Simulation method and device

Abstract

The invention discloses a simulation method and device, which are suitable for the technical field of electronic equipment and are used for efficiently identifying potential condensation risks and reducing the influence of condensation on hardware infrastructures. The method comprises the steps that a multi-dimensional model of a target component is obtained, and the target component is associated with a heat dissipation assembly; obtaining target simulation parameters, wherein the target simulation parameters indicate at least one of the following items: material parameters of different components of a target component, a simulation working medium and an internal heat source of the target component; based on the target simulation parameters, simulation calculation is conducted on the condensation condition of wet air around the heat dissipation assembly in the multi-dimensional model through simulation software, and a simulation result of the condensation distribution condition is obtained. In a composite scene, the condensation risk can be efficiently identified and an improvement scheme can be provided by simulating and analyzing the condensation distribution condition.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a simulation method and apparatus. Background Technology

[0002] The operating temperature of electronic devices typically affects their lifespan and stability. To maintain the operating temperature of electronic devices within a reasonable range, heat dissipation techniques can be employed. However, during heat dissipation, temperature differences can cause water molecules in the environment to condense on the low-temperature surfaces, resulting in condensation. This condensation may fall onto components of the electronic device or the circuit board, affecting hardware performance or even damaging it, posing a significant safety hazard.

[0003] Therefore, how to efficiently identify potential condensation risks and take corresponding measures remains an important issue that urgently needs to be addressed. Summary of the Invention

[0004] This application provides a simulation method and apparatus for efficiently identifying potential condensation risks and reducing the impact of condensation on hardware infrastructure.

[0005] Firstly, this application provides a simulation method applicable to computing devices with processing capabilities, such as personal computers, servers, vehicle-mounted mobile terminals, industrial control computers, embedded devices, etc., or it can be a chip, chip system, circuit, or circuit system that supports the implementation of the method on the computing device, such as a chip, chip system, circuit, or circuit system disposed in a personal computer, server, vehicle-mounted mobile terminal, industrial control computer, or embedded device. In some examples, the simulation method can be implemented by a server or virtual machine in the cloud. The method includes:

[0006] Obtain a multidimensional model of the target component, which is associated with a heat dissipation assembly; obtain target simulation parameters, which indicate at least one of the following: material parameters of different components of the target component, simulation working fluid, and internal heat source of the target component; based on the target simulation parameters, use simulation software to simulate the condensation of humid air around the heat dissipation assembly in the multidimensional model, and obtain simulation results of the condensation distribution.

[0007] In the above design, by obtaining the target simulation parameters to simulate the composite material scenario or composite structure scenario of the target component, and then simulating the condensation distribution of the multi-dimensional model of the target component, the condensation risk can be efficiently identified and improvement solutions can be provided.

[0008] In one possible design, obtaining the multidimensional model of the target component includes: obtaining the mesh division result of the multidimensional model of the target component, wherein, for different regions of the target component, the corresponding regions of the multidimensional model are divided into multiple meshes using different mesh densities.

[0009] In the above design, modeling software can be used to construct a multi-dimensional model based on the prototype of the target component, and then mesh the multi-dimensional model to obtain the meshing result. This involves using the finite element analysis (FEA) method, which employs mathematical approximation to simulate the real physical system, thereby improving simulation efficiency and design quality.

[0010] In one possible design, the target simulation parameters correspond to the simulated environmental conditions of the target component, which include the air temperature and / or air humidity of the simulated environment. It should be understood that this is merely an example of environmental factors affecting condensation distribution and not a limitation; in actual implementation, the simulated environmental conditions may also include other factors, which will not be elaborated upon here.

[0011] In one possible design, the method further includes: providing a custom entry point for the simulation software in a human-computer interaction (HMI) interface; obtaining custom code input through the custom entry point, the custom code being used to describe a calculation formula for at least one humid air parameter, the at least one humid air parameter including at least one of the following parameters associated with any grid of the multidimensional model: local humidity, relative humidity, saturated humidity, humid air pressure, humid air temperature, and saturated vapor pressure; wherein, based on the target simulation parameters, simulating the condensation of humid air around the heat dissipation component in the multidimensional model using simulation software includes: based on the target simulation parameters, simulating the condensation of humid air around the heat dissipation component in the multidimensional model using simulation software and running the custom code.

[0012] In the above design, the HMI interface allows users or other machines / devices to provide custom code to customize the design simulation process, thereby improving simulation efficiency and design quality.

[0013] In one possible design, the at least one humid air parameter corresponds to the simulated environmental conditions of the target component, wherein the simulated environmental conditions include ambient air temperature and / or air humidity, the saturated moisture content is associated with the air temperature, and the relative humidity is associated with the air humidity.

[0014] In one possible design, the custom code is also used to describe condensation conditions, which indicate the conditions that must be met for humid air to condense in the multidimensional model.

[0015] In one possible design, the condensation conditions include at least one of the following: the local moisture content is greater than the saturation moisture content; the relative humidity is greater than a first threshold.

[0016] In one possible design, the method may further include: acquiring true data obtained by experimentally measuring the humid air around the heat dissipation component under conditions of condensation on the target component; and adjusting the custom code based on the simulation results and the true data.

[0017] In one possible design, the method may further include: acquiring configuration information for the simulation software, the configuration information indicating the energy equation used for simulating the at least one humid air parameter, the energy equation including at least one of the following: water vapor composition conservation equation, mass conservation equation, momentum conservation equation, and energy conservation equation.

[0018] In one possible design, the target component includes at least one of the following: vehicle components, information and communication technology (ICT) components.

[0019] Secondly, this application provides a simulation device, comprising: an acquisition unit for acquiring a multi-dimensional model of a target component, the target component being associated with a heat dissipation assembly; acquiring target simulation parameters, the target simulation parameters indicating at least one of the following: material parameters of different components of the target component, simulation working fluid, and internal heat source of the target component; and a simulation unit for performing simulation calculations based on the target simulation parameters, using simulation software, on the situation where humid air around the heat dissipation assembly condenses in the multi-dimensional model, to obtain simulation results of the condensation distribution.

[0020] In one possible design, the acquisition unit is specifically used to: acquire the mesh division result of the multidimensional model of the target component, wherein, for different regions of the target component, the corresponding regions of the multidimensional model are divided into multiple meshes using different mesh densities.

[0021] In one possible design, the target simulation parameters correspond to the simulated environmental conditions of the target component, which include the air temperature and / or air humidity of the simulated environment.

[0022] In one possible design, the device further includes: a transceiver unit, configured to provide a custom entry point for the simulation software on a human-computer interaction (HMI) interface; and to acquire custom code input through the custom entry point, the custom code being used to describe a calculation formula for at least one humid air parameter, the at least one humid air parameter including at least one of the following parameters associated with any grid of the multidimensional model: local humidity, relative humidity, saturated humidity, humid air pressure, humid air temperature, and saturated vapor pressure; wherein, the simulation unit is specifically configured to: based on the target simulation parameters, and through the simulation software and by running the custom code, simulate and calculate the condensation of humid air around the heat dissipation component in the multidimensional model.

[0023] In one possible design, the at least one humid air parameter corresponds to the simulated environmental conditions of the target component, wherein the simulated environmental conditions include ambient air temperature and / or air humidity, the saturated moisture content is associated with the air temperature, and the relative humidity is associated with the air humidity.

[0024] In one possible design, the custom code is also used to describe condensation conditions, which indicate the conditions that must be met for humid air to condense in the multidimensional model.

[0025] In one possible design, the condensation conditions include at least one of the following: the local moisture content is greater than the saturation moisture content; the relative humidity is greater than a first threshold.

[0026] In one possible design, the transceiver unit is further configured to: acquire true data obtained by experimentally measuring the condensation of humid air around the heat dissipation component on the target component; the simulation unit is specifically configured to: adjust the custom code based on the simulation results and the true data.

[0027] In one possible design, the transceiver unit is further configured to: acquire configuration information for the simulation software, the configuration information indicating the energy equation used for simulating the at least one humid air parameter, the energy equation including at least one of the following: water vapor composition conservation equation, mass conservation equation, momentum conservation equation, and energy conservation equation.

[0028] In one possible design, the target component includes at least one of the following: vehicle components, information and communication technology (ICT) components.

[0029] Thirdly, this application provides a computing device including a processor coupled to a memory, the processor being configured to execute a computer program stored in the memory such that the electronic device performs the method as described in any of the designs in the first aspect above.

[0030] Fourthly, this application provides a computing device including a processor and a memory, the processor being coupled to the memory, the processor being configured to execute a computer program stored in the memory such that the electronic device performs the method as described in any of the designs in the first aspect above.

[0031] Fifthly, this application provides a computing device including a processor, a memory, and a transceiver, wherein the processor is coupled to the memory, and the processor is configured to execute a computer program stored in the memory to invoke the transceiver to implement the method described in any of the designs in the first aspect above.

[0032] In a sixth aspect, this application provides a chip that may include at least one processor and an interface, the at least one processor being configured to read instructions via the interface to perform the method described in any of the designs in the first aspect above.

[0033] In a seventh aspect, this application provides a computer-readable storage medium storing a computer program that, when run, implements the method described in any of the designs in the first aspect above.

[0034] Eighthly, this application provides a computer program product that, when run on a processor, implements the method described in any of the designs in the first aspect above.

[0035] For details of the beneficial effects of aspects two through eight above, please refer to the technical effects that can be achieved by the corresponding designs in aspect one above, which will not be repeated here. Attached Figure Description

[0036] Figure 1 The diagram illustrates a possible application scenario to which the embodiments of this application may be applicable;

[0037] Figure 2 This paper shows a schematic diagram of the target component implemented as a PCBA in an embodiment of this application;

[0038] Figure 3 This illustration shows a structural diagram of a PCBA and a liquid cooling heat dissipation assembly, representing the target component of this application.

[0039] Figure 4 A schematic diagram of an HMI interface according to an embodiment of this application is shown;

[0040] Figure 5 A flowchart illustrating the simulation method of an embodiment of this application is shown;

[0041] Figure 6 This application illustrates the region division method of the target component in an embodiment of the present application;

[0042] Figure 7 This illustration shows a schematic diagram of a multidimensional model in an embodiment of this application, where corresponding regions are divided using different grid densities.

[0043] Figure 8 A schematic diagram showing the simulation results of condensation distribution in an embodiment of this application is illustrated.

[0044] Figure 9 A schematic diagram of the structure of a simulation device according to an embodiment of this application is shown;

[0045] Figure 10 A schematic diagram of another simulation device according to an embodiment of this application is shown. Detailed Implementation

[0046] The operating temperature of electronic devices typically affects their lifespan and stability. To maintain the operating temperature of electronic devices within a reasonable range, heat dissipation techniques can be employed. However, during heat dissipation, temperature differences can cause water molecules in the environment to condense on the low-temperature surface, resulting in condensation. This condensation may adhere to or fall onto components or circuit boards of the electronic device, affecting hardware performance or even damaging it, posing a significant safety hazard.

[0047] Currently, commonly used heat dissipation technologies include air cooling, liquid cooling, and heat pipe cooling. Among these, liquid cooling technology has a superior heat conduction capacity compared to other technologies, presenting a significant advantage and better meeting the high computing power requirements, complexity, and miniaturization demands of current complex business applications. However, electronic devices using liquid cooling technology are also inevitably subject to a series of safety hazards caused by condensation. For example, condensation falling onto circuits can cause board burnout, condensation can reduce the insulation performance between circuit boards, or condensation can cause integrated circuit (IC) chips to become damp or corroded, leading to failure.

[0048] To address the aforementioned problems, this application provides a simulation method and apparatus for efficiently identifying potential condensation risks and reducing the impact of condensation on hardware infrastructure. The method and apparatus are based on the same technical concept. Since the principles underlying the problems solved by the method and apparatus are similar, their implementations can be mutually referenced, and repeated details will not be repeated. Furthermore, in the various embodiments of this application, unless otherwise specified or logically conflicting, the terminology and / or descriptions between the embodiments are consistent and can be mutually referenced. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0049] It should be noted that in the embodiments of this application, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple.

[0050] Furthermore, unless otherwise specified, the ordinal numbers such as "first" and "second" mentioned in the embodiments of this application are used to distinguish multiple objects and are not used to limit the priority or importance of multiple objects. For example, "first threshold" and "second threshold" are only used to distinguish different thresholds, and do not indicate that the two thresholds have different priorities or importance.

[0051] Furthermore, in the following embodiments of this application, "connection" can refer to an electrical connection, where the connection between two electrical components can be a direct or indirect connection between the two components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components, such as A and B being connected. Alternatively, A can be directly connected to C, and C can be directly connected to B, with A and B connected through C. In some scenarios, "connection" can also be understood as coupling, such as electromagnetic coupling between two inductors. In short, the connection between A and B enables the transmission of electrical energy between A and B.

[0052] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0053] Figure 1 The diagram illustrates a possible application scenario to which embodiments of this application may be applicable. This application scenario may include the target component 110 and the electronic device 120.

[0054] In this embodiment, target component 110 is a hardware prototype to be simulated and tested. Users can construct a multi-dimensional model of the target component 110 prototype using modeling software, and then implement the simulation method of this application based on this multi-dimensional model. As an example, target component 110 can be a vehicle component, or an information and communication technology (ICT) component, etc. This application embodiment does not limit the specific implementation of the target component. The multi-dimensional model can be a three-dimensional model.

[0055] The target component can be associated with a heat dissipation component. The association method can be that the target component contains a heat dissipation component, or that a heat dissipation component is provided around the target component. This application embodiment does not limit the association method between the two.

[0056] The heat dissipation component can employ any of the following heat dissipation technologies: air cooling, liquid cooling, heat pipe cooling, or other heat dissipation technologies. This application does not specifically limit the heat dissipation technology used in the heat dissipation component. Taking a liquid-cooled component using liquid cooling technology as an example, the heat dissipation component can be a liquid cooling chamber with an inlet and an outlet. The liquid cooling chamber can contain coolant, which can be water or other types of liquid. During heat dissipation, the coolant can flow in and out of the liquid cooling chamber through the inlet and outlet, thereby absorbing and transferring heat to achieve the purpose of heat dissipation. If the heat dissipation component employs other heat dissipation technologies, the purpose of heat dissipation can also be achieved through corresponding means, which will not be elaborated here.

[0057] Electronic device 120 can be a computing device with processing capabilities, such as a personal computer, server, vehicle-mounted mobile terminal, industrial control computer, embedded device, etc., or it can be a chip, chip system, circuit, or circuit system that supports the computing device in implementing the method, such as a chip, chip system, circuit, or circuit system installed in a personal computer, server, vehicle-mounted mobile terminal, industrial control computer, or embedded device. In some examples, the simulation method can be implemented by a server or virtual machine in the cloud. Simulation software can be installed and run on electronic device 120, and the simulation software can be used to perform simulation calculations on the multi-dimensional model of target component 110 to obtain simulation results. The simulation results indicate the condensation distribution of humid air around the heat dissipation component in the multi-dimensional model of the target component.

[0058] Figure 1 The arrows in the text only indicate that there is a relationship between the target component 110 and the electronic device 120, and do not limit the way the two are related.

[0059] Simulation methods can identify the potential distribution of condensation on target components and quantitatively analyze the potential safety hazards caused by condensation. This allows developers or maintenance personnel, as users, to take timely and appropriate measures to reduce the impact of condensation on hardware infrastructure and lower the difficulty and cost of developing or maintaining the target components.

[0060] In one implementation, Figure 1 The target component 110 can be a relatively simple hardware infrastructure with a simple internal structure, such as including a single heat source or being composed of a single material. In another embodiment, the target component 110 can also be a hardware facility with a more complex internal structure.

[0061] As an example, in a scenario where the target component 110 is a complex hardware facility, for example... Figure 2 As shown, target component 110 can be a printed circuit board assembly (PCBA). The PCBA can utilize 2.5D or 3D packaging technologies, where electronic components are placed in predetermined positions and soldered onto a PCB or packaging substrate using surface mount technology and through-hole technology, forming a circuit board assembly with a specific function. The PCBA can include multiple chips, such as micro-electro-mechanical system (MEMS) chips, memory chips, radio frequency (RF) chips, and logic gate chips. In 2.5D packaging, individual chips can be highly interconnected with the PCB through an interposer, which may or may not contain through-silicon vias (TSVs). In 3D packaging, chips can be stacked, and they are directly interconnected at high density through TSVs. The solder joints between the chip and the interposer or TSV can be microbumps (not shown in the figure), and the solder joints between the PCB and the TSV can be bumps (not shown in the figure).

[0062] based on Figure 2 The complex structure of a PCBA, taking liquid cooling technology as an example, can be addressed by installing liquid cooling components on top of the PCBA, such as... Figure 3 The top view shown illustrates that the liquid cooling heat dissipation component can be a liquid cooling chamber with a U-shaped tube structure. During PCBA operation, the inflow and outflow of coolant within the liquid cooling chamber absorbs and transfers heat, reducing the PCBA's operating temperature and improving its stability and reliability. It should be understood that... Figure 3 This is merely an example of the deployment relationship between the target component and the heat dissipation assembly, and does not constitute any limitation on the target component.

[0063] On the one hand, PCBAs may contain multiple heat sources (e.g., different chips), resulting in extremely complex distributions of temperature and humidity fields within the PCBA, potentially creating multiple points where condensation can occur. On the other hand, PCBAs can involve various materials, such as copper, aluminum, ceramics, tin, resin, and solder mask, and the surface properties of these materials can affect the degree to which condensation adheres to the surface. Even if the PCBA and liquid cooling chamber are packaged into a single structural component, multiple condensation points may still exist within this component.

[0064] Considering the complex structural scenarios and complex material systems described above, the simulation method designed in this application comprehensively considers multiple factors affecting the generation and distribution of condensation to perform simulation calculations on the multidimensional model of the target component, so as to obtain more accurate simulation results.

[0065] For example, condensation formation can be related to relative humidity. Relative humidity refers to the ratio of the amount of water vapor actually contained in the air at a certain location (e.g., local humidity) to the amount of saturated water vapor at that temperature (or saturated humidity). Alternatively, relative humidity is the percentage of the actual air vapor pressure at a certain location (e.g., denoted as p1) to the saturated vapor pressure at the same temperature (e.g., denoted as p2). Condensation occurs when the water vapor content in the air exceeds the saturated vapor content at that temperature. Generally, the higher the relative humidity in the air, the greater the likelihood of condensation. Therefore, in the simulation method of this application embodiment, at least one parameter of moist air (including dry air and water vapor), such as local humidity, saturated humidity, relative humidity, moist air pressure, moist air temperature, and saturated vapor pressure, can be analyzed using simulation software to analyze the condensation distribution. Among these, local humidity, which can be simply referred to as humidity, is a parameter representing the amount of moisture contained in moist air, and is usually expressed as absolute humidity. Saturated humidity refers to the water vapor content in moist air reaching its maximum value at a given temperature, meaning the air is saturated. In this state, the partial pressure of water vapor in the air is equal to the partial pressure of pure water vapor at the same temperature. Saturated humidity is the ratio of the partial pressure of water vapor in moist air to the partial pressure of pure water vapor at the same temperature.

[0066] Alternatively, condensation formation can also be related to temperature. Temperature changes affect the water vapor content in the air. When air comes into contact with a cold object surface, the water vapor in the air loses heat due to the temperature drop, thus condensing into water droplets, i.e., condensation occurs. Therefore, in the simulation method of this application embodiment, the condensation distribution can be analyzed by analyzing the heat source distribution and / or temperature distribution in the entire flow field using simulation software.

[0067] Alternatively, condensation formation can also be related to the characteristics of an object's surface. Some rough surfaces or surfaces with micropores can provide more condensation nuclei, facilitating the condensation of water vapor into water droplets, i.e., condensation. Therefore, in the simulation method of this application embodiment, the material properties of different components of the target part and / or associated working fluids can be analyzed using simulation software to analyze the condensation distribution. The materials of different components can include, but are not limited to, various metallic materials, semiconductor materials, superconducting materials, insulating materials, high-temperature resistant materials, etc. The working fluid is the substance that realizes the conversion of heat and work, and is simply called the working fluid, including at least one of moist air working fluid, liquid working fluid, or solid working fluid.

[0068] It should be understood that this is merely an illustrative example of factors that affect the formation and distribution of condensation, and not a limitation. In other embodiments, other factors may be considered, and corresponding simulation methods may be designed for simulation analysis, which will not be elaborated here.

[0069] In implementing the simulation method of this application embodiment, one approach is that the simulation software can provide selection / configuration entry points for simulation parameters. For example, it can provide users with multiple selection / configuration entry points for simulation parameters, through which users can input target simulation parameters into the simulation software. As an example, the target simulation parameters can indicate at least one of the following: material parameters of different components of the target part, the simulation working fluid, and the internal heat source of the target part. The simulation software can initialize a multidimensional model of the target part based on the target simulation parameters, so as to implement the simulation method of this application embodiment based on the initialized multidimensional model.

[0070] In one optional implementation, the simulation software can also provide a custom entry point, such as a user-defined entry point, through which the user can customize relevant information in the simulation software. For example, the user can input custom code into the simulation software through the custom entry point, which can be used to describe the calculation formula of at least one humid air parameter. As an example, the at least one humid air parameter may include the following parameters associated with the simulation test of the multidimensional model of the target component: local humidity, relative humidity, and saturation humidity. Optionally, the custom code can also be used to describe condensation conditions, which indicate the conditions that humid air must meet to cause condensation in the multidimensional model. For example, condensation conditions may include at least one of the following: the local humidity at the condensation location is greater than the saturation humidity; the relative humidity at the condensation location is greater than a first threshold, which may be, for example, 0.999. Alternatively, condensation conditions may also include at least one of the following: the local temperature at the condensation location is less than a condensation temperature threshold; the condensation location is located at a gas-solid interface.

[0071] When implementing the simulation method of this application embodiment, based on the target simulation parameters, the condensation of humid air around the heat dissipation component in the multi-dimensional model can be simulated and calculated using simulation software and custom code. For example, the local humidity at a certain location in the multi-dimensional model can be simulated and calculated, and it can be analyzed whether the local humidity at that location is greater than the saturation humidity. If so, that location can be a potential condensation point. Alternatively, the relative humidity at a certain location in the multi-dimensional model can be simulated and calculated, and it can be analyzed whether the relative humidity at that location is greater than a first threshold. If so, that location can be a potential condensation point. Or, the local temperature at a certain location in the multi-dimensional model can be simulated and calculated, and it can be analyzed whether the local temperature at that location is less than the condensation temperature threshold. If so, that location can be a potential condensation point. Or, the contact angle at a certain location in the multi-dimensional model can be simulated and calculated, and it can be analyzed whether that location is located at a gas-solid contact surface. If so, that location can be a potential condensation point. It should be understood that if the custom code describes the condensation conditions in an alternative manner, the potential condensation point determined during the simulation calculation will be taken as the location where condensation occurs. If the condensation conditions described in the above custom code include two or more, then the potential condensation location points that simultaneously satisfy two or more condensation conditions, as determined during simulation calculations, will be taken as the condensation location points.

[0072] In an optional implementation, the simulation software may also provide an energy equation selection / configuration entry point, such as providing a selection / configuration entry point for the user, through which the user can select / configure the energy equation required to implement the simulation method of this application embodiment. As an example, the energy equation may include at least one of the following: a water vapor component conservation equation, a mass conservation equation, a momentum conservation equation, and an energy conservation equation. Each energy equation can be associated with the various simulation parameters and / or humid air parameters described above to obtain the distribution of each parameter in the entire flow field of the multidimensional model of the target component, including local moisture content distribution, temperature distribution, relative humidity distribution, etc. The simulation software can also output local moisture content distribution maps, temperature distribution maps, relative humidity distribution maps, etc., of the entire flow field of the multidimensional model through a human-machine interaction (HMI) interface, so that the user can more intuitively determine the high-risk areas where condensation is likely to occur by combining the humidity field, temperature field, etc.

[0073] For example, such as Figure 4As shown, the simulation software can provide an HMI interface, also known as a management interface. This management interface can include various selection / configuration entry points for simulation parameters, such as material parameters, working fluid parameters, internal heat sources, energy equations, and custom entry points. In one implementation, the user can move the mouse cursor to select a parameter's selection / configuration entry point. The management interface can then display the relevant configuration items for that entry point for the user to choose from, thus completing the configuration of the corresponding parameter. Taking configuring working fluid parameters for a target component as an example... Figure 4 As shown, the detailed management interface for working fluid parameters can include the configuration of the mixture involved in the simulation test of the target component, and the configuration of certain components of the target component, such as the configuration of component 1, component 2, and component 3 of the gasket. Similarly, for other simulation parameters, users can also select the corresponding entry point and enter the corresponding details interface to complete the parameter configuration, which will not be elaborated further here.

[0074] Understandable Figure 4 This is merely an example of the HMI interface provided by the simulation software and not a limitation. In other embodiments, the management interface may also include selection / configuration entries for other parameters associated with the simulation service, which users can configure according to simulation needs. These will not be elaborated here.

[0075] Furthermore, considering the complex structure and material system of the target component, in order to obtain more accurate simulation results and improve simulation efficiency, one implementation method of this application is to use the finite element analysis (FEA) method to mesh the multidimensional model of the target component, obtaining the meshing result. That is, the simulation calculation of the multidimensional model of the target component is further refined into simulation calculations of multiple meshes of the multidimensional model, with each mesh as the object to be analyzed. When implementing the simulation method of this application embodiment, based on various user-configured simulation parameters, the condensation of moist air at each mesh of the multidimensional model is simulated to improve the accuracy of the simulation method of this application embodiment.

[0076] It is understood that the simulation software in this application embodiment can itself have the function of meshing the multidimensional model of the target component, and can be used to implement the step of meshing the multidimensional model of the target component to obtain the corresponding meshing result. In another embodiment, if the simulation software itself does not have the meshing function, other tools can be used to implement the step of meshing the multidimensional model. As an example, this application embodiment can use meshing software to implement the step of meshing the multidimensional model, which may include, but is not limited to, any of the following: TrueGrid, Pointwise, GridPro. When implementing the meshing step, for different regions of the target component, different mesh densities can be used to divide the corresponding regions of the multidimensional model into multiple meshes to improve simulation calculation efficiency.

[0077] To facilitate understanding, the simulation method of this application embodiment will be illustrated below with reference to the method flowchart.

[0078] like Figure 5 As shown, the simulation method may include the following steps:

[0079] S510: Acquiring a multidimensional model of a target component for electronic devices.

[0080] In this embodiment, the electronic device may be equipped with modeling software, which can model a target component to obtain a multi-dimensional model of the target component. The simulation software and the modeling software may have an interactive interface. During S510, the simulation software can obtain the multi-dimensional model of the target component from the modeling software through this interface. Alternatively, the modeling software can save the multi-dimensional model file of the target component in local storage. During S510, the simulation software can obtain the multi-dimensional model of the target component from the local storage medium. Alternatively, the simulation software itself may have modeling capabilities, allowing it to construct a multi-dimensional model of the target component during S510. Alternatively, the electronic device may also have network connectivity, allowing the simulation software to obtain the multi-dimensional model of the target component from a server during S510. This embodiment does not limit the method of obtaining the multi-dimensional model.

[0081] In this embodiment, the target component is associated with a heat dissipation component. This association can be either that the target component contains the heat dissipation component, or that a heat dissipation component is disposed around the target component. This embodiment does not limit the association method in any way. For example... Figure 2 and Figure 3As shown, when a PCBA is used as the target component, heat dissipation components can be deployed around (e.g., above) the target component. When a structural component consisting of a PCBA and heat dissipation components is used as the target component, the target component includes heat dissipation components. The multidimensional model obtained in S510 can be an overall multidimensional model of the target component. When the target component is a structural component, the multidimensional model can include an overall multidimensional model of the target component, as well as multidimensional models of related components after decomposing the structural component.

[0082] For example, for Figure 3 The diagram shows a structural component that includes both a PCBA and a heat dissipation assembly. The PCBA itself can be considered a sub-structural component. Correspondingly, the multi-dimensional model of the target component can include a multi-dimensional model built based on the PCBA, as well as a multi-dimensional model built based on the entire structural component. Alternatively, the PCBA can be further decomposed to construct corresponding multi-dimensional models. In more complex structural scenarios, the multi-dimensional model of the target component can include a multi-dimensional model built based on multiple sub-structural components, as well as a multi-dimensional model built based on the entire structural component. The requirements for the multi-dimensional model can be determined based on the actual structure of the target component, and will not be elaborated further here.

[0083] To obtain more accurate simulation results, in one optional implementation, step S510 may specifically involve acquiring the mesh generation result of the multidimensional model of the target component. This can be achieved either by the simulation software itself performing the mesh generation on the multidimensional model of the target component, or by using mesh generation software. This embodiment of the application does not limit the specific method used. When meshing the multidimensional model of the target component, different mesh densities can be used for different regions to improve simulation computation efficiency.

[0084] For example, based on Figure 3 The structural component shown is more prone to condensation near the heat dissipation assembly. Therefore, the component can be divided into different regions, such as a first region closer to the heat dissipation assembly and a second region farther away. The first region represents the area with a higher probability of condensation, or the condensation zone. The second region represents the area with a lower probability of condensation, or the non-condensation zone. Figure 6 As shown, the first and second regions are identified by different dashed boxes. The first region includes the area surrounding the heat dissipation components within the structural member, while the remaining area of ​​the structural member constitutes the second region. When meshing the multi-dimensional model of the target component, the mesh density used for the first region can be greater than that used for the second region. Similarly, in more complex structural scenarios, such as when the target component is associated with two or more heat dissipation components, different regions of the target component can be meshed using different mesh densities. Figure 7As shown, based on and Figure 6 Similarly, for structural components containing liquid cooling chambers (containing coolant), the location of the liquid cooling chamber can be represented as the first region, and the remaining locations as the second region (including air). During modeling, corresponding regions of a multi-dimensional model are created, and each region is divided into multiple meshes using different mesh densities. For example, the model region corresponding to the first region is divided into multiple meshes using a first density, and the model region corresponding to the second region is divided into multiple meshes using a second density, with the first density being greater than the second density. For PCBAs within structural components, different mesh densities can also be used for meshing. It should be understood that the range of the first and second regions can be set as needed during actual region division, and this application does not limit this. When different internal heat sources exist in a structural component, two or more heat dissipation components can be distributed. Correspondingly, a similar method can be used to divide the structural component into regions to improve simulation efficiency, which will not be elaborated further here.

[0085] S520: Electronic equipment acquires target simulation parameters.

[0086] In this embodiment of the application, the user can, as follows: Figure 4 The management interface shown allows selection / configuration of various simulation parameters involved in the simulation calculation. Target simulation parameters can indicate at least one of the following: material parameters of different components of the target part, the simulation working fluid, and the internal heat source of the target part. Alternatively, target simulation parameters can also indicate at least one humid air parameter. Users can input custom codes into the simulation software through a custom entry point. These custom codes can be used to describe the calculation formula for the at least one humid air parameter, and / or, they can be used to describe condensation conditions, indicating the conditions required for condensation to occur at any location (e.g., any grid) in the multidimensional model. Alternatively, target simulation parameters can also indicate energy equations. Users can configure the energy equations used for simulation calculations of at least one humid air parameter in the simulation software's management interface. Details regarding the implementation and configuration of various simulation parameters can be found in the preceding text. Figures 2-4 The relevant information will not be elaborated here.

[0087] S530: Based on the target simulation parameters, the electronic device uses simulation software to simulate and calculate the condensation of humid air around the heat dissipation component in the multi-dimensional model, and obtains the simulation results of the condensation distribution.

[0088] In this embodiment of the application, the user can set simulated environmental conditions for the target component. The target simulation parameters correspond to the simulated environmental conditions of the target component. When implementing S530, the electronic device can perform simulation calculations on the condensation of the humid air around the heat dissipation component in the multi-dimensional model based on the target simulation parameters under simulated environmental conditions, and obtain simulation results of the condensation distribution.

[0089] For example, the simulated environmental conditions may include the air temperature and / or air humidity of the simulated environment. Optionally, if liquid cooling technology is used, the simulated environmental conditions may also include coolant-related conditions, such as inlet coolant temperature and coolant flow rate. If air cooling technology is used, the simulated environmental conditions may also include wind speed and wind direction. This application does not specifically limit the simulated environmental conditions.

[0090] Based on one or more simulated environmental conditions, the local moisture content is represented by W, and the saturated moisture content is represented by Ws. S The pressure of moist air is expressed as P. W The saturated vapor pressure is expressed as P. Ws Relative humidity is expressed as RH, and humid air temperature is expressed as T. The formula for calculating saturated moisture content can be shown in the following expression (1):

[0091] W s =0.62198p ws / (p w -p ws (1);

[0092] When the temperature T of the moist air is 0-200 degrees Celsius (°C), the formula for calculating the saturated vapor pressure can be expressed as follows (2):

[0093] ln(p ws )=C1 / T+C2+C3T+C4T 2 +C5T 3 +C6 ln(T) (2);

[0094] Where C1-C6 are constants.

[0095] Taking condensation conditions including the following two items as an example: the local moisture content at the condensation location is greater than the saturated moisture content; and the relative humidity at the condensation location is greater than a first threshold. When implementing S530, the electronic device can use each grid of the multi-dimensional model of the target component as the object to be analyzed. Through simulation software and running custom code, it calculates the local moisture content W associated with each grid and analyzes whether the local moisture content W associated with each grid is greater than the saturated moisture content W. SSimultaneously, the electronic device can also calculate the relative humidity (RH) associated with each grid using simulation software and analyze whether the RH associated with each grid is greater than a first threshold. RH can be P W With P Ws The ratio of the two condensation conditions mentioned above. If both condensation conditions are met, the corresponding positions of the grids can be marked as the locations where condensation occurs in the simulation results. By performing the same simulation calculation method on multiple grids of the multidimensional model in S530, the simulation results will show the condensation distribution of humid air around the heat dissipation components across multiple grids of the multidimensional model. If needed, the simulation software can also output simulation results of moisture content (W) distribution and relative humidity (RH) distribution for user reference.

[0096] Optionally, condensation conditions may also include at least one of the following: the local temperature at the condensation location is less than the condensation temperature threshold; the condensation location is located at the gas-solid contact surface. When implementing S530, the electronic device can use each grid of the multidimensional model of the target component as the object to be analyzed, calculate the local temperature associated with each grid using simulation software, and analyze whether the local temperature at that grid is less than the condensation temperature threshold. Furthermore, the electronic device can also calculate the contact angle associated with each grid using simulation software and analyze whether the grid is located at the gas-solid contact surface based on the contact angle. If the corresponding condensation conditions are met, the location corresponding to the grid can be marked as the condensation location in the obtained simulation results. By performing the same simulation calculation method on multiple grids of the multidimensional model in S530, the simulation results can show the condensation situation of the humid air around the heat dissipation component at multiple grids of the multidimensional model, i.e., the condensation distribution. If necessary, the simulation software can also output temperature distribution simulation results, etc., to the user for reference.

[0097] by Figure 7 Taking the structural component shown as an example, based on the mesh generation results, the following can be obtained: Figure 8 The simulation diagram of condensation distribution is shown. It can be seen that multiple condensation points are mainly in the first region, that is, the area closer to the heat dissipation components. Based on the condensation distribution simulation diagram, users can visually see the condensation locations and quantitatively analyze the potential safety hazards caused by condensation, as well as take corresponding solutions to reduce the impact of condensation on hardware infrastructure and reduce the difficulty and cost of development or maintenance. For example, in locations prone to condensation, hydrophobic materials can be sprayed to reduce water condensation without affecting device performance. This application does not limit the corresponding solutions in any way.

[0098] In one optional implementation, the user can design the same environmental conditions in a real environment and conduct experiments under these conditions to measure the condensation of humid air around the heat dissipation component on the target component, obtaining experimental results on the condensation distribution of the target component. The electronic device can acquire the true value data obtained from the experimental measurement of condensation of humid air around the heat dissipation component on the target component, and verify the accuracy of the simulation results based on the true value data. Specifically, the user can divide the surface of the target component or the interior of the structural component into multiple areas as monitoring points, and verify the simulation results based on the true value data obtained from the experimental measurement of the monitoring points. By comparing and analyzing the experimental results with the simulation results, the accuracy of the simulation results can be verified. The computing device can also readjust various simulation parameters or custom code involved in the simulation test based on the comparison results to improve the accuracy of the simulation software. As an example, the condensation temperature threshold, the saturated moisture content calculation formula, or the constants involved in the calculation formula can be adjusted based on the comparison results.

[0099] The verification process described above can be performed manually by the user. For the structural component to be tested, the user can drill holes at pre-selected monitoring points. During the condensation experiment, an endoscope can be inserted into the holes to photograph the condensation at the selected points. The images of each point are used as experimental results and compared with the condensation distribution cloud map indicated by the simulation results to verify the accuracy of the simulation results. For the PCB board to be tested, the user can also spread auxiliary materials (such as anhydrous copper sulfate, which turns from white to blue upon contact with water) on the PCB board and take photos. These photos are used as experimental results and compared with the condensation distribution cloud map indicated by the simulation results to verify the accuracy of the simulation results. It should be understood that, if necessary, the user can also use image processing tools to process the experimental results so that the processed images can be compared with the condensation distribution cloud map indicated by the simulation results to verify the accuracy of the simulation results.

[0100] Understandably, the above verification process can also be automated by simulation software. For example, the simulation software can provide an input port for experimental results, such as providing an input port for users to provide experimental results on the condensation distribution of the target component, including images of various points captured by photography. Accordingly, after receiving the experimental results on the condensation distribution of the target component, the simulation software can verify the accuracy of the simulation results by comparing the simulation results with the experimental results.

[0101] Therefore, by using the above simulation method, a simulation method applicable to complex structural scenarios and complex material systems is provided to conduct condensation distribution simulation tests on components or structural parts with a high risk of condensation. This allows for timely identification of the potential distribution of condensation on the target component, quantitative analysis of the potential safety hazards caused by condensation, and enables developers or maintenance personnel to take timely and appropriate measures as users, thereby reducing the impact of condensation on hardware infrastructure and lowering the difficulty and cost of development or maintenance.

[0102] Based on the above embodiments and the same concept, this application also provides a simulation device for executing the method executed by the computing device in the above method embodiments. The relevant features can be found in the above method embodiments, and will not be repeated here.

[0103] like Figure 9 As shown, the simulation device 900 may include: an acquisition unit 901, used to acquire a multi-dimensional model of a target component, the target component being associated with a heat dissipation assembly; and to acquire target simulation parameters, the target simulation parameters indicating at least one of the following: material parameters of different components of the target component, simulation working fluid, and internal heat source of the target component; and a simulation unit 902, used to perform simulation calculations based on the target simulation parameters, using simulation software, on the situation where humid air around the heat dissipation assembly condenses in the multi-dimensional model, to obtain simulation results of the condensation distribution. For specific implementation details, please refer to the method steps implemented by the computing device in the above method embodiment, which will not be repeated here.

[0104] In some embodiments, the acquisition unit 901 is specifically used to: acquire the mesh division result of the multidimensional model of the target component, wherein, for different regions of the target component, the corresponding regions of the multidimensional model are divided into multiple meshes using different mesh densities.

[0105] In some embodiments, the target simulation parameters correspond to the simulated environmental conditions of the target component, including the air temperature and / or air humidity of the simulated environment.

[0106] In some embodiments, the simulation device may further include: a transceiver unit, configured to provide a custom entry point for the simulation software on a human-computer interaction (HMI) interface; and to acquire custom code input through the custom entry point, the custom code being used to describe a calculation formula for at least one humid air parameter, the at least one humid air parameter including at least one of the following parameters associated with any grid of the multidimensional model: local humidity, relative humidity, saturated humidity, humid air pressure, humid air temperature, and saturated vapor pressure; wherein, the simulation unit 902 is specifically configured to: based on the target simulation parameters, and through the simulation software and by running the custom code, perform simulation calculations on the condensation of humid air around the heat dissipation component in the multidimensional model.

[0107] In some embodiments, the at least one humid air parameter corresponds to a simulated environmental condition of the target component, wherein the simulated environmental condition includes ambient air temperature and / or air humidity, the saturated moisture content is associated with the air temperature, and the relative humidity is associated with the air humidity.

[0108] In some embodiments, the custom code is also used to describe condensation conditions, which indicate the conditions that must be met for humid air to condense in the multidimensional model.

[0109] In some embodiments, the condensation conditions include at least one of the following: local moisture content is greater than the saturation moisture content; relative humidity is greater than a first threshold.

[0110] In some embodiments, the transceiver unit is further configured to: acquire true data obtained by experimentally measuring the humid air around the heat dissipation component under the condition that condensation occurs on the target component; the simulation unit is specifically configured to: adjust the custom code based on the simulation results and the true data.

[0111] In some embodiments, the transceiver unit may also be used to: acquire configuration information for the simulation software, the configuration information indicating the energy equation used for simulating the at least one humid air parameter, the energy equation including at least one of the following: water vapor composition conservation equation, mass conservation equation, momentum conservation equation, and energy conservation equation.

[0112] In some embodiments, the target component includes at least one of the following: vehicle components, information and communication technology (ICT) components.

[0113] It should be understood that the division of units in the above device is only a logical functional division. In actual implementation, they can be fully or partially integrated into a single physical entity, or they can be physically separated. Furthermore, the units in the device can be implemented by a processor calling software; for example, the device includes a processor connected to a memory containing instructions. The processor calls the instructions stored in the memory to implement any of the above methods or to implement the functions of each unit in the device. The processor can be, for example, a general-purpose processor, such as a Central Processing Unit (CPU) or a microprocessor, and the memory can be internal or external to the device. Alternatively, the units in the device can be implemented as hardware circuits. The functionality of some or all units can be achieved through the design of these hardware circuits, which can be understood as one or more processors. For example, in one implementation, the hardware circuit is an application-specific integrated circuit (ASIC). The functionality of some or all of the above units is achieved through the design of the logical relationships between the components within the circuit. In another implementation, the hardware circuit can be implemented using a programmable logic device (PLD). Taking a field-programmable gate array (FPGA) as an example, it can include a large number of logic gates. The connection relationships between the logic gates are configured through a configuration file, thereby achieving the functionality of some or all of the above units. All units of the above device can be implemented entirely through processor-invoked software, entirely through hardware circuits, or partially through processor-invoked software with the remaining parts implemented through hardware circuits.

[0114] In this application embodiment, the processor is a circuit with signal processing capabilities. In one implementation, the processor can be a circuit with instruction reading and execution capabilities, such as a CPU, microprocessor, graphics processing unit (GPU) (which can be understood as a type of microprocessor), or digital signal processor (DSP). In another implementation, the processor can implement certain functions through the logical relationships of hardware circuits. These logical relationships of hardware circuits are fixed or reconfigurable. For example, the processor is a hardware circuit implemented as an ASIC or PLD, such as an FPGA. In a reconfigurable hardware circuit, the process of the processor loading a configuration document and configuring the hardware circuit can be understood as the process of the processor loading instructions to implement the functions of some or all of the above units. Furthermore, it can also be a hardware circuit designed for artificial intelligence, which can be understood as an ASIC, such as a Neural Network Processing Unit (NPU), Tensor Processing Unit (TPU), or Deep Learning Processing Unit (DPU).

[0115] As can be seen, each unit in the above device can be one or more processors (or processing circuits) configured to implement the above methods, such as: CPU, GPU, NPU, TPU, DPU, microprocessor, DSP, ASIC, FPGA, or a combination of at least two of these processor forms.

[0116] Furthermore, the units in the above devices can be integrated in whole or in part, or they can be implemented independently. In one implementation, these units are integrated together as a system-on-a-chip (SOC). The SOC may include at least one processor for implementing any of the above methods or implementing the functions of the units in the device. The at least one processor may be of different types, such as CPU and FPGA, CPU and artificial intelligence processor, CPU and GPU, etc.

[0117] In a simplified embodiment, those skilled in the art will realize that the communication devices described in the above embodiments can all be employed. Figure 10 As shown in the figure.

[0118] like Figure 10 The illustrated device 1000 includes at least one processor 1010 and a communication interface 1030. In an alternative design, a memory 1020 may also be included.

[0119] The specific connection medium between the processor 1010 and the memory 1020 is not limited in the embodiments of this application.

[0120] In such Figure 10 In the device, when the processor 1010 communicates with other devices, it can transmit data through the communication interface 1030.

[0121] When the communication device adopts Figure 10 When in the form shown, Figure 10 The processor 1010 can call computer execution instructions stored in the memory 1020, enabling the device 1000 to execute any of the above method embodiments.

[0122] This application also relates to a chip system including a processor for calling a computer program or computer instructions stored in a memory to cause the processor to execute the methods of any of the above embodiments.

[0123] In one possible implementation, the processor can be coupled to the memory via an interface.

[0124] In one possible implementation, the chip system may also directly include a memory in which computer programs or computer instructions are stored.

[0125] For example, the memory can be volatile memory or non-volatile memory, or may include both. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0126] This application also relates to a processor for calling a computer program or computer instructions stored in a memory to cause the processor to execute the methods described in any of the above embodiments.

[0127] For example, in the embodiments of this application, the processor is an integrated circuit chip with signal processing capabilities. For instance, the processor can be an FPGA, a general-purpose processor, a DSP, an ASIC, or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, a system-on-chip (SoC), a CPU, a network processor (NP), a microcontroller unit (MCU), a PLD, or other integrated chips, capable of implementing or executing the methods, steps, and logic block diagrams disclosed in the embodiments of this application. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of this application can be directly embodied in the execution of a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software modules can reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. This storage medium is located in memory; the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above methods.

[0128] It should be understood that embodiments of this application may be provided as methods, systems, or computer program products.

[0129] In one possible implementation, embodiments of this application provide a computer-readable storage medium storing program code that, when executed on a computer, causes the computer to perform the method embodiments described above.

[0130] In one possible implementation, this application provides a computer program product that, when run on a computer, causes the computer to execute the above-described method embodiments.

[0131] Therefore, this application may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0132] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0133] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0134] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the scope of the embodiments of this application. Therefore, if these modifications and variations to the embodiments of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations. In the various embodiments of this application, unless otherwise specified or logically conflicting, the terminology and / or descriptions between the various embodiments are consistent and can be mutually referenced. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

Claims

1. A simulation method, characterized in that, The method includes: Obtain a multi-dimensional model of the target component, which is associated with a heat dissipation assembly; Obtain target simulation parameters, which indicate at least one of the following: material parameters of different components of the target component, simulation working fluid, and internal heat source of the target component; Based on the target simulation parameters, simulation software is used to simulate the condensation of humid air around the heat dissipation component in the multidimensional model, and simulation results of the condensation distribution are obtained.

2. The method according to claim 1, characterized in that, The acquisition of the multidimensional model of the target component includes: Obtain the mesh division result of the multidimensional model of the target component, wherein for different regions of the target component, the corresponding regions of the multidimensional model are divided into multiple meshes with different mesh densities.

3. The method according to claim 1 or 2, characterized in that, The target simulation parameters correspond to the simulated environmental conditions of the target component, and the simulated environmental conditions include the air temperature and / or air humidity of the simulated environment.

4. The method according to any one of claims 1-3, characterized in that, The method further includes: A customizable entry point for the simulation software is provided within the human-computer interaction (HMI) interface; Obtain the custom code input through the custom entry, the custom code being used to describe the calculation formula of at least one humid air parameter, the at least one humid air parameter including at least one of the following parameters associated with any grid of the multidimensional model: local humidity, relative humidity, saturated humidity, humid air pressure, humid air temperature, saturated vapor pressure; Specifically, based on the target simulation parameters, simulation software is used to simulate and calculate the condensation of humid air around the heat dissipation component in the multidimensional model, including: Based on the target simulation parameters, the simulation software and the custom code are used to simulate the condensation of humid air around the heat dissipation component in the multidimensional model.

5. The method according to claim 4, characterized in that, The at least one humid air parameter corresponds to the simulated environmental conditions of the target component, wherein the simulated environmental conditions include the ambient air temperature and / or air humidity, the saturated moisture content is associated with the air temperature, and the relative humidity is associated with the air humidity.

6. The method according to claim 4 or 5, characterized in that, The custom code is also used to describe condensation conditions, which indicate the conditions that must be met for humid air to condense in the multidimensional model.

7. The method according to claim 6, characterized in that, The condensation conditions include at least one of the following: The local moisture content is greater than the saturated moisture content; The relative humidity is greater than the first threshold.

8. The method according to any one of claims 4-7, characterized in that, The method further includes: Obtain true data by experimentally measuring the condensation of humid air around the heat dissipation component on the target component; Adjust the custom code based on the simulation results and the truth data.

9. The method according to any one of claims 4-8, characterized in that, The method further includes: Obtain configuration information for the simulation software, wherein the configuration information indicates the energy equation used for simulating the at least one humid air parameter, and the energy equation includes at least one of the following: water vapor composition conservation equation, mass conservation equation, momentum conservation equation, and energy conservation equation.

10. The method according to any one of claims 1-9, characterized in that, The target component includes at least one of the following: vehicle components, information and communication technology (ICT) components.

11. A simulation device, characterized in that, include: The acquisition unit is used to acquire a multi-dimensional model of a target component, wherein the target component is associated with a heat dissipation assembly; Obtain target simulation parameters, which indicate at least one of the following: material parameters of different components of the target component, simulation working fluid, and internal heat source of the target component; The simulation unit is used to perform simulation calculations on the condensation of humid air around the heat dissipation component in the multidimensional model based on the target simulation parameters, and to obtain simulation results of the condensation distribution.

12. The apparatus according to claim 11, characterized in that, The acquisition unit is specifically used for: Obtain the mesh division result of the multidimensional model of the target component, wherein for different regions of the target component, the corresponding regions of the multidimensional model are divided into multiple meshes with different mesh densities.

13. The apparatus according to claim 11 or 12, characterized in that, The target simulation parameters correspond to the simulated environmental conditions of the target component, and the simulated environmental conditions include the air temperature and / or air humidity of the simulated environment.

14. The apparatus according to any one of claims 11-13, characterized in that, The device further includes: The transceiver unit is used to provide a custom entry point for the simulation software in the human-computer interaction (HMI) interface; and to obtain custom code input through the custom entry point. The custom code is used to describe the calculation formula of at least one humid air parameter, which includes at least one of the following parameters associated with any grid of the multidimensional model: local humidity, relative humidity, saturated humidity, humid air pressure, humid air temperature, and saturated vapor pressure. Specifically, the simulation unit is used for: Based on the target simulation parameters, the simulation software and the custom code are used to simulate the condensation of humid air around the heat dissipation component in the multidimensional model.

15. The apparatus according to claim 14, characterized in that, The at least one humid air parameter corresponds to the simulated environmental conditions of the target component, wherein the simulated environmental conditions include the ambient air temperature and / or air humidity, the saturated moisture content is associated with the air temperature, and the relative humidity is associated with the air humidity.

16. The apparatus according to claim 14 or 15, characterized in that, The custom code is also used to describe condensation conditions, which indicate the conditions that must be met for humid air to condense in the multidimensional model.

17. The apparatus according to claim 16, characterized in that, The condensation conditions include at least one of the following: The local moisture content is greater than the saturated moisture content; The relative humidity is greater than the first threshold.

18. The apparatus according to any one of claims 14-17, characterized in that, The transceiver unit is also used for: Obtain true data by experimentally measuring the condensation of humid air around the heat dissipation component on the target component; The simulation unit is specifically used to: adjust the custom code based on the simulation results and the truth data.

19. The apparatus according to any one of claims 14-18, characterized in that, The transceiver unit is further configured to: acquire configuration information for the simulation software, wherein the configuration information indicates the energy equation used for simulating the at least one humid air parameter, and the energy equation includes at least one of the following: water vapor composition conservation equation, mass conservation equation, momentum conservation equation, and energy conservation equation.

20. The apparatus according to any one of claims 11-19, characterized in that, The target component includes at least one of the following: vehicle components, information and communication technology (ICT) components.

21. A computing device, characterized in that, The device includes a processor and a memory, the processor being coupled to the memory, the processor being configured to execute a computer program stored in the memory to cause the computing device to perform the method as described in any one of claims 1-10.

22. A chip, characterized in that, It includes at least one processor and an interface, wherein the at least one processor is configured to read instructions through the interface to perform the method as described in any one of claims 1-10.

23. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed, implements the method as described in any one of claims 1-10.

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