A single crystal silicon wafer processing clamp

Through a tiered clamping design and modular drive unit, precise clamping of monocrystalline silicon wafers of different thicknesses is achieved, solving the problems of poor adaptability and damage risk of existing fixtures, improving processing accuracy and efficiency, and making it suitable for automated production lines.

CN121374883BActive Publication Date: 2026-05-12JIANGSU CINO SEMICON TECH CO LTD
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Patent Information

Application Number
CN202511904055.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-12-17
Publication Date
2026-05-12
Estimated Expiration
2045-12-17

AI Technical Summary

Technical Problem

Existing single-crystal silicon wafer processing fixtures have poor adaptability and cannot accommodate silicon wafers of different thicknesses. Furthermore, the wafer edges are prone to chipping or scratching during clamping, making it difficult to meet the high-efficiency processing requirements of automated production lines.

Method used

The device employs a tiered clamping design, which uses a drive unit and clamping components within the mounting ring to achieve precise clamping of silicon wafers of different thicknesses. This includes a modular layout of primary and secondary clamping components, combined with vacuum adsorption and mechanical clamping to ensure clamping stability and accuracy.

Benefits of technology

It expands the applicability of the fixture, reduces the risk of silicon wafer damage, improves processing accuracy and efficiency, adapts to automated processing procedures, and reduces operational complexity and maintenance costs.

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Abstract

The application discloses a single crystal silicon wafer processing clamp, and relates to the technical field of single crystal silicon processing, which comprises a mounting ring, a driving gear ring, a primary clamp assembly, a guide, a secondary clamp assembly and a driving unit. The mounting ring serves as a bearing base, the top of the mounting ring is provided with the driving gear ring, the inner ring is provided with the primary clamp assembly, the outer wall is fixedly connected with the guide, the guide is internally provided with the secondary clamp assembly, and the driving unit is internally provided with a built-in driving unit which is connected with the two-stage clamp through the mounting ring. For different thicknesses of silicon wafers, thin silicon wafers are clamped by the silicon wafer clamping plate through the driving motor one and the driving gear ring and the inclined push head; thick silicon wafers are clamped by the silicon wafer clamping arm after being centered by the driving motor two and the driving ring and the centering arm, and are clamped by the silicon wafer clamping arm. The clamp integrates the grading clamping and the precise guide structure, has the protection design, is high in adaptability, accurate in clamping, can avoid damage to the silicon wafer, is suitable for automatic processing, and improves the processing efficiency and the qualified rate.
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