Laser emission sensor and laser radar system

Abstract

The invention relates to the technical field of laser radars, and discloses a laser emission sensor and a laser radar system.The laser emission sensor comprises a substrate which comprises a first wiring layer, an insulating layer and a second wiring layer; a driving module and a plurality of light-emitting modules are arranged on the first wiring layer, any light-emitting module comprises a plurality of light sources, the light sources are connected with the driving module through corresponding first leads, and the first leads are arranged on the first wiring layer; a second lead opposite to the first lead is arranged on the second wiring layer; a plurality of connecting blocks are arranged on the insulating layer, the first lead is connected in parallel with the opposite second lead through at least two connecting blocks, and the length of the second lead connected in parallel is positively correlated with the length of the first lead. Response time and luminance of different light sources tend to be consistent, the reduction degree of a laser radar system to a target object is improved, and the reliability of the laser radar system is improved. And the signal crosstalk caused by increasing the line broadband of the lead and the increase of the size of the laser emission sensor can be avoided.

Description

Technical Field

[0001] This invention relates to the field of lidar technology, specifically to a laser emission sensor and lidar system. Background Technology

[0002] LiDAR is a radar system that uses a laser emitting sensor to emit a laser beam to detect the position, velocity, shape, and other characteristics of a target. These characteristics are then received by a laser receiving sensor and converted into image information. It is widely used in autonomous driving, intelligent robots, surveying and mapping, and other fields.

[0003] In related technologies, the laser emission sensor of a lidar system includes a substrate, a driving module, and multiple light-emitting modules. Each light-emitting module contains multiple light sources, each connected to the driving module via leads. Because the distances between different light sources and the driving module vary, the lengths of the leads connecting them also differ. This results in varying response times and brightness of different light sources when the driving module simultaneously outputs control signals to drive the light-emitting modules. Typically, longer leads correspond to lamps with longer response times and lower brightness. This leads to positional shifts and chromaticity differences between the detection results of different lamps, thus affecting the lidar's detection performance. Consequently, the lidar system's scanning detection results fail to accurately reproduce the true target object. Summary of the Invention

[0004] This invention provides a laser emission sensor and a lidar system to solve the technical problem of insufficient fidelity in the scanning and detection results of lidar systems to the real target object.

[0005] In a first aspect, the present invention provides a laser emission sensor for use in a lidar system, comprising: The substrate includes a first wiring layer, an insulating layer, and a second wiring layer sequentially disposed along the thickness direction of the substrate. A driving module and several light-emitting modules are provided on the first wiring layer. Each light-emitting module includes several light sources. The light sources are connected to the driving module through corresponding first leads. The first leads are provided on the first wiring layer. The second wiring layer has a second lead that is opposite to the first lead; The insulating layer is provided with a plurality of connecting blocks that penetrate the insulating layer along the thickness direction of the substrate. The first lead is connected in parallel with the opposite second lead through at least two connecting blocks. The length of the second lead connected in parallel is positively correlated with the length of the opposite first lead, so as to reduce the difference in response time of different light sources and reduce the difference in luminous brightness of different light sources.

[0006] The laser emission sensor of this invention adjusts the resistance of the leads between each light source and the driving module by setting a second lead on the second wiring layer. The length of the parallel second lead is positively correlated with the length of the corresponding first lead, so that the resistance of the leads connecting each power source to the driving module tends to be consistent. When the driving module drives and controls the light-emitting module, the response time and brightness of different light sources tend to be consistent. The projection on the target object will not have detection deviation, the position between the lines of the motion trajectory of the detection point will not be offset, the color of the formed point cloud will be accurate, the overall detection result has high fidelity to the target object, and it can avoid the problems of signal crosstalk caused by increasing the line width of the lead and the increase in the size of the laser emission sensor.

[0007] In one alternative implementation, the number of connecting blocks between the first lead and the opposite second lead is positively correlated with the length of the first lead.

[0008] In this method, the resistance of the leads is adjusted by increasing the number of connecting blocks. As the number of connecting blocks increases, the resistance of the leads decreases, which further makes the resistance of the leads connecting each power supply to the drive module more consistent.

[0009] In one alternative implementation, the width of the connecting block between the first lead and the opposing second lead is positively correlated with the length of the first lead, wherein the width direction of the connecting block is parallel to the extension direction of the connected first lead at the current position.

[0010] In this method, the resistance of the leads is adjusted by adjusting the width of the connecting block. As the width of the connecting block increases, the resistance of the leads decreases, which further makes the resistance of the leads connecting each power supply to the drive module more consistent.

[0011] In one alternative implementation, the length of the second lead is positively correlated with the length of the opposite first lead, and any first lead is connected in parallel with the opposite second lead through two connecting blocks, with the two connecting blocks respectively located at both ends of the second lead.

[0012] In this method, two connecting blocks are respectively placed at both ends of the second lead. This arrangement connects the second lead to the first lead, making full use of the second lead of the second wiring layer.

[0013] In one optional implementation, the first lead includes a light source connection segment, a position adjustment segment, and a drive connection segment. Any light source is sequentially connected to different pins of the drive module through the corresponding light source connection segment, position adjustment segment, and drive connection segment of the first lead. Any drive connection segment is perpendicular to the length direction of the drive module, the position adjustment segment is perpendicular to the drive connection segment, and the light source connection segment is parallel to the drive connection segment.

[0014] This method allows for a more orderly and regular arrangement of leads, reduces crossovers and interference between leads, lowers wiring difficulty, increases substrate utilization, and also facilitates stable signal transmission.

[0015] In one alternative implementation, the centers of any light source are located on the same straight line.

[0016] In this method, by setting the centers of the light sources on a straight line, it is convenient to use the light sources to scan the target object, thereby improving the accuracy and resolution of the detection.

[0017] In one alternative implementation, the light source is an LED chip.

[0018] In this method, LED beads are used as the light source, which can reduce production costs while ensuring the performance of the laser emission sensor, and also facilitate subsequent maintenance and replacement.

[0019] In one alternative embodiment, the substrate further includes a base layer disposed on a side close to the second wiring layer.

[0020] In this method, the overall strength of the substrate can be increased through the base layer.

[0021] In a second aspect, the present invention provides a lidar system including a laser emission sensor as described in any of the first aspects of the present invention.

[0022] In one optional implementation, the lidar system further includes a galvanometer, a laser receiving sensor, and an image processor. The galvanometer is disposed at the beam emission end of the laser emitting sensor and is used to scan the emitted beam along a single or dual line and then illuminate the target object. The laser receiving sensor generates an electrical signal based on the beam reflected back from the target object and sends the electrical signal to the image processor, which generates image information based on the electrical signal. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a laser emission sensor in related technologies; Figure 2 for Figure 1 The diagram shows a single-line scanning detection of a laser emission sensor. Figure 3 for Figure 1The diagram shows a dual-line scanning detection method for a laser emission sensor. Figure 4 This is a cross-sectional view of the first type of laser emission sensor according to an embodiment of the present invention; Figure 5 This is a top view of the first wiring layer according to an embodiment of the present invention; Figure 6 This is a top view of the second wiring layer according to an embodiment of the present invention; Figure 7 This is a schematic diagram of a single-line scanning detection of a laser emission sensor according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the dual-line scanning detection of the laser emission sensor according to an embodiment of the present invention; Figure 9 This is a cross-sectional view of a second type of laser emission sensor according to an embodiment of the present invention; Figure 10 This is a schematic diagram of the structure of a lidar system according to an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached figures: 100, Substrate; 101, Base layer; 102, First wiring layer; 103, Insulating layer; 104, Second wiring layer; 1031, Connector block; 110, Light-emitting module; 1101, Light source; 1101', Projector; 1102, Lead wire; 11021, First lead wire; 11022, Second lead wire; 200, Driving module; 10, Laser emitting sensor; 20, Galvanometer; 30, Laser receiving sensor; 40, Image processor. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, referring to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate medium; or a connection within two components. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within acceptable deviations, determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein an acceptable deviation range for approximate equality is, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] like Figure 1 As shown, in related technologies, a laser emission sensor 10 includes a substrate 100, a driving module 200, and multiple light-emitting modules 110. The light-emitting modules 110 are disposed on the substrate 100 and include several light sources 1101. The light-emitting modules 110 are electrically connected to the driving module 200 via leads 1102. Because the distances between different light sources 1101 and the driving module 200 are different, the lengths of the leads 1102 used to electrically connect the light sources 1101 and the driving module 200 are also different, for example... Figure 1 The lead 1102a is significantly longer than the lead 1102b, causing the response times of different light sources 1101 to differ when the driving module 200 drives and controls the light-emitting module 110, and also resulting in differences in brightness. Generally, the relatively longer lead 1102 corresponds to a light source 1101 with a longer response time and lower brightness.

[0029] Figure 2 and Figure 3These diagrams illustrate single-line and dual-line scanning detection of a target object by the laser emitting sensor 10 of a lidar system. The target object is detected by single-line scanning in the X direction or dual-line scanning in both the X and Y directions through the projections 1101' of each light source 1101 of the emitting module 110 onto the target object. For example, the projections of light sources 1101a and 1101b are 1101a' and 1101b', respectively. The scanning detection results are then fed back to the laser receiving sensor 30 of the lidar system (not shown in the diagram). In existing technologies, the response times and brightness of different light sources 1101 vary, leading to positional shifts and chromaticity differences between the detection results of different light sources 1101, thus affecting the detection performance of the lidar. Consequently, the scanning detection results of the current lidar system lack sufficient fidelity in reproducing the true target object.

[0030] To improve the accuracy and resolution of LiDAR detection and scanning, the number of lines in current LiDAR systems is constantly increasing, from 16, 32, and 64 lines to 128 and 192 lines, and may even exceed 1000 lines in the future. With the increase in the number of lines, the number of light sources 1101 and lead wires 1102 also increases, leading to greater differences in the length of lead wires 1102 at different locations, and also greater differences in the offset and fidelity of scanning detection results between different light sources 1101.

[0031] In the relevant improvement scheme, the width of the lead 1102 varies with its length; the longer the lead 1102, the wider it is. By adjusting the width of different leads 1102, the resistance of all leads 1102 tends to be consistent, thus effectively solving the technical problem of large resistance differences between leads 1102 of different lengths in the laser emission sensor 10. However, the wider the lead 1102, the more it needs to be widened. Increasing the lead width also leads to a closer distance between leads. The closer the distance between leads, the more obvious the crosstalk. As the spacing between leads increases, signal crosstalk will decrease. In addition, signal crosstalk is also related to the lead width; the wider the lead width, the more obvious the signal crosstalk. Generally, when the spacing between leads is more than three times the lead width, crosstalk can be basically ignored. Therefore, the increased linewidth of lead 1102 will make it easier for signal crosstalk to occur between adjacent leads. In order to reduce signal crosstalk between leads, the spacing between leads needs to be increased, which will further increase the size of the laser emission sensor 10.

[0032] In view of this, embodiments of the present invention provide a laser emission sensor 10 and a lidar system. To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] According to an embodiment of the present invention, a laser emission sensor 10 is provided, which is applied to a lidar system. (Combined with...) Figure 4 , Figure 5 and Figure 6 As shown, the laser emission sensor 10 includes: The substrate 100 includes a first wiring layer 102, an insulating layer 103, and a second wiring layer 104 sequentially disposed along the thickness direction of the substrate 100. A driving module 200 and several light-emitting modules 110 are provided on the first wiring layer 102. Each light-emitting module 110 includes several light sources 1101. The light sources 1101 are connected to the driving module 200 through corresponding first leads 11021. The first leads 11021 are provided on the first wiring layer 102. The second wiring layer 104 is provided with a second lead 11022 opposite to the first lead 11021; The insulating layer 103 is provided with a plurality of connecting blocks 1031 that penetrate the insulating layer 103 along the thickness direction of the substrate 100. The first lead 11021 is connected in parallel with the opposite second lead 11022 through at least two connecting blocks 1031. The length of the parallel second lead 11022 is positively correlated with the length of the opposite first lead 11021, so as to reduce the difference in response time of different light sources 1101 and reduce the difference in luminous brightness of different light sources 1101.

[0034] Specifically, the substrate 100 is a physical support platform that carries the components on the laser emission sensor 10, and can be a printed circuit board (PCB). The printed circuit board includes a single-layer printed circuit board, a double-layer printed circuit board, or a multi-layer printed circuit board. In this embodiment of the invention, the substrate 100 adopts a double-layer printed circuit board.

[0035] The driving module 200 includes a microcontroller and a corresponding driving circuit. The microcontroller outputs driving signals to the driving circuit, which controls the opening and closing of each light source 1101.

[0036] There are multiple light-emitting modules 110, and each light-emitting module 110 has multiple light sources 1101. The light source 1101 is the signal transmitter of the lidar system, and can use devices such as 905nm semiconductor laser, 1550nm fiber laser, and LED beads.

[0037] The number of light-emitting modules 110 and light sources 1101 can be set according to the actual situation. In one example, the light-emitting modules 110 are arranged at intervals on the substrate 100, and a total of 5 light-emitting modules 110 are arranged on the substrate 100. Each light-emitting module 110 includes 16 light sources 1101.

[0038] The driving module 200 and several light-emitting modules 110 are all located in the first wiring layer 102 and are connected by the first lead 11021.

[0039] The insulating layer 103 is made of insulating material. The insulating layer 103 isolates the first wiring layer 102 and the second wiring layer 104, so that the circuit wiring on the first wiring layer 102 and the second wiring layer 104 does not interfere with each other.

[0040] The connector 1031 is made of a metal material that can conduct current. The connector 1031 is mainly used to realize the electrical connection between the first wiring layer 102 and the second wiring layer 104.

[0041] The second lead 11022 on the second wiring layer 104 and the first lead 11021 on the first wiring layer 102 are arranged opposite to each other. The length of the second lead 11022 is shorter than or equal to the length of the corresponding first lead 11021. After the second lead 11022 is projected onto the first wiring layer 102 along the thickness direction of the substrate 100, it will be covered by the corresponding first lead 11021.

[0042] Because the different light sources 1101 are located at different positions and at different distances from the driving module 200, the lengths of the first leads 11021 are not exactly the same. For example, when the light-emitting module 110 is located in the lower middle part of the substrate 100, and the light sources 1101 are distributed above the substrate 100 and arranged horizontally, the length of the first lead 11021 between the middle light source 1101 and the driving module 200 is shorter, while the lengths of the first leads 11021 between the light sources 1101 on both sides and the driving module 200 are longer.

[0043] For first leads 11021 of different lengths, the longer the length, the greater the resistance, which will cause different brightness of different light sources 1101, resulting in errors such as color difference or light intensity difference in the detected light signal. In addition, the longer the signal takes to reach the light source 1101 from the drive module 200, the more inconsistent the output beam time of the light source 1101 will be, resulting in the inability to achieve time synchronization when scanning the target object, and causing the position of the scanning result to be deviated. Both of these factors will affect the degree of reproduction of the real target object by the scanning detection result.

[0044] In this embodiment of the invention, connecting blocks 1031 are respectively provided at or near both ends of the second lead 11022, which can connect the second lead 11022 and the first lead 11021 in parallel. As can be seen from the parallel connection characteristics, the resistance after parallel connection is smaller than the resistance before parallel connection. The length of the second lead 11022 connected in parallel is positively correlated with the length of the corresponding first lead 11021. That is, the longer the length of the first lead 11021, the longer the length of the second lead 11022 connected in parallel, and the greater the reduction in resistance. This makes the wire resistance between different light sources 1101 and driving modules 200 tend to be the same.

[0045] like Figure 7 and Figure 8 As shown, in this embodiment of the invention, the length of the first lead 11021 connected to the parallel second lead 11022 is set to be longer, so that the wire resistance between different light sources 1101 and the driving module 200 tends to be the same. When the target object is detected by single-line scanning or dual-line scanning, the response time and luminous brightness of different light sources 1101 tend to be consistent. The projection 1101' on the target object can accurately represent the position and shape of the target object, and there will be no detection deviation. The detection result has a high degree of reproduction of the target object.

[0046] The laser emission sensor 10 of the present invention adjusts the resistance of the leads between each light source 1101 and the driving module 200 through the second lead 11022 disposed on the second wiring layer 104. The length of the parallel second lead 11022 is positively correlated with the length of the corresponding first lead 11021, so that the resistance of the leads connecting each power source to the driving module 200 tends to be consistent. When the driving module 200 drives and controls the light emission module 110, the response time and brightness of different light sources 1101 tend to be consistent. The projection on the target object will not have detection deviation, the position between the lines of the motion trajectory of the detection point will not be offset, the color of the point cloud formed is accurate, the overall detection result has high reproduction of the target object, and it can avoid the problems of signal crosstalk caused by increasing the line width of the lead and the increase in the size of the laser emission sensor 10.

[0047] In one embodiment, the length of the second lead 11022 is positively correlated with the length of the corresponding first lead 11021, and any first lead 11021 is connected in parallel with the corresponding second lead 11022 through two connecting blocks 1031, with the two connecting blocks 1031 respectively disposed at both ends of the second lead 11022.

[0048] Specifically, two connecting blocks 1031 are respectively set at both ends of the second lead 11022. This arrangement connects all the second leads 11022 on the second wiring layer 104 to the first lead 11021, making full use of the second leads 11022 of the second wiring layer 104. Since the length of the second lead 11022 is positively correlated with the length of the relative first lead 11021, that is, the longer the length of the first lead 11021, the longer the connected second lead 11022, the more parallel parts there are, and the greater the reduction, so that the resistance of the leads connecting each power supply to the drive module 200 tends to be consistent.

[0049] In one embodiment, the number of connecting blocks 1031 connecting the first lead 11021 and the opposite second lead 11022 is positively correlated with the length of the first lead 11021.

[0050] Specifically, multiple connecting blocks 1031 are provided, which are respectively connected to the first lead 11021 and the corresponding second lead 11022.

[0051] The connecting block 1031 is essentially a wire with a certain thickness. When the connecting block 1031 is provided between the first lead 11021 and the second lead 11022, the thickness of the wire at the location of the connecting block 1031 increases. Therefore, the resistance of the wire at this location decreases, and the signal transmission delay decreases. The more connecting blocks 1031 are provided, the more obvious the decrease in resistance and the decrease in signal transmission delay will be.

[0052] The resistance of the leads is adjusted by the number of connecting blocks 1031. The number of connecting blocks 1031 connecting the first lead 11021 and the corresponding second lead 11022 is positively correlated with the length of the first lead 11021. That is, the longer the length of the first lead 11021, the more connecting blocks 1031 are added, and the lower the resistance of the leads. This further makes the resistance of the leads connecting each power supply to the drive module 200 tend to be consistent, and the light emission brightness and response time of the light source 1101 tend to be consistent.

[0053] In one embodiment, the width of the connecting block 1031 connecting the first lead 11021 and the opposite second lead 11022 is positively correlated with the length of the first lead 11021, wherein the width direction of the connecting block 1031 is parallel to the extension direction of the connected first lead 11021 at the current position.

[0054] Specifically, the longer the width of the connecting block 1031, the longer the portion of the conductor formed by the first lead 11021, the connecting block 1031, and the second lead 11022 becomes, resulting in a greater reduction in the overall conductor resistance and a shorter signal transmission time. Therefore, by setting the width of the connecting block 1031 connecting the first lead 11021 and the corresponding second lead 11022 in a positive correlation with the length of the first lead 11021, i.e., the longer the first lead 11021 is, the wider the connecting block 1031 becomes, the resistance of the longer leads can be further reduced, and the resistance of the leads connecting each power supply to the drive module 200 can be made more consistent.

[0055] In one embodiment, the first lead 11021 includes a light source 1101 connection segment, a position adjustment segment, and a drive connection segment. Any light source 1101 is sequentially connected to different pins of the drive module 200 through the light source 1101 connection segment, position adjustment segment, and drive connection segment of the corresponding first lead 11021. Any drive connection segment is perpendicular to the length direction of the drive module 200, the position adjustment segment is perpendicular to the drive connection segment, and the light source 1101 connection segment is parallel to the drive connection segment.

[0056] Specifically, by arranging the first leads 11021 as parallel as possible at different locations, the arrangement of the first leads 11021 can be made more regular and orderly, reducing the crossing and interference between the first leads 11021, reducing the difficulty of wiring, improving the utilization rate of the first wiring layer 102, and also facilitating the stable transmission of signals.

[0057] It should be understood that the second lead 11022 and the first lead 11021 are arranged correspondingly, the difference being that the length of the second lead 11022 is less than the length of the corresponding first lead 11021.

[0058] In one embodiment, the center of any light source 1101 is located on the same straight line.

[0059] Specifically, by setting the centers of all light sources 1101 on the same straight line, a row of light sources 1101 can perform single-line scanning detection on the target object, which facilitates scanning of the target object using the light sources 1101 and improves the accuracy and resolution of the detection.

[0060] Furthermore, the light source 1101 uses lamp beads, such as various types of LED lamp beads. Using lamp beads as the light source 1101 can reduce production costs while ensuring the performance of the laser emission sensor 10, and also facilitate subsequent maintenance and replacement.

[0061] In one embodiment, such as Figure 9As shown, the substrate 100 also includes a base layer 101, which is disposed on the side close to the second wiring layer 104. The base layer 101 can increase the overall strength of the substrate 100.

[0062] According to an embodiment of the present invention, a lidar system is also provided, including a laser emission sensor 10 as described in the above embodiment.

[0063] Specifically, such as Figure 10 As shown, the lidar system includes a laser emitting sensor 10, a galvanometer 20, a laser receiving sensor 30, and an image processor 40. The galvanometer 20 is located at the beam emission end of the laser emitting sensor 10 and is used to scan the emitted beam along a single or dual line and then illuminate the target object. The laser receiving sensor 30 generates an electrical signal based on the beam reflected back from the target object and sends the electrical signal to the image processor 40. The image processor 40 generates image information based on the electrical signal.

[0064] Among them, lidar systems can be used in scenarios such as autonomous driving, intelligent robots, and surveying.

[0065] A galvanometer 20 is a rapidly vibrating mirror, typically manufactured using microelectromechanical systems (MEMS) technology. It alters the propagation direction of the emitted light beam by applying an alternating voltage to the mirror surface, causing periodic vibrations. In a lidar system, the galvanometer 20 is positioned at the beam emission end of the laser emission sensor 10, scanning the emitted beam along a single or dual-path path before illuminating the target object. By rapidly changing the beam's propagation direction, the galvanometer 20 enables the lidar system to scan a large target area in a short time, thereby acquiring rich environmental information.

[0066] The laser receiving sensor 30 generates an electrical signal based on the light beam reflected back from the target object. For example, in an autonomous driving scenario, when the laser beam emitted by the laser emitting sensor 10 illuminates a target object such as a vehicle or pedestrian in front and reflects back, the laser receiving sensor 30 receives these reflected beams and converts them into electrical signals, providing raw data for subsequent image processing and target recognition.

[0067] The image processor 40 is the core processing component of the lidar system. It receives electrical signals from the laser receiving sensor 30 and converts these electrical signals into image information through a series of algorithms and calculations.

[0068] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A laser emission sensor, applied in a lidar system, characterized in that, include: A substrate, the substrate comprising a first wiring layer, an insulating layer and a second wiring layer sequentially disposed along the thickness direction of the substrate; The first wiring layer is provided with a driving module and a plurality of light-emitting modules. Each of the light-emitting modules includes a plurality of light sources. The light sources are connected to the driving module through corresponding first leads. The first leads are provided on the first wiring layer. The second wiring layer is provided with a second lead opposite to the first lead; The insulating layer is provided with a plurality of connecting blocks that penetrate the insulating layer along the thickness direction of the substrate. The first lead is connected in parallel with the opposite second lead through at least two of the connecting blocks. The length of the second lead connected in parallel is positively correlated with the length of the opposite first lead, so as to reduce the difference in response time of different light sources and reduce the difference in luminous brightness of different light sources.

2. The laser emission sensor according to claim 1, characterized in that, The number of connecting blocks between the first lead and the opposite second lead is positively correlated with the length of the first lead.

3. The laser emission sensor according to claim 1, characterized in that, The width of the connecting block connecting the first lead and the opposite second lead is positively correlated with the length of the first lead, wherein the width direction of the connecting block is parallel to the extension direction of the connected first lead at the current position.

4. The laser emission sensor according to claim 1, characterized in that, The length of the second lead is positively correlated with the length of the corresponding first lead, and any first lead is connected in parallel with the corresponding second lead through two connecting blocks, with the two connecting blocks respectively located at both ends of the second lead.

5. The laser emission sensor according to claim 1, characterized in that, The first lead includes a light source connection segment, a position adjustment segment, and a drive connection segment. Each of the light sources is sequentially connected to different pins of the drive module through the corresponding light source connection segment, the position adjustment segment, and the drive connection segment of the first lead. Each drive connection segment is perpendicular to the length direction of the drive module. The position adjustment segment is perpendicular to the drive connection segment, and the light source connection segment is parallel to the drive connection segment.

6. The laser emission sensor according to any one of claims 1 to 5, characterized in that, The centers of all the light sources are located on the same straight line.

7. The laser emission sensor according to claim 1, characterized in that, The light source is an LED chip.

8. The laser emission sensor according to claim 1, characterized in that, The substrate further includes a base layer disposed on a side close to the second wiring layer.

9. A lidar system, characterized in that, Including the laser emission sensor as described in any one of claims 1 to 8.

10. The lidar system according to claim 9, characterized in that, It also includes a galvanometer, a laser receiving sensor, and an image processor. The galvanometer is disposed at the beam emission end of the laser emitting sensor and is used to scan the emitted beam along a single or dual line and then illuminate the target object. The laser receiving sensor generates an electrical signal based on the beam reflected back from the target object and sends the electrical signal to the image processor. The image processor generates image information based on the electrical signal.

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