Calibration method and device of radio frequency integrated circuit test system

Abstract

The invention belongs to the field of integrated circuit test system calibration, and particularly discloses a calibration method and device for a radio frequency integrated circuit test system. The core parameters influencing the final test result are locked based on the mapping relation of the test system indexes, and calibration target generalization is avoided. And constructing a test model according to the transmission characteristics of the core parameters to ensure that the model accurately reflects actual circuit behaviors. Then various working conditions are simulated through the model, a corresponding relation between excitation and response is generated and packaged into a parameter equivalent model, and complex physical characteristics are converted into reproducible data standards. And calling the equivalent model in real time in a calibration stage, matching the input with the model library, and reproducing a calibration reference required by each current core parameter. And finally, the test system is calibrated by using the self-generated reference covering all working conditions, so that the problem of system misalignment caused by insufficient metering capacity and narrow calibration coverage is fundamentally solved, and the accuracy and reliability of a test result are remarkably improved.

Description

Technical Field

[0001] This application belongs to the field of integrated circuit test system calibration technology, and more specifically, relates to a calibration method and apparatus for a radio frequency integrated circuit test system. Background Technology

[0002] Radio frequency (RF) integrated circuits are analog circuits operating at higher frequencies, including microwave and millimeter-wave circuits, and are widely used in both military and civilian fields. With the continuous development of integrated circuit technology, RF chips today generally integrate digital, analog, and RF components, possessing characteristics such as high integration, high frequency, and high sensitivity. Therefore, the performance requirements for RF integrated circuit testing systems, which are crucial testing equipment for ensuring the accuracy and reliability of RF chip performance parameters, have also greatly increased.

[0003] However, current RF integrated circuit testing systems face multi-layered challenges in the metrological assurance system for RF integrated circuits. These problems, stemming from the surface, collectively restrict the high-level development of the industry. Specifically, the metrological capabilities of existing RF integrated circuit testing systems cannot fully cover the increasing number of key parameters, resulting in incomplete and inaccurate chip performance evaluation, becoming an initial bottleneck in product quality control. Secondly, the existing RF integrated circuit parameter traceability system is also incomplete, lacking unified metrological standards as support. This creates breaks in the value transfer chain from chip design and manufacturing to testing and acceptance, making it difficult to fundamentally guarantee the accuracy and comparability of test results. This also means that existing calibration methods cannot meet the on-site metrological requirements.

[0004] Therefore, there is an urgent need to propose a new calibration method for radio frequency integrated circuit testing systems to support the high-quality development of radio frequency chips and ensure the stability and reliability of the technical and tactical indicators of weapons and equipment. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a calibration method and apparatus for a radio frequency integrated circuit test system, which aims to solve the problem of poor test results caused by inaccurate metrological capabilities and insufficient calibration coverage in current radio frequency integrated circuit test systems.

[0006] To achieve the above objectives, in a first aspect, this application provides a calibration method for a radio frequency integrated circuit (RF integrated circuit) test system, comprising: selecting multiple core parameter indicators of RF integrated circuits based on a first mapping relationship set between RF integrated circuit indicators and test system indicators; constructing test models for multiple parameter indicators based on the transmission paths and parameter characteristics of the multiple core parameter indicators of RF integrated circuits; simulating the operating conditions of RF integrated circuits and generating a second mapping relationship set of excitation responses based on each test model, and generating a parameter equivalent model based on the second mapping relationship set; during test system operation, calling the parameter equivalent model to match the input excitation signal and reproducing the standard parameters corresponding to the core parameter indicators; and calibrating the RF integrated circuit test system based on each standard parameter.

[0007] In one embodiment, based on a first mapping relationship set between RF integrated circuit indicators and test system indicators, multiple core parameter indicators of RF integrated circuits are screened. Prior to this, the method further includes: obtaining a first set consisting of multiple key performance indicators of the RF integrated circuits and a second set consisting of multiple measurable parameter indicators of the test system, wherein the key performance indicators are used to evaluate the performance of the RF integrated circuits, and the measurable parameter indicators are defined by the physical measurement capabilities of the test system equipment; matching the multiple key performance indicators in the first set with one or more measurable parameter indicators in the second set that can quantify the key performance indicators, generating a matching result; and generating a first mapping relationship set between RF integrated circuit indicators and test system indicators based on the matching result.

[0008] In one embodiment, based on a first mapping relationship set between RF integrated circuit indicators and test system indicators, multiple core parameter indicators of RF integrated circuits are screened, including: scoring based on the number of RF integrated circuit types that each core parameter indicator can represent, and obtaining a first scoring result; scoring based on the frequency of each core parameter indicator appearing in multiple preset industry standard texts, and obtaining a second scoring result; and screening multiple core parameter indicators of RF integrated circuits from the first mapping relationship set based on the first scoring result and the second scoring result.

[0009] In one embodiment, the core parameters of multiple radio frequency integrated circuits include: power, noise figure, 1dB compression point, and error vector amplitude.

[0010] In one embodiment, when the core parameter is power, the method includes: constructing a simulated power path based on power transmission and reception characteristics, and performing transmission and reception tests based on the simulated power path to obtain power test results; calibrating the simulated power path based on the power test results, and constructing a power test model based on the calibrated simulated power path; inputting multiple test excitation signals covering the power operating range based on the power test model, recording the response signals corresponding to each excitation signal to form a second mapping relationship of power parameters, and adjusting the model parameters based on the second mapping relationship to match the standard power operating conditions to generate an equivalent power parameter model; when testing the RF integrated circuit, calling the equivalent power parameter model, receiving the RF excitation signals input by the test system, and generating a simulated power response signal as a standard value of the power parameters.

[0011] In one embodiment, when the core parameter is noise figure, the method includes: constructing a noise figure parameter test model based on the cold source method, according to the gain parameter acquisition path and the power of the output signal; for the noise figure parameter test model, inputting multiple test excitation signals to cover the noise figure operating range, recording the response signal corresponding to each excitation signal to form a second mapping relationship of the noise figure parameters, and adjusting the model parameters based on the second mapping relationship to match the standard noise figure operating conditions to generate an equivalent noise figure parameter model; when testing the RF integrated circuit, calling the equivalent noise figure parameter model, receiving the RF excitation signal input by the test system, and generating a simulated noise figure response signal as the standard value of the noise figure parameter.

[0012] In one embodiment, when the core parameter is a 1dB compression point, the method includes: increasing the input power of the test system by a preset step size, and constructing a 1dB compression point parameter test model based on the output power value; for the 1dB compression point parameter test model, inputting multiple test excitation signals covering the compression point operating range, recording the response signal corresponding to each excitation signal to form a second mapping relationship set for the 1dB compression point parameters, and adjusting the model parameters based on the second mapping relationship set to make the excitation response relationship match the standard compression point operating condition, generating an equivalent model of the 1dB compression point parameters; when testing the RF integrated circuit, calling the equivalent model of the 1dB compression point parameters, receiving the dynamic RF excitation signal input by the test system, and generating a simulated compression point response signal as the standard value of the 1dB compression point parameters.

[0013] In one embodiment, when the core parameter is the error vector amplitude, the method includes: constructing an error vector amplitude parameter test model based on a comparison test of the I and Q baseband signals with the input and output of the test system; for the error vector amplitude parameter test model, inputting multiple test excitation signals covering the error vector amplitude operating range, recording the response signal corresponding to each excitation signal to form a second mapping relationship set for the error vector amplitude parameter, and adjusting the model parameters based on the second mapping relationship set to match the standard error vector amplitude operating condition, generating an equivalent model for the error vector amplitude parameter; when testing the RF integrated circuit, calling the equivalent model for the error vector amplitude parameter, receiving the baseband excitation signal input from the test system, and generating a simulated error vector amplitude response signal as the standard value of the error vector amplitude parameter.

[0014] In one embodiment, calibrating the RF integrated circuit test system based on various standard parameters further includes: acquiring the actual parameters of the core parameter indicators of the RF integrated circuit test system; determining that the test system is inaccurate when the error value between the actual parameters and the standard parameters exceeds a preset error range; and adjusting the test system based on the path corresponding to the standard parameters when the test system is determined to be inaccurate.

[0015] Secondly, this application provides a calibration device for a test system of radio frequency integrated circuits, comprising: a parameter screening module for screening multiple core parameter indicators of radio frequency integrated circuits based on a first mapping relationship set between radio frequency integrated circuit indicators and test system indicators; a test model building module for building test models of multiple parameter indicators based on the transmission paths and parameter characteristics of the multiple core parameter indicators of radio frequency integrated circuits; an equivalent model generation module for simulating the operating conditions of radio frequency integrated circuits and generating a second mapping relationship set of excitation responses based on each test model, and generating a parameter equivalent model based on the second mapping relationship set; a parameter reproduction module for calling the parameter equivalent model to match the input excitation signal during test system operation, and reproducing the standard parameters corresponding to the core parameter indicators; and a calibration module for calibrating the radio frequency integrated circuit test system based on each standard parameter.

[0016] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0017] Overall, the technical solutions conceived in this application have the following beneficial effects compared with the prior art: This application employs a technique based on a first mapping relationship set between RF integrated circuit indicators and test system indicators to screen core parameter indicators, thus solving the problem of unclear calibration targets caused by the large number of parameters in existing technologies, achieving precise focus on key parameters. Based on this, by building test models according to the transmission paths and parameter characteristics of the core parameter indicators, it solves the problem of inaccurate modeling caused by traditional models ignoring actual transmission characteristics, providing a reliable foundation for subsequent calibration. Next, based on each test model simulating operating conditions and generating a second mapping relationship set of excitation responses, a parameter equivalent model is generated, solving the problem of insufficient operating condition simulation caused by inadequate calibration coverage and expanding the applicable scenarios for calibration. During test system operation, the input excitation signal is dynamically matched by calling the parameter equivalent model to reproduce the standard parameters corresponding to the core parameter indicators, solving the problem of accuracy degradation caused by signal mismatch in real-time calibration and ensuring the stability of the testing process. Finally, the test system is calibrated based on these standard parameters, completely solving the root causes of insufficient system metrological capability and poor calibration coverage. Attached Figure Description

[0018] Figure 1 This is one of the flowcharts illustrating an embodiment of the calibration method for the radio frequency integrated circuit test system provided in this application; Figure 2 This is a schematic diagram of the radio frequency integrated circuit index screening provided in the method embodiment of this application; Figure 3 This is a second schematic flowchart of an embodiment of the calibration method for the RF integrated circuit test system provided in this application; Figure 4 This is a schematic diagram of the parameter equivalent model construction path of the test system provided in the method embodiment of this application; Figure 5 This is the third flowchart illustrating an embodiment of the calibration method for the RF integrated circuit test system provided in this application; Figure 6 This is a schematic diagram of the power reception test principle provided in the embodiments of the method of this application; Figure 7 This is a schematic diagram of the power emission test principle provided in the embodiments of the method of this application; Figure 8 This is a schematic diagram of the radio frequency integrated circuit provided in the method embodiment of this application; Figure 9 This is a schematic diagram illustrating the calibration and reproduction principle of the test system provided in the embodiments of the method of this application; Figure 10 This is a schematic diagram of a parameter equivalent model provided in the method embodiment of this application; Figure 11 This is a schematic diagram of the noise figure testing principle provided in the embodiments of the method of this application; Figure 12 This is a schematic diagram of the gain as a function of input or output power provided in the embodiments of the method of this application; Figure 13 This is a schematic diagram of the 1dB compression point test principle provided in the embodiment of the method of this application; Figure 14 This is a schematic diagram illustrating the testing principle of the error vector amplitude parameter provided in the embodiments of the present application; Figure 15 This is another structural schematic diagram of the parameter equivalent model provided in the method embodiment of this application; Figure 16 This is a schematic diagram of the structure of an embodiment of the calibration device for the radio frequency integrated circuit test system provided in this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] In this article, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The symbol " / " in this article indicates that the related objects are in an "or" relationship; for example, A / B means A or B.

[0021] The terms "first" and "second," etc., used in the specification and claims herein are used to distinguish different objects, not to describe a specific order of objects. For example, "first response message" and "second response message," etc., are used to distinguish different response messages, not to describe a specific order of response messages.

[0022] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0023] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more, for example, multiple processing units means two or more processing units, multiple elements means two or more elements, etc.

[0024] The current RF integrated circuit testing system faces multi-layered challenges in the metrological assurance system of RF integrated circuits. These problems, from the superficial to the fundamental, collectively restrict the high-level development of the industry.

[0025] Based on this, this application proposes a calibration method for an RF integrated circuit test system. Please refer to [the relevant documentation]. Figure 1 , Figure 1 This is a schematic flowchart illustrating an embodiment of the calibration method for the radio frequency integrated circuit test system provided in this application. In this embodiment, the calibration method includes steps S10 to S50.

[0026] Step S10: Based on the first mapping relationship set between RF integrated circuit indicators and test system indicators, select the core parameter indicators of multiple RF integrated circuits.

[0027] It should be noted that an RF integrated circuit test system is a professional test platform designed to meet the performance testing needs of RF integrated circuits. Its core functionality lies in integrating RF, digital, and source measurement test resources to achieve automated, high-precision testing of multiple parameters of RF integrated circuits. Examples include the V93000, Ultra Flex, T2000, and ASL3000. Test system specifications refer to the capabilities or standards of the system used to test the performance of RF integrated circuits, such as which parameters it can measure, and its testing accuracy and range.

[0028] It should be noted that the performance specifications of radio frequency (RF) integrated circuits are typically defined by the key parameters of each module within the circuit and the overall circuit performance, such as the relevant parameters of amplifiers, filters, and mixers. Therefore, RF integrated circuit specifications refer to the various standards or parameters that RF integrated circuits must meet in their design and performance, such as frequency response, gain, and noise figure.

[0029] It should be noted that the core of the first mapping relationship set lies in the mapping relationship itself. This mapping relationship refers to the correspondence between various indicators of the RF integrated circuit and various indicators that the test system can measure or evaluate. For example, the output power of the RF integrated circuit corresponds to a parameter in the test system that can accurately measure the power level. Therefore, this first mapping relationship set needs to be obtained before step S10.

[0030] In one feasible implementation, please refer to Figure 2 Before step S10, the following are included: First, it is necessary to obtain a first set consisting of multiple key performance indicators of the RF integrated circuit, and a second set consisting of multiple measurable parameters of the test system.

[0031] It should be noted that key performance indicators (KPIs) are used to evaluate the performance of radio frequency (RF) integrated circuits. These include RF RF integrated circuit frequency response characteristics and noise figure, which reflect the performance of the integrated circuit from different perspectives. These measurable parameters are defined by the physical measurement capabilities of the test system equipment. In other words, the set of parameters that the test system can actually measure and record, based on its hardware configuration, technical level, and measurement accuracy, constitutes this set. Examples include the frequency range and power measurement accuracy that the test system can measure.

[0032] It is important to note that, due to the varying testing capabilities of different test systems, the metrics listed in the second set need to be as comprehensive as possible. A comprehensive list of metrics means covering the parameters that the test system can measure at different testing capability levels. The purpose of this is to more accurately identify the correspondence between RF integrated circuit metrics and test system metrics when establishing a mapping relationship, thereby selecting the core parameter metrics that meet the actual testing conditions.

[0033] Understandably, given the existence of different testing systems, comprehensive metrics enable the subsequent development of test plans to adapt to a wider range of testing systems, improving the applicability and flexibility of the test plans. For example, when dealing with different customers using different testing systems, a comprehensive list of metrics makes it easier to adjust and adapt test calibration plans.

[0034] Secondly, multiple key performance indicators in the first set are matched with one or more measurable parameter indicators in the second set that can quantify the key performance indicators, and a matching result is generated.

[0035] Understandably, for each key performance indicator in the first set, one or more measurable parameters in the second set must be found to quantify it. For example, suppose a key performance indicator in the first set is the output power of an RF integrated circuit. In the second set, there might be a measurable parameter, such as a power measurement value, which can directly quantify the output power. Alternatively, the performance of the output power at different frequency bands may require matching multiple measurable parameters in the second set, such as the frequency band power measurement parameter for the corresponding frequency band, for more detailed quantification.

[0036] Finally, based on the matching results, a first mapping relationship set between RF integrated circuit indicators and test system indicators is generated.

[0037] Understandably, this matching result reflects the correspondence between the key performance indicators of RF integrated circuits and the measurable parameters of the test system. The matching result may be presented in a table, list, or other form, clearly showing which key performance indicators correspond to which measurable parameters, i.e., the first mapping relationship set, providing an important basis for subsequent work such as selecting core parameter indicators based on the mapping relationship.

[0038] Understandably, core parameters refer to those that are most critical or decisive in evaluating the performance of radio frequency (RF) integrated circuits. Selecting multiple core parameters for RF integrated circuits means choosing the most important or relevant few from all possible parameters. Specifically, please refer to... Figure 3 Step S10 includes steps S11 to S13.

[0039] Step S11: Based on the first mapping relationship set, score according to the number of radio frequency integrated circuit types that each core parameter index can represent, and obtain the first score result.

[0040] Understandably, the scoring is based on the number of RF integrated circuit types that each core parameter can represent. Different core parameters have different characterizing capabilities for different types of RF integrated circuits. For example, some core parameters may only be applicable to one specific type of RF integrated circuit, while others may be meaningful for multiple types of RF integrated circuits. The more types of RF integrated circuits a core parameter can represent, the higher its versatility and importance are likely to be.

[0041] Understandably, by evaluating each core parameter indicator according to the above scoring criteria, a final score is obtained. This score quantitatively reflects the value of each core parameter indicator in characterizing the type of radio frequency integrated circuit. For example, the score may be presented as a score, with one core parameter indicator receiving a higher score because it can characterize multiple types of radio frequency integrated circuits, while another core parameter indicator that can only characterize a few types or a single type of radio frequency integrated circuit receives a lower score.

[0042] Step S12: Based on the first mapping relationship set, score each core parameter indicator according to the frequency of its appearance in multiple preset industry standard texts, and obtain the second scoring result.

[0043] Understandably, the scoring is based on the frequency with which each core parameter appears in multiple pre-defined industry standard texts. Different industry standard texts have different regulations and emphases regarding the performance requirements and testing methods of RF integrated circuits. The higher the frequency of a core parameter in the industry standard texts, the greater the attention and importance given to that parameter within the industry, and the more crucial its role may be in the quality and performance evaluation of RF integrated circuits. For example, certain RF integrated circuit performance indicators related to communication security may appear frequently in multiple communication industry standard texts.

[0044] Understandably, the second scoring result is obtained by statistically analyzing the frequency of each core parameter indicator in multiple pre-defined industry standard texts and assigning scores accordingly. This scoring result quantitatively reflects the importance of each core parameter indicator within the industry standards. For example, core parameter indicators with high frequency of occurrence receive higher scores, while those with low frequency of occurrence receive lower scores.

[0045] Step S13: Based on the first and second scoring results, select the core parameter indicators of multiple radio frequency integrated circuits from the first mapping relationship set.

[0046] It should be noted that combining these two scoring results allows for a more comprehensive and objective assessment of the value and importance of core parameters. Multiple core parameters for RF integrated circuits are selected from the first mapping relationship set. By comprehensively considering the two scoring results, core parameters that are both highly versatile (capable of characterizing various types of RF integrated circuits) and widely valued within the industry (frequently appearing in industry standard texts) can be identified. These selected core parameters will serve as the focus of subsequent testing, helping to improve testing efficiency, ensure the accuracy and reliability of test results, and allow testing and calibration work to focus on the most critical aspects of RF integrated circuit performance evaluation.

[0047] Specifically, the key performance indicators of typical RF integrated circuits are analyzed and compared with the testing capabilities and parameters of RF integrated circuit test systems. In the intersection of the key performance indicator parameters of typical RF integrated circuits and the test parameters of RF integrated circuit test systems, core parameter indicators of RF integrated circuits with broad coverage and strong typicality are established, including: power, noise figure, 1dB compression point and error vector amplitude.

[0048] Power reflects the signal strength. The noise figure measures the amount of noise introduced by the RF integrated circuit during signal transmission. The 1dB compression point represents the input power point where the output power drops by 1dB compared to the ideal linear case; it reflects the RF integrated circuit's ability to process large signals. The error vector amplitude is a parameter used to evaluate the quality of digitally modulated signals.

[0049] Step S20: Based on the transmission path and parameter characteristics of multiple core parameter indicators of the radio frequency integrated circuit, a test model for multiple parameter indicators is built.

[0050] Understandably, please refer to Figure 4 Based on the transmission path and parameter characteristics of core parameter indicators, building a test model involves analyzing the test principle of RF integrated circuit parameters, sorting out the resource boards and test logic called by the test system during testing, and building a test model based on the resource boards and test logic.

[0051] Understandably, core parameters such as power, noise figure, 1dB compression point, and error vector amplitude, as mentioned earlier, have specific transmission paths in RF integrated circuits. For example, power is amplified from the input port and then transmitted from the output port. Furthermore, each parameter has unique characteristics, such as the randomness of the noise figure and the nonlinear relationship between the 1dB compression point and signal power. Analyzing these transmission paths and parameter characteristics is essentially a deep dive into the testing principles of RF integrated circuit parameters.

[0052] It should be noted that by analyzing the testing principles, the resource boards and testing logic invoked by the testing system during testing are further clarified. Resource boards are the hardware modules in the testing system that specifically perform functions such as measurement and signal generation, such as signal generator boards for generating radio frequency signals and power meter boards for measuring power. Testing logic refers to the order and rules by which the testing system controls and operates these resource boards to complete the testing of core parameters, such as the logical flow of first setting signal input, then measuring parameters and processing data.

[0053] Understandably, a test model is built based on the identified resource boards and test logic. A test model is an abstraction and simulation of the actual testing process, presenting the functions of the resource boards and the test logic in a structured manner. For example, the test model can clearly show how the signal generator board connects to the input port of the RF integrated circuit, how the power meter board connects to the output port, and how the test system controls these boards to perform test operations according to a specific logical sequence. This provides guidance and a framework for subsequent actual testing, ensuring that the testing work can be carried out in an orderly and accurate manner.

[0054] Step S30: Based on each test model, simulate the operating conditions of the RF integrated circuit and generate a second mapping relationship set of excitation response, and generate a parameter equivalent model based on the second mapping relationship set.

[0055] Understandably, please refer to Figure 4By simulating actual tests using a structured test model, a second mapping relationship set consisting of the correspondence between excitation and response under different working conditions is obtained, and a parameter equivalent model is generated. This also requires resource boards and test logic to implement.

[0056] It's important to note that this simulation addresses the impact of different input signal frequencies and powers, as well as varying environmental factors such as temperature and humidity, on the performance of the radio frequency (RF) integrated circuit (IC). This approach provides a comprehensive understanding of the RF IC's performance under diverse real-world scenarios. Under simulated operating conditions, different excitation signals are applied to the RF IC, and its responses are recorded. The excitations and corresponding responses under different operating conditions are then organized and summarized to form a second mapping set. This mapping set is presented in data or graphical form, clearly demonstrating the correspondence between excitation and response. For example, it might list the output power response values ​​for different input frequency excitations in tabular form.

[0057] Understandably, in-depth analysis and processing of the data in the second mapping relationship set are necessary to extract key feature parameters and patterns. Mathematical methods and modeling techniques are then used to construct a parametric equivalent model based on these feature parameters and patterns. This model can be a mathematical formula, a circuit model, or an algorithm that simulates the response behavior of RF integrated circuits under different stimuli, facilitating subsequent prediction, optimization, and design. For example, by analyzing the output noise response under different input powers, a mathematical model describing the relationship between input and output noise can be constructed.

[0058] Step S40: During the test system operation, the parameter equivalent model is called to match the input excitation signal and reproduce the standard parameters corresponding to the core parameter indicators.

[0059] It should be noted that after the test system starts running, it first generates input excitation signals according to the preset test plan. These excitation signals simulate various input conditions that RF integrated circuits may encounter in actual operation, such as RF signals of different frequencies, amplitudes, and phases, to comprehensively test the performance of the integrated circuit. After the input excitation signals are generated, the calibration device automatically calls the pre-built parameter equivalent model. This model is based on previous steps such as RF integrated circuit operating condition simulation and excitation response mapping analysis, and includes the intrinsic relationship between the core parameters of the RF integrated circuit and the input excitation.

[0060] Understandably, when the generated input excitation signal is input into the parametric equivalent model, the model will perform matching analysis on the input excitation signal based on its internal algorithm and mapping relationships. It will identify the characteristic parameters of the input signal, such as frequency and power, and compare them with various excitation conditions stored in the model.

[0061] Understandably, after matching analysis, the parametric equivalent model will reproduce the standard parameters corresponding to the core parameter indicators based on the characteristics of the input excitation signal. For example, if the input is a radio frequency signal with a specific frequency and power, the model will output the standard values ​​corresponding to the core parameter indicators of the radio frequency integrated circuit under that excitation, such as power, noise figure, 1dB compression point, and error vector amplitude.

[0062] Step S50: Calibrate the RF integrated circuit test system based on the standard parameters.

[0063] It is understandable that the measurement accuracy of RF integrated circuit test systems will gradually decrease during long-term use due to environmental factors, hardware aging, and minor deviations in software algorithms. This may lead to discrepancies between test results and actual values, affecting the accurate assessment of RF integrated circuit performance. Calibrating the test system based on various standard parameters can eliminate these errors, ensuring the accuracy and reliability of the test system, thereby providing a solid guarantee for the quality control of RF integrated circuits.

[0064] Specifically, you can refer to Figure 5 Step S50 includes steps S51 to S53.

[0065] Step S51: Collect the actual parameters of the core parameters of the RF integrated circuit test system.

[0066] Understandably, appropriate measuring instruments and software modules should be selected from the testing system for data acquisition. For example, a power meter should be used to measure power parameters, and a spectrum analyzer should be used to obtain noise figure information. Simultaneously, the environmental conditions for data acquisition and the parameters of the input excitation signal must be set according to the testing requirements to ensure that the acquisition is conducted under stable and controllable conditions. Finally, the testing system should be started, and the core parameter indicators should be measured and the results recorded according to the preset procedures and parameter settings.

[0067] Step S52: When the error between the actual parameters and the standard parameters exceeds the preset error range, the test system is deemed to be inaccurate.

[0068] Understandably, an allowable error range for each core parameter is pre-set based on industry standards and testing requirements. This range needs to comprehensively consider factors such as testing accuracy requirements and application scenarios. Then, the calculated error value is compared with the preset error range. If the error value of one or more core parameters exceeds the preset range, the testing system is considered inaccurate.

[0069] Step S53: When it is determined that the test system is inaccurate, adjust the test system based on the path corresponding to the standard parameters.

[0070] Understandably, the first step is to analyze the differences between actual and standard parameters to identify potential causes of inaccurate test system readings, such as hardware malfunctions or software algorithm issues (incorrect parameter settings, algorithm defects, etc.). Next, based on the path corresponding to the standard parameters, identify the parts of the test system that need adjustment. For example, large power parameter errors may require adjusting the gain of the power measurement module or calibrating the power meter; inaccurate noise figure measurements may require checking the spectrum analyzer settings or optimizing the relevant software algorithm. Then, adjust the test system step by step according to the determined adjustment path. After each adjustment, collect parameters again, assess the error, and observe the adjustment effect. Finally, after a series of adjustments, collect actual parameters again and compare them with standard parameters to verify whether the adjustment has brought the error value back to the preset range. If not, continue to analyze the causes and make further adjustments.

[0071] This application solves the problem of target generalization in the calibration process by using a first mapping relationship set based on RF integrated circuit indicators and test system indicators to screen core parameter indicators. By establishing this mapping relationship, the core parameters that have the greatest impact on the final RF indicators and are most susceptible to the performance fluctuations of the test system are accurately identified, thereby focusing limited calibration resources on key control points and laying the foundation for subsequent accurate modeling.

[0072] This application builds a test model based on the transmission path and parameter characteristics of these core parameters. This step involves analyzing the selected discrete parameters within a specific circuit structure and working mechanism, clarifying the causal relationship and mutual influence of the parameters in the system link. This ensures that the established test model is no longer an isolated mathematical approximation, but reflects the physical reality of the causal link, thus guaranteeing the effectiveness of the model.

[0073] This application generates a second set of mapping relationships based on the simulated operating conditions of each test model to generate a parameter equivalent model. This step is to encapsulate the validity of the above physical model in a data-driven manner. By simulating the excitation and response under various extreme and typical operating conditions, the complex physical characteristics are transformed into input-output data pairs that the system can directly identify and call, i.e., parameter equivalent models. In this way, the deep circuit characteristics that are difficult to measure directly by the test system are transformed into a characterization quantity that can be reproduced by standard signal excitation.

[0074] During system operation, this application calls the equivalent model of the parameters to match the input excitation signal to reproduce the standard parameters. The logic lies in using the established equivalent model as a reference source. By matching real-time excitation with the model library, it dynamically and backward calculates the distortion-free standard values ​​of the core parameters that should exist under the current system state, effectively compensating for errors introduced by system hardware drift, environmental interference, and other factors. Finally, the test system is calibrated based on these real-time reproduced standard parameters, which serve as accurate references. This transforms the calibration process from a static calibration relying on a single external standard to a dynamic closed-loop feedback based on an internal model chain and real-time data matching. This fundamentally solves the overall inaccuracy problem caused by insufficient metrological capabilities and limited calibration coverage, achieving a significant improvement in test accuracy and reliability.

[0075] In one feasible implementation, when the core parameter is power, please refer to... Figure 6 and Figure 7 For power reception, the RF integrated circuit test system inputs an excitation signal to the chip. The excitation signal is then processed by the chip's logic functions and finally becomes an RF signal output. The RF board then receives the RF signal emitted by the chip and uses the signal source output signal in the RF board to down-convert the RF signal from analog to intermediate frequency (IF) and perform digital processing. Finally, it uses digital down-conversion to convert it into a baseband signal to measure its power. For power transmission, the AWG in the analog board first generates a baseband signal and up-converts it into an RF signal via the RF board. This signal is then sent to the RF signal receiving port of the chip under test through the front-end board path.

[0076] Understandably, a simulated power path is built based on the aforementioned power transmission and reception characteristics, and transmission and reception tests are performed based on this simulated power path to obtain power test results. The specific process is as follows: configure the RF chip pins and channels; set the power signal transmission magnitude; read the power signal magnitude of the specified channel; compare it with the set threshold; if the threshold requirement is met, the test is qualified; otherwise, it is unqualified. The corresponding test model for the RF integrated circuit test system at the test port is as follows: Figure 8 As shown, the following steps are the same. Specifically, the simulated power path can be calibrated based on the power test results, and a power test model can be constructed based on the calibrated simulated power path.

[0077] It should be noted that, based on the power test model, multiple test excitation signals covering the power operating range are input, and the response signals corresponding to each excitation signal are recorded to form a second mapping relationship of power parameters. The model parameters are then adjusted based on this second mapping relationship to match the standard power operating condition, generating an equivalent power parameter model. During the testing of the RF integrated circuit, the equivalent power parameter model is invoked, the RF excitation signals input by the test system are received, and a simulated power response signal is generated as the standard value of the power parameters.

[0078] Understandably, by controlling the output of the equivalent model of the control parameters, the power signal is transmitted to the test port of the RF integrated circuit test system through the test signal adapter board and test fixture, and the obtained test result is compared with the standard value of the power parameter; by controlling the output of the RF integrated circuit test system within the technical specification range, the power signal is transmitted to the power parameter standard through the test signal adapter board and test fixture for testing, and the measured result is compared with the set value of the RF integrated circuit test system. The schematic diagram of the principle is shown below. Figure 9 As shown, the following is the same.

[0079] It is understandable that the main functions of the RF power parameter equivalent model are twofold: first, to emit an RF signal of a specified power; and second, to measure the RF signal emitted by the RF integrated circuit test system. Therefore, a model such as... Figure 10 The hardware framework implementation.

[0080] It should be noted that, Figure 10 The hardware system architecture is centered around an FPGA control unit. Viewed from left to right, the dedicated interface serves as both the input and output endpoints of signals. The outputs of the dedicated interface connect to the inputs of the power measurement module, and the inputs connect to the outputs of the power output module. The outputs of the power measurement module connect to the FPGA control unit. Simultaneously, the FPGA control unit sends control commands to the power output module, thus forming a possible closed-loop control system. Finally, on the right side of the system, the FPGA control unit is connected to the human-machine interface unit via bidirectional arrows. This ensures that users can both issue commands through this interface and monitor the system's status and measurement results in real time.

[0081] It should be noted that the parameter equivalent model also needs to be matched; therefore, when building based on the aforementioned content, the corresponding algorithm is also required. The specific reproduction process is as follows: For transmission, configure the frequency and power parameters for generating the RF signal; transmit the RF signal; wait for the RF signal at the test channel of the RF integrated circuit test system; compare the test results with the set signal to obtain the verification result. For reception, configure the frequency and power parameters of the test system; the test system transmits the signal; wait for the parameter equivalent model to test the RF signal; compare the test results with the set signal to obtain the verification result.

[0082] In one feasible implementation, when the core parameter is the noise figure, the noise figure describes the degree to which the signal-to-noise ratio decreases as the signal passes through the system, and its measurement method varies depending on the application. Figure 2It is known that some applications have high gain and low noise figure (low-noise amplifiers (LNAs) in high-gain mode), some have low gain and high noise figure (mixers and LNAs in low-gain mode), and some have very high gain and a wide range of noise figures (receiver systems). Therefore, the measurement method must be selected according to different application scenarios. Typically, the noise figure of RF integrated circuits is measured using the Y-factor method and the cold source method.

[0083] The Y-factor method requires a noise source consisting of freely switchable diodes. When the diodes are reverse biased, they generate electrical noise exceeding that produced at room temperature under load; this additional noise is called the over-noise ratio (ONR). Using this noise source, test results can be obtained with the noise source off and on twice. Combined with the known ONR, the amplifier's gain and noise figure can be calculated. The cold source method refers to a device whose output is always at room temperature. The measured noise consists of the amplified input noise and the noise added by the device under test. If the system gain is precisely known, the noise generated by the device can be calculated, thus determining the noise figure.

[0084] For RF integrated circuit test systems, the most commonly used method is the cold source method because it requires only one measurement, significantly reducing test pipeline time. Noise during this test is generated by two factors: one is interference arriving at the RF system input, which differs from the desired useful signal; the second is random perturbations of the RF system carrier. The second case is a result of Brownian motion, applicable to thermal equilibrium in any electronic device, where the available noise power of the device is: (1).

[0085] Where PNA is the noise power; k is the Boltzmann constant ( T is temperature in Kelvin; ΔF is noise bandwidth (Hz); at room temperature (290ΔK), the noise power spectral density PNAD = -174 dBm / Hz.

[0086] Therefore, the following formula is derived: (2).

[0087] Wherein, PNOUT is the total measured output noise power; -174dBm / Hz is the power spectral density of ambient noise at 290K; BW is the frequency bandwidth of interest; G is the system gain in dB; and NF is the noise figure of the chip under test.

[0088] It is understandable that each variable in the formula is a logarithm. To simplify the formula and obtain the logical relationship between the input and output, the output noise power spectral density (dBm / Hz) can be directly measured. The formula can be simplified to: (3).

[0089] Wherein: is the noise power measured in the cold source state, with the unit of dBm; G is the chip gain, with the unit of dB.

[0090] Based on this, please refer to Figure 11 , in order to measure the noise figure using the gain method, the test process is to first measure the gain of the chip under test, and then set the RF signal source to the cold load mode, directly through the test path, without additional signal transmission, and measure the output power at the output end within the specified bandwidth.

[0091] It can be understood that according to the principle of testing the noise figure parameter by the above RF integrated circuit test system, two main steps can be completed during the test process of the RF integrated circuit test system: one is to input a certain power of RF signal as an excitation to the RF chip under test, and then measure the RF signal power output by the RF chip, so as to calculate the magnitude of the chip gain parameter; the other is that the RF integrated circuit test system provides cold source excitation and measures the magnitude of the power of the signal output by the chip. After obtaining these two values, the test result of the noise figure can be obtained. The input and output of this model are both based on RF signals, realizing the output and measurement functions of power parameters, and building a noise figure parameter test model based on this logic.

[0092] It can be understood that the process is to configure the pins and channels of the RF chip; set the magnitude of the power signal transmission; read the magnitude of the power signal of the specified channel; calculate the gain G of the DUT; disconnect the RF signal input of the channel; configure the connection of the input pins of the DUT and the cold source excitation of the channel; measure the output power N at the corresponding channel of the pin; calculate the noise figure N of the DUT f ; Compare with the technical requirements. If the requirements are met, the test is qualified; otherwise, it is unqualified. The noise figure test model corresponding to the RF integrated circuit test system at the test port is as Figure 8 shown.

[0093] It should be noted that for the noise figure parameter test model, input multiple test excitation signals to cover the working range of the noise figure, record the response signals corresponding to each excitation signal to form the second mapping relationship of the noise figure parameter, and adjust the model parameters based on the second mapping relationship to match the standard noise figure working condition, generating an equivalent model of the noise figure parameter; when testing the RF integrated circuit, call the equivalent model of the noise figure parameter, receive the RF excitation signal input by the test system, and generate a simulated noise figure response signal as the standard value of the noise figure parameter.

[0094] Understandably, based on the above test model and the characteristics of the input and output signals during testing, the noise figure parameter standard first reads the RF signal power generated by the RF integrated circuit test system, and then processes and feeds back the set standard power. This allows the test system to test the manually specified standard gain value G. Next, after connecting a cold source excitation to the input of the test system, the noise figure parameter standard output is controlled to set the noise power N0, enabling the RF integrated circuit test system to calculate the corresponding noise figure based on the given standard gain value G and standard noise power N0. The noise figure parameter can be reproduced by controlling the output power of the parameter reproduction model. A schematic diagram of the model is shown below. Figure 9 As shown.

[0095] Based on the above analysis, the main functions of the RF noise figure parameter standard are twofold: first, to measure the RF signal emitted by the RF integrated circuit test system (with known frequency and power values); and second, to emit an RF signal of a specified power based on the measured RF signal power. Therefore, the hardware composition for reproducing the noise figure parameter is consistent with that for the power parameter, including a power output module and a power measurement module. Since the noise figure is obtained by configuring parameters in the power output and power measurement modules, it is necessary to construct a relationship model between the noise figure and the power parameter, thereby controlling the power parameter to achieve the reproduction of the noise figure parameter. Therefore, the hardware for reproducing the noise figure parameter directly reuses the power output and power measurement modules from the power parameter standard. The hardware structure diagram is shown below. Figure 10 As shown.

[0096] Similarly, the algorithm flow is as follows: configure the test channel and pin connections of the RF integrated circuit test system; configure the frequency and power parameters of the transmitted signal of the RF integrated circuit system; set the time for generating the RF signal; the parameter standard device reads the RF signal generated by the RF integrated circuit test system; process the test results and transmit a signal of specified power; the test system measures the chip gain value G; configure the cold source excitation and pin connections of the RF integrated circuit test system; configure the cold source excitation and pin connections of the RF integrated circuit test system; configure the parameter standard device to emit a signal of specified power; the test system measures the chip noise figure N. f .

[0097] In one feasible implementation, when the core parameter is the 1dB compression point, the 1dB compression point is when the RF amplifier chip enters the nonlinear region, the output power no longer increases linearly and is less than the expected value, resulting in a decrease in gain. The point where the gain drops to 1dB below the linear gain is typically referred to as the 1dB compression point. The curve of gain versus input (output) power is shown below. Figure 12 As shown.

[0098] When testing the 1dB compression point parameter, the RF integrated circuit test system primarily provides the functions of generating and measuring RF power signals. The RF signal is generated as the excitation for the RF chip. This excitation signal undergoes amplification and filtering by the chip, resulting in a power-enhanced output. The test system's RF board then receives the RF signal emitted by the chip and uses the signal source output from the RF board to down-convert the RF signal from analog to intermediate frequency (IF) and digitize it. Finally, it uses digital down-conversion to convert it into a baseband signal to measure its power. This process differs from the power and noise figure parameter testing procedures mentioned above; it involves continuous testing during a dynamic process to capture the test results. The RF basic circuit test system needs to continuously increase the generated RF signal power while continuously measuring the chip's output RF power until the output power value is less than the ideal gain value by 1dB. The output power at this point is the 1dB compression point. Although it is a dynamic measurement process, the basic principle of RF power signal generation and testing remains the same; therefore, its test principle diagram is shown below. Figure 13 As shown.

[0099] Based on the testing principle of the 1dB compression point parameter of the aforementioned RF integrated circuit test system, it can be concluded that the RF integrated circuit test system is mainly responsible for continuously outputting and measuring the power of the RF signal. The specific test process is as follows: control the RF integrated circuit test system to increase the input power in specified steps, and measure the output power value accordingly until the gain decreases by 1dB, at which point the 1dB compression point is found. During testing, a FOR loop is used to control the output and measurement. A noise figure parameter test model is built based on this logic. The corresponding 1dB compression point parameter test model of the RF integrated circuit test system at the test port is as follows: Figure 8 As shown.

[0100] Understandably, the testing process involves configuring the input / output pins and channels of the RF chip; setting the signal power transmission range of the RF integrated circuit test system; reading the power signal magnitude of the specified channel; obtaining the power signal input / output relationship curve from the RF integrated circuit test; calculating the 1dB compression point result based on the curve; and checking whether the threshold requirement is met. If yes, the test is qualified; otherwise, it is unqualified.

[0101] It should be noted that, for the 1dB compression point parameter test model, multiple test excitation signals are input to cover the compression point operating range. The response signal corresponding to each excitation signal is recorded to form a second mapping relationship set for the 1dB compression point parameters. The model parameters are then adjusted based on the second mapping relationship set to make the excitation response relationship match the standard compression point operating condition, generating an equivalent model of the 1dB compression point parameters. When testing the RF integrated circuit, the equivalent model of the 1dB compression point parameters is called, and the dynamic RF excitation signal input by the test system is received to generate a simulated compression point response signal as the standard value of the 1dB compression point parameters.

[0102] It should be noted that the equivalent reproduction method for the 1dB compression point parameter of RF integrated circuits is a dynamic reproduction process compared to the reproduction methods for static parameters such as power and noise figure. It requires providing a real-time response within a certain input range. The 1dB compression point parameter standard measures the power P of the RF signal emitted by the RF integrated circuit test system in real time, and correspondingly emits an increased RF signal P+G according to a fixed gain G, ensuring that the RF integrated circuit test system can detect it and generate an input-output power relationship graph. The 1dB compression point parameter standard requires pre-setting the 1dB compression point value P1. After measuring this power value, it will no longer output P1+G, but rather P1+G-1. At this point, the 1dB compression point test result P2 of the RF integrated circuit test system is compared with P1 to complete the verification of the 1dB compression point parameter. A schematic diagram of the model is shown below. Figure 9 As shown.

[0103] Based on the above analysis, the main functions of the RF 1dB compression point parameter standard are twofold: first, to measure the power of the RF signal emitted by the RF integrated circuit test system in real time; and second, to output a corresponding RF signal with a specified power level in real time based on the measured RF signal power. Therefore, the 1dB compression point directly utilizes the hardware portion of the power parameter measurement and output module. The overall hardware framework diagram is shown below. Figure 10 As shown.

[0104] Similarly, the algorithm flow is as follows: configure the transmit signal power P of the RF integrated circuit test system; configure the 1dB compression point value P1; the RF integrated circuit test system transmits signal P; the 1dB compression point parameter standard device tests the RF signal P; determine whether P1 is equal to P; if not, execute the RF integrated circuit test system to transmit signal P; if yes, the 1dB compression point parameter standard device outputs the RF signal P1+G-1; the RF integrated circuit test system measures the input-output curve; the RF integrated circuit test system measures the 1dB compression point parameter.

[0105] In a feasible implementation, when the core parameter is the error vector amplitude, the physical meaning of the error vector amplitude parameter is the ratio of the amplitude of the error vector between the test signal and the reference signal to the power of the reference signal. Its test results can reflect both the amplitude error and the phase error of IQ modulation. This parameter, considering the overall signal transmission performance of current highly integrated RF chips, is more comprehensive than power parameters, noise figure, and 1dB compression point parameters, which only use single-tone signals during testing. The error vector amplitude parameter requires modulation and demodulation processing during the test calibration process, thus providing a more complete reflection of the RF system's transmission performance. Its calculation formula is as follows: (4).

[0106] in, This represents the average power (amplitude) of the error vector. The average power (amplitude) of the reference signal. It can also be expressed as: (5).

[0107] in, , .

[0108] It should be noted that during the testing process of the RF integrated circuit test system, the RF integrated circuit test system first transmits baseband I(t) and Q(t) signals. After passing through the RF chip, its output signal is transmitted to the test system. Then, the test system demodulates or recovers the original transmission state according to a known modulation method and performs analysis in three dimensions: frequency domain, time domain, and vector domain. The phase error and amplitude error of the input signal are compared with those of the actual demodulated signal, and the EVM value is output by the DSP unit. Since the error vector amplitude test still requires the output of the test system and the input / output signals of the test RF chip, the schematic diagram of its test principle is as follows: Figure 14 As shown.

[0109] Understandably, based on the testing principle of the RF integrated circuit test system for the error vector amplitude parameter, the RF integrated circuit test system mainly performs two tasks: First, it outputs I and Q baseband signals, then demodulates and measures the output RF signal from the chip under test, comparing the measured I and Q baseband signals with the output values; second, the RF integrated circuit test system first modulates the I and Q baseband signals to generate RF signals, then measures the I and Q baseband signals output by the chip under test and compares them with the input of the test system, completing the RF signal transmit / receive vector error parameter test. An error vector amplitude parameter test model is built based on this logic. The corresponding error vector amplitude parameter test model of the RF integrated circuit test system at the test port is as follows: Figure 8 As shown.

[0110] Understandably, the testing process involves configuring the RF chip pins and channels; setting the baseband signal bandwidth and modulation method; the RF integrated circuit test system generating baseband signals I and Q; demodulating the RF input signal under test; obtaining the I1 and Q1 baseband signals; obtaining the EVM test results; and determining whether the threshold requirements are met. If yes, it is qualified; otherwise, it is unqualified.

[0111] It should be noted that, for the error vector amplitude parameter test model, multiple test excitation signals are input to cover the working range of the error vector amplitude. The response signal corresponding to each excitation signal is recorded to form a second mapping relationship set for the error vector amplitude parameter. The model parameters are then adjusted based on the second mapping relationship set to match the standard error vector amplitude operating condition, generating an equivalent model for the error vector amplitude parameter. When testing the RF integrated circuit, the equivalent model for the error vector amplitude parameter is called, the baseband excitation signal input from the test system is received, and a simulated error vector amplitude response signal is generated as the standard value of the error vector amplitude parameter.

[0112] It is understandable that the equivalent reproduction method of the error vector amplitude parameter of RF integrated circuits is based on a component model that affects the change of the error vector amplitude parameter. This differs from the above parameters, which are only related to power; the error vector amplitude parameter is affected by more parameters and requires a more accurate mathematical model. The standard error vector amplitude parameter is measured in real-time from the baseband signal generated by the RF integrated circuit test system. The measured signal is then subjected to amplitude increases / decreases or phase shifts to degrade signal transmission quality. The processed baseband signal is then sent to the RF integrated circuit test system for measurement. At this point, the test system can measure the result of the manually controlled standard error vector amplitude, thus completing the verification of the error vector amplitude parameter. A schematic diagram of the model is shown below. Figure 9 As shown.

[0113] Based on the above analysis, the main functions of the RF error vector amplitude parameter standard are twofold: first, to measure the baseband signal emitted by the RF integrated circuit test system in real time; and second, to adjust the amplitude or phase of the measured baseband signal in real time, finally outputting a baseband signal with the specified error vector amplitude. To achieve controllable error vector amplitude parameters, a module that increases the signal amplitude can be used, which can be implemented by the power output module. Therefore, the overall hardware framework diagram is as follows: Figure 15 As shown.

[0114] Similarly, the algorithm flow is as follows: the RF integrated circuit test system is configured to transmit I and Q signals; the error vector amplitude parameter standard is configured to specify the EVM value; the RF integrated circuit test system transmits I and Q signals; the error vector amplitude parameter standard device measures the original I and Q signals and adds amplitude error; the error vector amplitude parameter standard device outputs the processed I and Q signals; and the RF integrated circuit test system measures the error vector amplitude parameter.

[0115] The calibration device for the RF integrated circuit test system provided in this application is described below. Please refer to... Figure 16 The calibration apparatus for the RF integrated circuit test system described below can be referred to in conjunction with the calibration method for the RF integrated circuit test system described above. The calibration apparatus for the RF integrated circuit test system includes: The parameter filtering module is used to filter the core parameter indicators of multiple RF integrated circuits based on the first mapping relationship set between RF integrated circuit indicators and test system indicators.

[0116] The test model building module is used to build test models for multiple core parameter indicators based on the transmission path and parameter characteristics of radio frequency integrated circuits.

[0117] The equivalent model generation module is used to simulate the operating conditions of the radio frequency integrated circuit based on each test model and generate a second mapping relationship set of excitation response, and generate a parameter equivalent model based on the second mapping relationship set.

[0118] The parameter reproduction module is used to call the parameter equivalent model to match the input excitation signal during the test system runtime, and reproduce the standard parameters corresponding to the core parameter indicators.

[0119] The calibration module is used to calibrate the RF integrated circuit test system based on various standard parameters.

[0120] It is understood that the detailed functional implementation of each of the above modules can be found in the description of the aforementioned method embodiments, and will not be repeated here.

[0121] It should be understood that the above-described device is used to execute the methods in the above embodiments. The implementation principle and technical effect of the corresponding program modules in the device are similar to those described in the above methods. The working process of the device can be referred to the corresponding process in the above methods, and will not be repeated here.

[0122] It is understood that the various numerical designations used in the embodiments of this application are for descriptive convenience only and are not intended to limit the scope of the embodiments of this application.

[0123] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A calibration method for an RF integrated circuit test system, characterized in that, include: Based on the first mapping relationship set between RF integrated circuit indicators and test system indicators, multiple core parameter indicators of RF integrated circuits are screened. Based on the transmission path and parameter characteristics of multiple core parameters of radio frequency integrated circuits, a test model for multiple parameter indicators is built. Based on the test models described above, the operating conditions of the radio frequency integrated circuit are simulated and a second mapping relationship set of excitation response is generated, and a parameter equivalent model is generated based on the second mapping relationship set; During system testing, the parameter equivalence model is invoked to match the input excitation signal, and the standard parameters corresponding to the core parameter indicators are reproduced. The RF integrated circuit test system is calibrated based on the aforementioned standard parameters.

2. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, Based on the first mapping relationship set between RF integrated circuit indicators and test system indicators, multiple core parameter indicators of RF integrated circuits are screened, which previously included: A first set consisting of multiple key performance indicators of an RF integrated circuit and a second set consisting of multiple measurable parameters of a test system are obtained, wherein the key performance indicators are used to evaluate the performance of the RF integrated circuit and the measurable parameters are defined by the physical measurement capabilities of the test system equipment. Match multiple key performance indicators in the first set with one or more measurable parameter indicators in the second set that can quantify the key performance indicators, and generate matching results. Based on the matching results, a first mapping relationship set between RF integrated circuit indicators and test system indicators is generated.

3. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, Based on the first mapping relationship set between RF integrated circuit indicators and test system indicators, multiple core parameter indicators of RF integrated circuits are screened, including: Based on the first mapping relationship set, a score is obtained by scoring according to the number of radio frequency integrated circuit types that each core parameter index can represent; Based on the first mapping relationship set, a second scoring result is obtained by scoring according to the frequency of each core parameter indicator in multiple preset industry standard texts. Based on the first and second scoring results, multiple core parameter indicators of radio frequency integrated circuits are selected from the first mapping relationship set.

4. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, The core parameters of the multiple radio frequency integrated circuits include: power, noise figure, 1dB compression point, and error vector amplitude.

5. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, When the core parameter is power, the method includes: A simulated power path was built based on the power transmission and reception characteristics, and transmission and reception tests were conducted based on the simulated power path to obtain power test results. The simulated power path is calibrated based on the power test results, and a power test model is constructed based on the calibrated simulated power path. Based on the power test model, multiple test excitation signals covering the power operating range are input, the response signals corresponding to each excitation signal are recorded to form a second mapping relationship of power parameters, and the model parameters are adjusted based on the second mapping relationship to match the standard power operating condition, thereby generating an equivalent power parameter model. When testing radio frequency integrated circuits, the power parameter equivalent model is invoked, the radio frequency excitation signal input by the test system is received, and a simulated power response signal is generated as the standard value of the power parameter.

6. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, When the core parameter is the noise figure, the method includes: Based on the cold source method, a noise figure parameter test model is constructed according to the gain parameter acquisition path and the power of the output signal; For the noise figure parameter test model, multiple test excitation signals are input to cover the noise figure working range. The response signal corresponding to each excitation signal is recorded to form a second mapping relationship of the noise figure parameters. Based on the second mapping relationship, the model parameters are adjusted to match the standard noise figure working condition and generate an equivalent model of the noise figure parameters. When testing radio frequency integrated circuits, the equivalent model of noise figure parameters is invoked, the radio frequency excitation signal input by the test system is received, and a simulated noise figure response signal is generated as the standard value of the noise figure parameters.

7. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, When the core parameter is at a compression point of 1dB, the method includes: Based on the preset step size, the input power of the test system is increased, and a 1dB compression point parameter test model is constructed according to the output power value. For the 1dB compression point parameter test model, multiple test excitation signals are input to cover the working range of the compression point. The response signal corresponding to each excitation signal is recorded to form a second mapping relationship set of 1dB compression point parameters. Based on the second mapping relationship set, the model parameters are adjusted to match the standard compression point working condition and generate an equivalent model of 1dB compression point parameters. When testing radio frequency integrated circuits, the equivalent model of 1dB compression point parameters is called, the dynamic radio frequency excitation signal input by the test system is received, and the simulated compression point response signal is generated as the standard value of 1dB compression point parameters.

8. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, When the core parameter is the magnitude of the error vector, the method includes: Based on the comparison test of I and Q baseband signals with the input and output of the test system, an error vector amplitude parameter test model is constructed. For the error vector amplitude parameter test model, multiple test excitation signals are input to cover the working range of the error vector amplitude. The response signal corresponding to each excitation signal is recorded to form a second mapping relationship set of the error vector amplitude parameter. Based on the second mapping relationship set, the model parameters are adjusted to match the standard error vector amplitude working condition, and an equivalent model of the error vector amplitude parameter is generated. When testing radio frequency integrated circuits, the equivalent model of error vector amplitude parameter is invoked, the baseband excitation signal input by the test system is received, and a simulated error vector amplitude response signal is generated as the standard value of error vector amplitude parameter.

9. The calibration method for the RF integrated circuit test system as described in claim 1, characterized in that, The RF integrated circuit test system, calibrated based on the aforementioned standard parameters, also includes: The actual parameters of the core parameters of the radio frequency integrated circuit test system are collected; When the error between the actual parameters and the standard parameters exceeds a preset error range, the test system is deemed inaccurate. If the test system is determined to be inaccurate, the test system is adjusted based on the path corresponding to the standard parameters.

10. A calibration device for a test system of radio frequency integrated circuits, characterized in that, include: The parameter filtering module is used to filter the core parameter indicators of multiple RF integrated circuits based on the first mapping relationship set between RF integrated circuit indicators and test system indicators. The test model building module is used to build test models for multiple core parameter indicators based on the transmission path and parameter characteristics of radio frequency integrated circuits. The equivalent model generation module is used to simulate the operating conditions of the radio frequency integrated circuit based on each of the test models and generate a second mapping relationship set of excitation response, and generate a parameter equivalent model based on the second mapping relationship set; The parameter reproduction module is used to call the parameter equivalent model to match the input excitation signal during the test system operation, and reproduce the standard parameters corresponding to the core parameter indicators. A calibration module is used to calibrate the RF integrated circuit test system based on the aforementioned standard parameters.

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