Electronic load device with low inductive reactance

Abstract

The invention discloses an electronic load device with low inductive reactance. The electronic load device comprises a first radiator, a first load circuit module, a first conducting strip, a first polarity connecting part and a second polarity connecting part, the first load circuit module comprises a first circuit board and a plurality of first power elements arranged on the first circuit board. The first conducting strip extends in the first direction and is erected on the first circuit board, so that the first circuit board is configured between the first radiator and the first conducting strip. The first polarity connection portion is coupled to an end portion of the first heat sink and protrudes in a first direction. The second polarity connection portion is coupled to an end portion of the first conductive sheet and protrudes along the first direction. The first polarity of the first power element is coupled to the first heat sink, and the second polarity is coupled to the first conductive sheet. Therefore, the distance between the two polarity connecting parts is reduced, the inductance value can be reduced in the power supply transmission process, the path impedance is reduced, and the voltage drop is further reduced.

Description

[Technical Field]

[0001] This invention relates to an electronic load device, and more specifically, to an electronic load device with low inductance having a special structural configuration. [Background Technology]

[0002] Electronic load devices can simulate electrical environments by controlling the number of power elements that are turned on within them, thereby consuming electrical energy. Electronic load devices are an indispensable testing apparatus for the development and manufacturing of power supply units.

[0003] In simulated high-current power environments, especially when the test voltage provided by the power supply is set to low, the inductive effect generated by the electronic load itself during operation can actually lead to test failure. This is because an inductor in a circuit generates a counter-voltage due to changes in current. When the current is dynamically changing, the counter-voltage generated by the inductive effect is relatively large. The inductive effect creates a significant voltage drop across the power transmission path, preventing the electronic load from obtaining sufficient operating voltage and causing it to be unable to stably load into the power supply's test circuit. Because the electronic load cannot be properly loaded, the power supply test system will fail due to exceeding equipment specifications, i.e., unloading and terminating the power supply, thus causing the test to fail. [Summary of the Invention]

[0004] In some embodiments of the present invention, the problem of high inductance inside the electronic load device is solved.

[0005] In some embodiments of the invention, certain mechanical configurations are provided to reduce the inductance within the electronic load device and to lower the impedance along the power transmission path.

[0006] According to one embodiment of the present invention, an electronic load device with low inductive reactance is provided, comprising: a first heat sink, a first load circuit module, a first conductive plate, a first polarity connection portion, and a second polarity connection portion. The first heat sink extends in a first direction and includes a first mounting side and a first fin side opposite to the first mounting side. The first load circuit module includes a first circuit board disposed on the first mounting side and extending in the first direction, and a plurality of first power components disposed on the first circuit board. The first conductive plate extends in the first direction and is mounted on the first circuit board, such that the first circuit board is disposed between the first heat sink and the first conductive plate. The first polarity connection portion is coupled to an end of the first heat sink and protrudes from the end of the first heat sink along the first direction. The second polarity connection portion is coupled to an end of the first conductive plate and protrudes from the end of the first conductive plate along the first direction. The first polarity of the first power components is coupled to the first heat sink and the first polarity connection portion, and the second polarity of the first power components is coupled to the first conductive plate and the second polarity connection portion.

[0007] According to another embodiment of the present invention, the first polarity connection portion may be configured to protrude from the end of the first heat sink in the form of a sheet, and the second polarity connection portion may be configured to protrude from the end of the first conductive sheet in the form of a sheet.

[0008] According to one embodiment of the present invention, the first direction may be the length extension direction and the airflow channel direction of the first heat sink. The second direction perpendicular to the first direction may be the width extension direction. The first conductive sheet may have a width wider than the width of the first heat sink, and the length of the first conductive sheet may be configured to be at least 1 / 2 of the length of the first heat sink.

[0009] According to one embodiment of the present invention, the front section of the second polarity connector may have an adjustment section that reduces the distance between it and the first polarity connector by being bent.

[0010] According to one embodiment of the present invention, the first polarity connection portion may be configured as an adjustment section parallel to the second polarity connection portion.

[0011] According to one embodiment of the present invention, the first polarity connection portion may be configured to protrude more than the second polarity connection portion in a first direction, and the width of the first polarity connection portion may be configured to be narrower than the width of the second polarity connection portion.

[0012] According to one embodiment of the present invention, the first polarity connection portion may be configured as an input copper busbar, and the second polarity connection portion may be configured as an output copper busbar.

[0013] According to one embodiment of the present invention, the first heat sink may have a recessed first clearance groove on the first mounting side. The first clearance groove is for the bottom of the first bracket disposed on the first circuit board to protrude. The first bracket is adapted to allow the first conductive sheet to be mounted on the first circuit board.

[0014] According to one embodiment of the present invention, it may further include: a second heat sink, a second load circuit module, a second conductive plate, and a plurality of conductive posts. The second heat sink may be configured to extend in a first direction and be coupled to a first heat sink. The second heat sink includes a second mounting side and a second fin side opposite to the second mounting side. The second fin side faces the first fin side. The second load circuit module may be configured to include: a second circuit board disposed on the second mounting side and extending in the first direction, and a plurality of second power components disposed on the second circuit board. The second conductive plate may be configured to extend in the first direction and be mounted on the second circuit board, such that the second circuit board is disposed between the second heat sink and the second conductive plate. One end of each conductive post may be configured to connect to the first conductive plate, and the other end of each conductive post may be connected to the second conductive plate. The second conductive plate may be coupled to the first conductive plate through the conductive post. The first polarity of the second power component is coupled to the second heat sink and the first polarity connection portion, and the second polarity of the second power component is coupled to the second conductive plate and the second polarity connection portion.

[0015] According to one embodiment of the present invention, the second conductive sheet may be configured to have a width wider than that of the second heat sink, and the length of the second conductive sheet may be configured to be at least 1 / 2 of the length of the second heat sink.

[0016] According to one embodiment of the present invention, the first conductive sheet and the second conductive sheet may be configured to be parallel to each other via conductive posts.

[0017] According to one embodiment of the present invention, a fan module may be further included. The fan module may be disposed at one end of the first heat sink and the second heat sink, and located on one side of the first polarity connection portion and the second polarity connection portion, for driving the fluid in the airflow channel defined by the first fin side and the second fin side.

[0018] According to one embodiment of the present invention, the second heat sink may have a recessed second clearance groove on the second mounting side. The second clearance groove is for the protrusion of the bottom of the second bracket disposed on the second circuit board. The second bracket is for mounting the second conductive sheet on the second circuit board.

[0019] In this way, by arranging the polarity connection parts with the corresponding heat sinks and conductive plates, the distance between the two polarity connection parts can be reduced, thereby reducing the inductance inside the electronic load device, and consequently reducing the voltage drop due to the reduction in path impedance. [Attached Image Description]

[0020] Figure 1 An exploded view of an electronic load device according to one embodiment; Figure 2 According to Figure 1A partial perspective sectional view of the electronic load device according to the embodiment; Figure 3 According to Figure 1 Side view of the electronic load device according to the embodiment; Figure 4 According to Figure 1 Rear view of the electronic load device according to the embodiment; Figure 5 According to Figure 1 A partial cross-sectional view of the electronic load device according to the embodiment; Figure 6 This is a perspective view of an electronic load device according to some other embodiments; Figure 7 According to Figure 6 Side view of the electronic load device according to the embodiment; Figure 8 According to Figure 6 Rear view of the electronic load device according to the embodiment; Figure 9 This is a perspective view of an electronic load device according to some other embodiments.

Detailed Implementation Methods

[0021] To fully understand the purpose, features, and effects of the present invention, the present invention will now be described in detail with reference to the following specific embodiments and accompanying drawings:

[0022] In this application, the terms “a” or “an” are used to describe an element or feature. This is used for convenience only and to provide a general meaning for the scope of this document. Therefore, unless it is clearly intended otherwise, such a description should be understood to include one or at least one, and the singular includes the plural.

[0023] In this application, the terms “comprising,” “including,” “having,” or any other similar terms are not limited to the elements or features listed herein, but may include other parts not expressly listed but which are generally inherent in the elements or features.

[0024] In this application, the ordinal terms such as "first" or "second" are used to distinguish or refer to elements or features that are related to the same or similar elements or features, and do not necessarily imply a spatial order of such elements or features. It should be understood that in some cases or configurations, ordinal terms may be used interchangeably without affecting the embodiments disclosed herein or associated with them.

[0025] In this application, the term "coupled" may refer to two or more elements or features making direct physical contact with each other, or making indirect physical contact with each other, or two or more elements or features operating or acting on each other, or direct or indirect electrical (electrical or electrical signal) connection.

[0026] For ease of explanation, the electronic load devices in each embodiment only illustrate relevant components. Please also refer to... Figure 1 and Figure 2 , Figure 1 This is an exploded view of an electronic load device according to some embodiments. Figure 2 According to Figure 1 A partial perspective sectional view of the electronic load device according to the embodiment. The electronic load device includes a first heat sink 110, a first load circuit module 120, a first conductive sheet 130, a first polarity connection portion 210, and a second polarity connection portion 220.

[0027] In this embodiment, the electronic load device is roughly rectangular in shape, with a longer extension in the first direction X, referred to as its length; on the other hand, the extension in the second direction Y, perpendicular to the first direction X, is referred to as its width. Furthermore, the first direction X can also be the direction of the airflow channel of the first heat sink 110, that is, the direction in which the airflow passes over the fins is along +X or -X.

[0028] The first heat sink 110 extends in a first direction X, defining its length, and extends in a second direction Y, defining its width. The first heat sink 110 includes a first mounting side 111 and a first fin side 112, the first fin side 112 being opposite to the first mounting side 111. The first mounting side 111 of the first heat sink 110 is used for the configuration of the first load circuit module 120. For example, but not limited to, the first mounting side 111 may be provided with a recessed first clearance groove 113, which can be used to provide the space required for the assembly of the first conductive sheet 130 on the first load circuit module 120 (see further reference). Figure 4 And the example of the first bracket 1211 used to assemble the first conductive sheet 130 and the first circuit board 121, thereby improving the compactness of the installation of the first heat sink 110, the first load circuit module 120 and the first conductive sheet 130, and also reducing the overall size of the electronic load device.

[0029] The first load circuit module 120 includes a first circuit board 121 and a plurality of first power components 122. The first power components 122 disposed on the first circuit board 121 can be fixed to the first circuit board 121 by locking elements or by other electrical connection methods. In the electronic load device, the control of the number of first power components 122 that are turned on allows the operator to determine the load capacity of the electronic load device to match the power supply device to be tested.

[0030] The first conductive sheet 130 extends in the first direction X and is mounted on the first circuit board 121. In this configuration, the first circuit board 121 is positioned between the first heat sink 110 and the first conductive sheet 130. For example, but not limited to, the first circuit board 121 is provided with a plurality of first brackets 1211, the bottom of which can protrude into a first relief groove 113 on the first heat sink 110 and be securely fixed to the first circuit board 121, thereby allowing the first conductive sheet 130 to be securely mounted on the first circuit board 121 and adjacent to the first heat sink 110.

[0031] The first polarity connection portion 210 and the second polarity connection portion 220 are used to couple with external components of opposite polarity. For example, the first polarity connection portion 210 is coupled to the positive terminal of the power supply device under test, and the second polarity connection portion 220 is coupled to the negative terminal of the power supply device under test. The first polarity connection portion 210 and the second polarity connection portion 220 may extend directly from the corresponding first heat sink 110 or first conductive sheet 130, or they may be separate components that are coupled together or otherwise connected. In this embodiment, the first polarity connection portion 210 is a sheet that protrudes from the end of the first heat sink 110 in the first direction X and is coupled together with the first heat sink 110. On the other hand, the second polarity connection portion 220 is a sheet that protrudes from the end of the first conductive sheet 130 in the first direction X and is presented in the embodiment in an extended manner. In addition, the first polarity connection 210 can be used as an input copper busbar, and the second polarity connection 220 can be used as an output copper busbar. The input copper busbar and the output copper busbar are respectively coupled to the positive and negative terminals of the power supply device under test.

[0032] The first polarity (e.g., positive polarity) of the first power element 122 is coupled to the first heat sink 110 and the first polarity connection portion 210 extending from the first heat sink 110. For example, a conductive locking element (e.g., a metal screw) can be passed through the first circuit board 121 and locked to the body of the first heat sink 110, thus simultaneously achieving coupling between the first power element 122 and the first heat sink 110. Other coupling relationships can also be applied to this embodiment and are not limited to those described above.

[0033] The second polarity (e.g., negative polarity) of the first power element 122 is coupled to the first conductive sheet 130 and the second polarity connection portion 220 extending from the first conductive sheet 130. For example, the second polarity of the first power element 122 can be coupled to the first conductive sheet 130 and the second polarity connection portion 220 through the layout lines on the first circuit board 121 and the conductive first bracket 1211 (e.g., the first bracket itself is conductive or has conductive lines inside the first bracket).

[0034] Next, please refer to the following: Figure 3 and Figure 4 , Figure 3 According to Figure 1 Side view of the electronic load device according to the embodiment. Figure 4 According to Figure 1 Rear view of the electronic load device according to the embodiment.

[0035] Regarding the inductance of the various components along the transmission path, the reduction of self-inductance can be further provided based on the following examples. For instance, the length L11 of the first conductive sheet 130 can be configured to be at least half the length L12 of the first heat sink 110, wherein the length L11 of the first conductive sheet 130 does not include the second polarity connection portion 220. As another example, the width W11 of the first conductive sheet 130 can be configured to be wider than the width W12 of the first heat sink 110. Even with a further increase in the cross-sectional area of ​​the first conductive sheet 130, the structural configuration of this embodiment still allows the first conductive sheet 130 to maintain a relatively close distance to the first heat sink 110, and also a relatively close distance between the first polarity connection portion 210 and the second polarity connection portion 220, thus maintaining a low mutual inductance.

[0036] Next, please refer to the following: Figure 1 and Figure 5 , Figure 5 According to Figure 1 A partial cross-sectional view of the electronic load device according to the embodiment.

[0037] The front section of the second polarity connector 220 may be configured to have an adjustment section 221. The adjustment section 221 is an extension formed by a small section of the front section of the second polarity connector 220 that bends towards the first polarity connector 210 and then extends parallel to it, thereby reducing the distance between the second polarity connector 220 and the first polarity connector 210. In some embodiments, the first conductive sheet 130 and the second polarity connector 220 protruding from it, the first heat sink 110 and the first polarity connector 210 protruding from it, and the adjustment section 221 are arranged approximately parallel to each other.

[0038] Furthermore, in some embodiments, the first polarity connection portion 210 may be configured to protrude more than the second polarity connection portion 220 in the first direction X, but the width W21 of the first polarity connection portion 210 is narrower than the width W22 of the second polarity connection portion 220.

[0039] Next, please refer to the following: Figures 6 to 8 , Figure 6 This is a perspective view of an electronic load device according to some other embodiments. Figure 7 According to Figure 6 Side view of the electronic load device according to the embodiment. Figure 8 According to Figure 6 Rear view of the electronic load device according to the embodiment.

[0040] Figures 6 to 8 Compared to Figures 1 to 5 It mainly includes a second heat sink 310, a second load circuit module 320, a second conductive sheet 330, and a plurality of conductive posts 340. Among them, the same as... Figures 1 to 5 The components are as described above, and will not be repeated in this embodiment.

[0041] The second heat sink 310 extends in the first direction X and is coupled to the first heat sink 110. That is, the first heat sink 110 and the second heat sink 310 are electrically connected and therefore share the first polarity connection portion 210. For example, they are coupled together to the positive terminal of the power supply device under test through the first polarity connection portion 210. The second heat sink 310 includes a second mounting side 311 and a second fin side 312 opposite to the second mounting side 311, with the second fin side 312 facing the first fin side 112.

[0042] The second load circuit module 320 includes a second circuit board 321 and a plurality of second power components 322. The second mounting side 311 of the second heat sink 310 is used for the configuration of the second load circuit module 320. For example, but not limited to, the second mounting side 311 may be provided with a recessed second clearance groove 313, which can be used to provide the space required for the assembly of the second conductive sheet 330 on the second load circuit module 320 (see reference). Figure 8 And the example of the second bracket 3211 used to assemble the second conductive sheet 330 and the second circuit board 321, thereby improving the compactness of the installation of the second heat sink 310, the second load circuit module 320 and the second conductive sheet 330, and also reducing the overall size of the electronic load device.

[0043] The second power element 322, configured on the second circuit board 321, can be fixed to the second circuit board 321 by a locking element or by other electrical connection methods. In the electronic load device, the control of the number of the first power element 122 and the second power element 322 that are turned on allows the operator to determine the load capacity of the electronic load device to match the power supply device to be tested.

[0044] The second conductive sheet 330 extends in the first direction X and is mounted on the second circuit board 321. In this configuration, the second circuit board 321 is positioned between the second heat sink 310 and the second conductive sheet 330. For example, but not limited to, the second circuit board 321 may have a plurality of second supports 3211, the bottom of which may protrude into the second relief groove 313 on the second heat sink 310 and be securely fixed to the second circuit board 321, thereby allowing the second conductive sheet 330 to be securely mounted on the second circuit board 321 and adjacent to the second heat sink 310.

[0045] One end of each conductive post 340 is connected to the first conductive sheet 130, and the other end of each conductive post 340 is connected to the second conductive sheet 330, thereby further securing the first conductive sheet 130 and the second conductive sheet 330 on the outside of the first heat sink 110 and the second heat sink 310. Furthermore, these conductive posts 340 allow the second conductive sheet 330 to be coupled to the first conductive sheet 130, forming an electrical connection. Therefore, the first conductive sheet 130 and the second conductive sheet 330 share the second polarity connection portion 220, for example, being coupled together to the negative terminal of the power supply device under test via the second polarity connection portion 220. In some embodiments, the first conductive sheet 130 and the second conductive sheet 330 can be arranged in a parallel configuration via the conductive posts 340.

[0046] The first polarity (e.g., positive polarity) of the second power element 322 is coupled to the second heat sink 310. Since the first heat sink 110 and the second heat sink 310 are electrically connected, the first polarity of the second power element 322 is also coupled to the first polarity connection portion 210 extending from the first heat sink 110. For example, the second power element 322 can be secured to the body of the second heat sink 310 by a conductive locking element (e.g., a metal screw) passing through the second circuit board 321, thus simultaneously achieving coupling between the second power element 322 and the second heat sink 310. Other coupling relationships are also applicable to this embodiment and are not limited to those described above.

[0047] The second polarity (e.g., negative polarity) of the second power element 322 is coupled to the second conductive sheet 330. Since the first conductive sheet 130 and the second conductive sheet 330 are electrically connected via the conductive post 340, the second polarity of the second power element 322 is also coupled to the second polarity connection portion 220 extending from the first conductive sheet 130. For example, the second power element 322 can be coupled to the second conductive sheet 330 and the second polarity connection portion 220 via the layout lines on the second circuit board 321 and the conductive second bracket 3211 (e.g., the second bracket itself is conductive or has conductive lines within it).

[0048] Regarding the relationship between the length and width of the second conductive plate 330 and the second heat sink 310, it can be configured to be the same as the relationship between the length and width of the first conductive plate 130 and the first heat sink 110. Therefore, the foregoing can be referred to in conjunction with this. Figure 3 , Figure 4 And the corresponding description. That is, the second conductive sheet 330 has a width wider than the second heat sink 310, and the length of the second conductive sheet 330 is at least 1 / 2 of the length of the second heat sink 310.

[0049] Next, please refer to Figure 9 This is a perspective view of an electronic load device according to some embodiments. In this embodiment, a fan module 400 is included, and under normal settings, the airflow over the fins flows in the +X direction. In some other embodiments, an electronic load device may also include multiple arrays such as... Figure 9 The electronic load device shown is designed to achieve a greater load capacity. Assembly within the electronic load device can be achieved through methods such as... Figure 9 The example track assembly 500 (typically configured on the outer sides of both the second conductive sheet 330 and the first conductive sheet 130) facilitates the installation and removal of the electronic load device from the housing of the electronic load equipment, and also makes replacement during maintenance convenient and flexible.

[0050] In summary, by arranging the mechanism to create specific connection relationships between each polarity connection and its corresponding heat sink and conductive plate, the distance between two polarity connections can be reduced, thereby reducing the inductance inside the electronic load device. Consequently, the voltage drop is reduced due to the decrease in path impedance, allowing the electronic load device to be operated in a test environment where the power supply device under test provides a lower voltage, thus avoiding test failure.

[0051] In this application, the terms “approximately,” “about,” “slightly,” “substantially,” or “basically” should generally refer to “any approximation of a given value” or “any approximation of a given range.” These approximations will vary depending on the relevant field, and their range should be consistent with the broadest interpretation understood by one of ordinary skill in the art to cover similar implementations and all modifications based on such variations. In some embodiments, it should generally refer to within 20 percent of a “given value” or “given range,” further to within 10 percent, and even further to within 5 percent. The numerical quantities given herein are approximate, indicating that unless explicitly stated otherwise, these values ​​can be inferred to fall within the categories of “approximately,” “about,” “slightly,” “substantially,” or “basically,” or imply the inclusion of other approximations.

[0052] Preferred embodiments have been disclosed above. However, those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention. It should be noted that all equivalent variations and substitutions to the embodiments are to be understood as falling within the scope of this invention. Therefore, the scope of protection of this invention is determined by the scope of the claims. [Attached image labels]

[0053] 110 First Radiator 111 First Installation Side 112 First fin side 113 First clearance slot 120 First Load Circuit Module 121 First Circuit Board 1211 First support 122 First power element 130 First conductive sheet 210 First polarity connection part 220 Second polarity connection part 221 Adjustment Section 310 Second Radiator 311 Second Installation Side 312 Second fin side 313 Second clearance slot 320 Second Load Circuit Module 321 Second Circuit Board 3211 Second support 322 Second Power Component 330 First conductive sheet 340 conductive pillar 400 fan module 500 track components The width of the first conductive sheet of W11 W12 First Heatsink Width W21 Width of the first polarity connection part W22 Width of the Second Polar Connection L11 Length of the first conductive sheet L12 First radiator length X First Direction Y is the second direction.

Claims

1. An electronic load device with low inductive reactance, comprising: A first heat sink extends in a first direction and includes a first mounting side and a first fin side opposite to the first mounting side; A first load circuit module includes a first circuit board disposed on the first mounting side and extending in the first direction, and a plurality of first power components disposed on the first circuit board; and A first conductive sheet extends in the first direction and is mounted on the first circuit board, such that the first circuit board is disposed between the first heat sink and the first conductive sheet; A first polarity connection portion, coupled to one end of the first heat sink and protruding from the end of the first heat sink along the first direction; and A second polarity connection portion is coupled to one end of the first conductive sheet and protrudes from the end of the first conductive sheet along the first direction. The first polarity of the plurality of first power elements is coupled to the first heat sink and the first polarity connection portion, and the second polarity of the plurality of first power elements is coupled to the first conductive sheet and the second polarity connection portion.

2. The electronic load device as claimed in claim 1, wherein, The first polarity connection portion protrudes from the end of the first heat sink in the form of a sheet, and the second polarity connection portion protrudes from the end of the first conductive sheet in the form of a sheet.

3. The electronic load device as claimed in claim 2, wherein, The first direction is the extension direction of the length and is the airflow channel direction of the first heat sink. A second direction perpendicular to the first direction is the extension direction of the width. The first conductive sheet has a width wider than the width of the first heat sink, and the length of the first conductive sheet is at least 1 / 2 of the length of the first heat sink.

4. The electronic load device as claimed in claim 3, wherein, The front section of the second polarity connector has an adjustment section that reduces the distance between it and the first polarity connector by being bent.

5. The electronic load device as claimed in claim 4, wherein, The first polarity connection portion is parallel to the adjustment section of the second polarity connection portion.

6. The electronic load device as claimed in claim 5, wherein, The first polarity connection portion protrudes more than the second polarity connection portion in the first direction, and the width of the first polarity connection portion is narrower than the width of the second polarity connection portion.

7. The electronic load device as claimed in claim 1, wherein, The first polarity connection is an input copper busbar, and the second polarity connection is an output copper busbar.

8. The electronic load device as claimed in claim 1, wherein, The first heat sink has a recessed first clearance groove on the first mounting side. The first clearance groove is for the protrusion of the bottom of a plurality of first brackets disposed on the first circuit board. The plurality of first brackets are for the first conductive sheet to be mounted on the first circuit board.

9. The electronic load device as claimed in any one of claims 3 to 8, wherein, Further includes: A second heat sink extends in the first direction and is coupled to the first heat sink, the second heat sink including a second mounting side and a second fin side opposite to the second mounting side, the second fin side facing the first fin side; A second load circuit module includes a second circuit board disposed on the second mounting side and extending in the first direction, and a plurality of second power components disposed on the second circuit board; A second conductive sheet extends in the first direction and is mounted on the second circuit board, such that the second circuit board is disposed between the second heat sink and the second conductive sheet; and A plurality of conductive posts are provided, one end of each conductive post being connected to the first conductive sheet, and the other end of each conductive post being connected to the second conductive sheet. The second conductive sheet is coupled to the first conductive sheet through the plurality of conductive posts. The first polarity of the plurality of second power elements is coupled to the second heat sink and the first polarity connection portion, and the second polarity of the plurality of second power elements is coupled to the second conductive sheet and the second polarity connection portion.

10. The electronic load device of claim 9, wherein the second conductive sheet has a width wider than the width of the second heat sink, and the length of the second conductive sheet is at least 1 / 2 of the length of the second heat sink.

11. The electronic load device as claimed in claim 10, wherein, The first conductive sheet and the second conductive sheet are arranged in parallel to each other through the plurality of conductive posts.

12. The electronic load device as claimed in claim 11, wherein, It further includes a fan module disposed at one end of the first heat sink and the second heat sink, and located on one side of the first polarity connection portion and the second polarity connection portion, for driving the fluid in the airflow channel defined by the first fin side and the second fin side.

13. The electronic load device as claimed in claim 12, wherein, The second heat sink has a recessed second clearance groove on the second mounting side. The second clearance groove provides for the protrusion of the bottom of a plurality of second brackets disposed on the second circuit board. The plurality of second brackets are adapted to allow the second conductive sheet to be mounted on the second circuit board.

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