Simulation analysis method and device for double-support component, electronic equipment and storage medium

Abstract

The embodiment of the invention relates to a simulation analysis method and device for double supporting parts, electronic equipment and a storage medium, and relates to the technical field of robot design. According to the invention, modeling can be carried out on the first component of the double-support structure, the second component supported by the first component and the connecting component between the first component and the second component; applying a load to the first component and the second component; and obtaining a stress cloud picture and a deformation cloud picture of the first component under the load. According to the invention, the precise connection relation, stress distribution and deformation condition among the components can be obtained, and the load of each connection point on the double-support component (namely the first component) corresponding to the actual condition can be precisely obtained. Compared with a current estimation load simulation method, the maximum principal stress and the maximum deformation of the double-support component under the load can be reduced, the mechanical level and the safety margin of the double-support component of the robot under the load can be reflected more accurately, and the problem that the design of the robot is too heavy is solved.

Description

Technical Field

[0001] This application relates to the field of robot design technology, and more specifically, to a simulation analysis method, apparatus, electronic device, and storage medium for dual-support components. Background Technology

[0002] Current robot design methods simplify a six-axis industrial robot into a two-force rod with forces at both ends, connected by hinges. By using kinematic and dynamic principles, the loads at two connection points of each component, such as the robot base, rotating seat, upper arm, and other parts, can be obtained, and then static analysis can be performed on each component of the robot.

[0003] For robots with a dual-support (i.e., force applied from both sides) structure, referred to as dual-support robots, the dual-support components (such as dual-support arms) have 3 to 4 connection points. The joint loads of a dual-support robot are related to the stiffness of the reducer, bearing stiffness, robot body structure, and operating load conditions. Current robot design methods cannot obtain the load at each connection point of the dual-support components. Even when using load distribution estimation to perform force analysis on the dual-support components in engineering, accurate load results are still not obtained, making precise analysis and design of the various structural components of the dual-support robot difficult.

[0004] In other words, how to obtain the load at each connection point of the dual-support component of a dual-support robot, thereby improving the accuracy of the analysis of the robot's various structural components, is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] This application provides a simulation analysis method, apparatus, electronic device, and storage medium for dual-support components to solve the aforementioned technical problems.

[0006] In a first aspect, embodiments of this application provide a simulation analysis method for a dual-support component. The method includes: modeling a first component, a second component, and a connecting component between the first and second components, wherein the first component is a dual-support structure and is used to support the second component; applying a load to the second component; and obtaining stress cloud diagrams and deformation cloud diagrams of the first component under the load.

[0007] Secondly, embodiments of this application provide a simulation analysis device for a dual-support component. The device includes: a component modeling module for modeling a first component, a second component, and a connecting component between the first and second components, wherein the first component is a dual-support structure and is used to support the second component; a load application module for applying a load to the second component; and a cloud map drawing module for obtaining stress cloud maps and deformation cloud maps of the first component under the load.

[0008] Thirdly, embodiments of this application provide an electronic device, which includes a memory and a processor. The memory stores an application program that, when invoked by the processor, causes the processor to execute the method provided in the embodiments of this application.

[0009] Fourthly, embodiments of this application provide a computer-readable storage medium storing program code, which, when invoked by a processor, causes the processor to execute the method provided in embodiments of this application.

[0010] The simulation analysis method for dual-support components provided in this application has the following technical effects: by modeling the first component of the dual-support structure, the second component supported by the first component, and the connecting components between the first and second components, the stress cloud map and deformation cloud map of the first component under the applied load can be obtained. This allows for the accurate connection relationship, stress distribution, and deformation between the components, thereby enabling the accurate acquisition of the load corresponding to the actual situation at each connection point on the first component of the dual-support structure. Compared with the current load estimation simulation method, this method can reduce the maximum principal stress and maximum deformation of the dual-support component (i.e., the first component) under load, and can more accurately reflect the mechanical level and safety margin of the robot's dual-support components under load, thus alleviating the problem of overly bulky robot design. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments and drawings obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0012] Figure 1 A flowchart illustrating a simulation analysis method for a dual-support component according to an embodiment of this application is shown.

[0013] Figure 2 This illustration shows a structural schematic diagram of a three-dimensional model of the first component provided in an exemplary embodiment of this application;

[0014] Figure 3 A schematic diagram of the structure of a finite element model provided in an embodiment of this application is shown;

[0015] Figure 4 A grayscale image of the stress cloud diagram provided in an exemplary embodiment of this application is shown;

[0016] Figure 5A grayscale image of the deformed cloud map provided in an exemplary embodiment of this application is shown;

[0017] Figure 6 A flowchart illustrating a simulation analysis method for a dual-support component provided in another embodiment of this application is shown.

[0018] Figure 7 A schematic diagram of a rod model provided in an exemplary embodiment of this application is shown;

[0019] Figure 8 A schematic diagram of the structure of the simulation analysis device with dual support components provided in an embodiment of this application is shown;

[0020] Figure 9 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the " / " in the following text of this application means "or".

[0022] The simulation analysis method for dual-support components in this application embodiment can be applied to simulation analysis devices or electronic devices for dual-support components. The simulation analysis device for dual-support components can be integrated into an electronic device. The electronic device can refer to a device with computing capabilities and a display screen. The electronic device can include, but is not limited to, tablet computers, laptops, and desktop computers. The electronic device can communicate with other electronic devices or servers via wired or wireless networks.

[0023] Please see Figure 1 , Figure 1 A schematic flowchart of a simulation analysis method for a dual-support component according to an embodiment of this application is shown. The simulation method for the dual-support component may include steps S110 to S130.

[0024] Step S110: Model the first component, the second component, and the connecting component between the first component and the second component. The first component is a double-support structure used to support the second component.

[0025] In this embodiment, the first component is the component that needs to be analyzed and evaluated, and can be referred to as the component to be evaluated or the component to be analyzed. The first component and the second component have a support and supported relationship. The first component is a double-support structure, that is, a structure that is subjected to forces on both sides. The first component can provide double support for the second component. The second component can be referred to as the next-level component of the first component.

[0026] In this embodiment of the application, the connecting component may include two components, one of which is connected from one side of the second component to one side of the first component, and the other component is connected from the other side of the second component to the other side of the first component, thereby realizing the dual support of the first component for the second component.

[0027] The first component can be modeled, then the second component can be modeled, and finally the connecting component can be modeled to obtain a finite element model. In this embodiment, modeling refers to three-dimensional modeling; for an example, please refer to [link to example]. Figure 2 , Figure 2 The diagram illustrates a three-dimensional model of a first component provided in an exemplary embodiment of this application. Assuming the first component is the base of a double-supported rotary table, the three-dimensional model of the first component can be as follows: Figure 2 As shown. Modeling the connecting components includes modeling the connection relationships between the first component, the connecting component, and the second component. The specific 3D models of the first component, the second component, and the connecting component can be modeled according to the actual structure of each component of the dual-support robot. It is understandable that the process of establishing a finite element model is called finite element modeling, which is crucial to the entire finite element analysis process. The rationality of the model directly affects the accuracy of the calculation results, the computation time, the storage capacity, and whether the computation process can be completed. A finite element model refers to a set of element combinations connected only at nodes, transmitting forces only at nodes, and constrained only at nodes. It is the result of discretizing the mechanical model and is a digital model for numerical calculation.

[0028] In some embodiments, the connecting component may include a connecting component body, a stator, and a rotor. Modeling the connecting component may include: modeling the connecting component between the first component and the second component, where modeling includes modeling the connecting component body, the stator, and the rotor; and connecting the stator and the first component, and connecting the rotor and the second component using a full-degree-of-freedom coupling method. It is understood that coupling a degree of freedom refers to forcing a certain degree of freedom of two or more components / nodes to be equal, while full-degree-of-freedom coupling refers to forcing all degrees of freedom of two or more components / nodes to be equal. That is, the full-degree-of-freedom coupling method of this application enables the coupled (i.e., connected) components to have the same degree of freedom, meaning that the number and values ​​of the degrees of freedom are the same, i.e., the coupled components share the same degree of freedom. In other words, the stator and the first component have the same degree of freedom, and the rotor and the second component have the same degree of freedom.

[0029] In some embodiments, the connecting component may include a reducer (torsion transmission component), and the stator and rotor structures of the reducer can be retained; that is, the stator and rotor structures of the reducer can be the same as those of the reducer on an actual dual-support robot. For modeling the reducer body, a first spring unit can be used as the reducer body model. The first spring unit has six degrees of freedom. In other words, this application can use a six-degree-of-freedom first spring unit between the rotor and stator of the reducer to simulate the support and torsion transmission relationship of the reducer, thereby ensuring the accuracy of the support and torsion transmission relationship of the reducer body and reducing the complexity of the reducer body modeling. This can improve the accuracy of structural analysis while also increasing the efficiency of structural modeling and analysis.

[0030] In some embodiments, the connecting component may include a bearing (support component), and the stator and rotor structures of the bearing may be retained, that is, the stator and rotor structures of the bearing may be the same as those of the bearing on an actual dual-support robot. A second spring element can be used as the bearing body for bearing body modeling. The degrees of freedom of the second spring element correspond to the support stiffness of the bearing, and this correspondence may include the number and values ​​of the degrees of freedom corresponding to the support stiffness of the bearing. For example, taking a deep groove ball bearing as an example, based on the characteristic that deep groove ball bearings mainly bear radial loads, this application can use a second spring element with degrees of freedom corresponding to the support stiffness of the deep groove ball bearing to simulate the support relationship of the deep groove ball bearing, thereby ensuring the accuracy of the support relationship of the bearing body and reducing the complexity of bearing body modeling, which can improve the accuracy of structural analysis while improving the efficiency of structural modeling and analysis. It is understood that the support stiffness of the bearing refers to the ratio of the deformation generated by the bearing after bearing a load to the load it bears, and the spatial direction of the support stiffness may include radial stiffness and axial stiffness.

[0031] The degree-of-freedom coupling method in the embodiments of this application may include the component common node method or the multipoint constraint (MPC) method.

[0032] In some embodiments, the full degree-of-freedom coupling method can be a component-shared-node method. In this case, using the full degree-of-freedom coupling method to connect the stator of the connecting component and the first component, and connecting the rotor of the connecting component and the second component, can include: setting the stator of the connecting component and the first component to share a node, and setting the rotor of the connecting component and the second component to share a node. Here, a shared node is a type of connection definition in finite element analysis. In finite element analysis, all physical quantities of components with a shared node are identical, equivalent to the components being bound together, which is a contact definition. After components share a node, the components with the shared node are approximately welded together, sharing the same degree of freedom. Components with shared nodes form a shared-node model. Using a shared-node model can improve the efficiency and accuracy of subsequent calculations, and for large deformations, the shared-node model is easier to converge.

[0033] After the finite element model is completed, it can accurately characterize the structural flexibility of each component, the connection relationship between the components, and the relative motion relationship. This allows the loads of each joint of the dual-support robot to be obtained based on the finite element model, that is, the loads of each connection point of each component. This solves the technical problem that current robot design methods cannot obtain the loads of each connection point of dual-support components, thereby improving the accuracy of subsequent component structural analysis. For example, static and fatigue simulation analysis can be carried out to avoid the problem of bulky robot design.

[0034] In some embodiments, the full degree-of-freedom coupling method can be the MPC method. Connecting the stator and the first component of the connecting member, and connecting the rotor and the second component of the connecting member using the full degree-of-freedom coupling method, can include: connecting the stator and the first component of the connecting member, and connecting the rotor and the second component of the connecting member using the MPC method. Here, MPC defines a coupling relationship of nodal degrees of freedom, that is, using certain degrees of freedom of a node as standard values, and then establishing a certain relationship between certain degrees of freedom of other specified nodes and these standard values. Multi-point constraints are often used to characterize specific physical phenomena, such as rigid connections, hinges, and sliding. Multi-point constraints can also be used for load transfer between incompatible elements.

[0035] As an example, please refer to Figure 3 , Figure 3 A schematic diagram of the structure of a finite element model provided in an embodiment of this application is shown. Assuming the first component is a base, the second component is a turntable, and the connecting components include a reducer and bearings, the modeling result of step S110 can be as follows: Figure 3 As shown. Figure 3The finite element model 100 shown may include a base 110 of the rotary table, a turntable 120 of the rotary table, a reducer 130, and a bearing 140. The reducer 130 may include a first spring unit 131, a stator 132, and a rotor 133 connected to each other. The stator 132 and the base 110 are fully coupled in all degrees of freedom, and the rotor 133 and the turntable 120 are also fully coupled in all degrees of freedom. The bearing 140 may include a second spring unit 141, a stator 142, and a rotor 143 connected to each other. The stator 142 and the base 110 are fully coupled in all degrees of freedom, and the rotor 143 and the turntable 120 are also fully coupled in all degrees of freedom. The base 110 provides dual support for the turntable 120 through the reducer 130 and the bearing 140.

[0036] Step S120: Apply a load to the second component.

[0037] A load refers to the external force borne by a part / component / assembly during operation. It is understood that the load applied in step S120 can include the actual load on the second component under different motion postures. Since the first and second components are physically connected, the load borne by the second component can be transferred to the first component. Therefore, applying a load to the second component can achieve the effect of applying a load to the first component.

[0038] In some embodiments, constraints can be set on the first component to keep it stationary, thereby improving the accuracy of obtaining the load on the first component when subsequent loads are applied. Specifically, the position of the bottom bolt of the first component can be constrained to remain stationary.

[0039] After the first component is constrained, a load can be applied to the second component. In some embodiments, such as Figure 2 As shown, structural mass elements 121 (i.e., Mass21) can also be set on the cross-section of the second component. Specifically, applying a load to the second component can include: applying a load to Mass21 on the cross-section of the second component, and the load is transmitted to the first component through the second component. Mass21 and the second component are rigidly connected on the cross-section of the second component, so that applying a load to Mass21 achieves the effect of applying a load to the second component. Each node of Mass21 can have up to 6 degrees of freedom, i.e., translational and rotational displacements along the X, Y, and Z directions of the node coordinate system. Mass21 can characterize the mass properties of the structure, and all loads in the translational and rotational directions can be applied to Mass21 in this application. Mass21 can have different masses and moments of inertia in each coordinate axis direction. Mass21 can be defined by a node, and a node can also generate a mass element. In finite element modeling, the object can be simplified to a mass point, and then mass is assigned to it through Mass21.

[0040] Step S130: Obtain the stress cloud diagram and deformation cloud diagram of the first component under the load.

[0041] The stress and deformation cloud maps of the first component are results from finite element analysis. The stress cloud map, also known as the stress distribution cloud map, displays the stress distribution within the first component. It shows the stress flow field distribution inside the first component, allowing personnel to clearly understand the areas of worst tensile / compressive / shear stress. The deformation cloud map, also known as the deformation distribution cloud map, displays the surface deformation state of the first component. It visually reveals the evolution of internal micro-deformation in the first component under pressure.

[0042] In some embodiments, the stress and deformation cloud diagrams of the first component under the load can be plotted using Ansys software or similar software based on a finite element model. It is understood that the load in this embodiment may include the actual load on the second component under different motion postures; therefore, the stress and deformation cloud diagrams of the first component under the load refer to the stress and deformation cloud diagrams of the first component under different loads.

[0043] As an example, if the first component is a rotary table, please refer to [link to relevant documentation]. Figure 4 and Figure 5 , Figure 4 This is a grayscale image of the stress cloud diagram provided in an exemplary embodiment of this application. Figure 5 A grayscale image of a deformable cloud map provided in an exemplary embodiment of this application is shown. Figure 4 and Figure 5 In the corresponding embodiment, the bearing stiffness is K1, which can be based on Figure 4 The stress cloud diagram shown indicates that the maximum principal stress of the first component is 45 megapascals (MPa). Figure 5 The deformation cloud diagram shown indicates that the maximum deformation of the first component is 0.26 millimeters (mm).

[0044] Please refer to Table 1 for Figure 4 and Figure 5In a corresponding embodiment, the simulation analysis method for the dual-support component of this application reveals that the maximum principal stress of the first component is 45 MPa and the maximum deformation is 0.26 mm. However, using the estimation analysis method currently employed in robot design, the maximum principal stress of the first component is estimated to be 188 MPa and the maximum deformation to be 1.2 mm. It is evident that the maximum principal stress and maximum deformation calculated by the simulation analysis method for the dual-support component of this application are both lower than those calculated by current estimation analysis methods. Compared to current estimation analysis methods, the simulation analysis method for the dual-support component of this application can more accurately reflect the mechanical level and safety margin of the robot body under different loads, and reflect the structural risk level of the dual-support robot in the first component. If the current estimation analysis method is used to design a dual-support robot, the robot will be designed to be too bulky and overly conservative. Using the simulation analysis method for the dual-support component of this application avoids the problem of overly bulky robot designs resulting from current estimation analysis methods, improves the accuracy of dual-support robot design, and optimizes each component of the dual-support robot. The method of this application has strong engineering application value.

[0045] Table 1

[0046] This application method Current estimation and analysis methods Maximum principal stress 45 188 Maximum deformation 0.26 1.2

[0047] Steps S110 to S130 have the following technical effects: Modeling the first component of the dual-support structure, the second component supported by the first component, and the connecting components between the first and second components, and obtaining the stress cloud map and deformation cloud map of the first component under the applied load, can obtain the accurate connection relationship, stress distribution, and deformation between the components. Thus, it is possible to accurately obtain the load corresponding to the actual situation at each connection point on the first component of the dual-support structure. Compared with the current load estimation simulation method, it can reduce the maximum principal stress and maximum deformation of the dual-support component (i.e., the first component) under the load, and can more accurately reflect the mechanical level and safety margin of the robot's dual-support component under the load, alleviating the problem of the robot design being too bulky.

[0048] Please see Figure 6 , Figure 6 A flowchart illustrating a simulation analysis method for a dual-support component according to another embodiment of this application is shown. The simulation analysis method for the dual-support component may include steps S210 to S260.

[0049] Step S210: Obtain the link model of the robot with a dual-support structure (dual-support robot).

[0050] The link model of a dual-support robot is an abstract model of the joints and connecting components of the dual-support robot. The link model includes the joints of the dual-support robot and the connecting components between the joints. The connecting components are called links or connecting rods in the link model, which can also be called the link model.

[0051] As an example, please refer to Figure 7 , Figure 7 A schematic diagram of a rod model provided in an exemplary embodiment of this application is shown. Figure 7 The rod model shown includes two joints, and the connecting component between the two joints is called a rod, such as... Figure 7 As shown, the member i includes two axes i and i+1, each of which passes through the center of the upper and lower cross sections of the joint.

[0052] Step S220: Based on the link model and the kinematic and dynamic equations of the robot, obtain the loads of each component of the robot.

[0053] Based on the aforementioned link model, the DH method can be used to obtain the motion patterns and rotation information of each component of the robot. This information is called DH parameters, such as... Figure 7 As shown, the DH parameters can include member length Li, member torsion angle αi, member offset di, and joint angle θi. Figure 7 As shown, the link length Li refers to the length of the portion of the common perpendicular of the two axes of the link between the two axes (also called the common perpendicular length). The link torsion angle αi refers to the angle between axis i and i+1 when one of the axes of joint axis i and i+1 is translated along the common perpendicular so that they intersect and form a plane, using the right-hand rule. The link offset di refers to the distance between the two common perpendiculars along the common axis of the two links when two links are connected together (there are three joints and two common perpendiculars). The joint angle θi refers to the angle between two adjacent links rotating about the common axis. Based on the above DH parameters, the loads at single-point positions (i.e., each connection point) of each component of the robot can be obtained through the robot's kinematic equations and dynamic principles.

[0054] As an example, assume the robot has two links with lengths L1 and L2, and the acceleration due to gravity is g. The robot's joint angles are θ1 and θ2, joint angular velocities are ω1 and ω2, and joint angular accelerations are α1 and α2. The kinematic relationships can be derived to obtain the position coordinates of the links' ends:

[0055] X=L1cos(θ1)+L2cos(θ1+θ2)y=L1sin(θ1)+L2sin(θ1+θ2)

[0056] According to Newton's second law, the dynamic equations of the robot can be obtained as follows:

[0057] M1α1+M2α2+c1ω1+c2ω2+G1+G2=τ1I1α1+I2α2+c3ω1+c4ω2

[0058] +G3+G4=τ2

[0059] Where M1 and M2 are the masses of the two links, I1 and I2 are the moments of inertia of the two links, c1, c2, c3 and c4 are the centrifugal force and Coriolis force coefficients (twice the value of the Earth's rotational angular velocity at various locations on the Earth's surface), G1, G2, G3 and G4 are the gravitational components, and τ1 and τ2 are the torques of the connecting joints.

[0060] The gravitational component can be obtained from the gravitational acceleration and the mass of the link. Centrifugal force and Coriolis force can be calculated from the joint angular velocity. Combining the above kinematic and dynamic equations, the joint angular acceleration can be obtained, and thus the joint loads under the current link model, i.e., the loads of each component of the robot, can be obtained. Different motion postures of the joints and / or links in the link model can be adjusted, and the loads of each component under different motion postures can be obtained through step S120.

[0061] Step S230: Model the first component, the second component, and the connecting component between the first component and the second component, wherein the first component is a double-support structure and is used to support the second component.

[0062] Step S240: Set constraints for the first component.

[0063] Step S250: Apply different loads to the second component, the different loads including the loads of the second component under different motion postures obtained in step S220.

[0064] Step S260: Obtain stress cloud diagrams and deformation cloud diagrams of the first component under different loads.

[0065] For steps S230 to S260, please refer to steps S110 to S130 above.

[0066] Steps S210 to S260 achieve the following technical effects: By modeling the first component of the dual-support structure, the second component supported by the first component, and the connecting components between the first and second components, and obtaining the stress cloud map and deformation cloud map of the first component under the applied load, the precise connection relationship, stress distribution, and deformation of each component can be obtained. This allows for accurate acquisition of the load corresponding to the actual situation at each connection point on the first component of the dual-support structure. Compared to current load estimation simulation methods, this reduces the maximum principal stress and maximum deformation of the dual-support component (i.e., the first component) under load, more accurately reflecting the mechanical level and safety margin of the robot's dual-support component under load, and alleviating the problem of overly bulky robot design. Furthermore, based on the link model of the robot with the dual-support structure, the robot's kinematic equations, and dynamic equations, the loads of each robot component under different motion postures can be obtained in advance. Subsequent simulations using these loads can make the simulation results closer to the actual mechanical level and safety margin of the robot's dual-support component under load, thereby further improving the accuracy of component simulation.

[0067] Please see Figure 8 , Figure 8 A schematic diagram of the structure of the simulation analysis device for dual-support components provided in this application embodiment is shown. The simulation analysis device 200 for dual-support components can be integrated into an electronic device. The simulation analysis device 200 for dual-support components may include a component modeling module 210, a load application module 220, and a contour plotting module 230.

[0068] The component modeling module 210 is used to model the first component, the second component, and the connecting component between the first component and the second component. The first component is a double-support structure and is used to support the second component.

[0069] The load application module 220 is used to apply a load to the second component.

[0070] The cloud map drawing module 230 is used to obtain the stress cloud map and deformation cloud map of the first component under the load.

[0071] In some embodiments, the component modeling module 210 is further configured to model the connecting component between the first component and the second component, the connecting component including the connecting component body, the stator and the rotor of the connecting component; the stator of the connecting component and the first component are connected by a full degree of freedom coupling method, and the rotor and the second component of the connecting component are connected by the full degree of freedom coupling method, wherein the degrees of freedom of the coupled components are the same.

[0072] In some embodiments, the connecting component includes a speed reducer. The component modeling module 210 is further configured to model the speed reducer body using a first spring unit as the speed reducer body, the first spring unit having six degrees of freedom.

[0073] In some embodiments, the connecting component includes a bearing. The component modeling module 210 is further configured to model the bearing body using a second spring unit as the bearing body, wherein the degrees of freedom of the second spring unit correspond to the support stiffness of the bearing.

[0074] In some embodiments, the component modeling module 210 is further configured to set the stator of the connecting component and the first component to share a node, and to set the rotor of the connecting component and the second component to share a node.

[0075] In some embodiments, the component modeling module 210 is further configured to connect the stator and the first component of the connecting component using a multi-point constraint method, and to connect the rotor and the second component of the connecting component.

[0076] In some embodiments, the load application module 220 is further configured to set constraints on the first component; apply a load to a structural mass unit on the cross-section of the second component, the load being transmitted to the first component through the second component, and the structural mass unit being rigidly connected to the second component on the cross-section.

[0077] In one embodiment, the simulation analysis device 200 for dual-support components may further include a load acquisition module, which is used to acquire the link model of the robot with dual-support structure; and to acquire the loads of each component of the robot based on the link model and the kinematic and dynamic equations of the robot.

[0078] Those skilled in the art will clearly understand that the apparatus provided in the embodiments of this application can implement the methods provided in the embodiments of this application. The specific working process of the described apparatus and modules can be found in the corresponding processes of the methods in the embodiments of this application, and will not be repeated here.

[0079] In the embodiments provided in this application, the coupling, direct coupling, or communication connection between the modules shown or discussed may be indirect coupling or communication coupling through some interfaces, devices, or modules, and may be electrical, mechanical, or other forms. The embodiments of this application do not impose specific limitations on this.

[0080] Furthermore, the functional modules in the embodiments of this application can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.

[0081] Please see Figure 9 , Figure 9 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. The electronic device 300 may include a memory 310 and a processor 320. The memory 310 stores an application program, which is configured to cause the processor 320 to execute the method provided in the embodiment of this application when invoked by the processor 320.

[0082] The processor 320 may include one or more processing cores. The processor 320 uses various interfaces and lines to connect to various parts of the entire electronic device 300, and is used to run or execute instructions, programs, code sets or instruction sets stored in the memory 310, as well as to call and run or execute data stored in the memory 310, and perform various functions of the electronic device 300 and process data.

[0083] The processor 320 can be implemented using at least one of the following hardware forms: Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The processor 320 can integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the displayed content; and the modem handles wireless communication. It is understood that the modem can also be implemented separately as a communication chip, without being integrated into the processor 320.

[0084] The memory 310 may include random access memory (RAM) or read-only memory (ROM). The memory 310 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 310 may include a program storage area and a data storage area. The program storage area may store instructions for implementing an operating system, instructions for implementing at least one function, instructions for implementing the various method embodiments described above, etc. The data storage area may store data created by the electronic device 300 during use.

[0085] This application also provides a computer-readable storage medium storing program code that is configured to execute the method provided in this application when invoked by a processor.

[0086] Computer-readable storage media can be electronic storage devices such as flash memory, electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), hard disk, or ROM.

[0087] In some embodiments, the computer-readable storage medium includes a non-volatile computer-readable storage medium (Non-TCRSM). The computer-readable storage medium has storage space for program code that performs any of the method steps described above. This program code can be read from or written to one or more computer program products. The program code may be compressed in an appropriate form.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A simulation analysis method for a dual-support component, characterized in that, include: Model the first component, the second component, and the connecting component between the first component and the second component. The first component is a double-support structure and is used to support the second component. Apply a load to the second component; Obtain the stress cloud diagram and deformation cloud diagram of the first component under the load.

2. The method according to claim 1, characterized in that, The modeling of the connecting component between the first component and the second component includes: The connecting component between the first component and the second component is modeled, and the connecting component includes the connecting component body, the stator of the connecting component, and the rotor; The stator and the first component of the connecting component are connected by a full degree of freedom coupling method, and the rotor and the second component of the connecting component are connected by the full degree of freedom coupling method, which makes the degrees of freedom of the coupled components the same.

3. The method according to claim 2, characterized in that, The connecting component includes a speed reducer, and the modeling of the connecting component between the first component and the second component includes: The first spring unit is used as the reducer body to model the reducer body. The first spring unit has six degrees of freedom.

4. The method according to claim 2, characterized in that, The connecting component includes a bearing, and the modeling of the connecting component between the first component and the second component includes: The bearing body is modeled using a second spring unit as the bearing body. The degrees of freedom of the second spring unit correspond to the support stiffness of the bearing.

5. The method according to any one of claims 2-4, characterized in that, The method of using full-degree-of-freedom coupling to connect the stator and the first component of the connecting component, and to connect the rotor and the second component of the connecting component, includes: Set the stator of the connecting component to share a common node with the first component, and set the rotor of the connecting component to share a common node with the second component; or A multi-point constraint method is used to connect the stator and the first component of the connecting component, and to connect the rotor and the second component of the connecting component.

6. The method according to claim 1, characterized in that, Applying a load to the second component includes: Set constraints on the first component; A load is applied to the structural mass element on the cross-section of the second component, and the load is transmitted to the first component through the second component. The structural mass element is rigidly connected to the second component on the cross-section.

7. The method according to claim 1, characterized in that, Before modeling the first component, the second component, and the connecting component between the first and second components, the method further includes: Obtain the link model of the robot with a double-support structure; Based on the link model and the kinematic and dynamic equations of the robot, the loads of each component of the robot are obtained.

8. A simulation analysis device with dual support components, characterized in that, include: The component modeling module is used to model the first component, the second component, and the connecting component between the first component and the second component. The first component is a double-support structure and is used to support the second component. A load application module for applying a load to the second component; The cloud map drawing module is used to obtain the stress cloud map and deformation cloud map of the first component under the load.

9. An electronic device, characterized in that, include: A memory and a processor, wherein the memory stores an application program configured to cause the processor to perform the method as described in any one of claims 1-7 when invoked by the processor.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program code that, when invoked by a processor, causes the processor to perform the method as described in any one of claims 1-10.

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