Ultrasonic dust removal device based on composite robot for semiconductor industry

Abstract

The invention discloses a composite robot-based ultrasonic dust removal device for the semiconductor industry, which comprises an AGV trolley, a mounting frame is arranged on the AGV trolley, a bottom frame is arranged at the bottom of the mounting frame, and the bottom frame is connected with the AGV trolley; a mechanical arm is arranged at the top of the mounting frame; an ultrasonic dust removal device is arranged at the free tail end, away from the mounting frame, of the mechanical arm; the ultrasonic dust removal device comprises a dust removal head, a dust removal head bottom plate is arranged at the bottom of a dust removal head cavity, and the dust removal head and the dust removal head bottom plate are integrally formed; an air inlet barrel is arranged at the top of the dust removal head cavity, a positive pressure cavity is formed in the dust removal head cavity, the peripheral side walls of the positive pressure cavity are vertically arranged on a dust removal head bottom plate in the dust removal head cavity, a separation distance is formed between a top plate of the positive pressure cavity and the top end of the dust removal head cavity, and the air inlet barrel is in through connection with the positive pressure cavity. The horizontal plane and the vertical door of the carrier are cleaned, the wider dust removal requirement is met, and the application range is greatly widened.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production, in particular to an ultrasonic dust removal device based on a composite robot for the semiconductor industry, which can efficiently clean the dust generated during the working process of the production carrier. BACKGROUND

[0002] A wafer is a silicon material used for the production of silicon semiconductor integrated circuits, and is used to produce chips of integrated circuits. The cleanliness of the wafer, as a carrier of integrated circuits, directly determines the product yield of the chip. In the semiconductor production process, the wafer is usually placed in a wafer box (FOUP) and transported to a carrier of different load ports 91 (Loadport) by an AMHS (Automatic Material Handling System). Referring to the accompanying drawings, the accompanying drawings are schematic diagrams of a semiconductor production line, and the accompanying drawings are schematic diagrams of a semiconductor production line. Figure 15 The accompanying drawings are schematic diagrams of a semiconductor production line, and the accompanying drawings are schematic diagrams of a semiconductor production line. Figure 15 The load port 91 is a key device for the docking and exchange of the wafer box and the processing equipment. After thousands of process cycles, the horizontal surface 93 (surface) of the load port 91 (Load Port) and the vertical door 92 (gate) at the entrance will inevitably accumulate fine dust pollutants from the environment or self-operation. Dust is a key factor affecting the yield of wafers.

[0003] Therefore, in order to ensure the product yield, the cleanliness of the carrier needs to be maintained, and the carrier of the semiconductor processing equipment needs to be cleaned regularly. The existing cleaning methods mainly include manual cleaning, brush cleaning, and tray automatic cleaning. Manual cleaning currently mainly relies on the window period of equipment maintenance, and is manually cleaned by technical personnel. This method highly depends on manpower, is time-consuming and laborious, has low efficiency, is not conducive to the environment of the entire working condition, and cannot control the cleanliness of cleaning and ensure cleaning consistency. Other tray automatic cleaning devices have limited dust removal coverage, and can usually only clean the horizontal surface 93 (water platform surface) area. The vertical door 92 (gate) forms a cleaning dead angle that cannot be reached, cannot be cleaned, and becomes a place where dust is most likely to accumulate, resulting in limited application scenarios and inability to achieve effective dust removal in a true sense. SUMMARY

[0004] In order to solve the problems existing in the prior art, the purpose of the present application is to provide an automatic cleaning device for a semiconductor chip production carrier 91 (Load port) which is efficient, lossless, has no dead angle, and can maintain cleaning consistency. The automatic cleaning device can automatically clean the horizontal surface 93 (table surface) of the carrier port 91 and the area of the vertical door 92 (gate) at the entrance. Non-contact suspended positive and negative air duct cleaning is adopted, and the cleaning device realizes gas and electricity isolation and independent operation, thereby improving the stability and yield of product processing.

[0005] To achieve the above object, the present application adopts the following technical scheme: A composite robot-based ultrasonic dust removal device for the semiconductor industry comprises an AGV trolley, an installation frame is arranged on the AGV trolley, a bottom frame is arranged at the bottom of the installation frame, and the bottom frame is connected with the AGV trolley; A mechanical arm is arranged at the top of the installation frame, and an ultrasonic dust removal device is arranged at the free end of the mechanical arm away from the installation frame; The ultrasonic dust removal device comprises a dust removal head, a dust removal head bottom plate is arranged at the bottom of a dust removal head cavity, and the dust removal head and the dust removal head bottom plate are integrally formed; an air inlet cylinder is arranged at the top of the dust removal head cavity, a positive pressure cavity is arranged in the dust removal head cavity, the side walls around the positive pressure cavity are vertically arranged on the dust removal head bottom plate in the dust removal head cavity, a separation distance is arranged between the top plate of the positive pressure cavity and the top end of the dust removal head cavity, and the air inlet cylinder is connected with the positive pressure cavity. A separation distance is arranged between the outer walls around the positive pressure cavity and the inner walls of the dust removal head cavity, a negative pressure cavity is formed between the inner walls of the dust removal head cavity and the outer walls of the positive pressure cavity, the negative pressure cavity is arranged on the outer side of the positive pressure cavity and covers the positive pressure cavity, and the negative pressure cavity is arranged in the dust removal head cavity. A multi-stage pulse dust blowing slot is arranged in the dust removal head bottom plate of the ultrasonic dust removal device and penetrates the positive pressure cavity, first suction slots are arranged on the two sides of the multi-stage pulse dust blowing slot and penetrate the negative pressure cavity, and second suction slots are arranged at the two ends of the multi-stage pulse dust blowing slot and penetrate the negative pressure cavity. The negative pressure cavity in the dust removal head is connected with an air suction cylinder, and the first suction slots and the second suction slots (which are matched in pairs) are arranged at the bottom of the negative pressure cavity of the dust removal head bottom plate.

[0006] Further, in some embodiments, a multi-stage pulse dust blowing slot is arranged in the dust removal head bottom plate of the positive pressure cavity and penetrates the positive pressure cavity, the multi-stage pulse dust blowing slot comprises a two-stage expanded air channel cavity and a two-stage narrowed surface passage, and the multi-stage pulse dust blowing slot is sequentially provided with an air inlet interval D1, a first narrowed air channel interval D2, a first-stage expanded cavity interval D3 of the two-stage expanded air channel cavity, a second narrowed air channel interval D4, a second-stage expanded cavity interval D5 of the two-stage expanded air channel cavity, and a dust blowing interval D6 from top to bottom. The air interval of the multi-stage pulse dust blowing slot is: the air inlet interval D1, the first-stage expanded cavity interval D3 of the two-stage expanded air channel cavity, and the second-stage expanded cavity interval D5 of the two-stage expanded air channel cavity are the same (D1=D3=D5); the first narrowed air channel interval D2, the second narrowed air channel interval D4, and the dust blowing interval D6 are the same (D2=D4=D6), and the ratio of the air inlet interval D1 to the first narrowed air channel interval D2 is 1:1.5~2 (i.e. D1:D2=1:1.5~2).

[0007] Further, in some embodiments, the mechanical arm is a six-axis collaborative mechanical arm, a hanging frame is arranged on the ultrasonic dust removal device, and the ultrasonic dust removal device is arranged on the end of the mechanical arm through the hanging frame. The dust removal head is provided with an air suction cylinder, and the air suction cylinder is in through connection with the negative pressure cavity; the positive pressure cavity and the negative pressure cavity are independently arranged in the dust removal head cavity, and the positive pressure cavity and the negative pressure cavity are isolated from each other and not in through connection; The AGV trolley is provided with a laser radar; a camera module is arranged on the end effector of the mechanical arm (six-axis cooperation), and the camera module is arranged beside the dust removal head.

[0008] Further, in some embodiments, the double-stage expansion airway cavity adopts a square cavity chamber structure, and the width spacing D3 and the spacing D5 between the inner side walls of the square cavity chamber of the double-stage expansion airway cavity are the expansion cavity widths; Or the double-stage expansion airway cavity adopts a circular cavity chamber structure, and the width spacing D3 and the spacing D5 between the outer top ends of the circular arcs of the inner side walls of the circular cavity chamber of the double-stage expansion airway cavity are the expansion cavity widths; Or the double-stage expansion airway cavity adopts a trapezoidal cavity chamber structure, and the width spacing D3 and the spacing D5 of the lower bottom of the trapezoidal cavity chamber of the double-stage expansion airway cavity are the expansion cavity widths.

[0009] Further, in some embodiments, the bottom frame is provided with a negative pressure fan, the negative pressure fan is provided with a negative pressure high-efficiency filter on the upper surface, the negative pressure high-efficiency filter is arranged in the mounting frame, the negative pressure high-efficiency filter is connected with the air suction cylinder on the dust removal head through a pipeline, and the air outlet of the negative pressure fan is provided with a silencer.

[0010] Further, in some embodiments, a plurality of ring-shaped dust blowing slits are arranged in the middle concave circular table cavity of the bottom surface of the positive pressure cavity of the dust removal head bottom plate, and four slender dust blowing slits are arranged around the planar area outside the concave circular table cavity. The negative pressure cavity in the dust removal head is connected with the air suction cylinder, and the bottom of the negative pressure cavity of the dust removal head bottom plate is provided with a matching pair of first suction slits and second suction slits.

[0011] Further, in some embodiments, the ratio of the height of the positive pressure cavity to the height of the dust removal head cavity is 2 / 3~3 / 4:1; and the ratio of the air volume of the dust blowing slit to the air volume of the suction slit is 1:1.5~2. The ratio of the pressure of the dust blowing slit to the pressure of the suction slit is 8~12:1.

[0012] Further, in some embodiments, the dust removal head of the ultrasonic dust removal device includes a positive pressure chamber and a negative pressure chamber, the ultrasonic dust removal device is arranged at the end of the mechanical arm; the positive pressure fan, the negative pressure fan and the negative pressure high-efficiency filter are arranged on the bottom frame of the mounting frame, the negative pressure high-efficiency filter is arranged on the negative pressure fan, the negative pressure high-efficiency filter is connected with the air suction cylinder of the ultrasonic dust removal device through the pipeline, and the pipeline is arranged on the mechanical arm in sections through the clamping sleeve; the positive pressure fan is arranged beside the negative pressure fan, the positive pressure fan is connected with the bottom frame through the support frame, and the positive pressure fan is connected with the air inlet cylinder of the ultrasonic dust removal device through the pipeline.

[0013] Further, in some embodiments, the ultrasonic dust removal device is arranged at the end of the mechanical arm, the positive pressure fan is embedded in the dust removal head of the ultrasonic dust removal device, the positive pressure fan is arranged on the top plate of the positive pressure chamber of the dust removal head, the air outlet of the positive pressure fan is in communication connection with the positive pressure chamber of the dust removal head, and the air inlet of the positive pressure fan is in communication connection with the air inlet cylinder on the top of the dust removal head. The negative pressure high-efficiency filter and the negative pressure fan are arranged on the bottom frame, the negative pressure high-efficiency filter is arranged on the negative pressure fan, the negative pressure high-efficiency filter is connected with the air suction cylinder of the ultrasonic dust removal device through the pipeline, and the pipeline is fixed on the mechanical arm in sections through the clamping sleeve.

[0014] Further, in some embodiments, the ultrasonic dust removal device is arranged at the end of the mechanical arm, the positive pressure fan is embedded in the dust removal head of the ultrasonic dust removal device, the positive pressure fan is arranged on the top plate of the positive pressure chamber of the dust removal head, the air outlet of the positive pressure fan is in communication connection with the positive pressure chamber of the dust removal head, and the air inlet of the positive pressure fan is in communication connection with the air inlet cylinder on the top of the dust removal head.

[0015] The application adopts a non-contact dust removal head for cleaning and an automatic cleaning device. The application cleans the carrier horizontal plane 93 (carrier surface) and the vertical door 92 (gate) at the wafer entry door, can clean the inclined surface of individual carriers, meets more extensive dust removal needs, and greatly increases the application range.

[0016] There are hundreds or thousands of wafer processing carriers (positions) in the working environment. An AGV (intelligent transport robot) mobile system is arranged in the working environment. The cleaning equipment of the application is moved to the corresponding wafer box transport position, the moving dust removal head 38 is controlled by the collaborative mechanical arm 14 to perform cleaning. After cleaning of a working position is completed, the AGV trolley (AGV system) transports the cleaning equipment of the application to the next idle working position. Only the working position route map is needed, and the idle working positions are cleaned one by one.

[0017] The application solves the problem of low efficiency of manual cleaning of fine dust, and provides a dust removal head structure capable of generating high-frequency high-speed pulse airflow and wind curtain barrier. The high-frequency high-speed fluctuating airflow is generated by self-oscillation of the cavity in the multi-stage pulse dust blowing slot (variable cross-section channel), and the fine dust is blown up. The wind curtain is formed by the suction slot around the dust removal head, and the dust is sucked to prevent the dust from escaping into the air. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The application is a three-dimensional schematic diagram of an embodiment of the application; Figure 2 The application is a structural schematic diagram of the dust removal head bottom plate part embodiment one; Figure 3 The application is a structural schematic diagram of the mechanical arm part of the embodiment; Figure 4 The application is a structural schematic diagram of the dust removal head bottom plate part embodiment two; Figure 5 The application is an airflow schematic diagram of the dust removal head bottom plate part embodiment two; Figure 6 The application is a three-dimensional schematic diagram of the mechanical arm part of the embodiment; Figure 7 The application is a structural schematic diagram of the embodiment; Figure 8 The application is a structural schematic diagram of the multi-stage pulse dust blowing slot part embodiment I; Figure 9 The application is a structural schematic diagram of the multi-stage pulse dust blowing slot part embodiment II; Figure 10 The application is a structural schematic diagram of the multi-stage pulse dust blowing slot part embodiment III; Figure 11 The application is a three-dimensional schematic diagram of the ultrasonic dust removal device part embodiment A; Figure 12 The application is a structural schematic diagram of the ultrasonic dust removal device part embodiment B; Figure 13 The application is a structural schematic diagram of the ultrasonic dust removal device part embodiment C; Figure 14 The application is an airflow schematic diagram of the dust removal head bottom plate part embodiment one; Figure 15 The application is a structural schematic diagram of the carrier port. DETAILED DESCRIPTION

[0019] It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other in the case of no conflict. In order to further understand the features, technical means and specific purposes and functions of the present application, the advantages and spirits of the present application are analyzed, and further understanding can be obtained through the following description of the present application in combination with the accompanying drawings and specific embodiments.

[0020] It should be noted that when a component is referred to as "fixed to" or "provided on" another component, it can be directly on another component or there can be a middle component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there can be a middle component. The terms "vertical", "horizontal", "front", "back" and similar expressions used herein are for illustrative purposes only and are not the only embodiment.

[0021] The present application adopts a non-contact suspension + air-electric isolation design, blows dust through fluctuating air flow → wind curtain barrier (negative pressure suction) to close the dust removal working space; a negative pressure fan 29 (suction fan, negative pressure air source) is provided with a negative pressure high efficiency filter 28 to filter dust (high efficiency); a positive pressure fan 39 provides a positive pressure air source without external air source; in addition, a battery is used for power supply without external power supply.

[0022] Please refer to the drawings, the dust removal head 38 (blowing and sucking head) of the present application is cleaned by the intermediate multi-stage pulse dust blowing seam 31 for blowing and cleaning, and the surrounding suction seam (first suction seam 32, second suction seam 33) for suction; the dust removal head 38 is suspended on the carrier port 91 without contact, the intermediate multi-stage pulse dust blowing seam 31 blows and the surrounding suction seam sucks, so that the dust cannot be exposed, the four sides of the negative pressure suction (suction seam) cannot leak air, and the dust can be prevented from floating out.

[0023] Further, in one of the embodiments, the dust removal head 38 has one suction seam around each side, and the gap width of the suction seam is greater than the width of the dust blowing seam. The wind blown by the intermediate multi-stage pulse dust blowing seam 31 of the dust removal head 38 (working gun) will spread to both sides, one suction seam (wind curtain) is arranged on each side of the four sides, and then the dust is sucked away; the four suction seams form a suction wind curtain; the dust is prevented from spreading out of the dust blowing gun, the cleaning efficiency is improved, and the degree of automation of the equipment is improved.

[0024] The present application solves the problems of damaging the surface of the carrier and generating static electricity, and provides a non-contact suspension + air-electric isolation design scheme to realize that the structure of the dust removal head 38 of the present application is suspended on the production carrier 91 (Loadport) without contact with the surface of the production carrier 91, so as to avoid the risk of damaging the surface of the carrier.

[0025] Further, in one embodiment, the application solves the problem of small cleaning area, provides a six-axis collaborative robot 14 carrying dust removal head 38 movement scheme, see FIG. 1 Figure 3 , FIG. 1 Figure 6 , by moving the dust removal head 38 through the multi-joint linkage of the robot 14 to the vertical door 92 (dust removal range) and horizontal surface 93 (dust removal range) area of the carrier port 91, to realize the coverage cleaning of the vertical door 92 and horizontal surface 93 area of the carrier port 91.

[0026] The application solves the problem of cleaning dead angle. In the first embodiment of the dust removal head bottom plate 22, see FIG. 2 Figure 2 , FIG. 2 Figure 2 is a concave structure of the dust removal head bottom plate 22, by improving the ultrasonic dust removal device 21, providing a concave round table cavity 36 structure of the dust removal head bottom plate 22 (bottom surface) inwardly recessed positive pressure air outlet area, see FIG. 3 Figure 14 , FIG. 3 Figure 14 is a schematic diagram of the airflow of the first embodiment of the dust removal head bottom plate 22, to realize the cleaning of the nail and other cleaning dead angles.

[0027] The application solves the problem of cleaning consistency, provides an AGV + collaborative robot composite robot automatic device design, by adopting a programmed cleaning process, to realize that the motion trajectory and action time of each cleaning operation remain highly consistent on each carrier, fundamentally eliminating the randomness of manual cleaning.

[0028] , FIG. 4 Figure 7 , FIG. 4 Figure 7 is a schematic diagram of the overall structure of the application, the application includes an AGV trolley 11 (intelligent handling robot Automated Guided Vehicle), the AGV trolley 11 is a carrying mechanism of the equipment, the AGV trolley 11 is provided with a mounting frame 12, the bottom of the mounting frame 12 is provided with a bottom frame 18, and the bottom frame 18 is connected with the AGV trolley 11 through bolts.

[0029] Further, in one embodiment, the mounting frame 12 is provided with a robot 14 at the top, the robot 14 is a six-axis collaborative robot, and the free end of the robot 14 (six-axis cooperation) away from the mounting frame 12 is provided with an ultrasonic dust removal device 21 (working gun); The negative pressure assembly is installed on the bottom frame 18, the bottom frame 18 is provided with a negative pressure fan 29, the negative pressure fan 29 is provided with a negative pressure high efficiency filter 28, the negative pressure high efficiency filter 28 is arranged in the mounting frame 12, and the mounting frame 12 is also provided with an embedded controller, a battery and the like.

[0030] Further, in one of the embodiments, a negative pressure high efficiency filter 28 is provided below the negative pressure fan 29 (suction fan) connected to the bottom frame 18 through the support frame; the outer side of the negative pressure fan 29 is provided with a negative pressure fan 29 air inlet shell, the top of the negative pressure fan 29 is provided with a negative pressure fan 29 air outlet shell, and the negative pressure high efficiency filter 28 is connected to the air suction cylinder 23 on the dust removal head 38 (blow and suction head) through the pipeline 16. The air outlet of the negative pressure fan 29 is provided with a silencer 42. The camera module 15 is arranged on the end effector of the mechanical arm 14 (six-axis cooperation), placed beside the dust removal head 38, and the overall device structure is as shown in the accompanying Figure 2

[0031] The AGV trolley 11 (module) has the ability of omni-directional driving, autonomous positioning, navigation and intelligent path planning; the laser radar 13 is arranged on the AGV trolley 11, the laser radar 13 has a 30m laser detection distance, and is agile in obstacle avoidance and suitable for human-machine mixed operation; the vision positioning system is matched, the position accuracy is + / - 5mm; the low power warning, intelligent path planning and autonomous charging can be realized by using the matched charging pile; the body is ESD (electrostatic discharge), and does not need a guardrail and stops by external force.

[0032] Further, in one of the embodiments, the dust removal module includes an ultrasonic dust removal device 21, a positive pressure fan 39, a negative pressure fan 29 and a negative pressure high efficiency filter 28; the ultrasonic dust removal device 21 includes a dust removal head 38, the bottom of the cavity of the dust removal head 38 is provided with a dust removal head bottom plate 22, the dust removal head 38 is integrally formed with the dust removal head bottom plate 22, and the top end of the cavity of the dust removal head 38 is provided with a frame sealing cover; the top of the cavity of the dust removal head 38 is provided with an air inlet cylinder 24, the air inlet cylinder 24 at the top end of the cavity of the dust removal head 38 is provided with a frame sealing cover, and a positive pressure cavity 27 (positive pressure chamber) is arranged in the cavity of the dust removal head 38; the side wall around (periphery) of the positive pressure cavity 27 is vertically arranged on the dust removal head bottom plate 22 in the cavity of the dust removal head 38, the top plate 26 (top end) of the positive pressure cavity is provided with a separation distance from the top end of the cavity of the dust removal head 38, and the air inlet cylinder 24 is connected with the positive pressure cavity 27; further, a space separation distance is arranged between the outer wall around the positive pressure cavity 27 and the inner wall of the cavity of the dust removal head 38, and the space between the inner wall of the cavity of the dust removal head 38 and the outer wall of the positive pressure cavity 27 forms a negative pressure cavity 25, the negative pressure cavity 25 is arranged on the outer side around the positive pressure cavity 27 and covers the positive pressure cavity 27, and the negative pressure cavity 25 is arranged in the cavity of the dust removal head 38; As shown in the accompanying Figure 2 , the dust removal head bottom plate 22 of the present application is shown in the accompanying Figure 14 ​​In the first embodiment: a plurality of multi-stage pulse dusting slits 31 (vertical dusting ports) and a plurality of annular dusting slits 35 (annular dusting ports) are arranged in the middle concave circular table cavity 36 (recessed area) of the positive pressure cavity 27 bottom surface of the dust head bottom plate 22. Four slender dusting slits 34 are arranged around the planar area outside the concave circular table cavity 36. The negative pressure cavity 25 in the dust removal head 38 is connected to the suction duct 23 (suction port), and the bottom of the negative pressure cavity 25 of the dust head bottom plate 22 is provided with a matching pair of first suction slit 32 and second suction slit 33 (four slender suction slits), as shown in the accompanying drawings. Figure 14

[0033] Further, in one of the embodiments, the dust removal head 38 is provided with a suction duct 23, which is connected to the negative pressure cavity 25; the positive pressure cavity 27 and the negative pressure cavity 25 are arranged in the cavity of the dust removal head 38, and are isolated from each other and do not penetrate each other; the height ratio of the positive pressure cavity 27 to the height of the cavity of the dust removal head 38 is 2 / 3~3 / 4:1; the ultrasonic dust removal device 21 is provided with a hanging rack, and the hanging rack of the ultrasonic dust removal device 21 is arranged on the collaborative robot arm 14; the air volume relationship: the air volume ratio of the dusting slit (air blowing gap) to the suction slit (air suction gap) is 1:1.5~2; the pressure relationship: the pressure ratio of the dusting slit to the suction slit is 8~12:1.

[0034] Referring to the accompanying drawings Figure 4 , the dust head bottom plate 22 of the present application is shown in the second embodiment: Figure 5 Referring to the accompanying drawings , the dust head bottom plate 22 of the present application is shown in the second embodiment: Figure 5 Referring to the accompanying drawings Figure 5 , the dust head bottom plate 22 of the present application is shown in the second embodiment:

[0035] Referring to the accompanying drawings Figure 8 ​As shown in the schematic diagram of the multi-stage pulse dust blowing slit 31, the bottom plate 22 (bottom surface) of the dust collector head of the positive pressure chamber 27 is provided with a through multi-stage pulse dust blowing slit 31. The multi-stage pulse dust blowing slit 31 includes a double-stage expansion airway cavity 47 (secondary cavity) and a two-stage narrowing surface channel. The multi-stage pulse dust blowing slit 31 is provided with the following structures in sequence from top to bottom (from inside to outside): air inlet spacing D1, first narrowing airway spacing D2, first stage expansion cavity spacing D3 of the double-stage expansion airway cavity 47, second narrowing airway spacing D4, second stage expansion cavity spacing D5 of the double-stage expansion airway cavity 47, and dust blowing spacing D6 (air outlet spacing).

[0036] Furthermore, in one embodiment, the air gap spacing on the multi-stage pulse dust blowing slit 31 is as follows: the inlet air gap D1, the first-stage expansion cavity spacing D3 of the dual-stage expansion airway cavity 47, and the second-stage expansion cavity spacing D5 of the dual-stage expansion airway cavity 47 are the same (D1=D3=D5); the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing spacing D6 are the same (D2=D4=D6), and the spacing D1:D2 ratio is 1:1.5~2 (D1:D2=1:1.5~2), and the airflow passes through D1→D 2→D3→D4→D5→D6, the air duct oscillates from wide at D1 to narrow at D2, from wide at D3 to narrow at D4, from wide at D5 to narrow at D6. When the airflow enters the wide air duct from the narrow air duct, the airflow on both sides of the air duct develops into a free shear flow, forming a large vortex at the wide air duct. The main airflow continues to flow downward and merges with the airflow in the wide air duct at the duct opening and continues to move downward, resulting in a high-frequency, high-speed pulsed airflow. The airflow pulse frequency reaches the ultrasonic frequency, and the air outlet of the multi-stage pulse dust blowing slit 31 (dust blowing distance D6) performs impact dust blowing and sweeping.

[0037] Example 1: Multi-stage pulse dust blowing slit 31 cavity structure See appendix Figure 8 As shown, attached Figure 8 This is a schematic diagram of the design scheme of the cavity structure of the multi-stage pulse dust blowing slit 31 in embodiment (i). The dual-stage expansion airway cavity 47 adopts a square cavity structure. The square cavity has clear edges and walls, which is conducive to the formation of a stable separation zone and promotes the development of the shear layer. The width of the square cavity of the dual-stage expansion airway cavity 47 is shown in the attached diagram. Figure 8 The spacing D3 and D5 of the mid-section structure expands the cavity width (spacing), enhances the periodic generation and collision of the vortex ring, and is the best solution to achieve high-intensity and high-stability pulse jets.

[0038] Example 2 of the multi-stage pulse dust blowing slit 31 cavity structure: See appendix Figure 9 As shown, the dual-stage expansion airway cavity 47 adopts a circular cavity structure, providing a solution that emphasizes energy efficiency and stability; the width of the circular cavity of the dual-stage expansion airway cavity 47 (see attached diagram).Figure 9 The spacing D3 and D5 of the mid-section structure is the width of the expanded cavity (spacing). The streamlined inner wall of the circular cavity minimizes the local energy loss caused by flow separation and vortex generation, allowing for smoother airflow. Under the same input power, this structure can achieve higher overall flow efficiency, which helps to reduce the energy consumption of the system.

[0039] Example 3 of the multi-stage pulse dust blowing slit 31 cavity structure: See appendix Figure 10 As shown, the dual-stage expansion airway cavity 47 adopts a trapezoidal cavity structure, providing an alternative suitable for specific scenarios; the width of the lower base of the trapezoidal cavity of the dual-stage expansion airway cavity 47 (see attached diagram). Figure 11 The trapezoidal bottom spacing (D3, D5) of the mid-section structure expands the cavity width (spacing). The trapezoidal cavity can induce strong, transient flow separation, establish initial oscillations more quickly, and achieve rapid response. In space-constrained applications, the trapezoidal structure allows for a more compact nozzle layout.

[0040] As described in the above examples, this application greatly enhances the adaptability of its dust removal device by providing a variety of optional cavity structures (dual-stage expansion airway cavity 47). Users can flexibly select a suitable solution based on a comprehensive consideration of dust removal efficiency, energy consumption level, and specific operating conditions, overcoming the shortcomings of the single solution in existing technologies.

[0041] To address different spatial and dust removal needs, this application provides three structural design schemes for ultrasonic dust removal devices 21.

[0042] Example A of ultrasonic dust removal device 21: See appendix Figure 11 The illustrated embodiment A separates the ultrasonic dust removal device 21 from the positive pressure fan 39 and the negative pressure fan 29, thereby minimizing the size of the ultrasonic dust removal device 21 at the end of the robotic arm 14 and maximizing its dust removal flexibility. The dust removal head 38 of the ultrasonic dust removal device 21 includes a positive pressure chamber 27 and a negative pressure chamber 25, and is installed at the end of the robotic arm 14. The positive pressure fan 39, the negative pressure fan 29, and the negative pressure high-efficiency filter 28 are placed on the bottom frame 18 of the mounting frame 12. The negative pressure high-efficiency filter 28 is installed on the negative pressure fan 29 and is connected to the exhaust duct 23 on the ultrasonic dust removal device 21 via a conduit 16. The conduit 16 is segmented and mounted on the robotic arm 14 via sleeves 17. The positive pressure fan 39 is placed next to the negative pressure fan 29 and connected to the bottom frame 18 via a support frame. It is also connected to the air inlet duct 24 on the ultrasonic dust removal device 21 via the conduit 16.

[0043] Example B of Ultrasonic Dust Removal Device 21: See appendix Figure 12The embodiment B shown, embodiment B is the application of built-in positive pressure integrated dust removal structure, the positive pressure fan 39 and ultrasonic dust removal device 21 are fused into a module, to realize the reduction of the required power of positive pressure fan 39 and the length of pipe 16. The design can significantly reduce the energy loss of airflow from the positive pressure fan 39 to the air outlet of the dust removal head 38 (multi-stage pulse dust blowing seam 31). See attached Figure 4 As shown in the attached Figure 4 The structure of ultrasonic dust removal device 21 of embodiment B is shown in the attached Figure 12 As shown in the attached Figure 12 The connection architecture of embodiment B is shown in the attached

[0044] The airflow gap design of ultrasonic dust removal device 21 of embodiment B is shown in the attached Figure 5 As shown in the attached Figure 5 The structure of ultrasonic dust removal device 21 of embodiment B is shown in the attached

[0045] Ultrasonic dust removal device 21 embodiment C: As shown in the attached Figure 13The embodiment C is an integrated scheme of built-in positive and negative pressure. The negative pressure fan 29, the positive pressure fan 39 (embedded in the dust removal head 38) and the ultrasonic dust removal device 21 are installed as a module to reduce the power required by the positive pressure fan 39 and the negative pressure fan 29 and the length of the conduit 16. Because the air flow transmission distance between the positive pressure fan 39, the negative pressure fan 29 and the dust removal head 38 is reduced, the air flow loss rate is reduced. The ultrasonic dust removal device 21 is installed at the end of the mechanical arm 14, the positive pressure fan 39 is embedded in the dust removal head 38 of the ultrasonic dust removal device 21 and connected with the positive pressure cavity 27 of the dust removal head, the negative pressure fan 29 is arranged on the outer wall of the dust removal head 38 through the hanger 41, the air inlet of the negative pressure fan 29 is connected with the air suction cylinder 23 of the dust removal head 38, and the air outlet of the negative pressure fan 29 is provided with the silencer 42.

[0046] The above three schemes have different effects on the volume of the ultrasonic dust removal device 21 at the end of the mechanical arm 14, the power required by the fan and the energy loss during dust removal due to different structures. The corresponding structure scheme can be selected according to the specific space requirement and the dust removal energy consumption requirement.

[0047] The above embodiments are described in detail and in detail, which are only product examples of the present application and only express several embodiments of the present application, and should not be understood as a limitation. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, by referring to the disclosure of the specification and examples in this paper, several modifications and improvements of the present application can be made, other embodiments of the present application will be obvious, which all belong to the protection scope of the present application. That is, the specification and examples should not be understood as exemplary, and the true scope and spirit of the present application are indicated by the appended claims.

Claims

1. An ultrasonic dust removal device based on a composite robot for the semiconductor industry, comprising: An AGV trolley (11) is provided with an installation frame (12), and a bottom frame (18) is provided at the bottom of the installation frame (12), which is connected to the AGV trolley (11). The feature is that a robotic arm (14) is provided on the top of the mounting frame (12), and an ultrasonic dust removal device (21) is provided at the free end of the robotic arm (14) away from the mounting frame (12). The ultrasonic dust removal device (21) includes a dust removal head (38), a dust removal head base plate (22) is provided at the bottom of the dust removal head (38) cavity, and the dust removal head (38) and the dust removal head base plate (22) are integrally formed; an air inlet duct (24) is provided at the top of the dust removal head (38) cavity, a positive pressure chamber (27) is provided in the dust removal head (38) cavity, the four sides of the positive pressure chamber (27) are vertically arranged from the dust removal head base plate (22) in the dust removal head (38) cavity, the top plate (26) of the positive pressure chamber is provided with a separation gap from the top of the dust removal head (38) cavity, and the air inlet duct (24) is connected to the positive pressure chamber (27). An empty space is provided between the outer wall of the positive pressure chamber (27) and the inner wall of the dust removal head (38) cavity. The space between the inner wall of the dust removal head (38) cavity and the outer wall of the positive pressure chamber (27) forms a negative pressure chamber (25). The negative pressure chamber (25) is located outside the periphery of the positive pressure chamber (27) and covers the positive pressure chamber (27). The negative pressure chamber (25) is located in the cavity of the dust removal head (38). The bottom plate (22) of the dust removal head of the ultrasonic dust removal device (21) is provided with a multi-stage pulse dust blowing slit (31) that communicates with the positive pressure chamber (27). The first suction slit (32) that communicates with the negative pressure chamber (25) is provided on both sides of the multi-stage pulse dust blowing slit (31). The second suction slit (33) that communicates with the negative pressure chamber (25) is provided at both ends of the multi-stage pulse dust blowing slit (31). The negative pressure chamber (25) in the dust removal head (38) is connected to the exhaust duct (23), and the first suction slit (32) and the second suction slit (33) are opened at the bottom of the negative pressure chamber (25) of the dust removal head base plate (22).

2. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The bottom plate (22) of the dust collector head of the positive pressure chamber (27) is provided with a through multi-stage pulse dust blowing slit (31). The multi-stage pulse dust blowing slit (31) includes a double-stage expansion airway cavity (47) and a two-stage narrowing surface channel. The multi-stage pulse dust blowing slit (31) is provided with an air gap spacing of varying D1, a first narrowing airway spacing D2, a first-stage expansion cavity spacing D3, a second narrowing airway spacing D4, a second-stage expansion cavity spacing D5, and a dust blowing spacing D6 from top to bottom. The air gap spacing on the multi-stage pulse dust blowing slit (31) is the same as: the air inlet spacing D1, the first stage expansion cavity spacing D3 of the dual-stage expansion airway cavity (47), and the second stage expansion cavity spacing D5 of the dual-stage expansion airway cavity (47); the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing spacing D6 are the same, and the ratio of air inlet spacing D1 to first narrowing airway spacing D2 is 1:1.5~2.

3. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The robotic arm (14) is a six-axis collaborative robotic arm. The ultrasonic dust removal device (21) is equipped with a hanging frame and is mounted on the end of the robotic arm (14) through the hanging frame. The top of the dust collector head (38) is provided with an exhaust duct (23), which is connected to the negative pressure chamber (25); the positive pressure chamber (27) and the negative pressure chamber (25) are respectively independently set in the cavity of the dust collector head (38), and the positive pressure chamber (27) and the negative pressure chamber (25) are isolated from each other and do not communicate with each other; The AGV (11) is equipped with a lidar (13); the end effector of the robotic arm (14) is equipped with a camera module (15), which is located next to the dust removal head (38).

4. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 2, characterized in that, The dual-stage expansion airway cavity (47) adopts a square cavity structure, and the width spacing D3 and spacing D5 between the inner sidewalls of the square cavity of the dual-stage expansion airway cavity (47) is the width of the expansion cavity. Alternatively, the dual-stage expansion airway cavity (47) adopts a circular cavity structure, and the width spacing D3 and spacing D5 between the outer top of the circular arc of the inner wall of the dual-stage expansion airway cavity (47) is the width of the expansion cavity. Alternatively, the dual-stage expansion airway cavity (47) adopts a trapezoidal cavity structure, and the bottom width spacing D3 and spacing D5 of the trapezoidal cavity of the dual-stage expansion airway cavity (47) is the width of the expansion cavity.

5. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The bottom frame (18) is equipped with a negative pressure fan (29), and a negative pressure high-efficiency filter (28) is provided on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is set in the mounting frame (12). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the dust removal head (38) through the conduit (16). The air outlet of the negative pressure fan (29) is equipped with a silencer (42).

6. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The bottom surface of the positive pressure chamber (27) of the dust collector head base plate (22) has a concave truncated cone cavity (36) with a multi-stage pulse dust blowing slit (31) and a number of annular dust blowing slits (35) in the ring group. Four slender dust blowing slits (34) are opened around the planar area outside the concave truncated cone cavity (36) of the bottom surface of the positive pressure chamber (27). The four slender dust blowing slits (34) surround the planar area outside the concave truncated cone cavity (36). The negative pressure chamber (25) in the dust removal head (38) is connected to the exhaust duct (23). The bottom of the negative pressure chamber (25) of the dust removal head base plate (22) is provided with a first suction slit (32) and a second suction slit (33) for matching pairs.

7. An ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The ratio of the height of the positive pressure chamber (27) to the height of the dust collector head (38) is 2 / 3 to 3 / 4:1; The ratio of air volume at the dust blowing gap to that at the suction gap is 1:1.5~2; The ratio of the pressure at the dust blowing gap to the pressure at the suction gap is 8~12:

1.

8. An ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The dust removal head (38) of the ultrasonic dust removal device (21) includes a positive pressure chamber (27) and a negative pressure chamber (25). The ultrasonic dust removal device (21) is located at the end of the robotic arm (14). The positive pressure fan (39), the negative pressure fan (29), and the negative pressure high-efficiency filter (28) are located on the bottom frame (18) of the mounting frame (12). The negative pressure high-efficiency filter (28) is located on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the ultrasonic dust removal device (21) through the conduit (16). The conduit (16) is set on the robotic arm (14) in sections through the sleeve (17). The positive pressure fan (39) is located next to the negative pressure fan (29). The positive pressure fan (39) is connected to the bottom frame (18) through the support frame. The positive pressure fan (39) is connected to the air inlet duct (24) on the ultrasonic dust removal device (21) through the conduit (16).

9. An ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The ultrasonic dust removal device (21) is located at the end of the robotic arm (14). The positive pressure fan (39) is embedded in the ultrasonic dust removal device (21). The positive pressure fan (39) is located on the top plate (26) of the positive pressure chamber of the dust removal head (38). The outlet of the positive pressure fan (39) is connected to the positive pressure chamber (27) of the dust removal head. The inlet of the positive pressure fan (39) is connected to the air inlet tube (24) at the top of the dust removal head (38). The negative pressure high-efficiency filter (28) and the negative pressure fan (29) are set on the bottom frame (18). The negative pressure high-efficiency filter (28) is set on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the ultrasonic dust removal device (21) through the conduit (16). The conduit (16) is fixed in sections on the robotic arm (14) through the sleeve (17).

10. An ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The ultrasonic dust removal device (21) is located at the end of the robotic arm (14). The positive pressure fan (39) is embedded in the dust removal head (38) of the ultrasonic dust removal device (21). The positive pressure fan (39) is connected to the positive pressure chamber (27) of the dust removal head. The negative pressure fan (29) is installed on the outer wall of the dust removal head (38) through the bracket (41). The air inlet of the negative pressure fan (29) is connected to the exhaust duct (23) of the dust removal head (38). The air outlet of the negative pressure fan (29) is equipped with a silencer (42).

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