Automatic testing method and device, equipment and storage medium

Abstract

The invention provides an automatic test method, device and equipment and a storage medium, the automatic test method is applied to the automatic test equipment, the automatic test equipment comprises a driving mechanism, a detection mechanism and a double-probe mechanism, and the automatic test method comprises the following steps: controlling the driving mechanism to drive probes in the double-probe mechanism to move to a detection point position of a to-be-detected material; when the probe is in contact with the detection point, collecting measurement data of the detection point through a detection mechanism; judging whether the to-be-detected material is an unqualified material or not according to the measurement data and preset standard information; and when the to-be-detected material is an unqualified material, obtaining abnormal data in the measurement data. According to the invention, the automatic measurement of the measurement data of the to-be-detected material can be realized, the measurement precision is improved, the labor cost is saved, the unqualified material can be detected automatically, rapidly and accurately, the yield is improved, the abnormal data of the unqualified material can be obtained automatically, and the detection efficiency is improved. The automatic analysis of the disqualification reason of the to-be-detected material is realized.

Description

Technical Field

[0001] This application relates to the field of testing technology, specifically to an automatic testing method, apparatus, equipment, and storage medium. Background Technology

[0002] In the field of digital electronic product manufacturing, especially in the production and quality control of printed circuit boards (PCBAs), testing the electrical signals of the PCBA is crucial to ensure its normal function and stable performance.

[0003] However, PCBA electrical signals are diverse and easily affected by factors such as power fluctuations and interference noise. Currently, to ensure accuracy, high-precision measuring instruments and strict testing procedures are required for electrical signal measurement. These instruments are often expensive and complex to operate, demanding a high level of skill from the personnel. Furthermore, subjective differences in measurement methods and data processing among different personnel can influence test results. Therefore, in current electrical signal measurement and testing processes, instrument control, data reading, and test information analysis and recording all rely on manual labor, resulting in cumbersome processes, low efficiency, and weak accuracy and reliability of test results. Summary of the Invention

[0004] In view of the above, this application provides an automatic testing method, apparatus, device, and storage medium to solve the technical problem that in the existing electrical signal measurement and testing process, whether it is the control of measuring instruments, data reading, or analysis and recording of test information, all need to be done manually, resulting in cumbersome testing and measurement processes, low testing and measurement efficiency, and weak accuracy and reliability of test results.

[0005] This application provides an automatic testing method applied to an automatic testing device, the automatic testing device including a driving mechanism, a detection mechanism, and a dual-probe mechanism, and the automatic testing method includes:

[0006] The drive mechanism is controlled to move the probes in the dual-probe mechanism to the detection point of the material to be tested;

[0007] When the probe contacts the detection point, the detection mechanism collects measurement data of the detection point.

[0008] Based on the measurement data and preset standard information, determine whether the material to be tested is a non-conforming material;

[0009] When the material to be tested is a non-conforming material, abnormal data in the measurement data is acquired.

[0010] In some embodiments, after acquiring abnormal data in the measurement data, the automated testing method further includes:

[0011] A maintenance strategy is determined based on the abnormal data, and the material to be tested is repaired according to the maintenance strategy.

[0012] In some embodiments, after the material to be tested has been repaired, the automated testing method further includes:

[0013] Obtain the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected, and determine the repair success rate of the materials to be inspected based on the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected.

[0014] In some embodiments, the dual-probe mechanism includes a camera, and the automated testing method further includes:

[0015] The camera acquires images of the detection points of the material to be detected.

[0016] The detection point image is compared and analyzed with a standard image to obtain the analysis results, wherein the standard image includes preset detection points;

[0017] Based on the analysis results, determine whether the position of the detection point is the same as the position of the preset detection point;

[0018] When the position of the detection point is the same as the position of the preset detection point, the driving mechanism is controlled to drive the probe to contact the detection point.

[0019] In some embodiments, before the probe contacts the detection point, the automated testing method further includes:

[0020] When the position of the detection point is different from the position of the preset detection point, the driving mechanism is controlled to move the probe to the position of the preset detection point.

[0021] In some embodiments, the dual-probe mechanism includes a first probe, a second probe, and a telescopic drive component, and the automatic testing method further includes:

[0022] The telescopic drive is controlled by a first control signal to move the second probe upward, so that the end of the second probe is above the end of the first probe, wherein the first control signal indicates that the first probe is in contact with the detection point.

[0023] The second control signal controls the telescopic drive to move the second probe downward, so that the end of the second probe is above the end of the first probe, wherein the second control signal indicates that the second probe is in contact with the detection point.

[0024] In some embodiments, before controlling the drive mechanism to move the probes in the dual-probe mechanism to the detection point position of the material to be tested, the automatic testing method further includes:

[0025] The material to be tested is transferred to the preset testing position by the feeding mechanism.

[0026] This application embodiment also provides an automatic testing device applied to an automatic testing equipment, the automatic testing equipment including a driving mechanism, a detection mechanism, and a dual-probe mechanism, the automatic testing device comprising:

[0027] The moving module is used to control the driving mechanism to move the probes in the dual-probe mechanism to the detection point position of the material to be detected;

[0028] The detection module is used to collect measurement data of the detection point through the detection mechanism when the probe contacts the detection point;

[0029] The judgment module is used to determine whether the material to be tested is a non-conforming material based on the measurement data and preset standard information;

[0030] The acquisition module is used to acquire abnormal data in the measurement data when the material to be tested is a non-conforming material.

[0031] This application embodiment also provides an automatic testing device, which includes a driving mechanism, a detection mechanism, a dual-probe mechanism, a memory, a processor, and an automatic testing program stored in the memory and executable on the processor. The processor is used to cooperate with the driving mechanism, the detection mechanism, and the dual-probe mechanism to implement the steps of the automatic testing method as described in the above embodiment when the automatic testing program is executed by the processor.

[0032] This application also provides a computer-readable storage medium storing an automatic test program, which, when executed by a processor, implements the steps of the automatic test method described in the above embodiments.

[0033] This application controls the driving mechanism to move the probes in the dual-probe mechanism to the detection point position of the material to be tested; further, when the probes contact the detection point, the detection mechanism collects measurement data of the detection point; further, based on the measurement data and preset standard information, it determines whether the material to be tested is unqualified; further, when the material to be tested is unqualified, it acquires abnormal data in the measurement data. Based on this, this application can realize the automatic measurement of the measurement data of the material to be tested, improving measurement accuracy and saving labor costs. Furthermore, it can automatically, quickly, and accurately detect unqualified materials, improving testing efficiency and ensuring the accuracy of test results. Furthermore, it can automatically acquire abnormal data of unqualified materials, realizing automatic analysis of the reasons for unqualification of the material to be tested, facilitating timely rework or repair of unqualified materials to ensure production quality and reliability. Attached Figure Description

[0034] Figure 1 This is a schematic diagram illustrating the steps of an automatic testing method provided in an embodiment of this application.

[0035] Figure 2 This is a schematic diagram of the composition of an automatic testing device provided in an embodiment of this application.

[0036] Figure 3 A detailed schematic diagram illustrating the steps of an automated testing method provided in another embodiment of this application.

[0037] Figure 4 This is a schematic diagram of the composition of an automatic testing device provided in an embodiment of this application.

[0038] Figure 5 This is a schematic diagram of the hardware structure of an automatic testing device provided in an embodiment of this application.

[0039] Explanation of main component symbols

[0040] Automated testing equipment 10

[0041] Memory 11

[0042] Processor 12

[0043] Drive mechanism 20

[0044] robotic arm 21

[0045] Linear drive assembly 22

[0046] First rotary drive component 23

[0047] 30 testing institutions

[0048] Sensor 31

[0049] Dual probe mechanism 40

[0050] First probe 41

[0051] Second probe 42

[0052] Telescopic drive component 43

[0053] Camera 44

[0054] Feeding mechanism 50

[0055] Vehicle 51

[0056] Linear drive component 52

[0057] Second rotary drive component 53

[0058] Automatic testing device 100

[0059] Mobile Module 110

[0060] Detection module 120

[0061] Judgment Module 130

[0062] Get Module 140

[0063] Repair Module 150

[0064] Calculation Module 160 Detailed Implementation

[0065] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0066] In the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the word "for example" is used to indicate an example, illustration, or description. Any embodiment or design scheme described as "for example" in the embodiments of this application should not be construed as being better or more advantageous than other embodiments or design schemes. Specifically, the use of the word "for example" is intended to present the relevant concepts in a specific manner.

[0067] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0068] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. Furthermore, in the description of this application, "a plurality of" means two or more, unless otherwise expressly and specifically defined.

[0069] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0070] PCBA electrical signals are diverse and easily affected by factors such as power fluctuations and interference noise. Currently, to ensure accuracy in measuring electrical signals, operators need to use high-precision measuring instruments and follow strict testing procedures. These instruments are often expensive and complex to operate, placing high demands on the skill level of the operators. Furthermore, subjective differences in measurement methods and data processing among different operators can affect test results. Therefore, in current electrical signal measurement and testing processes, whether it's instrument control, data reading, or test information analysis and recording, everything relies on manual labor, resulting in cumbersome processes, low efficiency, and weak accuracy and reliability of test results.

[0071] In view of the above, this application provides an automatic testing method, apparatus, device, and storage medium to solve the aforementioned technical problems.

[0072] Please see Figure 1 This is a schematic diagram of the steps of an automatic testing method provided in an embodiment of this application.

[0073] The automatic testing method provided in this application embodiment is applied to at least one automatic testing device 10 (such as...). Figure 2As shown, the automatic test device 10 is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions. Its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0074] In other embodiments, the automated testing device 10 can be communicatively connected to devices such as desktop computers, laptops, PDAs, and cloud servers. The automated testing device 10 can interact with users via keyboards, mice, remote controls, touchpads, or voice-activated devices.

[0075] Combination Figure 2 As shown, in some embodiments, the automatic testing equipment 10 includes a drive mechanism 20, a detection mechanism 30, a dual-probe mechanism 40, and a feeding mechanism 50. The drive mechanism 20 includes a robotic arm 21, an axial linear drive assembly 22, and a first rotary drive member 23. The detection mechanism 30 includes a sensor 31, which is disposed on the robotic arm 21. The dual-probe mechanism 40 is disposed at the end of the robotic arm 21 and connected to the axial linear drive assembly 22 and the first rotary drive member 23. The dual-probe mechanism 40 includes a first probe 41, a second probe 42, a telescopic drive member 43, and a camera 44. The telescopic drive member 43 is connected to the second probe 42, and the camera 44 is arranged side-by-side with the first probe 41 and the second probe 42. The feeding mechanism 50 includes a carrier 51, a linear drive member 52, and a second rotary drive member 53. The second rotary drive member 53 is connected to the linear drive member 52. The carrier 51 is disposed on the second rotary drive member 53.

[0076] Specifically, the automated testing method includes the following steps. Depending on different needs, the order of some steps in the flowchart can be changed, and some steps can be omitted.

[0077] S10, control the drive mechanism to move the probe in the dual probe mechanism to the detection point position of the material to be tested.

[0078] In some embodiments, before the control drive mechanism 20 moves the probes in the dual-probe mechanism 40 to the detection point position of the material to be tested, the automatic testing method further includes: transferring the material to be tested to a preset detection position via the feeding mechanism 50. Specifically, after the material is placed on the carrier 51, the material to be tested is transported by the linear drive member 52, and the placement state of the material to be tested (such as horizontal placement, vertical placement, etc.) is adjusted by the second rotary drive member 53 to facilitate the subsequent comprehensive measurement of the material to be tested by the dual-probe mechanism 40.

[0079] In some embodiments, the automatic testing device 10 pre-stores the position information of preset detection points of the material to be tested. Based on the position information of the preset detection points, the automatic testing device 10 determines the stroke information of the drive mechanism 20 and controls the drive mechanism 20 to move the probes in the dual-probe mechanism 40 to the detection point position of the material to be tested. Specifically, the probes in the dual-probe mechanism 40 can be moved to the detection point position of the material to be tested by the cooperation of the robotic arm 21, the linear drive assembly 22, and the first rotary drive component 23.

[0080] S11, when the probe contacts the detection point, the measurement data of the detection point is collected by the detection mechanism.

[0081] In some embodiments, the measurement data includes the frequency, modulation method, etc. of the electronic signal.

[0082] In some embodiments, when the probe contacts the detection point, the detection mechanism 30 collects measurement data of the detection point and sends the measurement data to the automatic testing equipment 10. The automatic testing equipment 10 identifies the received measurement data, determines key parameters such as the frequency range and modulation method of the electronic signal, and classifies the electronic signal into low-frequency or conventional signals and high-frequency or radio-frequency signals based on the key parameters. When the electronic signal is a low-frequency or conventional signal, a first control signal is generated; when the electronic signal is a high-frequency or radio-frequency signal, a second control signal is generated.

[0083] In some embodiments, the automatic testing device 10 controls the telescopic drive 43 to move the second probe 42 upward based on a first control signal, such that the end of the second probe 42 is above the end of the first probe 41. The first control signal instructs the first probe 41 to contact the detection point. The first probe 41 is an LCR test probe (L represents inductance, C represents capacitance, and R represents resistance), used for measuring low-frequency or conventional signals. When the first probe 41 contacts the detection point, the automatic testing device 10 collects measurement data of the detection point through the detection mechanism 30, such as inductance, capacitance, resistance, and impedance values.

[0084] In some embodiments, the automatic testing equipment 10 controls the telescopic drive 43 to move the second probe 42 downward based on a second control signal, such that the end of the second probe 42 is above the end of the first probe 41, wherein the second control signal instructs the second probe 42 to contact the detection point. The second probe 42 is a high-frequency test flying probe used for measuring high-frequency or radio frequency signals. When the second probe 42 contacts the detection point, the automatic testing equipment 10 collects measurement data of the detection point through the detection mechanism 30, such as inductance, capacitance, resistance, and impedance values.

[0085] The automatic testing method described above enables automatic switching between the first probe 41 and the second probe 42, reducing manual operation by staff and minimizing the impact of human factors on measurement data. Automatic switching between the first probe 41 and the second probe 42 allows for faster measurement of low-frequency or conventional signals and high-frequency or radio-frequency signals, shortening the measurement cycle. Selecting different probes for different types of signals improves the accuracy of the measurement results.

[0086] S12, determine whether the material to be tested is unqualified based on the measurement data and preset standard information.

[0087] In some embodiments, before performing step S12, the automatic testing method further includes: pre-importing preset standard information.

[0088] Specifically, by comparing the measurement data with preset standard information, the material to be tested is determined to be qualified when the measurement data meets the preset standard information; and the material to be tested is determined to be unqualified when the measurement data does not meet the preset standard information.

[0089] In some embodiments, when the material to be tested is a non-conforming material, step S13 is continued.

[0090] In some embodiments, when the material to be tested is not a non-conforming material, the process returns to step S10 to perform the next round of testing.

[0091] S13, Obtain abnormal data from the measurement data.

[0092] In some embodiments, by comparing the measurement data with preset standard information, measurement data that does not conform to the preset standard information is identified as abnormal data.

[0093] The automatic testing method described above can automatically, quickly, and accurately detect defective materials, improving the yield rate. Furthermore, it can automatically acquire abnormal data of defective materials, realizing automatic analysis of the reasons for the defect of the materials to be tested.

[0094] In some embodiments, after step S13, the automated testing method further includes the following steps:

[0095] S14, determine the maintenance strategy based on the abnormal data, and perform maintenance on the material to be tested according to the maintenance strategy.

[0096] In some embodiments, prior to step S14, the automatic testing method further includes: pre-storing maintenance strategies and establishing a correlation between abnormal data and maintenance strategies.

[0097] Specifically, the automatic testing equipment 10 determines the maintenance strategy for the material to be tested based on abnormal data and the correlation between abnormal data and maintenance strategy, and then performs maintenance on the material to be tested according to the maintenance strategy.

[0098] The automatic testing method in the above embodiments can quickly determine the maintenance strategy, ensure the orderly progress of maintenance work, and improve maintenance efficiency; further predicting the maintenance method of the maintenance strategy can promptly identify potential problems, avoid the expansion of non-conformities, avoid unnecessary maintenance and replacement, reduce maintenance costs, and ensure production safety and stability.

[0099] S15, obtain the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected, and determine the repair success rate of the materials to be inspected based on the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected.

[0100] The automated testing method in the above embodiments can reduce human error and improve the accuracy and reliability of data by automatically acquiring the total number of repaired materials to be tested and the number of qualified materials among the repaired materials to be tested. This can significantly improve work efficiency and further accurately calculate the repair success rate. The repair success rate is an important indicator for measuring repair quality and service level. It helps to discover potential problems and bottlenecks in the repair process and is of great significance for evaluating the work performance of the repair department, optimizing the repair process, and reducing repair costs.

[0101] Combination Figure 3 As shown, in some embodiments, before step S11, the automated testing method further includes the following steps:

[0102] S20: Acquire images of the detection points of the material to be detected using a camera.

[0103] Specifically, the camera 44 captures images of the detection points of the material to be tested, and then feeds these images back to the automatic testing equipment 10.

[0104] S21, compare and analyze the detection point image with the standard image to obtain the analysis results.

[0105] In some embodiments, the standard image includes preset detection points.

[0106] S22, Determine whether the location of the detection point is the same as the location of the preset detection point based on the analysis results.

[0107] In some embodiments, when the position of the detection point is the same as the position of the preset detection point, step S23 is continued.

[0108] In some embodiments, if the position of the detection point is different from the position of the preset detection point, step S24 is continued.

[0109] S23, control the drive mechanism to make the probe contact the detection point.

[0110] In some embodiments, when the position of the detection point is the same as the position of the preset detection point, it indicates that the position of the detection point pointed to by the probe is correct, and then the drive mechanism 20 can be controlled to drive the probe to contact the detection point.

[0111] Specifically, the probes in the dual-probe mechanism 40 can be moved to the detection point position of the material to be tested by the robotic arm 21.

[0112] S24, control the drive mechanism to move the probe to the preset detection point position.

[0113] In some embodiments, when the position of the detection point is different from the position of the preset detection point, it indicates that the position of the detection point pointed to by the probe is incorrect, and then the drive mechanism 20 can be controlled to move the probe to the preset detection point position.

[0114] Specifically, the probe can be moved to a preset detection point position by the axis linear drive component 22.

[0115] In the above embodiments, the accuracy of automatic testing is improved by automatically confirming the location of the detection point, and measurement accidents can be avoided.

[0116] Combination Figure 4 The diagram shown is a compositional diagram of an automatic testing device 100 provided in an embodiment of this application.

[0117] In this embodiment, based on the same concept as the automatic testing method in the above embodiments, this application also provides an automatic testing device 100, which can be used to execute the above-described automatic testing method. For ease of explanation, the schematic diagram of the automatic testing device 100 embodiment only shows the parts related to the embodiments of this application. Those skilled in the art will understand that the illustrated structure does not constitute a limitation on the automatic testing device 100, and may include more or fewer components than illustrated, or combine certain components, or have different component arrangements.

[0118] Specifically, the automatic testing device 100 provided in this application embodiment includes a moving module 110, a detection module 120, a judgment module 130, and an acquisition module 140.

[0119] The moving module 110 is used to control the drive mechanism 20 to move the probe in the dual probe mechanism 40 to the detection point position of the material to be tested.

[0120] In some embodiments, before the control drive mechanism 20 moves the probes in the dual-probe mechanism 40 to the detection point position of the material to be tested, the material to be tested needs to be transferred to a preset detection position by the feeding mechanism 50. Specifically, after the material is placed on the carrier 51, the material to be tested is transported by the linear drive member 52, and the placement state of the material to be tested (such as horizontal placement, vertical placement, etc.) is adjusted by the second rotary drive member 53, so as to facilitate the subsequent comprehensive measurement of the material to be tested by the dual-probe mechanism 40.

[0121] In some embodiments, the automatic testing device 10 pre-stores the position information of preset detection points of the material to be tested. Based on the position information of the preset detection points, the automatic testing device 10 determines the stroke information of the drive mechanism 20 and controls the drive mechanism 20 to move the probes in the dual-probe mechanism 40 to the detection point position of the material to be tested. Specifically, the probes in the dual-probe mechanism 40 can be moved to the detection point position of the material to be tested by the cooperation of the robotic arm 21, the linear drive assembly 22, and the first rotary drive component 23.

[0122] The detection module 120 is used to collect measurement data of the detection point through the detection mechanism 30 when the probe contacts the detection point.

[0123] In some embodiments, the measurement data includes the frequency, modulation method, etc. of the electronic signal.

[0124] In some embodiments, when the probe contacts the detection point, the detection mechanism 30 collects measurement data of the detection point and sends the measurement data to the automatic testing equipment 10. The automatic testing equipment 10 identifies the received measurement data, determines key parameters such as the frequency range and modulation method of the electronic signal, and classifies the electronic signal into low-frequency or conventional signals and high-frequency or radio-frequency signals based on the key parameters. When the electronic signal is a low-frequency or conventional signal, a first control signal is generated; when the electronic signal is a high-frequency or radio-frequency signal, a second control signal is generated.

[0125] In some embodiments, the automatic testing device 10 controls the telescopic drive 43 to move the second probe 42 upward based on a first control signal, such that the end of the second probe 42 is above the end of the first probe 41. The first control signal instructs the first probe 41 to contact the detection point. The first probe 41 is an LCR test probe (L represents inductance, C represents capacitance, and R represents resistance), used for measuring low-frequency or conventional signals. When the first probe 41 contacts the detection point, the automatic testing device 10 collects measurement data of the detection point through the detection mechanism 30, such as inductance, capacitance, resistance, and impedance values.

[0126] In some embodiments, the automatic testing equipment 10 controls the telescopic drive 43 to move the second probe 42 downward based on a second control signal, such that the end of the second probe 42 is above the end of the first probe 41, wherein the second control signal instructs the second probe 42 to contact the detection point. The second probe 42 is a high-frequency test flying probe used for measuring high-frequency or radio frequency signals. When the second probe 42 contacts the detection point, the automatic testing equipment 10 collects measurement data of the detection point through the detection mechanism 30, such as inductance, capacitance, resistance, and impedance values.

[0127] The automatic testing method described above enables automatic switching between the first probe 41 and the second probe 42, reducing manual operation by staff and minimizing the impact of human factors on measurement data. Automatic switching between the first probe 41 and the second probe 42 allows for faster measurement of low-frequency or conventional signals and high-frequency or radio-frequency signals, shortening the measurement cycle. Selecting different probes for different types of signals improves the accuracy of the measurement results.

[0128] The judgment module 130 is used to determine whether the material to be tested is unqualified based on the measurement data and preset standard information.

[0129] In some embodiments, before determining whether the material to be tested is a non-conforming material based on measurement data and preset standard information, the automatic testing equipment 10 imports preset standard information in advance.

[0130] Specifically, by comparing the measurement data with preset standard information, the material to be tested is determined to be qualified when the measurement data meets the preset standard information; and the material to be tested is determined to be unqualified when the measurement data does not meet the preset standard information.

[0131] The acquisition module 140 is used to acquire abnormal data in the measurement data when the material to be tested is a non-conforming material.

[0132] In some embodiments, by comparing the measurement data with preset standard information, measurement data that does not conform to the preset standard information is identified as abnormal data.

[0133] The automatic testing method described above can automatically, quickly, and accurately detect defective materials, improving the yield rate. Furthermore, it can automatically acquire abnormal data of defective materials, realizing automatic analysis of the reasons for the defect of the materials to be tested.

[0134] In some embodiments, the automatic testing device 100 further includes a maintenance module 150 and a calculation module 160.

[0135] The maintenance module 150 is used to determine the maintenance strategy based on the abnormal data, and to perform maintenance on the material to be tested according to the maintenance strategy.

[0136] In some embodiments, the automated testing device 10 pre-stores maintenance strategies and establishes a correlation between abnormal data and maintenance strategies.

[0137] Specifically, the automatic testing equipment 10 determines the maintenance strategy for the material to be tested based on abnormal data and the correlation between abnormal data and maintenance strategy, and then performs maintenance on the material to be tested according to the maintenance strategy.

[0138] The automatic testing method in the above embodiments can quickly determine the maintenance strategy, ensure the orderly progress of maintenance work, and improve maintenance efficiency; further predicting the maintenance method of the maintenance strategy can promptly identify potential problems, avoid the expansion of non-conformities, avoid unnecessary maintenance and replacement, reduce maintenance costs, and ensure production safety and stability.

[0139] The calculation module 160 is used to obtain the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected, and to determine the repair success rate of the materials to be inspected based on the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected.

[0140] The automatic testing device 100 in the above embodiments can reduce human error and improve the accuracy and reliability of data by automatically acquiring the total number of repaired materials to be tested and the number of qualified materials among the repaired materials to be tested. This can significantly improve work efficiency and further accurately calculate the repair success rate. The repair success rate is an important indicator for measuring repair quality and service level. It helps to discover potential problems and bottlenecks in the repair process and is of great significance for evaluating the work performance of the repair department, optimizing the repair process, and reducing repair costs.

[0141] Figure 5 The diagram shown is a schematic representation of the hardware structure of an automatic testing device 10 provided in an embodiment of this application.

[0142] In some embodiments, the automated test device 10 includes, but is not limited to, a memory 11, a processor 12, and a computer program, such as an automated test program, stored in the memory 11 and executable on the processor 12.

[0143] Those skilled in the art will understand that the schematic diagram is merely an example of the automatic test device 10 and does not constitute a limitation on the automatic test device 10. It may include more or fewer components than shown, or combine certain components, or different components. For example, the automatic test device 10 may also include input / output devices, network access devices, buses, etc.

[0144] Processor 12 acquires the operating system and various installed applications of the automated testing device 10. Processor 12 acquires these applications to implement the steps described in the various automated testing method embodiments above, for example... Figure 1 , Figure 3 The steps are shown.

[0145] For example, a computer program may be divided into one or more modules / units, one or more of which are stored in memory 11 and retrieved by processor 12 to complete this application. One or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the retrieval process of the computer program in the automatic testing device 10.

[0146] In some embodiments, the automatic test equipment 10 includes a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions. The hardware of the automatic test equipment 10 includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0147] In some embodiments, the network where the automated testing device 10 is located includes, but is not limited to, the Internet, a wide area network, a metropolitan area network, a local area network, a virtual private network (VPN), etc.

[0148] In some embodiments, the memory 11 is used to store program code and various data, such as the automatic testing device 100 installed in the automatic testing equipment 10, and to enable high-speed and automatic access to programs or data during the operation of the automatic testing equipment 10. The memory 11 may include read-only memory (ROM), random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium capable of carrying or storing data.

[0149] In some embodiments, memory 11 may also be external memory and / or internal memory of the automated testing device 10. Further, memory 11 may be a physical memory, such as a memory module, a TF card (Trans-flash Card), etc.

[0150] In some embodiments, the processor 12 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor. The processor 12 is the computational core and control center of the automatic test equipment 10, connecting various parts of the automatic test equipment 10 through various interfaces and lines, and calling data stored in the memory 11 to execute various functions of the automatic test equipment 10 and process data, such as performing the testing functions of the automatic test equipment 10.

[0151] In some embodiments, the processor 12 is used to obtain the operating system of the automated testing device 10 and various installed applications. For example, the processor 12 obtains an automated testing program to implement the automated testing method described in the above embodiments, for example... Figure 1 , Figure 3 The steps are shown.

[0152] In one embodiment of this application, the automatic testing device 10 may further include a power supply (not shown) for supplying power to various components. Preferably, the power supply can be logically connected to the processor 12 through a power management device, thereby enabling functions such as charging, discharging, and power consumption management through the power management device. The power supply may also include one or more DC or AC power supplies, recharging devices, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components. The automatic testing device 10 may also include Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0153] In one embodiment of this application, if the modules / submodules integrated into the automatic testing equipment 10 are implemented as software functional submodules and sold or used as independent workpieces, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when the computer program is acquired by the processor 12, it can implement the above... Figure 1 , Figure 3 The steps of the various method embodiments shown.

[0154] In one embodiment of this application, a computer program may include computer program code, which may be in the form of source code, object code, a downloadable file, or some intermediate form. A computer-readable medium may include any entity or device capable of carrying computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, or a read-only memory (ROM).

[0155] The memory 11 in the automatic testing device 10 stores multiple instructions to implement an automatic testing method, and the processor 12 can acquire multiple instructions to implement the automatic testing method of the above embodiment.

[0156] Specifically, the processor 12's implementation method for the above instructions can be found in [reference needed]. Figure 1 , Figure 3 The descriptions of the relevant steps in the corresponding embodiments are not repeated here.

[0157] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and there may be other division methods in actual implementation.

[0158] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0159] In the various embodiments of this application, the functional modules can be integrated into one processing submodule, or each submodule can exist physically separately, or two or more submodules can be integrated into one submodule. The integrated submodules described above can be implemented in hardware or in a combination of hardware and software functional modules.

[0160] Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No appended diagram markings in the claims should be construed as limiting the scope of the claims.

[0161] Furthermore, it is clear that the word "comprising" does not exclude other submodules or steps, and the singular does not exclude the plural. Multiple submodules or devices described in this application may also be implemented by a single submodule or device through software or hardware.

[0162] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. An automatic testing method, applied to automatic testing equipment, characterized in that, The automated testing equipment includes a drive mechanism, a detection mechanism, and a dual-probe mechanism; the automated testing method includes: The drive mechanism is controlled to move the probes in the dual-probe mechanism to the detection point of the material to be tested; When the probe contacts the detection point, the detection mechanism collects measurement data of the detection point. Based on the measurement data and preset standard information, determine whether the material to be tested is a non-conforming material; When the material to be tested is a non-conforming material, abnormal data in the measurement data is acquired.

2. The automatic testing method as described in claim 1, characterized in that, After acquiring abnormal data from the measurement data, the automated testing method further includes: A maintenance strategy is determined based on the abnormal data, and the material to be tested is repaired according to the maintenance strategy.

3. The automatic testing method as described in claim 2, characterized in that, After repairing the material to be tested, the automatic testing method further includes: Obtain the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected, and determine the repair success rate of the materials to be inspected based on the total number of repaired materials to be inspected and the number of qualified materials among the repaired materials to be inspected.

4. The automatic testing method as described in claim 1, characterized in that, The dual-probe mechanism includes a camera, and the automated testing method further includes, before the probes contact the detection point: The camera acquires images of the detection points of the material to be detected. The detection point image is compared and analyzed with a standard image to obtain the analysis results, wherein the standard image includes preset detection points; Based on the analysis results, determine whether the position of the detection point is the same as the position of the preset detection point; When the position of the detection point is the same as the position of the preset detection point, the driving mechanism is controlled to drive the probe to contact the detection point.

5. The automatic testing method as described in claim 4, characterized in that, Before the probe contacts the detection point, the automated testing method further includes: When the position of the detection point is different from the position of the preset detection point, the driving mechanism is controlled to move the probe to the position of the preset detection point.

6. The automatic testing method as described in claim 1, characterized in that, The dual-probe mechanism includes a first probe, a second probe, and a telescopic drive component; the automatic testing method further includes: The telescopic drive is controlled by a first control signal to move the second probe upward, so that the end of the second probe is above the end of the first probe, wherein the first control signal indicates that the first probe is in contact with the detection point. The second control signal controls the telescopic drive to move the second probe downward, so that the end of the second probe is below the end of the first probe, wherein the second control signal indicates that the second probe is in contact with the detection point.

7. The automatic testing method as described in claim 1, characterized in that, Before controlling the drive mechanism to move the probes in the dual-probe mechanism to the detection point position of the material to be tested, the automatic testing method further includes: The material to be tested is transferred to the preset testing position by the feeding mechanism.

8. An automatic testing device, applied to automatic testing equipment, characterized in that, The automatic testing equipment includes a drive mechanism, a detection mechanism, and a dual-probe mechanism; the automatic testing device includes: The moving module is used to control the driving mechanism to move the probes in the dual-probe mechanism to the detection point position of the material to be detected; The detection module is used to collect measurement data of the detection point through the detection mechanism when the probe contacts the detection point; The judgment module is used to determine whether the material to be tested is a non-conforming material based on the measurement data and preset standard information; The acquisition module is used to acquire abnormal data in the measurement data when the material to be tested is a non-conforming material.

9. An automatic testing device, characterized in that, The automatic testing equipment includes a drive mechanism, a detection mechanism, a dual-probe mechanism, a memory, a processor, and an automatic testing program stored in the memory and executable on the processor. The processor is used to cooperate with the drive mechanism, the detection mechanism, and the dual-probe mechanism to implement the steps of the automatic testing method as described in any one of claims 1 to 7 when the automatic testing program is executed by the processor.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores an automatic test program, which, when executed by a processor, implements the steps of the automatic test method as described in any one of claims 1 to 7.

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