder paste printing screen with a screen size of 200 has a soldering contact area greater than that of the solder paste. Figure 4 The solder paste contact area printed by a 200mm solder paste printing screen. Figure 4 Because the solder paste has a small contact area, it has better soldering performance.

[0053] Table 1

[0054]

[0055] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0056] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A structure for preventing breakage of a wire mesh panel, characterized in that, The screen includes an insulating adhesive printing stencil (100) and a solder paste printing stencil (200). The insulating adhesive printing stencil (100) has an annular insulating adhesive printing channel (101). The insulating adhesive printing channel (101) is recessed inward along two opposing inner edges in a first direction. The solder paste printing stencil (200) has a solder paste printing channel (201). The solder paste printing channel (201) is convex towards each other along two opposing inner edges in the first direction. The shape of the solder paste printing channel (201) is consistent with the shape enclosed by the insulating adhesive printing channel (101), or the shape of the solder paste printing channel (201) is an inscribed figure of the shape enclosed by the insulating adhesive printing channel (101). The first direction is the same as the extension direction of the main grid line.

2. The anti-breakage grid structure according to claim 1, characterized in that, The inner edge of the insulating adhesive printing channel (101) is recessed inward in an arc shape or a pointed shape, and correspondingly, the inner edge of the solder paste printing channel (201) is raised in an arc shape or a pointed shape.

3. The anti-breakage grid structure according to claim 1, characterized in that, The area of ​​the insulating adhesive printing channel (101) is equal to or less than the area of ​​the region enclosed by the insulating adhesive printing channel (101).

4. The anti-breakage grid structure according to claim 1, characterized in that, When the shape of the solder paste printing channel (201) is consistent with the shape enclosed by the insulating adhesive printing channel (101), the maximum spacing between the two inner edges of the insulating adhesive printing channel (101) along the first direction is equal to the maximum width of the solder paste printing channel (201) along the first direction, and the minimum spacing between the two inner edges of the insulating adhesive printing channel (101) along the first direction is equal to the minimum width of the solder paste printing channel (201) along the first direction.

5. The anti-breakage grid structure according to claim 1, characterized in that, When the shape of the solder paste printing channel (201) is an inscribed pattern of the shape enclosed by the insulating adhesive printing channel (101), the minimum spacing between the two inner edges of the insulating adhesive printing channel (101) along the first direction is equal to the maximum width of the solder paste printing channel (201) along the first direction.

6. The anti-breakage grid structure according to any one of claims 1 to 5, characterized in that, The two inner edges of the insulating adhesive printing channel (101) along the second direction are parallel, the two inner edges of the solder paste printing channel (201) along the second direction are parallel, and the width of the solder paste printing channel (201) along the second direction is less than or equal to the distance between the two inner edges of the insulating adhesive printing channel (101) along the second direction, wherein the second direction is perpendicular to the first direction.

7. The anti-breakage grid structure according to any one of claims 1 to 5, characterized in that, The insulating adhesive printing channel (101) extends along a first direction and a second direction that are perpendicular to each other, so that the insulating adhesive printing channel (101) has a cross-shaped structure as a whole.

8. The anti-breakage grid structure according to claim 7, characterized in that, The length of the insulating adhesive printing channel (101) along the first direction is the same as the length along the second direction.

9. The anti-breakage grid structure according to any one of claims 1 to 5 and 8, characterized in that, The insulating adhesive printing screen (100) has a plurality of spaced-apart insulating adhesive printing channels (101).

10. The anti-breakage grid structure according to any one of claims 1 to 5 and 8, characterized in that, The solder paste printing screen (200) has multiple spaced solder paste printing channels (201).

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