Wafer base device with variable angle and self-revolution function

Abstract

The invention discloses an angle-variable and self-revolution wafer base device, and belongs to the technical field of wafer bases, the angle-variable and self-revolution wafer base device comprises a revolution base, a gear carrier is fixedly connected to the center of the top of the revolution base, and a base is arranged above the gear carrier. According to the cooling device, an external liquid supply device conveys cooling water into the connecting base through a cooling water inlet pipe, inclined blades in the connecting base drive a driving shaft and a double-end protruding block to rotate, a sliding block drives an annular gear and a cooling disc to rotate through a rack, and the rotating cooling disc centrifugally throws out the cooling water; a uniform and dead-corner-free cooling water curtain is formed, the rotation shaft and the adjusting shaft are completely wrapped, the cooling uniformity of the peripheral side of the shaft body is ensured, stable and efficient heat exchange is achieved, sprayed cooling water can cool the revolution seat and the gear carrier at the same time, the influence of the high temperature in the reaction cavity on the device is reduced in an auxiliary mode, and the reaction efficiency is improved. And the operation reliability and the overall performance of the device are obviously improved.

Description

Technical Field

[0001] This invention belongs to the field of wafer substrate technology, and particularly relates to a wafer substrate device with variable angle and self-rotation capability. Background Technology

[0002] Wafers are the substrates for manufacturing semiconductor chips, and wafer pedestals are key components that ensure precise positioning, uniform temperature, and effective interaction with the process environment during wafer processing. In the current semiconductor industry, wafer pedestals (or substrates) in semiconductor equipment such as thin film deposition, etching, ion implantation, and heat treatment are mostly mounted horizontally to keep the wafer surface on a horizontal plane.

[0003] For example, Chinese patent document (CN215593183U) discloses a wafer vapor deposition apparatus, which includes: a reaction chamber; a base disposed within the reaction chamber for supporting a wafer; and a jetting structure including an exhaust section disposed within the reaction chamber and above the base for jetting gas onto the wafer; wherein the exhaust section has a first sub-exhaust section and a plurality of second sub-exhaust sections, the first sub-exhaust section and the plurality of second sub-exhaust sections being arranged radially spaced apart along the exhaust section, the exhaust volume of the first sub-exhaust section being less than the exhaust volume of each second sub-exhaust section; a first preset distance A is provided between the first sub-exhaust section and the central axis of the exhaust section, the first preset distance A being greater than or equal to 130 mm and less than or equal to 150 mm; and the central axis of the exhaust section is coaxially arranged with the central axis of the wafer.

[0004] However, during use, the angle of the base cannot be changed in real time after installation, making it inconvenient to quickly and accurately adjust the angle according to actual needs. Furthermore, its cooling method often involves input at one end and output at the other, resulting in differences in cooling effects on the water-facing and back-facing sides. This can affect the applicability and cooling effect of the device, thus requiring improvement. Summary of the Invention

[0005] The purpose of this invention is to solve the problems in the prior art where the base angle is inconvenient to quickly and accurately adjust according to actual needs after installation, and the cooling method often involves input at one end and output at the other, resulting in differences in cooling effect between the water-facing and back-facing sides. Therefore, this invention proposes a wafer base device with a variable angle and self-rotation capability.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A wafer pedestal device with variable angle and self-rotation capability includes a revolution base, a gear frame fixedly connected to the top center of the revolution base, a base disposed above the gear frame, and further includes: The self-rotating component, mounted on the orbital mount, is used to drive the mount to rotate and improve the uniformity of the wafer surface; An angle adjustment component, mounted on the orbital mount, is used to precisely adjust the angle between the base and the wafer surface relative to the raw material inlet. The cooling assembly includes a mounting base fixedly connected to the bottom side of the orbital seat. A double-headed protrusion is installed at the center of the mounting base. Sliding blocks and racks are provided on both sides of the double-headed protrusion. A ring gear is meshed on the side of the rack away from the double-headed protrusion. A cooling plate is fixedly connected to the inner circumference of the ring gear. The cooling plate is rotated by the cooling water entering the connecting base to uniformly cool the interior of the orbital seat.

[0007] As a further description of the above technical solution: The cooling assembly also includes: The connecting seat is fixedly connected to the center of the top of the mounting seat, and a first through hole is provided at the joint between the connecting seat and the mounting seat; The drive shaft is fixedly connected to the inner circumference of the double-headed protrusion, and the top end of the drive shaft passes through the first through hole and is fixedly connected to an inclined blade. The inclined blade is set inside the connecting seat, and the drive shaft is rotatably connected inside the first through hole through a first sealed bearing.

[0008] As a further description of the above technical solution: The cooling assembly also includes: Both the sliding block and the rack are slidably connected inside the mounting base; Multiple springs are symmetrically arranged on both sides inside the mounting base, and the two sides of the springs are respectively fixedly connected to one side of the sliding block and the inner wall of the mounting base; The mounting base has a second through hole at its center and a fourth through hole on one side of its interior. The cooling plate is respectively disposed inside the fourth through hole and the second through hole, and the cooling plate is rotated and sealed inside the mounting base.

[0009] As a further description of the above technical solution: The cooling assembly also includes: The cooling water inlet pipe has one end connected to the connecting seat, and the other end extends to the outside of the orbital seat. One end of the infusion tube is connected to the side of the connector away from the cooling water inlet pipe, and the other end of the infusion tube is connected to the outer periphery of the cooling plate through a pipe fitting hose. The cooling water outlet pipe has one end connected to the side of the orbital seat away from the cooling water inlet pipe, and the other end extends to the outside of the orbital seat.

[0010] As a further description of the above technical solution: The self-rotating component includes: The driven synchronous pulley is fixed on the outer periphery of the orbital seat; The active synchronizing wheel is located on one side of the orbital seat; A timing belt is fitted between the driven timing pulley and the driving timing pulley, and a rotating shaft is fixedly connected inside the driving timing pulley; The revolution drive motor is located on one side of the revolution seat, and one end of the output shaft of the revolution drive motor is fixedly connected to the bottom end of the rotating shaft through the first coupling.

[0011] As a further description of the above technical solution: The self-rotating component also includes: The rotation axis passes through the interior of the orbital seat, and the rotation axis is rotatably connected to the interior of the orbital seat through a second sealed bearing and a magnetohydrodynamic connection; The first gear is located on the top side inside the gear carrier and is fixedly connected to the top of the rotating shaft, which is rotatably connected inside the gear carrier through a third sealed bearing.

[0012] As a further description of the above technical solution: The self-rotating component also includes: An intermediate gear is located inside the top side of the gear carrier and is meshed with the top side of the first gear. The gear carrier is I-shaped, and the intermediate gear is rotatably connected to the top side of the gear carrier inside through a fixed shaft and a fourth sealed bearing. The second gear is meshed with the top side of the intermediate gear, and the second gear is positioned above the first gear; The connecting shaft is fixedly connected inside the second gear, and the top end of the connecting shaft is fixedly connected to the bottom of the base.

[0013] As a further description of the above technical solution: The self-rotating component also includes: The self-rotating drive motor has one end of its output shaft fixedly connected to the bottom end of the self-rotating shaft via a second coupling.

[0014] As a further description of the above technical solution: The angle adjustment component includes: An adjusting shaft is located on one side of the rotating shaft and is rotatably connected to the interior of the orbital seat via a fifth sealed bearing and a magnetic fluid. The adjusting shaft and the rotating shaft are respectively located inside the fourth through hole and the second through hole, and the cooling plate is rotatably sealed on the outer periphery of the adjusting shaft and the rotating shaft. The adjustment drive motor is located on one side below the planetary base, and one end of the output shaft of the adjustment drive motor is fixedly connected to the bottom end of the adjustment shaft through a third coupling.

[0015] As a further description of the above technical solution: The angle adjustment component also includes: The third gear is fixedly connected to the outer periphery of the top of the adjusting shaft; The fourth gear is engaged with the top side of the third gear; A round shaft is fixedly connected to the outer circumference of the fourth gear, and the round shaft is rotatably connected to the inside of the gear carrier through the sixth sealed bearing; An L-shaped frame is fitted onto the outer circumference of a round shaft, and one side of the L-shaped frame is fixedly connected to a fourth gear. A third through hole is provided on the top of the L-shaped frame, and the L-shaped frame is fitted onto the outer circumference of a connecting shaft through the third through hole. The connecting shaft is rotatably connected inside the L-shaped frame through a seventh sealed bearing.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. In this invention, through the cooling assembly, the external liquid supply device delivers cooling water to the inside of the connecting seat through the cooling water inlet pipe. This causes the inclined blades inside the connecting seat to drive the drive shaft and the double-headed protrusion to rotate. The sliding block drives the ring gear and the cooling plate to rotate through the rack. The rotating cooling plate centrifugally throws out the cooling water, forming a uniform cooling water curtain that covers all corners without dead angles. This completely wraps around the rotating shaft and the adjusting shaft, ensuring the uniformity of cooling on the outer periphery of the shaft body and achieving stable and efficient heat exchange. The sprayed cooling water also cools the orbital seat itself and the gear frame, helping to reduce the impact of high temperature inside the reaction chamber on the device, and significantly improving the operational reliability and overall performance of the device.

[0017] 2. In this invention, by setting an angle adjustment component, the adjustment drive motor drives the adjustment shaft and the third gear to rotate, and the fourth gear drives the L-shaped frame, the connecting shaft and the base to rotate through the round shaft, so that the base drives the wafer to tilt synchronously and accurately, realizing the continuous and precise adjustment of the axial angle between the wafer surface and the external raw material inlet, so that the device is suitable for the process requirements of wafers with different angles.

[0018] 3. In this invention, through the self-rotation component, the self-rotation drive motor drives the second gear, connecting shaft, and base to rotate via the self-rotation shaft, the first gear, and the intermediate gear. This causes the adjusted base to synchronously drive the wafer to rotate around its central axis, ensuring that the wafer surface can be fully and uniformly covered by raw materials from the external raw material inlet, thus guaranteeing good uniformity of the wafer surface during the process. Meanwhile, the revolution drive motor drives the driven synchronous wheel, revolution base, and gear carrier to rotate via the rotation shaft, the active synchronous wheel, and the synchronous belt, ensuring that the above mechanisms can guarantee uniform heating in the reaction chamber, thereby forming a high-quality, dense, and uniform thin film on the wafer surface. The angle adjustment, self-rotation, and revolution actions of this device can be performed individually or simultaneously without the need for component replacement, saving a significant amount of component manufacturing costs and personnel operating time, and improving process development and production efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the overall three-dimensional structure of the self-rotation component and the angle adjustment component in this invention; Figure 3 In this invention Figure 2 A magnified schematic diagram of the structure at point A; Figure 4 This is a partial three-dimensional structural diagram of the self-rotation component and the angle adjustment component in this invention; Figure 5 This is a schematic diagram of the overall three-dimensional structure of the cooling component in this invention; Figure 6 This is a three-dimensional structural diagram of the cooling component in this invention from another perspective; Figure 7 This is a schematic diagram of the multi-position planar structure of the present invention.

[0020] Legend: 1. Revolution seat; 2. Gear carrier; 3. Base; 4. Self-revolution assembly; 401. Driven synchronous pulley; 402. Synchronous belt; 403. Driven synchronous pulley; 404. Revolution drive motor; 405. Rotation shaft; 406. First gear; 407. Intermediate gear; 408. Second gear; 409. Connecting shaft; 410. Rotation drive motor; 5. Angle adjustment assembly; 501. Adjustment shaft; 502. Adjustment drive motor; 50 3. Third gear; 504. Fourth gear; 505. Round shaft; 506. L-shaped frame; 6. Cooling assembly; 601. Mounting base; 602. Connecting base; 603. Cooling water inlet pipe; 604. Slanted blade; 605. Drive shaft; 606. Double-headed protrusion; 607. Sliding block; 608. Spring; 609. Rack; 610. Ring gear; 611. Cooling plate; 612. Infusion pipe; 613. Cooling water outlet pipe. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-7 The present invention provides a technical solution: a wafer pedestal device with variable angle and self-rotation capability, including a pedestal 1, a gear carrier 2 fixedly connected to the top center of the pedestal 1, a base 3 disposed above the gear carrier 2, and further comprising: The self-rotating component 4 is set on the orbiting base 1 and is used to drive the base 3 to rotate to improve the uniformity of the wafer surface. Angle adjustment component 5 is set on the orbital seat 1 and is used to precisely adjust the angle between the base 3 and the wafer surface relative to the raw material inlet. The cooling assembly 6 includes a mounting base 601 fixedly connected to the bottom side of the orbital seat 1. A double-headed protrusion 606 is installed at the center of the mounting base 601. Sliding blocks 607 and racks 609 are provided on both sides of the double-headed protrusion 606. A ring gear 610 is meshed on the side of the rack 609 away from the double-headed protrusion 606. A cooling plate 611 is fixedly connected to the inner circumference of the ring gear 610. The cooling plate 611 is rotated by the cooling water entering the connecting base 602 and the interior of the orbital seat 1 is uniformly cooled. Cooling component 6 also includes: The connecting seat 602 is fixedly connected to the top center of the mounting seat 601, and a first through hole is provided at the joint of the connecting seat 602 and the mounting seat 601; The drive shaft 605 is fixedly connected to the inner circumference of the double-headed protrusion 606, and the top end of the drive shaft 605 passes through the first through hole and is fixedly connected to an inclined blade 604. The inclined blade 604 is disposed inside the connecting seat 602, and the drive shaft 605 is rotatably connected inside the first through hole through the first sealed bearing. Both the sliding block 607 and the rack 609 are slidably connected inside the mounting base 601; Multiple springs 608 are symmetrically arranged on both sides inside the mounting base 601, and the two sides of the springs 608 are respectively fixedly connected to one side of the sliding block 607 and the inner wall of the mounting base 601. A second through hole is provided at the center of the mounting base 601, and a fourth through hole is provided on one side of the mounting base (601). Cooling discs 611 are respectively disposed inside the fourth through hole and the second through hole, and the cooling discs 611 are rotatably sealed inside the mounting base 601. The cooling water inlet pipe 603 is connected to the connecting seat 602 at one end, and the other end of the cooling water inlet pipe 603 extends to the outside of the orbital seat 1. One end of the infusion tube 612 is connected to the side of the connector 602 away from the cooling water inlet pipe 603, and the other end of the infusion tube 612 is connected to the outer periphery of the cooling plate 611 through a pipe fitting hose. The cooling water outlet pipe 610 has one end connected to the side of the orbital seat 1 away from the cooling water inlet pipe 603, and the other end of the cooling water outlet pipe 610 extends to the outside of the orbital seat 1.

[0023] First, the device is placed inside the reaction chamber of an external vapor deposition equipment, maintaining a high temperature environment of 300°C to 1500°C. The device is then installed at a suitable distance from the external raw material inlet using an external protective mechanism. Next, the wafer is placed inside the base 3 via an external device. As needed, the cooling water inlet pipe 603 is connected to an external liquid supply device. The external liquid supply device delivers cooling water through the cooling water inlet pipe 603 to the connector 602, causing the inclined blades 604 inside the connector 602 to drive the drive shaft 605 and the double-headed bump 606 to rotate. During the rotation of the double-headed bump 606… The continuous movement of the sliding block 607, spring 608, and rack 609 causes the ring gear 610 to drive the cooling plate 611 to rotate. The cooling plate 611 evenly delivers the liquid supplied by the connecting seat 602 and the infusion pipe 612 to the rotating shaft 405 and the adjusting shaft 501, ensuring uniform heat exchange between the cooling water and the adjusting shaft 501 and the rotating shaft 405. This guarantees comprehensive and uniform cooling of the outer periphery of the adjusting shaft 501 and the rotating shaft 405. Simultaneously, the sprayed cooling water actively cools the orbital seat 1 itself and the gear carrier 2, preventing the high temperature inside the reaction chamber from escalating due to heat conduction and radiation. The liquid is transmitted through the injection path to the internal self-revolution component 4 and angle adjustment component 5, preventing the critical sealing elements inside the device from failing or being damaged due to overheating. This greatly improves the overall performance and service life of the device during use. At this time, the liquid sprayed from the cooling plate 611 inside the orbital seat 1 will be discharged through the cooling water outlet pipe 610. The material of this device can be made of metal or non-metal. In lower temperatures (such as 300℃-500℃) and non-corrosive cavity environments, aluminum alloy, stainless steel, and molybdenum metal parts are used. In higher temperatures (such as 600℃-1000℃) and corrosive cavity environments, metal parts such as aluminum alloy, stainless steel, and molybdenum are used. In this environment, high-strength ceramic materials such as quartz, graphite, silicon carbide, carbon nitride, and boron nitride are used. A high-temperature resistant protective layer can be set between the orbital seat 1 and the base 3 as needed. The high-temperature resistant protective layer is set on the outer periphery of the angle adjustment component 5 and the orbital component 4. The bottom of the high-temperature resistant protective layer can be rotatably connected to the top of the orbital seat 1 through a bearing. This is a protective mechanism that is easy for those skilled in the art to imagine after understanding this application. The control system, power connection system, sensor system, external protective mechanism, and valve system set in this device are all known and disclosed technologies known to those skilled in the art. Therefore, this application will not elaborate on them in detail.

[0024] Please see Figures 1-4 and Figure 7 The self-orbiting component 4 includes: Driven synchronous pulley 401 is fixed to the outer periphery of revolution seat 1; The active synchronizing wheel 403 is located on one side of the orbital seat 1; Synchronous belt 402 is fitted between driven synchronous pulley 401 and driving synchronous pulley 403. A rotating shaft is fixedly connected inside the driving synchronous pulley 403. The revolution drive motor 404 is located on one side of the revolution seat 1, and one end of the output shaft of the revolution drive motor 404 is fixedly connected to the bottom end of the rotating shaft through the first coupling; The rotation shaft 405 passes through the interior of the orbital seat 1, and the rotation shaft 405 is rotatably connected to the interior of the orbital seat 1 through the second sealed bearing and the magnetohydrodynamic connection. The first gear 406 is located on the top side inside the gear carrier 2, and the first gear 406 is fixedly connected to the top of the rotating shaft 405. The rotating shaft 405 is rotatably connected to the inside of the gear carrier 2 through the third sealed bearing. The intermediate gear 407 is located on the top side inside the gear carrier 2, and the intermediate gear 407 is meshed with the top side of the first gear 406. The gear carrier 2 is I-shaped, and the intermediate gear 407 is rotatably connected to the top side inside the gear carrier 2 through a fixed shaft and a fourth sealed bearing. The second gear 408 is meshed with the top side of the intermediate gear 407, and the second gear 408 is positioned above the first gear 406; The connecting shaft 409 is fixedly connected inside the second gear 408, and the top end of the connecting shaft 409 is fixedly connected to the bottom of the base 3; The output shaft of the self-rotating drive motor 410 is fixedly connected to the bottom end of the self-rotating shaft 405 via a second coupling.

[0025] The revolution drive motor 404 and the rotation drive motor 410 are activated as needed. The rotation drive motor 410 drives the first gear 406 to rotate through the rotation shaft 405. The first gear 406 drives the second gear 408, the connecting shaft 409 and the base 3 to rotate through the intermediate gear 407. This causes the adjusted base 3 to synchronously drive the wafer to rotate, so that the wafer surface can be fully and uniformly covered by the raw material from the external raw material inlet, ensuring good uniformity of the wafer surface during the process. The revolution drive motor 404 drives the active synchronous wheel 403 to rotate through the rotating shaft. The active synchronous wheel 403 transmits power synchronously to the driven synchronous wheel 401 through the synchronous belt 402, so that the driven synchronous wheel 401 drives the revolution seat 1 and the gear carrier 2 to rotate. This ensures that the above mechanisms can maintain uniform heating in the reaction chamber, so that a high-quality, dense and uniform thin film is formed on the wafer surface.

[0026] Please see Figures 1-4 and Figure 7 The angle adjustment component 5 includes: An adjusting shaft 501 is located on one side of the rotating shaft 405, and the adjusting shaft 501 is rotatably connected to the inside of the orbital seat 1 through the fifth sealed bearing and the magnetic fluid. The adjusting shaft 501 and the rotating shaft 405 are respectively located inside the fourth through hole and the second through hole, and the cooling plate 611 is rotatably sealed on the outer periphery of the adjusting shaft 501 and the rotating shaft 405. Adjustment drive motor 502 is set on one side below the revolution seat 1, and one end of the output shaft of adjustment drive motor 502 is fixedly connected to the bottom end of adjustment shaft 501 through a third coupling; The third gear 503 is fixedly connected to the outer periphery of the top of the adjusting shaft 501; The fourth gear 504 is meshed with the top side of the third gear 503; The round shaft 505 is fixedly connected to the outer circumference of the fourth gear 504, and the round shaft 505 is rotatably connected to the inside of the gear carrier 2 through the sixth sealed bearing; L-shaped bracket 506 is sleeved on the outer circumference of round shaft 505, and one side of L-shaped bracket 506 is fixedly connected to fourth gear 504. A third through hole is opened on the top of L-shaped bracket 506. L-shaped bracket 506 is sleeved on the outer circumference of connecting shaft 409 through the third through hole. Connecting shaft 409 is rotatably connected inside L-shaped bracket 506 through seventh sealed bearing.

[0027] The adjustment drive motor 502 is activated as needed. The adjustment drive motor 502 drives the adjustment shaft 501 and the third gear 503 to rotate, causing the fourth gear 504 to drive the L-shaped frame 506, connecting shaft 409, and base 3 to rotate via the round shaft 505. This causes the base 3 to cause the wafer to tilt synchronously and precisely, thereby changing the angle between the wafer surface and the external material inlet (as shown in the attached figure). Figure 7 As shown in the figure, this device is suitable for the process requirements of wafers at different angles. The angle changing, rotation and revolution actions of this device can be performed individually or simultaneously without the need for component replacement, saving a lot of component manufacturing costs and personnel operation time, and improving process research and development and production efficiency. Among them, the adjustment drive motor 502, revolution drive motor 404 and rotation drive motor 410 can be selected as self-locking motors according to actual needs. The tooth surface specifications of the first gear 406, intermediate gear 407, second gear 408, third gear 503 and fourth gear 504 are consistent to prevent the transmission effect of each gear from being affected when the base 3 is tilted. In addition, the use of magnetic fluid sealing components ensures that the sealing of the reaction chamber is not damaged when the transmission components are in operation. Furthermore, the magnetic fluid can be selected as a self-cooling type according to actual needs to solve the impact of high temperature in the reaction chamber.

[0028] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer pedestal device with variable angle and self-rotation capability, comprising a revolution base (1), characterized in that, A gear frame (2) is fixedly connected to the top center of the orbital seat (1), and a base (3) is provided above the gear frame (2). The system also includes: The self-rotation component (4) is set on the orbital seat (1) and is used to drive the base (3) to rotate; Angle adjustment component (5) is set on the orbital seat (1) to precisely adjust the angle between the wafer surface and the raw material inlet by the base (3); The cooling assembly (6) includes a mounting base (601) fixedly connected to the bottom side of the orbital seat (1). A double-headed protrusion (606) is installed at the center of the mounting base (601). Sliding blocks (607) and racks (609) are provided on both sides of the double-headed protrusion (606). A ring gear (610) is meshed on the side of the rack (609) away from the double-headed protrusion (606). A cooling plate (611) is fixedly connected to the inner circumference of the ring gear (610).

2. The wafer pedestal device with variable angle and self-rotation capability according to claim 1, characterized in that, The cooling assembly (6) also includes: The connecting seat (602) is fixedly connected to the center of the top of the mounting seat (601), and a first through hole is provided at the joint of the connecting seat (602) and the mounting seat (601); The drive shaft (605) is fixedly connected to the inner circumference of the double-headed protrusion (606), and the top end of the drive shaft (605) passes through the first through hole and is fixedly connected to an inclined blade (604). The inclined blade (604) is disposed inside the connecting seat (602), and the drive shaft (605) is rotatably connected inside the first through hole through the first sealed bearing.

3. A wafer pedestal device with a variable angle and self-rotating capability according to claim 2, characterized in that, The cooling assembly (6) also includes: The sliding block (607) and the rack (609) are both slidably connected inside the mounting base (601); Multiple springs (608) are symmetrically arranged on both sides inside the mounting base (601), and the two sides of the springs (608) are fixedly connected to one side of the sliding block (607) and the inner wall of the mounting base (601), respectively. The mounting base (601) has a second through hole at its center and a fourth through hole on one side. The cooling plate (611) is respectively disposed inside the fourth through hole and the second through hole, and the cooling plate (611) is rotatably sealed inside the mounting base (601).

4. A wafer pedestal device with a variable angle and self-rotating capability according to claim 3, characterized in that, The cooling assembly (6) also includes: The cooling water inlet pipe (603) is connected at one end to the connecting seat (602), and the other end of the cooling water inlet pipe (603) extends to the outside of the orbital seat (1); One end of the infusion tube (612) is connected to the side of the connector (602) away from the cooling water inlet pipe (603), and the other end of the infusion tube (612) is connected to the outer periphery of the cooling plate (611) through a pipe fitting hose. The cooling water outlet pipe (613) has one end connected to the side of the orbital seat (1) away from the cooling water inlet pipe (603), and the other end of the cooling water outlet pipe (613) extends to the outside of the orbital seat (1).

5. A wafer pedestal device with a variable angle and self-rotating capability according to claim 4, characterized in that, The self-rotating component (4) includes: Driven synchronous pulley (401) is fixed to the outer periphery of the orbital seat (1); An active synchronizing wheel (403) is located on one side of the orbital seat (1); A timing belt (402) is fitted between the driven timing pulley (401) and the driving timing pulley (403), and a rotating shaft is fixedly connected inside the driving timing pulley (403); The revolution drive motor (404) is located on one side of the revolution seat (1), and one end of the output shaft of the revolution drive motor (404) is fixedly connected to the bottom end of the rotating shaft through the first coupling.

6. A wafer pedestal device with a variable angle and self-rotating capability according to claim 5, characterized in that, The self-rotating component (4) also includes: The rotation shaft (405) passes through the interior of the orbital seat (1), and the rotation shaft (405) is rotatably connected to the interior of the orbital seat (1) through the second sealed bearing and the magnetohydrodynamic connection; The first gear (406) is located on the top side inside the gear carrier (2), and the first gear (406) is fixedly connected to the top of the rotating shaft (405). The rotating shaft (405) is rotatably connected inside the gear carrier (2) through the third sealed bearing.

7. A wafer pedestal device with a variable angle and self-rotating capability according to claim 6, characterized in that, The self-rotating component (4) also includes: An intermediate gear (407) is located on the top side inside the gear carrier (2), and the intermediate gear (407) is meshed with the top side of the first gear (406). The gear carrier (2) is configured as an I-shaped structure. The intermediate gear (407) is rotatably connected to the top side inside the gear carrier (2) through a fixed shaft and a fourth sealed bearing. The second gear (408) is meshed with the top side of the intermediate gear (407), and the second gear (408) is positioned above the first gear (406); The connecting shaft (409) is fixedly connected inside the second gear (408), and the top of the connecting shaft (409) is fixedly connected to the bottom of the base (3).

8. A wafer pedestal device with a variable angle and self-rotating capability according to claim 7, characterized in that, The self-rotating component (4) also includes: The output shaft of the self-rotating drive motor (410) is fixedly connected to the bottom end of the self-rotating shaft (405) via a second coupling.

9. A wafer pedestal device with a variable angle and self-rotating capability according to claim 8, characterized in that, The angle adjustment component (5) includes: An adjusting shaft (501) is set on one side of the rotating shaft (405), and the adjusting shaft (501) is rotatably connected to the inside of the revolving seat (1) through the fifth sealed bearing and the magnetic fluid. The adjusting shaft (501) and the rotating shaft (405) are respectively set inside the fourth through hole and the second through hole, and the cooling plate (611) is rotatably sealed on the outer periphery of the adjusting shaft (501) and the rotating shaft (405). The adjustment drive motor (502) is located on one side below the radiator (1), and one end of the output shaft of the adjustment drive motor (502) is fixedly connected to the bottom end of the adjustment shaft (501) through a third coupling.

10. A wafer pedestal device with a variable angle and self-rotating capability according to claim 9, characterized in that, The angle adjustment component (5) also includes: The third gear (503) is fixedly connected to the outer periphery of the top of the adjusting shaft (501); The fourth gear (504) is meshed with the top side of the third gear (503); A round shaft (505) is fixedly connected to the outer circumference of the fourth gear (504), and the round shaft (505) is rotatably connected to the inside of the gear carrier (2) through the sixth sealed bearing; An L-shaped frame (506) is fitted on the outer circumference of a round shaft (505), and one side of the L-shaped frame (506) is fixedly connected to a fourth gear (504). A third through hole is provided on the top of the L-shaped frame (506). The L-shaped frame (506) is fitted on the outer circumference of a connecting shaft (409) through the third through hole. The connecting shaft (409) is rotatably connected inside the L-shaped frame (506) through a seventh sealed bearing.

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