Temperature detection device and silicon water temperature detection system

Abstract

The invention relates to a temperature detection device and a silicon water temperature detection system. The movable part is provided with two opposite ends in the lengthwise direction of the movable part, and one end of the movable part is rotatably mounted on the main body part; the driving piece is in transmission connection with the main body piece and the movable piece, and the driving piece is used for driving the movable piece to rotate relative to the main body piece; and the temperature measuring assembly is mounted at the other end of the movable part, and a non-contact temperature sensor is arranged on the temperature measuring assembly. Through a non-contact temperature measurement mode, direct contact between the temperature sensor and high-temperature silicon water can be avoided, the sensor is prevented from being damaged due to direct contact with the high-temperature silicon water, and the service life of equipment is prolonged. The temperature sensor is driven by the driving part to realize multi-angle and multi-area detection of the silicon water, different positions of the silicon water in the ladle can be covered, local temperature difference can be effectively captured, complete data support is provided for judging the temperature uniformity of the silicon water, and process misjudgment caused by local data deviation is avoided.

Description

Technical Field

[0001] This application relates to the field of temperature measuring device technology, and in particular to a temperature detection device and a silicon water temperature detection system. Background Technology

[0002] In the oxygen refining process of industrial silicon, molten silicon exhibits good fluidity within a suitable temperature range, facilitating oxygen diffusion and full reaction with impurities. Excessively high temperatures exacerbate equipment corrosion and increase the iron content in the molten silicon; conversely, excessively low temperatures increase the viscosity of the molten silicon, reducing oxygen diffusion rates and impurity reactivity, thus affecting the quality of industrial silicon. Furthermore, slagging agents are sometimes added during refining to enhance impurity removal. Improper addition of slagging agents leading to excessively low local temperatures can cause molten silicon to clump together, resulting in production losses and equipment damage.

[0003] Therefore, the uniformity of silicon molten metal temperature distribution directly affects product quality and energy efficiency, making accurate and comprehensive monitoring of silicon molten metal temperature crucial. Traditional silicon molten metal temperature monitoring methods mostly rely on contact temperature measuring devices (such as embedded thermocouples) and often employ single-point fixed monitoring. Traditional contact temperature measuring devices are easily corroded and damaged by the high-temperature melt under long-term high-temperature conditions, resulting in short service life, poor reliability, and frequent replacement. Furthermore, single-point fixed monitoring cannot comprehensively reflect the true temperature distribution of the silicon molten metal within the ladle, leading to insufficient data representativeness. Summary of the Invention

[0004] Therefore, it is necessary to provide a temperature detection device and a silicon water temperature detection system to address the problems of short service life, poor reliability, and inability to fully reflect the true temperature distribution of silicon water in the tub.

[0005] A temperature detection device, comprising:

[0006] Main components;

[0007] The movable component has two opposing ends along its longitudinal direction, one end of which is rotatably mounted on the main component;

[0008] A driving component is connected to the main body and the movable component, and the driving component is used to drive the movable component to rotate relative to the main body.

[0009] A temperature measuring component is installed at the other end of the movable part, and a non-contact temperature sensor is provided on the temperature measuring component.

[0010] In one embodiment, the temperature measuring component includes a temperature measuring housing, the temperature sensor is disposed on the temperature measuring housing, and a cooling channel is provided inside the temperature measuring housing. An injection pipe and a discharge pipe are provided on the outside of the temperature measuring housing, and the injection pipe and the discharge pipe are both connected to the cooling channel.

[0011] In one embodiment, the movable component further includes a shielding cover disposed on the temperature measuring housing and having a shielding cavity, wherein the temperature sensor is located within the shielding cavity.

[0012] In one embodiment, the temperature detection device further includes a purging assembly for generating a purging airflow that passes through the temperature sensor and forms an air curtain on one side of the temperature sensor.

[0013] In one embodiment, the purging assembly includes a fan, a purging platform, a mounting platform, and a dust collector. The mounting platform is disposed on the temperature measuring assembly. The purging platform and the dust collector are both disposed on the purging platform, and the mounting platform and the dust collector are arranged at intervals. The temperature sensor is located between the purging platform and the dust collector.

[0014] The fan is mounted on the main body, the blowing platform is connected to the fan and is used to spray the blowing airflow toward the dust collector, and the dust collector is used to collect the dust from the blowing airflow.

[0015] In one embodiment, the purging assembly further includes a first lifting cylinder having a retractable first lifting rod, the first lifting cylinder being disposed on the mounting platform, and the first lifting rod being connected to the purging platform;

[0016] And / or, the purging assembly further includes a second lifting cylinder having a retractable second lifting rod, the second lifting cylinder being disposed on the mounting platform, and the second lifting rod being connected to the dust collector.

[0017] In one embodiment, the driving component is a driving cylinder, which includes a cylinder body and a driving rod retractably disposed within the cylinder body. The cylinder body is rotatably disposed on the main body, and the driving component is rotatably connected to the movable component.

[0018] The temperature detection device further includes an elastic element that elastically connects the main body and the movable part. The movable part has an initial position and a detection position during its movement. During the movement of the movable part from the initial position to the detection position, the elastic element accumulates an elastic force to enable the movable part to move from the detection position to the initial position.

[0019] In one embodiment, the temperature detection device includes a reinforcing shell and a reinforcing rod. One end of the reinforcing shell is rotatably mounted on the main body, and the other end is provided with a sliding hole. One end of the reinforcing rod passes through the sliding hole, and the other end is connected to the movable member. An elastic member is disposed in the sliding hole, and the elastic member connects the end face of the reinforcing rod to the bottom wall of the sliding hole.

[0020] In one embodiment, the temperature detection device further includes a mounting plate and mounting screws. The mounting plate is provided on both opposite sides of the main body. The mounting screws pass through the mounting plate and connect the mounting plate to an external mounting base.

[0021] A silicon water temperature detection system includes a temperature detection device as described in any of the preceding claims.

[0022] When the aforementioned temperature detection device is applied to industrial silicon oxygen refining equipment, it is positioned above the industrial silicon ladle. The industrial silicon ladle is a key piece of equipment used in the industrial silicon smelting process for ladle refining and casting, primarily used to hold high-temperature molten silicon and perform impurity removal processes. The temperature detection device uses a temperature sensor to receive the infrared radiation energy emitted by the molten silicon, thereby measuring its temperature. This non-contact temperature measurement method avoids direct contact between the temperature sensor and the high-temperature molten silicon, preventing sensor damage and extending the equipment's lifespan.

[0023] By driving the moving parts relative to the main body, the temperature sensing component rotates relative to the main body, allowing the temperature sensor to move to different locations within the silica melt and thus detect the temperature at those locations. In this way, the temperature sensor, driven by the driving component, enables multi-angle, multi-area detection of the silica melt, covering different locations within the ladle and effectively capturing localized temperature differences. This provides comprehensive data support for determining the temperature uniformity of the silica melt, avoiding process misjudgments caused by localized data deviations. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the temperature detection device in some embodiments of this application.

[0025] Figure 2 for Figure 1 A schematic diagram of the temperature measuring component in the embodiment.

[0026] Figure 3 for Figure 1 A schematic diagram of the purging assembly in the embodiment.

[0027] Figure 4 for Figure 1 A schematic diagram of the reset component in the embodiment.

[0028] Figure 5 This is a schematic diagram of the working process of the silicon water temperature detection system in some embodiments of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] Main component 10; Mounting plate 11; Mounting screws 12;

[0031] Moving part 20; driving part 21; driving cylinder 22; driving rod 23; cylinder body 24;

[0032] Temperature measuring component 30; temperature sensor 31; temperature measuring housing 32; injection pipe 33; discharge pipe 34; shielding cover 35;

[0033] Blowing assembly 40; blower 41; blower station 42; mounting platform 43; dust collector 44; first lifting cylinder 45; first lifting rod 46; second lifting cylinder 47; second lifting rod 48;

[0034] Elastic element 50; Reinforcing shell 51; Reinforcing rod 52; Sliding hole 53; Third mounting shaft 54; Fourth mounting shaft 55;

[0035] Delivery hose 60; high-pressure nozzle 61; air inlet 62; air outlet 63; locking screw 64; mounting base 65; air inlet channel 66. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] See Figure 1 and Figure 2 , Figure 1A schematic diagram of a temperature detection device according to an embodiment of this application is shown. The temperature detection device provided in this embodiment includes a main body 10, a movable part 20, a driving part 21, and a temperature measuring component 30. The main body 10 serves as the main supporting component of the entire temperature detection device. In actual use, the main body 10 is directly placed on the ground, or it is installed on a wall or other mounting base. Then, the movable part 20, the driving part 21, and the temperature measuring component 30 are all mounted on the main body 10 to achieve the effect of fixing the entire temperature detection device.

[0043] The movable component 20 has two opposing ends along its longitudinal direction, and one end of the movable component 20 is rotatably mounted on the main body 10. The driving component 21 drives the main body 10 and the movable component 20 to rotate relative to the main body 10. The temperature measuring component 30 is mounted on the other end of the movable component 20, and a non-contact temperature sensor 31 is provided on the temperature measuring component 30.

[0044] In actual use, when the driving component 21 drives the movable component 20 to rotate relative to the main body 10, the temperature measuring component 30 located on the movable component 20 will rotate along with the movable component 20, thereby changing the position of the temperature measuring component 30 and thus changing the position of the temperature sensor 31. This allows the temperature sensor 31 to detect the temperature at different locations of the object to be detected. By setting the temperature sensor 31 to be non-contact, direct contact between the temperature sensor 31 and the object to be detected can be avoided, preventing damage to the temperature sensor 31 after prolonged contact with a high-temperature object.

[0045] Optionally, the temperature sensor 31 is a non-contact temperature sensor based on the blackbody radiation law. The temperature sensor 31 measures temperature by receiving the infrared radiation energy emitted by the object. It should be noted that in some other embodiments, the temperature sensor 31 may also be a laser temperature sensor 31 that emits a laser beam and analyzes the changes in the laser signal reflected by the object, or a microwave temperature sensor 31 that emits a microwave signal and analyzes the changes in the signal reflected back by the object, etc., which are currently existing non-contact temperature sensors 31, and are not limited here.

[0046] When the temperature detection device is applied in industrial silicon oxygen refining equipment, it is positioned above the industrial silicon ladle. The industrial silicon ladle is a key piece of equipment used for ladle refining and casting in the industrial silicon smelting process, primarily used to hold high-temperature molten silicon and perform impurity removal processes. The temperature detection device, through temperature sensor 31, receives the infrared radiation energy emitted by the molten silicon, thereby measuring the temperature of the molten silicon. This non-contact temperature measurement method avoids direct contact between the temperature sensor 31 and the high-temperature molten silicon, preventing damage to the sensor and extending the equipment's lifespan.

[0047] The driving component 21 drives the movable component 20 to rotate relative to the main body 10, thereby causing the temperature sensing component 30 to rotate relative to the main body 10. This allows the temperature sensor 31 to move to different positions in the silicon water, enabling temperature detection at different locations. Thus, by driving the temperature sensor 31 via the driving component 21, multi-angle and multi-area detection of the silicon water can be achieved, covering different positions within the silicon water package. This effectively captures local temperature differences, providing complete data support for judging the temperature uniformity of the silicon water and avoiding process misjudgments caused by local data deviations.

[0048] When the temperature detection device is applied to industrial silicon oxygen refining equipment, although the temperature sensor 31 does not need to be in direct contact with the molten silicon inside the industrial silicon ladle, the detection device still needs to be placed close to the industrial silicon ladle. However, during operation, the industrial silicon ladle and the molten silicon inside continuously radiate high-temperature radiation outwards. This high-temperature radiation causes the temperature of the temperature sensing component 30 to rise continuously, thus affecting the accuracy of the temperature sensor 31. Furthermore, the continuous exposure of the temperature sensing component 30 to a high-temperature environment also reduces its lifespan.

[0049] Therefore, in some embodiments of this application, the temperature measuring component 30 includes a temperature measuring housing 32, a temperature sensor 31 disposed on the temperature measuring housing 32, and a cooling channel provided inside the temperature measuring housing 32. An injection pipe 33 and a discharge pipe 34 are provided on the outside of the temperature measuring housing 32, both of which are connected to the cooling channel. In actual use, the temperature measuring housing 32, as a component exposed to heat radiation, is made of high-temperature resistant stainless steel. The injection pipe 33 is used to connect to an external cooling system, which provides coolant. The coolant flows through the injection pipe 33 into the cooling channel inside the temperature measuring housing 32, where it exchanges heat with the housing, thereby reducing the temperature of the housing. After heat exchange, the coolant is discharged from the temperature measuring housing 32 through the discharge channel and can be recycled back into the cooling system.

[0050] The flow of coolant within the cooling channels effectively cools the temperature sensing housing 32, thereby suppressing interference from the high-temperature heat radiation emitted by the industrial silicon ladle and molten silicon on the temperature sensing component 30. This ensures the continuous stability of the data monitored by the temperature sensor 31, meeting the process requirements for continuous temperature measurement during industrial silicon refining. Simultaneously, reducing the operating temperature of the temperature sensing housing 32 further minimizes wear and tear on the core components of the temperature sensing component 30 caused by the high-temperature environment, reducing equipment replacement frequency, lowering maintenance costs, and extending equipment lifespan.

[0051] In some embodiments, the movable component 20 further includes a shielding cover 35. The shielding cover 35 is threadedly connected to the temperature measuring housing 32 and has a shielding cavity. The temperature sensor 31 is located inside the shielding cavity. In actual use, the shielding cover 35 is also provided with an opening communicating with the shielding cavity. The opening can be open or a transparent part such as glass can be provided at the opening, facing the silicon water or the object to be measured, so that the infrared radiation of the silicon water can enter the temperature sensor 31 through the opening and be received by the temperature sensor 31 to measure the temperature of the silicon water. By enclosing the temperature sensor 31 with the shielding cover 35, heat radiation is prevented from directly impacting the temperature sensor 31, thereby improving the detection accuracy of the temperature sensor 31.

[0052] Furthermore, when the temperature detection device is applied in industrial silicon oxygen refining equipment, in addition to being subjected to the heat radiation from the industrial silicon ladle and silicon water, the industrial silicon ladle will also generate a large amount of dust in the working chamber. The dust accumulates on the surface of the temperature sensor 31, which will seriously affect the detection results of the temperature sensor 31.

[0053] Therefore, in some embodiments of this application, see reference to Figure 1 and Figure 3 The temperature detection device also includes a purging assembly 40, which generates a purging airflow. This purging airflow passes through the temperature sensor 31 and forms an air curtain on one side of the temperature sensor 31. Thus, when the purging airflow passes through the temperature sensor 31, it can clean impurities adhering to the surface of the temperature sensor 31, preventing dust from obstructing the surface and ensuring detection accuracy. Furthermore, the air curtain formed on one side of the temperature sensor 31 prevents dust accumulation on its surface during operation, ensuring the stability of detection accuracy during continuous operation.

[0054] In some embodiments, see Figure 3 The purging assembly 40 includes a fan 41, a spray platform 42, a mounting platform 43, and a dust collector 44. The mounting platform 43 is mounted on the temperature measuring assembly 30. Both the spray platform 42 and the dust collector 44 are mounted on the mounting platform 43, and the mounting platform 43 and the dust collector 44 are spaced apart. The temperature sensor 31 is located between the spray platform 42 and the dust collector 44. The fan 41 is mounted on the main body 10. The spray platform 42 is connected to the fan 41 and is used to spray purging airflow toward the dust collector 44. The dust collector 44 is used to collect the dust from the purging airflow.

[0055] Thus, by setting the mounting platform 43 on the movable part 20, the mounting platform 43 can rotate around the movable part 20 together with the temperature measuring component 30, thereby ensuring that the airflow generated by the spraying station 42 can pass through the temperature sensor 31 no matter where the temperature measuring component 30 rotates. Furthermore, the fan 41 is provided with an air inlet channel 66, and the fan 41 is connected to the spraying station 42 through a delivery hose 60. The fan 41 draws in external air through the air inlet channel 66 and generates a high-pressure airflow. The airflow enters the spraying station 42 through the delivery hose 60, and the spraying station 42 is provided with multiple high-pressure nozzles 61. Each high-pressure nozzle 61 is connected to the delivery hose 60, and each high-pressure nozzle 61 is directed towards the temperature sensor 31 and the dust collector 44. The high-pressure airflow in the delivery hose 60 is sprayed out through the multiple high-pressure nozzles 61, thereby generating a purging airflow. The purging airflow enters the dust collector 44 after passing through the temperature sensor 31.

[0056] The dust collector 44 contains filter bags. When the blowing airflow enters the dust collector 44, it enters the filter bags, creating a positive pressure environment that traps dust. The dust collector 44 also has an inlet 62 and an outlet 63, both connected to its interior. The inlet 62 faces the blowing platform 42, allowing the blowing airflow to enter the dust collector 44 through it, and the purified air to exit through the outlet 63. Thus, the blowing assembly 40 cleans the surface of the temperature sensor 31 and collects dust from the space, achieving dust removal in the workspace.

[0057] In some specific embodiments, the mounting platform 43 is fixed to the temperature measuring housing 32 by locking screws 64, and the purging assembly 40 further includes a first lifting cylinder 45 and a second lifting cylinder 47. The first lifting cylinder 45 has a retractable first lifting rod 46, and the first lifting cylinder 45 is disposed on the mounting platform 43. The first lifting rod 46 is connected to the blowing platform 42. The purging assembly 40 also includes a second lifting cylinder 47 and a mounting base 65. The second lifting cylinder 47 has a retractable second lifting rod 48, and the second lifting cylinder 47 is disposed on the mounting platform 43. The second lifting rod 48 is connected to the dust collector 44 through the mounting base 65.

[0058] Optionally, both the first lifting cylinder 45 and the second lifting cylinder 47 are pneumatic cylinders. By adjusting the extension and retraction of the first lifting rod 46 and the second lifting rod 48, the positions of the blowing table 42 and the dust collector 44 can be changed accordingly. Thus, by adjusting the first lifting cylinder 45 and the second lifting cylinder 47, the positions of the blowing table 42 and the dust collector 44 can be adjusted so that the blowing table 42 and the dust collector 44 can be aligned with each other, ensuring the blowing effect of the blowing table 42 on the temperature sensor 31 and the dust removal effect of the dust collector 44.

[0059] In some embodiments of this application, see [reference] Figure 1 and Figure 4 The driving component 21 is a driving cylinder 22, which includes a cylinder body and a driving rod 23 retractably disposed within the cylinder body. The cylinder body is rotatably mounted on the main body 10 via a first mounting shaft, and the driving component 21 is rotatably connected to the movable component 20 via a second mounting shaft. Thus, when the driving rod 23 extends or retracts relative to the cylinder body, the driving rod 23 can drive the movable component 20 to rotate around the main body 10, thereby realizing the change of position of the temperature measuring component 30.

[0060] The temperature detection device also includes an elastic element 50, which elastically connects the main body 10 and the movable part 20. The movable part 20 has an initial position and a detection position during its movement. As the movable part 20 moves from the initial position to the detection position, the elastic element 50 accumulates an elastic force to allow the movable part 20 to move from the detection position back to the initial position. Thus, the elastic element 50 can buffer the movement of the movable part 20, facilitating subsequent repositioning of the movable part 20. Optionally, the elastic element 50 is a spring; in other embodiments, the elastic element 50 can also be a rubber component or other elastic material.

[0061] Furthermore, the reset assembly includes a reinforcing shell 51 and a reinforcing rod 52. One end of the reinforcing shell 51 is rotatably mounted on the main body 10 via a third mounting shaft 54, and the other end is provided with a sliding hole 53. One end of the reinforcing rod 52 passes through the sliding hole 53, and the other end is connected to the movable member 20 via a fourth mounting shaft 55. An elastic member 50 is disposed in the sliding hole 53, and the elastic member 50 connects the end face of the reinforcing rod 52 to the bottom wall of the sliding hole 53. Optionally, the reinforcing shell 51 and the cylinder are respectively disposed on opposite sides of the main body 10 in the direction of the rotation axis of the movable member 20, so that the reinforcing rod 52 and the driving member 21 can be located on opposite sides of the movable member 20, so as to improve the stability of the movement of the movable member 20 by the cooperation of the reinforcing shell 51 and the reinforcing rod 52 with the driving member 21.

[0062] When the drive rod 23 extends relative to the cylinder body, it drives the movable part 20 to rotate around the main body 10. The movable part 20 then drives the reinforcing shell 51 and the reinforcing rod 52 to rotate around the main body 10. Simultaneously, the movable part 20 also drives the reinforcing rod 52 to extend, sliding along the sliding hole 53, thereby improving the stability of the movable part 20's deflection. At the same time, the reinforcing rod 52 also causes the elastic element 50 to stretch, allowing it to undergo elastic deformation to buffer the tensile force and facilitate the subsequent reset of the movable part 20. When the drive rod 23 retracts relative to the cylinder body, the movement of the movable part 20 and the reinforcing part is reversed, which will not be elaborated here.

[0063] In some embodiments of this application, the temperature detection device further includes a mounting plate 11 and mounting screws 12. Mounting plates 11 are provided on both opposite sides of the main body 10. The mounting screws 12 pass through the mounting plates 11 and connect the mounting plates 11 to the external mounting base. Thus, the mounting plates 11 are fixed to the external mounting base by the mounting screws 12 to realize the installation of the temperature detection device.

[0064] When using the temperature detection device of this application, the user tightens the mounting screws 12 to install the mounting plate 11 at the point of use, thus completing the installation of the temperature detection device. Afterwards, the cylinder drives the drive rod 23 to extend and retract. The drive rod 23 pushes the movable part 20 from the bottom. During the angular deflection of the movable part 20 relative to the main body 10, the reinforcing rod 52 slides along the reinforcing shell 51, improving the stability of the deflection of the movable part 20. Furthermore, the reinforcing rod 52 pulls the elastic member 50 from one side. The elastic member 50 is elastic, and its elastic deformation buffers the pulling force, facilitating the subsequent retraction of the movable part 20.

[0065] Temperature sensor 31 is a non-contact temperature measuring device based on the blackbody radiation law. It measures temperature by receiving infrared radiation energy emitted by an object. This non-contact sensor allows for monitoring of the silicon water temperature from different locations. The components of the temperature measuring housing 32 exposed to heat radiation are made of high-temperature resistant stainless steel, and the shielding cover 35 reduces direct heat radiation impact.

[0066] Meanwhile, the cooled liquid is injected into the injection pipe 33 and discharged through the discharge pipe 34. The fan 41 sprays the airflow generated by the fan 41 through the delivery hose 60 and sprays it out through the high-pressure nozzle 61 to clean the impurities adhering to the surface of the temperature sensor 31. The dust-laden gas enters the dust collector 44 with filter bags under the push of the fan 41. The dust collector 44 forms an internal positive pressure environment. The dust is intercepted by the filter bags of the bag dust collector 44, and the purified gas is discharged from the top of the exhaust port.

[0067] This application also provides a silicon water temperature detection system, which includes the temperature detection device as described in any of the above embodiments, and see also... Figure 5 The silicon water temperature detection system also includes an A / D converter, a wireless transmitter / receiver module, a reader / writer, a communication module, and a computer. Specifically, the temperature sensor 31 collects the temperature data of the silicon water at key points in real time, the A / D converter converts the physical signal into a digital signal, the wireless transmitter / receiver module transmits the signal to the reader / writer, and the communication module uploads it to the computer for real-time monitoring. This enables the silicon water temperature detection system of this application to have single-channel or multi-channel temperature curve display and overheat warning functions.

[0068] Furthermore, the silicon water temperature detection system can achieve 24-hour uninterrupted transmission of silicon water temperature through IoT technology. The external server cleans, verifies, and standardizes the received data, removing invalid data and outliers. For example, the wireless temperature measurement system uses professional algorithms to remove invalid data and generate standardized silicon water temperature data. The integrated silicon water temperature monitoring system uses machine learning models to identify abnormal data in real time and triggers an alarm when the data exceeds a preset threshold. For example, the wireless temperature measurement system connected to temperature sensor 31 provides timely warnings through temperature curve display and overheating warning functions. The silicon water temperature monitoring system automatically compares the current water level with the warning value, and immediately sends an alarm message if it exceeds the range.

[0069] The temperature detection device of this invention, by incorporating a non-contact temperature sensor 31, a main body 10, a moving part 20, a purging assembly 40, a driving part 21, and a matching cooling and data transmission system, constructs a non-contact, multi-point, continuous monitoring system suitable for the temperature of silicon water in industrial silicon ladle packaging. This effectively solves the problems of easy damage and unrepresentative single-point monitoring in traditional contact temperature measurement methods. Compared with the prior art, the beneficial effects of this invention are:

[0070] 1. Multi-point monitoring and comprehensive data: The moving part 20 is driven by the driving part 21 to deflect relative to the main part 10, thereby driving the non-contact temperature sensor 31 to achieve multi-angle and multi-position monitoring. This can cover the silicon water temperature in different areas of the package, avoid local errors caused by single-point temperature measurement, and truly reflect the silicon water temperature distribution, providing reliable data support for process control.

[0071] 2. Non-contact temperature measurement and long lifespan: The non-contact temperature sensor 31 based on the blackbody radiation principle does not need to be in direct contact with high-temperature silicon water, which fundamentally avoids the problem of sensor being corroded and damaged by high-temperature melt, significantly extending the service life of the equipment and reducing maintenance frequency and cost.

[0072] 3. Strong environmental adaptability and high stability: The purge assembly 40 continuously sprays clean compressed air to form an air curtain in front of the temperature sensor 31, effectively preventing dust from adhering and keeping the optical path clean; at the same time, in conjunction with the coolant circulation system, the temperature measuring housing 32 is actively cooled to reduce the impact of heat radiation and ensure that the temperature sensor 31 can still work stably and accurately in high-temperature and harsh environments.

[0073] 4. Stable structure and high reliability: The stability and reset performance of the moving part 20 are enhanced by spring buffer and sliding structure. The overall structure has good rigidity and strong shock resistance, and is suitable for complex environments with large vibration and large temperature difference in industrial sites.

[0074] 5. Intelligent monitoring and real-time early warning: Through A / D conversion, wireless transmission and 485 communication modules, temperature data is uploaded to the computer system in real time. It supports multi-channel temperature curve display and overheating early warning function. Combined with data cleaning and machine learning algorithms, it can automatically identify abnormal data and trigger early warning, realizing intelligent, remote and continuous monitoring of silicon water temperature.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A temperature detection device, characterized in that, The temperature detection device includes: Main component (10); The movable part (20) has two opposite ends in its longitudinal direction, one end of which is rotatably mounted on the main body part (10); A driving member (21) is connected to the main body (10) and the movable member (20) in a transmission manner. The driving member (21) is used to drive the movable member (20) to rotate relative to the main body (10). A temperature measuring component (30) is installed at the other end of the movable part (20), and a non-contact temperature sensor (31) is provided on the temperature measuring component (30).

2. The temperature detection device according to claim 1, characterized in that, The temperature measuring component (30) includes a temperature measuring housing (32), the temperature sensor (31) is disposed on the temperature measuring housing (32), and a cooling channel is provided inside the temperature measuring housing (32). An injection pipe (33) and an discharge pipe (34) are provided on the outside of the temperature measuring housing (32), and the injection pipe (33) and the discharge pipe (34) are both connected to the cooling channel.

3. The temperature detection device according to claim 2, characterized in that, The movable part (20) also includes a shield (35), which is disposed on the temperature measuring housing (32) and has a shield cavity, and the temperature sensor (31) is located inside the shield cavity.

4. The temperature detection device according to claim 1, characterized in that, The temperature detection device further includes a purging assembly (40) for generating a purging airflow that passes through the temperature sensor (31) and forms an air curtain on one side of the temperature sensor (31).

5. The temperature detection device according to claim 4, characterized in that, The purging assembly (40) includes a fan (41), a spraying platform (42), a mounting platform (43), and a dust collector (44). The mounting platform (43) is located on the temperature measuring assembly (30). The spraying platform (42) and the dust collector (44) are both located on the spraying platform (42), and the mounting platform (43) and the dust collector (44) are arranged at intervals. The temperature sensor (31) is located between the spraying platform (42) and the dust collector (44). The blower (41) is mounted on the main body (10), the blower (42) is connected to the blower (41) and is used to spray the blowing airflow toward the dust collector (44), and the dust collector (44) is used to collect the dust of the blowing airflow.

6. The temperature detection device according to claim 5, characterized in that, The purging assembly (40) further includes a first lifting cylinder (45), which has a retractable first lifting rod (46). The first lifting cylinder (45) is located on the mounting platform (43), and the first lifting rod (46) is connected to the purging station (42). And / or, the purging assembly (40) further includes a second lifting cylinder (47) having a retractable second lifting rod (48), the second lifting cylinder (47) being disposed on the mounting platform (43), and the second lifting rod (48) being connected to the dust collector (44).

7. The temperature detection device according to claim 1, characterized in that, The driving component (21) is a driving cylinder (22), which includes a cylinder body and a driving rod (23) that is telescopically disposed in the cylinder body. The cylinder body is rotatably disposed on the main body (10), and the driving component (21) is rotatably connected to the movable component (20). The temperature detection device further includes an elastic element (50), which elastically connects the main body (10) and the movable part (20). The movable part (20) includes an initial position and a detection position during its movement. During the movement of the movable part (20) from the initial position to the detection position, the elastic element (50) accumulates an elastic force to enable the movable part (20) to move from the detection position to the initial position.

8. The temperature detection device according to claim 7, characterized in that, The temperature detection device includes a reinforcing shell (51) and a reinforcing rod (52). One end of the reinforcing shell (51) is rotatably mounted on the main body (10), and the other end is provided with a sliding hole (53). One end of the reinforcing rod (52) passes through the sliding hole (53), and the other end is connected to the movable part (20). The elastic element (50) is located in the sliding hole (53), and the elastic element (50) connects the end face of the reinforcing rod (52) to the bottom wall of the sliding hole (53).

9. The temperature detection device according to claim 1, characterized in that, The temperature detection device also includes a mounting plate (11) and mounting screws (12). The mounting plate (11) is provided on both sides of the main body (10). The mounting screws (12) pass through the mounting plate (11) and connect the mounting plate (11) to the external mounting base.

10. A silicon water temperature detection system, characterized in that, Includes the temperature detection device as described in any one of claims 1-9.

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