Positioning anti-offset chip mounter and chip mounting method

Abstract

The invention relates to the related technical field of electrical element assembly manufacturing, in particular to a positioning anti-deviation chip mounter and a chip mounter method.The positioning anti-deviation chip mounter comprises a cabinet body, a feeding module and a component transferring module used for transferring components on the feeding module to the position of a PCB bonding pad, and the component transferring module comprises an assembling plate movably arranged in the cabinet body; the assembly plate can be driven by two groups of power mechanisms in the cabinet body, a movable seat is slidably arranged on the assembly plate, and the bottom of the movable seat is connected with a suction nozzle through a negative pressure pipeline; the cylinder is arranged, the multiple limiting grooves with different lengths are formed in the cylinder, and the protruding columns correspond to the limiting grooves with the appropriate lengths before the component is released, so that the downward movement forming amount of the suction nozzle is accurately controlled, and the negative pressure state in the negative pressure pipeline is relieved through the change of the position relation between the first conduction groove and the second conduction groove; and the problems that the component is released unstably and deviates due to sudden release of the component are avoided.

Description

Technical Field

[0001] This invention relates to the technical field of electrical component assembly manufacturing, specifically a positioning and anti-misalignment pick-and-place machine and pick-and-place method. Background Technology

[0002] Pick-and-place machines, as advanced electronic manufacturing equipment, are widely used in modern electronic production. They utilize a suction nozzle system with negative pressure to precisely pick up surface-mount components (SMDs) from the feeder and quickly transfer them to designated pads on a printed circuit board (PCB). This highly automated process ensures component placement accuracy and efficiency, meeting the demands of large-scale production. During operation, the components are aligned with their mounting orientation in the feeder. The suction nozzle uses negative pressure to pick up the components and place them on the designated pads on the PCB. As the nozzle approaches the component surface, the negative pressure inside the nozzle creates a pressure difference sufficient to overcome the component's weight. Atmospheric pressure then presses the component against the nozzle, achieving adsorption. Once the component reaches its designated mounting position, the nozzle releases it.

[0003] Currently, component release is generally achieved by cutting off the vacuum source, introducing compressed air, using mechanical ejection devices, and vibration-assisted release. While these methods can successfully release components, they have limitations. Specifically, cutting off the vacuum source is the most direct method, quickly stopping the component's adsorption. However, suddenly cutting off the vacuum source can cause the nozzle's adsorption force on the component to disappear instantly, causing the component to fall rapidly under its own weight, potentially impacting the solder pads and the component itself, and possibly causing the component to shift position. When introducing compressed air, if the airflow... Excessive airflow can cause components to shift on the pads or even damage them, while insufficient airflow may fail to release components effectively. Furthermore, different component types require different airflow intensities, placing high demands on the control of compressed air flow and pressure. For some uniquely shaped or fragile components, mechanical ejection devices may not be suitable; uneven or excessive ejection force from the ejector pins or pistons can damage or deform the components. Vibration can be transmitted to other parts of the pick-and-place machine, causing overall equipment vibration and affecting the placement accuracy of other components and the normal operation of the equipment. Therefore, existing component release mechanisms still have room for improvement in stability during release, as they are prone to component shifting, leading to poor soldering, reduced circuit conductivity and reliability, decreased electrical performance, and problems such as poor signal transmission and contact. Summary of the Invention

[0004] The purpose of this invention is to provide a positioning and anti-misalignment pick-and-place machine and a pick-and-place method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A positioning and anti-misalignment pick-and-place machine includes a cabinet, a feeding module, and a component transfer module for transferring components from the feeding module to PCB pads. The component transfer module includes:

[0007] The assembly plate is located inside the cabinet and can be driven by two sets of power mechanisms inside the cabinet to move in the horizontal or vertical direction. The assembly plate has a movable seat that slides on it. The bottom of the movable seat is connected to a suction nozzle through a negative pressure pipeline, and the negative pressure pipeline has a conductive structure.

[0008] The cylinder connected to the power mechanism has an arc-shaped groove and multiple circumferentially distributed limiting grooves that communicate with the arc-shaped groove. The multiple limiting grooves are parallel to the axis of the cylinder, and their lengths increase or decrease circumferentially. The negative pressure pipeline has a protrusion that cooperates with the limiting groove. The negative pressure pipeline can drive the protrusion to rotate circumferentially, so that the protrusion can correspond to the multiple limiting grooves respectively. When the suction nozzle discharges material, after the protrusion reaches the bottom of the limiting groove, the suction nozzle and the component stop, the conduction structure is triggered, and the negative pressure state in the negative pressure pipeline is released, so that the suction nozzle releases the component.

[0009] As a further aspect of the present invention: the negative pressure pipeline includes a first pipe fitting rotatably mounted on the movable seat and a second pipe fitting that is sealed and slidably fitted with the first pipe fitting, the second pipe fitting being connected to the assembly plate through an elastic support structure;

[0010] The movable seat is equipped with a motor whose output end is connected to the first pipe. The motor can drive the first pipe and the second pipe to rotate synchronously, and the movable seat can be driven by a threaded assembly located on the side of the assembly plate to slide along the length direction of the assembly plate.

[0011] As a further embodiment of the present invention: the suction nozzle is rotatably connected to the second tube, the protrusion is fixed to the outer wall of the second tube, a strip-shaped protrusion is formed on the outer wall of the first tube, and a strip-shaped groove is provided on the inner wall of the second tube. The strip-shaped groove is adapted to the strip-shaped protrusion, and both are parallel to the axial direction of the first tube and the second tube.

[0012] As a further embodiment of the present invention: the conductive structure includes a plurality of first conductive grooves and second conductive grooves respectively disposed on the first pipe and the second pipe and distributed along the circumference, and the cylinder is slidably fitted with the second pipe;

[0013] The first pipe fitting has multiple ports along its circumference. The bottom of the movable seat is fixed with a kit that is sealed and slidably fitted with the first pipe fitting. The multiple ports are enclosed by the kit, and the kit is connected to a negative pressure pump via a hose.

[0014] As a further embodiment of the present invention: the elastic support structure includes a horizontal plate disposed on the side of the assembly plate, each end of the horizontal plate is connected to the assembly plate by a set of elastic elements, and a slider is slidably fitted on the side of the horizontal plate facing the second pipe, and the slider is rotatably connected to the second pipe.

[0015] The elastic element includes a column fixed to the side of the horizontal plate by a second protrusion and a spring sleeved on the outer periphery of the column. The column passes through and is fixed to the side of the assembly plate by a first protrusion and is slidably connected to the first protrusion. The two ends of the spring are respectively connected to the first protrusion and the second protrusion.

[0016] As a further embodiment of the present invention: the power mechanism includes a pushing structure and a lifting structure disposed in the cabinet. The lifting structure includes a vertical arm fixed in the cabinet, a horizontal arm slidably disposed on the vertical arm, and a second cylinder fixed in the cabinet. The movable end of the second cylinder is fixed to the horizontal arm, and a follower block slidably connected to the horizontal arm is fixed on the assembly plate.

[0017] As a further embodiment of the present invention: the pushing structure includes a guide rail fixed in the cabinet, a transverse plate slidably fitted on the guide rail, and a first cylinder rotatably installed in the cabinet. The movable end of the first cylinder is hinged to the transverse plate, and a guide arm is fixed to the bottom of the transverse plate. The guide arm is slidably connected to the assembly plate.

[0018] As a further embodiment of the present invention: the transverse plate is fixedly connected to a frame parallel to the assembly plate, the cylinder is located inside the frame, and two protrusions are formed on the cylinder. The protrusions are slidably fitted into the inner side of the frame. The suction nozzle is also fixedly connected to a "U"-shaped component, which is slidably connected to the outer side of the frame.

[0019] A surface mount method, using the aforementioned surface mount machine, includes the following steps:

[0020] Step 1: The negative pressure pipeline draws the components from the feeding module through the suction nozzle;

[0021] Step 2: The power mechanism operates, driving the assembly board to move above the PCB pads. Then, the position of the suction nozzle along the length of the assembly board is adjusted so that the components correspond to the placement positions on the PCB pads.

[0022] Step 3: The power mechanism drives the assembly plate to move down. After the component reaches the placement position, the conduction structure is triggered, the negative pressure in the negative pressure pipeline is released, and the suction nozzle loses its suction force on the component.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] This application sets up a cylinder with multiple limiting grooves of different lengths on the cylinder. The negative pressure pipeline drives the convex to rotate, thereby positioning the convex. Specifically, according to the model of the component picked up by the nozzle, the convex is aligned with the limiting groove of appropriate length before the component is released. In particular, when the component is released, the bottom of the limiting groove limits the convex, thereby achieving precise control over the downward movement of the nozzle.

[0025] Furthermore, after the protrusion moves down to the end of the limiting groove, the first and second guide grooves gradually overlap due to the relative sliding between the first and second tubes, and the overlap gradually increases. As a result, external air slowly enters the negative pressure pipeline, which gradually reduces the suction force of the nozzle on the component. This avoids the problem of the component being suddenly released due to the instantaneous cutoff of the vacuum source, which would cause unstable component release and displacement. At the same time, this method of releasing components does not require the introduction of compressed gas, avoiding the component displacement problem caused by the impact of compressed gas on the component, improving the stability of the component release process, preventing component displacement, and affecting the placement effect. Attached Figure Description

[0026] Figure 1 A schematic diagram of one embodiment of a pick-and-place machine for positioning and preventing misalignment.

[0027] Figure 2 A schematic diagram of another aspect of a placement machine for positioning and preventing offset.

[0028] Figure 3 A schematic diagram of another angle of one embodiment of a pick-and-place machine for positioning and preventing offset.

[0029] Figure 4 A schematic diagram of the internal structure of the cabinet in one embodiment of a chip mounter designed to prevent misalignment.

[0030] Figure 5 for Figure 4 A structural diagram from another angle.

[0031] Figure 6 for Figure 4 A schematic diagram of the structure at point A in the middle.

[0032] Figure 7 for Figure 5 A schematic diagram of the structure at point B.

[0033] Figure 8 A schematic diagram of the power mechanism in one embodiment of a pick-and-place machine designed to prevent misalignment during positioning.

[0034] Figure 9 A schematic diagram of the power mechanism from another angle in one embodiment of a pick-and-place machine designed to prevent misalignment during positioning.

[0035] Figure 10 An exploded view of the power mechanism in one embodiment of a pick-and-place machine designed to prevent misalignment.

[0036] Figure 11 An exploded view of the negative pressure pipeline structure in one embodiment of a chip mounter designed to prevent misalignment.

[0037] Figure 12 A schematic diagram of the structure of a cylinder in one embodiment of a pick-and-place machine for positioning and preventing misalignment.

[0038] In the diagram: 1. Cabinet; 2. Feeding module; 3. Suction nozzle; 4. First fitting; 401. Strip protrusion; 402. First guide groove; 403. Through port; 5. Second fitting; 501. Strip groove; 502. Second guide groove; 6. Kit; 7. Assembly plate; 701. First protruding block; 8. Movable seat; 9. Motor; 10. "U" shaped part; 11. Guide rail; 12. Horizontal sliding plate; 13. Frame; 14. Cylinder; 1401. Arc groove; 1402. Limiting groove; 1403. Protrusion; 15. Guide arm; 16. First cylinder; 17. Second cylinder; 18. Horizontal arm; 19. Vertical arm; 20. Follower block; 21. Horizontal plate; 2101. Second protruding block; 22. Slider; 23. Column; 2301. Frustum; 24. Spring; 25. Protruding column. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0041] Please see Figures 1-12 In this embodiment of the invention, a positioning and anti-offset pick-and-place machine includes a cabinet 1, a feeding module 2, and a component transfer module for transferring components from the feeding module 2 to PCB pad positions. The component transfer module includes:

[0042] The assembly plate 7 is movable inside the cabinet 1. The assembly plate 7 can be driven by two sets of power mechanisms inside the cabinet 1 to move in the horizontal or vertical direction. The assembly plate 7 is slidably provided with a movable seat 8. The bottom of the movable seat 8 is connected to a suction nozzle 3 through a negative pressure pipeline, and a conductive structure is provided on the negative pressure pipeline.

[0043] The cylinder 14 connected to the power mechanism is provided with an arc-shaped groove 1401 and multiple circumferentially distributed limiting grooves 1402 that communicate with the arc-shaped groove 1401. The multiple limiting grooves 1402 are parallel to the axial direction of the cylinder 14, and their lengths increase or decrease circumferentially. The negative pressure pipeline is provided with a protrusion 25 that cooperates with the limiting groove 1402. The negative pressure pipeline can drive the protrusion 25 to rotate circumferentially, so that the protrusion 25 can correspond to the multiple limiting grooves 1402 respectively. When the suction nozzle 3 discharges material, after the protrusion 25 reaches the bottom of the limiting groove 1402, the suction nozzle 3 and the component are stationary. The conduction structure is triggered, and the negative pressure state in the negative pressure pipeline is released, so that the suction nozzle 3 releases the component.

[0044] Furthermore, during operation, the power mechanism drives the assembly plate 7 to move horizontally, enabling the suction nozzle 3 to operate between the material pick-up position (i.e., the position corresponding to the material supply module 2) and the material release position (i.e., the position corresponding to the PCB pads). In addition, the power mechanism drives the assembly plate 7 to move vertically, and in conjunction with the switching between negative pressure and normal pressure in the negative pressure pipeline, the suction nozzle 3 can perform the functions of picking up and releasing components.

[0045] This application addresses the release process of components by the suction nozzle 3. When the suction nozzle 3, carrying the component, reaches the upper part of the discharge position, initially, the protrusion 25 is located within the arc-shaped groove 1401. The power mechanism drives the suction nozzle 3 and the component downwards. Before this, the negative pressure pipeline, according to the specifications of different components, drives the protrusion 25 to rotate circumferentially within the arc-shaped groove 1401, aligning the protrusion 25 with a suitable length of limiting groove 1402. Therefore, during the downward movement of the component by the suction nozzle 3, when the protrusion 25 reaches the bottom end of the limiting groove 1402, the limiting groove 1402... One end of the arc-shaped groove 1401 acts as a limit, keeping the nozzle 3 stationary with the component at this height. At this point, the component has reached the optimal release position. Subsequently, the conduction structure is triggered, releasing the negative pressure in the negative pressure pipeline. The suction force of the nozzle 3 on the component disappears, completing the precise release of the component. This avoids the component shifting due to the distance error before release, which could lead to poor soldering, affect the conductivity and reliability of the circuit, degrade electrical performance, and cause problems such as poor signal transmission and poor contact.

[0046] Please refer to it again. Figure 11 The negative pressure pipeline includes a first pipe fitting 4 rotatably mounted on the movable seat 8 and a second pipe fitting 5 that is sealed and slidably fitted with the first pipe fitting 4. The second pipe fitting 5 is connected to the assembly plate 7 through an elastic support structure. The movable seat 8 is equipped with a motor 9 whose output end is connected to the first pipe fitting 4. The motor 9 can drive the first pipe fitting 4 and the second pipe fitting 5 to rotate synchronously, and the movable seat 8 can be driven by a threaded assembly provided on the side of the assembly plate 7 to slide along the length direction of the assembly plate 7.

[0047] In detail, the assembly plate 7 is provided with a guide groove, and the movable seat 8 is slidably disposed in the guide groove. The threaded assembly (not labeled in the figure) includes a lead screw rotatably mounted on the side of the assembly plate 7 and a threaded sleeve sleeved on the lead screw and threadedly connected to the lead screw. The threaded sleeve is fixedly connected to the movable seat 8. The side of the assembly plate 7 is also equipped with a motor for driving the lead screw to rotate. During operation, through the threaded engagement between the lead screw and the threaded sleeve, the threaded sleeve can drive the movable seat 8 to move, thereby enabling the adjustment of the position of the suction nozzle 3.

[0048] The suction nozzle 3 is rotatably connected to the second tube 5 in a sealed manner. The protrusion 25 is fixed to the outer wall of the second tube 5. A strip-shaped protrusion 401 is formed on the outer wall of the first tube 4. A strip-shaped groove 501 is provided on the inner wall of the second tube 5. The strip-shaped groove 501 is adapted to the strip-shaped protrusion 401, and both are parallel to the axial direction of the first tube 4 and the second tube 5.

[0049] In detail, when the motor 9 drives the first pipe 4 to rotate, the first pipe 4 can drive the second pipe 5 to rotate through the strip protrusion 401 and the strip groove 501. Correspondingly, the second pipe 5 drives the protrusion 25 to deflect circumferentially in the arc groove 1401, so that the protrusion 25 corresponds with the appropriate limiting groove 1402.

[0050] Please refer to it again. Figure 7 and Figure 11 The conductive structure includes a plurality of first conductive grooves 402 and second conductive grooves 502 respectively disposed on the first pipe 4 and the second pipe 5 and distributed circumferentially. The cylinder 14 is slidably fitted with the second pipe 5. The first pipe 4 is provided with a plurality of through ports 403 circumferentially. The bottom of the movable seat 8 is fixed with a kit 6 that is slidably fitted with the first pipe 4. The plurality of through ports 403 are enclosed by the kit 6. The kit 6 is connected to a negative pressure pump (not shown in the figure) through a hose.

[0051] Please refer to it again. Figure 7 The elastic support structure includes a horizontal plate 21 disposed on the side of the assembly plate 7. Each end of the horizontal plate 21 is connected to the assembly plate 7 through a set of elastic elements. A slider 22 is slidably fitted on the side of the horizontal plate 21 facing the second tube 5. The slider 22 is rotatably connected to the second tube 5. The elastic element includes a column 23 fixed to the side of the horizontal plate 21 through a second protrusion 2101 and a spring 24 sleeved on the outer periphery of the column 23. The column 23 passes through and is fixed to the first protrusion 701 on the side of the assembly plate 7 and is slidably connected to the first protrusion 701. The two ends of the spring 24 are respectively connected to the first protrusion 701 and the second protrusion 2101.

[0052] It should be noted that a frustum 2301 is fixed at one end of the column 23 away from the second protruding block 2101. The frustum 2301 is located above the first protruding block 701 and abuts against the first protruding block 701. The purpose is to enable the horizontal plate 21 to maintain the height of the second tube 5 and the suction nozzle 3 under the support of the spring 24. At the same time, it ensures that the first guide groove 402 and the second guide groove 502 have no overlapping parts (the height of the first guide groove 402 is higher than that of the second guide groove 502). The first tube 4 and the second tube 5 can be smoothly sucked up by the suction nozzle 3 under the action of the negative pressure pump.

[0053] Once the component reaches above the PCB pad, the movable seat 8 slides on the assembly plate 7 under the drive of the threaded assembly. During this process, the slider 22 slides along the length of the horizontal plate 21 so that the component reaches directly above a specific position on the PCB pad. Subsequently, the protrusion 25 is aligned with the appropriate limiting groove 1402, the assembly plate 7 moves down, and the suction nozzle 3 gradually moves the component closer to the specific position on the PCB pad. When the component reaches the specific position on the PCB pad, the protrusion 25 reaches the limiting groove 1402. At the end away from the arc groove 1401, the protrusion 25 and the second tube 5 are stationary. As the assembly plate 7 continues to move down, the first tube 4 and the second tube 5 begin to slide relative to each other. During this process, the first protrusion 701 moves closer to the second protrusion 2101, and the spring 24 is compressed until the first guide groove 402 descends and overlaps with the second guide groove 502. Then, the internal chambers of the first tube 4 and the second tube 5 are connected to the outside, the negative pressure is released, and the suction nozzle 3 can lose its attraction to the components.

[0054] Therefore, by using multiple limiting grooves 1402 of varying lengths, the downward movement of the suction nozzle 3 can be precisely limited during material feeding. After the suction nozzle 3 moves the component down to the appropriate feeding height, the negative pressure suction state is automatically terminated by the relative sliding between the first tube 4 and the second tube 5. This feeding method can effectively avoid the component shifting due to the distance error of the component before release.

[0055] Furthermore, the release of negative pressure in the negative pressure pipeline is achieved by changing the positional relationship between the first conductive groove 402 and the second conductive groove 502. That is, when releasing the component, the first conductive groove 402 and the second conductive groove 502 gradually overlap, and the overlap gradually increases. Therefore, external air slowly enters the negative pressure pipeline, which gradually reduces the adsorption force of the nozzle 3 on the component. This avoids the problem of unstable component release and displacement caused by the sudden cut-off of the vacuum source. At the same time, this method of releasing components does not require the introduction of compressed gas, avoiding the component displacement problem caused by the impact of compressed gas on the component, improving the stability of the component release process, preventing component displacement, and affecting the placement effect.

[0056] Please refer to it again. Figure 8 , Figure 9 as well as Figure 10The power mechanism includes a pushing structure and a lifting structure disposed within the cabinet 1. The lifting structure includes a vertical arm 19 fixed within the cabinet 1, a horizontal arm 18 slidably disposed on the vertical arm 19, and a second cylinder 17 fixed within the cabinet 1. The movable end of the second cylinder 17 is fixed to the horizontal arm 18. A follower block 20 slidably connected to the horizontal arm 18 is fixed on the assembly plate 7. The pushing structure includes a guide rail 11 fixed within the cabinet 1, a transverse plate 12 slidably fitted onto the guide rail 11, and a first cylinder 16 rotatably mounted within the cabinet 1. The movable end of the first cylinder 16 is hinged to the transverse plate 12. A guide arm 15 is fixed to the bottom of the transverse plate 12, and the guide arm 15 is slidably connected to the assembly plate 7.

[0057] Furthermore, the pushing structure can drive the assembly plate 7 to move along a direction perpendicular to its own length. Correspondingly, the follower block 20 slides on the horizontal arm 18. When picking up and discharging materials, the second cylinder 17 works, which can drive the horizontal arm 18 to slide on the vertical arm 19 to adjust the height of the suction nozzle 3.

[0058] When the first cylinder 16 is working, it can drive the transverse plate 12 to slide along the guide rail 11. Correspondingly, the transverse plate 12 drives the assembly plate 7 to move along the length direction of the transverse arm 18 through the guide arm 15, so that the suction nozzle 3 can operate normally between the material taking position and the material discharging position.

[0059] Please refer to it again. Figure 6 and Figure 12 The transverse plate 12 is fixedly connected to a frame 13 parallel to the assembly plate 7. The cylinder 14 is located inside the frame 13, and two protrusions 1403 are formed on the cylinder 14. The protrusions 1403 are slidably fitted into the inner side of the frame 13. The suction nozzle 3 is also fixedly connected to a "U"-shaped piece 10, which is slidably connected to the outer side of the frame 13.

[0060] During operation, the height of the transverse plate 12 remains constant, thereby maintaining the cylinder 14 at a fixed height. When the suction nozzle 3 moves along the length of the assembly plate 7, the second tube 5 drives the cylinder 14 to slide along the length of the frame 13. The "U"-shaped part 10 is provided to prevent the suction nozzle 3 from driving the components to rotate when the first tube 4 and the second tube 5 rotate, thus avoiding the problem of deviation in the installation position of the components.

[0061] As another embodiment of the present invention, a placement method is also proposed, using the aforementioned placement machine, comprising the following steps:

[0062] Step 1: The negative pressure pipeline sucks up the components on the feeding module 2 through the suction nozzle 3;

[0063] Step 2: The power mechanism works to move the assembly board 7 above the PCB pads. Then, the position of the suction nozzle 3 along the length of the assembly board 7 is adjusted so that the components correspond to the component placement positions on the PCB pads.

[0064] Step 3: The power mechanism drives the assembly plate 7 to move down. After the component reaches the placement position, the conduction structure is triggered, the negative pressure in the negative pressure pipeline is released, and the suction nozzle 3 loses its suction force on the component.

[0065] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0066] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A positioning and anti-offset pick-and-place machine, comprising a cabinet, a feeding module, and a component transfer module for transferring components on the feeding module to PCB pad positions; Its features are, The component transfer module includes: The assembly plate is located inside the cabinet and can be driven by two sets of power mechanisms inside the cabinet to move in the horizontal or vertical direction. The assembly plate has a movable seat that slides on it. The bottom of the movable seat is connected to a suction nozzle through a negative pressure pipeline, and the negative pressure pipeline has a conductive structure. The cylinder connected to the power mechanism has an arc-shaped groove and multiple circumferentially distributed limiting grooves that communicate with the arc-shaped groove. The multiple limiting grooves are parallel to the axis of the cylinder, and their lengths increase or decrease circumferentially. The negative pressure pipeline has a protrusion that cooperates with the limiting groove. The negative pressure pipeline can drive the protrusion to rotate circumferentially, so that the protrusion can correspond to the multiple limiting grooves respectively. When the suction nozzle discharges material, after the protrusion reaches the bottom of the limiting groove, the suction nozzle and the component stop, the conduction structure is triggered, and the negative pressure state in the negative pressure pipeline is released, so that the suction nozzle releases the component.

2. The positioning and anti-offset placement machine according to claim 1, characterized in that, The negative pressure pipeline includes a first fitting rotatably mounted on the movable seat and a second fitting that is sealed and slidably fitted with the first fitting. The second fitting is connected to the assembly plate through an elastic support structure. The movable seat is equipped with a motor whose output end is connected to the first pipe. The motor can drive the first pipe and the second pipe to rotate synchronously, and the movable seat can be driven by a threaded assembly located on the side of the assembly plate to slide along the length direction of the assembly plate.

3. A positioning and anti-offset placement machine according to claim 2, characterized in that, The suction nozzle is rotatably connected to the second tube, the protrusion is fixed to the outer wall of the second tube, a strip-shaped protrusion is formed on the outer wall of the first tube, and a strip-shaped groove is provided on the inner wall of the second tube. The strip-shaped groove is adapted to the strip-shaped protrusion, and both are parallel to the axial direction of the first tube and the second tube.

4. A positioning and anti-offset placement machine according to claim 2, characterized in that, The conductive structure includes a plurality of first conductive grooves and second conductive grooves respectively disposed on the first pipe and the second pipe and distributed along the circumference, and the cylinder is slidably fitted with the second pipe; The first pipe fitting has multiple ports along its circumference. The bottom of the movable seat is fixed with a kit that is sealed and slidably fitted with the first pipe fitting. The multiple ports are enclosed by the kit, and the kit is connected to a negative pressure pump via a hose.

5. A positioning and anti-offset placement machine according to claim 2, characterized in that, The elastic support structure includes a horizontal plate disposed on the side of the assembly plate. Each end of the horizontal plate is connected to the assembly plate through a set of elastic elements. A slider is slidably fitted on the side of the horizontal plate facing the second pipe, and the slider is rotatably connected to the second pipe. The elastic element includes a column fixed to the side of the horizontal plate by a second protrusion and a spring sleeved on the outer periphery of the column. The column passes through and is fixed to the side of the assembly plate by a first protrusion and is slidably connected to the first protrusion. The two ends of the spring are respectively connected to the first protrusion and the second protrusion.

6. A positioning and anti-offset placement machine according to claim 2, characterized in that, The power mechanism includes a pushing structure and a lifting structure disposed in the cabinet. The lifting structure includes a vertical arm fixed in the cabinet, a horizontal arm slidably disposed on the vertical arm, and a second cylinder fixed in the cabinet. The movable end of the second cylinder is fixed to the horizontal arm, and a follower block slidably connected to the horizontal arm is fixed on the assembly plate.

7. A positioning and anti-offset placement machine according to claim 6, characterized in that, The pushing structure includes a guide rail fixed inside the cabinet, a transverse plate slidably fitted on the guide rail, and a first cylinder rotatably installed inside the cabinet. The movable end of the first cylinder is hinged to the transverse plate, and a guide arm is fixed to the bottom of the transverse plate. The guide arm is slidably connected to the assembly plate.

8. A positioning and anti-offset placement machine according to claim 7, characterized in that, The transverse plate is fixedly connected to a frame parallel to the assembly plate. The cylinder is located inside the frame and has two protrusions. The protrusions are slidably fitted into the inner side of the frame. The suction nozzle is also fixedly connected to a "U"-shaped component, which is slidably connected to the outer side of the frame.

9. A placement method, employing the placement machine as described in claim 1, characterized in that, Includes the following steps: Step 1: The negative pressure pipeline draws the components from the feeding module through the suction nozzle; Step 2: The power mechanism operates, driving the assembly board to move above the PCB pads. Then, the position of the suction nozzle along the length of the assembly board is adjusted so that the components correspond to the placement positions on the PCB pads. Step 3: The power mechanism drives the assembly plate to move down. After the component reaches the placement position, the conduction structure is triggered, the negative pressure in the negative pressure pipeline is released, and the suction nozzle loses its suction force on the component.

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