Server

Abstract

The invention discloses a server, which comprises a mainboard module, a liquid cooling substrate, a first heat dissipation pipeline and a second heat dissipation pipeline, and is characterized in that a plurality of heating modules on a mainboard body of the mainboard module are at least arranged at intervals along a first direction; the liquid cooling substrate covers the mainboard body, and the outer peripheral contour line of the liquid cooling substrate exceeds the outer peripheral contour line of the mainboard body; the first heat dissipation pipeline and the second heat dissipation pipeline are both embedded in the surface of the side, away from the mainboard body, of the liquid cooling substrate, and the first heat dissipation pipeline communicates with the first sub liquid cooling plate of the heating module with the maximum heat generation amount in the multiple heating modules; the second heat dissipation pipeline at least extends in a bent shape in the first direction; the liquid cooling substrate is attached to at least a part of the heating modules in the rest of the heating modules with the maximum heat production capacity. The problem that all heating elements on a mainboard of a server cannot be effectively cooled by a liquid cooling heat dissipation system in the related technology is at least solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a server. BACKGROUND

[0002] With the rapid increase in power consumption of modern electronic equipment, especially high-performance computing devices such as servers, supercomputing centers, and artificial intelligence servers, the demand for heat dissipation is growing, and existing air-cooled heat dissipation technology has gradually failed to meet the requirements of efficient heat dissipation. Liquid cooling technology has become a key means for current high-power density device heat dissipation due to its high heat conduction performance. However, the existing liquid cooling system has certain limitations in design, especially in terms of heat dissipation efficiency, system complexity, maintenance convenience, and compatibility.

[0003] The existing liquid cooling technology mainly focuses on the heat dissipation of high-power components such as CPUs (central processing units) and memories of servers, while ignoring other heat-generating elements such as hard drives, M.2 solid-state drives, and network cards. SUMMARY

[0004] The present application provides a server to at least solve the problem that the liquid cooling system in the related art cannot effectively dissipate heat from all heat-generating elements on the mainboard of the server.

[0005] The present application provides a server, which includes a mainboard module, a liquid cooling base plate, a first heat dissipation pipeline, and a second heat dissipation pipeline. The mainboard body of the mainboard module is provided with a plurality of different heat-generating modules, and the plurality of heat-generating modules are arranged at intervals along a first direction. The liquid cooling base plate is arranged on the mainboard body, and the outer peripheral contour line of the liquid cooling base plate is located outside the outer peripheral contour line of the mainboard body. The first heat dissipation pipeline is embedded on the surface of the side of the liquid cooling base plate away from the mainboard body and is in communication with a first sub-liquid cooling plate of the heat-generating module with the largest heat generation among the plurality of heat-generating modules. The second heat dissipation pipeline is embedded on the surface of the side of the liquid cooling base plate away from the mainboard body and extends in a curved shape along the first direction. The part of the surface of the liquid cooling base plate on the side facing the mainboard body is arranged in close contact with at least part of the number of heat-generating modules among the remaining heat-generating modules with the largest heat generation, so as to remove heat through the second heat dissipation pipeline.

[0006] In an exemplary embodiment, at least part of the heat-generating modules among the remaining heat-generating modules with the largest heat generation have a heat-conducting structure to be in close contact with the surface of the liquid cooling base plate on the side facing the mainboard body through the heat-conducting structure.

[0007] In an exemplary embodiment, the first heat dissipation pipeline and the second heat dissipation pipeline are arranged in parallel.

[0008] In an example embodiment, the plurality of heat generating modules includes a processor module, the processor module having a first sub-liquid cooling plate; the first heat dissipation pipeline includes a first sub-liquid inlet pipe and a first sub-liquid outlet pipe, wherein two ends of the first sub-liquid inlet pipe are respectively communicated with a liquid inlet joint of the server and an inlet of the first sub-liquid cooling plate, and two ends of the first sub-liquid outlet pipe are respectively communicated with a liquid outlet joint of the server and an outlet of the first sub-liquid cooling plate; wherein the first sub-liquid inlet pipe and the first sub-liquid outlet pipe both extend along a straight line in the first direction.

[0009] In an example embodiment, the first sub-liquid inlet pipe and the inlet of the first sub-liquid cooling plate are connected by a detachable first locking structure; the first sub-liquid outlet pipe and the outlet of the first sub-liquid cooling plate are connected by a detachable second locking structure, for replacing the first sub-liquid cooling plate.

[0010] In an example embodiment, the first sub-liquid cooling plate has a first sub-flow channel and a second sub-flow channel, the first sub-flow channel and the second sub-flow channel are arranged in series, and one end of the first sub-flow channel away from the second sub-flow channel forms an inlet of the first sub-liquid cooling plate, and one end of the second sub-flow channel away from the first sub-flow channel forms an outlet of the first sub-liquid cooling plate; wherein a plurality of first fin structures are arranged at intervals in the first sub-flow channel, and a plurality of second fin structures are arranged at intervals in the second sub-flow channel.

[0011] In an example embodiment, the first spacing between any two adjacent first fin structures in the plurality of first fin structures is equal; the second spacing between any two adjacent second fin structures in the plurality of second fin structures is equal; wherein the first spacing is different from the second spacing.

[0012] In an example embodiment, the first spacing is greater than the second spacing.

[0013] In an example embodiment, the plurality of heat generating modules includes a first hard disk module, the first hard disk module having a second sub-liquid cooling plate; the second heat dissipation pipeline includes a second sub-liquid inlet pipe and a second sub-liquid outlet pipe, wherein two ends of the second sub-liquid inlet pipe are respectively communicated with the liquid inlet joint and an inlet of the second sub-liquid cooling plate, and two ends of the second sub-liquid outlet pipe are respectively communicated with the liquid outlet joint and an outlet of the second sub-liquid cooling plate; wherein in a second direction perpendicular to the first direction, the second sub-liquid inlet pipe and the second sub-liquid outlet pipe are respectively located on two sides of the first sub-liquid inlet pipe and the first sub-liquid outlet pipe, and the second sub-liquid inlet pipe and the second sub-liquid outlet pipe both extend in a curved shape.

[0014] In an example embodiment, the second sub-liquid cooling plate has a third sub-flow channel, the third sub-flow channel is in a U shape, and two ends of the U shape form the inlet and the outlet of the second sub-liquid cooling plate, respectively.

[0015] In an example embodiment, the first hard disk module further comprises a hard disk chip and a uniform temperature plate, the uniform temperature plate wraps at least part of the outer circumferential side of the hard disk chip; at least part of the side wall surface of the uniform temperature plate is arranged in abutment with the second sub-liquid cooling plate, and the surface of the uniform temperature plate away from the mainboard body is arranged in abutment with the surface of the liquid cooling substrate facing the mainboard body.

[0016] In an example embodiment, the mainboard body further comprises a plurality of connectors, the plurality of connectors are arranged at intervals; the plurality of heat generating modules comprise a board card assembly, the board card assembly comprises a plurality of chip particles stacked, the plurality of chip particles correspond one-to-one to the plurality of connectors, and each chip particle is connected to the mainboard body through the corresponding connector; wherein at least the chip particle located at the uppermost layer in the plurality of chip particles is directly abutted with the liquid cooling substrate.

[0017] In an example embodiment, the plurality of chip particles comprise at least two layers of chip particles stacked in a staggered manner, the number of connectors is consistent with the number of chip particles, and the height of each connector is different to adapt to chip particles of different layers; wherein the chip particle located at the uppermost layer is directly abutted with the liquid cooling substrate; the chip particle located at the lower layer is provided with a first heat conducting block between the liquid cooling substrate, so as to transmit heat to the liquid cooling substrate through the first heat conducting block.

[0018] In an example embodiment, the spacing distance between the two layers of chip particles is not less than 0.5mm; the thickness of the first heat conducting block ranges from 0 to 1.2mm.

[0019] In an example embodiment, the thickness of the first heat conducting block is 1mm.

[0020] In an example embodiment, the plurality of heat generating modules further comprise a second hard disk module, the second hard disk module comprises a second hard disk body and a second heat conducting block, wherein the second hard disk body is connected to the mainboard body in a plug-in manner, and the liquid cooling substrate has a avoiding gap at a position opposite to the second hard disk body; the second heat conducting block is located in the avoiding gap and connected to the liquid cooling substrate, and the surface of the second heat conducting block facing the mainboard body is arranged in abutment with the second hard disk body.

[0021] In an example embodiment, the second heat conducting block is detachably connected to the liquid cooling substrate.

[0022] In an example embodiment, the plurality of heat generating modules further comprises a network card module, the network card module comprising a support carrier, a network card body and an optical module, wherein the support carrier is connected to the mainboard body in a plug-in manner, the support carrier has a receiving groove and a pluggable groove capable of being deformed, an opening of the receiving groove faces the liquid cooling base plate, and an opening of the pluggable groove faces the front window of the server; the network card body is arranged at the receiving groove, and a third heat conduction block is attached to a side surface of the network card body away from the receiving groove, the third heat conduction block is attached to the liquid cooling base plate; at least part of the optical module is inserted into the pluggable groove to support a groove wall surface of the pluggable groove, and a cooling fin on an outer surface of the pluggable groove is attached to the liquid cooling base plate.

[0023] In an example embodiment, the optical module is two, the pluggable groove is two, the two pluggable grooves correspond to the two optical modules one by one, and the outer surface of each pluggable groove has a cooling fin.

[0024] In an example embodiment, the liquid cooling base plate has a first guide groove and a second guide groove on a surface away from the mainboard body, the first guide groove and the second guide groove are independently arranged; wherein the first guide groove extends in a straight line in a first direction, and the second guide groove is compressed in a curved shape in the first direction; the first heat dissipation pipeline is located in the first guide groove, and the second heat dissipation pipeline is located in the second guide groove.

[0025] In an example embodiment, the server further comprises a liquid leakage detection structure, the liquid leakage detection structure is attached to a surface of the liquid cooling base plate away from the mainboard body, and the liquid leakage detection structure covers at least a liquid leakage risk area.

[0026] In an example embodiment, the liquid leakage risk area at least includes a position where two ends of the first sub-liquid inlet pipe are respectively communicated with the liquid inlet connector and the inlet of the first sub-liquid cooling plate; and / or, a position where two ends of the first sub-liquid outlet pipe are respectively communicated with the liquid outlet connector and the outlet of the first sub-liquid cooling plate; and / or, a position where two ends of the second sub-liquid inlet pipe are respectively communicated with the liquid inlet connector and the inlet of the second sub-liquid cooling plate; and / or, a position where two ends of the second sub-liquid outlet pipe are respectively communicated with the liquid outlet connector and the outlet of the second sub-liquid cooling plate.

[0027] According to the application, a server is provided, comprising a mainboard module, a liquid cooling base plate, a first heat dissipation pipeline and a second heat dissipation pipeline. A plurality of different heat generating modules are arranged on a mainboard body of the mainboard module, and the plurality of heat generating modules are arranged at intervals along a first direction. The liquid cooling base plate is arranged on the mainboard body, and an outer peripheral contour line of the liquid cooling base plate is located outside an outer peripheral contour line of the mainboard body. The first heat dissipation pipeline is embedded on a surface of the liquid cooling base plate away from the mainboard body, and is in communication with a first sub-liquid cooling plate of a heat generating module with the largest heat generation among the plurality of heat generating modules. The second heat dissipation pipeline is embedded on the surface of the liquid cooling base plate away from the mainboard body, and extends in a curved shape along the first direction. A part of a surface of the liquid cooling base plate on a side facing the mainboard body is arranged in abutment with at least part of the heat generating modules other than the heat generating module with the largest heat generation, so as to remove heat through the second heat dissipation pipeline.

[0028] The liquid cooling base plate provided by the application can comprehensively cover the heat generating modules on the mainboard body, and effectively distribute the cooling liquid through the first heat dissipation pipeline and the second heat dissipation pipeline, so as to ensure that the heat is uniformly and effectively removed. By using the heat exchange characteristics of the cooling liquid, the first heat dissipation pipeline preferentially cools the high-power consumption area, and the second heat dissipation pipeline is responsible for other areas, forming a complementary heat dissipation network, which significantly improves the heat dissipation efficiency of the server, ensures that each heat generating module can normally work in a reasonable temperature environment, greatly reduces the operating temperature of the server, and prolongs the service life of the server.

[0029] Further, the second heat dissipation pipeline extends in a curved shape along the first direction. The design of the curved pipeline takes into account the spatial layout inside the server, avoids interference with other hardware, and also increases the liquid flow path, which is conducive to the uniform distribution of heat. The second heat dissipation pipeline 40 changes the flow direction of the cooling liquid, which helps to eliminate local hot spots and improve the thermal stability of the server. The technical solution in the embodiment not only optimizes the thermal management inside the server, but also improves the overall reliability and performance of the system. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0031] Figure 1 A partial structure schematic diagram of a server provided by the application;

[0032] Figure 2 A structure schematic diagram of the server in Figure 1 omits the structure schematic diagram of the liquid cooling base plate;

[0033] Figure 3 Fig. 1 is a structural schematic diagram of a server in the prior art; Figure 2 Fig. 2 is a structural schematic diagram of a liquid cooling base plate of the server in Fig. 1;

[0034] Figure 4 Fig. 3 is a structural schematic diagram of the server in Fig. 1 omitting the liquid cooling base plate, in which a respective area of a first heat dissipation pipeline and a second heat dissipation pipeline is shown; Figure 1 Fig. 4 is a structural schematic diagram of a first sub-liquid cooling plate of a processor module of the server in Fig. 1;

[0035] Figure 5 Fig. 5 is a structural schematic diagram of a second sub-liquid cooling plate of the processor module of the server in Fig. 1; Figure 1 Fig. 6 is a partial structural schematic diagram of a server provided by an embodiment of the present application;

[0036] Figure 6 Fig. 7 is a partial structural schematic diagram of a server provided by another embodiment of the present application, in which a structural schematic diagram of a locking structure is shown;

[0037] Figure 7 Fig. 8 is a structural schematic diagram of the locking structure of the server in Fig. 7 in a disassembled state.

[0038] Figure 8 Fig. 9 is a structural schematic diagram of a server in the prior art; Figure 7 Fig. 10 is a structural schematic diagram of a locking structure of the server in Fig. 9 in a disassembled state.

[0039] In the above figures, the following reference signs are used:

[0040] 10, motherboard module; 11, motherboard body; 111, connector;

[0041] 20, liquid cooling base plate; 21, avoiding notch; 22, first guide groove; 23, second guide groove; 24, first avoiding via; 25, second avoiding via;

[0042] 30, first heat dissipation pipeline; 31, first sub-liquid inlet pipe; 32, first sub-liquid outlet pipe;

[0043] 40, second heat dissipation pipeline; 41, second sub-liquid inlet pipe; 42, second sub-liquid outlet pipe;

[0044] 50, processor module; 51, first sub-liquid cooling plate; 511, first sub-flow channel; 5111, first fin structure; 512, second sub-flow channel; 5121, second fin structure;

[0045] 60, first hard disk module; 61, second sub-liquid cooling plate; 62, uniform temperature plate;

[0046] 70, board card assembly; 71, chip particle; 72, first heat conduction block;

[0047] 80, second hard disk module; 81, second hard disk body; 82, second heat conduction block;

[0048] 90, network card module; 91, support carrier; 92, third heat-conducting block; 93, optical module; 94, heat sink;

[0049] 110, liquid leakage detection structure;

[0050] 100, liquid inlet connector; 200, liquid outlet connector;

[0051] 300, locking assembly; 301, locking base; 302, locking cover plate. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0053] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case similar to the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0054] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0055] The embodiments of the present application provide a server, which is described in detail in combination with the structure and working principle of the server (the technical terms involved must be explained).

[0056] As Figures 1 to 8As shown, the server includes a mainboard module 10, a liquid cooling baseplate 20, a first heat dissipation pipeline 30, and a second heat dissipation pipeline 40. The mainboard body 11 of the mainboard module 10 is provided with a plurality of different heat generating modules, and the plurality of heat generating modules are arranged at intervals along the first direction. The liquid cooling baseplate 20 is arranged on the mainboard body 11, and the outer peripheral contour line of the liquid cooling baseplate 20 is located outside the outer peripheral contour line of the mainboard body 11. The first heat dissipation pipeline 30 is embedded on the surface of the liquid cooling baseplate 20 away from the mainboard body 11 and is in communication with the first sub-liquid cooling plate 51 of the heat generating module with the largest heat generation among the plurality of heat generating modules. The second heat dissipation pipeline 40 is embedded on the surface of the liquid cooling baseplate 20 away from the mainboard body 11 and extends in a curved shape along the first direction. The part of the surface of the liquid cooling baseplate 20 towards the mainboard body 11 is arranged in close contact with at least part of the heat generating modules other than the heat generating module with the largest heat generation, so as to remove heat through the second heat dissipation pipeline 40.

[0057] The liquid cooling baseplate 20 provided by the application can comprehensively cover the heat generating modules on the mainboard body 11, and effectively distribute the cooling liquid through the first heat dissipation pipeline 30 and the second heat dissipation pipeline 40, so as to ensure that the heat is uniformly and effectively removed. By using the heat exchange characteristics of the cooling liquid, the first heat dissipation pipeline 30 preferentially cools the high-power consumption area, while the second heat dissipation pipeline 40 is responsible for other areas, forming a complementary heat dissipation network, which significantly improves the heat dissipation efficiency of the server, ensures that each heat generating module can work normally in a reasonable temperature environment, greatly reduces the operating temperature of the server, and prolongs the service life of the server.

[0058] Further, the second heat dissipation pipeline 40 extends in a curved shape from the front window to the rear window of the server. The design of the curved pipeline takes into account the space layout inside the server, avoids interference with other hardware, and also increases the liquid flow path, which is conducive to the uniform distribution of heat. The second heat dissipation pipeline 40 changes the flow direction of the cooling liquid, which helps to eliminate local hot spots and improve the thermal stability of the server. The technical solution in the embodiment not only optimizes the thermal management inside the server, but also improves the overall reliability and performance of the system.

[0059] It should be noted that in other embodiments, the shape and material of the curved pipeline can be optimized to further improve the heat exchange efficiency and solve the heat dissipation challenge in the complex environment inside the server.

[0060] It should be noted that in other embodiments, the layout and diameter of the first heat dissipation pipeline 30 and the second heat dissipation pipeline 40 can be adjusted to optimize the cooling liquid flow and solve the heat dissipation demand under different server architectures.

[0061] It should be noted that in this application, at least some of the heat-generating modules, except those generating the most heat, have thermally conductive structures to adhere to the surface of the liquid-cooled substrate 20 facing the motherboard body 11. This thermally conductive structure enhances the thermal coupling between the heat-generating modules and the liquid-cooled substrate 20, improving heat conduction efficiency. Furthermore, the thermally conductive structure fills the tiny gaps between the heat-generating modules and the liquid-cooled substrate 20, reducing thermal resistance and promoting rapid heat transfer. The technical solution in this embodiment allows even heat-generating modules that are not in direct contact to be effectively cooled, further optimizing the overall heat dissipation performance of the server. In other embodiments, the efficiency of the thermally conductive structure can be improved by using materials with higher thermal conductivity, solving the heat dissipation problem of high-density servers.

[0062] Optionally, the thermally conductive structure includes at least one of a thermal pad and thermal paste.

[0063] It should be noted that in this application, the first heat dissipation pipe 30 and the second heat dissipation pipe 40 are connected in parallel. This ensures that the coolant can flow simultaneously through the high-power area (the heat-generating module with the largest heat output) and the second-highest heat-generating module (the low-power area), balancing the cooling needs of the entire server. Through parallel pipes, even if the heat dissipation demand in one area increases, it does not affect the cooling effect in another area, ensuring the stability and reliability of the system. The technical solution in this embodiment improves the utilization rate of the coolant, reduces energy consumption, and lowers maintenance costs. In other embodiments, the coolant flow rate in the pipes can be dynamically adjusted to address the heat dissipation needs under different load conditions, solving the heat dissipation problem of the server under different operating states.

[0064] like Figure 1 and Figure 2As shown, multiple heat dissipation modules include a processor module 50, which has a first sub-liquid cooling plate 51; the first heat dissipation pipe 30 includes a first sub-liquid inlet pipe 31 and a first sub-liquid outlet pipe 32, wherein the two ends of the first sub-liquid inlet pipe 31 are respectively connected to the liquid inlet connector 100 of the server and the inlet of the first sub-liquid cooling plate 51, and the two ends of the first sub-liquid outlet pipe 32 are respectively connected to the liquid outlet connector 200 of the server and the outlet of the first sub-liquid cooling plate 51; wherein the first sub-liquid inlet pipe 31 and the first sub-liquid outlet pipe 32 both extend in a straight line in a first direction. In this way, the processor module 50 is the heat-generating module with the highest power consumption and the highest heat generation. By setting the first heat dissipation pipe 30 to include a first sub-inlet pipe 31 and a first sub-outlet pipe 32, and making the two ends of the first sub-inlet pipe 31 connected to the server's inlet connector 100 and the inlet of the first sub-liquid cooling plate 51 respectively, and the two ends of the first sub-outlet pipe 32 connected to the server's outlet connector 200 and the outlet of the first sub-liquid cooling plate 51 respectively, it is beneficial to achieve effective heat dissipation of the CPU chip of the processor module 50, thereby ensuring that the CPU chip can operate normally under suitable ambient temperature.

[0065] It should be noted that in this application, the processor module 50 mentioned above can be a central processing unit module (i.e., a CPU module), an XPU module, or of course, a GPU module.

[0066] like Figure 3 As shown, a first clearance via 24 is provided at the position opposite to the processor module 50 on the liquid cooling substrate 20. Part of the periphery of the first clearance via 24 is used to support the processor module 50. The first clearance via 24 can cool the CPU chip of the processor module 50 by direct contact with the air.

[0067] like Figure 5As shown, the first sub-liquid cooling plate 51 has a first sub-flow channel 511 and a second sub-flow channel 512. The first sub-flow channel 511 and the second sub-flow channel 512 are connected in series, with the end of the first sub-flow channel 511 away from the second sub-flow channel 512 forming the inlet of the first sub-liquid cooling plate 51, and the end of the second sub-flow channel 512 away from the first sub-flow channel 511 forming the outlet of the first sub-liquid cooling plate 51. Multiple first fin structures 5111 are spaced apart within the first sub-flow channel 511, and multiple second fin structures 5121 are spaced apart within the second sub-flow channel 512. This series-connected first sub-flow channel 511 and second sub-flow channel 512, with each sub-flow channel 511 and second sub-flow channel 512 respectively equipped with multiple first fin structures 5111 and multiple second fin structures 5121, optimizes the flow path of the coolant, increases the heat exchange area, and thus improves heat dissipation efficiency. The introduction of multiple first fin structures 5111 and multiple second fin structures 5121 increases the contact area between the fluid and the solid, accelerating heat diffusion; significantly improving the heat dissipation effect of the processor module 50, reducing the operating temperature, and extending its service life.

[0068] It should be noted that in other embodiments, the shape and density of the fin structure can be adjusted to adapt to the heat dissipation requirements of different heat-generating modules, thus solving the heat dissipation problem of diverse heat-generating modules inside the server.

[0069] It should be noted that in this application, the first spacing between any two adjacent first fin structures 5111 in the plurality of first fin structures 5111 is equal; the second spacing between any two adjacent second fin structures 5121 in the plurality of second fin structures 5121 is equal; wherein, the first spacing and the second spacing are different.

[0070] Preferably, the first spacing is greater than the second spacing. This differentiated channel design takes into account the heat distribution in different heat-generating areas. By adjusting the first spacing between two adjacent first fin structures 5111 within the first sub-channel 511, and adjusting the second spacing between two adjacent second fin structures 5121 within the second sub-channel 512, more precise heat management is achieved. The larger first spacing is suitable for areas with concentrated heat, while the smaller second spacing is suitable for areas with dispersed heat. This design helps improve the heat exchange efficiency of the coolant. The technical solution in this embodiment enables the server's cooling system to better adapt to various heat generation modes, improving the overall heat dissipation capacity of the system.

[0071] It should be noted that in other embodiments, the problem of insufficient adaptability of the heat dissipation system can also be solved by dynamically adjusting the channel spacing to respond to changes in the server's operating status.

[0072] It should be noted that, in this application, considering that the power consumption of the hard drive chip in the first hard drive module 60 is second only to the CPU chip, in order to ensure the heat dissipation reliability of the hard drive chip, such as Figure 4 As shown, the multiple heat-generating modules include a first hard disk module 60, which has a second sub-liquid cooling plate 61; the second heat dissipation pipe 40 includes a second sub-liquid inlet pipe 41 and a second sub-liquid outlet pipe 42, wherein the two ends of the second sub-liquid inlet pipe 41 are respectively connected to the inlet of the inlet connector 100 and the inlet of the second sub-liquid cooling plate 61, and the two ends of the second sub-liquid outlet pipe 42 are respectively connected to the outlet of the drain connector 200 and the outlet of the second sub-liquid cooling plate 61; wherein, in a second direction perpendicular to the first direction, the second sub-liquid inlet pipe 41 and the second sub-liquid outlet pipe 42 are located on both sides of the first sub-liquid inlet pipe 31 and the first sub-liquid outlet pipe 32, and both the second sub-liquid inlet pipe 41 and the second sub-liquid outlet pipe 42 extend in a curved shape. In this way, the second sub-liquid cooling plate 61 effectively removes heat generated by the hard disk chip, thereby ensuring the reliable operation of the hard disk chip. Furthermore, by positioning the second sub-inlet pipe 41 and the second sub-outlet pipe 42 on opposite sides of the first sub-inlet pipe 31 and the first sub-outlet pipe 32, respectively, and by having both sub-inlet pipes 41 and 42 extend in a curved manner, the internal space of the server is fully utilized, cross-interference between pipes is avoided, and the system structure is simplified. Separating the second sub-inlet pipe 41 and the second sub-outlet pipe 42 reduces pressure loss during coolant flow and improves coolant circulation efficiency. The technical solution in this embodiment makes the server's cooling system more compact, reducing manufacturing costs and installation difficulty.

[0073] It should be noted that in other embodiments, the space utilization can be further optimized by introducing a three-dimensional pipeline design, thus solving the problem of heat dissipation layout with limited internal space of the server.

[0074] It should be noted that in this application, the second sub-liquid cooling plate 61 has a third sub-flow channel, which is U-shaped, and the openings at both ends of the U-shape form the inlet and outlet of the second sub-liquid cooling plate 61, respectively.

[0075] like Figure 2 and Figure 3 As shown, the second clearance through-hole 25 is used to avoid the second sub-liquid cooling plate 61. Specifically, as... Figure 3 As shown, a second clearance through hole 25 is provided at the position opposite to the first hard disk module 60 on the liquid-cooled substrate 20. Part of the periphery of the second clearance through hole 25 is used to support the first hard disk module 60. The second clearance through hole 25 can cool the second sub-liquid cooling plate 61 of the first hard disk module 60 by direct contact with the air.

[0076] It should be noted that, in this application, the first direction mentioned above refers to the direction from the front window to the rear window of the server, and the second direction mentioned above refers to the direction perpendicular to the direction from the front window to the rear window of the server.

[0077] like Figure 2 and Figure 4 As shown, the first hard drive module 60 also includes a hard drive chip and a heat spreader 62. The heat spreader 62 wraps around at least a portion of the outer periphery of the hard drive chip. At least a portion of the sidewall of the heat spreader 62 is attached to a second sub-liquid cooling plate 61, and the surface of the heat spreader 62 facing away from the motherboard body 11 is attached to the surface of the liquid cooling substrate 20 facing the motherboard body 11. In this way, the addition of the heat spreader 62 ensures that the heat generated by the hard drive chip is evenly distributed, avoiding localized overheating. The heat spreader 62, through its excellent thermal conductivity, rapidly diffuses the heat from the hard drive chip onto a larger surface area, improving heat dissipation efficiency. Furthermore, by attaching at least a portion of the sidewall of the heat spreader 62 to the second sub-liquid cooling plate 61, and by attaching the surface of the heat spreader 62 facing away from the motherboard body 11 to the surface of the liquid cooling substrate 20 facing the motherboard body 11, the hard drive temperature is effectively controlled, ensuring reliable heat dissipation for the hard drive chip and guaranteeing the stability and security of data storage.

[0078] It should be noted that, in other embodiments of this application, the heat conduction performance can be further improved by increasing the thickness of the heat spreader 62 or by using composite materials, thereby solving the heat dissipation problem of high-density hard disk arrays.

[0079] like Figure 6 As shown, the motherboard body 11 is also provided with multiple connectors 111, which are spaced apart. Multiple heat dissipation modules include board components 70, which include multiple stacked chip particles 71. Each chip particle 71 corresponds one-to-one with a connector 111, and each chip particle 71 is connected to the motherboard body 11 through its corresponding connector 111. At least the topmost chip particle 71 is directly attached to the liquid cooling substrate 20. This direct contact between the topmost chip particle 71 and the liquid cooling substrate 20 ensures efficient heat dissipation of the board component 70 while also accommodating the layout of the multiple chip particles 71.

[0080] like Figure 6As shown, the plurality of chip particles 71 include at least two layers of chip particles 71 stacked in a staggered manner. The number of connectors 111 is the same as the number of chip particles 71, and the height of each connector 111 is different to accommodate different layers of chip particles 71. The uppermost chip particle 71 is directly attached to the liquid-cooled substrate 20. A first heat-conducting block 72 is disposed between the lower chip particle 71 and the liquid-cooled substrate 20 to transfer heat to the liquid-cooled substrate 20. In this way, the first heat-conducting block 72, with its good thermal conductivity, transfers the heat from the lower chip particle 71 to the liquid-cooled substrate 20, realizing vertical heat conduction. The technical solution in this embodiment effectively controls the temperature of the chip particles 71, avoiding data errors and system instability caused by overheating.

[0081] It should be noted that in this application, the aforementioned board component 70 can be a memory module, and the corresponding chip 71 can be the memory itself.

[0082] It should be noted that in other embodiments, the heat conduction efficiency can be improved and the problem of uneven heat dissipation in multi-layer memory can be solved by optimizing the material and shape of the first heat-conducting block.

[0083] It should be noted that in this application, the spacing between the two layers of chip particles 71 is not less than 0.5 mm; the thickness of the first heat-conducting block 72 ranges from 0 to 1.2 mm. Thus, by setting the thickness range of the first heat-conducting block 72 to be greater than the spacing range between adjacent layers of chip particles 71, the thickness of the first heat-conducting block 72 is ensured to be sufficiently large, thereby ensuring that the lower chip particle in the two staggered stacked layers of chip particles 71 can achieve effective heat dissipation through the corresponding first heat-conducting block 72.

[0084] Furthermore, precisely controlling the spacing between the chip particles 71 and the thickness of the first heat-conducting block 72 helps balance heat conduction and airflow, optimizing heat dissipation. A reasonable spacing and thickness of the first heat-conducting block 72 ensure effective heat transfer while preventing airflow obstruction, creating a good heat dissipation environment. The technical solution in this embodiment ensures the stability and reliability of the board assembly 70 under high load operation, extending the server's lifespan.

[0085] It should be noted that in other embodiments, the dynamic adjustment problem of memory heat dissipation can also be solved by dynamically adjusting the interval distance and the thickness of the first heat-conducting block 72 in response to changes in the internal temperature of the server.

[0086] Preferably, the thickness of the first heat-conducting block 72 is 1 mm.

[0087] like Figures 1 to 4As shown, the multiple heat-generating modules also include a second hard disk module 80. The second hard disk module 80 includes a second hard disk body 81 and a second heat-conducting block 82. The second hard disk body 81 is connected to the motherboard body 11 via a plug-in connection, and the liquid cooling substrate 20 has a clearance notch 21 at a position opposite to the second hard disk body 81. The second heat-conducting block 82 is located at the clearance notch 21 and connected to the liquid cooling substrate 20, with the surface of the second heat-conducting block 82 facing the motherboard body 11 in contact with the second hard disk body 81. Thus, the design of the clearance notch 21 avoids direct contact between the liquid cooling substrate 20 and the second hard disk body 81, ensuring normal plugging and unplugging and maintenance of the second hard disk body 81. The existence of the clearance notch 21 does not affect the overall performance of the liquid cooling system, while providing necessary operating space for the second hard disk body 81. The technical solution in this embodiment simplifies the replacement process of the second hard disk body 81 and improves the maintainability and scalability of the server.

[0088] Furthermore, a second heat-conducting block 82 is provided at the clearance notch 21 and connected to the liquid-cooled substrate 20 to transfer the heat generated by the second hard disk drive body 81. The introduction of the second heat-conducting block 82 compensates for the heat conduction loss caused by the clearance notch 21, ensuring the effective removal of heat from the second hard disk drive body 81; the second heat-conducting block 82, through its excellent thermal conductivity, transfers the heat generated by the second hard disk drive body 81 to the liquid-cooled substrate 20, realizing indirect heat conduction. The technical solution in this embodiment ensures temperature control of the hard disk drive during high-load operation and avoids the risk of data corruption.

[0089] It should be noted that in other embodiments, the heat dissipation efficiency of the hard disk can be improved by enhancing the thermal conductivity of the second heat-conducting block 82, thereby solving the temperature control problem of the high-density hard disk array.

[0090] It should be noted that in other embodiments, the size and position of the clearance notch 21 can be optimized to better accommodate hard drives of different specifications, thus solving the compatibility problem of hard drive replacement in the server.

[0091] It should be noted that in this application, the second hard disk module 80 mentioned above usually refers to an M.2 solid-state drive.

[0092] In one exemplary embodiment, the second heat-conducting block 82 is detachably connected to the liquid-cooled substrate 20. This ensures that after the second heat-conducting block 82 is removed, operational space is provided for the insertion and removal of the second hard disk body 81.

[0093] like Figure 4As shown, the multiple heat dissipation modules also include a network card module 90. The network card module 90 includes a support carrier 91, a network card body, and an optical module 93. The support carrier 91 is connected to the motherboard body 11 via a plug-in connection. The support carrier 91 has a receiving slot and a deformable insertion slot. The opening of the receiving slot faces the liquid-cooled substrate 20, and the opening of the insertion slot faces the front window of the server. The network card body is disposed in the receiving slot, and a third heat-conducting block 92 is attached to the surface of the network card body facing away from the receiving slot. The third heat-conducting block 92 is attached to the liquid-cooled substrate 20. At least a portion of the optical module 93 is inserted into the insertion slot to support the slot wall and to make the heat sink 94 located on the outer surface of the insertion slot attached to the liquid-cooled substrate 20. In this way, a deformable insertion slot is provided, and a third heat-conducting block 92 is provided between the network card body and the liquid-cooled substrate 20. The deformable design of the connector slot ensures flexible installation of the network card module 90, while the third heat-conducting block 92 ensures good thermal contact between the network card body and the liquid-cooled substrate 20. The third heat-conducting block 92 fills the gap between the network card body and the liquid-cooled substrate 20, reducing thermal resistance and improving heat conduction efficiency. The technical solution in this embodiment effectively controls the network card temperature, ensuring the stability and speed of network communication. Of course, in other embodiments, adaptive thermal conductive materials can be introduced to automatically adjust the heat conduction performance and solve the heat dissipation problem of the server's network card module 90 under different operating conditions.

[0094] Furthermore, the optical module 93 inserted into the slot supports the slot wall, allowing the heat sink 94 to adhere to the liquid-cooled substrate 20. This combination of the optical module 93 and the heat sink 94 ensures that the heat generated by the optical module 93 can be rapidly transferred to the liquid-cooled substrate 20, achieving efficient heat exchange. The heat from the optical module 93 is directly conducted to the liquid-cooled substrate 20 through the heat sink 94, reducing the heat conduction path and improving heat dissipation efficiency. The technical solution in this embodiment effectively controls the temperature of the optical module 93, ensuring the stability and reliability of high-speed data transmission. Of course, in other embodiments, the heat conduction performance can be further improved by optimizing the material and structure of the heat sink 94, solving the heat dissipation problem of the server optical module 93 under high load.

[0095] like Figure 4 As shown, there are two optical modules 93 and two plug slots. The two plug slots correspond one-to-one with the two optical modules 93, and each plug slot has a heat sink 94 on its outer surface.

[0096] like Figure 3As shown, the liquid-cooled substrate 20 has a first guide groove 22 and a second guide groove 23 on the surface of the side opposite to the motherboard body 11. The first guide groove 22 and the second guide groove 23 are independently provided. The first guide groove 22 extends in a straight line in the first direction, and the second guide groove 23 is curved and compressed in the first direction. The first heat dissipation pipe 30 is located in the first guide groove 22, and the second heat dissipation pipe 40 is located in the second guide groove 23.

[0097] like Figure 1 and Figure 4 As shown, the server also includes a leakage detection structure 110, which is attached to the surface of the liquid-cooled substrate 20 on the side opposite to the motherboard body 11, and the leakage detection structure 110 at least covers the leakage risk area. In this way, the setting of the leakage detection structure 110 enables real-time and effective detection of the leakage risk area, thereby ensuring that measures are taken immediately to resolve the leakage problem after leakage information is detected.

[0098] It should be noted that, in this application, the aforementioned leakage detection structure 110 can be a leakage detection membrane, or of course, a leakage detection line.

[0099] like Figure 1 and Figure 4 As shown, the leakage risk area includes at least the locations where both ends of the first sub-inlet pipe 31 are connected to the inlet connector 100 and the inlet of the first sub-liquid cooling plate 51, respectively; and / or, the locations where both ends of the first sub-outlet pipe 32 are connected to the outlet of the drain connector 200 and the outlet of the first sub-liquid cooling plate 51, respectively; and / or, the locations where both ends of the second sub-inlet pipe 41 are connected to the inlet of the inlet connector 100 and the inlet of the second sub-liquid cooling plate 61, respectively; and / or, the locations where both ends of the second sub-outlet pipe 42 are connected to the outlet of the drain connector 200 and the outlet of the second sub-liquid cooling plate 61, respectively. This ensures that the leakage risk area in this application can be effectively detected in real time by the leakage detection structure 110.

[0100] It should be noted that, in this application, due to the presence of the liquid-cooled substrate 20, and the fact that the first heat dissipation pipe 30 is located in the first guide groove 22 and the second heat dissipation pipe 40 is located in the second guide groove 23, even if leakage occurs in the leakage risk area, the liquid-cooled substrate 20 itself has a certain barrier effect, preventing the leakage from directly contacting the motherboard body 11.

[0101] like Figure 7 and Figure 8As shown, the inlet of the first sub-inlet pipe 31 is connected to the inlet of the first sub-liquid cooling plate 51 via a detachable first locking structure; the outlet of the first sub-outlet pipe 32 is connected to the outlet of the first sub-liquid cooling plate 51 via a detachable second locking structure, for the purpose of replacing the first sub-liquid cooling plate 51. Thus, the detachable first and second locking structures facilitate the maintenance and upgrading of the first sub-liquid cooling plate 51, allowing replacement without completely disassembling the server. Furthermore, the design of the first and second locking structures considers the sealing and maintainability of the liquid cooling system, ensuring no coolant leakage and facilitating on-site maintenance. The technical solution in this embodiment simplifies the server maintenance process and reduces downtime caused by heat dissipation system failures.

[0102] Furthermore, the second locking structure complements the first locking structure, jointly maintaining the integrity and effectiveness of the liquid cooling system. The technical solution in this embodiment ensures the stability of the server during long-term operation and reduces failures caused by improper maintenance of the heat dissipation system.

[0103] Specifically, in this application, reference is made to Figure 7 and Figure 8 As can be seen, the first and second locking structures in this application are integrally formed, that is, the locking assembly 300 includes the first and second locking structures. Further, the locking assembly 300 includes a locking base 301 and a locking cover plate 302, and the locking base 301 and the locking cover plate 302 are connected by fasteners to ensure convenient installation and disassembly of both. The surface of the locking base 301 facing the locking cover plate 302 has two first arc-shaped grooves for locking... The surface of the cover plate 302 facing the locking base 301 has two second arc-shaped grooves. The two first arc-shaped grooves correspond one-to-one with the two second arc-shaped grooves and form two circular limiting holes. The two circular limiting holes are used to limit the connection between the first sub-inlet pipe 31 of the first heat dissipation pipe 30 and the inlet of the first sub-liquid cooling plate 51, and the connection between the first sub-outlet pipe 32 of the first heat dissipation pipe 30 and the outlet of the first sub-liquid cooling plate 51, so as to ensure the convenience of replacing the first sub-liquid cooling plate 51.

[0104] It should be noted that in other embodiments, the sealing performance of the locking structure can be enhanced to prevent coolant leakage and solve the security issues of the server operating environment.

[0105] It should be noted that in other embodiments, the maintenance time can be further reduced and the problem of server maintenance efficiency can be solved by introducing fast connection technology.

[0106] The heat dissipation process of the server in this application is as follows: When the server starts up, coolant enters the first heat dissipation pipe 30 and the second heat dissipation pipe 40 from the inlet connector 100. The coolant first flows through the first sub-inlet pipe 31 and enters the first sub-channel 511 of the first sub-liquid cooling plate 51, where it exchanges heat with the CPU chip of the processor module 50 through the first fin structure 5111. Then, it flows through the second sub-channel 512 and further absorbs heat through the second fin structure 5121. Finally, it returns to the drain connector 200 through the first sub-drain pipe 32. At the same time, the coolant also flows through the second sub-inlet pipe 41 and enters the second sub-liquid cooling plate 61, where it exchanges heat with the hard disk chip of the first hard disk module 60. Then, it returns to the drain connector 200 through the second sub-drain pipe 42. During this process, the coolant also exchanges heat with the board assembly 70 and the network card module 90 through the liquid cooling substrate 20, ensuring that the temperature of each heat-generating module inside the server is effectively controlled, thereby ensuring the stable operation and data processing capabilities of the server.

[0107] The server provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server, characterized in that, include: The motherboard module (10) has multiple different heat-generating modules on its motherboard body (11), and the multiple heat-generating modules are spaced apart at least along a first direction. Liquid-cooled substrate (20) is mounted on the motherboard body (11), and the outer periphery outline of the liquid-cooled substrate (20) is located outside the outer periphery outline of the motherboard body (11). The first heat dissipation pipe (30) is embedded on the surface of the liquid cooling substrate (20) away from the main body (11) and is connected to the first sub-liquid cooling plate (51) of the heat dissipation module that generates the most heat among the multiple heat dissipation modules. The second heat dissipation pipe (40) is embedded on the surface of the liquid cooling substrate (20) on the side away from the motherboard body (11) and extends in a curved shape at least along the first direction. The liquid-cooled substrate (20) has a portion of its surface facing the motherboard body (11) that is attached to at least a portion of the heat-generating modules except for the ones that generate the most heat, so that heat can be carried away through the second heat dissipation pipe (40).

2. The server according to claim 1, characterized in that, At least some of the heating modules, except for those that generate the most heat, have a thermally conductive structure to be attached to the surface of the liquid-cooled substrate (20) facing the motherboard body (11) via the thermally conductive structure.

3. The server according to claim 1, characterized in that, The first heat dissipation pipe (30) and the second heat dissipation pipe (40) are connected in parallel.

4. The server according to claim 1, characterized in that, The plurality of heat-generating modules include a processor module (50), the processor module (50) having the first sub-liquid cooling plate (51); The first heat dissipation pipe (30) includes a first sub-inlet pipe (31) and a first sub-outlet pipe (32), wherein the two ends of the first sub-inlet pipe (31) are respectively connected to the inlet connector (100) of the server and the inlet of the first sub-liquid cooling plate (51), and the two ends of the first sub-outlet pipe (32) are respectively connected to the outlet connector (200) of the server and the outlet of the first sub-liquid cooling plate (51); The first sub-inlet pipe (31) and the first sub-outlet pipe (32) both extend in a straight line in the first direction.

5. The server according to claim 4, characterized in that, The first sub-inlet pipe (31) and the inlet of the first sub-liquid cooling plate (51) are connected by a detachable first locking structure. The first sub-drain pipe (32) and the outlet of the first sub-liquid cooling plate (51) are connected by a detachable second locking structure for replacing the first sub-liquid cooling plate (51).

6. The server according to claim 4, characterized in that, The first sub-liquid cooling plate (51) has a first sub-flow channel (511) and a second sub-flow channel (512). The first sub-flow channel (511) and the second sub-flow channel (512) are connected in series. The end of the first sub-flow channel (511) away from the second sub-flow channel (512) forms the inlet of the first sub-liquid cooling plate (51), and the end of the second sub-flow channel (512) away from the first sub-flow channel (511) forms the outlet of the first sub-liquid cooling plate (51). The first sub-channel (511) is provided with a plurality of first fin structures (5111) spaced apart, and the second sub-channel (512) is provided with a plurality of second fin structures (5121) spaced apart.

7. The server according to claim 6, characterized in that, The first spacing between any two adjacent first fin structures (5111) in the plurality of first fin structures (5111) is equal; The second spacing between any two adjacent second fin structures (5121) in the plurality of second fin structures (5121) is equal; The first spacing is different from the second spacing.

8. The server according to claim 7, characterized in that, The first spacing is greater than the second spacing.

9. The server according to claim 4, characterized in that, The plurality of heat-generating modules include a first hard disk module (60), the first hard disk module (60) having a second sub-liquid cooling plate (61); The second heat dissipation pipe (40) includes a second sub-inlet pipe (41) and a second sub-outlet pipe (42), wherein the two ends of the second sub-inlet pipe (41) are respectively connected to the inlet connector (100) and the inlet of the second sub-liquid cooling plate (61), and the two ends of the second sub-outlet pipe (42) are respectively connected to the outlet of the outlet connector (200) and the outlet of the second sub-liquid cooling plate (61); In the second direction perpendicular to the first direction, the second sub-inlet pipe (41) and the second sub-outlet pipe (42) are located on both sides of the first sub-inlet pipe (31) and the first sub-outlet pipe (32), respectively, and the second sub-inlet pipe (41) and the second sub-outlet pipe (42) both extend in a curved shape.

10. The server according to claim 9, characterized in that, The second sub-liquid cooling plate (61) has a third sub-flow channel, which is U-shaped, and the two ends of the U-shape form the inlet and outlet of the second sub-liquid cooling plate (61), respectively.

11. The server according to claim 9, characterized in that, The first hard disk module (60) further includes a hard disk chip and a heat spreader (62), wherein the heat spreader (62) wraps around at least a portion of the outer periphery of the hard disk chip; At least a portion of the sidewall of the heat spreader (62) is attached to the second sub-liquid cooling plate (61), and the surface of the heat spreader (62) facing away from the main body (11) is attached to the surface of the liquid cooling substrate (20) facing the main body (11).

12. The server according to claim 1, characterized in that, The motherboard body (11) is also provided with multiple connectors (111), which are spaced apart; The multiple heating modules include board components (70), the board components (70) include multiple stacked chip particles (71), the multiple chip particles (71) correspond one-to-one with the multiple connectors (111), and each chip particle (71) is connected to the motherboard body (11) through the corresponding connector (111). Among them, at least the uppermost chip particle (71) of the plurality of chip particles (71) is directly bonded to the liquid-cooled substrate (20).

13. The server according to claim 12, characterized in that, The plurality of chip particles (71) include at least two layers of chip particles (71) arranged in a staggered stack, the number of connectors (111) is the same as the number of chip particles (71), and the height of each connector (111) is different to accommodate different layers of chip particles (71). Among them, the chip particle (71) located at the top layer is directly attached to the liquid-cooled substrate (20); A first heat-conducting block (72) is provided between the chip particle (71) located in the lower layer and the liquid-cooled substrate (20) to transfer heat to the liquid-cooled substrate (20) through the first heat-conducting block (72).

14. The server according to claim 13, characterized in that, The spacing between the two layers of chip particles (71) is not less than 0.5 mm; The thickness of the first heat-conducting block (72) ranges from 0 to 1.2 mm.

15. The server according to claim 14, characterized in that, The thickness of the first heat-conducting block (72) is 1 mm.

16. The server according to claim 1, characterized in that, The plurality of heat-generating modules also include a second hard disk module (80), the second hard disk module (80) comprising: The second hard disk body (81) is connected to the motherboard body (11) in a plug-in manner, and the liquid cooling substrate (20) has a clearance notch (21) at the position opposite to the second hard disk body (81). The second heat-conducting block (82) is located in the clearance notch (21) and connected to the liquid cooling substrate (20), and the surface of the second heat-conducting block (82) facing the motherboard body (11) is attached to the second hard disk body (81).

17. The server according to claim 16, characterized in that, The second heat-conducting block (82) is detachably connected to the liquid-cooled substrate (20).

18. The server according to claim 1, characterized in that, The plurality of heat-generating modules also include a network card module (90), the network card module (90) comprising: Support carrier (91) is connected to the motherboard body (11) in a pluggable manner. The support carrier (91) has a receiving groove and a deformable plug-in groove. The opening of the receiving groove faces the liquid-cooled substrate (20), and the opening of the plug-in groove faces the front window of the server. The network card body is disposed in the receiving groove, and a third heat-conducting block (92) is attached to the surface of the network card body facing away from the receiving groove. The third heat-conducting block (92) is attached to the liquid cooling substrate (20). An optical module (93) is inserted into the socket to support the wall of the socket and to make the heat sink (94) located on the outer surface of the socket fit against the liquid-cooled substrate (20).

19. The server according to claim 18, characterized in that, There are two optical modules (93) and two plug slots. The two plug slots correspond one-to-one with the two optical modules (93), and the outer surface of each plug slot has the heat sink (94).

20. The server according to any one of claims 1 to 19, characterized in that, The liquid-cooled substrate (20) has a first guide groove (22) and a second guide groove (23) on the surface of the side opposite to the main body (11), and the first guide groove (22) and the second guide groove (23) are independently provided; Wherein, the first guide groove (22) extends in a straight line in the first direction, and the second guide groove (23) is curved and compressed in the first direction; The first heat dissipation pipe (30) is located in the first guide groove (22), and the second heat dissipation pipe (40) is located in the second guide groove (23).

21. The server according to claim 9, characterized in that, The server also includes: A leakage detection structure (110) is attached to the surface of the liquid-cooled substrate (20) on the side away from the motherboard body (11), and the leakage detection structure (110) at least covers the leakage risk area.

22. The server according to claim 21, characterized in that, The leakage risk area includes at least: The two ends of the first sub-inlet pipe (31) are respectively connected to the inlet connector (100) and the inlet of the first sub-liquid cooling plate (51); and / or, The two ends of the first sub-drain pipe (32) are respectively connected to the drain connector (200) and the outlet of the first sub-liquid cooling plate (51); and / or, The two ends of the second sub-inlet pipe (41) are respectively connected to the inlet connector (100) and the inlet of the second sub-liquid cooling plate (61); and / or, The two ends of the second sub-drain pipe (42) are respectively connected to the drain connector (200) and the outlet of the second sub-liquid cooling plate (61).

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