Design method and system of capsule liquid crystal dimming film

Abstract

The invention relates to the technical field of material design, and discloses a design method and system for a capsule liquid crystal dimming film, and the method comprises the steps: obtaining a basic performance index of a design material corresponding to the capsule liquid crystal dimming film, constructing a preliminary design architecture of the design material, carrying out the spatial distribution optimization of the preliminary design architecture, and obtaining a preliminary optimization architecture; determining material matching parameters of the design material, and performing optical simulation on the design material to determine the optical performance of the design material; constructing an electrode layout and a circuit topological structure of the design material, and constructing a design scheme of the design material based on the electrode layout and the circuit topological structure; and performing packaging simulation on the design material to obtain simulated material performance, and performing material packaging on the design material when an evaluation value of performance index evaluation meets a preset value. The quality of the capsule liquid crystal dimming film can be improved.

Description

Technical Field

[0001] This invention relates to a design method and system for a capsule liquid crystal dimming film, belonging to the field of materials design technology. Background Technology

[0002] Capsule liquid crystal dimming film is a new type of material that can dynamically adjust light transmittance. It controls the passage and obstruction of light by changing the arrangement of liquid crystal molecules. It plays a key role in privacy protection, energy saving and temperature control, and display optimization, and has wide applications in modern architecture, automobiles, electronic displays and other fields.

[0003] Currently, the design and fabrication of capsule liquid crystal dimming films typically involve encapsulating liquid crystal materials within tiny capsule structures, then laminating them with a transparent substrate, and finally using electrodes to drive the dimming function. For example, in architectural glass applications, by sandwiching a capsule liquid crystal dimming film between two layers of glass, the glass can transition from transparent to frosted state when electricity is applied. However, this method cannot simultaneously meet user dimming needs while ensuring the uniformity and stability of the capsule structure. It is prone to problems such as leakage and capsule rupture during use, affecting the dimming effect and lifespan, resulting in a low utilization rate of the capsule liquid crystal dimming film. Summary of the Invention

[0004] This invention provides a design method and system for capsule liquid crystal dimming films, the main purpose of which is to improve the quality of capsule liquid crystal dimming films.

[0005] To achieve the above objectives, the present invention provides a design method for a capsule liquid crystal dimming film, comprising: The basic performance indicators of the design material corresponding to the capsule liquid crystal dimming film are obtained. Based on the basic performance indicators, a preliminary design architecture of the design material is constructed. Based on the preliminary design architecture, finite element analysis is performed on the design material to determine the mechanical properties of the design material. Based on the mechanical properties, the spatial distribution of the preliminary design architecture is optimized to obtain a preliminary optimized architecture. Multiphysics coupling analysis is performed on the preliminary optimized architecture to determine the material matching parameters of the design material. Based on the material matching parameters, optical simulation is performed on the design material to determine the optical performance of the design material. Based on the optical performance, the encapsulation material of the design material is configured, and the electric field interaction analysis is performed on the encapsulation material and the design material to determine the molecular response time and molecular stability when the design material is encapsulated using the encapsulation material. Using the molecular response time and molecular stability, the electrode layout and circuit topology of the design material are constructed, and the design scheme of the design material is constructed based on the electrode layout and circuit topology. According to the design scheme, the design material is encapsulated and simulated to obtain simulated process parameters. Based on the simulated process parameters, the design material is performance-mapped to obtain simulated material performance. The simulated material performance is evaluated by performance indicators. When the evaluation value of the performance indicators meets the preset value, the design material is encapsulated according to the design scheme.

[0006] Optionally, the step of performing finite element analysis on the design material based on the preliminary design architecture to determine the mechanical properties of the design material includes: The preliminary design architecture is reconstructed using a three-dimensional model parametric method to obtain a parametric model. The parameterized model is adaptively meshed to obtain a finite element mesh model; Material properties are assigned to each mesh in the finite element mesh model to obtain the assigned mesh model; Using the assigned mesh model, the stress-strain field of the designed material is constructed; The mechanical properties of the designed material are analyzed using the stress-strain field.

[0007] Optionally, the step of optimizing the spatial distribution of the preliminary design architecture based on the mechanical properties to obtain a preliminary optimized architecture includes: The mechanical properties are parameterized to obtain a set of quantized parameters; Using the set of quantized parameters, the preliminary design architecture is capsule-deployed to obtain the capsule deployment architecture; The capsule distribution weights of the capsule points in the capsule deployment architecture are calculated using the following formula: ; in, This represents the capsule distribution weight, where n represents the number of capsule nodes in the capsule deployment architecture. This represents the interpolation coefficient for high-stress capsule point i in the capsule deployment architecture. ( ) represents the Gaussian kernel function. This represents the spatial coordinates of a capsule point in a capsule deployment architecture. This represents the spatial coordinates of the high-stress capsule point i in the capsule deployment architecture; Based on the capsule distribution weights, the distribution of capsule points in the capsule deployment architecture is optimized to obtain a preliminary optimized architecture.

[0008] Optionally, the step of performing multiphysics coupling analysis on the preliminary optimized architecture to determine the material matching parameters of the design material includes: The electric field, temperature field, and mechanical field simulations were performed on the preliminary optimized architecture to obtain the simulated physical field architecture. Identify the interaction relationships of the multiphysics fields in the simulated physics architecture; Based on the aforementioned interaction relationship, a multiphysics coupling model of the preliminary optimized architecture is constructed; The target physical field is obtained by setting physical field boundary conditions for the multiphysics coupling model. Finite volume analysis is performed on the target physical field to obtain the physical coupling parameters; Based on the physical coupling parameters, the material matching parameters of the design material are determined.

[0009] Optionally, the step of performing optical simulation on the designed material based on the material matching parameters to determine the optical properties of the designed material includes: Based on the material matching parameters, the optical intrinsic parameters of the designed material are constructed; Using the aforementioned optical eigenvalues, calculate the single-capsule transmission matrix of the designed material; Using the single-capsule transmission matrix, a global thin-film simulation of the designed material is performed to obtain a simulated optical path diagram; The optical properties of the designed material are identified using the simulated optical path diagram.

[0010] Optionally, the step of constructing the electrode layout and circuit topology of the designed material using the molecular response time and the molecular stability includes: The operating frequency of the designed material is calculated using the molecular response time. Based on the molecular stability, the voltage amplitude of the designed material was analyzed; Based on the operating frequency and the voltage amplitude, a fractal electrode pattern of the designed material is constructed; In the fractal electrode diagram, the electrode layout of the design material is performed, and the circuit topology of the design material is constructed using the fractal electrode diagram.

[0011] Optionally, the step of constructing the design scheme for the design material based on the electrode layout and the circuit topology includes: Inquire about the application scenarios of the design materials; Based on the application scenario, the electrode layout is used to construct the electrode design scheme for the designed material; Using the aforementioned circuit topology, construct a circuit module design scheme for the design material; Based on the electrode design scheme and the circuit module design scheme, the design material is deployed in conjunction with supporting components to obtain a design scheme for the design material.

[0012] Optionally, the step of performing encapsulation simulation on the design material according to the design scheme to obtain simulated process parameters includes: Based on the design scheme, define the material properties of the design material; Based on the design scheme, construct the geometric model of the designed material. The geometric model is configured with the material properties to obtain a material property configuration model. Inquire about the actual application scenarios of the designed materials; Based on the actual application scenario, the material property configuration model is configured with environmental parameters to obtain an environmental parameter configuration model. The environmental parameter configuration model is configured with preset process parameters to obtain the target model; The target model is used to simulate the encapsulation of the design material, and the simulation results are visualized and analyzed to obtain key simulation parameters. The preset process parameters are optimized using the simulated key parameters to obtain simulated process parameters.

[0013] Optionally, the performance evaluation of the simulated material includes: The evaluation indicators for the properties of the simulated material are defined, wherein the evaluation indicators include optical indicators, thermal indicators and electrical indicators; Extract the performance data corresponding to the evaluation index from the simulation results of the simulated material properties; Using the performance data, the properties of the simulated material are quantitatively evaluated to obtain quantitative performance values; After performing single-index analysis on the quantitative performance values, the performance index evaluation of the simulated material is completed.

[0014] To address the above problems, the present invention also provides a design system for capsule liquid crystal dimming films, the system comprising: The preliminary architecture design module is used to obtain the basic performance indicators of the design material corresponding to the capsule liquid crystal dimming film, construct the preliminary design architecture of the design material based on the basic performance indicators, perform finite element analysis on the design material based on the preliminary design architecture to determine the mechanical properties of the design material, and optimize the spatial distribution of the preliminary design architecture based on the mechanical properties to obtain the preliminary optimized architecture. The material performance analysis module is used to perform multiphysics coupling analysis on the preliminary optimized architecture to determine the material matching parameters of the design material, and to perform optical simulation on the design material based on the material matching parameters to determine the optical performance of the design material. The material design module is used to configure the encapsulation material of the design material according to the optical performance, perform electric field analysis on the encapsulation material and the design material to determine the molecular response time and molecular stability when the design material is encapsulated using the encapsulation material, construct the electrode layout and circuit topology of the design material using the molecular response time and the molecular stability, and construct the design scheme of the design material based on the electrode layout and circuit topology. The material encapsulation module is used to perform encapsulation simulation on the design material according to the design scheme to obtain simulated process parameters, perform performance mapping on the design material based on the simulated process parameters to obtain simulated material performance, evaluate the performance index of the simulated material performance, and encapsulate the design material according to the design scheme when the evaluation value of the performance index meets the preset value.

[0015] Compared to the problems described in the background art, the embodiments of the present invention first obtain the basic performance indicators of the capsule liquid crystal dimming film design material, providing a basis for material design and analysis. Then, based on the indicators, a preliminary design architecture is constructed, transforming the performance indicators into specific structural designs, forming a basic framework for analysis and optimization. Furthermore, the spatial distribution of the preliminary design architecture is optimized according to mechanical properties, improving the material's mechanical properties and utilization efficiency. Further, the present invention performs multiphysics coupling analysis on the preliminary optimized architecture to determine material matching parameters, helping users understand the comprehensive performance of the material and avoid design defects. Based on the material matching parameters, optical simulation is performed to determine the material's optical properties, ensuring that the optical performance of the designed material can be adjusted and improved before actual manufacturing to meet the light requirements of specific application scenarios. The invention addresses stringent performance requirements. Furthermore, by analyzing the electric field interaction of the encapsulation and design materials, the molecular response time and stability are determined, molecular behavior is understood, and material efficiency and reliability are evaluated. The molecular response time and stability are then used to construct electrode layouts and circuit topologies, ensuring uniform electric field application and improving material performance and reliability. Based on these electrode layouts and circuit topologies, a design scheme is constructed that comprehensively considers various factors, avoiding conflicts and mismatches, and improving product quality. Even further, by performing encapsulation simulation, performance mapping, and performance evaluation on the design materials, the invention can analyze whether defects exist in the design materials throughout the entire process, ensuring the quality of the produced products. Encapsulation is then performed when the performance evaluation is appropriate, thereby improving the quality of the capsule liquid crystal dimming film. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating a design method for a capsule liquid crystal dimming film according to an embodiment of the present invention. Figure 2This is a schematic diagram of a module for implementing a capsule liquid crystal dimming film design system according to an embodiment of the present invention.

[0017] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0019] This application provides a method for designing a capsule liquid crystal dimming film. The execution subject of this method includes, but is not limited to, at least one electronic device configured to execute the method provided in this application, such as a server or a terminal. In other words, the method for designing a capsule liquid crystal dimming film can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0020] Example 1: Reference Figure 1 The diagram shown is a flowchart illustrating a design method for a capsule-shaped liquid crystal dimming film according to an embodiment of the present invention. In this embodiment, the design method for the capsule-shaped liquid crystal dimming film includes: S1. Obtain the basic performance indicators of the design material corresponding to the capsule liquid crystal dimming film. Based on the basic performance indicators, construct the preliminary design architecture of the design material. Based on the preliminary design architecture, perform finite element analysis on the design material to determine the mechanical properties of the design material. Based on the mechanical properties, optimize the spatial distribution of the preliminary design architecture to obtain the preliminary optimized architecture.

[0021] The embodiments of the present invention can obtain the basis for material design and analysis by acquiring the basic performance indicators of the corresponding design material of the capsule liquid crystal dimming film, so as to ensure the correctness of the design direction.

[0022] The capsule liquid crystal dimming film refers to a smart dimming material prepared based on microcapsule technology. Its core structure is to encapsulate liquid crystal material in tiny capsules and then uniformly disperse these capsules in a polymer matrix to form a film. The basic performance indicators refer to the set of key parameters for measuring the performance of the capsule liquid crystal dimming film, such as light transmittance, tensile strength and operating temperature range.

[0023] Optionally, the basic performance indicators can be obtained by querying the basic performance indicators of the design materials for capsule liquid crystal dimming films in the historical design data of capsule liquid crystal dimming films.

[0024] Furthermore, the embodiments of the present invention, by constructing a preliminary design architecture for the design material based on the aforementioned basic performance indicators, can transform abstract performance indicators into specific structural designs, such as the number of layers of the material film, the material distribution of each layer, and the size and spacing of the capsules, providing a basic framework for subsequent analysis and optimization.

[0025] The preliminary design architecture refers to the basic framework for equipment linkage control built based on fundamental performance indicators, equipment functional characteristics, and application scenario requirements, using technologies such as computer-aided design and system modeling.

[0026] Optionally, the preliminary design architecture can be built using SOA technology.

[0027] This invention embodiment uses finite element analysis based on the preliminary design architecture to determine the mechanical properties of the design material. This allows for a deeper understanding of the mechanical behavior of the design material during actual use and the discovery of potential mechanical problems, such as stress concentration and excessive deformation.

[0028] As an embodiment of the present invention, the step of performing finite element analysis on the design material based on the preliminary design architecture to determine the mechanical properties of the design material includes: parametrically reconstructing the three-dimensional model of the preliminary design architecture to obtain a parametric model; adaptively meshing the parametric model to obtain a finite element mesh model; assigning material property values ​​to each mesh in the finite element mesh model to obtain an assigned mesh model; constructing the stress-strain field of the design material using the assigned mesh model; and analyzing the mechanical properties of the design material using the stress-strain field.

[0029] The parametric model refers to a model that describes an object or system by defining parameters and their interrelationships. The finite element mesh model refers to the model obtained by meshing the parametric model. The stress-strain field refers to the stress and strain distribution at various points inside an object when it is subjected to external forces.

[0030] Optionally, the parametric model can extract key geometric features and dimensional parameters from the preliminary design architecture, such as the length, width, height, and shape parameters of each part of the architecture. These parameters are then correlated and modeled using 3D modeling software, such as SolidWorks. The finite element mesh model can be obtained by importing the parametric model into finite element analysis software, such as ANSYS, and then setting adaptive mesh generation parameters in the software, such as the maximum and minimum mesh size and mesh density control conditions. Finally, the model is obtained by operating the software according to the settings. The assigned mesh model can be obtained in the finite element analysis software by selecting a suitable material library and assigning corresponding material properties to each mesh in the model based on the actual properties of the design material, such as elastic modulus, Poisson's ratio, and density. The stress-strain field can be obtained in the finite element analysis software by applying corresponding boundary conditions and loads, such as constraints, forces, and displacements, according to the actual working conditions of the design material. Then, the finite element solver is run to solve for the stress and strain distribution of the assigned mesh model under these conditions.

[0031] Furthermore, in this embodiment of the invention, the spatial distribution of the preliminary design architecture is optimized based on the mechanical properties, resulting in a preliminary optimized architecture that can improve the mechanical properties and utilization efficiency of the design materials.

[0032] As an embodiment of the present invention, the step of optimizing the spatial distribution of the preliminary design architecture based on the mechanical properties to obtain a preliminary optimized architecture includes: parameterizing the mechanical properties to obtain a quantized parameter set; using the quantized parameter set to perform capsule deployment on the preliminary design architecture to obtain a capsule deployment architecture; and calculating the capsule distribution weights of the capsule points in the capsule deployment architecture using the following formula: ; in, This represents the capsule distribution weight, where n represents the number of capsule nodes in the capsule deployment architecture. This represents the interpolation coefficient for high-stress capsule point i in the capsule deployment architecture. ( ) represents the Gaussian kernel function. This represents the spatial coordinates of a capsule point in a capsule deployment architecture. This represents the spatial coordinates of the high-stress capsule point i in the capsule deployment architecture; Based on the capsule distribution weights, the distribution of capsule points in the capsule deployment architecture is optimized to obtain a preliminary optimized architecture.

[0033] The quantized parameter set refers to a set of numerical parameters obtained after parameterizing the mechanical properties of the design material. The capsule point refers to the specific location point where the capsule is placed when the capsule is deployed in the preliminary design architecture. The capsule deployment architecture refers to an architecture form formed by deploying the capsules to the corresponding positions (i.e., capsule points) of the preliminary design architecture according to certain rules and algorithms based on the quantized parameter set.

[0034] Optionally, the quantified parameter set can be obtained by extracting key indicators, such as maximum stress, minimum stress, and average stress, from the mechanical performance results obtained by finite element analysis, and then standardizing and normalizing these key indicators. The capsule deployment architecture can be obtained by deploying capsule points in the preliminary design architecture using MATLAB tools combined with the quantified parameters of mechanical performance. The optimized architecture can be obtained by adjusting the position and density of each capsule point in the capsule deployment architecture based on the calculated capsule distribution weights, such as increasing the number of high-weight capsule points or optimizing their positions, and reducing the number of low-weight capsule points.

[0035] S2. Perform multiphysics coupling analysis on the preliminary optimized architecture to determine the material matching parameters of the design material, and perform optical simulation on the design material based on the material matching parameters to determine the optical performance of the design material.

[0036] The embodiments of the present invention perform multiphysics coupling analysis on the preliminary optimized architecture to determine the material matching parameters of the design material. This can help users gain a deeper understanding of the comprehensive performance of the design material in actual use and avoid design defects caused by considering only a single physical field.

[0037] The material matching parameters refer to a set of indicators or values ​​used to measure the degree of compatibility between different materials in terms of specific properties or characteristics.

[0038] As an embodiment of the present invention, the step of performing multiphysics coupling analysis on the preliminary optimized architecture to determine the material matching parameters of the design material includes: simulating the electric field, temperature field, and mechanical field of the preliminary optimized architecture to obtain a simulated physical field architecture; identifying the interaction relationships of the multiphysics fields in the simulated physical field architecture; constructing a multiphysics coupling model of the preliminary optimized architecture based on the interaction relationships; setting physical field boundary conditions for the multiphysics coupling model to obtain a target physical field; performing finite volume analysis on the target physical field to obtain physical coupling parameters; and determining the material matching parameters of the design material based on the physical coupling parameters.

[0039] The interaction relationship refers to the intrinsic connection between electric field, temperature field and mechanical field in multiphysics simulation. The multiphysics coupling model is a mathematical model that comprehensively describes the interconnection and interaction of multiple physical fields (such as electric field, temperature field and mechanical field).

[0040] Optionally, the simulated physics field architecture can be imported into professional multiphysics simulation software, such as ANSYS Workbench. Then, the simulation parameters (electric field strength, temperature distribution, load magnitude and direction, etc.) for the electric field, temperature field, and mechanical field can be set separately using the multiphysics simulation software, and the simulation fields are generated after running the simulation program. The interaction relationships can be analyzed using the post-processing function of the simulation software to examine the mutual influence between the electric field, temperature field, and mechanical field. For example, the heating of the material under the action of the electric field leads to a change in the temperature field, and the temperature change causes thermal expansion of the material, affecting the mechanical field, thereby identifying the coupling mechanism (i.e., the interaction relationship) between the various physics fields. The multiphysics coupling model can be obtained by selecting a suitable coupling physics interface in the simulation software based on the identified multiphysics interaction relationships, coupling the electric field, temperature field, and mechanical field, and setting the transfer parameters and boundary conditions between each field. The target physics field can be obtained by setting boundary conditions for the multiphysics coupling model according to the actual application scenario, such as setting voltage boundaries in the electric field, setting ambient temperature and thermal convection conditions in the temperature field, and determining constraints and external loads in the mechanical field. The physical coupling parameters can be obtained by discretizing the target physical field using the finite volume method, dividing the solution domain into multiple control volumes, and calculating the flux and conservation relationships of physical quantities within each control volume. The material matching parameters can be used to analyze the correlation between the physical coupling parameters and material properties. Based on the material's response characteristics under multi-physics fields, indicators reflecting the degree of fit between different materials can be extracted. For example, under an electric field strength of 100 V / m, the chip material temperature increases by 0.5 K, while the packaging material temperature increases by 0.3 K. This indicates that the electric field has a more significant thermal effect on the chip material.

[0041] Furthermore, in this embodiment of the invention, optical simulation of the designed material is performed based on the material matching parameters to determine the optical performance of the designed material. The material design can be adjusted and improved before actual manufacturing to meet the stringent requirements of optical performance for specific application scenarios, such as high light transmittance and low haze in architectural scenarios.

[0042] The optical properties refer to a series of characteristics exhibited by a material under the influence of light, such as transmittance, refractive index, and scattering properties.

[0043] As an embodiment of the present invention, the step of performing optical simulation on the design material based on the material matching parameters to determine the optical performance of the design material includes: constructing optical intrinsic parameters of the design material based on the material matching parameters; calculating the single-capsule transmission matrix of the design material using the optical intrinsic parameters; performing overall thin-film simulation on the design material using the single-capsule transmission matrix to obtain a simulated optical path diagram; and identifying the optical performance of the design material using the simulated optical path diagram.

[0044] The optical intrinsic parameters refer to physical quantities that describe the inherent optical properties of the material itself; the single capsule transmission matrix refers to a matrix used to describe the relationship between input and output when light propagates in a single capsule structure; and the simulated light path diagram refers to a visual graphic that shows the propagation path and behavior of light in the designed material.

[0045] Optionally, the optical intrinsic parameters can be obtained by extracting optically relevant data from the material matching parameters, such as refractive index and absorptivity, and then performing data quantization processing. The single-capsule transmission matrix can be obtained by substituting the obtained optical intrinsic parameters into the formulas of transmission matrix theory (such as Maxwell's equations) and then calculating the propagation process of light within the single capsule. The simulated optical path diagram can be obtained by combining the single-capsule transmission matrix according to the distribution and arrangement of capsules in the designed material, simulating the propagation path and behavior of light throughout the entire thin film material, and then obtaining information such as the intensity and phase of light at various positions within the thin film through continuous iterative calculations. The optical performance can be obtained by analyzing the simulated optical path diagram, extracting key information such as light transmittance, reflectance, and scattering rate, and then comparing and analyzing these key information with the standard definitions of optical performance.

[0046] S3. Configure the encapsulation material of the design material according to the optical performance, perform electric field analysis on the encapsulation material and the design material to determine the molecular response time and molecular stability when the design material is encapsulated using the encapsulation material, construct the electrode layout and circuit topology of the design material using the molecular response time and molecular stability, and construct the design scheme of the design material based on the electrode layout and the circuit topology.

[0047] In this embodiment of the invention, by configuring the packaging material according to the optical performance of the design material, the packaging material can be selected to match the optical performance requirements of the design material, so as to ensure that it will not have a negative impact on the optical performance of the design material.

[0048] The encapsulation material refers to a type of material used to wrap, seal, and protect a specific object; in this embodiment, it refers to the encapsulation material of the capsule liquid crystal dimming film.

[0049] Optionally, the encapsulation material can be selected based on the optical performance requirements of the design material (such as transmittance, refractive index, scattering rate, etc.). For example, if a transmittance of 90% is required, a matching encapsulation material type (transparent plastic, glass, silicone, etc.) can be selected.

[0050] Furthermore, by performing electric field analysis on the encapsulation material and the design material, the embodiments of the present invention can help users understand the molecular behavior of the encapsulation material and the design material under the action of an electric field, thereby enabling them to evaluate the working efficiency and reliability of the design material under different electric field conditions.

[0051] The molecular response time refers to the time required for molecules in the encapsulation material and the design material to reach a state of relative equilibrium with the electric field from their initial state under the action of an electric field, and the molecular stability refers to the ability of material molecules to maintain their original structure and properties under the action of an electric field and during the encapsulation process.

[0052] Optionally, the process of performing electric field analysis on the encapsulation material and the design material to determine the molecular response time and molecular stability when encapsulating the design material with the encapsulation material is as follows: First, using quantum chemical calculation software, molecular models of the encapsulation material and the design material are constructed to simulate the application of electric fields of different intensities and frequencies, tracking the structural changes and charge distribution dynamics of molecules under the influence of the electric field. Then, the molecular response time is determined by analyzing the time it takes for the molecular structure and charge to reach a stable state. Finally, parameters such as chemical bond energy and configuration changes of the molecules before and after the electric field are compared to evaluate molecular stability.

[0053] The embodiments of the present invention utilize the molecular response time and molecular stability to construct the electrode layout and circuit topology of the designed material, which can make the electric field act uniformly on the designed material, avoid the performance inconsistency caused by excessively strong or weak local electric fields, and thus improve the performance and reliability of the designed material.

[0054] The electrode layout refers to the positional distribution, arrangement, and relative positional relationship of electrodes with other components in a specific electronic device or system. The circuit topology refers to the connection method and interrelationship between various components (such as resistors, capacitors, inductors, power supplies, etc.) in the circuit.

[0055] As an embodiment of the present invention, the step of constructing the electrode layout and circuit topology of the design material using the molecular response time and the molecular stability includes: calculating the operating frequency of the design material using the molecular response time; analyzing the voltage amplitude of the design material based on the molecular stability; constructing a fractal electrode pattern of the design material based on the operating frequency and the voltage amplitude; performing electrode layout of the design material in the fractal electrode pattern; and constructing the circuit topology of the design material using the fractal electrode pattern.

[0056] Wherein, the operating frequency refers to the frequency at which the designed material can stably and effectively perform an electrical response under the action of a specific electric field, the voltage amplitude refers to the maximum or peak value of the voltage, and the fractal electrode diagram refers to a graphic drawn based on the principle of fractal geometry for designing material electrodes.

[0057] Optionally, the operating frequency can be calculated using the formula "operating frequency = 1 / molecular response time". The voltage amplitude can be obtained by simulating the changes in molecular structure and properties under different voltage amplitudes to find the maximum voltage value that will not destroy molecular stability. The fractal electrode diagram can be generated by using AutoCAD combined with a fractal algorithm program to convert the operating frequency and voltage amplitude into the geometric parameters of the fractal electrode diagram, thus generating an electrode pattern with a specific self-similar structure. The electrode layout of the designed material can be planned according to the structural characteristics of the fractal electrode diagram, ensuring that the electrode distribution can achieve optimal electric field uniformity and current conduction efficiency. The circuit topology can be based on the fractal electrode diagram, determining the connection relationship and signal transmission path between each electrode, abstracting the electrodes as circuit nodes, and then adding necessary circuit elements (such as resistors and capacitors) according to the electrical functional requirements of the material to construct a complete circuit structure.

[0058] The present invention, through the electrode layout and circuit topology, constructs a design scheme for the design material that comprehensively considers the interrelationships and influences between various factors of the design material, avoiding conflicts and mismatches between various links, thereby improving product quality.

[0059] As an embodiment of the present invention, the step of constructing a design scheme for the design material based on the electrode layout and the circuit topology includes: querying the application scenarios of the design material; constructing an electrode design scheme for the design material based on the application scenarios and the electrode layout; constructing a circuit module design scheme for the design material based on the circuit topology; and deploying supporting components for the design material in a coordinated manner based on the electrode design scheme and the circuit module design scheme to obtain a design scheme for the design material.

[0060] Optionally, the electrode design scheme can be adjusted according to the application scenario's requirements for electric field distribution and signal transmission, adjusting electrode layout parameters such as electrode spacing, shape, and size. The optimized electrode layout is then converted into detailed design drawings and process specifications. The circuit module design scheme can utilize EDA for circuit schematic design and PCB layout, then combine the circuit topology to simulate the circuit's operating state, and adjust the circuit parameters based on the simulation results. The design scheme can integrate the electrode design scheme and the circuit module design scheme, planning the installation positions and connection methods of supporting components (such as packaging shells, heat dissipation components, signal interfaces, etc.), and then using 3D modeling and assembly verification to ensure reasonable spatial layout and functional synergy among the components, ultimately forming a complete solution.

[0061] S4. According to the design scheme, the design material is encapsulated and simulated to obtain simulated process parameters. Based on the simulated process parameters, the design material is performance-mapped to obtain simulated material performance. The simulated material performance is evaluated by performance indicators. When the evaluation value of the performance indicators meets the preset value, the design material is encapsulated based on the design scheme.

[0062] In this embodiment of the invention, by performing a packaging simulation on the design material according to the design scheme, the simulated process parameters can be obtained to predict potential problems during the packaging process before the actual material packaging is carried out, such as compatibility issues between the packaging material and the design material, stress concentration that may occur during the packaging process, etc., and the packaging process can be optimized by adjusting the parameters in the simulation.

[0063] As an embodiment of the present invention, the step of performing encapsulation simulation on the design material according to the design scheme to obtain simulation process parameters includes: defining the material properties of the design material based on the design scheme; constructing a geometric model of the design material based on the design scheme; configuring model parameters of the geometric model using the material properties to obtain a material property configuration model; querying the actual application scenario of the design material; configuring environmental parameters of the material property configuration model based on the actual application scenario to obtain an environmental parameter configuration model; configuring process parameters of the environmental parameter configuration model using preset process parameters to obtain a target model; performing encapsulation simulation on the design material using the target model; visually analyzing the simulation results of the encapsulation simulation to obtain simulation key parameters; and optimizing the preset process parameters using the simulation key parameters to obtain simulation process parameters.

[0064] The material properties refer to the various physical, chemical, and mechanical characteristics of the designed material. The preset process parameters refer to a series of parameters that are pre-set based on the requirements and experience of the packaging process before the packaging simulation, such as temperature, pressure, time, and speed during the packaging process.

[0065] Optionally, based on the design scheme, defining the material properties of the design material can be achieved by extracting key information about the design material from the design scheme, such as material type (polymer, metal, ceramic, etc.) and physical properties (density, elastic modulus), chemical characteristics (corrosion resistance, thermal stability), and then inputting the corresponding relevant parameters into the simulation software. The geometric model can be determined based on the electrode layout, circuit modules, and supporting component information in the design scheme, determining the shape, size, and spatial structure of the design material, and then building it using modeling tools. The material property configuration model can associate the defined material properties with various parts of the geometric model, assigning corresponding material parameters to different regions, and setting interface properties between materials (such as adhesion strength, thermal conductivity). The environmental parameter configuration model can be obtained by testing the actual environmental data of the actual application scenario, and then using the actual environmental data to configure the temperature and humidity of the material property configuration model. The target model can be obtained by setting preset process parameters according to the packaging process requirements, such as packaging temperature, pressure application method, curing time, and coating speed, and then applying these parameters to the environmental parameter configuration model.

[0066] This invention, through the simulation process parameters, maps the performance of the design material to obtain the simulated material performance. The simulated process parameters can be applied to the performance model of the design material, helping users to understand the performance of the design material after packaging in advance.

[0067] The simulated material properties refer to the performance indicators obtained in the field of materials science and engineering by predicting and evaluating various physical, chemical, and mechanical properties of materials under specific conditions through computer simulation, numerical analysis, and other methods. Optionally, the simulated material properties can be obtained by performing matrix transformation on the simulated process parameters to obtain matrix parameters, and then using the matrix parameters to perform performance mapping.

[0068] Furthermore, by evaluating the performance indicators of the simulated material, this embodiment of the invention can determine whether the design scheme needs further improvement, thus avoiding product quality problems caused by the discovery of substandard material performance during subsequent production.

[0069] As an embodiment of the present invention, the performance index evaluation of the simulated material includes: identifying the evaluation index of the simulated material performance, wherein the evaluation index includes optical index, thermal index and electrical index; extracting the performance data corresponding to the evaluation index from the simulation results corresponding to the simulated material performance; using the performance data to quantitatively evaluate the simulated material performance to obtain a quantitative evaluation performance value; and performing single index analysis on the quantitative evaluation performance value to complete the performance index evaluation of the simulated material performance.

[0070] Optionally, the evaluation indicators can be determined based on the application scenarios and requirements of the designed materials, specifying specific evaluation indicators in the optical, thermal, and electrical aspects. For example, in the optical field, transmittance and refractive index are considered; in the thermal field, thermal conductivity and coefficient of thermal expansion are taken into account; and in the electrical field, electrical conductivity and dielectric constant are emphasized. The quantitative performance evaluation values ​​can be obtained by using statistical analysis tools, such as SPSS, to substitute the extracted performance data into the calculations. The single-index analysis of the quantitative performance evaluation values ​​can compare the quantitative performance value of each evaluation indicator with a preset standard value or ideal range to determine the quality of the material performance under that indicator.

[0071] It should be further explained that when the evaluation value of the performance index meets the preset value, it means that the value of the performance index evaluation is not less than the preset value. For example, in the manufacturing of optical lenses for smartphone cameras, the preset optical indexes are that the transmittance must be ≥95%, the refractive index error range is within ±0.005, and the dispersion coefficient must be ≤40. When the evaluation results of the simulated material performance show that the transmittance reaches 96.2%, the refractive index is within the error range of ±0.003 of the design value, and the dispersion coefficient is 38, then the requirements are met.

[0072] Furthermore, by encapsulating the designed material based on the design scheme, the embodiments of the present invention can ensure that the actual production process is carried out on a proven and reliable basis, thereby improving the success rate and quality stability of the product.

[0073] Example 2: like Figure 2 The diagram shown is a functional block diagram of the design system for a capsule liquid crystal dimming film according to the present invention.

[0074] The capsule liquid crystal dimming film design system 200 described in this invention can be installed in an electronic device. Depending on the functions implemented, the capsule liquid crystal dimming film design system may include an initial parameter construction module 201, a device parameter configuration module 202, an environmental data optimization module 203, and an intelligent night vision light source construction module 204. The module described in this invention can also be referred to as a unit, which refers to a series of computer program segments that can be executed by the processor of an electronic device and can perform a fixed function, and are stored in the memory of the electronic device.

[0075] In this embodiment of the invention, the functions of each module / unit are as follows: The preliminary architecture design module 201 is used to obtain the basic performance indicators of the design material corresponding to the capsule liquid crystal dimming film, construct the preliminary design architecture of the design material based on the basic performance indicators, perform finite element analysis on the design material based on the preliminary design architecture to determine the mechanical properties of the design material, and optimize the spatial distribution of the preliminary design architecture based on the mechanical properties to obtain the preliminary optimized architecture. The material performance analysis module 202 is used to perform multiphysics coupling analysis on the preliminary optimized architecture to determine the material matching parameters of the design material, and to perform optical simulation on the design material based on the material matching parameters to determine the optical performance of the design material. The material design module 203 is used to configure the encapsulation material of the design material according to the optical performance, perform electric field analysis on the encapsulation material and the design material to determine the molecular response time and molecular stability when the design material is encapsulated using the encapsulation material, construct the electrode layout and circuit topology of the design material using the molecular response time and the molecular stability, and construct the design scheme of the design material based on the electrode layout and circuit topology. The material encapsulation module 204 is used to perform encapsulation simulation on the design material according to the design scheme to obtain simulated process parameters, perform performance mapping on the design material based on the simulated process parameters to obtain simulated material performance, evaluate the performance index of the simulated material performance, and encapsulate the design material according to the design scheme when the evaluation value of the performance index meets the preset value.

[0076] In detail, the modules in the capsule liquid crystal dimming film design system 200 described in this embodiment of the invention employ the same methods as described above during use. Figure 1 The design method of the capsule liquid crystal dimming film described herein uses the same technical means and can produce the same technical effect, so it will not be repeated here.

[0077] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A design method of a capsule liquid crystal light control film, characterized by, The method comprises: acquiring basic performance indexes of a design material corresponding to the capsule liquid crystal dimming film, constructing a preliminary design architecture of the design material based on the basic performance indexes, performing finite element analysis on the design material based on the preliminary design architecture to determine mechanical properties of the design material, performing spatial distribution optimization on the preliminary design architecture based on the mechanical properties to obtain a preliminary optimization architecture; performing multi-physical field coupling analysis on the preliminary optimization architecture to determine material matching parameters of the design material, performing optical simulation on the design material based on the material matching parameters to determine optical properties of the design material; configuring packaging materials of the design material according to the optical properties, performing electric field action analysis on the packaging materials and the design material to determine molecular response time and molecular stability when the design material is packaged by using the packaging materials, constructing electrode layout and circuit topology structure of the design material by using the molecular response time and the molecular stability, and constructing a design scheme of the design material based on the electrode layout and the circuit topology structure; performing packaging simulation on the design material according to the design scheme to obtain simulation process parameters, performing performance mapping on the design material based on the simulation process parameters to obtain simulation material properties, performing performance index evaluation on the simulation material properties, and packaging the design material based on the design scheme when an evaluation value of the performance index evaluation meets a preset value.

2. The method of designing a capsule liquid crystal light control film according to claim 1, wherein, The method comprises: performing three-dimensional model parameterization reconstruction on the preliminary design architecture to obtain a parameterized model; performing adaptive mesh division on the parameterized model to obtain a finite element mesh model; performing material attribute assignment for each mesh in the finite element mesh model to obtain an assigned mesh model; constructing a stress-strain field of the design material by using the assigned mesh model; analyzing the mechanical properties of the design material by using the stress-strain field.

3. The method of designing a capsule liquid crystal light control film according to claim 1, wherein, The method comprises: performing parameterization processing on the mechanical properties to obtain a quantitative parameter set; performing capsule deployment on the preliminary design architecture by using the quantitative parameter set to obtain a capsule deployment architecture; calculating capsule distribution weights of capsule points in the capsule deployment architecture by using the following formula: ； wherein, represents the capsule distribution weight, n represents the number of capsule points in the capsule deployment architecture, represents the interpolation coefficient of the high-stress capsule point i in the capsule deployment architecture, () represents a Gaussian kernel function, represents the spatial coordinates of a capsule point in the capsule deployment architecture, represents the spatial coordinates of the high-stress capsule point i in the capsule deployment architecture; performing distribution optimization on the capsule points in the capsule deployment architecture based on the capsule distribution weights to obtain the preliminary optimization architecture.

4. The method of designing a capsule liquid crystal light control film according to claim 1, wherein, The method comprises: performing electric field, temperature field and mechanical field simulation on the preliminary optimization architecture to obtain a simulation physical field architecture; identifying action relationships of multiple physical fields of the simulation physical field architecture; constructing a multi-physical field coupling model of the preliminary optimization architecture based on the action relationships; and performing multi-physical field coupling analysis on the preliminary optimization architecture to determine material matching parameters of the design material. The physical field boundary condition of the multi-physical field coupling model is set, and a target physical field is obtained; The target physical field is analyzed by finite volume, and a physical coupling parameter is obtained; Based on the physical coupling parameter, the material matching parameter of the design material is determined.

5. The method of designing a capsule liquid crystal switchable film according to claim 1, wherein, The optical simulation of the design material based on the material matching parameter is performed to determine the optical performance of the design material, including: Based on the material matching parameter, the optical intrinsic parameter of the design material is constructed; The single capsule transmission matrix of the design material is calculated by using the optical intrinsic parameter; The overall thin film simulation of the design material is performed by using the single capsule transmission matrix, and a simulation light path diagram is obtained; The optical performance of the design material is identified by using the simulation light path diagram.

6. The method of designing a capsule liquid crystal switchable film according to claim 1, wherein, The electrode layout and circuit topology of the design material are constructed by using the molecular response time and the molecular stability, including: The working frequency of the design material is calculated by using the molecular response time; The voltage amplitude of the design material is analyzed based on the molecular stability; The fractal electrode map of the design material is constructed based on the working frequency and the voltage amplitude; The electrode layout of the design material is performed in the fractal electrode map, and the circuit topology of the design material is constructed by using the fractal electrode map.

7. The method of designing a capsule liquid crystal switchable film according to claim 1, wherein, The design scheme of the design material is constructed based on the electrode layout and the circuit topology, including: The application scenario of the design material is queried; The electrode design scheme of the design material is constructed by using the electrode layout based on the application scenario; The circuit module design scheme of the design material is constructed by using the circuit topology; The design scheme of the design material is obtained by deploying the supporting components of the design material based on the electrode design scheme and the circuit module design scheme.

8. The method of designing a capsule liquid crystal switchable film according to claim 1, wherein, The packaging simulation of the design material is performed according to the design scheme, and simulation process parameters are obtained, including: The material attribute of the design material is defined based on the design scheme; The geometric model of the design material is constructed based on the design scheme The material attribute configuration model is obtained by configuring the model parameters of the geometric model by using the material attribute; The actual application scenario of the design material is queried; The environment parameter configuration model is obtained by configuring the environment parameters of the material attribute configuration model based on the actual application scenario of the design material; The target model is obtained by configuring the process parameters of the environment parameter configuration model by using the preset process parameters; The simulation key parameters are obtained by performing packaging simulation on the design material by using the target model and performing visual analysis on the simulation results of the packaging simulation; The simulation process parameters are obtained by optimizing the preset process parameters by using the simulation key parameters.

9. The method of designing a capsule liquid crystal switchable film according to claim 1, wherein, The performance index evaluation of the simulation material performance includes: The evaluation index of the simulation material performance is determined, wherein the evaluation index includes optical index, thermal index and electrical index; The performance data corresponding to the evaluation index is extracted from the simulation results corresponding to the simulation material performance; The performance data is used to quantitatively evaluate the simulated material performance, and a quantitative evaluation performance value is obtained; After single-index analysis of the quantitative evaluation performance value, performance index evaluation of the simulated material performance is completed.

10. A design system for a capsule liquid crystal dimming film, characterized in that, The system comprises: A preliminary architecture design module is configured to obtain basic performance indexes of a design material corresponding to a capsule liquid crystal dimming film, construct a preliminary design architecture of the design material based on the basic performance indexes, perform finite element analysis on the design material based on the preliminary design architecture to determine mechanical performance of the design material, perform spatial distribution optimization on the preliminary design architecture based on the mechanical performance to obtain a preliminary optimized architecture; A material performance analysis module is configured to perform multi-physical field coupling analysis on the preliminary optimized architecture to determine material matching parameters of the design material, perform optical simulation on the design material based on the material matching parameters to determine optical performance of the design material; A material design module is configured to configure packaging materials of the design material according to the optical performance, perform electric field action analysis on the packaging materials and the design material to determine molecular response time and molecular stability when the design material is packaged by using the packaging materials, construct electrode layout and circuit topology structure of the design material by using the molecular response time and the molecular stability, and construct a design scheme of the design material based on the electrode layout and the circuit topology structure; A material packaging module is configured to perform packaging simulation on the design material according to the design scheme to obtain simulated process parameters, perform performance mapping on the design material based on the simulated process parameters to obtain simulated material performance, perform performance index evaluation on the simulated material performance, and perform material packaging on the design material based on the design scheme when an evaluation value of the performance index evaluation meets a preset value.

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